Refrigeration shoe

Abstract

The invention discloses a refrigeration shoe which comprises a sole, an insole and a vamp, and the sole is provided with a semiconductor refrigeration unit; the insole comprises a cold conduction layer assembly and a supporting layer assembly, the cold conduction layer assembly is connected to the supporting layer assembly, and part of the cold conduction layer assembly is located below the supporting layer assembly. The cold conduction layer assembly is used for conducting cold energy to the upper surface of the insole; the vamp is connected to the sole to form a wearing space, and the insole is arranged at the bottom of the wearing space. According to the refrigeration shoe, the semiconductor refrigeration technology is combined with a shoe product, and the function and comfort are balanced through the layered design of the cold conduction layer and the supporting layer. According to the refrigeration shoe, through the combination of semiconductor refrigeration and efficient cold conduction, local cooling of the foot is achieved, and the core purpose is to improve the wearing comfort in the high-temperature environment. According to the design, a refrigeration unit, a cold conduction system and a wearing structure are integrated into a shoe body, and a complete link of cold generation, cold transfer and cold utilization is formed.

Description

Technical Field

[0001] The present invention relates to the technical field of footwear, in particular to a pair of cooling shoes. Background Art

[0002] As living standards improve, consumers are demanding more comfortable footwear, hats, and apparel. In hot environments or during exercise, feet easily sweat and accumulate heat, causing discomfort and potentially even foot problems. Traditional footwear cooling methods rely primarily on vents in the upper or sweat-absorbing materials in the insole. However, these methods only achieve limited cooling and fail to actively reduce the temperature inside the shoe, making them difficult to meet the demands of high-temperature environments.

[0003] Traditional footwear can easily cause sweating and stuffiness in hot environments or during strenuous exercise, compromising comfort and hygiene. Existing cooling shoes often rely on passive ventilation, which has limited cooling effectiveness. The few solutions that utilize semiconductor cooling suffer from low heat transfer efficiency, poor heat dissipation, and limited battery life.

[0004] To this end, the present invention provides a cooling shoe that can effectively solve the above problems. Summary of the Invention

[0005] In order to overcome the shortcomings of the existing technology, the present invention provides a cooling shoe with a simple structure, high cold conduction efficiency, good heat dissipation performance, and long battery life. It effectively ensures uniform and effective heat dissipation of the user's feet, thereby avoiding the problem of bacterial growth caused by moisture in the shoe cavity due to sweating of the feet, and is comfortable to wear.

[0006] The technical solution adopted by the present invention to solve its technical problem is:

[0007] A cooling shoe, comprising:

[0008] A sole, wherein the sole is provided with a semiconductor refrigeration unit;

[0009] An insole comprising a cooling layer assembly and a supporting layer assembly, wherein the cooling layer assembly is connected to the supporting layer assembly, with a portion of the cooling layer assembly located below the supporting layer assembly and a portion of the cooling layer assembly located above the supporting layer assembly; the cooling layer assembly is configured to conduct cooling to an upper surface of the insole;

[0010] The shoe upper is connected to the shoe sole to form a wearing space, and the insole is arranged at the bottom of the wearing space.

[0011] As an improvement of the present invention, the sole is also provided with a heat dissipation fan, the support layer assembly includes a support protrusion, an air guide groove and a ventilation unit, the ventilation unit is arranged in the air guide groove, the air guide groove is defined by the support protrusion, the semiconductor refrigeration unit includes a cooling end, one end of the cooling layer assembly is located on the upper surface of the insole, and the other end is located on the lower surface of the insole and is in contact with the cooling end of the semiconductor refrigeration unit; the cooling layer assembly extends from near the semiconductor refrigeration unit along the support protrusion toward the toe, forming a plurality of block-shaped cooling areas, the ventilation unit is connected to the wearing space, and the heat dissipation fan enables the airflow to pass through the cooling layer assembly, through the ventilation unit, and finally discharged out of the shoe through the heat dissipation fan.

[0012] As an improvement of the present invention, the cooling area of the cooling layer component placed below the support layer component is smaller than the cooling area of the upper part, so that the cooling capacity is expanded from a small area to a relatively large area; the air guide grooves and the ventilation units between the multiple block-shaped cooling areas are used to ensure that the airflow passes through the cooling layer component smoothly, thereby realizing air circulation and heat dissipation in the shoe.

