Coating equipment and coating method

Abstract

The present application discloses a coating device and a coating method, which relate to the field of circuit board manufacturing technology. The coating device includes: a coating assembly and a support device, the support device includes a support assembly, a first sensor and a first controller, the support assembly includes a first support rod, a second support rod and a hinge group, the hinge group includes a plurality of third support rods pivotally connected in sequence, the lower end of the second support rod is telescopically arranged in the first support rod, the first drive member is used to drive the second support rod to telescope, the upper end of the second support rod is connected to the hinge group, and the rotation connection of the two connected third support rods is provided with a second drive member to enable the two third support rods to rotate relative to each other. According to the coating device of the present application, the area where the first electrical component is arranged on the first surface can be better avoided, regardless of whether the printed circuit board is deformed, the printed circuit board can be better supported, the reliability of coating the second surface can be improved, and the coating surface can be ensured to be smooth.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board manufacturing, and in particular to a coating device and a coating method. Background Art

[0002] Related technologies indicate that after the first side of a bare board (printed circuit board) is soldered to form a board (soldered circuit board assembly), thermal expansion and material stress can cause deformation (warping, bending, etc.). Statistics show that bare boards with a thickness of 1.0mm or less experience deformation rates of up to 30%-40% after reflow soldering. This results in insufficient support when printing solder paste on the second side, leading to defects such as insufficient solder, misalignment, and short circuits, directly impacting product yield and repair costs.

[0003] The traditional support structure is only suitable for undeformed boards and cannot adaptively adjust the support surface. When the board is deformed, a gap is generated between the base and the board, resulting in partial overhang and uneven printing pressure, which aggravates quality problems. With the trend of lightweight and thinner electronic products, the thickness of the light board is further reduced (such as below 0.6mm), and this problem has become more and more significant. The traditional support method uses the method of digging out the avoidance device, which can only be customized for each product. After the product is iteratively upgraded, it cannot be used and can only be scrapped. In addition, this traditional support model for product customization requires design and processing time for each production. If there is a very urgent product production demand, it cannot meet the delivery requirements. Summary of the Invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application is to propose a coating device that can adapt to different types of printed circuit boards, thereby meeting production needs and effectively supporting the printed circuit boards regardless of whether they are deformed.

[0005] This application also proposes a coating method.

[0006] According to the first aspect of the present application, a coating device is used for a printed circuit board, the printed circuit board includes a first surface and a second surface, the first surface and the second surface are both suitable for coating solder paste so that electrical components are fixed on the first surface and the second surface of the printed circuit board by reflow soldering, the coating device includes: a coating component and a supporting device, the coating component is suitable for coating the first surface and the second surface of the printed circuit board; the supporting device is arranged on the lower side of the coating component, the supporting device is used to support one of the first surface and the second surface so that the coating component coats the other of the first surface and the second surface, wherein the supporting device includes: a plurality of supporting components, a first sensor and a first controller, the plurality of supporting components are arranged in a matrix on one side of the coating component, the supporting component includes a telescopic member and a first driving member, the telescopic member includes The first support rod, the second support rod and the hinge group, the hinge group including a plurality of third support rods pivotally connected in sequence, the lower end of the second support rod being telescopically arranged in the first support rod, the first driving member being used to drive the second support rod to telescope, the upper end of the second support rod being connected to the hinge group, and a second driving member being provided at the rotation connection of the two connected third support rods, the second driving member being used to make the two connected third support rods rotate relative to each other; the first sensor being used to obtain surface information of the first surface or the second surface of the printed circuit board, the first controller being used to control the first driving member to drive the second support rod to telescope according to the surface information, and to control the second driving member to drive the third support rod to adjust the supporting position of the third support rod on the printed circuit board to avoid the electrical components.

[0007] According to the support device of the present application, by arranging multiple actively retractable support components on the first workbench, the area on the first surface where the first electrical component is arranged can be avoided better. Alternatively, the first controller controls the second drive component to drive the third support rod to adjust the support position of the third support rod on the printed circuit board to avoid the first electrical component. Regardless of how the arrangement area of ​​the first electrical component on the printed circuit board changes, the first electrical component can be avoided better, thereby being able to adapt to different models of printed circuit boards, thereby meeting production needs. For the area on the first surface where there is no first electrical component, regardless of whether the printed circuit board is deformed, multiple support components can effectively support the printed circuit board, thereby reducing the adverse phenomena such as insufficient tin, deviation, short circuit, etc. caused by insufficient support force when coating solder paste on the second surface, thereby improving the reliability of coating on the second surface and ensuring a smooth coating surface.

[0008] In some feasible embodiments of the present application, the support device also includes: a second sensor and a second controller, the second sensor is arranged on the telescopic member, the second sensor is used to obtain the pressure value between the telescopic member and the printed circuit board, and the second controller is used to control the first driving member according to the pressure value to adjust the telescopic amount of the second support rod.

[0009] In the above technical solution, the pressure value between the telescopic part and the printed circuit board is obtained by the second sensor, so that the second controller can judge whether the support component effectively supports the printed circuit board according to the pressure state, thereby ensuring the coating quality, and thus preventing the occurrence of undesirable phenomena such as insufficient tin, deviation, and short circuit during reflow soldering, thereby improving the yield rate and reducing maintenance costs.

[0010] In some feasible embodiments of the present application, the support device also includes a first workbench, the first workbench is provided with a mounting groove, and there are multiple mounting grooves. The multiple support components are installed in the multiple mounting grooves one by one, and the mounting groove has a first electrical connector. The first driving component includes a first driving motor and a third electrical connector. When the support component is installed in the mounting groove, the first electrical connector and the third electrical connector abut against each other to energize the first driving motor, thereby driving the second support rod to extend and retract.

[0011] In the above technical solution, by setting an installation groove on the first workbench, the support assembly can be better installed in the installation groove, which can not only better limit the telescopic direction of the telescopic part, which is beneficial to improving the stability of the telescopic part, but also better protect the support assembly and increase the service life of the support assembly.

[0012] In some feasible embodiments of the present application, the mounting groove also has a second electrical connector, and the second driving member includes a second driving motor and a fourth electrical connector. When the support assembly is installed in the mounting groove, the second electrical connector and the fourth electrical connector abut against each other to energize the second driving motor, thereby enabling the two connected third support rods to rotate relative to each other.

[0013] In the above technical solution, the second drive motor and the fourth electrical connector can make the second drive motor better conductive, so that the third support rod can be better controlled, thereby being able to support different positions of the printed circuit board according to actual needs, with good flexibility.

[0014] In some feasible embodiments of the present application, the support assembly further includes a base, which is connected to the lower end of the first support rod and is detachably mounted in the mounting groove.

[0015] In the above technical solution, the support assembly can be produced and assembled separately, and when assembling the support assembly, the support assembly can be directly placed in the installation groove, which is simple to disassemble and assemble, and can effectively reduce the difficulty of disassembly and assembly of the support assembly and improve the efficiency of disassembly and assembly and maintenance.

[0016] In some feasible embodiments of the present application, a positioning assembly is provided between the base and the mounting groove, and the positioning assembly is used to limit the relative position between the base and the mounting groove in the circumferential direction.

[0017] In the above technical solution, by providing a positioning component, the difficulty of assembly can be reduced and the efficiency of assembly can be improved, so that both the first drive motor and the second drive motor can be powered on well.

[0018] In some feasible embodiments of the present application, one of the multiple third support rods connected to the second support rod is a connecting rod, which is rotatably connected to the second support rod, and a third driving member is provided at the rotating connection, which is used to rotate the connecting rod relative to the second support rod.

[0019] In the above technical solution, the flexibility of the support assembly can be improved by rotatably connecting the connecting rod and the second support rod and setting a third driving member. In addition, the third driving member can better drive the connecting rod to rotate, and can make the connecting rod rotate to a predetermined angle and maintain at this angle, thereby better supporting the printed circuit board and having good stability.

[0020] In some feasible embodiments of the present application, one of the multiple third support rods that abuts against the printed circuit board is an abutment rod, and the support assembly also includes an abutment member, which is detachably mounted on the abutment end of the abutment rod, and the abutment member is made of silicone or polyurethane.

