Automatic processing equipment for substrate of satellite-borne circuit board

Abstract

The invention relates to the technical field of laser cutting equipment, and discloses automatic processing equipment for a substrate of a satellite-borne circuit board, the automatic processing equipment comprises a supporting seat, a sliding table is slidably connected to the inner wall of the supporting seat, and a cooling mechanism is arranged on the inner wall of the supporting seat; the cooling mechanism comprises a cooling mechanism; the inner wall of the supporting table is fixedly connected with the inner wall of the supporting base, the inner wall of the supporting table is fixedly connected with an isolation plate, a collecting groove is formed in the surface of the isolation plate, a connecting hole is formed in the groove wall of the collecting groove, and an adsorption mechanism is arranged on the surface of the isolation plate and comprises a supporting plate; the bottom of the supporting plate is fixedly connected with the surface of the isolation plate. According to the substrate cutting device, the substrate is cooled in the substrate cutting process through the cooling mechanism, meanwhile, cutting residues are collected, the cut face of the substrate is kept flat, the situation that the substrate is cooled through negative pressure, the substrate vibrates in the cooling process due to the fact that the cut face is provided with impurities is prevented, and the cutting stability of the substrate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of laser cutting equipment, in particular to an automated processing equipment for substrates of satellite-borne circuit boards. Background Art

[0002] The substrate is the basic carrier for the assembly of electronic components and the interconnection of circuits. It provides physical support for electronic components and establishes conductive paths. The copper layer covering the surface of the substrate is patterned to form a wire network to realize signal transmission between integrated circuits.

[0003] The patent application with application number CN202420604035.5 discloses a rapid cutting device for circuit board substrates. The board surface of the cutting platform is arranged in an array and has multiple groups of negative pressure holes. The interior of the negative pressure box frame is arranged in an array and has multiple groups of airtight sealing components corresponding to the negative pressure holes, and a negative pressure air pump is installed at the bottom of the box frame of the negative pressure box frame.

[0004] However, during the laser cutting process, the vibration generated by the automated processing equipment for satellite-borne circuit board substrates can easily cause the cut substrate to vibrate, resulting in the substrate shifting. In addition, during the laser cutting process, the substrate is easily heated and deformed, resulting in the substrate cutting line shifting, affecting the processing size of the substrate. Summary of the Invention

[0005] The object of the present invention is to provide an automated substrate processing device for a satellite-borne circuit board to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above object, the present invention provides the following technical solution: an automated substrate processing device for a satellite-borne circuit board, comprising a support base, an inner wall of the support base being slidably connected to a slide, and an inner wall of the support base being provided with a cooling mechanism; The cooling mechanism comprises: A support platform, the inner wall of the support platform is fixedly connected to the inner wall of the support seat, the inner wall of the support platform is fixedly connected to an isolation plate, a collection groove is provided on the surface of the isolation plate, and a connection hole is provided on the wall of the collection groove. An adsorption mechanism is provided on the surface of the isolation plate, and the adsorption mechanism includes a support plate, the bottom of the support plate is fixedly connected to the surface of the isolation plate, and the inner wall of the support plate is fixedly connected to a suction cup, and the suction cup is used to adsorb and fix the substrate.

[0007] According to the above technical solution, the outer wall of the support seat is fixedly connected to motor 2, the output end of motor 2 passes through the outer wall of the support seat and is connected to the inner wall of the slide through a screw, the outer wall of the slide is fixedly connected to motor 1, the inner wall of the slide is slidably connected to a transmitter through a slider, the output end of motor 1 passes through the outer wall of the slide and is connected to the slider arranged on the outer wall of the transmitter through a screw, and the transmitter is a laser cutter for cutting the substrate.

