Chip resistor

Abstract

The resistor body of the chip resistor is provided with a resistance value adjusting part. A meandering forming portion is formed in the resistance value adjusting portion. In the meandering forming portion, the first trimming groove and the second trimming groove are arranged along a first direction (longitudinal direction). The first trimming groove has a first linear portion extending from a second edge of the resistance value adjusting portion along a second direction (short side direction). The second trimming groove has a second linear portion extending from the second edge of the resistance value adjusting portion in the second direction, and a bent portion extending from the tip of the second linear portion toward the first trimming groove.

Description

Technical Field

[0001] The present invention generally relates to a chip resistor and a method for manufacturing the chip resistor, and more particularly to a chip resistor including a pair of electrodes and a resistor element, and a method for manufacturing the chip resistor. Background Art

[0002] Patent Document 1 discloses a chip resistor in which a linear trimming groove is formed in a rectangular portion of a resistor formed on an insulating substrate.

[0003] Patent Document 2 discloses a chip resistor in which a linear trimming groove is formed in a rectangular portion of a resistor formed on an insulating substrate.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2010-135358

[0007] Patent Document 2: Japanese Patent Application Laid-Open No. 2005-244060 Summary of the Invention

[0008] In the chip resistor described in Patent Document 1, trimming grooves are formed in a meandering pattern in the rectangular portion of the resistor body. The trimming grooves are formed, for example, using a laser. Furthermore, the chip resistor described in Patent Document 1 has two parallel trimming grooves formed for fine-tuning the resistance value.

[0009] When using a laser to form a trimming groove, there are technical limitations in widening the groove width of the trimming groove. Therefore, it is difficult to increase the withstand voltage of the trimming groove, and the withstand voltage of the trimming groove may become the voltage limit of the chip resistor.

[0010] In the chip resistor described in Patent Document 2, the resistor element has a pair of rectangular portions and a meandering portion between the pair of rectangular portions. The trimming grooves are formed in a meandering pattern in the rectangular portions of the resistor element. The trimming grooves are formed using, for example, a laser.

[0011] When using a laser to form a trimming groove, there are technical limitations in widening the trimming groove width. Therefore, it is relatively difficult to increase the withstand voltage of the trimming groove, and the withstand voltage of the trimming groove may become the voltage limit of the chip resistor.

[0012] A chip resistor according to one embodiment of the present invention includes a substrate, a pair of electrodes, and a resistor. The pair of electrodes are provided at both ends of one surface of the substrate. The resistor is provided between the pair of electrodes on the one surface of the substrate. The resistor includes a pair of connecting portions connected to the pair of electrodes, respectively, and a resistance value adjusting portion provided between the pair of connecting portions. A meandering forming portion is formed in the resistance value adjusting portion for forming the resistance value adjusting portion into a meandering shape. The meandering forming portion includes a first trimming groove and a second trimming groove. The first trimming groove and the second trimming groove are arranged along a first direction, which is the direction in which the pair of connecting portions are arranged. The first trimming groove includes a first straight portion extending from the groove starting edge of the resistance value adjusting portion along a second direction perpendicular to the first direction. The second trimming groove includes a second straight portion extending from the groove starting edge of the resistance value adjusting portion along the second direction, and a bent portion extending from the front end of the second straight portion toward a direction approaching the first trimming groove.

[0013] According to the present invention, a chip resistor having a high withstand voltage is obtained.

[0014] A chip resistor according to one embodiment of the present invention comprises a substrate, a first electrode, a second electrode, and a resistor body. The first electrode and the second electrode are arranged at both ends of a first direction of one side of the substrate. The resistor body is arranged between the first electrode and the second electrode on the one side of the substrate. The resistor body has a meandering portion and a rectangular portion connected to the meandering portion and the first electrode. The chip resistor further comprises a first trimming groove and a second trimming groove. The first trimming groove and the second trimming groove are formed in the rectangular portion, and the rectangular portion is set to a meandering shape by extending from an edge of the rectangular portion extending along the first direction along a second direction orthogonal to the first direction.

[0015] A method for manufacturing a chip resistor according to one embodiment of the present invention includes the following steps: forming a first electrode and a second electrode at both ends of a first direction of one side of a substrate; forming a resistor body having a meandering portion and a rectangular portion connected to the meandering portion and the first electrode in the middle of the first direction of the one side of the substrate; and forming a first trimming groove and a second trimming groove in the rectangular portion so as to set the rectangular portion into a meandering shape by extending from an edge of the rectangular portion along the first direction along a second direction orthogonal to the first direction.

[0016] According to the present invention, a chip resistor having a high withstand voltage and a method for manufacturing the chip resistor are obtained. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 1 is a schematic cross-sectional view of a chip resistor according to a first embodiment of the present invention.

[0018] Figure 2 Schematic top view of the chip resistor as above.

[0019] Figure 3 Graph showing the change in resistance value with respect to the total trimming distance.

[0020] Figure 4 Graph showing changes in the potential difference across each groove with changes in the ratio of the length of the second trimming groove to the length of the first trimming groove.

[0021] Figure 5 It is a schematic top view of a chip resistor in accordance with a second embodiment of the present invention.

[0022] Figure 6 It is a schematic top view of a chip resistor in accordance with a third embodiment of the present invention.

[0023] Figure 7 It is a schematic plan view of a chip resistor in accordance with a fourth embodiment of the present invention.

[0024] Figure 8 It is a schematic plan view of a chip resistor in accordance with a fifth embodiment of the present invention.

[0025] Figure 9 It is a schematic perspective view of a chip resistor in a sixth embodiment of the present invention.

[0026] Figure 10 This is a graph showing changes in the potential difference across each groove relative to the length of the second trimming groove of the chip resistor in the sixth embodiment of the present invention.

[0027] Figure 11 It is a schematic perspective view of a chip resistor in accordance with a seventh embodiment of the present invention.

[0028] Figure 12 This is a graph showing changes in the resistance value variation rate with respect to the crack length of the chip resistor according to the seventh embodiment of the present invention.

[0029] Figure 13 It is a schematic perspective view of a chip resistor in an eighth embodiment of the present invention.

[0030] Figure 14 It is a schematic perspective view of a chip resistor in a ninth embodiment of the present invention. DETAILED DESCRIPTION

[0031] The following describes chip resistors according to the embodiments with reference to the accompanying drawings. The figures used in the following embodiments are schematic diagrams, and the sizes and thickness ratios of the components do not necessarily reflect actual dimensional ratios. Furthermore, the structure described in the following embodiments is merely an example of the present invention. The present invention is not limited to the following embodiments, and various modifications can be made according to design, etc., as long as the effects of the present invention are achieved.

[0032] The X-axis, Y-axis, and Z-axis in the drawing are orthogonal to each other, but this is just an example and is not intended to define the direction in which the chip resistor is used.

[0033] (First embodiment)

[0034] (1-1) Basic structure of chip resistors

[0035] Below, refer to Figure 1 as well as Figure 2 A first embodiment will be described. The first embodiment discloses a chip resistor 1 in which a meandering groove is formed in a resistor element.

[0036] The chip resistor 1 is a surface mount (SMT) chip resistor mounted on the surface (mounting surface) of a printed circuit board using a surface mounter. In this embodiment, the chip resistor 1 is a thick film chip resistor as an example.

[0037] like Figure 1 as well as Figure 2 As shown in FIG. 1 , the chip resistor 1 includes an insulating substrate 2, a first upper surface electrode 3, a second upper surface electrode 4, and a resistor 5. Figure 1 As shown, the chip resistor 1 further includes a first lower surface electrode 33, a second lower surface electrode 34, a first end surface electrode 35, a second end surface electrode 36, a pair of first plating layers 37, and a pair of second plating layers 38. Figure 1 As shown, the chip resistor 1 further includes a glass protection film 41 and a resin protection film 42 .

[0038] (1-2) Insulating substrate

[0039] The insulating substrate 2 is made of, for example, aluminum oxide containing 96% Al2O3 and has a rectangular shape (rectangular in plan view). Figure 1 as well as Figure 2 The left and right directions of Figure 2 The vertical direction of is set as the short side direction D2 (an example of the second direction). Figure 1 as well as Figure 2 The right side of is set as the first side in the long direction, Figure 1 as well as Figure 2 The left side of is set as the second side in the long direction, Figure 2 The upper side of is set as the first side in the short side direction, Figure 2 The lower side is set as the second side in the short side direction.

[0040] The long side direction D1 is perpendicular to the short side direction D2. It should be noted that the term "perpendicular" herein refers to a concept of being substantially perpendicular, including a range of 90°±10°.

[0041] (1-3) Top surface electrode, bottom surface electrode, and side surface electrode

[0042] The first upper surface electrode 3 and the second upper surface electrode 4 are respectively provided at both ends in the longitudinal direction of the surface 21 of the insulating substrate 2 and are formed by printing and firing a thick film material containing a metal such as silver.

[0043] The first lower surface electrode 33 and the second lower surface electrode 34 are respectively provided at both ends of the longitudinal direction of the back surface 22 of the insulating substrate 2 and are formed by printing and firing a thick film material containing a metal such as silver. The first lower surface electrode 33 and the second lower surface electrode 34 correspond to the first upper surface electrode 3 and the second upper surface electrode 4, respectively.

[0044] The first end surface electrodes 35 and the second end surface electrodes 36 are respectively provided on a pair of end surfaces 23 on either side of the insulating substrate 2 in the longitudinal direction. The first end surface electrodes 35 and the second end surface electrodes 36 are, for example, sputtered films made of NiCr. That is, the first end surface electrodes 35 and the second end surface electrodes 36 are formed (film-formed) on the left-right end surfaces 23 of the insulating substrate 2 by sputtering. The first end surface electrodes 35 electrically connect the first upper surface electrode 3 and the first lower surface electrode 33. The second end surface electrodes 36 electrically connect the second upper surface electrode 4 and the second lower surface electrode 34.