[0021] In the above technical solution, by providing the abutment member, it is not easy to cause damage to the printed circuit board, and it can adapt to abutment interfaces of different shapes, with high reliability and good stability.

[0022] In some feasible embodiments of the present application, the abutment member includes a cylindrical abutment block, and a diameter D1 of the abutment block satisfies: 1mm≤D1≤3mm.

[0023] In the above technical solution, the cylindrical structure is easy to position and install, which can significantly improve production efficiency. At the same time, the cylindrical shape is also conducive to reducing wear on the abutting surface and extending the service life.

[0024] In some feasible embodiments of the present application, the abutment member includes a suction cup, and a diameter D2 of the suction cup satisfies: 1mm≤D2≤5mm.

[0025] In the above technical solution, when the printed circuit board is placed on the supporting device, the suction cup can be well adsorbed on the surface of the printed circuit board without causing damage to the surface of the printed circuit board. After adsorption, the suction cup can effectively fix the printed circuit board, which is beneficial to improve the stability when the printed circuit board is coated. In addition, the suction cup has a simple structure and a low production cost, which is beneficial to reducing the production cost of the supporting device.

[0026] In some feasible embodiments of the present application, the surface information includes the warping curvature information and the warping position information of the printed circuit board. When the suction cup is sucked onto the surface of the printed circuit board, the first controller is also used to control the support assembly at the corresponding warping position according to the warping curvature information and the warping position information to drag the printed circuit board at the warping position. The support device also includes: a third sensor, which is installed between the suction cup and the abutment rod to obtain the dragging force. The first controller controls the dragging action of the support assembly according to the dragging force.

[0027] According to the coating method of the embodiment of the second aspect of the present application, a coating device according to the embodiment of the first aspect of the present application is used. The second side of the printed circuit board is coated, the first side of the printed circuit board is fixedly connected to an electrical component, the first side and the second side are two opposite sides of the printed circuit board, and the coating method includes: facing the first side toward the supporting device; the first sensor obtains surface information of the first side; the first controller controls the first driving member and the second driving member according to the surface information of the first side; the first driving member drives the second support rod to extend and retract; the second driving member drives the third support rod to adjust the support position of the third support rod on the first side to avoid the electrical component; the coating assembly coats the second side.

[0028] According to the coating method of the embodiment of the present application, the coating of the printed circuit board can be achieved well, with high reliability and good stability, and it is not easy to cause adverse phenomena such as insufficient tin, deviation, and short circuit due to insufficient supporting force.

[0029] In some feasible embodiments of the present application, the support device of the coating equipment also includes a first workbench, the first workbench is provided with a mounting groove, and there are multiple mounting grooves. The multiple support components are installed in the multiple mounting grooves one by one, and the mounting groove has a first electrical connector. The first driving component includes a first driving motor and a third electrical connector. When the support component is installed in the mounting groove, the first electrical connector and the third electrical connector abut to energize the first driving motor to drive the second support rod to extend and retract. After obtaining the surface information of the first surface, it also includes: obtaining a supportable area around the electrical component, the area of ​​the supportable area is greater than or equal to a predetermined area; if there is no supportable area, the support component corresponding to the electrical component in the up and down directions is removed from the corresponding mounting groove.

[0030] In the above technical solution, the number of support components can be arranged according to different support requirements, so that the coating equipment can better adapt to diversified production needs and improve the versatility and compatibility of the coating equipment.

[0031] In some feasible embodiments of the present application, after obtaining the surface information of the first surface, it also includes: obtaining the thickness value of the electrical component along the up and down directions; when the thickness value is greater than a predetermined thickness, the supporting assembly corresponding to the electrical component along the up and down directions is removed from the corresponding mounting groove; when the thickness value is less than or equal to the predetermined thickness, the supportable area around the electrical component is obtained.

[0032] In this technical solution, a hierarchical judgment mechanism ensures that the support assembly layout meets support requirements while avoiding blind installation and waste of resources. This process enables intelligent and precise operation of coating equipment when faced with complex electrical component layouts, significantly improving the automation and intelligence level of the production process.

[0033] In some feasible embodiments of the present application, one of the multiple third support rods that abuts against the printed circuit board is an abutment rod, and the support assembly also includes an abutment member, which is detachably mounted on the abutment end of the abutment rod, and the abutment member is made of silicone or polyurethane, and the abutment member includes a suction cup, and the support device also includes: a third sensor, which is mounted between the suction cup and the abutment rod and is used to obtain a drag force, and before the coating assembly coats the second surface, it also includes: obtaining the warping curvature information and the warping position information of the printed circuit board; when the suction cup is attracted to the surface of the printed circuit board, the first controller is also used to control the support assembly at the corresponding warping position according to the warping curvature information and the warping position information to drag the printed circuit board at the warping position; obtaining the dragging force, and the first controller controls the dragging action of the support assembly according to the dragging force.

[0034] In the above technical solution, by adding a drag function and related component design, the drag force and direction can be intelligently adjusted according to the different degrees of warping of the printed circuit board, so that the circuit board can reach the ideal flatness before coating, effectively solving problems such as uneven coating thickness and coating defects caused by the unevenness of the printed circuit board, and better improving the appearance quality and electrical performance of the product, and better improving the qualified rate of finished products.

[0035] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become obvious from the description below, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0037] Figure 1 A schematic structural diagram of a first workbench of a support device provided in an embodiment of the present application;

[0038] Figure 2 A schematic plan view of a first workbench of a support device provided in an embodiment of the present application;

[0039] Figure 3 A schematic structural diagram of an embodiment of a support assembly of a support device provided in an embodiment of the present application;

[0040] Figure 4 A schematic structural diagram of another embodiment of a support assembly of a support device provided in an embodiment of the present application;

[0041] Figure 5 A flow chart of a coating method provided in an embodiment of the present application.

[0042] The above drawings include the following reference numerals:

[0043] 1. First workbench; 11. Mounting slot; 2. Support assembly; 21. Base; 22. Telescopic member; 221. First support rod; 222. Second support rod; 223. Hinge assembly; 2231. Third support rod; 23. Abutment member; 31. Sensor A; 32. Sensor B; 33. Sensor C; 34. Sensor D; 35. Sensor E. DETAILED DESCRIPTION

[0044] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0045] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above-mentioned figure descriptions are intended to cover non-exclusive inclusions.

[0047] In the description of the embodiments of this application, the technical terms "first" and "second" are used only to distinguish different objects and should not be understood to indicate or imply relative importance or implicitly specify the quantity, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0048] References herein to "embodiments" mean that a particular feature, structure, or characteristic described in connection with the embodiments may be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor does it constitute an independent or alternative embodiment that is mutually exclusive of other embodiments. It is understood, both explicitly and implicitly, by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0049] In the description of the embodiments of this application, the term "and / or" is simply a description of the association relationship between associated objects, indicating that three relationships can exist. For example, A and / or B can represent the following three situations: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this document generally indicates that the associated objects are in an "or" relationship.

[0050] In the description of the embodiments of the present application, the term "plurality" refers to more than two (including two).

[0051] In the field of SMT (Surface Mount Technology), solder paste printing stations are very important. Factors that affect the quality of solder paste printing mainly include the parameter setting and adjustment of the printer, the aperture design of the stencil, etc.

[0052] Related technologies indicate that after the first side of a bare board (printed circuit board) is soldered to form a board (soldered circuit board assembly), thermal expansion and material stress can cause deformation (warping, bending, etc.). Statistics show that bare boards with a thickness of 1.0mm or less experience deformation rates of up to 30%-40% after reflow soldering. This results in insufficient support when printing solder paste on the second side, leading to defects such as insufficient solder, misalignment, and short circuits, directly impacting product yield and repair costs.

[0053] The traditional support structure is only suitable for undeformed boards and cannot adaptively adjust the support surface. When the board is deformed, a gap is generated between the base and the board, resulting in partial overhang, uneven printing pressure, and exacerbated quality problems. With the trend of lightweight and thin electronic products, the thickness of the light board is further reduced (such as below 0.6mm), and this problem has become more and more significant. The traditional support method uses the method of digging out the avoidance device, which can only be customized for each product. After the product is iteratively upgraded, it cannot be used and can only be scrapped. In addition, this traditional support model for product customization requires design and processing time for each production. If there is a very urgent product production demand, it cannot meet the delivery requirements.

