Wearable device

Abstract

A PCB and a heat source are installed in an equipment shell of the wearable equipment, one side of the heat source is connected with the PCB, the other side of the heat source is connected with a first heat conduction layer, the first end of the first heat conduction layer is arranged in an inner cavity in a suspended mode, and the second end of the first heat conduction layer extends to the inner wall of the outer side of the equipment shell to make contact with the inner wall of the outer side of the equipment shell. A second heat-conducting layer is arranged on the outer inner wall of the second end, close to the first heat-conducting layer, of the equipment shell, and one end of the second heat-conducting layer extends along the outer inner wall to be connected with the second end of the first heat-conducting layer. According to the wearable device, the heat source can be transmitted to the far end of the device shell through the first heat conduction layer and the second heat conduction layer, the problem of uneven heat dissipation of the device is solved, local hot spots are eliminated through the second heat conduction layer, and the heat dissipation capacity and the comfort level of wearing temperature experience of a user are effectively improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and more particularly to a wearable device. Background Art

[0002] To address heat issues, some products rely on air cooling or split-unit designs, making them cumbersome and limiting their use cases. Improving the heat dissipation and thermal performance of smart glasses has become a pressing issue for researchers in this field.

[0003] With the continuous advancement of smart wearable devices, the functions integrated into these devices are increasing, and the demand for processing power is also increasing. This makes power consumption and heat dissipation key technologies for achieving a balance between high performance and convenience. Currently, the proportion of customer complaints about heat dissipation and power consumption of smart glasses is relatively high. In order to solve the heat dissipation problem, existing smart glasses mostly stick a graphite layer on the inner wall of the glasses away from the skin. The heating device conducts heat to the inner wall of the shell through the graphite layer for heat dissipation. Although this solution can achieve a lower device temperature, it will form a local hot spot at the location of contact with the shell. At the same time, the lower device temperature is quickly lost after the temperature difference is conducted in the narrow channel, resulting in a significant loss of heat dissipation capacity at the far end of the narrow channel. It is impossible to fully utilize the entire device surface for heat dissipation, resulting in uneven heat dissipation. Summary of the Invention

[0004] In view of this, an embodiment of the present invention provides a wearable device that can eliminate local hot spots, improve the problem of uneven heat dissipation of the device, and effectively improve the heat dissipation capacity and the comfort of the user's wearing temperature experience.

[0005] An embodiment of the present invention provides a wearable device, comprising:

[0006] a device housing having an interior cavity;

[0007] A PCB board is located in the inner cavity;

[0008] at least one heat source connected to the surface of the PCB;

[0009] a first heat-conducting layer, wherein a first end of the first heat-conducting layer is suspended in the inner cavity, a second end of the first heat-conducting layer extends to contact the outer inner wall of the device housing, and the heat source is in contact with one side of the first heat-conducting layer;

[0010] The second heat-conducting layer is arranged on the outer inner wall of the device housing close to the second end of the first heat-conducting layer, and one end of the second heat-conducting layer extends along the outer inner wall to connect with the second end of the first heat-conducting layer.

[0011] Optionally, the wearable device includes a third heat-conducting layer, which is arranged on the outer inner wall of the device housing and opposite to the PCB board.

[0012] Optionally, the wearable device includes a thermal insulation layer and a heat balancing layer, the thermal insulation layer is arranged on the inner wall of the device housing and is arranged opposite to the PCB board, and the heat balancing layer is arranged on the side of the thermal insulation layer close to the PCB board, and one end of the thermal insulation layer and one end of the heat balancing layer both extend horizontally to be arranged opposite to the second heat conductive layer.

[0013] Optionally, the wearable device includes two PCB boards and two heat sources, the two heat sources are respectively connected to both sides of the first heat conducting layer, and the two PCB boards are respectively connected to the side of the two heat sources away from the first heat conducting layer.

[0014] Optionally, there is a distance between the PCB board and the heat source and the inner wall of the device housing.

