Device and method for cooling electronics of a motor vehicle

Abstract

The invention relates to a device and a method for cooling electronic components of a motor vehicle, comprising at least one heat-conducting element for cooling electronic components arranged on a circuit board and at least one housing having at least one opening for connecting a heat sink, in particular a cooler or a cooling channel, the heat-conducting element is arranged at least partially in the opening in order to connect the electronic component to the cooler in a heat-conducting manner, an elastic fastening means is provided which connects the circuit board and / or the electronic component to the heat-conducting element, the elastic fastening means exerting a force on the heat-conducting element towards the electronic component to be cooled, the heat-conducting element is connected to the housing by means of a further elastic fastening means which permits a relative movement of the heat-conducting element and the housing, a permanently elastic seal being arranged between the heat-conducting element and the housing.

Description

Technical Field

[0001] The invention relates to a device and a method for cooling electronic components of a motor vehicle according to the preambles of the independent claims. Background Art

[0002] Document DE 10 2013 206 999 A1 discloses a control unit for a motor vehicle, which has a heat-conducting housing wall formed by a heat-conducting plate and forms a heat sink. The heat-conducting housing wall is detachably connected to the housing and has a stamping in a region opposite the power semiconductor. The stamping brings the housing wall closer to the power semiconductor, so that the distance, in particular the gap, between the housing wall and the power semiconductor before stamping is greater than the distance after stamping, in particular the distance between the housing wall and the surface region. Summary of the Invention

[0003] The object of the present invention is to ensure reliable cooling of electronic components. This object is achieved by the features of the independent claims.

[0004] By arranging a permanently elastic seal between the heat-conducting element and the housing, the gap between the electronic device to be cooled and the heat-conducting element can be minimized. Here, the heat-conducting element is screwed into the housing in a resiliently supported manner, wherein the heat-conducting element is supported on the housing by the permanently elastic seal. When tightening or installing the circuit board, the heat-conducting element is pressed into the desired position relative to the electronic device to be cooled, thereby reducing the gap to the desired size. The permanently elastic seal is thus stretched and still seals the housing against dust and, if necessary, water. By elastically supporting the heat-conducting element on both sides (and, if necessary, reinforcing it on the opposite side of the circuit board), the gap can be minimized while maintaining the sealing of the basic housing. After complete assembly, the heat-conducting element (particularly a heat sink) with cooling fins or a needle-like structure extends from the housing or extends into any cooling channels. By combining the heat-conducting element, especially the heat-conducting element, which is elastically supported on both sides, with the permanently elastic seal, all mechanical tolerances in the controller can be compensated. This creates a sealed basic housing with a movable heat sink or heat-conducting element that compensates for existing tolerances without loss of functionality. This allows for efficient cooling of the controller or vehicle computer, particularly for electronic components with high power loss or power loss density (SoCs (Systems on a Chip), microprocessors, microcontrollers, etc.). The use of elastically supported heat-conducting elements reduces deflection of the circuit board between the circuit board support and the interface between the controller and the cooler compared to rigidly mounted circuit boards. Furthermore, conventional EMC shielding can be achieved. Multiple electronic components on the circuit board can also be reliably cooled without mechanical interference. The circuit board can be mounted as usual and is therefore resistant to vibrations and shocks, while being subject to reduced mechanical stress due to the proposed cooling concept.

[0005] In an advantageous development, the permanently elastic seal is arranged such that there is no direct contact between the heat-conducting element and the housing. This allows elastic support on both sides to compensate for tolerances while providing a reliable seal.

