Method for manufacturing polishing pad

Abstract

The invention provides a method for manufacturing a polishing pad, which can easily peel off resin at low cost when a concave-convex pattern is transferred to the resin by using a gravure plate. Disclosed is a method for manufacturing a polishing pad having a polishing layer obtained by curing a resin, the method comprising: a step for preparing a plastic intaglio plate on which an uneven pattern is formed by vacuum molding or injection molding; a step of pouring the resin raw material into the plastic gravure; a step for hardening the resin; and a step for obtaining the polishing layer by peeling the hardened resin from the plastic gravure plate.

Description

Technical Field

[0001] The present invention relates to a polishing pad. Specifically, the polishing pad of the present invention is used for polishing or grinding optical materials, semiconductor devices, glass substrates for hard disks, and the like, and is particularly suitable for polishing or grinding sapphire or SiC, and the like. Background Art

[0002] In the polishing and grinding of optical materials, semiconductor devices, glass substrates for hard disks, or sapphire or SiC, a grinding process using a grinding pad is performed. Various grinding pads are known, including those using non-woven fabrics, those using foamed or non-foamed polyurethane, those having fixed abrasive grains, and those using a resin layer having a concave-convex pattern as a grinding surface.

[0003] Among these, polishing pads using a resin layer with a concavo-convex pattern as the polishing surface have the following advantages: the grooves formed in the concavo-convex pattern affect the fluidity of the slurry, resulting in uniform polishing of the object to be polished. Examples of methods for manufacturing such polishing pads include methods of forming grooves by cutting the surface of a flat base material, methods of forming a concavo-convex pattern on a substrate using screen printing, and methods of preparing a mold having a concavo-convex pattern and using the prepared mold for molding.

[0004] For example, Patent Document 1 discloses a polishing pad having a concave-convex pattern formed by transferring from a plate having a concave-convex pattern containing a photosensitive resin, and Patent Document 2 discloses a polishing pad having a concave-convex pattern formed by using a forming mold containing silicone rubber or the like to which a plate having a concave-convex pattern containing a photosensitive resin is transferred.

[0005] However, methods such as those described in Patent Documents 1 and 2 that use a gravure plate to transfer a concave-convex pattern to a resin present problems such as difficulty peeling the cured resin from the plate, causing the convex portions of the resin to fall off. Furthermore, the photosensitive resins and silicone rubbers used in gravure plates are expensive and have difficulty maintaining durability after repeated use, making them unsuitable for mass production.

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Laid-Open No. 2019-178248

[0009] Patent Document 2: Japanese Patent Application Laid-Open No. 2019-178258 Summary of the Invention

[0010] Problems to be solved by the invention

[0011] The present invention has been made in view of the above-mentioned problems, and provides a method for producing a polishing pad that can easily peel off the resin at low cost when transferring a concave-convex pattern to the resin using a gravure plate.

[0012] Technical means to solve the problem

[0013] The present inventors have conducted research and discovered a method for manufacturing a polishing pad that can be manufactured inexpensively using a general-purpose plastic as a disposable gravure plate. Furthermore, by using a polyolefin or polystyrene having low surface free energy, the polishing pad can be easily separated from the resin forming the polishing layer. The present invention encompasses the following aspects.

[0014] [1] A method for manufacturing a polishing pad having a polishing layer formed by curing a resin,

[0015] The manufacturing method of the polishing pad has the following steps:

[0016] A process for preparing a plastic gravure plate having a concave-convex pattern formed by vacuum forming or injection molding;

[0017] The process of pouring the resin raw material into the plastic gravure;

[0018] a step of hardening the resin;

[0019] and peeling the cured resin from the plastic gravure to obtain the polishing layer.

[0020] [2] The method for manufacturing a polishing pad according to [1], wherein, in the step of curing the resin, the temperature of the plastic gravure is 130° C. or lower.

[0021] [3] The method for manufacturing a polishing pad according to [1], wherein the plastic gravure plate comprises a resin selected from polyethylene, polypropylene, polystyrene, and polyvinyl chloride.