[0054] Therefore, how to ensure the printing quality of the second side while meeting the support requirements of different products has become an issue that needs to be solved urgently.

[0055] Based on the above considerations, in order to ensure the printing quality of the second side and at the same time meet the support requirements of different products, the applicant has designed a coating device after in-depth research.

[0056] The coating device according to the embodiment of the first aspect of the present application can be used for a printed circuit board, wherein the printed circuit board includes a first side and a second side, both of which are suitable for applying solder paste so that electrical components are fixed to the first side and the second side of the printed circuit board through reflow soldering. The coating device includes a coating assembly and a support device, wherein the coating assembly is suitable for coating the first side and the second side of the printed circuit board, and the support device is disposed on the lower side of the coating assembly, and the support device is used to support one of the first side and the second side so that the coating assembly can coat the other of the first side and the second side.

[0057] That is, when applying solder paste to the first surface of the printed circuit board, the second surface of the printed circuit board can be supported by the support device. At this time, the second surface of the printed circuit board is relatively flat. Therefore, when the printed circuit board is supported by the support device, the stability is better, and the coating effect on the first surface can also be better. The first electrical component can be arranged at the position where the solder paste is applied to the first surface, and then the first electrical component is soldered to the first surface of the printed circuit board by reflow soldering. The soldering effect is good and it is not easy to have undesirable phenomena such as insufficient solder, deviation, and short circuit. Furthermore, after the printed circuit board is reflow soldered, the first surface of the printed circuit board can be turned toward the support device, and the support device can also support the first surface with the first electrical component, so that the solder paste can be applied to the second surface, and then the second electrical component can be soldered to the second surface.

[0058] like Figure 1-Figure 4 As shown, the support device includes: multiple support components 2, a first sensor and a first controller, multiple support components 2 are arranged in a matrix on one side of the coating component, the support component 2 includes a telescopic member 22 and a first driving member, the telescopic member 22 includes a first support rod 221, a second support rod 222 and a hinge group 223, the hinge group 223 includes a plurality of third support rods 2231 pivotally connected in sequence, the lower end of the second support rod 222 is telescopically arranged in the first support rod 221, the first driving member is used to drive the second support rod 222 to telescope, and the second support rod 22 The upper end of 2 is connected to the hinge group 223, and a second driving member is provided at the rotation connection of the two connected third support rods 2231. The second driving member is used to make the two connected third support rods 2231 rotate relative to each other. The first sensor is used to obtain surface information of the first surface or the second surface of the printed circuit board. The first controller is used to control the first driving member to drive the second support rod 222 to extend and retract according to the surface information, and to control the second driving member to drive the third support rod 2231 to adjust the supporting position of the third support rod 2231 on the printed circuit board to avoid electrical components.

[0059] It should be noted that the application environment of the support device can be not only coating equipment, but also other applications where it is necessary to support a plate-like structure or a structure with a certain curvature. Therefore, the support device of the present application can be used not only on coating equipment, but also on other equipment, and the present application does not limit this. In addition, in order to facilitate the description of the solution of the present application, the support device of the present application is applied to a coating device to support a light board (printed circuit board) as an example, but this cannot be used as a limitation of the present application.

[0060] Therefore, the support device of the present application can support the printed circuit board. Specifically, multiple support devices can support the printed circuit board at multiple points. In addition, the support assembly 2 of the present application includes a telescopic part 22. When solder paste is applied to the first side of the printed circuit board, the second side of the printed circuit board can be supported by the support device, that is, multiple support assemblies 2 are in contact with the second side of the printed circuit board. At this time, the second side of the printed circuit board is relatively flat, and through multiple support assemblies 2 are in contact with the second side, the printed circuit board can be supported at multiple points. The stability of the printed circuit board is better, and the coating effect of the first side can also be better. The first electrical component can be arranged at the position where the solder paste is applied on the first side, and then the first electrical component is soldered to the first side of the printed circuit board by reflow soldering. The welding effect is good and it is not easy to have undesirable phenomena such as insufficient solder, deviation, and short circuit. The above-mentioned first electrical component is a general term for the electrical components soldered on the first side of the printed circuit board, and the second electrical component appearing in the text is also a general term for the electrical components soldered on the second side of the printed circuit board. They will not be described in detail below.

[0061] Furthermore, after the printed circuit board is reflowed, the first surface of the printed circuit board can be directed toward the supporting device, and the supporting device can adjust the telescopic length of the second support rod 222 through the first driving member. Specifically, the second support rod 222 can be driven by the first driving member to telescope relative to the first support rod 221, so that the first surface is supported by the hinge group 223. For the position where the first electrical component is arranged on the first surface, the support assembly 2 opposite to the first electrical component on the first surface can be retracted, that is, this part of the support assembly 2 does not contact the first electrical component, thereby avoiding damage to the first electrical component. Alternatively, the first controller controls the second driving member to drive the third support rod 2231 to adjust the supporting position of the third support rod 2231 on the printed circuit board. Avoid the first electrical component. In this way, no matter how the layout area of ​​the first electrical component on the printed circuit board changes, the first electrical component can be avoided better, so that it can adapt to different models of printed circuit boards, so as to meet production needs. In the area where there is no first electrical component on the first side, it can be supported by the remaining support components 2, that is, the first driving member extends the telescopic member 22, so that the third support rod 2231 abuts against the first side of the printed circuit board. In this way, no matter whether the printed circuit board is deformed, multiple support components 2 can effectively support the printed circuit board, so that when the second side is coated with solder paste, it can reduce the adverse phenomena such as insufficient solder, deviation, short circuit, etc. caused by insufficient support force, and can improve the reliability of coating on the second side and ensure that the coating surface is smooth.

[0062] In addition, it can be understood that when the first controller controls the second driving member to drive the third support rod 2231 to adjust the supporting position of the third support rod 2231 on the printed circuit board, other structures can also be avoided, such as solder pads, conductive circuits, etc., and this application does not impose any restrictions on this.

[0063] Furthermore, the supporting device also includes: a first sensor and a first controller, the first sensor is used to obtain surface information of the supported surface of the printed circuit board, and the first controller is used to control the driving member according to the surface information to adjust the extension amount of the extension member 22.

[0064] That is to say, when the printed circuit board is placed on the support device with its second side, since the printed circuit board has not yet been reflowed, the printed circuit board is relatively flat, and the second side is also relatively flat. The support device can obtain surface information that the second side is relatively flat and that there are no electrical components on the second side through the first sensor. In this way, the support device does not need to avoid, and can extend the telescopic parts 22 of all support components 2, so that all support components 2 are in contact with the second side, thereby improving the reliability of the printed circuit board support through multiple point support. After the printed circuit board undergoes the first reflow, that is, the printed circuit board is placed on the support device with its first side, and the first side has the first electrical component, the first sensor can obtain whether the first side is bent, thereby identifying the location with the bend. In this way, when the first controller obtains the surface information of these bends, it can adjust the extension length of the telescopic parts 22 of the support component 2 corresponding to the area, thereby reliably supporting the area with high reliability. For the location where the first electrical component is arranged on the first side, when the first controller obtains the surface information of these first electrical components, it can adjust the extension length of the telescopic parts 22 of the support component 2 corresponding to the area. The extension length of the telescopic member 22 can be adjusted, or the first controller can control the second driving member to drive the third support rod 2231 to adjust the support position of the third support rod 2231 on the printed circuit board to avoid the electrical components, so that the support component 2 corresponding to the area does not contact the first electrical component, thereby better achieving the avoidance of the first electrical component. In addition, through the automatic control of the first sensor and the first controller, the difficulty of manual adjustment can be reduced, the degree of automation and the accuracy of the control of the telescopic member 22 can be improved, thereby improving the reliability of the support device for the printed circuit board, and also improving production efficiency and reducing production costs.

[0065] Further, the first sensor includes a laser sensor and / or a visual sensor.