[0045] (1-4) Resistor

[0046] Resistor 5 is formed between first upper surface electrode 3 and second upper surface electrode 4 on surface 21 of insulating substrate 2 and is connected to first upper surface electrode 3 and second upper surface electrode 4. Resistor 5 is formed by printing a thick film material composed of copper nickel, silver palladium, or ruthenium oxide onto surface 21 of insulating substrate 2 and then firing it.

[0047] The resistor 5 includes a resistance value adjusting portion 12 , a first connecting portion 31 , and a second connecting portion 32 .

[0048] The resistance-adjusting portion 12 is positioned in the middle of the longitudinal direction of the surface 21 of the insulating substrate 2, in other words, spaced apart between the first upper surface electrode 3 and the second upper surface electrode 4. More specifically, the resistance-adjusting portion 12 is provided between the first connecting portion 31 and the second connecting portion 32. The resistance-adjusting portion 12 is the portion that adjusts the resistance of the resistor 5 through laser trimming, as described later. The edge of the resistance-adjusting portion 12 on the first side in the transverse direction is referred to as the first edge 13, and the edge on the second side in the transverse direction is referred to as the second edge 14 (an example of a groove start edge).

[0049] The first connecting portion 31 and the second connecting portion 32 are arranged along the longitudinal direction D1. The first connecting portion 31 includes a first rectangular portion 6, a second rectangular portion 7, and a third rectangular portion 8 (an example of a connecting portion). The first rectangular portion 6 is connected to the first side portion of the first upper surface electrode 3 in the short direction and extends toward the first side in the long direction. The second rectangular portion 7 extends from the front end of the first rectangular portion 6 to the second side in the short direction. The third rectangular portion 8 extends from the front end of the second rectangular portion 7 to the first side in the long direction and is connected to the end portion of the resistance value adjusting portion 12 on the second side in the short direction (the end portion on the second edge 14 side). The third rectangular portion 8 has an edge 49 (an example of an edge) on the first side in the short direction. Edge 49 is the edge on the side opposite to the second edge 14 in the short direction D2.

[0050] The second connecting portion 32 includes a fourth rectangular portion 9, a fifth rectangular portion 10, and a sixth rectangular portion 11 (an example of a connecting portion). The fourth rectangular portion 9 is connected to the first side of the second upper electrode 4 in the short direction and extends toward the second side in the long direction. The fifth rectangular portion 10 extends from the front end of the fourth rectangular portion 9 toward the second side in the short direction. The sixth rectangular portion 11 extends from the front end of the fifth rectangular portion 10 toward the second side in the long direction and connects to the second end of the resistance adjusting portion 12 in the short direction (the end on the side of the second edge 14). In the above configuration, the sixth rectangular portion 11 is located near the second edge 14 of the resistance adjusting portion 12. The sixth rectangular portion 11 has an edge 50 (an example of an edge) on the first side in the short direction. Edge 50 is on the side opposite to the second edge 14 in the short direction D2. It should be noted that the short-side position of the edge 49 of the third rectangular portion 8 and the edge 50 of the sixth rectangular portion 11 is defined as the voltage reference position 51.

[0051] The resistance value adjusting portion 12 is formed with a meandering portion 15 for forming the resistance value adjusting portion 12 into a meandering shape. The resistor 5 has a meandering shape that folds back three times in a direction parallel to the short-side direction D2 of the insulating substrate 2. Specifically, the first rectangular portion 6, the second rectangular portion 7, the third rectangular portion 8, and the resistance value adjusting portion 12 form a first bend that folds back toward the first side in the short-side direction. In addition, the fourth rectangular portion 9, the fifth rectangular portion 10, the sixth rectangular portion 11, and the resistance value adjusting portion 12 form a second bend that folds back toward the first side in the short-side direction. Furthermore, the resistance value adjusting portion 12 forms a third bend that folds back toward the second side in the short-side direction, as described later.

[0052] Two trimming grooves are formed in the meandering portion 15. Specifically, a first trimming groove 16 and a second trimming groove 17 are formed in the meandering portion 15. The first trimming groove 16 and the second trimming groove 17 are arranged along the longitudinal direction D1.

[0053] The first trimming groove 16 has a first straight portion 16P1 extending from the second edge 14 of the resistance value adjusting portion 12 along the short-side direction D2 (an example of the second direction).

[0054] The second trimming groove 17 includes a second straight portion 17P1 extending from the second edge 14 of the resistance value adjusting portion 12 along the short-side direction D2 and a bent portion 17P2 (an example of a folded portion) extending from the front end of the second straight portion 17P1 toward the first trimming groove 16 .

[0055] The second straight portion 17P1 of the second trimming groove 17 is longer than the first straight portion 16P1 of the first trimming groove 16 in the short-side direction D2 .

[0056] The bent portion 17P2 of the second trimming groove 17 is arranged on the opposite side of the second edge 14 with respect to the front end of the first straight portion 16P1 of the first trimming groove 16 .

[0057] The above-described structure can reduce the potential difference between both sides of each trimming groove of the meandering portion 15. Therefore, a meandering pattern that can withstand a high potential difference can be formed.

[0058] The bent portion 17P2 of the second trimming groove 17 has a first portion 18 that bends at a right angle from the front end of the second straight portion 17P1 and extends toward the second side in the short direction. The front end of the first portion 18 is located closer to the second side in the long direction than the front end of the first straight portion 16P1 of the first trimming groove 16.

[0059] The bent portion 17P2 of the second trimming groove 17 further includes a second portion 19 extending from the front end of the first portion 18, folding back relative to the second straight portion 17P1. The second portion 19 extends from the front end of the first portion 18 toward the second side in the short-side direction. Specifically, the second portion 19 is a straight line extending parallel to the second straight portion 17P1. More specifically, the front end of the second portion 19 is located closer to the second side in the short-side direction than the front end of the first straight portion 16P1. In other words, the front end of the first straight portion 16P1 is surrounded by the second trimming groove 17 on both sides in the long-side direction and on the first side in the short-side direction.

[0060] like Figure 2 As shown, when the short-side length from the voltage reference position 51 to the front end of the second trimming groove 17 is a1 and the short-side length from the voltage reference position 51 to the front end of the first trimming groove 16 is b1, 0.53≤a1 / b1≤1.30 holds.

[0061] In this case, the potential difference between both sides of each trimming groove can be reduced compared to the conventional example of two trimming grooves, so that voltage breakdown in the groove portion is less likely to occur, and thus characteristic abnormalities can be suppressed.

[0062] (1-5) Glass protective film

[0063] The glass protection film 41 is a film for protecting the resistor 5. Figure 1 As shown, the glass protective film 41 covers the entire area (entire body) of the resistor 5. The glass protective film 41 is made of, for example, lead oxide glass. The glass protective film 41 is formed (film-formed) by, for example, screen printing. It should be noted that the glass protective film 41 is not limited to lead oxide glass; for example, it can also be made of silicon oxide glass.

[0064] (1-6) Resin protective film

[0065] The resin protection film 42 is made of, for example, epoxy resin and covers the entire region (entirety) of the glass protection film 41. The resin protection film 42 is formed (film formation) by, for example, applying epoxy resin by screen printing and then thermally curing the epoxy resin.

[0066] (1-7) First coating

[0067] The pair of first plating layers 37 are made of, for example, nickel (Ni) plating layers, and cover the first end surface electrode 35 and the second end surface electrode 36 at both ends in the longitudinal direction of the insulating substrate 2 .

[0068] (1-8) Second coating

[0069] The pair of second plating layers 38 are made of, for example, tin (Sn) plating layers, and cover the pair of first plating layers 37 at both ends of the insulating substrate 2 in the longitudinal direction D1.

[0070] (1-9) Manufacturing method of chip resistors

[0071] Hereinafter, a method for manufacturing the chip resistor 1 will be described. However, for simplicity of description, only the formation of the first upper surface electrode 3 , the second upper surface electrode 4 , and the resistor 5 will be described.

[0072] First, electrode paste was screen-printed on both ends in the longitudinal direction of the insulating substrate 2 made of alumina, and fired at 850° C. to form the first upper surface electrode 3 and the second upper surface electrode 4 .

[0073] Next, a resistor paste was screen-printed between the first upper surface electrode 3 and the second upper surface electrode 4 , and fired at 850° C. to form the resistor 5 .

[0074] Next, in order to form the resistance value adjusting portion 12 into a meandering shape, a meandering portion 15 is formed by laser trimming. Thus, the resistor 5 has a meandering shape having three bends.

[0075] use Figure 3 The formation of the second trimming groove 17 is described. In this embodiment, laser trimming is performed in the order of the second straight portion 17P1, the first portion 18 of the bent portion 17P2, and the second portion 19 of the bent portion 17P2. Figure 3 In the figure, a change in resistance value is observed when second straight portion 17P1 is formed, as indicated by reference numeral 91; a change in resistance value is observed when first portion 18 is formed, as indicated by reference numeral 92; and a change in resistance value is observed when second portion 19 is formed, as indicated by reference numeral 93. Thus, it is apparent that the resistance value of resistor 5 can be finely adjusted by forming first portion 18 and second portion 19.

[0076] (1-10) Characteristics

[0077] use Figure 4 The following describes how the potential difference across each trimming groove changes as the ratio (%) of the length of the second trimming groove 17 to the length of the first trimming groove 16 changes. These results were obtained through a simulation in which 800V was applied to the resistor 5. Here, the potential difference across the groove refers to the potential difference between the conductor portions located on either side of each trimming groove. It should be noted that in the conventional case of two trimming grooves, the minimum potential difference across the groove is 176V.