[0008] According to the above technical solution, a filter plate is fixedly connected to the inner wall of the isolation plate, an adsorption hole is provided on the surface of the isolation plate, and a guide groove 1 is provided on the wall of the collection tank. The filter plate is used to isolate cutting impurities, and the connection hole is connected to a negative pressure pipeline to guide the air through the collection tank to collect the cutting impurities, and at the same time, the air is sucked to dissipate heat for the circuit substrate. The adsorption hole is connected to a negative pressure pipeline to enable the suction cup to adsorb the substrate on the surface of the support plate and fix it.

[0009] According to the above technical solution, a second guide groove is provided on the surface of the support plate, a cooling groove is provided on the surface of the support plate, the cooling groove passes through the surface of the support plate and is connected to the collection groove, a clamping mechanism is provided on the surface of the support plate, and the cooling groove is used to adsorb impurities cut from the substrate.

[0010] According to the above technical solution, the clamping mechanism includes a guide block 1, the outer wall of the guide block 1 is slidably connected to the groove wall of the guide groove 2, the surface of the guide block 1 is provided with a guide groove 3, the groove wall of the guide groove 3 is slidably connected to a support wheel, the outer wall of the support wheel is fixedly connected to a hydraulic damper 2, the other end of the hydraulic damper 2 is fixedly connected to the groove wall of the guide groove 3, the bottom of the guide block 1 is fixedly connected to the guide block 2, the outer wall of the guide block 2 is slidably connected to the groove wall of the guide groove 1 through a slider, the outer wall of the guide block 2 passes through the groove wall of the guide groove 1 and is fixedly connected to the support block 3, the outer wall of the support block 3 is slidably connected to the bottom of the support plate, the inner wall of the support block 3 is fixedly connected to an electric push rod, the other end of the electric push rod is fixedly connected to the inner wall of the support plate, and the support wheel is used to support and fix the circuit substrate.

[0011] According to the above technical solution, the outer wall of the guide block 1 is fixedly connected to the support block 1, a sliding groove is provided on the top of the support block 1, the inner wall of the support block 1 is fixedly connected to the hydraulic damper 1, the other end of the hydraulic damper 1 is fixedly connected to the clamping claw, the outer wall of the clamping claw is connected to the connecting rod through a rotating shaft hinge, the outer wall of the connecting rod is connected to the support block 2 through a rotating shaft hinge, the support block 2 is slidably connected to the sliding groove wall through a slider, and the clamping claw is used to position the circuit substrate.

[0012] According to the above technical solution, the guide groove three is used to guide the support wheel, and the outer wall of the guide block two slides along the inner wall of the isolation plate.

[0013] According to the above technical solution, the inner wall of the second support block contacts the outer wall of the support wheel, and drives the support wheel to protrude from the inner wall of the first support block, which is used to support the support wheel. The sliding groove is used to guide the second support block, and the bottom of the first support block slides along the surface of the support plate.

[0014] Compared with the prior art, the present invention has the following beneficial effects: 1. The automated processing equipment for the satellite-borne circuit board substrate cools down the substrate during the cutting process through a cooling mechanism, and collects cutting residues at the same time to keep the cutting surface of the substrate flat, prevent the substrate from vibrating during the cooling process due to impurities on the cutting surface, and cause the substrate to deviate, thereby increasing the stability of substrate cutting.

[0015] 2. The automated substrate processing equipment for the satellite-borne circuit board uses a clamping mechanism to position and adjust the substrate, clamp the substrate, and make the substrate fit the surface of the support plate to prevent gaps between the substrate and the support plate, which would result in the inability to adsorb the substrate through negative pressure, causing the substrate to vibrate during the cutting process and causing the substrate to shift, making the substrate more stable during the cutting process.

[0016] 3. The automated processing equipment for the satellite-borne circuit board substrate positions the substrate through the clamping claws and generates downward pressure after clamping the substrate, so that the substrate fits more closely to the surface of the support plate, making the substrate more stable through negative pressure adsorption and enabling the substrate to be cut more stably.

