Method for manufacturing case member for power storage device, case member for power storage device, and power storage device

Abstract

The invention provides a method for manufacturing a case member for a power storage device, a case member for a power storage device, and a power storage device. A method for manufacturing a case member includes a step for preparing a plate member, a step for disposing the plate member in a mold, and a step for integrally molding the plate member and a seal. In the step of integrally molding the plate member and the seal, resin is caused to flow into the mold, and the plate member and the seal that seals the plate member are integrally molded. The mold is provided with a convex part which is pressed on the periphery of the through hole of the plate component. The step of disposing the plate member in the mold includes a step of pressing the convex portion of the mold around the through hole of the plate member. The plate member has a recess formed between a position pressed by the protrusion of the mold and the through hole.

Description

Technical Field

[0001] The present invention relates to a method for manufacturing a case member for an electrical storage device, a case member for an electrical storage device, and an electrical storage device. Background Art

[0002] Japanese Patent Publication No. 2005-4968 discloses a method for manufacturing a sealing plate in which an electrode terminal is integrated with a sealing plate body formed of a polymer material by insert molding. In the manufacturing method disclosed in the publication, when the molding die for insert molding is closed, the molding die is pressed against the end face of the electrode terminal to block the molding material of the sealing plate body. In the molding die, an annular protrusion is pre-set that sinks into the end face of the electrode terminal when the mold is closed. The diameter of the annular protrusion is set to be smaller than the diameter of the outer peripheral edge of the electrode terminal. If based on this manufacturing method, it is possible to effectively suppress the electrolyte from penetrating the joint surface between the sealing plate body and the electrode terminal.

[0003] Patent Document 1: Japanese Patent Application Laid-Open No. 2005-4968 Summary of the Invention

[0004] In a case member for an electric storage device, it is necessary to firmly join a plate member and a seal.

[0005] The manufacturing method of a case component for a storage device disclosed herein includes the following steps: a step of preparing a plate component having a through-hole formed therein; a step of arranging the plate component in a mold; and a step of causing resin to flow into the mold to integrally form the plate component and a sealant that seals the plate component. The mold has a convex portion that presses against the periphery of the through-hole of the plate component. The step of arranging the plate component in the mold includes the step of pressing the convex portion of the mold against the periphery of the through-hole of the plate component. A concave portion is formed in the plate component between the position pressed by the convex portion of the mold and the through-hole. The plate component of the case component manufactured by this manufacturing method has good bonding properties with the sealant. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 It is a perspective view of the power storage device 100 .

[0007] Figure 2 This is a flowchart of a method for manufacturing the electrical storage device case member 14 .

[0008] Figure 3 It is a perspective view of the plate member 14a.

[0009] Figure 4 It is along Figure 3 Cross-sectional view of line IV-IV.

[0010] Figure 5 It is a schematic diagram of the plate member 14 a arranged in the mold 60 .

[0011] Figure 6 It is a schematic diagram of the plate member 14 a arranged in the mold 60 .

[0012] Figure 7 Schematic diagram of the housing member 14 integrally molded in the mold 60 .

[0013] Figure 8 It is a schematic diagram showing how the plate member 14a is deformed.

[0014] Figure 9 It is a cross-sectional view of the power storage device 100 . DETAILED DESCRIPTION

[0015] Hereinafter, one embodiment of the technology disclosed herein will be described with reference to the accompanying drawings. Of course, the embodiments described herein are not intended to limit the present invention in particular. The drawings are shown schematically and do not necessarily reflect the actual objects. In addition, for components and parts that play the same role, the same figure marks are appropriately marked, and repeated descriptions are appropriately omitted. In the following description, the figure marks L, R, F, Rr, U, and D in the drawings represent left, right, front, back, top, and bottom, and the figure marks X, Y, and Z in the drawings represent the long side direction, short side direction, and height direction, respectively. However, they are only directions for convenience of description and do not limit the present invention in any way.

