Communication method and device of semiconductor factory automation system, terminal, medium and product

Abstract

The invention provides a communication method and device of a semiconductor factory automation system, a terminal, a medium and a product. The communication method comprises the following steps: acquiring related information of target semiconductor equipment, and inputting the related information into a built factory automation general design library based on an SEMI standard to obtain a factory automation special design library of the target semiconductor equipment; and enabling the target semiconductor equipment to communicate with the corresponding semiconductor factory through the factory automation special design library. Through the factory automation general design library based on the SEMI standard, the time cost for realizing communication between the semiconductor factory and the semiconductor equipment is saved.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a communication method, device, terminal, medium and product for a semiconductor factory automation system. Background Art

[0002] With the continuous development of modern industrial automation, the communication standards for various automation equipment are increasing. In the semiconductor industry, the SECS / GEM standard is a common communication protocol used by semiconductor factories and semiconductor equipment.

[0003] To achieve factory automation (FA), existing semiconductor factories and semiconductor equipment adhere to the SECS / GEM standards for communication between the factory and equipment. To accomplish this, technicians not only need to control the hardware through commands and be familiar with the equipment's business processes, but also must master the content and format of SECS / GEM messages and be familiar with automation standards. This investment of time and effort by technicians also delays semiconductor equipment delivery cycles. Summary of the Invention

[0004] In view of the shortcomings of the prior art described above, the purpose of this application is to provide a communication method, device, terminal, medium and product for a semiconductor factory automation system, which is used to solve the problem of high time cost of existing methods for achieving communication between semiconductor factories and semiconductor equipment.

[0005] To achieve the above-mentioned purpose and other related purposes, the first aspect of the present application provides a communication method for a semiconductor factory automation system, including: obtaining relevant information of a target semiconductor device and inputting it into a factory automation general design library constructed based on SEMI standards to obtain a factory automation-specific design library for the target semiconductor device; and enabling the target semiconductor device to communicate with the corresponding semiconductor factory through the factory automation-specific design library.

[0006] In some embodiments of the first aspect of the present application, the relevant information of the target semiconductor device includes: hardware type, hardware quantity, and automation requirement information.

[0007] In some embodiments of the first aspect of the present application, the target semiconductor device communicates with the corresponding semiconductor factory through the factory automation dedicated design library, including: the behavior information issued by the target semiconductor device is converted into the corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory; the factory message related to the device behavior issued by the semiconductor factory is converted into the corresponding device instruction through the factory automation dedicated design library and sent to the target semiconductor device.

[0008] In some embodiments of the first aspect of the present application, the factory automation-specific design library includes: a plurality of upper-layer interfaces corresponding to the target semiconductor device, a SEMI standard message content format, and a factory automation logic module.

[0009] In some embodiments of the first aspect of the present application, the behavioral information issued by the target semiconductor device is converted into a corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory, including: when the target semiconductor device issues a device instruction, calling the corresponding upper-level interface to determine the automation logic unit corresponding to the upper-level interface in the factory automation logic module; the automation logic unit converts the behavioral information corresponding to the device instruction issued by the target semiconductor device into a corresponding SEMI standard message based on the SEMI standard message content format and sends it to the semiconductor factory.

[0010] In some embodiments of the first aspect of the present application, the factory message issued by the semiconductor factory is converted into corresponding device instructions through the factory automation dedicated design library and sent to the target semiconductor device, including: the factory automation logic module parses the corresponding specific content from the factory message related to the device behavior issued by the semiconductor factory based on the SEMI standard message content format; the factory automation logic module sends the specific content to the corresponding upper-level interface, so that the upper-level interface generates corresponding instructions and sends them to the target semiconductor device.

[0011] To achieve the above-mentioned purpose and other related purposes, the second aspect of the present application provides a communication device for a semiconductor factory automation system, including: an acquisition module for acquiring relevant information of a target semiconductor device and inputting it into a factory automation general design library constructed based on SEMI standards to obtain a factory automation-specific design library for the target semiconductor device; a communication module for enabling the target semiconductor device to communicate with the corresponding semiconductor factory through the factory automation design library.