[0078] exist Figure 4In the figure, the line connecting multiple points (△) represents the potential difference between the two sides of the first trimming groove 16, and the line connecting multiple points (0) represents the potential difference between the two sides of each second trimming groove 17. In addition, the straight line 61 represents the lowest value of the potential difference between the two sides of the groove in the past, which is 176V. Figure 4 Clearly, when the ratio is low (e.g., near 0%), the potential difference across the first trimming groove 16 is greater than 176 V. However, as the ratio increases, the potential difference across the first trimming groove 16 decreases, and when the ratio reaches 53% or greater, the potential difference across the groove is less than 176 V. Furthermore, when the ratio is low (e.g., near 0%), the potential difference across the second trimming groove 17 is small, but as the ratio increases, the potential difference across the second trimming groove 17 increases. However, even when the ratio approaches 100% and even exceeds 100%, the potential difference across the second trimming groove 17 remains less than 176 V as long as the ratio is 130% or less.

[0079] As can be seen from the above, if the ratio is 53% or more and 130% or less, a potential difference significantly smaller than the conventional minimum across-slot potential difference can be achieved. Furthermore, the ratio is preferably in the range of 70% to 120%, and more preferably in the range of 80% to 110%. In this case, the across-slot potential difference of all trimming slots can be reduced to less than 150V.

[0080] (Second embodiment)

[0081] use Figure 5 A chip resistor 1A according to the second embodiment will be described. The basic structure of the chip resistor 1A is the same as that of the chip resistor 1 according to the first embodiment, so the description will focus on the differences.

[0082] Two trimming grooves are formed in the meandering portion 15A. Specifically, a first trimming groove 16A and a second trimming groove 17A are formed in the meandering portion 15A. The first trimming groove 16A and the second trimming groove 17A are arranged along the longitudinal direction D1 (an example of the first direction).

[0083] The first trimming groove 16A has a first straight portion 16A1 extending from the second edge 14A of the resistance value adjusting portion 12A along the short-side direction D2 .

[0084] The second trimming groove 17A includes a second straight portion 17A1 extending from the second edge 14A of the resistance value adjusting portion 12A along the short-side direction D2 (an example of the second direction) and a bent portion 17A2 extending from the front end of the second straight portion 17A1 toward the first trimming groove 16A.

[0085] The second straight portion 17A1 of the second trimming groove 17A is longer than the first trimming groove 16A in the short-side direction D2.

[0086] The bent portion 17A2 of the second trimming groove 17A is bent at a right angle from the front end of the second straight portion 17A1 and extends toward the second longitudinal side.

[0087] The above-described structure can reduce the potential difference between the two sides of each trimming groove of the meandering portion 15A, thereby forming a meandering pattern that can withstand a high potential difference.

[0088] (Third embodiment)

[0089] use Figure 6 A chip resistor 1B according to a third embodiment will be described. The basic structure of the chip resistor 1B is the same as that of the chip resistor 1 according to the first embodiment, and therefore the description will focus on the differences.

[0090] The resistance adjusting portion 12B of the resistor 5B includes a meandering portion 15B. A trimming groove is formed in the meandering portion 15B to give the resistance adjusting portion 12B a meandering shape. Specifically, a first trimming groove 16B and a second trimming groove 17B are formed in the meandering portion 15B. The first trimming groove 16B and the second trimming groove 17B are aligned along the longitudinal direction D1 (an example of a first direction). The first trimming groove 16B and the second trimming groove 17B extend parallel to each other along the transverse direction D2 (the transverse direction) from the second edge 14B (an example of a groove starting edge) of the resistance adjusting portion 12B. The second trimming groove 17B is located on the first side of the first trimming groove 16B in the longitudinal direction.

[0091] The first trimming groove 16B has a first straight portion 16B1 extending from the second edge 14B of the resistance value adjusting portion 12B toward the first side in the short-side direction.

[0092] The second trimming groove 17B includes a second straight portion 17B1 extending from the second edge 14B of the resistance value adjusting portion 12B toward the first side in the short-side direction, and a bent portion 17B2 (an example of a folded portion) extending from the front end of the second straight portion 17B1 toward the first straight portion 16B1 .

[0093] The second straight portion 17B1 of the second trimming groove 17B is longer in the short-side direction D2 than the first straight portion 16B1 of the first trimming groove 16B.

[0094] The bent portion 17B2 of the second trimming groove 17B includes a first portion 18B having a semicircular arc shape in a plan view from the thickness direction of the insulating substrate 2B and a second portion 19B that is bent back relative to the second straight portion 17B1 and extends parallel to the second straight portion 17B1.

[0095] The bent portion 17B2 of the second trimming groove 17B is located on the opposite side of the second edge 14B from the distal end of the first straight portion 16B1 of the first trimming groove 16B. Specifically, the first portion 18B curves from the distal end of the second straight portion 17B1 in a convex manner outward in the transverse direction and extends toward the second side in the longitudinal direction. More specifically, the distal end of the bent portion 17B2 (specifically, the second portion 19B) is located further to the second side in the transverse direction than the distal end of the first straight portion 16B1. In other words, the distal end of the first straight portion 16B1 is surrounded by the second trimming groove 17B on both sides in the longitudinal direction and on the first side in the transverse direction.

[0096] The above-described structure can reduce the potential difference between both sides of each trimming groove of the meandering portion 15. Therefore, a meandering pattern that can withstand a high potential difference can be formed.

[0097] In the above-described structure, second trimming groove 17B includes bend 17B2, making it less susceptible to microcracks at the distal end of second trimming groove 17B. In particular, bend 17B has a rounded portion at least in part, which mitigates current concentration at the corner at the distal end of the bend, improving load characteristics.

[0098] More specifically, the microcracks at the tip of the second trimming groove 17B are oriented in the same direction as the current path. Therefore, even if the microcracks grow, the resistance value hardly changes, which improves resistance accuracy and reliability. Furthermore, the resistance value fluctuations caused by the growth of microcracks at the tip of the first trimming groove 16B can be reduced, thereby improving resistance accuracy and reliability.

[0099] Furthermore, the bent portion 17B2 of the second trimming groove 17B is bent toward the first trimming groove 16B in the longitudinal direction D1, so that the microcracks at the tip of the second trimming groove 17B can be generated in a location where little current flows. As a result, the resistance value accuracy and reliability are further improved.

[0100] (Fourth embodiment)

[0101] use Figure 7 A chip resistor 1C according to a fourth embodiment will be described. The chip resistor 1C has the same basic structure as the chip resistor 1 according to the first embodiment, and therefore the description will focus on the differences.

[0102] The resistor 5C includes a resistance value adjusting portion 12C, a first connecting portion 6C, and a second connecting portion 9C.

[0103] The resistance adjusting portion 12C is positioned in the middle of the longitudinal direction of the surface 21C of the insulating substrate 2C, in other words, spaced apart between the first top electrode 3C and the second top electrode 4C. The resistance adjusting portion 12C is the portion that adjusts the resistance of the resistor 5C through laser trimming. The edge on the first side of the longitudinal direction of the resistance adjusting portion 12C is referred to as a first edge 13C, and the edge on the second side of the longitudinal direction is referred to as a second edge 14C (an example of a groove start edge).

[0104] The first connecting portion 6C and the second connecting portion 9C are arranged along the short-side direction D2 (an example of the first direction). The first connecting portion 6C is connected to the first side of the first top electrode 3C in the short-side direction and extends to the first side in the long-side direction to connect to the resistance adjusting portion 12C. The second connecting portion 9C is connected to the second side of the second top electrode 4 in the short-side direction and extends to the second side in the long-side direction. The end of the second connecting portion 9C in the long-side direction is connected to the resistance adjusting portion 12C via the connecting portion 11C.

[0105] The resistor 5C has a meandering shape that bends back in a direction parallel to the longitudinal direction D1 of the insulating substrate 2C. Specifically, the first connecting portion 6C and the resistance adjusting portion 12C form a first bend that bends back toward the second side in the longitudinal direction. Furthermore, the resistance adjusting portion 12C, the connecting portion 11C, and the second connecting portion 9C form a second bend that bends back toward the first side in the longitudinal direction.

[0106] The resistance adjusting portion 12C includes a meandering portion 15C. A trimming groove is formed in the meandering portion 15C to give the resistance adjusting portion 12C a meandering shape. Specifically, a first trimming groove 16C and a second trimming groove 17C are formed in the meandering portion 15C. The first trimming groove 16C and the second trimming groove 17C extend parallel to each other along the longitudinal direction D1 (an example of the second direction) from the second edge 14C of the resistance adjusting portion 12C. The second trimming groove 17C is located on the second side of the first trimming groove 16C in the lateral direction.

[0107] The first trimming groove 16C has a first straight portion 16C1 extending from the second edge 14C of the resistance value adjusting portion 12C toward the first side in the longitudinal direction.

[0108] The second trimming groove 17C includes a second straight portion 17C1 extending from the second edge 14C of the resistance value adjusting portion 12C along the short-side direction D2 and a bent portion 17C2 extending from the front end of the second straight portion 17C1 toward the first trimming groove 16A.

[0109] The second straight portion 17C1 of the second trimming groove 17C is longer in the longitudinal direction D1 (an example of the second direction) than the first straight portion 16C1 of the first trimming groove 16 of the first trimming groove 16C.

[0110] The bent portion 17C2 of the second trimming groove 17C is located on the opposite side of the second edge 14C from the distal end of the first straight portion 16C1 of the first trimming groove 16C. Specifically, the bent portion 17C2 bends at a right angle from the distal end of the second straight portion 17C1 and extends toward the second side in the longitudinal direction. The distal end of the bent portion 17C2 is located closer to the first side in the transverse direction than the distal end of the first straight portion 16C1 of the first trimming groove 16C.

[0111] The above-described structure can reduce the potential difference between the two sides of each trimming groove of the meandering portion 15C, thereby forming a meandering pattern that can withstand a high potential difference.

[0112] (Fifth embodiment)

[0113] use Figure 8 A chip resistor 1D according to a fifth embodiment will be described. The basic structure of the chip resistor 1D is the same as that of the chip resistor 1C according to the fourth embodiment, and therefore the description will focus on the differences.