[0022] [4] The method for manufacturing a polishing pad according to [1] further comprises a step of applying a release agent to the plastic gravure, wherein the release agent is a silicone release agent or a fluorine release agent.

[0023] [5] The method for manufacturing a polishing pad according to claim 1, wherein the resin is a thermosetting resin composition.

[0024] [6] The method for producing a polishing pad according to [1], wherein the resin is an ultraviolet (UV) curable resin composition.

[0025] [7] A method for manufacturing a polishing pad having a polishing layer formed by curing a resin and containing no abrasive grains,

[0026] The manufacturing method of the polishing pad has the following steps:

[0027] A process for preparing a plastic gravure plate having a concave-convex pattern formed by vacuum forming or injection molding;

[0028] The process of pouring the resin raw material without abrasive particles into the plastic gravure;

[0029] a step of hardening the resin;

[0030] and peeling the cured resin from the plastic gravure to obtain the polishing layer.

[0031] [8] A polishing method for polishing an object to be polished using a polishing pad obtained by the polishing pad manufacturing method according to [7], wherein:

[0032] Grinding is performed by free abrasive grinding.

[0033] [9] A method for manufacturing a polishing pad having a polishing layer formed by curing a resin and containing abrasive grains,

[0034] The manufacturing method of the polishing pad has the following steps:

[0035] A process for preparing a plastic gravure plate having a concave-convex pattern formed by vacuum forming or injection molding;

[0036] The process of pouring the resin raw material containing abrasive particles into the plastic gravure;

[0037] a step of hardening the resin;

[0038] and peeling the cured resin from the plastic gravure to obtain the polishing layer.

[0039]

[10] A polishing method for polishing an object to be polished using a polishing pad obtained by the polishing pad manufacturing method according to [9], wherein:

[0040] The grinding is performed by fixed abrasive grinding.

[0041] Effects of the Invention

[0042] By using general-purpose plastic as a disposable intaglio plate, it can be manufactured at low cost. Furthermore, by using a polyolefin or polystyrene having low surface free energy, it can be easily peeled off from the resin forming the polishing layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] [ Figure 1 ] Figure 1 This is a process diagram of a method for producing the polishing layer 11 of the polishing pad of the present invention.

[0044] [ Figure 2 ] Figure 2 This is a cross-sectional view of the polishing layer 11 of the polishing pad of the present invention in another embodiment. DETAILED DESCRIPTION

[0045] Hereinafter, an embodiment of the present invention (hereinafter referred to as “this embodiment”) will be described in detail, but the present invention is not limited thereto and various modifications can be made without departing from the spirit and scope of the present invention.

[0046] <<Manufacturing method of polishing pad>>

[0047] use Figure 1 A first embodiment of the method for producing a polishing pad of the present invention will be described using a flowchart.

[0048] The first embodiment is as follows: The polishing pad includes a polishing layer, and the polishing layer includes a polishing surface for polishing an object to be polished.

[0049] A method for manufacturing a polishing pad having a polishing layer 11 formed by curing a resin 50 is provided. The method comprises the following steps:

[0050] A process of preparing a plastic intaglio plate 72 having a concave-convex pattern formed by vacuum forming or injection molding (Step 1).

[0051] The process of applying the release agent 8 to the plastic gravure 72 (step 2) is as follows:

[0052] The process of pouring the resin raw material 50 into the plastic gravure 72 (step 3),

[0053] The step of hardening the resin 50 (step 4)

[0054] A step of peeling the cured resin 50 from the plastic intaglio plate 72 to obtain the polishing layer 11 (step 5).

[0055] In addition, in the present specification, for convenience, the resin raw material before being poured into the mold (ie, the resin before curing) and the resin after curing are both represented by the symbol 50.

[0056] (Step 1)

[0057] First, prepare a mold for forming the concavo-convex pattern. The mold is not particularly limited, as long as it can form a concavo-convex pattern on a plastic material through vacuum forming or injection molding. Examples include wooden molds, resin molds, and metal molds. The plastic intaglio plate 72 used to form the concavo-convex pattern does not require very high durability, so a reproducible mold is preferred.