[0012] To achieve the above-mentioned purpose and other related purposes, the third aspect of the present application provides a computer-readable storage medium having a computer program stored thereon, which implements the communication method of the semiconductor factory automation system when the computer program is executed by a processor.

[0013] To achieve the above-mentioned objectives and other related objectives, the fourth aspect of the present application provides a computer program product, which includes computer program code. When the computer program code runs on a computer, the computer implements the communication method of the semiconductor factory automation system.

[0014] To achieve the above-mentioned purpose and other related purposes, the fifth aspect of the present application provides an electronic terminal, including a memory, a processor and a computer program stored in the memory; the processor executes the computer program to implement the communication method of the semiconductor factory automation system.

[0015] As described above, the communication method, device, terminal, medium, and product of the semiconductor factory automation system of the present application have the following beneficial effects:

[0016] This application saves the time cost of implementing communication between semiconductor factories and semiconductor equipment through a universal factory automation design library based on SEMI standards. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Shown is a flow chart of a communication method for a semiconductor factory automation system according to an embodiment of the present application.

[0018] Figure 2 Shown is a schematic block diagram of a universal design library for factory automation in one embodiment of the present application.

[0019] Figure 3 Shown is a schematic diagram of the communication process of a semiconductor factory automation system in a specific embodiment of the present application.

[0020] Figure 4 Shown is a schematic diagram of the communication process of a semiconductor factory automation system in another specific embodiment of the present application.

[0021] Figure 5 Shown is a schematic block diagram of a communication device of a semiconductor factory automation system according to an embodiment of the present application.

[0022] Figure 6 Shown is a structural schematic diagram of an electronic terminal in one embodiment of the present application. DETAILED DESCRIPTION

[0023] The following describes the embodiments of the present application through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0024] In the embodiments of this application, terms such as "first" and "second" are used to distinguish between identical or similar items with substantially the same functions and effects. Those skilled in the art will understand that terms such as "first" and "second" do not limit the quantity or order of execution, and that terms such as "first" and "second" do not necessarily define differences.

[0025] It should be noted that in the embodiments of this application, words such as "exemplary" or "for example" represent examples, illustrations, or descriptions. Any embodiment or design described in this application as "exemplary" or "for example" should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0026] In the embodiments of the present application, "at least one" refers to one or more, and "more" refers to two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: the existence of A alone, the existence of A and B at the same time, and the existence of B alone, where A and B can be singular or plural. The character " / " generally indicates that the previous and next associated objects are in an "or" relationship. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b or c can represent: a, b, c, ab, ac, bc or abc, where a, b, c can be single or multiple.

[0027] Before further explaining the present invention in detail, the semiconductor factory automation system involved in the embodiments of the present invention is described. The semiconductor factory automation system involved in the embodiments of the present invention is applicable to the following explanation:

[0028] A semiconductor factory automation system includes: at least one semiconductor device and a semiconductor factory communicating with each semiconductor device. One semiconductor device communicates only with one semiconductor factory, and one semiconductor factory can communicate with multiple semiconductor devices respectively.

[0029] Semiconductor equipment refers to the production equipment used to manufacture various semiconductor products, including other machinery and equipment required to produce semiconductor raw materials. Semiconductor factories interact with semiconductor equipment to achieve automation and digitization of the production process.

[0030] To facilitate understanding of the embodiments of this application, first Figure 1 Detailed description. Figure 1 The following is a flow chart showing a communication method for a semiconductor factory automation system according to an embodiment of the present invention. The communication method for the semiconductor factory automation system according to this embodiment mainly includes the following steps:

[0031] Step S11: Obtain relevant information of the target semiconductor device and input it into a factory automation general design library constructed based on SEMI standards to obtain a factory automation specific design library for the target semiconductor device.

[0032] It should be understood that the SEMI standard is a series of industry standards developed by the Semiconductor Equipment and Materials International (SEMI), mainly including: SECS / GEM standard (Semiconductor Equipment Communication Standard / Generic Equipment Model), GEM300, etc.