[0114] The resistance-adjusting portion 12D of the resistor 5D includes a meandering portion 15D. A trimming groove is formed in the meandering portion 15D to give the resistance-adjusting portion 12D a meandering shape. Specifically, a first trimming groove 16D and a second trimming groove 17D are formed in the meandering portion 15D. The first trimming groove 16D and the second trimming groove 17D are aligned along the short-side direction D2. The first trimming groove 16D and the second trimming groove 17D extend parallel to the short-side direction D2 (an example of the first direction). The second trimming groove 17D is located on the second side of the first trimming groove 16D in the short-side direction.

[0115] The first trimming groove 16D has a first straight portion 16D1 extending from the second edge 14D of the resistance value adjusting portion 12D toward the first side in the longitudinal direction.

[0116] Second trimming groove 17D includes a second straight portion 17D1 extending from second edge 14D of resistance adjusting portion 12D toward the first side in the longitudinal direction, and a bent portion 17D2 (an example of a folded portion) extending from the distal end of second straight portion 17D1 toward first straight portion 16D1. Bend portion 17D2 includes a first portion 18D having a semicircular arc shape when viewed from above in the thickness direction of insulating substrate 2D, and a second portion 19D folded back relative to second straight portion 17D1 and extending parallel to second straight portion 17D1.

[0117] The second straight portion 17D1 of the second trimming groove 17D is longer in the longitudinal direction D1 than the first straight portion 16D1 of the first trimming groove 16D.

[0118] The bent portion 17D2 of the second trimming groove 17D is located on the opposite side of the second edge 14D from the distal end of the first straight portion 16D1 of the first trimming groove 16D. Specifically, the first portion 18D curves from the distal end of the second straight portion 17D1 in a convex manner outward in the longitudinal direction and extends toward the second longitudinal side. More specifically, the distal end of the bent portion 17D2 (specifically, the second portion 19D) is located further to the second longitudinal side than the distal end of the first straight portion 16D1. In other words, the distal end of the first straight portion 16D1 is surrounded by the second trimming groove 17D on both sides in the transverse direction and on the first longitudinal side.

[0119] The above-described structure can reduce the potential difference between the two sides of each trimming groove of the meandering portion 15D, thereby forming a meandering pattern that can withstand a high potential difference.

[0120] (Variation)

[0121] The above-mentioned embodiments are merely one of various embodiments of the present invention. As long as the above-mentioned embodiments can achieve the purpose of the present invention, various modifications can be made according to design, etc. The following lists modifications of the above-mentioned embodiments. The modifications described below can be appropriately combined and applied.

[0122] The chip resistor 1 may also be a thin film chip resistor.

[0123] In the first to fifth embodiments, the second straight portion of the second trimming groove is longer than the first straight portion of the first trimming groove. However, the second straight portion of the second trimming groove may be shorter than the first straight portion of the first trimming groove.

[0124] The shape and length of the bent portion of the trimming groove are not particularly limited, but the bent portion is preferably free of corners, in other words, smooth.

[0125] In the first to fifth embodiments, the bent portion of the second trimming groove overlaps the first straight portion of the first trimming groove in the groove arrangement direction and further extends beyond it. However, the bent portion of the second trimming groove may not overlap the first straight portion of the first trimming groove in the groove arrangement direction, or may overlap only a portion of the first straight portion of the first trimming groove in the groove arrangement direction.

[0126] (plan)

[0127] The following aspects are disclosed in this specification.

[0128] The chip resistor (1, 1A, 1B, 1C, 1D) of the first embodiment includes a substrate (2, 2B, 2C, 2D), a pair of electrodes (3, 3C, 4, 4C), and a resistor (5, 5B, 5C, 5D). The pair of electrodes (3, 4) are provided at both ends of one surface (21, 21C) of the substrate (2, 2B, 2C, 2D). The resistor (5, 5B, 5C, 5D) is provided between the pair of electrodes (3, 3C, 4, 4C) on one surface (21, 21C) of the substrate (2, 2B, 2C, 2D). The resistor includes a pair of connecting portions (31, 32) connected to the pair of electrodes (3, 4), respectively, and a resistance value adjusting portion (12, 12A, 12B, 12C, 12D) provided between the pair of connecting portions (31, 32). A meandering portion (15, 1, 15B, 15C, 15D) is formed in the resistance value adjusting portion (12, 12A, 12B, 12C, 12D) to form the resistance value adjusting portion (12, 12A, 12B, 12C, 12D) into a meandering shape. A first trimming groove (16, 16A, 16B, 16C, 16D) and a second trimming groove (17, 17A, 17B, 17C, 17D) are formed in the meandering portion (15, 15A, 15B, 15C, 15D). The first trimming groove (16, 16A, 16B, 16C, 16D) and the second trimming groove (17, 17A, 17B, 17C, 17D) are arranged along a first direction, which is the direction in which a pair of connecting portions (31, 32) are arranged. The first trimming groove (16, 16A, 16B, 16C, 16D) has a first straight portion (161, 16A1, 16B1, 16C1, 16D1) extending from a groove starting edge (14, 14A, 14B, 14C, 14D) of a resistance value adjusting portion (12, 12A, 12B, 12C, 12D) along a second direction perpendicular to the first direction. The second trimming groove (17, 17A, 17B, 17C, 17D) includes a second straight portion (17P1, 17A1, 17B1, 17C1, 17D1) extending from a groove starting edge (14, 14A, 14B, 14C, 14D) of the resistance value adjusting portion (12, 12A, 12B, 12C, 12D) along a second direction, and a bent portion (17P2, 17A2, 17B2, 17C2, 17D2) extending from a front end of the second straight portion (17P1, 17A1, 17B1, 17C1, 17D1) toward the first trimming groove (16, 16A, 16B, 16C, 16D).

[0129] According to this embodiment, the potential difference between both sides of each trimming groove in the meandering portion can be reduced, thereby forming a meandering pattern that can withstand a high potential difference.

[0130] In the chip resistor (1, 1A, 1B, 1C, 1D) of the second embodiment, based on the first embodiment, the second straight line portion (17P1, 17A1, 17B1, 17C1, 17D1) is longer than the first straight line portion (16P1, 16A1, 16B1, 16C1, 16D1) in the second direction.

[0131] According to this embodiment, the potential difference between both sides of each trimming groove in the meandering portion can be reduced, thereby forming a meandering pattern that can withstand a high potential difference.

[0132] In the chip resistor (1, 1A, 1B, 1C, 1D) of the third embodiment, based on the first or second embodiment, the bent portion (17P2, 17A2, 17B2, 17C2, 17D2) of the second trimming groove (17, 17A, 17B, 17C, 17D) is arranged on the opposite side of the groove starting edge (14, 14A, 14B, 14C, 14D) relative to the front end of the first straight portion (16P1, 16A1, 16B1, 16C1, 16D1) of the first trimming groove (16, 16A, 16B, 16C, 16D).

[0133] According to this embodiment, the potential difference between both sides of each trimming groove in the meandering portion can be reduced, thereby forming a meandering pattern that can withstand a high potential difference.

[0134] In the chip resistor (1, 1B, 1D) of the fourth embodiment, based on any one of the first to third embodiments, the bent portion (17P2, 17B2, 17D2) has a return portion (17P2, 17B2, 17D2) extending in a manner that returns relative to the second straight portion (17P1, 17A1, 17B1, 17C1, 17D1).

[0135] According to this embodiment, the potential difference between both sides of each trimming groove in the meandering portion can be reduced, thereby forming a meandering pattern that can withstand a high potential difference.

[0136] In the chip resistor (1B, 1D) of the fifth aspect, based on the fourth aspect, the return portion (17B2, 17D2) of the second trimming groove (17B, 17D) has an arc portion in at least a portion.

[0137] According to this aspect, since the folded portion has a circular arc portion in a part, microcracks are less likely to occur in the front end portion in the extending direction of the trimming groove.

[0138] In the chip resistor (1) of the sixth embodiment, based on the first to fifth embodiments, each of the pair of connecting portions (31, 32) has a connecting portion (8, 11) provided near the groove start edge and connected to the resistance value adjusting portion. When the length from the edge (49, 50) of the connecting portion (8, 11) on the side opposite to the groove start edge (14) to the front end of the second trimming groove (17) is set to a1, and the length from the edge (14) of the connecting portion (8, 11) to the front end of the first trimming groove (16) is set to b1, a1 / b1 ≥ 0.53 and a1 / b1 ≤ 1.30 are established.

[0139] According to this aspect, the potential difference between both sides of each trimmed groove can be reduced compared to the conventional example of two trimmed grooves, so that voltage breakdown in the groove portion is less likely to occur, and thus characteristic abnormalities can be suppressed.

[0140] (Sixth embodiment)

[0141] (6-1) Structure of chip resistors

[0142] Below, refer to Figure 9 A sixth embodiment will be described.

[0143] The chip resistor 101 is a surface mount (SMT) chip resistor mounted on the surface (mounting surface) of a printed circuit board using a surface mounter. In this embodiment, the chip resistor 101 is a thick film chip resistor as an example.

[0144] like Figure 9 As shown, chip resistor 101 includes an insulating substrate 102, a first upper surface electrode 103, a second upper surface electrode 104, and a resistor body 105. Although not shown, chip resistor 101 also includes a first lower surface electrode, a second lower surface electrode, a first end surface electrode, a second end surface electrode, a pair of first plating layers, and a pair of second plating layers. Although not shown, chip resistor 101 also includes a glass protective film and a resin protective film.

[0145] (6-2) Insulating substrate

[0146] The insulating substrate 102 is made of, for example, aluminum oxide containing 96% Al2O3 and has a rectangular shape (rectangular in plan view). The insulating substrate 102 has a long side along the Y-axis (first direction), a short side along the X-axis (second direction), and a thickness along the Z-axis. Figure 9 The upper right side of is set as the first side in the long side direction (the first side in the Y-axis direction), and Figure 9 The left lower side is set as the second side in the long side direction (the second side in the Y-axis direction), and Figure 9 The upper left side is set as the first side in the short side direction (the first side in the X-axis direction), and Figure 9 The lower right side is set as the second side in the short side direction (the second side in the X-axis direction).