[0006] In one advantageous refinement, at least one receptacle for the seal is provided in the housing and / or the heat-conducting element. This allows the seal to be securely positioned. It is particularly advantageous if the seal has at least one fixing region for securing the seal in the receptacle. Particularly preferably, the seal has at least one fin, particularly in the fixing region, for securing the seal in the receptacle. Particularly preferably, the seal includes at least one intermediate section that is flexibly movable in order to seal the gap between the housing and the heat-conducting element. This further improves functional reliability by providing a reliable seal and ensuring the elastic properties of the seal. To this end, the intermediate section of the seal is particularly preferably designed as a flexible hollow body. Particularly preferably, the seal is made of a rubber-elastic material, such as, in particular, EPDM (ethylene-propylene-diene (monomer) rubber). In an advantageous refinement, the seal is particularly O-shaped, so that it surrounds the opening in a circumferential manner. This allows for a reliable sealing effect and possible tolerance compensation using particularly simple methods.

[0007] In one advantageous refinement, the elastic fastening means and / or the further elastic fastening means include at least one spring, wherein the spring is designed as a coil spring surrounding the respective fastening element and / or as at least one, in particular corrugated, leaf spring and / or as at least one leaf spring arranged at least in particular in a Z-shape between the two fastening elements. Particularly preferably, the spring includes at least one support surface, via which the spring exerts a force on the fastening element and / or the printed circuit board and / or the electronic component and / or the heat-conducting element. This makes it particularly easy and effective to support the heat-conducting element, preferably on both sides, so that gaps with the electronic component and the seal can be reduced using simple methods. Corresponding tolerances can be compensated particularly easily.

[0008] In one advantageous refinement, the housing and / or the heat-conducting element include at least one receptacle for at least one of the elastic fastening means and / or another fastening element, in particular at least one threaded fastener, for connecting the circuit board to the housing. This allows for a reliable connection between the housing, the heat-conducting element, and the circuit board. This further enhances the robustness of this arrangement, particularly against shocks and vibrations.

[0009] In one advantageous refinement, the heat-conducting element includes an outer edge that covers the opening in the housing and allows passage of at least one fastener for another elastic fastening mechanism and / or a receptacle on the housing for another elastic fastening mechanism. Furthermore, a receptacle for a seal is provided in the outer edge covering the opening in the housing. This circumferential outer edge allows the spring to uniformly apply the desired force to further secure the seal. This section can also accommodate the seal and simultaneously apply the desired force thereto. This further improves functional reliability and tolerance compensation.

[0010] In an advantageous refinement, a gap is formed between the housing and the heat-conducting element, and the transition between the gap and the recess is provided with at least one inclined surface, which cooperates with the seal in the sealed state. The sealing effect is further improved by correspondingly increasing the surface area for contact with the seal.

[0011] In one advantageous refinement, the circuit board includes at least one recess through which a receptacle for a further elastic fastening means of the heat-conducting element is guided. This, on the one hand, further improves the positional accuracy of the circuit board relative to the heat-conducting element. Furthermore, it reduces stresses on the circuit board during bending.

[0012] In an advantageous development, a further heat conducting element is provided between the heat conducting element and the electronic component, in particular a flexible heat conducting element or a heat conducting paste, etc. This can further improve heat transfer, in particular because the further heat conducting element conforms well to the surface of the electronic component due to its flexibility.

[0013] In an advantageous development, the heat-conducting element has at least one surface structure that projects into the cooling channel and serves to dissipate heat. This improves the heat transfer behavior and thus enables better cooling of the electronic component.

[0014] Furthermore, a method according to the invention is provided according to the features of a further independent claim, which method leads to improved and tolerance-compensated cooling.

[0015] Further advantageous developments emerge from the further dependent claims and the description. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings show:

[0017] Figure 1 This is a schematic diagram of the controller in the assembled state;

[0018] Figure 2 is a top view of a circuit board with electronic components underneath;

[0019] Figure 3yes Figure 1 Detailed view of

[0020] Figure 4 is a detailed view of the seal; and

[0021] Figure 5 It is a perspective exploded view of another embodiment. DETAILED DESCRIPTION

[0022] The present invention is schematically illustrated by means of exemplary embodiments and is described in detail below with reference to the accompanying drawings.