[0015] Optionally, the wearable device further includes a supporting rib, one end of the supporting rib is connected to the inner wall of the device housing, and the other end of the supporting rib extends to below the first heat-conducting layer.

[0016] Optionally, the first heat-conducting layer, the second heat-conducting layer, the third heat-conducting layer and the heat-dissipating layer are all made of graphite, the heat-insulating layer is made of aerogel, and the device housing is made of plastic.

[0017] Optionally, the heat source is fixed to the first heat-conducting layer via a heat-conducting adhesive layer, and the second heat-conducting layer and the third heat-conducting layer are fixed to the outer and inner walls of the device housing via an adhesive layer.

[0018] Optionally, the inner cavity includes a first cavity, a second cavity and a third cavity which are connected in sequence laterally, the widths of the first cavity, the second cavity and the third cavity gradually decrease, the PCB board and the heat source are located in the first cavity, the first end of the first heat-conducting layer is suspended in the first cavity, the second end of the first heat-conducting layer extends horizontally to the outer inner wall of the second cavity, the second heat-conducting layer is arranged on the outer inner wall of the third cavity, and one end of the second heat-conducting layer extends to the outer inner wall of the second cavity and is connected to the second end of the first heat-conducting layer, and the third heat-conducting layer is arranged on the outer inner wall of the first cavity and partially extends to the outer inner wall of the second cavity.

[0019] Optionally, the wearable device includes a control module, the control module is located at an end of the third cavity away from the first cavity, and the control module is connected to the first PCB board and the heat source.

[0020] A wearable device according to an embodiment of the present invention has a PCB and a heat source mounted within its housing. One side of the heat source is connected to the PCB, and the other side of the heat source is connected to a first thermally conductive layer. A first end of the first thermally conductive layer is suspended within an inner cavity, and a second end extends to contact the outer inner wall of the device housing. A second thermally conductive layer is disposed on the outer inner wall of the device housing, near the second end of the first thermally conductive layer. One end of the second thermally conductive layer extends along the outer inner wall to connect with the second end of the first thermally conductive layer. This wearable device improves uneven heat dissipation by allowing the heat source to be transferred to the distal end of the device housing through the first and second thermally conductive layers. Local hot spots are eliminated through the second conductive layer, effectively improving heat dissipation and enhancing the user's wearing comfort. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0022] Figure 1 is a schematic cross-sectional view of a wearable device according to a first embodiment of the present invention;

[0023] Figure 2 is a temperature transfer path diagram of a wearable device according to the first embodiment of the present invention;

[0024] Figure 3 is a schematic cross-sectional view of a wearable device according to a second embodiment of the present invention;

[0025] Figure 4 2 is another cross-sectional schematic diagram of the wearable device according to the second embodiment of the present application.

[0026] Reference numerals:

[0027] 1-Device housing; 11-First outer panel; 12-Second outer panel; 13-Third outer panel; 14-Inner panel; 15-End panel; 2-PCB board; 4-Heat source; 6-First thermal conductive layer; 7-Second thermal conductive layer; 8-Third thermal conductive layer; 9-Thermal insulation layer; 10-Heat-distributing layer; 20-Support ribs; 100-Inner cavity; 101-First cavity; 102-Second cavity; 103-Third cavity. DETAILED DESCRIPTION

[0028] The present application is described below based on the following embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without the description of these details. To avoid obscuring the essence of the present application, well-known methods, processes, procedures, components, and circuits are not described in detail.

[0029] Furthermore, persons of ordinary skill in the art will appreciate that the figures provided herein are for illustration purposes only and are not necessarily drawn to scale.

[0030] Unless the context clearly requires otherwise, words like “include”, “comprising” and the like throughout this application should be interpreted as including rather than exclusive or exhaustive; that is, as meaning “including but not limited to”.

[0031] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood to indicate or imply relative importance. In addition, in the description of this application, unless otherwise specified, "plurality" means two or more.