[0066] That is to say, the laser sensor can emit laser toward the printed circuit board, thereby obtaining position information of various locations on the first surface or the second surface of the printed circuit board, and then obtaining surface information of the printed circuit board through the position information. In this way, the first controller can better adjust the extension length of the telescopic member 22 according to the surface information, thereby effectively supporting the printed circuit board.

[0067] The visual sensor can obtain whether there is any deformation on the surface of the printed circuit board and whether there are electrical components by taking pictures, that is, directly obtaining surface information in a visual way. In this way, the first controller can better adjust the extension length of the telescopic member 22 according to the surface information, thereby effectively supporting the printed circuit board.

[0068] Illustratively, in the supporting device of the present application, the first sensor may only include a laser sensor.

[0069] Illustratively, in the supporting device of the present application, the first sensor may only include a visual sensor.

[0070] For example, in the supporting device of the present application, the first sensor may include a laser sensor and a visual sensor at the same time. The combination of two different types of sensors can better obtain surface information.

[0071] In the above technical solution, both the laser sensor and the visual sensor can better obtain the surface information of the printed circuit board, so that the first controller can better adjust the extension length of the telescopic member 22 according to the surface information, thereby effectively supporting the printed circuit board.

[0072] Furthermore, at least one first sensor is provided. When a plurality of first sensors are provided, the plurality of first sensors are spaced apart and arranged on the surface of the first workbench 1 .

[0073] That is to say, the first sensor can be arranged according to actual needs. For example, if the size of the printed circuit board is small, only one first sensor can be arranged to better obtain the surface information of the printed circuit board. For another example, if the size of the printed circuit board is large, multiple first sensors can be arranged according to actual needs, such as Figure 2 As shown, five first sensors can be arranged. The first workbench 1 is rectangular. A first sensor can be arranged at each of the four corners of the first workbench 1, and then a first sensor can be arranged at the center of the first workbench 1, so as to better obtain the surface information of the printed circuit board.

[0074] In the above technical solution, the first sensor can be arranged according to actual needs, thereby meeting the demand for obtaining surface information of the printed circuit board.

[0075] According to the support device of the present application, by arranging multiple actively retractable support components 2 on the first workbench 1, the area on the first surface where the first electrical component is arranged can be avoided better. Alternatively, the first controller controls the second drive component to drive the third support rod 2231 to adjust the support position of the third support rod 2231 on the printed circuit board to avoid the first electrical component. Regardless of how the arrangement area of ​​the first electrical component on the printed circuit board changes, the first electrical component can be avoided better, thereby being able to adapt to different models of printed circuit boards, thereby meeting production needs. For the area on the first surface where there is no first electrical component, regardless of whether the printed circuit board is deformed, multiple support components 2 can effectively support the printed circuit board, thereby reducing the adverse phenomena such as insufficient tin, deviation, short circuit, etc. caused by insufficient support force when applying solder paste on the second surface, thereby improving the reliability of coating on the second surface and ensuring a smooth coating surface.

[0076] Exemplarily, when the second driving member drives the third support rod 2231 to rotate, it can rotate 360°. For example, the two connected third support rods 2231 are connected by a rotating shaft, and the second driving member can be connected to the rotating shaft for transmission, thereby driving the third support rod 2231 to rotate 360° around the axis of the rotating shaft. Optionally, the second driving member can drive the third support rod 2231 to rotate 360° clockwise, and the second driving member can also drive the third support rod 2231 to rotate 360° counterclockwise, thereby improving the flexibility of the third support rod 2231.

[0077] In any embodiment of the present application, Figure 1-Figure 4 As shown, the support assembly 2 also includes: a second sensor and a second controller. The second sensor is arranged on the telescopic member 22 and is used to obtain the pressure value between the telescopic member 22 and the printed circuit board. The second controller is used to control the first driving member according to the pressure value to adjust the telescopic amount of the second support rod 222.

[0078] That is to say, when the printed circuit board is placed on the support device, the pressure value between the telescopic member 22 and the printed circuit board can be obtained through the second sensor, so that when the pressure value between the printed circuit board and the telescopic member 22 is large or small, the telescopic amount of the telescopic member 22 is adjusted by the second controller to improve the support effect of the support device on the printed circuit board. Specifically, when the pressure value between the printed circuit board and the telescopic member 22 is large, it may be that the elongation of the telescopic member 22 here is large, so that the printed circuit board in this area is pushed upward, thereby affecting the stability of the printed circuit board as a whole, making the printed circuit board prone to deviation during coating, thereby easily affecting the coating quality, and then prone to undesirable phenomena such as insufficient tin, deviation, short circuit, etc. during reflow soldering, which directly affects the yield rate and maintenance cost. At this time, the telescopic member 22 at this location can be adjusted to shorten by the second controller, so that the pressure value between the printed circuit board and the telescopic member 22 is within a certain range. a predetermined pressure value range; in addition, when the pressure value between the printed circuit board and the telescopic member 22 is small, it may indicate that the supporting force of the support component 2 on the printed circuit board at this position is insufficient, that is, the elongation of the telescopic member 22 of the support component 2 may be small. At this time, the elongation of the telescopic member 22 at this location can be adjusted by the second controller, so that the pressure value between the printed circuit board and the telescopic member 22 is within a predetermined pressure value range, thereby ensuring the coating quality, and then less likely to have undesirable phenomena such as insufficient tin, deviation, short circuit, etc. during reflow soldering, which can increase the yield rate and reduce maintenance costs.

[0079] In the above technical solution, the pressure value between the telescopic part 22 and the printed circuit board is obtained by the second sensor, so that the second controller can judge whether the support component 2 provides effective support for the printed circuit board according to the pressure state, thereby ensuring the coating quality, and thus preventing the occurrence of undesirable phenomena such as insufficient tin, deviation, and short circuit during reflow soldering, thereby improving the yield rate and reducing maintenance costs.

[0080] In any embodiment of the present application, Figure 1-Figure 4 As shown, the support device also includes a first workbench 1, the first workbench 1 is provided with a mounting groove 11, and a plurality of mounting grooves 11 are provided. A plurality of support components 2 are installed in the plurality of mounting grooves 11 in a one-to-one correspondence. The mounting groove 11 has a first electrical connector, and the first driving component includes a first driving motor and a third electrical connector. When the support component 2 is installed in the mounting groove 11, the first electrical connector and the third electrical connector are abutted to energize the first driving motor, and the first driving motor is used to drive the second support rod 222 to extend and retract.

[0081] For example, the supporting device can be assembled on the coating equipment through the first workbench 1. In one example, there can also be a second workbench on the coating equipment, and the supporting device can also be installed on the second workbench through the first workbench 1. In this way, the supporting device can be disassembled better, so that the supporting device can be easily repaired, which can reduce the difficulty of maintenance and improve maintenance efficiency.

[0082] After the support assembly 2 is installed in the mounting groove 11, the mounting groove 11 can limit the position of the support assembly 2, and the mounting groove 11 can limit the telescopic direction of the telescopic member 22, so that the telescopic member 22 can stably telescope in the mounting groove 11. Specifically, when the telescopic member 22 is telescoping, the groove wall of the mounting groove 11 can guide the telescopic direction of the telescopic member 22, so that the telescopic member 22 can stably telescope, and thus the telescopic member 22 can reliably support the printed circuit board when it abuts against the surface of the printed circuit board. In addition, after the support assembly 2 is installed in the mounting groove 11, the first workbench 1 can better protect the portion of the support assembly 2 located in the mounting groove 11, which can reduce damage to the support assembly 2 and increase the service life of the support assembly 2.

[0083] The support assembly 2 can be driven by electric energy, that is, when the support assembly 2 is installed in the installation groove 11, the first electrical connector can be abutted against the third electrical connector, so that the first drive motor is energized, and the first controller can control the operation of the first drive motor, thereby driving the second support rod 222 to extend and retract.

[0084] In the above example, by setting the installation groove 11 on the first workbench 1, the support component 2 can be better installed in the installation groove 11, which not only can better limit the telescopic direction of the telescopic part 22, which is beneficial to improve the stability of the telescopic part 22, but also can better protect the support component 2 and increase the service life of the support component 2.