[0058] Next, prepare the material of plastic gravure 72, i.e. plastic material. As long as the plastic material is cheap and has low surface free energy, it is not particularly limited, and polyolefin resins (polyethylene, polypropylene), or polystyrene, polyvinyl chloride, etc. can be cited. The surface free energy of the material used in gravure 72 of the present invention is preferably below 50mN / m, more preferably below 40mN / m. If the surface free energy is below 50mN / m, it is easy to peel off the grinding layer 11 from the gravure 72, so the convex portion 51 during the peeling of the grinding layer 11 can be suppressed to fall off and be damaged. In addition, the surface free energy can be calculated by measuring the contact angle with water and diiodomethane using a contact angle meter. As the material of gravure 72, due to easy availability, cheapness and low surface free energy, it is preferably polypropylene (surface free energy: 29.8mN / m) or polyethylene (surface free energy: 35.6mN / m). As polypropylene, trade names "Elon" manufactured by OJK and "Hi-pearl" manufactured by Sanvic can be used, and as polyethylene, trade name "EL-N-AN" manufactured by Resonac can be used.

[0059] The shape of the plastic material is not particularly limited as long as it can produce a plastic intaglio plate 72 having a concavo-convex pattern formed thereon by vacuum forming or injection molding, but is preferably in the form of a film or sheet for ease of forming.

[0060] The thickness of the film or sheet plastic material is not particularly limited as long as it is a thickness that can produce a plastic intaglio plate 72 having a concavo-convex pattern formed thereon by vacuum forming or injection molding, but is preferably 0.1 mm to 5 mm from the viewpoint of maintaining strength as a plate and facilitating molding.

[0061] In vacuum forming, a film or sheet of plastic material is heated and softened, then placed in a mold with a concave-convex pattern. The space between the plastic material and the mold is vacuumed, resulting in close contact between the plastic material and the mold. After forming, the material is cooled and separated from the mold to obtain a plastic intaglio plate 72 with a concave-convex pattern. Vacuum forming conditions vary depending on the plastic material, its thickness, and other factors.

[0062] In the case of injection molding, a heated and molten plastic material is injected into a mold formed with a concave-convex pattern, cooled and solidified, and then removed from the mold to obtain a plastic intaglio plate 72 formed with a concave-convex pattern. The injection molding conditions vary depending on the plastic material, the thickness of the plastic intaglio plate 72, and other factors.

[0063] The strength of the plastic gravure 72 having a concave-convex pattern formed by vacuum forming or injection molding is not particularly limited as long as the polishing layer 11 having a concave-convex pattern can be obtained by accurately transferring the concave-convex pattern from the plastic gravure 72 in step 4. However, in order to prevent cracking or breaking due to impact, the impact strength is preferably 0.5 J / m or more at 0°C in a DuPont impact test.

[0064] (Step 2)

[0065] Next, a release agent 8 is applied to the obtained plastic gravure 72. The release agent 8 facilitates the release of the cured resin from the plastic gravure. The type of release agent 8 is not particularly limited, and examples thereof include silicone release agents and fluorine release agents, with fluorine release agents being preferred.

[0066] The method for applying the release agent 8 is not particularly limited as long as the cured resin can be released from the plastic gravure. Examples thereof include a spray method and an electrostatic coating method, and a spray method is preferred.

[0067] (Step 3)

[0068] The resin raw material 50 is poured into the plastic gravure 72 coated with the release agent 8 .

[0069] Here, in the present invention, the resin raw material 50 may or may not contain abrasive grains.

[0070] The polishing pad 1 having a polishing layer containing abrasive grains is a polishing pad for fixed abrasive polishing. The resin raw material 50 is preferably prepared by mixing abrasive grains into liquid resin before pouring the resin raw material 50 into the plastic intaglio plate 72 .

[0071] The amount of abrasive grains relative to the resin is not particularly limited and can be the same as above. For example, the abrasive grains can be generally contained in a ratio of 1 mass % to 20 mass %, preferably 5 mass % to 10 mass %, relative to the entire resin raw material 50.