[0033] In one embodiment, the relevant information of the target semiconductor device includes but is not limited to: hardware type, hardware quantity, automation requirement information, etc. Specifically, the hardware type includes but is not limited to: electromechanical components, electrical components, optical components, etc. The hardware quantity is the number of each type of hardware. For example, the hardware quantity in the relevant information of the target semiconductor device may include: the number of device loading ports (LoadportCount) and the number of slots of the loading ports (LoadportSlotCount). The automation requirement information includes but is not limited to the GEM type (GEMType), device ID (DeviceId), etc. It should be understood that the SEMI standard defines GEM (Generic Equipment Model). GEM defines the state variables, event conditions and allowed operations of semiconductor devices so that different types of semiconductor devices can be integrated and communicate based on the same model. GEM types mainly include: basic GEM (GEM200) and extended GEM (GEM300), which are respectively suitable for manufacturing equipment of wafers of different sizes. The device ID of each semiconductor device is unique.

[0034] In one embodiment, if Figure 2As shown, the SEMI-standard factory automation universal design library includes: multiple upper-layer interfaces, SEMI-standard message content formats, and a factory automation universal logic module. Specifically, the SEMI-standard factory automation universal design library includes: functional interfaces (implementable through programming languages) created for all device behaviors of semiconductor devices defined in the GEM model, such as variable management (Variable Manager), recipe management (Recipe Management), etc. The SEMI-standard message content format is the message content format defined in the SEMI standard. The factory automation logic universal module encapsulates the message conversion logic corresponding to the behavioral messages of all device behaviors involved in communication between semiconductor devices and semiconductor factories, and the message disassembly logic corresponding to all factory messages. Each encapsulated logic corresponds one-to-one to each upper-layer interface. It should be understood that the message conversion logic and the message disassembly logic are both implemented using code written in accordance with the SECS / GEM standard. Device behavior generally refers to the various operations, state changes, data interactions, and other characteristics exhibited by the device during its operation.

[0035] In one embodiment, SECS / GEM messages are encapsulated through the factory, singleton, and decorator patterns, implementing factory automation logic and providing a top-level, clearest calling interface for device-side software developers. This design maximizes compliance with the open-closed principle of software design: open for extension but closed for modification, facilitating future development as demand grows.

[0036] In one embodiment, the SEMI standard-based factory automation universal design library is a dynamic link library (.dll format).

[0037] In one embodiment, a SEMI-standard universal factory automation design library is added to the software of the target semiconductor device, and relevant information about the target semiconductor device is filled in the configuration file of the SEMI-standard universal factory automation design library. The SEMI-standard universal factory automation design library triggers the relevant parts of the SEMI-standard universal factory automation design library (interfaces used by the target semiconductor device, message conversion logic and message disassembly logic, etc.) based on the relevant information of the target semiconductor device in the configuration file to obtain a factory automation-specific design library for the target semiconductor device. The factory automation-specific design library includes: multiple upper-layer interfaces corresponding to the target semiconductor device, SEMI-standard message content format, and factory automation logic module.

[0038] Step S12: enabling the target semiconductor device to communicate with the corresponding semiconductor factory through the factory automation dedicated design library.

[0039] In one embodiment, the target semiconductor device communicates with the corresponding semiconductor factory through the factory automation dedicated design library, including: the behavior information sent by the target semiconductor device is converted into a corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory; the factory message related to the device behavior sent by the semiconductor factory is converted into a corresponding device instruction through the factory automation dedicated design library and sent to the target semiconductor device.

[0040] In one embodiment, the behavior information issued by the target semiconductor device is converted into a corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory, including: when the target semiconductor device issues a device instruction, calling the corresponding upper-layer interface to determine the automation logic unit corresponding to the upper-layer interface in the factory automation logic module; the automation logic unit converts the behavior information corresponding to the device instruction issued by the target semiconductor device into a corresponding SEMI standard message based on the SEMI standard message content format and sends it to the semiconductor factory.

[0041] In one embodiment, the SEMI standard message issued by the semiconductor factory is converted into a corresponding device instruction through the factory automation dedicated design library and sent to the target semiconductor device, including: the factory automation logic module parses the corresponding specific content from the factory message related to the device behavior issued by the semiconductor factory based on the SEMI standard message content format; the factory automation logic module sends the specific content to the corresponding upper-level interface, so that the upper-level interface generates a corresponding instruction and sends it to the target semiconductor device.