[0017] 4. The automated substrate processing equipment for the satellite-borne circuit board uses a cooling mechanism to perform negative pressure adsorption on the substrate, and cooperates with a clamping mechanism to fix the substrate to prevent the substrate from vibrating due to the cutting gap when the negative pressure collects the cutting residue, causing the substrate to shift during the cutting process, so that the automated substrate processing equipment maintains stability in cutting the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 The structure of the present invention is schematically shown Figure 1 ; Figure 2 The structure of the present invention is schematically shown Figure 2 ; Figure 3 The structure of the cooling mechanism of the present invention is shown in FIG. Figure 1 ; Figure 4 The structure of the cooling mechanism of the present invention is shown in FIG. Figure 2 ; Figure 5 is a cross-sectional view of the cooling mechanism of the present invention; Figure 6 It is a structural schematic diagram of the adsorption mechanism of the present invention; Figure 7 It is a structural schematic diagram of the clamping mechanism of the present invention; Figure 8 It is a cross-sectional view of the clamping mechanism of the present invention.

[0019] In the figure: 1. Support seat; 101. Slide; 102. Launcher; 103. Motor 1; 104. Motor 2; 2. Cooling mechanism; 201. Support platform; 202. Isolation plate; 203. Adsorption hole; 204. Collecting trough; 205. Guide groove 1; 206. Filter plate; 207. Connecting hole; 21. Adsorption mechanism; 211. Support plate; 212. Guide groove 2; 213. Cooling trough; 214. Suction cup; 22. Clamping mechanism; 221. Support block 1; 222. Slide groove; 223. Guide block 1; 224. Guide groove 3; 225. Support wheel; 226. Support block 2; 227. Connecting rod; 228. Clamping claw; 229. Hydraulic damper 1; 2210. Guide block 2; 2211. Support block 3; 2212. Electric push rod; 2213. Hydraulic damper 2. DETAILED DESCRIPTION