[0085] In any embodiment of the present application, the mounting groove 11 also has a second electrical connector, and the second driving member includes a second driving motor and a fourth electrical connector. When the support assembly 2 is installed in the mounting groove 11, the second electrical connector and the fourth electrical connector abut against each other to energize the second driving motor, thereby enabling the two connected third support rods 2231 to rotate relative to each other.

[0086] That is to say, each second driving member can be provided with a circuit, and the circuit can extend along the third support rod 2231, the second support rod 222 and the first support rod 221. For example, the fourth electrical connector of the circuit can be located at the lower end of the first support rod 221. In this way, when the support assembly 2 is installed in the mounting groove 11, the second driving motor can be easily energized through the second electrical connector and the fourth electrical connector. The structure is simple, and the second driving motor can make the third support rod 2231 stay at any position after rotating, and the stability is good.

[0087] Exemplarily, two connected third support rods 2231 can be connected by a rotating shaft, and three third support rods 2231 can be provided. Thus, the three third support rods 2231 are connected by two rotating shafts, and the axes of the two rotating shafts can be perpendicular to each other, so that the three third support rods 2231 can move in three-dimensional space, and can also adjust the supporting force in the up and down directions of the printed circuit board, thereby reducing the adjustment pressure of the second support rod 222 in the up and down directions.

[0088] It is understandable that the number of the third support rods 2231 can also be two, four, five, etc., and this application does not impose any limitation.

[0089] In the above example, the second drive motor and the fourth electrical connector can make the second drive motor better conductive, so that the third support rod 2231 can be better controlled, thereby being able to support different positions of the printed circuit board according to actual needs, with good flexibility.

[0090] In any embodiment of the present application, Figure 1-Figure 4 As shown, the support assembly 2 further includes a base 21 , which is connected to the lower end of the first telescopic rod and is detachably mounted in the mounting groove 11 .

[0091] In other words, the support assembly 2 is an independent structural component, that is, the support assembly 2 can be produced and assembled separately. Specifically, the base 21 and the telescopic component 22 can be produced separately, and then after the two are assembled, the support assembly 2 is assembled with the first workbench 1. Moreover, when assembling the support assembly 2, the support assembly 2 can be directly placed in the installation groove 11. When the support assembly 2 needs to be replaced or repaired, the support assembly 2 can be directly taken out from the installation groove 11. Thus, the disassembly and assembly are simple, which can effectively reduce the difficulty of disassembly and assembly of the support assembly 2 and improve the efficiency of disassembly and assembly and maintenance. In addition, the support assembly 2 can be processed and produced separately, which can reduce the difficulty of processing the support assembly 2, thereby reducing production costs.

[0092] In the above example, the support component 2 can be produced and assembled separately, and when assembling the support component 2, the support component 2 can be directly placed in the installation groove 11, which is simple to disassemble and assemble, and can effectively reduce the difficulty of disassembly and assembly of the support component 2 and improve the efficiency of disassembly and assembly and maintenance.

[0093] In any embodiment of the present application, a positioning assembly is provided between the base 21 and the mounting groove 11 , and the positioning assembly is used to limit the relative position between the base 21 and the mounting groove 11 in the circumferential direction.

[0094] That is to say, when the support component 2 is installed in the installation groove 11, it can be quickly positioned by the positioning component. After the support component 2 is positioned and installed, the first electrical connector can be electrically connected to the third electrical connector, and the second electrical connector can be electrically connected to the fourth electrical connector, so that the first drive motor and the second drive motor can be better powered, which can reduce the difficulty of assembly and improve assembly efficiency.

[0095] Exemplarily, the positioning assembly may include a first positioning block and a second positioning block, and the relative position between the base 21 and the mounting groove 11 in the circumferential direction is limited by the abutment between the first positioning block and the second positioning block.

[0096] In the above example, by providing the positioning component, the assembly difficulty can be reduced and the assembly efficiency can be improved, so that both the first drive motor and the second drive motor can be powered on well.

[0097] In any embodiment of the present application, Figure 1-Figure 4 As shown, a plurality of support assemblies 2 are arranged in a matrix.

[0098] In other words, a matrix arrangement of multiple support assemblies 2 provides superior structural stability. Specifically, this arrangement allows the support assemblies 2 to be regularly arranged in the vertical and horizontal directions, evenly distributing the load and reducing localized stress concentrations within the structure. Furthermore, the relatively regular arrangement of multiple support assemblies 2 facilitates installation, simplifies the assembly process, improves efficiency, and reduces costs.

[0099] In the above example, the multiple support components 2 arranged in a matrix have good structural stability, and can simplify the assembly process, improve assembly efficiency, and reduce assembly costs.

[0100] In any embodiment of the present application, a third support rod 2231 among the multiple third support rods 2231 connected to the second support rod 222 is a connecting rod, which is rotatably connected to the second support rod 222, and a third driving member is provided at the rotating connection, which is used to rotate the connecting rod relative to the second support rod 222.

[0101] For example, the connecting member can be retracted into the first support rod 221 along with the second support rod 222 .

[0102] That is to say, after the hinge group 223 is connected to the second support rod 222, the hinge group 223 can rotate relative to the second support rod 222. At the same time, the hinge group 223 includes multiple third support rods 2231 that can rotate relative to each other, thereby making the support assembly 2 have better flexibility. At the same time, through the provision of the third driving member, the connecting rod can be better driven to rotate, and the connecting rod can be rotated to a predetermined angle and then maintained at the angle, thereby better supporting the printed circuit board and having good stability.

[0103] Exemplarily, the third driving member can rotate 360° when driving the connecting rod to rotate. For example, the second support rod 222 and the connecting rod are rotatably connected by a rotating shaft, and the third driving member can be connected to the rotating shaft to drive the connecting rod to rotate 360°. Optionally, the third driving member can drive the connecting rod to rotate 360° clockwise, and the third driving member can also drive the connecting rod to rotate 360° counterclockwise, thereby improving the flexibility of the connecting rod.

[0104] In the above example, the flexibility of the support assembly 2 can be improved by rotatably connecting the connecting rod with the second support rod 222 and setting a third driving member. In addition, the third driving member can better drive the connecting rod to rotate, and can make the connecting rod rotate to a predetermined angle and maintain at that angle, thereby better supporting the printed circuit board and having good stability.

[0105] In any embodiment of the present application, Figure 1-Figure 4 As shown, one of the multiple third support rods 2231 that abuts against the printed circuit board is an abutment rod, and the support assembly 2 also includes an abutment member 23, which is detachably mounted on the abutment end of the abutment rod, and the abutment member 23 is made of silicone or polyurethane.

[0106] For example, when solder paste is applied to the first side of the printed circuit board, the second side of the printed circuit board can be supported by a supporting device, that is, the abutting members 23 of the multiple support assemblies 2 abut against the second side of the printed circuit board under the telescopic action of the telescopic member 22. At this time, the second side of the printed circuit board is relatively flat, and the abutting members 23 of the multiple support assemblies 2 abut against the second side. When the abutting members 23 abut against the first side, silicone has relatively excellent elasticity and high and low temperature resistance, can maintain good deformation recovery ability under extreme conditions, is not easy to harden or embrittle, and can withstand repeated abutment stress for a long time. Its surface friction coefficient is moderate, which can avoid hard wear on the contact parts. Polyurethane has both high strength and high elasticity, outstanding compressive and wear resistance, and excellent damping performance, which can absorb vibration energy and reduce impact noise during abutment. Both are flexible materials, can be molded into complex structures, can adapt to abutment interfaces of different shapes, and have high reliability and good stability.

[0107] In the above example, by providing the abutting member 23 , it is not easy to cause damage to the printed circuit board, and it can adapt to abutting interfaces of different shapes, with high reliability and good stability.

[0108] In any embodiment of the present application, the abutment member 23 includes a cylindrical abutment block, and the diameter D of the abutment block satisfies: 1 mm ≤ D ≤ 3 mm.

[0109] In other words, the cylindrical structure is easy to process and manufacture, and can ensure product quality consistency through standardized production, thereby reducing production costs. During assembly, the cylindrical structure is easy to position and install, which can significantly improve production efficiency. At the same time, the cylindrical shape is also conducive to reducing wear on the abutting surface and extending service life.