[0023] Figure 1 1 shows a schematically illustrated cross section of a controller 10. The controller 10 comprises at least one circuit board 16 on which at least one electronic component 26 to be cooled is arranged. The electronic component 26 can be, for example, a so-called system-in-place (SIP) or a component thereof and / or a so-called system-on-chip (SOC) or another semiconductor or chip with high power dissipation. The circuit board 16 is connected to the heat-conducting element 14 via a fastener 22. For this purpose, the fastener 22 engages in a protruding receptacle 11 of the heat-conducting element 14. At least one plug 30 is arranged on the circuit board 16. The receptacle 11 of the heat-conducting element 14 extends through Figure 2 The recess 33 shown in the circuit board 16 projects outward. A resilient fastening mechanism 22, 19 is formed by a fastener 22 and at least one or more springs 19. The spring 19 is arranged between the respective head of the fastener 22 (in particular a threaded fastener), the upper side of the receptacle 11 of the heat-conducting element 14, and (via the respective support surface) the upper side of the circuit board 16. The spring 19 extends between the at least two fasteners 22. The spring 19 can be Z-shaped, for example, but other embodiments are also possible. By tightening the fastener 22 (which connects the circuit board 16 to the heat-conducting element 14) or the resilient fastening mechanism 22, 19 due to the spring 19, the heat-conducting element 14 is pressed onto the electronic component 26 or the circuit board 16.

[0024] The heat-conducting element 14 is secured in the housing 18 via corresponding receptacles 32 using another fastener 20, particularly at least one spring 23 and another elastic fastener 20 in the housing 18. This allows forces acting on the heat-conducting element 14 to be applied toward the surface of the housing 18 or the seal 24. This enables relative movement between the heat-conducting element 14 and the housing 18. This application of force helps the permanently elastic seal 24 ensure a reliable seal between the cooling channel 13 and the heat-conducting element 14, even with certain tolerances in other components. In this embodiment, the spring 23 is arranged between the head of the fastener 20 (e.g., a threaded fastener) and a corresponding surface on the heat-conducting element 14. The spring 23 can be configured, for example, as a coil spring or leaf spring surrounding the fastener 20.

[0025] Furthermore, fasteners 31 are provided, particularly at the edge regions or corners of the circuit board 16, to connect the circuit board 16 to the housing 18, particularly to the base housing. Corresponding receptacles 32 are provided in the housing 18 for the fasteners 31. These receptacles 32 extend dome-shaped into the center of the housing, toward the circuit board 16. Preferably, the fasteners 31 are designed as screw fasteners.

[0026] The housing 18 or housing part at least partially surrounds the electronic component 26 to be cooled or the circuit board 16. The housing 18 can be composed of two housing parts, such as Figure 1 As shown in the example, the housing portion 18 is connected to the circuit board 16 and another housing portion at the contact surfaces via EMC seals 28. An EMC seal 28 is also disposed at the joint between the housing portion of the housing 18 and the circuit board 16. The EMC seal 28 can be, for example, a seal composed of FIPG (Formin Place Gasket, formed in place gasket (liquid during assembly)), CIPG (Cured in Place Gasket, cured in place gasket (hardened during assembly)), FoF (Fabric over Foam, fabric tube covered with foam core), tape, foam core, springs, and the like. This achieves electromagnetic shielding for certain electronic components on the circuit board 16.

[0027] The heat-conducting element 14 is used to cool the electronic device 26 via a heat sink (e.g., cooler 12). The heat-conducting element 14 can be a so-called heat sink, particularly made of a heat-conducting material such as copper, or a so-called vapor chamber or air chamber, in which heat generated by the phase change of a cooling medium arranged in a closed chamber is dissipated very efficiently. To better dissipate heat at the cooler 12, the heat-conducting element 14 can have certain surface structures 17, such as ribs, extensions, pins, or turbulators (e.g., in the form of appropriately shaped sheets), to increase the surface area of the heat-conducting element 14 for better heat dissipation. These surface structures 17 are surrounded by the flow of the cooling medium from the cooler 12 in the cooling channel 13 to dissipate heat. The cooling medium can be a liquid cooling medium (e.g., water or a water-glycol mixture), but can also be a gaseous cooling medium or other cooling medium (e.g., air). Because the electronic device 26 needs to dissipate a large amount of heat, a cooler 12 that operates on a liquid cooling medium, particularly a water cooler, is used. The cooler 12 has a coolant supply and a coolant discharge for circulating the coolant. Corresponding cooling channels 13 for circulating the coolant can be integrated into the housing part or housing 18. Figure 1During assembly of the controller 10 , the cooler 12 is connected to a further subassembly consisting of the printed circuit board 16 with the electronic components 26 to be cooled, the heat conducting element 14 and the housing part of the housing 18 .