[0072] The type of abrasive grains is not particularly limited, and examples thereof include diamond, cerium oxide, silicon carbide, silicon oxide, zirconium oxide, iron oxide, manganese oxide, magnesium oxide, zinc oxide, titanium oxide, aluminum oxide, zirconium silicate, boron nitride, silicon nitride, barium sulfate, and calcium carbonate. The abrasive grains preferably have a particle size of 1 μm to 100 μm.

[0073] On the other hand, the polishing pad 1 having a polishing layer containing no abrasive grains is a polishing pad for use in a free abrasive polishing method, and it is preferable that the resin raw material 50 be prepared without mixing the abrasive grains into the liquid resin before pouring the resin raw material 50 onto the plastic intaglio plate 72. Furthermore, even in the case of a polishing pad for use in a free abrasive polishing method, the polishing layer used in the polishing pad does not prevent the incorporation of additives other than abrasive grains, but it is preferable that additives that affect polishing are not added.

[0074] As a method for pouring the resin raw material 50 into the plastic gravure 72, there is no particular limitation as long as the resin raw material 50 is filled (cast) into the concave portion of the plastic gravure 72. For example, there can be a gravity injection molding method in which the resin raw material is poured into the concave portion by its own weight at room temperature and pressure, or a vacuum injection molding method in which the plastic gravure 72 and the resin 50 are placed in a vacuum container, decompressed, and poured into the concave portion at atmospheric pressure.

[0075] The resin 50 is not particularly limited as long as a polishing pad using the resin layer 11 having a concavo-convex pattern as a polishing surface can be obtained, but a curable resin composition is preferable.

[0076] The curable resin composition is not particularly limited, and examples thereof include thermosetting resins; UV curable resins; photocurable resin compositions containing a photopolymerization initiator and a polymerizable compound; thermosetting resin compositions containing a thermal polymerization initiator and a polymerizable compound; and curable resin compositions containing a two-liquid mixing type curable resin. Furthermore, the curable resin composition may contain a crosslinking agent having two or more polymerizable functional groups, as needed.

[0077] The thermosetting resin is not particularly limited, and examples thereof include phenol resins, epoxy resins, acrylic resins, urethane resins, and formaldehyde resins.

[0078] There is no particular limitation on the UV curable resin, but a prepolymer having a number average molecular weight of about 1,000 to 10,000 is preferred. Examples of the material include isocyanurate resins, acrylic (methacrylic) ester resins or their urethane modified resins, and thiol resins. Reactive diluents or organic solvents may be used as appropriate depending on the intended use.

[0079] Examples of photopolymerization initiators include benzophenone compounds, acetophenone compounds, and thioxanthone compounds. Examples of thermal polymerization initiators include azo compounds such as 2,2'-azobisbutyronitrile, and peroxides such as methyl ethyl ketone peroxide and benzoyl peroxide (BPO).

[0080] Specific examples of the resin include unsaturated carboxylic acids having a polymerizable unsaturated group, such as (meth)acrylic acid, itaconic acid, crotonic acid, isocrotonic acid, and maleic acid; unsaturated carboxylic acid esters having a polymerizable unsaturated group, such as (meth)acrylate, epoxy (meth)acrylate (vinyl ester resin), urethane (meth)acrylate, and polyester (meth)acrylate; polyesters having an unsaturated group; polyethers having a polymerizable unsaturated group; polyamides having a polymerizable unsaturated group; urethanes having a polymerizable unsaturated group; aromatic compounds having a polymerizable unsaturated group, such as styrene, and vinyl ester resins.

[0081] The two-liquid mixing type curing resin is not particularly limited. For example, prepolymers having different physical properties may be used, and examples thereof include epoxy resins, unsaturated polyester resins, and polyamide resins.

[0082] Among them, those that cure at room temperature are preferred from the perspective of the heat resistance of the plastic intaglio plate 72. Examples include curable resin compositions containing a polymerization initiator that function at room temperature, UV curable resins and photocurable resin compositions that cure by light irradiation, and hybrid curable resin compositions that cure by mixing two liquids.