[0042] Specifically, when the software within the target semiconductor device issues a device instruction (different device instructions correspond to different device behaviors) to the corresponding hardware of the semiconductor device, it simultaneously calls the corresponding upper-level interface in the factory automation design library. The target semiconductor device, through the called upper-level interface, sends the behavior message corresponding to the device instruction to the corresponding automation logic unit in the factory automation logic module. The automation logic unit has corresponding message conversion logic. The automation logic unit uses its own message conversion logic to convert the behavior message into a corresponding SEMI standard message based on the SEMI standard message content format, and then sends the converted SEMI standard message to the corresponding semiconductor factory.

[0043] When a semiconductor factory sends a factory message related to the behavior of semiconductor equipment, the factory automation logic module invokes the corresponding message parsing logic based on the factory message. This parsing logic then parses the factory message to extract its specific content. The factory automation logic module then sends the parsed content to the corresponding upper-layer interface, which converts it into corresponding device instructions and sends them to the target semiconductor equipment. If the factory message is unrelated to the behavior of the semiconductor equipment, the factory automation logic module directly responds with a message reply.

[0044] It should be noted that in the prior art, technicians need to write the corresponding device instructions for semiconductor devices, write the corresponding conversion logic and disassembly logic, and process replies from semiconductor factories. However, after adding a factory automation-specific design library, the semiconductor device of the present invention only needs to issue and receive instructions. The corresponding conversion logic, disassembly logic, and information reply logic are all located in the factory automation-specific design library, which minimizes the coupling between the semiconductor device software code and the SEMI standard itself, and also reduces the cost of learning and understanding the FA module for technicians. Technicians only need to understand the business logic of the device itself, saving manpower and time costs.

[0045] In order to better illustrate the communication method of the present invention, two specific embodiments are provided.

[0046] Example 1: A process of Foup reaching Loadport.

[0047] like Figure 3 As shown, the semiconductor device reads the Foup ID, calls the corresponding upper-layer interface in the factory automation dedicated design library to transmit the Foup ID to the factory automation logic module, and the factory automation logic module converts it into message S6F11 according to the SEMI standard message content format, so as to send the Foup ID to the semiconductor factory through the message S6F11.

[0048] The factory automation logic module processes the response message S6F12 received from the semiconductor factory on its own.

[0049] The factory automation logic module receives the factory message S3F7 sent by the semiconductor factory and extracts the corresponding message content "Foup ID verification failed". The factory automation dedicated design library automatically responds with a message S3F8 to the semiconductor factory.

[0050] The factory automation logic module sends the updated Foup ID verification status (verification failed) to the semiconductor factory through the message S6F11, and sends the instruction Unload Foup to the semiconductor equipment.

[0051] The factory automation logic module processes the message S6F12 after receiving the reply message from the semiconductor factory.

[0052] After executing the Unload Form, the semiconductor device calls the corresponding upper-layer interface of the factory automation design library to transmit the execution result to the factory automation logic module. The factory automation logic module sends the Unload Form execution result to the semiconductor factory via message S6F11. The factory automation logic module receives the semiconductor factory's reply message S6F12 and processes it accordingly.

[0053] like Figure 4 As shown in Example 2, another process of Foup reaching Loadport.

[0054] The semiconductor device reads the Foup ID and calls the corresponding upper-layer interface in the factory automation dedicated design library to transmit the Foup ID to the factory automation logic module. The factory automation logic module converts it into message S6F11 according to the SEMI standard message content format, and sends the Foup ID to the semiconductor factory through the message S6F11.

[0055] The factory automation logic module processes the response message S6F12 received from the semiconductor factory.

[0056] The factory automation logic module receives the factory message S3F7 sent by the semiconductor factory and extracts the corresponding message content "Foup ID verification successful" from it. The factory automation dedicated design library automatically responds with a message S3F8 to the semiconductor factory.

[0057] The factory automation logic module sends the updated Foup ID verification status (verification successful) to the semiconductor factory through the message S6F11, and sends the instruction Load Foup to the semiconductor equipment.