[0016] Figure 1 It is a perspective view of the power storage device 100 . Figure 2 This is a flowchart of a method for manufacturing the electrical storage device case member 14 . Figure 3 It is a perspective view of the plate member 14a. Figure 4 It is along Figure 3 Cross-sectional view of line IV-IV. Figure 5 and Figure 6 Schematic diagram of the plate member 14a disposed in the mold 60. Figure 5 , the plate member 14a is shown in a state of being placed on the lower mold 61. Figure 6 , the plate member 14 a is shown clamped by the lower mold 61 and the upper mold 66 . Figure 7 Schematic diagram of the housing component 14 integrally formed in the mold 60. Figures 5 to 7 , the hatching of the mold 60 is omitted. Figure 8 It is a schematic diagram showing how the plate member 14a is deformed. Figure 9 is a cross-sectional view of the power storage device 100. Figure 8 In FIG, the mold 60 bitten into the plate member 14a and the deformed portion of the plate member 14a are shown by two-dot chain lines. Figure 9 , a housing component 14 mounted on the housing 10 is schematically shown.

[0017] like Figure 1 As shown, the electrical storage device 100 includes an electrode body 40 (see Figure 9 ), and a housing 10 that houses the electrode assembly 40. Although not shown, an electrolyte is also contained within the housing 10. The electrode assembly 40 and the electrolyte are the power generation elements of the electrical storage device 100. These power generation elements can be used without particular limitation in conventionally known electrical storage devices, and therefore detailed descriptions are omitted.

[0018] The term "electricity storage device" as used in this specification encompasses devices that generate charge and discharge reactions by the movement of charge carriers between a pair of electrodes (a positive electrode and a negative electrode). Specifically, the energy storage devices described in the technology disclosed herein include not only secondary batteries such as lithium-ion batteries, nickel-metal hydride batteries, and nickel-cadmium batteries, but also capacitors such as lithium-ion capacitors and electric double-layer capacitors.

[0019] In this specification, the housing component refers to a component that constitutes the housing of the power storage device. Figure 1 The electrical storage device 100 shown in the figure uses a case 10 composed of a case body 12 and a cover 14. The case body 12 has an opening at the top. The cover 14 is a component that is assembled to the opening of the case body 12 to seal the opening. In this case 10, the case body 12 and the cover 14 each constitute a case member. Figure 1 In the embodiment shown, the electrode terminal 20 and the seal 30 are mounted on the cover 14 as the housing member. Here, the electrode terminal 20 and the seal 30 are mounted on the cover 14, but the electrode terminal 20 and the seal 30 can also be mounted on the housing body 12. The housing member can be made of aluminum or an aluminum alloy. Figure 1 In the manner shown, a method for manufacturing the case member 14 serving as the cover 14 will be described.

[0020] <Method for Manufacturing Electricity Storage Device Case Member 14>

[0021] like Figure 2 As shown, the method for manufacturing the case member for an electrical storage device (hereinafter also referred to as “case member”) 14 includes a step S10 of preparing a plate member 14a, a step S20 of placing the plate member 14a in a mold 60, and a step S30 of integrally molding the plate member 14a and the seal 30.

[0022] <Step S10 of Preparing Plate Member 14a>

[0023] In the step S10 of preparing the plate member 14a, as shown in FIG. Figure 3As shown in FIG. 1 , a plate member 14a having a through hole 14b is prepared. The plate member 14a is also called a sealing plate and is used to seal the case body 12 (see FIG. 1 ) containing the electrode assembly. Figure 1 The plate member 14a can be made of the same material as the housing body 12, for example, aluminum or an aluminum alloy. The plate member 14a is an elongated plate-shaped member.

[0024] Through holes 14b are provided at both ends of the plate member 14a. The through holes 14b are openings that are substantially rectangular in plan view. The planar shape of the through holes 14b is such that the electrode terminals 20 (see FIG. 2 ) can be supplied. Figure 1 The through hole 14b may be inserted through the hole 14b without any particular limitation. The planar shape of the through hole 14b may also be circular, elliptical, or the like.

[0025] The outer side surface 14c of the plate member 14a is formed with a groove 14e surrounding the through hole 14b. Similarly, the inner side surface 14d of the plate member 14a is also formed with a groove 14e surrounding the through hole 14b (see Figure 4 ). The groove 14e is formed in the mold 60 (see Figure 5 ) is pressed.