[0013] As an improvement of the present invention, the semiconductor refrigeration unit includes a cooling end, the cooling layer assembly includes a first cooling element, the first cooling element includes a fitting end and a conduction end, the fitting end is located below the support layer assembly, and the conduction end is located above the support layer assembly, the support layer assembly includes a connecting element, the fitting end is fitted with the cooling end, the connecting element is used to allow the cold from the fitting end to pass through the support layer assembly to reach the conduction end, and the conduction end is used to conduct the cold to the upper surface of the insole.

[0014] As an improvement of the present invention, the cooling layer assembly includes a second cooling element, which includes a connecting end and a diffusion end. The connecting end is in contact with the conducting end, and the diffusion end is used to conduct the cold to the upper surface of the insole.

[0015] As an improvement of the present invention, the sole is further provided with a heat dissipation element, which includes a heat dissipation connection end and a heat dissipation terminal. The semiconductor refrigeration unit also includes a heat dissipation end, which is connected to the heat dissipation connection end.

[0016] As an improvement of the present invention, the sole is further provided with a flexible heat-conducting layer, and the heat dissipation end is connected to the heat dissipation connection end through the flexible heat-conducting layer; the heat dissipation fan uses airflow to blow the heat of the heat dissipation terminal out of the shoe.

[0017] As an improvement of the present invention, it further includes a plug-in power supply, which is detachably connected to the sole and supports wireless charging;

[0018] As an improvement of the present invention, the heat dissipation fan includes a motor and fan blades, and the motor and the fan blades are detachably connected to the sole.

[0019] A temperature monitoring device inside a shoe is applied to cooling shoes. The temperature monitoring device inside the shoe comprises a temperature sensor. The temperature sensor comprises a temperature sensing probe. The temperature sensing probe is suspended in the air, and the space around the temperature sensing probe is connected to the wearing space.

[0020] The beneficial effect of this invention is that, through the above-mentioned structure, semiconductor refrigeration technology is integrated with footwear during use, and the layered design of the cooling layer and support layer balances functionality and comfort. This cooling shoe achieves localized cooling of the foot through the combination of "semiconductor refrigeration + efficient cooling conduction," with the core purpose of improving wearing comfort in high-temperature environments. Its design integrates the refrigeration unit, cooling system, and wearing structure into the shoe body, forming a complete chain of "cooling generation-transmission-use." BRIEF DESCRIPTION OF THE DRAWINGS

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. The drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the various components in the drawings are drawn for illustrative purposes only and are not necessarily drawn to scale.

[0022] The present invention will be further described below with reference to the accompanying drawings and examples.

[0023] Figure 1 This is a schematic diagram of the overall structure of the cooling shoe of the present invention from a first angle;

[0024] Figure 2 This is a schematic diagram of the overall structure of the cooling shoe of the present invention from a second angle;

[0025] Figure 3 It is a schematic cross-sectional view of the cooling shoe of the present invention;

[0026] Figure 4 This is a schematic diagram of the exploded structure of the refrigeration shoe of the present invention at a first angle;

[0027] Figure 5 This is a schematic diagram of the exploded structure of the refrigeration shoe of the present invention at a second angle;

[0028] Figure 6 Schematic diagram of the exploded structure of the cooling fan 140 of the cooling shoe of the present invention;

[0029] Figure 7This is a schematic diagram of the exploded structure of the cooling shoe of the present invention from a first perspective;

[0030] Figure 8 This is a schematic diagram of the exploded structure of the cooling shoe of the present invention from a second viewing angle;

[0031] Figure 9 1 is a schematic diagram of airflow circulation at a first angle when the heat dissipation fan 140 of the cooling shoe of the present invention is turned on;

[0032] Figure 10 1 is a schematic diagram of air flow circulation at a second angle when the heat dissipation fan 140 of the cooling shoe of the present invention is turned on.