[0058] The factory automation logic module processes the message S6F12 after receiving the reply message from the semiconductor factory.

[0059] After the semiconductor device executes the LoadFoup, it calls the corresponding upper-layer interface of the factory automation design library to transmit the execution result to the factory automation logic module. The factory automation logic module sends the LoadFoup execution result to the semiconductor factory via message S6F11. The factory automation logic module receives the semiconductor factory's reply message S6F12 and processes it accordingly.

[0060] It should be understood that the S6F11, S6F12, S6F7, and S6F8 messages mentioned in the above embodiments are all message types defined in the SECS-II protocol. A Foup (Front Opening Unified Pod) is a container used to transport and store wafers within a wafer fab, primarily for protecting, transporting, and storing 300mm wafers. A Loadport is an automated device used in the semiconductor production process for loading and unloading carriers containing semiconductor wafers.

[0061] Figure 5 Schematic block diagram of a communication device of a semiconductor factory automation system provided by an embodiment of the present application. Figure 5 As shown, the communication device of the semiconductor factory automation system includes:

[0062] An acquisition module 51 is configured to acquire relevant information of a target semiconductor device and input the information into a SEMI standard-based factory automation general design library to obtain a factory automation specific design library for the target semiconductor device.

[0063] The communication module 52 is configured to enable the target semiconductor device to communicate with a corresponding semiconductor factory via the factory automation design library.

[0064] It should be understood that the specific process of each module executing the above corresponding steps has been described in detail in the above method embodiment, and for the sake of brevity, it will not be repeated here.

[0065] It should also be understood that the division of modules in the embodiments of the present application is illustrative and is merely a logical functional division. In actual implementation, other division methods may be used. Furthermore, the functional modules in the various embodiments of the present application may be integrated into a single processor, or may exist physically separately, or two or more modules may be integrated into a single module. The aforementioned integrated modules may be implemented in the form of hardware or software functional modules.

[0066] In one embodiment, the relevant information of the target semiconductor device includes: hardware type, hardware quantity, and automation requirement information.

[0067] In one embodiment, the target semiconductor device communicates with the corresponding semiconductor factory through the factory automation dedicated design library, including: the behavior information sent by the target semiconductor device is converted into a corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory; the factory message related to the device behavior sent by the semiconductor factory is converted into a corresponding device instruction through the factory automation dedicated design library and sent to the target semiconductor device.

[0068] In one embodiment, the factory automation-specific design library includes: a plurality of upper-layer interfaces corresponding to the target semiconductor device, a SEMI standard message content format, and a factory automation logic module.

[0069] In one embodiment, the behavior information issued by the target semiconductor device is converted into a corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory, including: when the target semiconductor device issues a device instruction, calling the corresponding upper-layer interface to determine the automation logic unit corresponding to the upper-layer interface in the factory automation logic module; the automation logic unit converts the behavior information corresponding to the device instruction issued by the target semiconductor device into a corresponding SEMI standard message based on the SEMI standard message content format and sends it to the semiconductor factory.

[0070] In one embodiment, the factory message issued by the semiconductor factory is converted into a corresponding device instruction through the factory automation dedicated design library and sent to the target semiconductor device, including: the factory automation logic module parses the corresponding specific content from the factory message related to the device behavior issued by the semiconductor factory based on the SEMI standard message content format; the factory automation logic module sends the specific content to the corresponding upper-level interface, so that the upper-level interface generates a corresponding instruction and sends it to the target semiconductor device.

[0071] Figure 6 : is a schematic block diagram of an electronic terminal provided in an embodiment of the present application. Figure 6 As shown, the electronic terminal includes: at least one processor 601, a memory 602, at least one network interface 603 and a user interface 605. The various components in the device are coupled together through a bus system 604. It is understood that the bus system 604 is used to achieve connection and communication between these components. In addition to including a data bus, the bus system 604 also includes a power bus, a control bus and a status signal bus. However, for the sake of clarity, Figure 6 Various buses are labeled as bus systems.

[0072] The user interface 605 may include a display, a keyboard, a mouse, a trackball, a click gun, keys, buttons, a touch pad or a touch screen.