[0032] The embodiment of the present application provides a wearable device, which specifically improves the heat dissipation architecture inside the wearable device. It uses stacked heat sources and non-direct contact heat conduction to increase the thermal resistance between the heat source and the shell, and can appropriately increase the temperature of the heat source to create a large temperature difference, thereby driving the heat to be transmitted over a longer distance on the heat conductive layer (i.e., on high-performance graphite). It can fully utilize the outer surface of the entire device for heat dissipation, effectively improve the surface heat dissipation capacity, reduce the temperature of local hot spots, and effectively improve the heat dissipation capacity and user experience of the wearable device. Among them, the wearable device can be smart glasses, AR devices, VR devices, etc. When the wearable device is smart glasses, the non-direct contact heat conduction method increases the temperature of the heat source, drives the heat to be conducted in a narrow channel through a large temperature difference, increases the average surface temperature of the smart glasses, and effectively improves the heat dissipation capacity of the smart glasses.

[0033] Heat sources refer to the functional components within a wearable device that generate heat during operation. The outer inner wall of the device's housing is the side away from the skin when the device is worn (i.e., the heat dissipation side), while the inner inner wall of the device's housing is the side closest to the skin when the device is worn.

[0034] Figure 1 This is a cross-sectional diagram of the wearable device according to the first embodiment of the present application. Figure 1As shown, the wearable device includes a device housing 1, two PCB boards 2, two heat sources 4, a first heat-conducting layer 6, and a second heat-conducting layer 7. The device housing 1 has an inner cavity 100. Two PCB boards 2 are disposed within the inner cavity 100, with one PCB board 2 stacked on the other PCB board 2, i.e., the two PCB boards 2 are stacked. The two heat sources 4 are arranged relative to each other between the two PCB boards 2, and the two heat sources 4 are respectively connected to the oppositely disposed surfaces of the two PCB boards 2. The first heat-conducting layer 6 is disposed between the two heat sources 4 and contacts each of the two heat sources 4. The first end of the first heat-conducting layer 6 is suspended (i.e., it maintains a distance from and does not contact the outer inner wall of the device housing 1), and the second end of the first heat-conducting layer 6 extends to contact the outer inner wall of the device housing 1. The second heat-conducting layer 7 is disposed on the outer inner wall of the device housing 1 near the second end of the first heat-conducting layer 6, and one end of the second heat-conducting layer 7 extends along the outer inner wall to connect to the second end of the first heat-conducting layer 6. Since the two heat sources 4 are in direct contact with the first heat conducting layer 6 , the heat generated by the two heat sources 4 can be directly transferred to the first heat conducting layer 6 , and then the first heat conducting layer 6 transfers the heat to the second heat conducting layer 7 to reach the device housing 1 for heat dissipation.

[0035] Among them, there is a distance between the two PCB boards 2 and the two heat sources 4 and the inner wall of the device housing 1 (i.e., the side wall of the inner cavity 100), and they are separated by air, which makes the heat source 4 and the device housing 1 non-direct contact, and increases the thermal resistance between the heat source 4 and the device housing 1. The centralized stacking of the two heat sources 4 can appropriately increase the temperature of the heat source, thereby increasing the temperature of the first heat-conducting layer 6 at the opposite position (i.e., the temperature of the P1 end). After the temperature of the P1 end is increased, it is transferred to the second heat-conducting layer 7 through the first heat-conducting layer 6, and then transferred to the device housing 1 and to the end away from the heat source 4. That is, as Figure 2 As shown, the temperature at the P1 end passes through point P2 and is transferred to the far end point P3. The overall temperatures of P1, P2, and P3 are all raised, which improves the far-end heat dissipation capacity, allowing heat to be dissipated from different positions of the device housing 1, significantly enhancing the heat dissipation capacity of the device housing 1.