[0033] Description of the accompanying drawings:

[0034] 100, sole; 200, insole; 300, upper; 400, wearable space; 500, plug-in power supply; 600, control circuit board; 110, semiconductor refrigeration unit; 111, cooling end; 112, heat dissipation end; 120, heat dissipation element; 121, heat dissipation connection end; 122, heat dissipation terminal; 130, flexible thermal conductive layer; 140, heat dissipation fan; 141, motor; 142, fan blade; 150, electrically insulating thermal conductive layer; 210, cooling Layer assembly; 211, first cooling element; 2111, fitting end; 2112, conduction end; 212, second cooling element; 2121, connection end; 2122, diffusion end; 213, third cooling element; 2131, connection terminal; 2132, diffusion terminal; 220, supporting layer assembly; 221, connecting element; 222, supporting protrusion; 223, air guide groove; 224, ventilation unit; 10, temperature sensor; 11, temperature probe. DETAILED DESCRIPTION

[0035] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0036] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0037] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0038] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0039] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0041] Reference Figures 1 to 10 , a cooling shoe, comprising:

[0042] A sole 100, wherein the sole 100 is provided with a semiconductor refrigeration unit 110;

[0043] The insole 200 includes a cooling layer assembly 210 and a support layer assembly 220. The cooling layer assembly 210 is connected to the support layer assembly 220 and is located below the support layer assembly 220. The cooling layer assembly 210 is used to conduct cold air to the upper surface of the insole 200.

[0044] The upper 300 is connected to the sole 100 to form a wearing space 400 , and the insole 200 is disposed at the bottom of the wearing space 400 .

[0045] Through the setting of the above structure, when in use, local cooling of the foot is achieved through "semiconductor refrigeration + gradient thermal conductive insole", and the core innovation lies in the balance between thermal management efficiency and wearing comfort. The present invention constructs a complete thermal management system of "producing cold-transmitting cold-using cold" through the semiconductor refrigeration unit 110 (based on the Peltier effect) integrated in the sole 100, the layered structure of "the cooling layer component 210 and the supporting layer component 220" of the insole 200, and the wearing space 400 formed by the upper 300 and the sole 100, thereby achieving local cooling of the foot in a high temperature environment. It should be noted that the insole 200 of the present invention can be partially or completely integrated with the sole 100, and the cooling layer component 210 and the supporting layer component 220 can also be partially or completely integrated.

[0046] In this embodiment, the sole 100 is further provided with a heat dissipation fan 140, the support layer component 220 includes a support protrusion 222, an air guide groove 223 and a ventilation unit 224, the ventilation unit 224 is arranged in the air guide groove 223, the air guide groove 223 is defined by the support protrusion 222, the semiconductor refrigeration unit 110 includes a cooling end 111, one end of the cooling layer component 210 is located on the upper surface of the insole (200), and the other end is located on the lower surface of the insole 200 and is in contact with the cooling end of the semiconductor refrigeration unit 110; the cooling layer component 210 extends from a position close to the semiconductor refrigeration unit 110 along the support protrusion 222 toward the toe of the shoe to form a plurality of block-shaped cooling areas, the ventilation unit 224 is connected to the wearing space 400, and the heat dissipation fan 140 enables airflow to pass through the cooling layer component (210), pass through the ventilation unit 224, and finally be discharged out of the shoe through the heat dissipation fan 140. It should be noted that the first cooling element 211 of the present invention passes through the support layer assembly 220 through the connecting element 221 (that is, the connecting element 221 exists in the form of a through hole. In fact, a lateral groove can be opened at the position where the cold energy of the fitting end 2111 needs to pass through the support layer assembly 220 to be delivered to the conduction end 2112, and the connecting element 221 can be made by bending the material with high thermal conductivity to connect the fitting end 2111 and the conduction end 2112, or the material with high thermal conductivity can be directly used at the corresponding position of the support layer assembly 220 for local replacement, that is, the fitting end 2111 and the conduction end 2112 are connected together by locally using the connecting element 221 with high thermal conductivity), so the loss of cold energy transmitted from the support layer assembly 220 to the conduction end 2112 is extremely low. The sole 100 of the present invention is also provided with an electrically insulating and heat-conductive layer 150. Due to the above-described structural arrangement, during use, the bonding end 2111 and the cooling end 111 are not bonded directly (direct bonding is also possible), but rather indirectly bonded via the electrically insulating and heat-conductive layer 150. This is done primarily to form a flexible buffer layer to prevent scratches on the semiconductor edges and corners, which could cause wear on the bonding end 2111. To further enhance safety, the electrically insulating and heat-conductive layer 150 is made of a material with good thermal conductivity and is nearly electrically insulating. In this embodiment, the electrically insulating and heat-conductive layer 150 is formed from thermally conductive silicone grease.In addition, the electrically insulating heat-conducting layer 150 made of the thermally conductive silicone grease can also fill the microscopic gap between the contact surface of the fitting end 2111 and the cooling end 111, reduce thermal resistance, and improve cold conduction efficiency (because the surfaces of the cooling end 111 and the fitting end 2111 are not absolutely flat, there are small bumps or gaps, and the thermally conductive silicone grease has the characteristics of high thermal conductivity and low viscosity, which can tightly fill the gaps and form a continuous cold conduction path, avoiding the heat conduction loss caused by air stagnation, thereby improving cold conduction efficiency). In addition, the thermally conductive silicone grease has insulation properties, which can ensure the electrical safety of the semiconductor refrigeration unit when it is working, and its temperature resistance and chemical stability can adapt to the use environment (such as mechanical extrusion, temperature fluctuation) inside the sole. In actual production applications, it is necessary to pay attention to the control of the coating thickness (too thick will increase thermal resistance), and it is possible to consider adding a waterproof sealing layer on the outside of the silicone grease (the present embodiment is actually produced, and a waterproof sealing layer is made at the fitting edge with glue) to prevent water vapor from intruding and affecting thermal conductivity or causing a short circuit, thereby optimizing the overall energy efficiency of the refrigeration system. It should be noted that both the cooling layer assembly 210 and the support layer assembly 220 are made of flexible materials. The support layer assembly 220 is made of flexible material, providing support and buffering for the foot, while keeping the air guide groove 223 from deforming slightly. The cooling area of the cooling layer assembly 210 below the support layer assembly 220 is smaller than the cooling area of the upper portion, so that the cooling capacity is expanded from a small area to a relatively large area; the air guide grooves 223 and the ventilation units 224 between the multiple block-shaped cooling areas are used to ensure that the airflow passes smoothly through the cooling layer assembly 210, thereby achieving air circulation and heat dissipation in the shoe.