[0147] It should be noted that the X-axis direction, the Y-axis direction, and the Z-axis direction are orthogonal to each other, but the orthogonal here refers to a concept including being substantially orthogonal, including a range of 90°±10°.

[0148] (6-3) Upper surface electrode

[0149] The first upper surface electrode 103 and the second upper surface electrode 104 are respectively provided at both ends in the longitudinal direction of the surface 121 of the insulating substrate 102 and are formed by printing and firing a thick film material containing a metal such as silver.

[0150] (6-4) Resistor

[0151] (6-4-1) Overview of Resistors

[0152] The resistor 105 is formed on the surface 211 (one surface) of the insulating substrate 102, between the first upper surface electrode 103 and the second upper surface electrode 104, and is connected to the first and second upper surface electrodes 103 and 104. The resistor 105 is formed, for example, by printing a thick film material composed of approximately 10 wt% lead ruthenate, approximately 53 wt% glass, and approximately 37 wt% solvent onto the surface 121 of the insulating substrate 102 and then firing it. The resistor 105 has a first edge 151 and a second edge 152 extending in the Y-axis direction. The first edge 151 is located on the second side in the Y-axis direction, and the second edge 152 is located on the first side in the Y-axis direction.

[0153] The resistor 105 has a meandering portion 106 , a first rectangular portion 107 , and a second rectangular portion 108 .

[0154] The meandering portion 106 is located in the middle of the longitudinal direction of the surface 121 of the insulating substrate 102, in other words, between the first upper surface electrode 103 and the second upper surface electrode 104. The meandering portion 106 includes a first recess 109 and a second recess 110. In the Y-axis direction, the first recess 109 is located on the first upper surface electrode 103 side, and the second recess 110 is located on the second upper surface electrode 104 side. The first recess 109 extends in the X-axis direction from the second edge 152 on the first side of the resistor 105 in the X-axis direction, while the second recess 110 extends in the X-axis direction from the first edge 151 on the second side of the resistor 105 in the X-axis direction. As a result, the meandering portion 106 has a two-fold meandering shape (approximately an S-shape).

[0155] The first rectangular portion 107 continues from the meandering portion 106 and is connected to the first upper surface electrode 103 .

[0156] The second rectangular portion 108 continues from the meandering portion 106 and is connected to the second upper surface electrode 104 .

[0157] (6-4-2) Rectangular part

[0158] (6-4-2-1) First rectangular portion

[0159] A first trimming groove 111 and a second trimming groove 112 are formed in the first rectangular portion 107. The first trimming groove 111 and the second trimming groove 112 extend parallel to each other along the X-axis from the first edge 151 of the first rectangular portion 107 and are linear. The first trimming groove 111 and the second trimming groove 112 give the first rectangular portion 107 a serpentine shape. The first trimming groove 111 and the second trimming groove 112 are formed within the first rectangular portion 107 near the first top electrode 103 (in a region closer to the first top electrode 103 than the center of the first rectangular portion 107 in the Y-axis direction).

[0160] The first trimming groove 111 is provided closer to the first upper surface electrode 103 than the second trimming groove 112 in the Y-axis direction.

[0161] The first trimming groove 111 is longer than the second trimming groove 112 . That is, the front end of the first trimming groove 111 is located closer to the second edge 152 than the front end of the second trimming groove 112 .

[0162] (6-4-2-2) Second rectangular part

[0163] A third trimming groove 113 and a fourth trimming groove 114 are formed in the second rectangular portion 108. The third trimming groove 113 and the fourth trimming groove 114 extend parallel to each other along the X-axis from the second edge 152 of the second rectangular portion 108 and are linear. The third trimming groove 113 and the fourth trimming groove 114 give the second rectangular portion 108 a serpentine shape. The third trimming groove 113 and the fourth trimming groove 114 are formed within the second rectangular portion 108 near the second top electrode 104 (in a region closer to the second top electrode 104 than the center of the second rectangular portion 108 in the Y-axis direction).

[0164] The third trimming groove 113 is provided closer to the second upper surface electrode 104 than the fourth trimming groove 114 in the Y-axis direction.

[0165] The third trimming groove 113 is longer than the fourth trimming groove 114 . That is, the front end of the third trimming groove 113 is located closer to the first edge 151 than the front end of the fourth trimming groove 114 .

[0166] (6-5) Effect

[0167] use Figure 10The effects of the chip resistor 101 will be described.

[0168] Figure 10 For example, the simulation results show the potential difference between the ends of the first trimming groove 111 and the second trimming groove 112 when the length of the first trimming groove 111 is fixed at 0.85 mm and the length of the second trimming groove 112 is changed within the range of 0 to 0.85 mm. Figure 10 In FIG. 1 , A1 represents the potential difference (250 V) when simulating a conventional case where there is only one trimming groove, V1 represents the potential difference of the first trimming groove 111 , and V2 represents the potential difference of the second trimming groove 112 .

[0169] according to Figure 10 Clearly, if the length of the second trimming groove 112 exceeds 0 mm, the potential difference is smaller than in the conventional case of a single groove. Furthermore, if the length of the second trimming groove 112 is less than 0.85 mm, the potential difference applied across the two sides of the multiple trimming grooves is smaller than in the case of the same length. Therefore, even when the chip resistor 101 is used at high voltage, dielectric breakdown in the trimming groove is less likely to occur, resulting in less characteristic abnormalities.

[0170] In particular, Figure 10 When the length of the second trimming groove 112 is 0.65 mm, the potential difference between the first trimming groove 111 and the second trimming groove 112 reaches 134 V. That is, the potential difference between the two trimming grooves with the larger potential difference is the smallest. Compared to the case of a single trimming groove, the potential difference between the two sides of each trimming groove in the rectangular portion can be significantly reduced. This allows the formation of a meandering pattern that can withstand a relatively high potential difference.

[0171] It should be noted that the optimal length of the second trimming groove 112 varies depending on the shape of the resistor, the position or length of the first trimming groove 111 and the second trimming groove 112 , and the like.

[0172] Generally, resistors are often covered with a resin or glass protective film, but their dielectric strength is around 1 kV / mm. The width of the trimming groove is typically 0.015 to 0.040 mm, so the dielectric strength of the protective film in the trimming groove is 150 to 400 V. Therefore, even at a potential difference of 250 V, as shown in simulations with only one trimming groove, dielectric breakdown can occur. However, by forming two trimming grooves of appropriate length, as in this embodiment, the potential difference can be reduced to below the protective film's withstand voltage of 134 V.

[0173] In this embodiment, trimming grooves are formed on both first rectangular portion 107 and second rectangular portion 108. This allows for adjustment of the resistance value near first upper surface electrode 103 and second upper surface electrode 104 on both sides, expanding the adjustable resistance range and improving resistance adjustment accuracy.

[0174] (6-6) Manufacturing method of chip resistors

[0175] Hereinafter, a method for manufacturing the chip resistor 101 will be described. However, for simplicity of description, only the formation of the first upper surface electrode 103 , the second upper surface electrode 104 , and the resistor 105 will be described.

[0176] First, electrode paste was screen-printed on both ends in the longitudinal direction of the insulating substrate 102 made of alumina, and fired at 850° C. to form the first upper surface electrode 103 and the second upper surface electrode 104 .

[0177] Next, a resistor paste is screen-printed between the first top electrode 103 and the second top electrode 104 and fired at 850°C to form the resistor 105. The resistor 105 comprises a meandering portion 106, a first rectangular portion 107, and a second rectangular portion 108. Finally, laser processing is used to form a first trimming groove 111 and a second trimming groove 112 in the first rectangular portion 107, and a third trimming groove 113 and a fourth trimming groove 114 in the second rectangular portion 108. It should be noted that the order of forming the first top electrode 103 and the second top electrode 104 and the resistor 105 can also be reversed.

[0178] (Seventh embodiment)

[0179] In the aforementioned sixth embodiment, the trimming groove is linear, but the shape of the trimming groove is not particularly limited.

[0180] use Figure 11 as well as Figure 12 A chip resistor 101A having a trimming groove having a shape different from that of the sixth embodiment will be described as a seventh embodiment. The basic structure of the chip resistor 101A is the same as that of the chip resistor 101 of the sixth embodiment, so the description will focus on the differences.

[0181] (7-1) Overview of Chip Resistors

[0182] like Figure 11 As shown, the chip resistor 101A includes an insulating substrate 102A, a first upper surface electrode 103A, a second upper surface electrode 104A, and a resistor 105A.

[0183] (7-2) Insulating substrate

[0184] The insulating substrate 102A is made of, for example, aluminum oxide containing 96% Al2O3 and has a rectangular shape (rectangular in plan view). The insulating substrate 102A has its long side along the Y axis, its short side along the X axis, and its thickness along the Z axis.

[0185] (7-3) Upper surface electrode

[0186] The first upper surface electrode 103A and the second upper surface electrode 104A are respectively provided at both ends in the longitudinal direction of the surface 121A of the insulating substrate 102A, and are formed by printing and firing a thick film material containing a metal such as silver.

[0187] (7-4) Resistor

[0188] (7-4-1) Overview of Resistors

[0189] Resistor 105A is formed on surface 121A of insulating substrate 102A between first upper surface electrode 103A and second upper surface electrode 104A, and is connected to first upper surface electrode 103A and second upper surface electrode 104A. Resistor 105A has a first edge 151A and a second edge 152A extending in the Y-axis direction. First edge 151A is located on the second side in the X-axis direction, and second edge 152A is located on the first side in the X-axis direction.

[0190] The resistor 105A has a meandering portion 106A, a first rectangular portion 107A, and a second rectangular portion 108A.