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] For example 1, please refer to Figures 1-6 The present invention provides a technical solution: an automated substrate processing device for satellite-borne circuit boards, comprising a support base 1, the inner wall of which is slidably connected to a slide 101, characterized in that a cooling mechanism 2 is provided on the inner wall of the support base 1; During the laser cutting process, the substrate is easily deformed by heat, causing the cutting line of the substrate to deviate, thus affecting the processing size of the substrate. Therefore, a cooling mechanism 2 is provided to cool the substrate during the cutting process and collect the cutting residues to keep the cutting surface of the substrate flat. This prevents the substrate from vibrating during the cooling process due to impurities on the cutting surface caused by negative pressure cooling, which may cause the substrate to deviate. The cooling mechanism 2 includes: The support platform 201, the inner wall of the support platform 201 is fixedly connected to the inner wall of the support seat 1, the inner wall of the support platform 201 is fixedly connected with an isolation plate 202, a collection groove 204 is provided on the surface of the isolation plate 202, and a connection hole 207 is provided on the wall of the collection groove 204. An adsorption mechanism 21 is provided on the surface of the isolation plate 202, and the adsorption mechanism 21 includes a support plate 211. The bottom of the support plate 211 is fixedly connected to the surface of the isolation plate 202, and the inner wall of the support plate 211 is fixedly connected with a suction cup 214. The suction cup 214 is used to adsorb and fix the substrate. When the substrate automation processing equipment for satellite-borne circuit boards is put into use, the circuit substrate is placed on the surface of the support plate 211. After the substrate is positioned by the clamping mechanism 22, the negative pressure pipeline connected to the adsorption hole 203 is used to make the suction cup 214 adsorb to the bottom of the substrate, so that the suction cup 214 fixes the substrate on the support On the surface of the support plate 211, the emitter 102 is started to cut the substrate. The debris generated during the cutting process of the substrate generates negative pressure inside the collection tank 204 through the connecting hole 207, so that the debris passes through the second guide groove 212 and the cooling groove 213 and enters the collection tank 204 for collection. At the same time, the second guide groove 212 and the cooling groove 213 use the negative pressure in the collection tank 204 to suck the air, so that during the cutting process, the air flowing through the second guide groove 212 and the cooling groove 213 cools the substrate, thereby preventing the substrate from being heated up during the cutting process and causing deformation of the substrate, causing the emitter 102 to change the cutting path of the substrate, and affecting the cutting accuracy of the substrate. The debris collected in the collection tank 204 is blocked by the filter plate 206 to prevent the debris from entering the filter plate 206 and causing the connection hole 207 pipeline to be blocked. The outer wall of the support base 1 is fixedly connected to a motor 2 104, the output end of the motor 2 104 passes through the outer wall of the support base 1 and is connected to the inner wall of the slide 101 through a lead screw, the outer wall of the slide 101 is fixedly connected to a motor 103, the inner wall of the slide 101 is slidably connected to a launcher 102 through a slider, the output end of the motor 103 passes through the outer wall of the slide 101 and is connected to the slider provided on the outer wall of the launcher 102 through a lead screw, the launcher 102 is a laser cutter for cutting the substrate, after the substrate is fixed, the launcher 102 is started, the lead screw is driven to rotate by the motor 103, so that the slide 101 slides on the inner wall of the support base 1, and at the same time, the lead screw is driven to rotate by the motor 2 104, so that the slider provided on the outer wall of the launcher 102 slides on the inner wall of the slide 101, driving the launcher 102 to form a cutting path for the substrate, thereby automatically cutting the substrate; The inner wall of the isolation plate 202 is fixedly connected to a filter plate 206. The surface of the isolation plate 202 is provided with an adsorption hole 203. The wall of the collection tank 204 is provided with a guide groove 205. The filter plate 206 is used to isolate the cutting impurities. The connection hole 207 is connected to the negative pressure pipeline to guide the air through the collection tank 204 to collect the cutting impurities. At the same time, the air is sucked to dissipate heat for the circuit substrate. The adsorption hole 203 is connected to the negative pressure pipeline so that the suction cup 214 adsorbs the substrate on the surface of the support plate 211 and fixes it. After the clamping mechanism 22 positions the substrate, the substrate is fixed to the support plate 211 through the adsorption hole 203. 03 is connected to the negative pressure pipeline, so that the suction cup 214 is adsorbed on the bottom of the substrate, so that the suction cup 214 fixes the substrate on the surface of the support plate 211. The debris generated by the substrate during the cutting process generates negative pressure inside the collection tank 204 through the connection hole 207, so that the debris enters the collection tank 204 through the second guide groove 212 and the cooling groove 213 for collection. At the same time, the second guide groove 212 and the cooling groove 213 use the negative pressure in the collection tank 204 to suck the air, so that during the cutting process, the air flowing through the second guide groove 212 and the cooling groove 213 cools the substrate; A second guide groove 212 is provided on the surface of the support plate 211, and a cooling groove 213 is provided on the surface of the support plate 211. The cooling groove 213 passes through the surface of the support plate 211 and is connected to the collection groove 204. A clamping mechanism 22 is provided on the surface of the support plate 211. The cooling groove 213 is used to adsorb impurities from substrate cutting. The debris generated during the cutting process of the substrate enters the collection groove 204 through the second guide groove 212 and the cooling groove 213 for collection. At the same time, the second guide groove 212 and the cooling groove 213 suck the air through the negative pressure in the collection groove 204, so that the air flowing through the second guide groove 212 and the cooling groove 213 cools the substrate during the cutting process.