[0073] It will be appreciated that the memory 602 may be a volatile memory or a non-volatile memory, or may include both volatile and non-volatile memories. Among them, the non-volatile memory may be a read-only memory (ROM) or a programmable read-only memory (PROM), which is used as an external cache. By way of example but not limitation, many forms of RAM are available, such as static random access memory (SRAM) and synchronous static random access memory (SSRAM). The memory described in the embodiments of the present invention is intended to include, but is not limited to, these and any other suitable types of memory.

[0074] The memory 602 in the embodiment of the present invention is used to store various types of data to support the operation of the electronic terminal 600. Examples of such data include: any executable program used to operate on the electronic terminal 600, such as an operating system 6021 and an application 6022; the operating system 6021 includes various system programs, such as a framework layer, a core library layer, a driver layer, etc., for implementing various basic services and processing hardware-based tasks. The application 6022 can include various applications, such as a media player (Media Player), a browser (Browser), etc., for implementing various application services. The communication method of the semiconductor factory automation system provided by the embodiment of the present invention can be included in the application 6022.

[0075] The methods disclosed in the above embodiments of the present invention can be applied to or implemented by processor 601. Processor 601 may be an integrated circuit chip with signal processing capabilities. During implementation, each step of the above method can be completed by hardware integrated logic circuits in processor 601 or by software instructions. The above processor 601 may be a general-purpose processor, a digital signal processor (DSP), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Processor 601 can implement or execute the various methods, steps, and logic block diagrams disclosed in the embodiments of the present invention. The general-purpose processor 601 can be a microprocessor or any conventional processor. The steps of the accessory optimization method provided in the embodiments of the present invention can be directly implemented and executed by a hardware decoding processor, or by a combination of hardware and software modules in the decoding processor. The software module can be located in a storage medium located in a memory. The processor reads the information in the memory and, in conjunction with its hardware, completes the steps of the above method.

[0076] In an exemplary embodiment, the electronic terminal 600 may be configured to execute the aforementioned method using one or more application specific integrated circuits (ASICs), DSPs, programmable logic devices (PLDs), or complex programmable logic devices (CPLDs).

[0077] According to the method provided in the embodiment of the present application, the present application also provides a computer program product, which includes: a computer program code, which, when executed on a computer, causes the computer to execute Figure 1 A communication method for a semiconductor factory automation system in the illustrated embodiment.

[0078] According to the method provided in the embodiment of the present application, the present application also provides a computer-readable storage medium, which stores a program code, and when the program code is run on a computer, the computer executes Figure 1 A communication method for a semiconductor factory automation system in the illustrated embodiment.

[0079] As used in this specification, the terms "component," "module," "system," and the like are used to represent computer-related entities, hardware, firmware, a combination of hardware and software, software, or software in execution. For example, a component can be, but is not limited to, a process running on a processor, a processor, an object, an executable file, an execution thread, a program, and / or a computer. By way of illustration, both an application running on a computing device and a computing device can be a component. One or more components can reside in a process and / or an execution thread, and a component can be located on a computer and / or distributed between two or more computers. In addition, these components can be executed from various computer-readable media having various data structures stored thereon. Components can communicate, for example, via local and / or remote processes based on signals having one or more data packets (e.g., data from two components interacting with another component on a local system, a distributed system, and / or a network, such as the Internet interacting with other systems via signals).

[0080] Those skilled in the art will appreciate that the various illustrative logical blocks and steps described in conjunction with the embodiments disclosed herein can be implemented using electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professionals and technicians may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0081] Those skilled in the art will clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0082] In the several embodiments provided in this application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the device embodiments described above are merely schematic. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of devices or units, which can be electrical, mechanical or other forms.

[0083] Units described as separate components may or may not be physically separate, and components shown as units may or may not be physical units, that is, they may be located in one place or distributed across multiple network units. Some or all of these units may be selected to achieve the purpose of this embodiment according to actual needs.

[0084] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit.