[0191] The meandering portion 106A is located in the middle of the longitudinal direction of the surface 121A of the insulating substrate 102A, in other words, between the first upper surface electrode 103A and the second upper surface electrode 104A. The meandering portion 106A has a first recess 109A and a second recess 110A. In the Y-axis direction, the first recess 109A is located on the first upper surface electrode 103A side, and the second recess 110A is located on the second upper surface electrode 104A side. The first recess 109A extends in the X-axis direction from the second edge 152A on the first side of the resistor 105A in the X-axis direction, while the second recess 110A extends in the X-axis direction from the first edge 151A on the second side of the resistor 105A in the X-axis direction. As a result, the meandering portion 106A has a two-fold meandering shape (roughly an S-shape).

[0192] The first rectangular portion 107A continues from the meandering portion 106A and is connected to the first upper surface electrode 103A.

[0193] The second rectangular portion 108A continues from the meandering portion 106A and is connected to the second upper surface electrode 104A.

[0194] (7-4-2) Rectangular part

[0195] (7-4-2-1) First rectangular portion

[0196] A first trimming groove 111A and a second trimming groove 112A are formed in the first rectangular portion 107A. The first trimming groove 111A and the second trimming groove 112A extend substantially parallel to each other along the X-axis direction from the first edge 151A of the first rectangular portion 107A. The first trimming groove 111A and the second trimming groove 112A give the first rectangular portion 107A a serpentine shape. The first trimming groove 111A and the second trimming groove 112A are formed within the first rectangular portion 107A near the first top electrode 103A (in a region closer to the first top electrode 103A than the center of the first rectangular portion 107 in the Y-axis direction).

[0197] The first trimming groove 111A is provided closer to the first upper surface electrode 103A side than the second trimming groove 112A in the Y-axis direction.

[0198] The first trimming groove 111A is longer than the second trimming groove 112A. That is, the front end of the first trimming groove 111A is located closer to the second edge 152A than the front end of the second trimming groove 112A.

[0199] The first trimming groove 111A includes a straight portion 211A and a tip portion 212A extending from the tip of the straight portion 211A toward the first upper surface electrode 103. Specifically, the tip portion 212A is linear and tilts from the straight portion 211A toward the first upper surface electrode 103A. The tilt angle of the tip portion 212A relative to the straight portion 211A is in the range of 30 to 60 degrees.

[0200] The second trimming groove 112A is linear.

[0201] (7-4-2-2) Second rectangular portion

[0202] A third trimming groove 113A and a fourth trimming groove 114A are formed in the second rectangular portion 108A. The third trimming groove 113A and the fourth trimming groove 114A extend substantially parallel to each other along the X-axis direction from the second edge 152A of the second rectangular portion 108A. The third trimming groove 113A and the fourth trimming groove 114A give the second rectangular portion 108A a serpentine shape. The third trimming groove 113A and the fourth trimming groove 114A are formed within the second rectangular portion 108A near the second top electrode 104A (in a region closer to the second top electrode 104A than the center of the second rectangular portion 108A in the Y-axis direction).

[0203] The third trimming groove 113A is provided closer to the second upper surface electrode 104A side than the fourth trimming groove 114A in the Y-axis direction.

[0204] The third trimming groove 113A is longer than the fourth trimming groove 114A. That is, the front end of the third trimming groove 113A is located closer to the first edge 151A than the front end of the fourth trimming groove 114A.

[0205] The third trimming groove 113A includes a straight portion 231A and a tip portion 232A extending from the tip of the straight portion 231A toward the second upper surface electrode 104. Specifically, the tip portion 232A is linear and tilts from the straight portion 231A toward the second upper surface electrode 104A. The tilt angle of the tip portion 232A relative to the straight portion 231A is in the range of 30 to 60 degrees.

[0206] The fourth trimming groove 114A is linear.

[0207] (7-5) Effect

[0208] (7-5-1)

[0209] In the seventh embodiment, similarly to the sixth embodiment, the potential difference between both sides of each trimming groove in the rectangular portion can be significantly reduced compared to the case of a single trimming groove, thereby forming a meandering pattern that can withstand a high potential difference.

[0210] (7-5-2)

[0211] In particular, in the seventh embodiment, by forming the front end portions 212A and 232A in the straight portion 211A and the straight portion 231A, respectively, current concentration at the front end of the trimming groove can be reduced. As a result, characteristic abnormalities caused by overload can be suppressed.

[0212] (7-5-3)

[0213] Generally, laser trimming tends to generate microcracks along the direction of laser trimming, resulting in resistance variation. However, in the seventh embodiment, the formation of the tip portion 212A and the tip portion 232A suppresses the resistance variation caused by microcracks, thereby reducing resistance variation in the product.

[0214] Figure 12 The resistance value variation rate is shown relative to the crack length. Figure 12 In the embodiment, A2 represents an example in which the trimming groove is not provided with an inclined front end portion, and A3 represents an example of the present embodiment in which the trimming groove is provided with an inclined front end portion. Figure 12 It is clear that the rate of change in resistance value with respect to the length of the microcrack can be reduced by providing the inclined front end portion.

[0215] (Eighth Embodiment)

[0216] In the aforementioned sixth and seventh embodiments, two trimming grooves are formed in one rectangular portion, but the number of trimming grooves may be two or more.

[0217] use Figure 13 A chip resistor 101B having three trimming grooves will be described as an eighth embodiment. The basic structure of the chip resistor 101B is the same as that of the chip resistor 101 according to the sixth embodiment, so the description will focus on the differences.

[0218] (8-1) Overview of Chip Resistors

[0219] like Figure 13 As shown, the chip resistor 101B includes an insulating substrate 102B, a first upper surface electrode 103B, a second upper surface electrode 104B, and a resistor body 105B.

[0220] (8-2) Insulating substrate

[0221] The insulating substrate 102B is made of, for example, aluminum oxide containing 96% Al2O3 and has a rectangular shape (rectangular in plan view). The insulating substrate 102B has its long side along the Y axis, its short side along the X axis, and its thickness along the Z axis.

[0222] (8-3) Upper surface electrode

[0223] The first upper surface electrode 103B and the second upper surface electrode 104B are respectively provided at both ends in the longitudinal direction of the surface 121B of the insulating substrate 102B, and are formed by printing and firing a thick film material containing a metal such as silver.

[0224] (8-4) Resistor

[0225] (8-4-1) Overview of Resistors

[0226] Resistor 105B is formed on surface 121B of insulating substrate 102B between first upper surface electrode 103B and second upper surface electrode 104B, and is connected to first upper surface electrode 103B and second upper surface electrode 104B. Resistor 105B has a first edge 151B and a second edge 152B extending in the Y-axis direction. First edge 151B is located on the second side in the X-axis direction, and second edge 152B is located on the first side in the X-axis direction.

[0227] The resistor 105B has a meandering portion 106B, a first rectangular portion 107B, and a second rectangular portion 108B.

[0228] The serpentine portion 106B is located in the middle of the longitudinal direction of the surface 121B of the insulating substrate 102B, in other words, between the first upper surface electrode 103B and the second upper surface electrode 104B. The serpentine portion 106B has a first recess 109B and a second recess 110B. In the Y-axis direction, the first recess 109B is located on the first upper surface electrode 103B side, and the second recess 110B is located on the second upper surface electrode 104B side. The first recess 109B extends in the X-axis direction from the second edge 152B on the first side of the resistor 105B in the X-axis direction, while the second recess 110B extends in the X-axis direction from the first edge 151B on the second side of the resistor 105B in the X-axis direction. As a result, the serpentine portion 106B has a two-fold serpentine shape (roughly an S-shape).

[0229] The first rectangular portion 107B continues from the meandering portion 106B and is connected to the first upper surface electrode 103B.

[0230] The second rectangular portion 108B continues from the meandering portion 106B and is connected to the second upper surface electrode 104B.

[0231] (8-4-2) Rectangular part

[0232] (8-4-2-1) First rectangular portion

[0233] A first trimming groove 111B, a second trimming groove 112B, and a fifth trimming groove 115B are formed in the first rectangular portion 107B. These first trimming grooves 111B, 112B, and 115B extend parallel to each other along the X-axis from the first edge 151B of the first rectangular portion 107B and are linear. These first trimming grooves 111B, 112B, and 115B give the first rectangular portion 107B a serpentine shape. The first trimming grooves 111B, 112B, and 115B are arranged in this order from the second side to the first side in the Y-axis direction. The first trimming grooves 111B, 112B, and 115B are formed within the first rectangular portion 107B near the first top electrode 103B (in a region closer to the first top electrode 103B than the center of the first rectangular portion 107 in the Y-axis direction).

[0234] The first trimming groove 111B is provided closer to the first upper surface electrode 103B than the second trimming groove 112B in the Y-axis direction.

[0235] The first trimming groove 111B is longer than the second trimming groove 112B. In other words, the front end of the first trimming groove 111B is located closer to the second edge 152B than the front end of the second trimming groove 112B.

[0236] The fifth trimming groove 115B is formed on the opposite side of the second trimming groove 112B from the first trimming groove 111B. The fifth trimming groove 115B is shorter than the second trimming groove 112B. As a result, three trimming grooves are formed in the first rectangular portion 107B, which become longer as they get closer to the first upper surface electrode 103B.

[0237] (8-4-2-2) Second rectangular part

[0238] The second rectangular portion 108B is formed with a third trimming groove 113B, a fourth trimming groove 114B, and a sixth trimming groove 116B. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B are arranged in this order from the first side to the second side in the Y-axis direction. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B extend parallel to the X-axis direction from the second edge 152B of the second rectangular portion 108B and are linear. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B give the second rectangular portion 108B a serpentine shape. The third trimming groove 113B, the fourth trimming groove 114B, and the sixth trimming groove 116B are formed within the second rectangular portion 108B near the second top electrode 104B (in a region closer to the second top electrode 104B than the center of the second rectangular portion 108B in the Y-axis direction).

[0239] The third trimming groove 113B is provided on the second upper surface electrode 104B side relative to the fourth trimming groove 114B in the Y-axis direction.

[0240] The third trimming groove 113B is longer than the fourth trimming groove 114B.