[0036] When installing the wearable device, the two heat sources 4 are first fixedly connected to the surfaces of the two PCB boards 2 respectively; a first heat-conducting layer 6 is set in the inner cavity 100, the first end of the first heat-conducting layer 6 is suspended, and the second end of the first heat-conducting layer 6 extends to contact the outer inner wall of the device housing 1, and a second heat-conducting layer 7 is set on the outer inner wall of the device housing 1 near the second end of the first heat-conducting layer 6, so that one end of the second heat-conducting layer 7 is connected to the second end of the first heat-conducting layer 6, and the other end extends to the distal end, and the two heat sources 4 are respectively connected to the upper and lower side surfaces of the first heat-conducting layer 6, so that the two are arranged opposite to each other and the two PCB boards 2 are arranged in an overlapping manner.

[0037] The wearable device also includes a third thermally conductive layer 8, which is disposed on the outer inner wall of the device housing 1 and opposite the PCB board 2. Heat generated by the heat source 4 can also be partially dissipated to the outside of the device housing 1 through the third thermally conductive layer 8, thereby eliminating local hot spots, increasing the heat dissipation area, and further improving heat dissipation efficiency. Optionally, the third thermally conductive layer 8 can extend along the outer inner wall to connect to the second thermally conductive layer 7, or it can be spaced apart from the second thermally conductive layer 7. The arrangement of three thermally conductive layers allows the heat from the heat source 4 to be fully dissipated across the entire surface of the device housing 1, improving heat dissipation efficiency.

[0038] In this embodiment, the first, second, and third thermally conductive layers 6, 7, and 8 are all made of graphite, which has excellent thermal conductivity. This allows heat to be rapidly transferred along a plane to the device housing, achieving rapid heat dissipation. Alternatively, the first, second, and third thermally conductive layers 6, 7, and 8 can be made of other thermally conductive interface materials.

[0039] In this embodiment, the two heat sources 4 are fixed to both sides of the first heat-conducting layer 6 via thermally conductive adhesive layers. The thermally conductive adhesive layers have thermal conductivity, which not only securely connects the heat source to the heat-conducting layer but also transfers heat from the heat source to the heat-conducting layer. The thermally conductive adhesive layers can be made of thermally conductive gel or other interface materials.

[0040] The second heat-conducting layer 7 and the third heat-conducting layer 8 can be fixed to the outer and inner walls of the device housing 1 respectively by adhesive layers. The adhesive layer can be glue, double-sided tape, etc., which can effectively fix the heat-conducting layer to the device housing. In addition, the adhesive layer can be replaced with a thermally conductive adhesive layer.

[0041] In this embodiment, the wearable device further includes a heat-insulating layer 9 and a heat-dissipating layer 10. The heat-insulating layer 9 is disposed on the inner wall of the device housing 1, opposite the PCB board 2, and the heat-dissipating layer 10 is disposed on the side of the heat-insulating layer 9 closer to the PCB board 2. The heat-insulating layer 9 and the heat-dissipating layer 10 can provide insulation and heat dissipation, prevent burns to the skin, and improve the user's wearing temperature comfort.

[0042] In this embodiment, the thermal insulation layer 9 and the heat-dissipating layer 10 are arranged opposite to the PCB board, and one end of both extends along the inner wall to be arranged opposite to the second heat-conducting layer 7, so that the entire side of the wearable device close to the skin can play a role in heat insulation and heat distribution, prevent skin burns, and improve the user's wearing temperature comfort.

[0043] Optionally, the entire inner wall of the device housing 1 is coated with a heat insulating layer 9 and a heat balancing layer 10 to further improve the wearing temperature comfort of the user.

[0044] In this embodiment, the heat-spreading layer 10 is made of graphite, the insulation layer 9 is made of aerogel, and the device housing 1 is made of plastic. Alternatively, the heat-spreading layer 10 can be made of other materials with both heat-spreading and thermal conductivity, and the insulation layer 9 can be made of other materials with thermal insulation properties. The plastic material used in the device housing 1 prevents harm from electrical conduction. The thermal conductivity of plastic is approximately 0.2 W / mK, while the planar thermal conductivity of graphite is 1560 W / mK.