[0028] The housing 18, which at least partially forms the cooling channel 13, has an opening 21 for accommodating the heat-conducting element 14 or, in particular, its surface structure 17. This opening 21 is part of the cooling channel 13 through which the cooling medium flows. During assembly of the controller 10, a flexible and permanently elastic seal 24 (e.g., in the form of an O-ring) is applied around this opening 21, so that the gap between the housing 18 and the heat-conducting element 14 is sealed from the cooling medium of the cooling channel 13, as described in more detail below. During assembly, the assembly consisting of the circuit board 16 and the housing part 18, as well as the elastically supported heat-conducting element 14, is connected to the cooler 12, so that the heat-conducting element 14 or the heat sink closes the opening 21 of the cooler 12 with the permanently elastic seal 24.

[0029] To improve the heat transfer, a further particularly flexible heat-conducting element 15 , such as a pad or a liner, can be arranged between the electronic component 26 to be cooled and the surface of the heat-conducting element 14 , or other TIM materials (TIM: thermal interface material or heat-conducting material 28 ; for example, thermal paste, etc.) can be used.

[0030] Figure 2 The figure shows a view of the circuit board 16 with the electronic components 26 mounted thereon, viewed from below. On one side, corresponding recesses 33 are provided in the circuit board 16 around the electronic components 26. The recesses 33 are, for example, circular. They are used to allow the receiving portion 11 of the heat conducting element 14 to pass through, such as Figure 1 shown.

[0031] Figure 3 Shown Figure 1 . In particular, the arrangement and design of the seal 24 are shown more precisely. The permanently elastic seal 24 is arranged in a recess 34 of the heat-conducting element 14 and / or in a recess 36 of the housing 18. The recesses 34, 36 are designed as depressions or grooves. The gap to be sealed between the heat-conducting element 14 and the housing 18 or the cooler 12 is parallel to the surface of the electronic component 26 to be cooled. The receptacles 34, 36 extend transversely to the direction of the gap to be sealed. The receptacles are dimensioned so that they only accommodate the fin area or the fixing area of the seal 24 for fixing, but the middle section 27 of the seal 24 is at least partially located in the area of the gap.

[0032] The seal 24 has fins 25 at both ends. The two end sections of the seal 24 are connected to each other by a middle section 27. The middle section 27 at least partially seals the gap formed between the heat-conducting element 14 and the housing 18, and the coolant of the cooling channel 13 can reach this gap from one side. The fins 25 are arranged at a certain angle with respect to the longitudinal axis of the seal 24. Figure 2 In the embodiment of the present invention, each wing 25 projects inwardly towards the middle section 27 of the seal 24. The wing 25 is used in particular to fix the flexible seal 24 in the corresponding housing 34, 36. Figure 3 In the embodiment, for example, two fins 25 are provided on each side. The middle section 27 of the seal 24 is configured in a rhombus shape with a cavity in cross section. The cavity facilitates achieving the desired elasticity. If pressure is applied to one side of the middle section 27, the opposing portion of the middle section 27 moves in the direction of the increased pressure, thereby closing the opening or gap therebehind, which extends between the heat-conducting element 14 and the housing 18. The permanently elastic seal 24 is made, for example, of a rubber-elastic material, such as EPDM (ethylene-propylene-diene (monomer) rubber), or other suitable rubber or rubber-like material or other material.