[0022] Example 2, based on Example 1, please refer to Figure 7-Figure 8 The present invention provides a technical solution: when the substrate is fixed by negative pressure, the substrate should be in contact with the surface of the support plate 211 to prevent the suction cup 214 from being unable to fix the substrate due to gaps when the substrate is fixed by the suction cup 214, causing the substrate to vibrate during the cutting process. Therefore, a clamping mechanism 22 is provided to position and adjust the substrate, clamp the substrate, make the substrate fit the surface of the support plate 211, and allow the suction cup 214 to adsorb and fix the substrate; The clamping mechanism 22 includes a guide block 223, the outer wall of the guide block 223 is slidably connected to the wall of the guide groove 212, the surface of the guide block 223 is provided with a guide groove 3 224, the wall of the guide groove 3 224 is slidably connected to the support wheel 225, the outer wall of the support wheel 225 is fixedly connected to the hydraulic damper 2213, the other end of the hydraulic damper 2213 is fixedly connected to the wall of the guide groove 3 224, the bottom of the guide block 1 223 is fixedly connected to the guide block 2210, the outer wall of the guide block 2210 is slidably connected to the wall of the guide groove 1 205 through a slider, the outer wall of the guide block 2210 passes through the wall of the guide groove 1 205 and the support block The third 2211 is fixedly connected, the outer wall of the support block 3 2211 is slidably connected to the bottom of the support plate 211, the inner wall of the support block 3 2211 is fixedly connected with an electric push rod 2212, and the other end of the electric push rod 2212 is fixedly connected to the inner wall of the support plate 211. The support wheel 225 is used to support and fix the circuit substrate. After the substrate is placed on the surface of the support plate 211, the electric push rod 2212 is started to drive the support block 3 2211 to slide at the bottom of the support plate 211 toward the substrate, so that the support block 3 2211 drives the guide block 2 2210 to pass through the guide groove 1 205 to guide, and drives the guide block 1 223 in the guide groove 2 212 toward the substrate. The clamping jaw 228 slides to contact the outer wall of the substrate. The clamping jaw 228 is supported by the hydraulic damping 1 229, so that the clamping jaw 228 adjusts the position of the substrate. After the substrate is adjusted, the negative pressure of the adsorption hole 203 is sucked on the suction cup 214, so that the suction cup 214 fixes the substrate on the surface of the support plate 211. After the substrate is fixed by the suction cup 214, the electric push rod 2212 continues to drive the support block 1 221 to slide toward the substrate, so that the clamping jaw 228 squeezes the hydraulic damping 1 229, and is hinged to the clamping jaw 228 through the connecting rod 227, so that the connecting rod 227 drives the support block 226 to slide toward the support wheel 225, and is connected to the support wheel 225 outer wall, and supports the support wheel 225, so that the support wheel 225 squeezes the hydraulic damper 2213, and is guided by the guide groove 3 224, so that the support wheel 225 slides toward the substrate, and protrudes the outer wall of the support block 1 221, contacts the outer wall of the substrate, squeezes and fixes the substrate, and at the same time supports the support block 226 through the support wheel 225, limits the support block 226, and makes the clamping claw 228 press the substrate tightly, so that the substrate is more closely attached to the support plate 211, preventing the substrate from being offset due to the negative pressure on the laser plate during the laser cutting process, resulting in unqualified cutting size of the substrate; The outer wall of the guide block 223 is fixedly connected to the support block 1 221, and a sliding groove 222 is provided on the top of the support block 1 221. The inner wall of the support block 1 221 is fixedly connected to the hydraulic damper 1 229, and the other end of the hydraulic damper 1 229 is fixedly connected to the clamping claw 228. The outer wall of the clamping claw 228 is connected to the connecting rod 227 through a rotating shaft hinge. The outer wall of the connecting rod 227 is connected to the support block 226 through a rotating shaft hinge. The support block 226 is slidably connected to the wall of the sliding groove 222 through a slider. The clamping claw 228 is used to position the circuit substrate. Start the electric push rod 2212 to drive the support block 3 2211 to slide at the bottom of the support plate 211 toward the substrate, and drive the support block 1 221 to slide on the surface of the support plate 211 toward the substrate, so that the inner wall of the clamping claw 228 contacts the outer wall of the substrate, and the substrate is positioned and adjusted. After the substrate is fixed by the suction cup 214, the electric push rod 2212 continues to drive the support block 1 221 to slide toward the substrate, so that the clamping claw 228 squeezes the hydraulic damping 1 229, and is hinged to the clamping claw 228 through the connecting rod 227, so that the connecting rod 227 drives the support block 2 26 to slide toward the support wheel 225, contacts the outer wall of the support wheel 225, and supports the support wheel 225, so that the support wheel 225 squeezes the hydraulic damping 2 2213, and is guided by the guide groove 3 224, so that the support wheel 225 slides toward the substrate, protrudes the outer wall of the support block 1 221, contacts the outer wall of the substrate, squeezes and fixes the substrate, and at the same time supports the support block 226 through the support wheel 225, limits the support block 226, and causes the clamping claw 228 to press the substrate tightly, so that the substrate is more closely attached to the support plate 211; The guide groove three 224 is used to guide the support wheel 225. The outer wall of the guide block two 2210 slides along the inner wall of the isolation plate 202. After the inner wall of the support block two 226 contacts the outer wall of the support wheel 225, the support wheel 225 is supported, so that the support wheel 225 squeezes the hydraulic damper two 2213 and is guided by the guide groove three 224 to slide in the guide groove three 224 toward the substrate, so that the support wheel 225 protrudes and contacts the inner wall of the support block one 221 and the outer wall of the substrate, squeezing and fixing the substrate. At the same time, the support block two 226 is supported by the support wheel 225 and limited, so that the clamping claw 228 presses the substrate so that the substrate fits more closely to the support plate 211. The inner wall of the support block 226 contacts the outer wall of the support wheel 225, and drives the support wheel 225 to protrude from the inner wall of the support block 1 221, which is used to support the support wheel 225. The sliding groove 222 is used to guide the support block 226. The bottom of the support block 1 221 slides along the surface of the support plate 211. After the clamping claw 228 contacts the outer wall of the substrate, the support block 1 221 continues to slide toward the substrate, so that the clamping claw 228 squeezes the hydraulic damping 1 229 and is supported by the connecting rod 227. At the same time, the support block 226 is limited by the sliding groove 222, so that the support block 226 moves toward the support wheel 225 slides in the direction of support block 226, so that the inner wall of support block 226 contacts the outer wall of support wheel 225, supporting support wheel 225, so that support wheel 225 squeezes hydraulic damper 2213 and slides toward the substrate in guide groove 3 224 through guide groove 3 224, so that support wheel 225 protrudes and contacts the inner wall of support block 1 221 and the outer wall of substrate, squeezing and fixing the substrate, and at the same time supporting support block 226 through support wheel 225, limiting support block 226, so that clamping claw 228 presses the substrate, making the substrate fit more closely to support plate 211.