[0110] Exemplarily, the diameter D1 of the abutment block may be 1 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2 mm, 2.2 mm, 2.5 mm, 2.8 mm, or 3 mm.

[0111] In addition, it can also be understood that when the diameter of the abutment block is small, for example, the diameter D1 of the abutment block is 1 mm, the number of support components 2 can be increased, so that the surface of the printed circuit board has more dense support points, thereby improving the support reliability of the printed circuit board. When the diameter of the abutment block is large, for example, the diameter D1 of the abutment block is 3 mm, this type of support device can be applied to printed circuit boards with larger sizes, thereby effectively reducing the number of support components 2 and ensuring support for the printed circuit board.

[0112] In any embodiment of the present application, the abutting member 23 includes a suction cup, and a diameter D2 of the suction cup satisfies: 1 mm ≤ D2 ≤ 5 mm.

[0113] That is to say, when the printed circuit board is placed on the supporting device, the suction cup can be well adsorbed on the surface of the printed circuit board without causing damage to the surface of the printed circuit board. After adsorption, the suction cup can effectively fix the printed circuit board, which is beneficial to improve the stability when the printed circuit board is coated. In addition, the suction cup has a simple structure and a low production cost, which is beneficial to reducing the production cost of the supporting device.

[0114] Illustratively, the diameter D2 of the suction cup may be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm.

[0115] Illustratively, the suction pressure of the suction cup may range from -80 kPa to -20 kPa.

[0116] Similarly, when the diameter of the suction cup is small, for example, the diameter D2 of the suction cup is 1 mm, the number of support components 2 can be increased, so that the surface of the printed circuit board has more dense support points, thereby improving the support reliability of the printed circuit board. When the diameter of the suction cup is large, for example, the diameter D2 of the suction cup is 5 mm, this type of support device can be applied to printed circuit boards with larger sizes, thereby effectively reducing the number of support components 2 and ensuring support for the printed circuit board.

[0117] In any embodiment of the present application, Figure 3 As shown, the abutment member 23 is detachably mounted on the free end of the telescopic member 22 .

[0118] For example, the first support rod 221 and the second support rod 222 of the telescopic member 22 may be configured as telescopic rods, which may include pneumatic telescopic rods, hydraulic telescopic rods, or electric telescopic rods.

[0119] Exemplarily, the telescopic rod can be a pneumatic telescopic rod, whereby the first driving member can be an air pump, and the telescopic rods of multiple support assemblies 2 can be driven by the same air pump, that is, a pipeline can be set and a valve body that can be automatically opened and closed can be arranged on the pipeline, whereby the corresponding valve body is opened accordingly when the air pump is working, and the telescopic amount of the pneumatic telescopic rod at different positions can be adjusted. In addition, it can be understood that the first driving member can also include multiple air pumps, and the multiple air pumps correspond one-to-one to the multiple pneumatic telescopic rods.

[0120] Similarly, the telescopic rod can be a hydraulic telescopic rod, whereby the first driving member is a hydraulic pump, and the telescopic rods of multiple support assemblies 2 can be driven by the same hydraulic pump, that is, a pipeline can be set and a valve body that can be automatically opened and closed can be arranged on the pipeline. Thus, when the hydraulic pump is working, the corresponding valve body is opened, and the telescopic amount of the hydraulic telescopic rod at different positions can be adjusted. In addition, it can be understood that the first driving member can also include multiple hydraulic pumps, and the multiple hydraulic pumps correspond one-to-one to the multiple hydraulic telescopic rods.

[0121] Finally, when the telescopic rod is an electric telescopic rod, the first driving member can be a driving motor, which is not limited in this application.

[0122] In the above examples, the pneumatic telescopic rod, the hydraulic telescopic rod and the electric telescopic rod can all perform telescopic movements well, and can also provide good support for the printed circuit board, with good stability and high reliability.

[0123] In a specific embodiment, Figure 1-Figure 4As shown, the mounting grooves 11 on the first workbench 1 are cylindrical grooves with a diameter R3 of 1.5 cm. There are fourteen of them in total. The first workbench 1 is rectangular. The distance R1 between the cylindrical grooves arranged in a matrix and the two side edges of the first workbench 1 in the width direction is 1 cm. At the same time, the distance between two adjacent cylindrical grooves is also R1. The five first sensors are A sensor 31, B sensor 32, C sensor 33, D sensor 34, and E sensor 35. The E sensor 35 is arranged between multiple mounting grooves 11, and the distance from the adjacent mounting groove 11 is also R1. There are first and second areas at both ends of the length direction of the first workbench 1, respectively. The size R2 of the first and second areas is equal to 1 cm. The distance between the mounting groove 11 adjacent to the first area and the first area is R1, and the distance between the mounting groove 11 adjacent to the second area and the second area is R1.

[0124] For example, each support assembly 2 can be movable in both the length and width directions, for example, by being electrically driven, which is not limited in this application. By making the support assembly 2 movable, the first electrical component on the first surface can be better avoided.

[0125] For example, the initial length of the telescopic rod can be 2 cm, and the extension amount can be 2 cm, or 3 cm, 4 cm, etc., which is not limited in this application.

[0126] According to an embodiment of the present application, the coating equipment includes a coating assembly and a supporting device. The coating assembly is suitable for coating the first and second surfaces of the printed circuit board. The supporting device is suitable for abutting against the first or second surface of the printed circuit board to support the printed circuit board.

[0127] That is to say, when solder paste is applied to the first surface of the printed circuit board, the second surface of the printed circuit board can be supported by the supporting device, that is, the abutment members 23 of the multiple supporting components 2 abut against the second surface of the printed circuit board under the telescopic action of the telescopic member 22. At this time, the second surface of the printed circuit board is relatively flat, and the abutment members 23 of the multiple supporting components 2 abut against the second surface, so that the printed circuit board can be supported through multiple points. The stability of the printed circuit board is better, and the coating effect of the first surface can also be better. The first electrical component can be arranged at the position where the solder paste is applied on the first surface, and then the first electrical component is soldered to the first surface of the printed circuit board by reflow soldering. The welding effect is good, and it is not easy to have adverse phenomena such as insufficient tin, deviation, and short circuit.

[0128] Furthermore, after the printed circuit board is reflowed, the first side of the printed circuit board can be directed toward the supporting device, and the supporting device can adjust the length of the telescopic member 22 through the driving member, so that the supporting assembly 2 opposite to the first electrical component on the first side can be retracted, that is, this part of the supporting assembly 2 does not contact the first electrical component, thereby avoiding damage to the first electrical component. Alternatively, the first controller controls the second driving member to drive the third support rod 2231 to adjust the supporting position of the third support rod 2231 on the printed circuit board to avoid electrical components, pads and conductive circuits. In this way, regardless of the arrangement area of ​​the first electrical component on the printed circuit board, Any change can better avoid the first electrical component, so that it can adapt to different types of printed circuit boards, and in the area where there is no first electrical component on the first side, it can be supported by the remaining support components 2, that is, the first driving member extends the telescopic member 22, so that the abutment member 23 abuts against the first side of the printed circuit board. In this way, regardless of whether the printed circuit board is deformed, the multiple support components 2 can better support the printed circuit board effectively, so that when the second side is coated with solder paste, the defective phenomena such as insufficient solder, deviation, short circuit, etc. caused by insufficient support force can be reduced, the reliability of coating on the second side can be improved, and the coating surface can be ensured to be smooth.

[0129] According to the coating equipment of the embodiment of the present application, the coating of the printed circuit board can be achieved well, with high reliability and good stability, and it is not easy to cause adverse phenomena such as insufficient tin, deviation, short circuit, etc. caused by insufficient supporting force.

[0130] According to the coating method of the second embodiment of the present application, the coating equipment according to the first embodiment of the present application is used.

[0131] like Figure 1-Figure 5 As shown, the coating method can coat the second side of the printed circuit board, the first side of the printed circuit board is fixedly connected to the electrical components, and the first side and the second side are two opposite sides of the printed circuit board, and the coating method includes: the first side faces the supporting device; the first sensor obtains the surface information of the first side; the first controller controls the first driving member and the second driving member according to the surface information of the first side; the first driving member drives the second support rod 222 to extend and retract; the second driving member drives the third support rod 2231 to adjust the supporting position of the third support rod 2231 on the first side to avoid the electrical components; the coating component coats the second side.