[0033] according to Figure 4 The embodiment shown is characterized by a more detailed illustration. The receptacle 34 of the heat-conducting element 14 and the receptacle 36 of the housing 18 or the cooler 12 are designed transversely to the surface of the electronic component 26 to be cooled. A gap to be sealed is formed between the surface of the housing 18 and the heat-conducting element 14, which extends parallel to the surface of the electronic component 26. This gap widens towards the receptacle 34, 36 by a corresponding bevel 35, 37. The permanently elastic seal 24 in turn has an end section 25, which particularly preferably has a wing 25 for fixing, which is arranged in the corresponding receptacle 34, 36. In accordance with Figure 3 In the exemplary embodiment, each fin is oriented at an angle from the end section toward the middle section 27. When a correspondingly high pressure is applied, the middle section 27 can be moved toward the corresponding wall sections of the housing 18 and the heat-conducting element 14 in a sealing manner, as shown by the schematic semicircle. The bevel 35 ensures that the seal 24 contacts the correspondingly configured wall sections of the housing 18 and / or the heat-conducting element 14 over a large area, thereby achieving a particularly good sealing effect. The size of the gap to be sealed ranges, for example, from 0.1 mm to 1.4 mm. Under normal pressures in the range of 9 bar to 10 bar, the seal 24 deforms into the sealing state shown.

[0034] Figure 4Different seals 24 are shown, differing, for example, in the length of the end sections with fastening elements 25 (e.g., fins) or the width of the middle section 27. The middle region 27 can also be designed simply as an expandable thickening. Alternatively, a combination of a corresponding thickening and a hollow body is also possible, as shown in the embodiment shown on the lower left.

[0035] according to Figure 5 The embodiment of FIG2 shows an exploded perspective view. A corresponding spring 19 is arranged between the fastener 22 and the upper side of the circuit board 26. The spring can be a correspondingly bent metal strip that exerts the desired spring effect between the head of the screw fastener and the surface of the circuit board 16. Other configurations of the spring 19 are also possible. The fastener 22 is screwed into the receptacle 11 of the heat-conducting element 14. This creates a corresponding preload on the spring 19. Furthermore, a fastener 31 is provided, which passes through the circuit board 16 and is screwed to the housing 18 via the receptacle 32 to secure the circuit board 16.

[0036] At least one additional spring 23 is provided between the additional fastening element 20 and the upper side or edge region of the heat-conducting element 14. This additional spring 23 exerts an additional force on the heat-conducting element 14 toward the seal 24 arranged in the corresponding receptacle 34, 36. This serves to secure the seal 24. The additional fastening element 20 is screwed into the receptacle 32 of the housing 18 or cooler 12 via the corresponding additional spring 23 or the corresponding spring region 23 through the edge region of the heat-conducting element 14. The additional fastening element 20 and the spring 23 form additional elastic fastening means 20, 23.

[0037] As can be seen from this view, the seal 24 is designed as a circumferential seal that is arranged around the opening 21 in the housing 18 or cooler 12. The seal 24 can be designed as an O-ring, for example. The seal 24 surrounds the section of the heat-conducting element 14 that projects further into the opening 21 of the housing 18 or cooler 12, such as the ribs 17. The upper region of the heat-conducting element 14, which is thermally connected to the electronic component 26 to be cooled, is surrounded by an edge region that may protrude further toward the printed circuit board 16. A receptacle 11 is arranged in this edge region, protruding through the printed circuit board 16 via a recess 33. This receptacle is for a corresponding additional fastening element 22 that projects through a corresponding spring section 20. The further protruding edge region of the heat-conducting element 14, in turn, serves to elastically support the heat-conducting element 14 relative to the housing 18 or cooler 12.

[0038] In particular, the heat-conducting element 14, which is elastically supported on both sides, in combination with the permanently elastic seal 24, can compensate for all mechanical tolerances in the control unit 10. This results in a sealed basic housing 18 with a movable heat sink or heat-conducting element 14, which can compensate for existing tolerances without loss of functionality.