[0047] In this embodiment, the cooling layer assembly 210 includes a second cooling element 212, which includes a connecting end 2121 and a diffusion end 2122. The connecting end 2121 is in contact with the conduction end 2112, and the diffusion end 2122 is used to conduct the cold to the upper surface of the insole 200. Through the above-mentioned structure, when in use, a second cooling element 212 is added on the basis of the first cooling element 211 (penetrating conduction) to construct a secondary cooling link of "concentrated conduction-plane diffusion". The second cooling element 212 of the cooling layer assembly 210 is closely attached to the conduction end 2112 of the first cooling element 211 through the connecting end 2121. The diffusion end 2122 then increases the contact area, thereby further conducting the cold from the first cooling element 211 to the upper surface of the insole 200. The present invention forms an extended path for cold conduction through the connection and diffusion function of the second cooling element 212, ensuring that the cold generated by the cooling end 111 can be effectively diffused to the upper surface of the insole 200 through the second cooling element 212 after initial conduction through the first cooling element 211, thereby achieving cold coverage of the use area of the insole 200 and improving the uniformity and efficiency of the overall cooling effect. It should be noted that the first cooling element 211 and the second cooling element 212 of the present invention can be made into an integral body.

[0048] In this embodiment, the cooling layer assembly 210 includes a third cooling element 213, and the third cooling element 213 includes a connection terminal 2131 and a diffusion terminal 2132. The connection terminal 2131 is in contact with the diffusion terminal 2122, and the diffusion terminal 2122 is used to conduct the cold to the diffusion terminal 2132. Through the above-mentioned structure, when in use, on the basis of "the first cooling element 211 (concentrated conduction) + the second cooling element 212 (plane diffusion)", the third cooling element 213 is added to construct a three-stage cooling link of "concentrated input-surface diffusion-microscale homogenization". In addition, since the diffusion terminal 2132 of the third cooling element 213 is in direct contact with the sole of the user's foot, the third cooling element 213 is made of skin-friendly fabric.

[0049] In this embodiment, the sole 100 is further provided with a heat dissipation element 120, which includes a heat dissipation connection end 121 and a heat dissipation terminal 122. The semiconductor refrigeration unit 110 also includes a heat dissipation end 112, which is connected to the heat dissipation connection end 121. With the above-described structural arrangement, when in use, by providing the heat dissipation element 120 on the sole 100, a heat conduction link "heat dissipation end 112 - heat dissipation element 120" is constructed, thereby achieving efficient heat removal from the semiconductor refrigeration unit 110. The temperature of the heat dissipation end 112 can reach 60-80°C. The heat dissipation end 112 (the waste heat end generated by the Peltier effect) achieves efficient heat collection and conduction through the heat dissipation connection end 121; the heat dissipation terminal 122 diffuses the heat to the environment.