[0083] In addition, as for grinding (polishing) performance, vinyl ester resins or unsaturated polyester resins having high heat resistance (high deformation temperature) are preferred.

[0084] The process may further include embedding a sheet of fiber material 6 in the resin 50 before the resin 50 is cured. By embedding the fiber material 6 in the resin 50, the strength of the protrusions 51 is increased, and a polishing layer 11 can be obtained that prevents the protrusions 51 of the polishing pad from falling off during manufacturing (when peeling from the plastic intaglio plate 72) and during polishing.

[0085] Furthermore, a step of bonding a substrate to the surface of the resin 50 opposite to the surface in contact with the plastic intaglio plate 72 may be further included before curing the resin 50. By using the substrate, the resin 50 is cured while being sandwiched between the substrate and the plastic intaglio plate 72. This tends to improve the uniformity of the thickness of the resulting cured product and further enhance the flatness of the back surface of the resulting cured product (the surface opposite to the surface in contact with the plastic intaglio plate 72).

[0086] (Step 4)

[0087] The process of curing the resin raw material 50 will be described.

[0088] There are no particular restrictions on the method for curing the resin raw material 50 as long as it is a method suitable for each resin raw material 50. Depending on the properties of the resin, there can be a light curing method such as irradiation with ultraviolet rays, a thermal curing method (including a method of leaving it at room temperature) by applying heat, or a method of mixing and leaving it as in a two-liquid mixing type.

[0089] As for the irradiated light, there is no particular limitation as long as it is light that can harden the resin raw material 50, and ultraviolet rays can be cited as examples. In addition, as a light source that emits such light, a high-pressure mercury lamp, an ultraviolet-light emitting diode (UV-LED) lamp, a black light fluorescent lamp (black light blue (BLB)), etc. can be cited, but BLB is preferred among them. The direction of the irradiated light can be any one of the direction of irradiation from the lower surface 72A side of the plastic gravure 72 and the direction of irradiation from the upper surface 50A side of the resin raw material 50. In particular, when the plastic gravure 72 is used, even if irradiation is performed from the lower surface 72A side, due to its transparency, light sufficient to harden the protrusion 51 can pass through, and the hardening of the protrusion 51 becomes sufficient. This is something that cannot be achieved with the molding mold containing silicone rubber and the like used previously. The wavelength of ultraviolet irradiation is preferably 200nm to 400nm, and the irradiation time is preferably 3 minutes to 30 minutes.

[0090] (Step 5)

[0091] The polishing layer 11 is obtained by peeling the cured resin 50 from the plastic gravure plate 72. The peeling method is not particularly limited, and methods such as grasping the end of the cured resin and peeling it from the gravure plate 72 are possible. The obtained polishing layer 11 has a concave-convex pattern transferred from the plastic gravure plate 72, and the surface of the convex portions 51 of the concave-convex pattern serves as the polishing surface for polishing the object to be polished.

[0092] In addition, the plastic gravure 72 can also be peeled off from the hardened resin 50. Since the plastic gravure 72 used in the manufacturing method of the polishing pad of the present invention is disposable, it can be deformed or damaged when peeling off from the hardened resin 50, thereby suppressing defects such as damage or deformation of the polishing layer 11 and falling off of the protrusion 51 of the resin 50.

[0093] Furthermore, the polishing layer 11 after peeling can be cut into a predetermined size so as to be included in the polishing pad.

[0094] Furthermore, a cushion layer may be attached to the surface opposite to the surface having the concavo-convex pattern as needed to prepare a polishing pad.

[0095] The obtained polishing layer 11 has a flexural strength of 30 MPa or more, preferably 30 MPa to 1000 MPa, more preferably 40 MPa to 900 MPa, and even more preferably 50 MPa to 800 MPa. The flexural strength is determined by measurement in accordance with Japanese Industrial Standard (JIS) K7203. By having a flexural strength within this range, damage or deformation of the polishing layer 11 can be suppressed when the polishing layer 11 is peeled off from the plastic intaglio plate 72.