[0132] That is to say, after the printed circuit board is reflowed, the first surface of the printed circuit board can be turned toward the supporting device, and the supporting device can adjust the length of the telescopic member 22 through the first driving member. Specifically, the second support rod 222 can be driven by the first driving member to telescope relative to the first support rod 221, so as to support the first surface. For the position where the first electrical component is arranged on the first surface, the support assembly 2 opposite to the first electrical component on the first surface can be retracted, that is, this part of the support assembly 2 does not contact the first electrical component, thereby avoiding damage to the first electrical component. Alternatively, the first controller controls the second driving member to drive the third support rod 2231 to adjust the supporting position of the third support rod 2231 on the printed circuit board to avoid the first electrical component. In this way, no matter how the arrangement area of ​​the first electrical component on the printed circuit board changes, the first electrical component can be avoided better, so that it can adapt to different models of printed circuit boards, so as to meet production needs. In the area where there is no first electrical component on the first side, it can be supported by the remaining support components 2, that is, the first driving member extends the telescopic member 22, so that the third support rod 2231 abuts against the first side of the printed circuit board. In this way, no matter whether the printed circuit board is deformed, multiple support components 2 can effectively support the printed circuit board, so that when the second side is coated with solder paste, the problem of insufficient tin, deviation, short circuit and other undesirable phenomena caused by insufficient support force can be reduced, the reliability of coating on the second side can be improved, and the coating surface can be ensured to be smooth.

[0133] The coating method may also include: facing the second side of the printed circuit board toward the support assembly 2, the first sensor obtaining surface information of the second side, the first controller controlling the driving member according to the surface information of the second side, the first driving member driving the second support rod 222 to extend and retract so that the abutment member 23 abuts against the second side, thereby supporting the printed circuit board; coating the first side of the printed circuit board.

[0134] According to the coating method of the embodiment of the present application, the coating of the printed circuit board can be achieved well, with high reliability and good stability, and it is not easy to cause adverse phenomena such as insufficient tin, deviation, short circuit, etc. caused by insufficient supporting force.

[0135] In any embodiment of the present application, the support device of the coating equipment also includes a first workbench 1, the first workbench 1 is provided with a mounting groove 11, and there are multiple mounting grooves 11. Multiple support components 2 are installed in the multiple mounting grooves 11 in a one-to-one correspondence. The mounting groove 11 has a first electrical connector and a first driving component including a first driving motor and a third electrical connector. When the support component 2 is installed in the mounting groove 11, the first electrical connector and the third electrical connector abut to energize the first driving motor. The first driving motor is used to drive the second support rod 222 to extend and retract. After obtaining the surface information of the first surface, it also includes: obtaining a supportable area around the electrical component, and the area of ​​the supportable area is greater than or equal to a predetermined area; if there is no supportable area, the support component 2 corresponding to the electrical component, the pad or the conductive circuit in the up and down directions is removed from the corresponding mounting groove 11.

[0136] In other words, the support assemblies 2 can be arranged in the corresponding mounting slots 11 according to actual needs. In other words, the number of support assemblies 2 can be arranged according to different support needs, thereby reducing the use of support assemblies 2. In other words, the number of telescopic rods in traditional support equipment is fixed, and sufficient support rods must be configured for various possible support scenarios, resulting in high costs. However, this design can be arranged as needed, significantly reducing the number of idle components and lowering material, manufacturing and maintenance costs. From the perspective of production efficiency, the layout of support assemblies 2 can be quickly adjusted according to different products, avoiding the tedious process of frequently replacing the overall support structure, shortening equipment debugging time, and speeding up production.

[0137] When there's no support area around an electrical component, promptly removing the corresponding support assembly 2 can effectively prevent short circuits, open circuits, and other faults caused by accidental contact with the support assembly 2, ensuring product quality and production safety. Furthermore, this on-demand layout allows coating equipment to better adapt to diverse production needs, enhancing its versatility and compatibility.

[0138] In the above example, the number of support components 2 can be arranged according to different support requirements, so that the coating equipment can better adapt to diversified production needs and improve the versatility and compatibility of the coating equipment.

[0139] In any embodiment of the present application, after obtaining the surface information of the first surface, it also includes: obtaining the thickness value of the electrical component along the up and down directions; when the thickness value is greater than the predetermined thickness, the support component 2 corresponding to the electrical component along the up and down directions is removed from the corresponding installation groove 11; when the thickness value is less than or equal to the predetermined thickness, the supportable area around the electrical component is obtained.

[0140] For example, the thickness value of the electrical component can be directly obtained according to the dimension parameter table of the electrical component, or can be obtained through a sensor, which is not limited in this application.

[0141] In other words, this application further adds the ability to obtain the thickness of electrical components and adjust support assembly 2 accordingly, providing more refined protection and production optimization for coating equipment. By obtaining the thickness of electrical components along the vertical direction, the height characteristics of the electrical components can be accurately determined. When the thickness value exceeds the predetermined thickness, the corresponding support assembly 2 is promptly removed. This effectively avoids undue pressure on the support assembly 2 due to excessive thickness of the electrical components, prevents physical damage such as deformation and breakage of the electrical components, and greatly improves product yield.

[0142] When the thickness value is less than or equal to the predetermined thickness, the surrounding supportable area is further determined. This hierarchical judgment mechanism ensures that the layout of the support assembly 2 meets the support requirements without blindly installing and wasting resources. This process enables the coating equipment to operate intelligently and accurately when faced with complex electrical component layouts, significantly improving the level of automation and intelligence in the production process.

[0143] Furthermore, this feature reduces damage to the equipment caused by improper operation of the support assembly 2. It prevents unnecessary contact between the support assembly 2 and high components, reduces wear on equipment components, extends equipment life, and reduces maintenance frequency and costs. Furthermore, this precise operating process helps improve the stability of the production environment and reduces production interruptions caused by component damage.

[0144] In the present application, the support assembly 2 can be dismantled manually or automatically by setting up a robotic arm, and this application does not impose any restrictions.

[0145] In the above example, a hierarchical judgment mechanism ensures that the layout of support assembly 2 meets support requirements while avoiding blind installation and waste of resources. This process enables intelligent and precise operation of coating equipment when faced with complex electrical component layouts, significantly improving the level of automation and intelligence in the production process.

[0146] In any embodiment of the present application, a third support rod 2231 among the multiple third support rods 2231 that abuts against the printed circuit board is an abutment rod, and the support assembly 2 also includes an abutment member 23, which is detachably mounted on the abutment end of the abutment rod, and the abutment member 23 is made of silicone or polyurethane. The abutment member 23 includes a suction cup, and the support device also includes: a third sensor, which is mounted between the suction cup and the abutment rod for obtaining a drag force, and the coating assembly also includes: obtaining the warping curvature information and the warping position information of the printed circuit board before coating the second side; when the suction cup is attracted to the surface of the printed circuit board, the first controller is also used to control the support assembly 2 at the corresponding warping position according to the warping curvature information and the warping position information to drag the printed circuit board at the warped position; obtaining the dragging force, and the first controller controls the dragging action of the support assembly 2 according to the dragging force.

[0147] In other words, the added dragging function and related component design further enhance the production efficiency of coating equipment. The removable suction cup made of silicone or polyurethane not only provides good cushioning properties, preventing scratches and indentations on the printed circuit board surface during the dragging process, but also ensures that the suction cup adheres firmly to the printed circuit board surface with its high elasticity and strong adsorption force, providing a reliable foundation for dragging.

[0148] The third sensor acquires the drag force in real time. Combined with the PCB's curvature and position information, the first controller dynamically and precisely controls the dragging action of support assembly 2. This closed-loop control mechanism intelligently adjusts the drag force and direction based on varying degrees of PCB warpage, ensuring the PCB achieves ideal flatness before coating. This effectively addresses issues such as uneven coating thickness and coating defects caused by uneven PCB surfaces, significantly improving the product's appearance, electrical performance, and yield rate.