[0045] In this embodiment, the second end of the first heat-conducting layer 6 extends to the outer inner wall and connects to the second heat-conducting layer 7. This allows for suspension while also supporting the PCB board within the inner cavity 100. The extended area of the second heat-conducting layer 7 and the third heat-conducting layer 8 on the housing serves as the primary heat dissipation surface of the outer housing.

[0046] In this embodiment, the wearable device further includes a support rib 20, one end of the support rib 20 is connected to the inner wall of the device housing 1, and the other end of the support rib 20 extends to the bottom of the first heat conducting layer 6, as shown in FIG. Figure 2 The support ribs 20 support the PCB board 2 by supporting the first heat conducting layer 6 , so that the PCB board 2 and the heat source 4 are suspended in the inner cavity 100 .

[0047] In this embodiment, the wearable device includes a control module, which is located at one end of the inner cavity 100 away from the two heat sources. The control module is connected to the PCB board 2 and the heat source 4, thereby realizing functional control of the two heat sources.

[0048] When the wearable device is a pair of smart glasses, the device housing 1 can be the temple of the smart glasses. The temple generally has an inner cavity that is wide at the front and narrow at the back. The PCB board 2 and the heat source 4 are stacked and arranged at the wider position of the temple inner cavity, and the control module is located at the rear end of the temple (i.e., the narrower position).

[0049] In one embodiment, the temple structure, i.e., the device housing 1, includes a first outer panel 11, a second outer panel 12, a third outer panel 13, an inner panel 14, and an end panel 15. The first outer panel 11, the second outer panel 12, and the third outer panel 13 are sequentially connected and arranged opposite to the inner panel 14. The end panel 15 connects the first outer panel 11 and the inner panel 14. The first outer panel 11, the third outer panel 13, and the inner panel 14 are arranged in parallel. The distance between the first outer panel 11 and the inner panel 14 is greater than the distance between the third outer panel 13 and the inner panel 14. That is, the second outer panel 12 is an inclined outer panel. The above structure enables the inner cavity 100 to form a first cavity 101, a second cavity 102, and a third cavity 103 that are sequentially connected laterally, and the widths of the first cavity 101, the second cavity 102, and the third cavity 103 gradually decrease. As Figure 2As shown, the inner cavity 100 is divided by dotted lines, the first cavity 101 is a rectangular cavity close to the left, the third cavity 103 is an elongated rectangular cavity close to the right, and the second cavity 102 is a trapezoid.

[0050] The PCB board 2 and heat source 4 are stacked within the first cavity 101, suspended with gaps between the side panels to increase the thermal resistance between the heat source 4 and the device housing 1. A first end of a first thermally conductive layer 6 is suspended within the first cavity 101, with a second end extending horizontally to the outer inner wall of the second cavity 102 (i.e., the inner side of the second outer panel 12). A second thermally conductive layer 7 is disposed on the outer inner wall of the third cavity 103 (i.e., the inner side of the third outer panel 13), with one end of the second thermally conductive layer 7 extending to the outer inner wall of the second cavity 102 (i.e., the inner side of the second outer panel 12) and connected to the second end of the first thermally conductive layer 6. A third thermally conductive layer 8 is disposed on the outer inner wall of the first cavity 101 (i.e., the inner side of the first outer panel 11) and partially extends to the outer inner wall of the second cavity 102 (i.e., the inner side of the second outer panel 12). A heat-dissipating layer 10 and a thermally insulating layer 9 are disposed on the inner side of the inner panel 14. The control module is located at one end of the third cavity 103 away from the first cavity 101 , and is connected to the PCB board 2 and the heat source 4 .

[0051] In this embodiment, the wearable device isolates the heat source from the shell, increases the thermal resistance between the heat source and the shell, and through the concentrated stacking design of the heat source, appropriately increases the temperature of the heat source, and conducts more heat from the heat source concentration point, thereby increasing the temperature of the hot end P1 of the heat conduction layer. After the hot end temperature is increased, it is transferred to the far end P3 through point P2, reducing the temperature loss in the heat conduction path and reducing the temperature difference between the hot and cold ends (i.e., the front and rear ends of the temples), which is beneficial to increasing the overall temperature of the device shell and significantly enhancing the heat dissipation capacity of the temple shell.