[0026] Step S10 of preparing the plate member 14a may also include forming the recess 14f in the plate member 14a. The method for forming the recess 14f and the groove 14e is not particularly limited. In step S10 of preparing the plate member 14a, the recess 14f may be formed in the plate member 14a using a known method such as cutting or forging.

[0027] The plate member 14a is formed in the mold 60 (see Figure 5 A recess 14f is formed between the position (groove 14e) pressed by the mold 60 and the through-hole 14b. In other words, recess 14f is provided between the through-hole 14b and the position pressed by the mold 60. Recess 14f is provided so as to be close to the groove (the position pressed by the mold 60). Recess 14f is provided closer to groove 14e than through-hole 14b. Recess 14f is provided on both the outer side surface 14c and the inner side surface 14d of the plate member 14a.

[0028] The recess 14f has a substantially rectangular shape when viewed in the direction in which the groove 14e extends (see FIG. Figure 4 In this embodiment, the recess 14f surrounds the through-hole 14b all around. The recess 14f is continuous around the through-hole 14b in a substantially rectangular shape when viewed from above. Furthermore, the recess 14f does not necessarily need to be continuous around the through-hole 14b all around. The recess 14f may be interrupted midway around the through-hole 14b. Parts of the through-hole 14b where the recess 14f is not formed may also be provided.

[0029] The process S10 of preparing the plate member 14a may also include the step of forming a second recess in the plate member 14a. The second recess can be formed by the same method as the method of forming the recess 14f. In the plate member 14a, a second recess may also be provided at the position pressed by the mold 60. Here, the second recess is provided on both the outer side surface 14c and the inner side surface 14d of the plate member 14a. In this embodiment, the groove 14e is equivalent to the second recess. Hereinafter, the groove 14e is also referred to as the second recess 14e. In this embodiment, the second recess 14e surrounds the through hole 14b (and the recess 14f) all around. The second recess 14e is continuous in a roughly rectangular manner around the recess 14f when viewed from above.

[0030] The second recess 14e includes a straight portion 14e1 parallel to the straight portion 14b1 of the substantially rectangular through-hole 14b, and a corner portion 14e2 connecting adjacent straight portions 14e1. The straight portion 14e1 of the second recess 14e is spaced apart from the straight portion 14b1 of the through-hole 14b at a substantially constant distance and is substantially parallel to the straight portion 14b1 of the through-hole 14b. The corner portion 14e2 of the second recess 14e is substantially arc-shaped and connects the ends of adjacent straight portions 14e1.

[0031] The shape of the second recess 14e is not particularly limited. Figure 4 As shown, the second recess 14e is in a shape that is concave in a roughly wedge-shaped manner when viewed in the direction in which the groove 14e extends. The second recess 14e narrows in the depth direction. The shape of the second recess 14e can be set according to the shape of the mold 60 being pressed. In addition, the second recess 14e can also be locally provided around the recess 14f. In the case where the second recess 14e is locally provided, the second recess 14e can be provided on the outside of at least the corner 14b2 of the rectangular through-hole 14b. For example, in the above-mentioned second recess 14e, at least a circular arc-shaped corner 14e2 can be provided. In addition, it is not necessary to provide the second recess 14e (groove 14e).

[0032] In addition, the plate member 14a may also be provided with a rough surface processed portion 14a1 that has been subjected to rough surface processing for improving the bonding property with the seal 30. The rough surface processed portion 14a1 is a portion where the surface roughness is relatively increased by performing rough surface processing (surface treatment) on the member. The rough surface processed portion 14a1 can be formed by processes such as laser irradiation, sandblasting, and chemical etching. In the plate member 14a, the rough surface processed portion 14a1 can be provided around the through hole 14b. The rough surface processed portion 14a1 can be provided at a position that is closer to the inside than the position (groove 14e) pressed by the mold 60. In this embodiment, the rough surface processed portion 14a1 is provided in an area inside the recess 14f. The rough surface processed portion 14a1 can also be formed on the inner circumferential surface of the through hole 14b. By providing the rough surface processed portion 14a1 on the plate member 14a, the bonding property between the plate member 14a and the seal 30 is improved. The surface roughness (arithmetic mean roughness Ra) of the roughened portion 14a1 is higher than that of the portion not subjected to the roughening process. The arithmetic mean roughness Ra can be measured using a stylus-type surface roughness measuring instrument based on JIS B0601:2001, for example.