[0096] Figure 2 Shown in Figure 1 Magnified view of the grinding layer 11 with different shapes. Figure 1 The difference between the polishing layer 11 and the polishing layer 11 is that the concave portion 53 is included on the opposite side of the convex portion 51. By including the concave portion 53, further weight reduction and cost reduction can be achieved. The concave portion 53 can be provided by intentionally reducing the amount of resin at the portion where the convex portion 51 is formed in the process of step 3, or by pressing a mold corresponding to the concave portion 53 from above after the process of step 3. The shape of the concave portion 53 is not particularly limited, and can be as follows: Figure 2 Thus, it may be a shape having corners (for example, a quadrangular pyramid) or a shape having a curved surface (for example, a dome).

[0097] (Grinding method)

[0098] The polishing method using the polishing pad 1 obtained by the manufacturing method of the present invention is preferably used for free abrasive polishing. Here, the so-called free abrasive polishing is a method of polishing using a slurry or the like obtained by mixing the abrasive with a liquid without fixing the abrasive. In other words, it is a method of polishing using a slurry containing abrasive particles (a solution containing abrasive particles). Therefore, the polishing layer of the polishing pad 1 does not contain abrasive particles.

[0099] Compared with fixed abrasives, there are fewer problems such as scratches, especially when the generation of scratches is suppressed as low as possible, for example, when performing final finishing, by using the polishing pad 1 obtained by the manufacturing method of the present invention, the generation of scratches on the polished object can be suppressed as much as possible at a low price.

[0100] Example

[0101] Hereinafter, the present invention will be described in further detail with reference to Examples, but the present invention is not limited to these Examples.

[0102] In each of the Examples and Comparative Examples, "parts" means "parts by mass" unless otherwise specified.

[0103] (Manufacturing of polishing pads)

[0104] (Manufacturing of Polishing Pad 1)

[0105] The plastic intaglio plate 72 having a plurality of concave portions in the shape of a quadrangular pyramid with a height of 0.85 mm and a base of 1.5 mm square was produced by vacuum forming a polypropylene resin sheet.

[0106] Next, 90 parts of unsaturated polyester resin (product name: Rigolac, manufactured by Resonac Co., Ltd.) was poured into the plastic gravure 72. Before curing, a mesh fabric made of polypropylene with a fiber diameter of 150 μm, a pore size of 30 μm, and a thickness of 300 μm was lowered from above the resin 50 into the interior, and the fiber material entered the base 52.

[0107] After the resin 50 was cured at room temperature (25° C.) over 30 minutes, the resin 50 was peeled off from the plastic intaglio plate 72 , thereby removing the plastic intaglio plate 72 to produce the polishing pad 1 .

[0108] (Manufacturing of Polishing Pad 2)

[0109] Polishing pad 2 was manufactured using the same method as polishing pad 1, except that vinyl ester resin (product name: Ripoxy, manufactured by Resonac Co., Ltd.) was used instead of unsaturated polyester resin, and polyethylene fiber was used instead of polypropylene fiber for the mesh fabric.

[0110] (Manufacturing of Polishing Pad 3)

[0111] As for the material of the polishing pad, a UV curable resin (product name: SR368D NS (tris(2-hydroxyethyl)isocyanurate acrylate), manufactured by Arkema) containing 12 mass% of abrasive particles (product name: SQDP, manufactured by Surphase, particle size 4 μm) is used instead of the unsaturated polyester resin. No fiber material is allowed to enter, and the polishing pad is irradiated with ultraviolet rays to be cured. Except for this, the polishing pad 3 is manufactured using the same method as the polishing pad 1.

[0112] Furthermore, in the manufacture of polishing pads 2 and 3, it was confirmed that polishing pads similar to polishing pad 1 could be manufactured using a plastic gravure plate made of polypropylene resin even if the polishing pad material or mesh fabric material, the presence or absence of abrasive grains, etc. were changed.