[0052] The above-mentioned wearable device was simulated. Under a heat load of 0.9W, the remote temperature of the wearable device increased by 3.2°C compared with the direct contact shell heat dissipation. The average temperature rise of the graphite extension surface shell increased by about 4°C, the average heat dissipation capacity increased by 15%, and the temperature rise of the surface at the tail of the temple decreased by 2°C.

[0053] Figure 3 and Figure 4This is a cross-sectional schematic diagram of the wearable device of the second embodiment of the present application. The only difference between the wearable device of the second embodiment and the wearable device of the first embodiment is the number of heat sources 4 and PCB boards 2. In the second embodiment, the wearable device includes a heat source 4 and a PCB board 2. The heat source 4 is arranged on the surface of the PCB board 2. The heat source 4 and the PCB board 2 are arranged as a whole above or below the first heat-conducting layer 6. The heat source 4 is in contact with and connected to the first heat-conducting layer 6, and the PCB board 2 is located on the side of the heat source 4 away from the first heat-conducting layer 6. The heat source 4 and the PCB board 2 maintain a distance from the device housing 1 through the arrangement of the first heat-conducting layer 6. The non-direct contact arrangement allows the heat of the heat source 4 to be transferred to the second heat-conducting layer 7 through the first heat-conducting layer 6, so that the heat can be dissipated simultaneously through different positions of the device housing 1, thereby improving the heat dissipation efficiency.

[0054] In other embodiments, there may be more than two heat sources 4, and one PCB board 2 may be provided. If the internal space of the device housing 1 permits, all heat sources 4 may be provided on the same PCB board 2 at the same time, and the other side surfaces of all heat sources 4 may be in contact with the first heat-conducting layer 6, so that the heat of all heat sources 4 may be transferred to the second heat-conducting layer 7 through the first heat-conducting layer 6, thereby allowing the heat to be dissipated simultaneously through different positions of the device housing 1, thereby improving the heat dissipation efficiency.

[0055] In other embodiments, there may be three or more heat sources 4, two PCB boards 2 may be provided, one or more heat sources 4 may be provided on each PCB board 2, and the two PCB boards 2 are relatively arranged on both sides of the first heat-conducting layer 6, and all heat sources 4 are located between the PCB board 2 and the first heat-conducting layer 6, so that the heat of all heat sources 4 can be transferred to the second heat-conducting layer 7 through the first heat-conducting layer 6, so that the heat can be dissipated simultaneously through different positions of the device housing 1, thereby improving the heat dissipation efficiency.

[0056] In another embodiment, if the internal space of the device housing 1 allows, two or more first heat-conducting layers 6 can be provided. Multiple first heat-conducting layers 6 are arranged in parallel, with their first ends suspended in the air and their second ends extending horizontally to contact the outer inner wall of the device housing 1. One end of each second heat-conducting layer 7 is in contact with the second ends of the multiple first heat-conducting layers 6. Each first heat-conducting layer 6 is provided with at least one heat source 4. Heat from all heat sources 4 is transferred to the second heat-conducting layer 7 through the corresponding first heat-conducting layer 6. This allows heat to be dissipated simultaneously from different locations of the device housing 1, improving heat dissipation efficiency.

[0057] This embodiment of the wearable device utilizes a non-contact stacked thermal design to avoid localized hotspots. Non-contact heat conduction increases the thermal resistance between the heat source and the housing, appropriately raising the heat source temperature. This creates a large temperature differential, driving heat transfer over a longer distance through the high-performance graphite. This fully utilizes the entire device's external surface for heat dissipation, effectively increasing surface heat dissipation by over 15% and reducing localized hotspot temperatures by over 2°C, significantly improving overall device heat dissipation and user experience.