[0023] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. An automated substrate processing device for a satellite-borne circuit board, comprising a support base (1), wherein the inner wall of the support base (1) is slidably connected to a slide table (101), characterized in that: The inner wall of the support seat (1) is provided with a cooling mechanism (2); The cooling mechanism (2) comprises: A support platform (201), wherein the inner wall of the support platform (201) is fixedly connected to the inner wall of the support seat (1), an isolation plate (202) is fixedly connected to the inner wall of the support platform (201), a collection groove (204) is provided on the surface of the isolation plate (202), a connection hole (207) is provided on the groove wall of the collection groove (204), an adsorption mechanism (21) is provided on the surface of the isolation plate (202), the adsorption mechanism (21) comprises a support plate (211), the bottom of the support plate (211) is fixedly connected to the surface of the isolation plate (202), a suction cup (214) is fixedly connected to the inner wall of the support plate (211), and the suction cup (214) is used to adsorb and fix the substrate.

2. The automated processing equipment for substrates of satellite-borne circuit boards according to claim 1, characterized in that: The outer wall of the support seat (1) is fixedly connected to a motor 2 (104), the output end of the motor 2 (104) passes through the outer wall of the support seat (1) and is connected to the inner wall of the slide (101) through a lead screw, the outer wall of the slide (101) is fixedly connected to a motor 1 (103), the inner wall of the slide (101) is connected to a transmitter (102) through a slider, the output end of the motor 1 (103) passes through the outer wall of the slide (101) and is connected to the slider provided on the outer wall of the transmitter (102) through a lead screw, and the transmitter (102) is a laser cutter for cutting a substrate.