[0113] Furthermore, the polishing pad 1 not using the mesh fabric was also manufactured by the same manufacturing method (polishing pad 4 ), and the polishing pad 2 not using the mesh fabric was also manufactured by the same manufacturing method (polishing pad 5 ).

[0114] (When peeling from the gravure)

[0115] Experiments were conducted to peel the resin 50 from the plastic gravure plate 72 using a peeling roller. For example, a stripping roller composed of a combination of adhesive tape and a rod-shaped stripping roller, as described in Japanese Patent Application Laid-Open No. 9-114384, was used. Under conditions enabling peeling of the gravure plate and the resin 50, peeling experiments were conducted using the plastic gravure plate 72 according to the examples and using silicone rubber instead of plastic. The silicone rubber gravure required significant force for peeling, resulting in the protrusions 51 of the peeled resin 50 falling off or being damaged. In contrast, the polishing pads 1 to 5 obtained using the plastic gravure plate 72 made of polypropylene resin showed no signs of falling off or being damaged during peeling.

[0116] Industrial applicability

[0117] The method for producing a polishing pad of the present invention is inexpensive and can easily peel resin from a gravure plate. Therefore, it has industrial applicability as a method for producing a polishing pad for polishing or grinding optical materials, semiconductor devices, glass substrates for hard disks, and the like.

[0118] Explanation of Figure Numbers

[0119] 11: Grinding layer

[0120] 50: Resin raw materials

[0121] 50A: Upper surface of resin material

[0122] 51: convex part

[0123] 52: Base

[0124] 53: Concave

[0125] 71: Plastic materials

[0126] 72: Plastic gravure

[0127] 72A: Lower surface of plastic gravure

[0128] 8: Release agent

Claims

1. A method for producing a polishing pad having a polishing layer formed by curing a resin. The manufacturing method of the polishing pad has the following steps: A process for preparing a plastic gravure plate having a concave-convex pattern formed by vacuum forming or injection molding; The process of pouring the resin raw material into the plastic gravure; a step of hardening the resin; and peeling the cured resin from the plastic gravure to obtain the polishing layer.

2. The method for manufacturing a polishing pad according to claim 1, wherein: In the step of curing the resin, the temperature of the plastic gravure is 130° C. or lower.

3. The method for manufacturing a polishing pad according to claim 1, wherein: The plastic gravure plate comprises a resin selected from polyethylene, polypropylene, polystyrene and polyvinyl chloride. 4 . The method for producing a polishing pad according to claim 1 , further comprising the step of applying a release agent to the plastic gravure plate, wherein the release agent is a silicone release agent or a fluorine release agent.

5. The method for manufacturing a polishing pad according to claim 1, wherein The resin is a thermosetting resin composition.

6. The method for manufacturing a polishing pad according to claim 1, wherein: The resin is an ultraviolet curable resin composition.

7. A method for producing a polishing pad having a polishing layer formed by curing a resin and containing no abrasive grains, The manufacturing method of the polishing pad has the following steps: A process for preparing a plastic gravure plate having a concave-convex pattern formed by vacuum forming or injection molding; The process of pouring the resin raw material without abrasive particles into the plastic gravure; a step of hardening the resin; and peeling the cured resin from the plastic gravure to obtain the polishing layer.

8. A polishing method for a polishing object using the polishing pad obtained by the method for manufacturing a polishing pad according to claim 7, wherein: Grinding is performed by free abrasive grinding.

9. A method for producing a polishing pad having a polishing layer formed by curing a resin and containing abrasive grains, The manufacturing method of the polishing pad has the following steps: A process for preparing a plastic gravure plate having a concave-convex pattern formed by vacuum forming or injection molding; The process of pouring the resin raw material containing abrasive particles into the plastic gravure; a step of hardening the resin; and peeling the cured resin from the plastic gravure to obtain the polishing layer.

10. A polishing method for a polished object using the polishing pad obtained by the method for manufacturing a polishing pad according to claim 9, wherein: The grinding is performed by fixed abrasive grinding.

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