[0058] The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application. Persons skilled in the art will readily appreciate that various modifications and variations are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present application are intended to be within the scope of protection of the present application.

Claims

1. A wearable device, characterized in that: The wearable device includes: A device housing (1) having an inner cavity (100); At least one PCB board (2) is located in the inner cavity (100); at least one heat source (4), the heat source (4) being connected to the surface of the PCB board (2); A first heat-conducting layer (6), a first end of which is suspended in the inner cavity (100), a second end of which extends to contact the outer inner wall of the device housing (1), and the heat source (4) is in contact with one side of the first heat-conducting layer (6); A second heat-conducting layer (7) is arranged on the outer inner wall of the device housing (1) close to the second end of the first heat-conducting layer (6), and one end of the second heat-conducting layer (7) extends along the outer inner wall to connect with the second end of the first heat-conducting layer (6).

2. The wearable device according to claim 1, wherein: The wearable device comprises a third heat-conducting layer (8), which is arranged on the outer inner wall of the device housing (1) and is arranged opposite to the PCB board (2).

3. The wearable device according to claim 2, wherein: The wearable device comprises a heat insulating layer (9) and a heat balancing layer (10); the heat insulating layer (9) is arranged on the inner wall of the device housing (1) and is arranged opposite to the PCB board (2); the heat balancing layer (10) is arranged on a side of the heat insulating layer (9) close to the PCB board (2); one end of the heat insulating layer (9) and one end of the heat balancing layer (10) both extend horizontally to be arranged opposite to the second heat conducting layer (7).

4. The wearable device according to any one of claims 1 to 3, characterized in that: The wearable device comprises two PCB boards (2) and two heat sources (4), the two heat sources (4) are respectively connected to both sides of the first heat-conducting layer (6), and the two PCB boards (2) are respectively connected to the side of the two heat sources (4) away from the first heat-conducting layer (6).

5. The wearable device according to claim 4, wherein: There is a distance between the PCB board (2) and the heat source (4) and the inner wall of the device housing (1).

6. The wearable device according to claim 4, wherein: The wearable device further comprises a supporting rib (20), one end of the supporting rib (20) being connected to the inner wall of the device housing (1), and the other end of the supporting rib (20) extending to below the first heat-conducting layer (6).

7. The wearable device according to claim 3, wherein: The materials of the first heat-conducting layer (6), the second heat-conducting layer (7), the third heat-conducting layer (8) and the heat-dissipating layer (10) are all graphite, the material of the heat-insulating layer (9) is aerogel, and the material of the device housing (1) is plastic material.

8. The wearable device according to claim 2, wherein: The heat source (4) is fixed to the first heat-conducting layer (6) via a heat-conducting adhesive layer, and the second heat-conducting layer (7) and the third heat-conducting layer (8) are respectively fixed to the outer and inner walls of the device housing (1) via adhesive layers.

9. The wearable device according to claim 8, wherein: The inner cavity (100) comprises a first cavity (101), a second cavity (102) and a third cavity (103) which are connected in sequence laterally, the widths of the first cavity (101), the second cavity (102) and the third cavity (103) gradually decrease, the PCB board (2) and the heat source (4) are located in the first cavity (101), the first end of the first heat-conducting layer (6) is suspended in the first cavity (101), the second end of the first heat-conducting layer (6) extends horizontally to the outer inner wall of the second cavity (102), the second heat-conducting layer (7) is arranged on the outer inner wall of the third cavity (103), and one end of the second heat-conducting layer (7) extends to the outer inner wall of the second cavity (102) and is connected to the second end of the first heat-conducting layer (6), and the third heat-conducting layer (8) is arranged on the outer inner wall of the first cavity (101) and partially extends to the outer inner wall of the second cavity (102).

10. The wearable device according to claim 9, wherein: The wearable device comprises a control module, the control module is located at one end of the third cavity (103) away from the first cavity (101), and the control module is connected to the PCB board (2) and the heat source (4).

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