[0050] In this embodiment, the sole 100 is further provided with a flexible thermally conductive layer 130, and the heat dissipation end 112 is connected to the heat dissipation connection end 121 via the flexible thermally conductive layer 130. With this structural arrangement, during use, this embodiment adds a sealed flexible thermally conductive layer 130 between the heat dissipation end 112 of the semiconductor refrigeration unit 110 and the heat dissipation connection end 121 of the heat dissipation element 120. This all-around sealing design prevents air infiltration (while also waterproofing it), increasing thermal resistance (the thermal conductivity of air is 0.026 W / (m·K), which is only 1 / 100 of that of thermal grease), thereby improving heat conduction efficiency. The waterproofing here primarily protects the flexible thermally conductive layer 130 (also made of thermal grease in this embodiment) at the semiconductor heating end. Because it is located near the sole exhaust port and connected to the outside of the shoe, it is easily soaked with water and air, resulting in reduced thermal conductivity between the heat dissipation end 112 and the heat dissipation element 120. The upper surface of the heat dissipation element 120 is larger than the heating surface of the semiconductor, requiring the use of sealing glue to achieve a good seal.

[0051] In this embodiment, the sole 100 is further equipped with a cooling fan 140, which uses airflow to blow heat from the heat dissipation terminal 122 out of the shoe. With this configuration, the cooling fan 140 significantly improves the heat exchange efficiency of the heat dissipation terminal 122 through forced convection during use. The miniaturized design of the cooling fan 140, adapted to the sole space, and combined with optimized air duct structures such as the openings on the sole surface, further enhances the convective heat exchange efficiency.

[0052] It should be noted that the control of the heat dissipation fan 140 and the semiconductor refrigeration unit 110 are independent of each other. The upper 300 is provided with an upper through-hole, and the sole 100 is provided with a sole through-hole. When in an air-conditioned room, the semiconductor refrigeration unit 110 is turned off and the heat dissipation fan 140 is turned on. In conjunction with the upper through-hole or the sole through-hole, the cooling shoes of the present invention can achieve the function of ordinary fan shoes. It should be noted that due to the small space in the shoe and the high lightweight requirements, the battery capacity is limited. The demand for contact cooling is mainly concentrated on outdoor cooling (usually for a short time). Our customers spend most of their time in air-conditioned rooms in the summer. This structure can achieve the function of ordinary fan shoes, which means that the heat dissipation fan 140 is used to draw the cold air from the indoor air-conditioned room into the shoes for cooling, so that when people are in the air-conditioned room, the cooling can be stopped (the energy consumption of semiconductor refrigeration is relatively high), solving the contradiction between battery life and cooling effect.

[0053] It should be noted that the present embodiment also includes a plug-in power supply 500 and a control circuit board 600, the plug-in power supply 500 supplies power to the heat dissipation fan 140, the plug-in power supply 500 is detachably connected to the sole 100, and supports wireless charging, and the control circuit board 600 is used to control the opening and closing of the heat dissipation fan 140. The heat dissipation fan 140 includes a motor 141 and fan blades 142, and the fan blades 142 are detachably connected to the motor 141. Through the arrangement of the above structure, the fan blades 142 can be quickly disassembled and cleaned during use. The fan blades 142 are prone to accumulate dust and debris during long-term operation. The detachable design allows the user to directly remove the fan blades 142 for deep cleaning, avoiding a decrease in air volume, an increase in noise, or an increase in the load on the motor 141 due to dirt accumulation. In addition, when the fan blades 142 are damaged due to problems such as collision deformation, aging, and fracture, there is no need to replace the heat dissipation fan 140 as a whole. Only the fan blades 142 need to be replaced separately, reducing maintenance costs. At the same time, the motor 141 as a core component can be independently inspected and maintained, thereby improving maintenance flexibility.