[0039] Particularly preferably, the heat-conducting element 14 is screwed into the housing 18 in an elastically supported manner (radially or axially) using a permanently elastic seal 24, thereby forming a transition to the cooling circuit in the form of the cooling channels 13 of the cooler 12. Thus, the base housing or housing 18 is integrated into the existing cooling circuit using the movable heat-conducting element 14. The elastic support structure of the heat-conducting element 14 (elastic fastening means 22, 19; further elastic fastening means 20, 23) and, if necessary, reinforcement structures on the opposite side of the circuit board 16, minimizes play because the heat-conducting element 14 can be pressed against the electronic components 26 to be cooled by the springs 19, 23 of the support structure and the permanently elastic seal 24 using screw fasteners or fasteners 20, 22, as well as, if necessary, reinforcement structures. The permanently elastic seal 24 is in constant contact with the heat-conducting element 14 and the housing 18, thereby sealing the cooling circuit of the cooling channels 13 of the cooler 12.

[0040] Alternatively, two or more thermal connections can be provided in the form of a plurality of heat-conducting elements 14 and corresponding openings 21 in the housing 18 for connection to the common cooling channel 13. Each heat-conducting element 14 can be elastically fixed and sealed relative to the housing 18 with the cooling channel 13 using a permanently elastic seal 24. The cooling channel 13 can extend along an inlet or outlet and be delimited laterally by walls, so that the cooling medium is guided around the surface 17 to be cooled of the heat-conducting element 14. The cooling channel 13 can then be guided to any further heat-conducting elements 14 provided, so that the cooling medium also flows around the corresponding surface 17 of the further heat-conducting element 14 to dissipate heat from the further electronic components 26 to be cooled. For this purpose, a corresponding edge region surrounding the cooling channel 13 is formed in the housing 18 or in the housing portion forming the housing 18.

[0041] The electronic components 26 particularly include high-performance computer cores that perform particularly computationally intensive functions in the motor vehicle. These may include, for example, automated or semi-automated driving functions, infotainment, communication interfaces or gateway functions between different bus systems (Ethernet, CAN, LIN, etc.), certain safety applications for authorizing, for example, external access to the motor vehicle, or other operations in the motor vehicle that require particularly high computing power. The electronic components 26 are particularly preferably powerful processors, multi-core processors, or highly integrated circuits (SoCs, system-on-chips) characterized by high power consumption. The two electronic components 26 arranged on the respective circuit boards 16 are particularly preferably functionally redundant. If one electronic component 26 fails, the other electronic component 26 can take over the functions of the failed electronic component 26. However, the applications are not limited to this.

Claims

1. A device for cooling an electronic device (26) of a motor vehicle, said device comprising: at least one heat-conducting element (14) for cooling an electronic device (26) arranged on a circuit board (16), and at least one housing (18) having at least one opening (21) for connecting a heat sink, in particular a cooler (12) or a cooling channel (13), The heat-conducting element (14) is at least partially arranged in the opening (21) in order to connect the electronic device (26) to the cooler (12) in a heat-conducting manner, wherein elastic fastening means (22, 19) are provided, which connect the circuit board (16) and / or the electronic device (26) to the heat-conducting element (14), wherein the elastic fastening means (22, 19) causes the heat-conducting element (14) to exert a force toward the electronic device (26) to be cooled, wherein the heat-conducting element (14) is connected to the housing (18) via another elastic fastening means (20, 23), wherein the other elastic fastening means allows relative movement of the heat-conducting element (14) and the housing (18), wherein a permanently elastic seal (24) is arranged between the heat-conducting element (14) and the housing (18).

2. The device according to claim 1, characterized in that The permanently elastic seal (24) ensures that there is no direct contact between the heat-conducting element (14) and the housing (18).

3. The device according to any one of the preceding claims, characterized in that At least one receptacle (34, 36) for the seal (24) is provided in the housing (18) and / or the heat-conducting element (14).