[0085] In the above embodiments, the functions of each functional unit can be implemented in whole or in part by software, hardware, firmware, or any combination thereof. When implemented using software, it can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions (programs). When the computer program instructions (program) are loaded and executed on a computer, the process or function according to the embodiment of the present application is generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via a wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) method. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server or data center that includes one or more available media integrated therein. Available media may be magnetic media (e.g., floppy disks, hard disks, tapes), optical media (e.g., high-density digital video discs (DVDs), or semiconductor media (e.g., solid state disks (SSDs)).

[0086] If the function is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes several instructions for enabling a computer device (which can be a personal computer, server, or network device, etc.) to execute all or part of the steps of the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM), random access memory (RAM), magnetic disk or optical disk, and other media that can store program codes.

[0087] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

[0088] In summary, the present application provides a communication method, apparatus, terminal, medium, and product for a semiconductor factory automation system. The communication method includes: obtaining relevant information about a target semiconductor device and inputting it into a SEMI-standard factory automation general design library to obtain a factory automation-specific design library for the target semiconductor device; and enabling the target semiconductor device to communicate with the corresponding semiconductor factory through the factory automation-specific design library. The present application reduces the time cost of achieving communication between semiconductor factories and semiconductor devices by utilizing a SEMI-standard factory automation general design library. Therefore, the present application effectively overcomes the various shortcomings of the prior art and has a high degree of industrial application value.

[0089] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A communication method for a semiconductor factory automation system, characterized in that: include: Obtaining relevant information of a target semiconductor device and inputting the information into a SEMI standard-based factory automation general design library to obtain a factory automation-specific design library for the target semiconductor device; The target semiconductor device is enabled to communicate with a corresponding semiconductor factory through the factory automation dedicated design library.

2. The communication method of the semiconductor factory automation system according to claim 1, wherein: The relevant information of the target semiconductor device includes: hardware type, hardware quantity and automation requirement information.

3. The communication method of the semiconductor factory automation system according to claim 1, wherein: The target semiconductor device communicates with the corresponding semiconductor factory through the factory automation dedicated design library, including: The behavior information sent by the target semiconductor device is converted into a corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory; The factory messages related to device behavior issued by the semiconductor factory are converted into corresponding device instructions through the factory automation dedicated design library and sent to the target semiconductor device.

4. The communication method of the semiconductor factory automation system according to claim 3, wherein: The factory automation-specific design library includes: a plurality of upper-layer interfaces corresponding to the target semiconductor device, a SEMI standard message content format, and a factory automation logic module.

5. The communication method of the semiconductor factory automation system according to claim 4, wherein: The behavior information sent by the target semiconductor device is converted into a corresponding SEMI standard message through the factory automation dedicated design library and notified to the semiconductor factory, including: When the target semiconductor device issues a device instruction, calling a corresponding upper-layer interface to determine an automation logic unit corresponding to the upper-layer interface in the factory automation logic module; The automation logic unit converts the behavior information corresponding to the device instruction issued by the target semiconductor device into a corresponding SEMI standard message based on the SEMI standard message content format and sends the message to the semiconductor factory.

6. The communication method of the semiconductor factory automation system according to claim 4, wherein: The factory message sent by the semiconductor factory is converted into a corresponding device instruction through the factory automation dedicated design library and sent to the target semiconductor device, including: The factory automation logic module parses the factory messages related to device behavior sent by the semiconductor factory to obtain corresponding specific content based on the SEMI standard message content format; The factory automation logic module sends the specific content to the corresponding upper-layer interface, so that the upper-layer interface generates corresponding instructions and sends them to the target semiconductor device.

7. A communication device for a semiconductor factory automation system, characterized in that: include: An acquisition module is used to acquire relevant information of a target semiconductor device and input the information into a general factory automation design library constructed based on SEMI standards to obtain a factory automation specific design library for the target semiconductor device; A communication module is used to enable the target semiconductor device to communicate with a corresponding semiconductor factory through the factory automation design library.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method according to any one of claims 1 to 6 is implemented.

9. A computer program product, characterized in that The computer program product includes computer program code, and when the computer program code is run on a computer, the computer is enabled to implement the method according to any one of claims 1 to 6.

10. An electronic terminal comprising a memory, a processor, and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the method according to any one of claims 1 to 6.

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