[0054] In this embodiment, the support layer assembly 220 includes a support protrusion 222, an air guide groove 223 and a ventilation unit 224. The ventilation unit 224 is arranged in the air guide groove 223, and the air guide groove 223 is defined by the support protrusion 222; the shape of the cooling layer assembly 210 matches the shape of the support protrusion 222. Through the above-mentioned structural arrangement, when in use, an air cooling channel is constructed through the three-dimensional structural design of the support protrusion 222-the air guide groove 223-the ventilation unit 224; the support protrusion 222 serves as the main mechanical support body and also defines the geometric shape of the air guide groove 223, ensuring foot support stiffness; the air guide groove 223 is formed into a continuous air duct by the array of support protrusions 222, and the groove wall can be inclined to further reduce airflow resistance; the ventilation unit 224 is opened at the bottom of the air guide groove 223 and communicates with the ventilation system of the sole 100 (such as the air inlet of the heat dissipation fan 140), forming a complete airflow path of "sole air intake-shoe insole air guide-foot heat dissipation". The lower surface contour of the cooling layer assembly 210 matches the top contour of the support protrusion 222. It should be noted that the step on the side of the insole 200 (a circle around the edge of the insole 200) is also part of the air guide groove 223. The ventilation unit 224 is presented in the form of a ventilation hole in this embodiment, but it does not mean that the ventilation unit 224 can only appear in the form of a ventilation hole. The ventilation unit 224 can also be a groove opened on the edges of the insole 200, and then a long groove opened at the bottom of the insole to lead to the air inlet.

[0055] In this embodiment, the first cooling element 211 and the second cooling element 212 are made of graphene, and the third cooling element 213 is made of a flexible, wear-resistant, and skin-friendly material. 3 ) and flexibility (bending radius ≤ 5mm) to build an efficient cold transport channel: the first cooling element 0.1mm thick film achieves fast conduction in less than 0.2 seconds, and the second cooling element 0.2mm composite film covers 20-30cm 2 The cooling uniformity in the area is ±0.5℃, and the interface thermal resistance is reduced to 0.05K·m 2 / W, compared with the traditional metal solution, the conduction efficiency is increased by 200% and the weight is reduced by 60%. The third cooling element is made of flexible, wear-resistant and skin-friendly materials (such as graphene silicone, thermal conductivity 2.5-3.5W / (m·K), Shore hardness 30-40A), and the 0.3mm thickness design achieves 300% elongation at break and ≤10mm 3 / 1.6km wear, the temperature difference between the surface and the skin is controlled at 3-5℃, taking into account the cold conduction (contact thermal resistance 0.5K·m 2 / W) and wearing comfort (antibacterial rate ≥ 99%, biocompatibility meets standards). These three factors work together to stabilize the foot surface temperature at 26-28°C at 35°C, making it suitable for scenarios such as medical rehabilitation (precise temperature control within ±0.5°C). This breaks the paradox of traditional cooling layers: "efficiency without comfort, comfort without efficiency," providing a lightweight, flexible, and user-friendly solution for wearable thermal management devices.

[0056] In this embodiment, the in-shoe temperature monitoring device is applied to cooling shoes. The temperature sensor 10 includes a temperature probe 11. The temperature probe 11 is suspended in the air, and the space surrounding the temperature probe 11 is connected to the wearable space 400. Through the above-mentioned structural arrangement, when in use, the structural design of the temperature probe 11 being suspended in the air (or at least partially suspended in the air) and connected to the wearable space 400 enables accurate and real-time monitoring of the air temperature inside the shoe, providing reliable data support for the cooling shoe's intelligent temperature control system (such as fan start and stop, speed adjustment), ensuring that the microclimate inside the shoe is always within a comfortable range (e.g., 26-30°C).

[0057] The above descriptions are provided in conjunction with specific content to provide one or more embodiments, and the specific implementation of the present invention is not limited to these descriptions. Any similarity or similarity with the methods, structures, etc. of the present invention, or any technical deduction or substitution based on the concept of the present invention, shall be considered within the scope of protection of the present invention.

Claims

1. A cooling shoe, characterized in that: include: A shoe sole (100), wherein the shoe sole (100) is provided with a semiconductor refrigeration unit (110); An insole (200), the insole (200) comprising a cooling layer component (210) and a supporting layer component (220), the cooling layer component (210) being connected to the supporting layer component (220), with a portion of the cooling layer component (210) being located below the supporting layer component (220), and a portion of the cooling layer component (210) being located above the supporting layer component (220); the cooling layer component (210) being used to conduct cold energy to the upper surface of the insole (200); The shoe upper (300) is connected to the shoe sole (100) to form a wearing space (400), and the insole (200) is arranged at the bottom of the wearing space (400).