3. The automated processing equipment for substrates of satellite-borne circuit boards according to claim 1, characterized in that: The inner wall of the isolation plate (202) is fixedly connected to a filter plate (206), the surface of the isolation plate (202) is provided with an adsorption hole (203), the wall of the collection tank (204) is provided with a guide groove (205), the filter plate (206) is used to isolate cutting impurities, the connection hole (207) is connected to a negative pressure pipeline, and is used to guide air through the collection tank (204) to collect the cutting impurities, and at the same time, suck air to dissipate heat for the circuit substrate, and the adsorption hole (203) is connected to the negative pressure pipeline, so that the suction cup (214) adsorbs the substrate on the surface of the support plate (211) and fixes it.

4. The automated substrate processing equipment for a satellite-borne circuit board according to claim 1, characterized in that: A second guide groove (212) is provided on the surface of the support plate (211), a cooling groove (213) is provided on the surface of the support plate (211), the cooling groove (213) passes through the surface of the support plate (211) and is connected to the collection groove (204), a clamping mechanism (22) is provided on the surface of the support plate (211), and the cooling groove (213) is used to adsorb impurities cut from the substrate.

5. The automated substrate processing equipment for a satellite-borne circuit board according to claim 4, characterized in that: The clamping mechanism (22) includes a guide block (223), the outer wall of the guide block (223) is slidably connected to the groove wall of the guide groove (212), a guide groove (224) is provided on the surface of the guide block (223), the groove wall of the guide groove (224) is slidably connected to a support wheel (225), the outer wall of the support wheel (225) is fixedly connected to a hydraulic damper (2213), the other end of the hydraulic damper (2213) is fixedly connected to the groove wall of the guide groove (224), the bottom of the guide block (223) is fixedly connected to the guide block (221 0), the outer wall of the guide block 2 (2210) is slidably connected to the groove wall of the guide groove 1 (205) through a slider, the outer wall of the guide block 2 (2210) passes through the groove wall of the guide groove 1 (205) and is fixedly connected to the support block 3 (2211), the outer wall of the support block 3 (2211) is slidably connected to the bottom of the support plate (211), the inner wall of the support block 3 (2211) is fixedly connected with an electric push rod (2212), the other end of the electric push rod (2212) is fixedly connected to the inner wall of the support plate (211), and the support wheel (225) is used to support and fix the circuit substrate.

6. The automated substrate processing equipment for a satellite-borne circuit board according to claim 5, characterized in that: The outer wall of the guide block 1 (223) is fixedly connected to the support block 1 (221), the top of the support block 1 (221) is provided with a sliding groove (222), the inner wall of the support block 1 (221) is fixedly connected to the hydraulic damper 1 (229), the other end of the hydraulic damper 1 (229) is fixedly connected to the clamping claw (228), the outer wall of the clamping claw (228) is connected to the connecting rod (227) through a rotating shaft hinge, the outer wall of the connecting rod (227) is connected to the support block 2 (226) through a rotating shaft hinge, the support block 2 (226) is slidably connected to the wall of the sliding groove (222) through a slider, and the clamping claw (228) is used to position the circuit substrate.

7. The automated substrate processing equipment for a satellite-borne circuit board according to claim 5, characterized in that: The guide groove three (224) is used to guide the support wheel (225), and the outer wall of the guide block two (2210) slides along the inner wall of the isolation plate (202).

8. The automated substrate processing equipment for a satellite-borne circuit board according to claim 6, characterized in that: The inner wall of the second support block (226) contacts the outer wall of the support wheel (225) and drives the support wheel (225) to protrude from the inner wall of the first support block (221) to support the support wheel (225). The sliding groove (222) is used to guide the second support block (226). The bottom of the first support block (221) slides along the surface of the support plate (211).

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