[0033] In this embodiment, the roughening process is performed by laser irradiation. By performing the roughening process by laser irradiation, it is unnecessary to perform processes such as covering and removal during the process. Therefore, the mass productivity of the plate member 14a is improved.

[0034] The morphology of the surface of the rough surface processed portion 14a1 is not particularly limited. The surface that has been roughened by laser irradiation may have a plurality of convex portions that are raised compared to the surface of the base material before processing due to the smoke and dust that adheres during processing. The surface that has been roughened by chemical etching can form a plurality of concave portions that are recessed compared to the surface of the base material before processing. In addition, the surface of the rough surface processed portion 14a1 is not limited to a morphology with concave and convex portions. The surface of the rough surface processed portion 14a1 may also be a porous surface with a plurality of tiny pores. The rough surface processed portion 14a1 may also be a surface with a plurality of hook-shaped protrusions that are thin and raised in a layered manner.

[0035] The timing of the roughening process is not particularly limited. In this embodiment, after the recess 14f is formed, the roughening process is performed between the recess 14f and the through hole 14b. Alternatively, after the recess 14f is formed using the above method, the surface of the plate member 14a may be roughened from the edge of the recess 14f along the edge of the through hole 14b. This improves the positional accuracy of the roughening process. In addition, by forming the recess 14f in advance, the processing of the recess 14f will not affect the roughening process portion 14a1, thereby improving the quality of the roughening process portion 14a1.

[0036] <Step S20 of arranging the plate member 14a on the mold 60>

[0037] In the step S20 of placing the plate member 14a in the mold 60, as shown in FIG. Figure 5 As shown, with the electrode terminal 20 inserted through the through hole 14b of the plate member 14a, the electrode terminal 20 and the plate member 14a are placed in the mold 60. At this time, the electrode terminal 20 and the plate member 14a are placed in the mold 60 so that they do not contact each other.

[0038] In this embodiment, the electrode terminal 20 includes a shaft portion 22 and a plate portion 24. The shaft portion 22 is a portion that is inserted into the through hole 14b. The shaft portion 22 is a long plate-like component that extends in the height direction Z. The shape of the shaft portion 22 is not limited to a plate-like shape, and may also be a columnar shape (cylindrical shape, prism shape), etc. The shaft portion 22 is housed in the housing 10 of the manufactured storage device 100 and is connected to the electrode body 40 (see Figure 9 The shaft portion 22 can be connected to the electrode body 40 via a current collector terminal or the like.

[0039] The plate portion 24 is a member that is arranged along the plate member 14a when the shaft portion 22 is inserted into the through hole 14b. The plate portion 24 is continuous from the upper end of the shaft portion 22. The plate portion 24 is a portion that is exposed to the outside of the housing 10 and is connected to an external conductive member such as a bus bar (see Figure 1 The plate portion 24 extends in the width direction X (see Figure 1 The plate portion 24 has a generally rectangular planar shape. The plate portion 24 and the shaft portion 22 may also be formed by bending a long, plate-shaped conductive member. Furthermore, the electrode terminal need not be a continuous, integrated component with a shaft portion and a plate portion. For example, the shaft portion and the plate portion may be formed separately and then combined to form the electrode terminal.

[0040] The electrode terminal 20 may also include a roughened portion. The surface of the electrode terminal 20 that is housed in the mold 60 and exposed to the interior of the mold 60 can be roughened. By including a roughened portion in the electrode terminal 20, the bond between the electrode terminal 20 and the seal 30 can be improved. The method for roughening the electrode terminal 20 can be the same as the method for roughening the plate member 14a, and therefore a detailed description will be omitted.

[0041] The structure of the mold 60 can be appropriately set according to the shapes of the plate member 14a and the electrode terminal 20. In this embodiment, the mold 60 includes a lower mold 61 and an upper mold 66. The material of the mold 60 is not particularly limited, but can be composed of a high-strength metal material such as stainless steel, mold steel, or maraging steel.