2. The cooling shoe according to claim 1, characterized in that: The shoe sole (100) is further provided with a heat dissipation fan (140); the support layer assembly (220) comprises a support convex portion (222), an air guide groove (223) and a ventilation unit (224); the ventilation unit (224) is arranged in the air guide groove (223); the air guide groove (223) is defined by the support convex portion (222); the semiconductor refrigeration unit (110) comprises a refrigeration end (111); one end of the cooling layer assembly (210) is located on the upper surface of the support layer assembly (220); and the other end is located on the support layer. The lower surface of the component (220) is in contact with the cooling end of the semiconductor refrigeration unit (110); the cooling layer component (210) extends from a position close to the semiconductor refrigeration unit (110) along the supporting protrusion (222) toward the toe of the shoe to form a plurality of block-shaped cooling areas; the ventilation unit (224) is connected to the wearing space (400); the heat dissipation fan (140) enables airflow to pass through the cooling layer component (210), pass through the ventilation unit (224), and finally be discharged outside the shoe through the heat dissipation fan (140).

3. The cooling shoe according to claim 2, characterized in that: The cooling area of the cooling layer component (210) placed below the support layer component (220) is smaller than the cooling area of the upper portion thereof, so that the cooling capacity is expanded from a small area to a relatively large area; the air guide grooves (223) and the ventilation units (224) between the plurality of block-shaped cooling areas are used to ensure that air flows smoothly through the cooling layer component (210), thereby achieving air circulation and heat dissipation in the shoe.

4. The cooling shoe according to claim 2, characterized in that: The semiconductor refrigeration unit (110) comprises a refrigeration end (111), the cooling layer assembly (210) comprises a first cooling element (211), the first cooling element (211) comprises a fitting end (2111) and a conduction end (2112), the fitting end (2111) is located below the support layer assembly (220), and the conduction end (2112) is located above the support layer assembly (220), the support layer assembly (220) comprises a connecting element (221), the fitting end (2111) is fitted with the refrigeration end (111), the connecting element (221) is used to allow the cooling energy of the fitting end (2111) to pass through the support layer assembly (220) and be delivered to the conduction end (2112), and the conduction end (2112) is used to conduct the cooling energy to the upper surface of the insole (200).

5. The cooling shoe according to claim 4, characterized in that: The cooling layer assembly (210) includes a second cooling element (212), and the second cooling element (212) includes a connecting end (2121) and a diffusion end (2122), wherein the connecting end (2121) is in contact with the conductive end (2112), and the diffusion end (2122) is used to conduct cold air to the upper surface of the insole (200).

6. The cooling shoe according to claim 2, characterized in that: The shoe sole (100) is further provided with a heat dissipation element (120), the heat dissipation element (120) comprising a heat dissipation connection end (121) and a heat dissipation terminal (122), and the semiconductor refrigeration unit (110) further comprises a heat dissipation end (112), the heat dissipation end (112) being connected to the heat dissipation connection end (121).

7. The cooling shoe according to claim 6, characterized in that: The shoe sole (100) is further provided with a flexible heat-conducting layer (130), and the heat-dissipating end (112) is connected to the heat-dissipating connecting end (121) via the flexible heat-conducting layer (130); the heat-dissipating fan (140) uses wind flow to blow the heat of the heat-dissipating terminal (122) out of the shoe.

8. The cooling shoe according to claim 1, characterized in that: The shoe further comprises a plug-in power supply (500), which is detachably connected to the sole (100) and supports wireless charging.

9. The cooling shoe according to claim 2, characterized in that: The heat dissipation fan (140) comprises a motor (141) and fan blades (142), and the motor (141) and / or the fan blades (142) are detachably connected to the sole (100).

10. A temperature monitoring device inside a shoe, applied to the cooling shoe according to any one of claims 1 to 9, characterized in that: The in-shoe temperature monitoring device comprises a temperature sensor (10), the temperature sensor (10) comprises a temperature sensing probe (11), the temperature sensing probe (11) is suspended, and the space around the temperature sensing probe (11) is connected to the wearing space (400).

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