[0241] The sixth trimming groove 116B is formed on the side of the fourth trimming groove 114B opposite the second trimming groove 112B. The sixth trimming groove 116B is shorter than the fourth trimming groove 114B. As a result, three trimming grooves are formed in the second rectangular portion 108B, which become longer as they get closer to the second upper electrode 104B.

[0242] (8-5) Effect

[0243] (8-5-1)

[0244] In the eighth embodiment, similarly to the sixth embodiment, the potential difference between both sides of each trimming groove in the rectangular portion can be significantly reduced compared to the case of a single trimming groove, thereby forming a meandering pattern that can withstand a high potential difference.

[0245] (8-5-2)

[0246] In particular, in the eighth embodiment, since three trimming grooves are formed that become longer as they get closer to the electrodes as described above, the potential difference between both sides of the trimming groove can be further dispersed and reduced.

[0247] (8-6) Modification of the Eighth Embodiment

[0248] The first trimming groove 111B and the third trimming groove 113B may have leading end portions formed thereon as in the seventh embodiment.

[0249] (Ninth embodiment)

[0250] In the sixth to eighth embodiments, the trimming grooves are formed in both rectangular portions, but may be formed in only one rectangular portion.

[0251] use Figure 14 A chip resistor 101C having a trimming groove formed only in one rectangular portion will be described as a ninth embodiment. The basic structure of the chip resistor 101C is the same as that of the chip resistor 101 of the sixth embodiment, so the description will focus on the differences.

[0252] (9-1) Overview of Chip Resistors

[0253] like Figure 14 As shown, the chip resistor 101C includes an insulating substrate 102C, a first upper surface electrode 103C, a second upper surface electrode 104C, and a resistor body 105C.

[0254] (9-2) Insulating substrate

[0255] The insulating substrate 102C is made of, for example, aluminum oxide containing 96% Al2O3 and has a rectangular shape (rectangular in plan view). The insulating substrate 102C has its long side along the Y axis, its short side along the X axis, and its thickness along the Z axis.

[0256] (9-3) Upper surface electrode

[0257] The first upper surface electrode 103C and the second upper surface electrode 104C are respectively provided at both ends in the longitudinal direction of the surface 121C of the insulating substrate 102C, and are formed by printing and firing a thick film material containing a metal such as silver.

[0258] (9-4) Resistor

[0259] (9-4-1) Overview of Resistors

[0260] Resistor 105C is formed on surface 121C of insulating substrate 102C between first upper surface electrode 103C and second upper surface electrode 104C, and is connected to first upper surface electrode 103C and second upper surface electrode 104C. Resistor 105C has a first edge 151C and a second edge 152C extending in the Y-axis direction. First edge 151C is located on the second side in the X-axis direction, and second edge 152C is located on the first side in the X-axis direction.

[0261] The resistor 105C has a meandering portion 106C and a rectangular portion 107C.

[0262] The meandering portion 106C is located in the middle of the longitudinal direction of the surface 121C of the insulating substrate 102C, in other words, between the first top electrode 103C and the second top electrode 104C. The meandering portion 106C includes a first recess 109C, a second recess 110C, and a third recess 117C. The first recess 109C, the second recess 110C, and the third recess 117C are arranged in this order from the second side to the first side in the Y-axis direction. In the Y-axis direction, the first recess 109C is located on the first top electrode 103B side, the third recess 117C is located on the second top electrode 104C side, and the second recess 110C is located between the first recess 109C and the third recess 117C. The first recess 109C extends in the X-axis direction from the second edge 152C on the first side of the resistor 105C in the X-axis direction. Second recess 110C extends along the X-axis from first edge 151C on the second side of resistor 105C in the X-axis direction. Third recess 117C extends along the X-axis from second edge 152C on the first side of resistor 105C in the X-axis direction. Thus, meandering portion 106C has a three-fold meandering shape.

[0263] The rectangular portion 107C continues from the meandering portion 106C and is connected to the first upper surface electrode 103C.

[0264] (9-4-2) Rectangular part

[0265] A first trimming groove 111C and a second trimming groove 112C are formed in the rectangular portion 107C. The first trimming groove 111C and the second trimming groove 112C extend parallel to each other along the X-axis from the first edge 151C of the rectangular portion 107C and are linear. The first trimming groove 111C and the second trimming groove 112C give the rectangular portion 107C a serpentine shape. The first trimming groove 111C and the second trimming groove 112C are formed within the rectangular portion 107C near the first top electrode 103C (in a region closer to the first top electrode 103C than the center of the first rectangular portion 107 in the Y-axis direction).

[0266] The first trimming groove 111C is provided closer to the first upper surface electrode 103C than the second trimming groove 112C in the Y-axis direction.

[0267] The first trimming groove 111C is longer than the second trimming groove 112C. That is, the front end of the first trimming groove 111C is located closer to the second edge 152C than the front end of the second trimming groove 112C.

[0268] (9-5) Effect

[0269] In the ninth embodiment, similarly to the sixth embodiment, the potential difference between both sides of each trimming groove in the rectangular portion can be significantly reduced compared to the case of a single trimming groove, thereby forming a meandering pattern that can withstand a high potential difference.

[0270] (9-6) Modification of the Ninth Embodiment

[0271] The first trimming groove 111B and the third trimming groove 113B may have leading end portions formed thereon as in the seventh embodiment.

[0272] The number of trimming grooves formed in the rectangular portion may be three as in the eighth embodiment.

[0273] (Variation)

[0274] The above-mentioned embodiments are merely one of various embodiments of the present invention. As long as the above-mentioned embodiments can achieve the purpose of the present invention, various modifications can be made according to design, etc. The following lists modifications of the above-mentioned embodiments. The modifications described below can be appropriately combined and applied.

[0275] The chip resistor 101 may also be a thin film chip resistor.

[0276] The number of trimming grooves is not particularly limited.

[0277] The trimming groove may include curves or other shapes in addition to straight lines.

[0278] (plan)

[0279] The following aspects are disclosed in this specification.

[0280] A chip resistor (101, 101A, 101B, 101C) according to a seventh aspect includes a substrate (102, 102A, 102B, 102C), a first electrode (103, 103A, 103B, 103C), a second electrode (104, 104A, 104B, 104C), and a resistor (105, 105A, 105B, 105C). The first electrode (103, 103A, 103B, 103C) and the second electrode (104, 104A, 104B, 104C) are provided at both ends in a first direction (Y) of a surface (121, 121A, 121B, 121C) of the substrate (102, 102A, 102B, 102C). A resistor (105, 105A, 105B, 105C) is provided between a first electrode (103, 103A, 103B, 103C) and a second electrode (104, 104A, 104B, 104C) on one surface (121, 121A, 121B, 121C) of a substrate (102, 102A, 102B, 102C). The resistor (105, 105A, 105B, 105C) includes a meander portion (106, 106A, 106B, 106C) and a rectangular portion (107, 107A, 107B, 107C) connected to the meander portion (106, 106A, 106B, 106C) and the first electrode (103, 103A, 103B, 103C). A first trimming groove (111, 111A, 111B, 111C) and a second trimming groove (112, 112A, 112B, 112C) are formed in a rectangular portion (107, 107A, 107B, 107C), and the rectangular portion (107, 107A, 107B, 107C) is formed into a meandering shape by extending an edge (151, 151A, 151B, 151C) extending in a first direction (Y) from the rectangular portion (107, 107A, 107B, 107C) along a second direction (X) orthogonal to the first direction (Y).

[0281] This configuration reduces the potential difference across the trimming groove, making dielectric breakdown less likely to occur in the trimming groove even when the chip resistor is used at high voltage. Consequently, a chip resistor with less characteristic abnormalities and excellent resistance value accuracy is obtained.

[0282] In the chip resistor (101, 101A, 101B, 101C) of the eighth aspect, in addition to the seventh aspect, the first trimming groove (111, 111A, 111B, 111C) is formed closer to the first electrode (103, 103A, 103B, 103C) than the second trimming groove (112, 112A, 112B, 112C) in the first direction (Y). The first trimming groove (111, 111A, 111B, 111C) is longer than the second trimming groove (112, 112A, 112B, 112C).

[0283] According to this aspect, the potential difference applied to both sides of the plurality of trimming grooves can be reduced compared to the case where the trimming grooves have the same length, so that dielectric breakdown is less likely to occur.

[0284] In the chip resistor (101A) of the ninth aspect, based on the eighth aspect, the first trimming groove (111A) has a straight portion (211A) and a front end portion (212A) extending from the front end of the straight portion (211A) toward the first electrode (103A).

[0285] This solution reduces current concentration at the tip of the trimming groove, thereby suppressing characteristic abnormalities caused by overload. Furthermore, laser trimming generally tends to cause microcracks along the direction of travel, resulting in resistance variations. However, this solution, by providing an inclined tip, suppresses resistance variations caused by microcracks, thereby reducing resistance variations within the chip resistor.

[0286] In the chip resistor (101, 101A, 101B) of the tenth aspect, in addition to any one of the seventh to ninth aspects, the rectangular portion (107, 107A, 107B) is a first rectangular portion (107, 107A, 107B), and the edge (151, 151A, 151B, 151C) is a first edge (151, 151A, 151B, 151C). The chip resistor (101, 101A, 101B) further includes a second rectangular portion (108, 108A, 108B) connected to the second electrode (104, 104A, 104B), and a third trimming groove (113, 113A, 113B) and a fourth trimming groove (114, 114A, 114B) formed in the second rectangular portion (108, 108A, 108B) and extending along the second direction (X) from a second edge (152, 152A, 152B) of the second rectangular portion (108, 108A, 108B) extending along the first direction (Y).

[0287] According to this embodiment, by adjusting the resistance value near the electrodes on both sides, the adjustable resistance range can be expanded, and the resistance adjustment accuracy can be improved.