4. The device according to any one of the preceding claims, characterized in that The seal (24) comprises at least one fixing region for fixing the seal (24) in the receiving portion (34, 36).

5. The device according to any one of the preceding claims, characterized in that The seal (24) has, in particular in a fixing region, at least one wing (25) for fixing the seal (24) in the receptacle (34, 36), and / or the seal (24) has at least one intermediate section (27) which is flexibly movable in order to seal the gap between the housing (18) and the heat-conducting element (14).

6. The device according to any one of the preceding claims, characterized in that The middle section (27) of the seal (24) is designed as a flexible hollow body and / or the seal (24) is made of a rubber-elastic material, for example, in particular EPDM (ethylene-propylene-diene (monomer) rubber).

7. The device according to any one of the preceding claims, characterized in that The sealing element (24), in particular designed as an O-ring, circumferentially surrounds the opening (21).

8. The device according to any one of the preceding claims, characterized in that The elastic fastening means (22, 19) and / or the further elastic fastening means (20, 23) comprise at least one spring, wherein the spring (19, 23) is constructed as a helical spring surrounding the respective fastening element (20, 22) and / or at least as a particularly corrugated leaf spring and / or as at least one leaf spring arranged particularly in a Z-shape between the two fastening elements (20, 22), and / or the spring (19) comprises at least one supporting surface (38) via which the spring (19, 23) exerts a force on the fastening element (20, 22) and / or the circuit board (16) and / or the electronic component (26) and / or the heat-conducting element (14).

9. The device according to any one of the preceding claims, characterized in that The housing (18) and / or the heat-conducting element (14) comprises at least one receiving portion (11, 32) for at least one of the elastic fastening means (20, 23; 22, 19) and / or a further fastening element (31), in particular at least one threaded fastening element, for connecting the circuit board (16) to the housing (18).

10. The device according to any one of the preceding claims, characterized in that The heat-conducting element (14) comprises an outer edge, which covers the opening (21) in the housing (18) and enables at least one fastener (20) for the further elastic fastening means (20, 23) or a receptacle (32) for the further fastener (20) for the further elastic fastening means (20, 23) on the housing (18) to pass through, and / or a receptacle (34) for the seal (24) is provided in the outer edge covering the opening (21) in the housing (18).

11. The device according to any one of the preceding claims, characterized in that A gap is formed between the housing (18) and the heat conducting element (14), and a transition portion between the gap and the recess (34, 36) is provided with at least one inclined surface (35), which cooperates with the seal (24) in a sealed state.

12. The device according to any one of the preceding claims, characterized in that The circuit board (16) comprises at least one recess (33) through which the receptacle (11) of the heat-conducting element (14) for the elastic fastening means (22, 19) is guided.

13. The device according to any one of the preceding claims, characterized in that The heat-conducting element (14) has at least one surface structure (17) that projects into the cooling channel (13) and is used for heat dissipation.

14. Method for cooling an electronic component (26) of a motor vehicle, comprising at least one heat-conducting element (14) for cooling an electronic component (26) arranged on a circuit board (16) and at least one housing (18), the housing having at least one opening (21) for connecting a heat sink, in particular a cooler (12) or a cooling channel (13), wherein: The heat-conducting element (14) is at least partially arranged in the opening (21) in order to connect the electronic component (26) to the cooler (12) in a heat-conducting manner, wherein elastic fastening means (22, 19) connect the circuit board (16) and / or the electronic component (26) to the heat-conducting element (14), wherein the elastic fastening means (22, 19) causes the heat-conducting element (14) to exert a force toward the electronic component (26) to be cooled, wherein the heat-conducting element (14) is connected to the housing (18) via another elastic fastening means (20, 23), wherein the other elastic fastening means allows relative movement of the heat-conducting element (14) and the housing (18), wherein a permanently elastic seal (24) is arranged between the heat-conducting element (14) and the housing (18).

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