[0149] Furthermore, this feature enhances the coating equipment's adaptability to PCBs of varying specifications and warpage. Eliminating the need to customize production plans for each PCB, intelligent drag-and-drop adjustments can meet diverse production needs, reducing coating equipment commissioning costs and production preparation time. Furthermore, drag-and-drop control reduces abnormal wear on coating components caused by uneven PCBs, extending the coating equipment's lifespan and reducing maintenance costs.

[0150] In the above example, by adding a drag function and related component design, the drag force and direction can be intelligently adjusted according to the different degrees of warping of the printed circuit board, so that the circuit board can reach the ideal flatness before coating, effectively solving problems such as uneven coating thickness and coating defects caused by the unevenness of the printed circuit board, and better improving the appearance quality and electrical performance of the product, and better improving the qualified rate of finished products.

[0151] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and intent of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A coating device for printed circuit boards, characterized in that: The printed circuit board includes a first surface and a second surface, and the first surface and the second surface are both suitable for coating solder paste so that electrical components are fixed on the first surface and the second surface by reflow soldering. The coating device includes: a coating assembly, the coating assembly being adapted to coat the first surface and the second surface; A supporting device is provided on the lower side of the coating assembly, and is used to support one of the first surface and the second surface so that the coating assembly can coat the other of the first surface and the second surface, wherein the supporting device includes: A plurality of support assemblies (2), wherein the plurality of support assemblies (2) are arranged in a matrix on one side of the coating assembly, the support assembly (2) comprises a telescopic member (22) and a first driving member, the telescopic member (22) comprises a first support rod (221), a second support rod (222) and a hinge group (223), the hinge group (223) comprises a plurality of third support rods (2231) pivotally connected in sequence, the lower end of the second support rod (222) is telescopically arranged in the first support rod (221), the first driving member is used to drive the second support rod (222) to telescope, the upper end of the second support rod (222) is connected to the hinge group (223), a second driving member is provided at the rotation connection of the two connected third support rods (2231), and the second driving member is used to make the two connected third support rods (2231) rotate relative to each other; A first sensor and a first controller, wherein the first sensor is used to obtain surface information of the first surface or the second surface, and the first controller is used to control the first driving member to drive the second support rod (222) to extend and retract according to the surface information, and to control the second driving member to drive the third support rod (2231) to adjust the supporting position of the third support rod (2231) on the printed circuit board to avoid the electrical component.

2. The coating device according to claim 1, characterized in that The supporting device further comprises: a second sensor and a second controller, wherein the second sensor is arranged on the telescopic member (22), the second sensor is used to obtain a pressure value between the telescopic member (22) and the printed circuit board, and the second controller is used to control the first driving member according to the pressure value to adjust the telescopic amount of the second supporting rod (222).

3. The coating device according to claim 1, characterized in that The support device also includes a first workbench (1), the first workbench (1) is provided with a mounting groove (11), and the mounting groove (11) is provided with a plurality of the support components (2) being mounted in the plurality of the mounting grooves (11) in a one-to-one correspondence. The mounting groove (11) has a first electrical connector, and the first driving component includes a first driving motor and a third electrical connector. When the support component (2) is mounted in the mounting groove (11), the first electrical connector and the third electrical connector abut against each other, so that the first driving motor is energized, thereby driving the second support rod (222) to telescope.

4. The coating device according to claim 3, characterized in that The mounting groove (11) also has a second electrical connector, and the second driving member includes a second driving motor and a fourth electrical connector. When the support assembly (2) is installed in the mounting groove (11), the second electrical connector and the fourth electrical connector abut against each other to energize the second driving motor, thereby enabling the two connected third support rods (2231) to rotate relative to each other.

5. The coating device according to claim 3, characterized in that The support assembly (2) further comprises a base (21), the base (21) being connected to the lower end of the first support rod (221), and the base (21) being detachably mounted in the mounting groove (11).

6. The coating device according to claim 5, characterized in that A positioning assembly is provided between the base (21) and the mounting groove (11), and the positioning assembly is used to limit the relative position between the base (21) and the mounting groove (11) in the circumferential direction.

7. The coating device according to claim 1, characterized in that One of the plurality of third support rods (2231) connected to the second support rod (222) is a connecting rod, the connecting rod is rotatably connected to the second support rod (222), and a third driving member is provided at the rotatable connection, the third driving member is used to rotate the connecting rod relative to the second support rod (222).

8. The coating device according to claim 1, characterized in that One of the plurality of third support rods (2231) that abuts against the printed circuit board is an abutment rod, and the support assembly (2) further comprises an abutment member (23), which is detachably mounted on the abutment end of the abutment rod, and the abutment member (23) is made of silicone or polyurethane.

9. The coating device according to claim 8, characterized in that The abutment member (23) comprises a cylindrical abutment block, and the diameter D1 of the abutment block satisfies: 1mm≤D1≤3mm.

10. The coating device according to claim 8, characterized in that The abutment member (23) comprises a suction cup, and the diameter D2 of the suction cup satisfies: 1mm≤D2≤5mm.

11. The coating device according to claim 10, characterized in that The surface information includes the warping curvature information and the warping position information of the printed circuit board. When the suction cup is attracted to the surface of the printed circuit board, the first controller is further used to control the support assembly (2) at the corresponding warping position according to the warping curvature information and the warping position information, so as to drag the printed circuit board at the warping position. The support device further includes: a third sensor, which is installed between the suction cup and the abutment rod and is used to obtain a dragging force. The first controller controls the dragging action of the support assembly (2) according to the dragging force.

12. A coating method, characterized in that: Using the coating device according to any one of claims 1 to 11, coating the second side of a printed circuit board, wherein the first side of the printed circuit board is fixedly connected to an electrical component, and the first side and the second side are two opposite sides of the printed circuit board, respectively, the coating method comprising: directing the first surface toward the supporting device; The first sensor acquires surface information of the first surface; The first controller controls the first driving member and the second driving member according to the surface information of the first surface; The first driving member drives the second support rod (222) to extend and retract; the second driving member drives the third support rod (2231) to adjust the supporting position of the third support rod (2231) on the first surface to avoid the electrical component; The coating component coats the second surface.

13. The coating method according to claim 12, characterized in that The support device of the coating equipment further comprises a first workbench (1), the first workbench (1) is provided with a mounting groove (11), a plurality of the mounting grooves (11) are provided, a plurality of the support components (2) are mounted in the plurality of the mounting grooves (11) in a one-to-one correspondence, a first electrical connector is provided in the mounting groove (11), the first driving component comprises a first driving motor and a third electrical connector, when the support component (2) is mounted in the mounting groove (11), the first electrical connector and the third electrical connector are in contact, so that the first driving motor is energized, and the first driving motor is used to drive the second support rod (222) to extend and retract, and after obtaining the surface information of the first surface, the following further comprises: Acquire a supportable area around the electrical component, where the area of ​​the supportable area is greater than or equal to a predetermined area; If the supportable area does not exist, the support assembly (2) corresponding to the electrical component in the up-down direction is removed from the corresponding installation slot (11).

14. The coating method according to claim 13, wherein After obtaining the surface information of the first surface, the method further includes: Obtaining a thickness value of the electrical component along a vertical direction; When the thickness value is greater than a predetermined thickness, the support assembly (2) corresponding to the electrical component in the up-down direction is removed from the corresponding installation slot (11); When the thickness value is less than or equal to the predetermined thickness, the supportable area around the electrical component is obtained.

15. The coating method according to claim 12, wherein One of the plurality of third support rods (2231) that abuts against the printed circuit board is an abutting rod, the support assembly (2) further comprises an abutting member (23), the abutting member (23) being detachably mounted on the abutting end of the abutting rod, the abutting member (23) being made of silicone or polyurethane, the abutting member (23) comprising a suction cup, the support device further comprising: a third sensor, the third sensor being mounted between the suction cup and the abutting rod for obtaining a dragging force, and the coating assembly further comprising: Acquiring warping curvature information and warping position information of the printed circuit board; When the suction cup is sucked onto the surface of the printed circuit board, the first controller is further used to control the support component (2) at the corresponding warping position according to the warping curvature information and the warping position information, so as to drag the printed circuit board at the warping position; The dragging force is acquired, and the first controller controls the dragging action of the support assembly (2) according to the dragging force.

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