[0288] In the chip resistor (101, 101A, 101B) of the eleventh aspect, in addition to the tenth aspect, the third trimming groove (113, 113A, 113B) is provided closer to the remaining electrode than the fourth trimming groove (114, 114A, 114B) in the first direction (Y). The third trimming groove (113, 113A, 113B) is longer than the fourth trimming groove (114, 114A, 114B).

[0289] According to this aspect, the potential difference applied to both sides of the plurality of trimming grooves can be reduced compared to the case where the trimming grooves have the same length, so that dielectric breakdown is less likely to occur.

[0290] In the chip resistor (101A) of the twelfth embodiment, based on the eleventh embodiment, the third trimming groove (113A) has a straight portion (231A) and a front end portion (232A) extending from the front end of the straight portion (231A) toward the second electrode (104A).

[0291] This solution reduces current concentration at the tip of the trimming groove, thereby suppressing characteristic abnormalities caused by overload. Furthermore, laser trimming generally tends to cause microcracks along the direction of travel, resulting in resistance variations. However, this solution, by providing an inclined tip, suppresses resistance variations caused by microcracks, thereby reducing resistance variations within the chip resistor.

[0292] The manufacturing method of the chip resistor (101, 101A, 101B, 101C) of the thirteenth scheme includes the following steps: forming a first electrode (103, 103A, 103B, 103C) and a second electrode (104, 104A, 104B, 104C) at both ends of a first direction (Y) of a surface of a substrate (102, 102A, 102B, 102C); forming a serpentine portion (106, 106A, 106B, 106C) and a serpentine portion (106, 106A, 106B, 106C) in the middle of a first direction of a surface (121, 121A, 121B, 121C) of the substrate (102, 102A, 102B, 102C) 103B, 103C); and a first trimming groove (111, 111A, 111B, 111C) and a second trimming groove (112, 112A, 112B, 112C) are formed in the rectangular portion (107, 107A, 107B, 107C) to form a serpentine shape of the rectangular portion (107, 107A, 107B, 107C) extending from an edge (151, 151A, 151B, 151C) extending in a first direction (Y) of the rectangular portion (107, 107A, 107B, 107C) along a second direction (X) perpendicular to the first direction (Y).

[0293] This configuration reduces the potential difference between the two sides of the trimming groove, making dielectric breakdown less likely to occur in the trimming groove even when the chip resistor is used at high voltage. Consequently, a chip resistor with less characteristic abnormalities and excellent resistance value accuracy is obtained.

[0294] A fourteenth aspect of the present invention relates to a method for manufacturing a chip resistor (101, 101A, 101B, 101C) according to the thirteenth aspect, wherein the first trimming groove (111, 111A, 111B, 111C) is formed closer to one electrode than the second trimming groove (112, 112A, 112B, 112C) in the first direction (Y). The first trimming groove (111, 111A, 111B, 111C) is longer than the second trimming groove (112, 112A, 112B, 112C).

[0295] According to this aspect, the potential difference applied to both sides of the plurality of trimming grooves can be reduced compared to the case where the trimming grooves have the same length, so that dielectric breakdown is less likely to occur.

[0296] In the manufacturing method of the chip resistor (101A) of the fifteenth embodiment, based on the fourteenth embodiment, the first trimming groove (111A) has a straight portion (211A) and a front end portion (212A) extending from the front end of the straight portion (211A) toward the first electrode (103A).

[0297] This solution reduces current concentration at the tip of the trimming groove, thereby suppressing characteristic abnormalities caused by overload. Furthermore, laser trimming generally tends to cause microcracks along the direction of travel, resulting in resistance variations. However, this solution, by placing an inclined tip in the trimming groove, suppresses resistance variations caused by microcracks, thereby reducing resistance variations within the chip resistor.

[0298] Description of Reference Numerals

[0299] 1, 1A, 1B, 1C, 1D chip resistors

[0300] 2, 2B, 2C, 2D Insulating substrate (substrate)

[0301] 3.3C First upper surface electrode (electrode)

[0302] 4.4C Second upper surface electrode (electrode)

[0303] 5, 5B, 5C, 5D resistors

[0304] 11 Sixth rectangular portion (connecting portion)

[0305] 11C connection part

[0306] 12, 12A, 12B, 12C, 12D resistance adjustment section

[0307] 14, 14A, 14B, 14C, 14D Second edge (groove start edge)

[0308] 15, 15A, 15B, 15C, 15D: Meandering formation

[0309] 16, 16A, 16B, 16C, 16D first trimming groove

[0310] 17, 17A, 17B, 17C, 17D Second trimming groove

[0311] 16P1, 16A1, 16B1, 16C1, 16D1 First straight line

[0312] 17P1, 17A1, 17B1, 17C1, 17D1 Second straight line

[0313] 17P2, 17A2, 17B2, 17C2, 17D2 bending part

[0314] 21, 21C surface

[0315] 31 First connection

[0316] 32 Second connection

[0317] 49 Fate

[0318] 50 Fate

[0319] 101, 101A, 101B, 101C chip resistors

[0320] 102, 102A, 102B, 102C insulating substrate

[0321] 103, 103A, 103B, 103C first upper surface electrode

[0322] 104, 104A, 104B, 104C second upper surface electrode

[0323] 105, 105A, 105B, 105C resistors

[0324] 106, 106A, 106B, 106C winding part

[0325] 107, 107A, 107B first rectangular portion

[0326] 107C rectangular part

[0327] 108, 108A, 108B second rectangular portion

[0328] 111, 111A, 111B, 111C first trimming groove

[0329] 112, 112A, 112B, 112C Second trimming groove

[0330] 113, 113A, 113B Third trimming groove

[0331] 114, 114A, 114B Fourth trimming groove

[0332] 115B Fifth trimming slot

[0333] 116B Sixth trimming groove.

Claims

1. A chip resistor, wherein: The chip resistor has: substrate; a pair of electrodes disposed at both ends of one side of the substrate; and a resistor provided between the pair of electrodes on the one side of the substrate, The resistor has: a pair of connecting portions, which are respectively connected to the pair of electrodes and arranged along a first direction; and a resistance value adjusting portion provided between the pair of connecting portions, The resistance value adjusting portion includes a meandering portion for forming the resistance value adjusting portion into a meandering shape. A first trimming groove and a second trimming groove are formed in the meandering portion. The first trimming groove and the second trimming groove are arranged along the first direction, The first trimming groove has a first straight portion extending from a groove starting edge of the resistance value adjusting portion along a second direction perpendicular to the first direction. The second trimming groove includes a second straight portion extending from the groove starting edge of the resistance value adjusting portion along the second direction, and a bent portion extending from a front end of the second straight portion toward the first trimming groove.

2. The chip resistor according to claim 1, wherein The second straight line portion is longer than the first straight line portion in the second direction.

3. The chip resistor according to claim 1 or 2, wherein: The bent portion of the second trimming groove is arranged on the opposite side of the groove starting edge with respect to the front end of the first straight portion of the first trimming groove.

4. The chip resistor according to any one of claims 1 to 3, wherein The bent portion includes a folded portion extending so as to fold back with respect to the second straight portion.

5. The chip resistor according to claim 4, wherein The folded portion of the second trimming groove has an arc portion at least in a portion thereof.

6. The chip resistor according to any one of claims 1 to 5, wherein Each of the pair of connecting portions has a connecting portion provided near the groove start edge and connected to the resistance value adjusting portion. When a1 is the length from the edge of the connecting portion opposite to the groove start edge to the front end of the second trimming groove, and b1 is the length from the edge of the connecting portion to the front end of the first trimming groove, a1 / b1≥0.53 and a1 / b1≤1.30 holds.

7. A chip resistor, wherein: The chip resistor has: substrate; A first electrode and a second electrode are provided at two ends of a first direction of one surface of the substrate; and a resistor provided between the first electrode and the second electrode on the one side of the substrate, The resistor has: a meander; and a first rectangular portion connected to the meandering portion and the first electrode; The first rectangular portion includes a first trimming groove and a second trimming groove formed therein. The first trimming groove and the second trimming groove extend from a first edge of the first rectangular portion extending in the first direction in a second direction perpendicular to the first direction, thereby giving the first rectangular portion a meandering shape.

8. The chip resistor according to claim 7, wherein The first trimming groove is formed at a position closer to the first electrode than the second trimming groove in the first direction. The first trimming groove is longer than the second trimming groove.

9. The chip resistor according to claim 8, wherein The first trimming groove has: straight portion; and A front end portion extends from a front end of the straight portion toward the first electrode.

10. The chip resistor according to any one of claims 7 to 9, wherein a second rectangular portion connected to the second electrode, The second rectangular portion includes a third trimming groove and a fourth trimming groove formed therein. The third trimming groove and the fourth trimming groove extend along the second direction from a second edge of the second rectangular portion extending along the first direction.

11. The chip resistor according to claim 10, wherein The third trimming groove is provided at a position closer to the second electrode than the fourth trimming groove in the first direction. The third trimming groove is longer than the fourth trimming groove.

12. The chip resistor according to claim 11, wherein The third trimming groove has: straight portion; and A front end portion extends from a front end of the straight portion toward the second electrode.

13. A method for manufacturing a chip resistor, wherein: The manufacturing method of the chip resistor includes the following steps: forming a first electrode and a second electrode at two ends in a first direction of one side of the substrate; A resistor having a meandering portion and a rectangular portion connected to the meandering portion and the first electrode is formed in the middle of the first direction of the one surface of the substrate; as well as The rectangular portion is formed with a first trimming groove and a second trimming groove that extend from an edge of the rectangular portion extending in the first direction in a second direction perpendicular to the first direction so as to give the rectangular portion a meandering shape.

14. The method for manufacturing a chip resistor according to claim 13, wherein: The first trimming groove is formed at a position closer to the one electrode than the second trimming groove in the first direction. The first trimming groove is longer than the second trimming groove.

15. The method for manufacturing a chip resistor according to claim 14, wherein: The first trimming groove has: straight portion; and A front end portion extends from a front end of the straight portion toward the first electrode.

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