[0042] The lower mold 61 is a mold for placing the plate member 14a and the electrode terminal 20. The lower mold 61 includes an upper surface 62 on which the plate member 14a is placed, and a recessed portion 63 recessed downward from the upper surface 62.

[0043] like Figure 5 As shown, the upper surface 62 of the lower mold 61 is a flat surface along the outer side surface 14c of the plate member 14a. The outer side surface 14c of the plate member 14a is placed on the upper surface 62. The lower mold 61 has a convex portion 62a that is pressed around the through hole 14b of the plate member 14a. The convex portion 62a protrudes upward from the upper surface 62 of the lower mold 61. When the plate member 14a is arranged on the lower mold 61, the convex portion 62a is continuously provided in the circumferential direction so as to surround the through hole 14b. The recess 63 has a shape that follows the shape of the plate portion 24. The recess 63 is generally recessed in a rectangular shape. The depth of the recess 63 is slightly smaller than the thickness of the plate portion 24 of the electrode terminal 20. The depth of the recess 63 is not particularly limited. The recess 63 functions as a cavity surface in the subsequent integral molding process.

[0044] The upper mold 66 is a mold that is pressed against the plate member 14a. The upper mold 66 includes a lower surface 67 placed on the plate member 14a and a recessed portion 68 that is recessed upward from the lower surface 67. The lower surface 67 of the upper mold 66 is a flat surface that is along the inner side surface 14d of the plate member 14a. The lower surface 67 is placed on the inner side surface 14d of the plate member 14a (see Figure 6 ). The upper mold 66 has a convex portion 67a that is pressed around the through hole 14b of the plate member 14a. The convex portion 67a protrudes downward from the lower surface 67 of the upper mold 66. When the upper mold 66 is placed on the plate member 14a, the convex portion 67a is continuously provided in the circumferential direction so as to surround the through hole 14b. The recess 68 is the same as the recess 63 and has a shape along the shape of the plate portion 24. The recess 68 is generally recessed in a rectangular shape. The depth of the recess 68 is approximately the same as the depth of the recess 63. The depth of the recess 68 is not particularly limited. A through hole 68a through which the shaft portion 22 of the electrode terminal 20 passes is provided in the recess 68 of the upper mold 66. In addition, an injection hole 69 is provided in the recess 68. The injection hole 69 is used to inject the resin 31 into the mold 60 (refer to Figure 7 The recess 68 functions as a cavity surface in the subsequent integral molding process.

[0045] The shape, size, and configuration of the protrusions 62a and 67a can also be set according to the structure of the plate member 14a and are not particularly limited. The protrusions 62a and 67a are portions that protrude in a roughly wedge-shaped cross-section when viewed along the direction in which the protrusions 62a and 67a are continuously arranged. The protrusions 62a and 67a become thinner in the height direction of the protrusions 62a and 67a. The protrusions 62a and 67a have roughly the same shape and size. In this embodiment, the protrusions 62a and 67a are arranged in positions that overlap in the vertical direction. In this embodiment, the protrusions 62a and 67a are arranged in positions that overlap with the second recess 14e formed on the outer side surface 14c and the inner side surface 14d of the plate member 14a. The height of the protrusions 62a and 67a is greater than the depth of the second recess 14e.

[0046] The plate member 14a is arranged on the upper surface 62 of the lower mold 61 so that the outer side surface 14c faces downward. In this embodiment, the plate member 14a is arranged on the lower mold 61 so that the second recess 14e fits into the protrusion 62a of the upper surface 62 of the lower mold 61. The plate member 14a is supported by the protrusion 62a. The outer side surface 14c of the plate member 14a is slightly raised from the upper surface 62 of the lower mold 61. The plate portion 24 of the electrode terminal 20 is arranged on the bottom surface of the recess 63 of the lower mold 61 so that the upper surface 24a faces downward. The electrode terminal 20 passes through the through hole 14b of the plate member 14a. The upper surface 24a of the plate portion 24 of the electrode terminal 20 protrudes downward from the outer side surface 14c of the plate member 14a.

[0047] In step S20 of placing the plate member 14a in the die 60, the plate member 14a is clamped by the lower die 61 and the upper die 66. The lower die 61 may be attached to a base (not shown). The upper die 66 may be attached to a press device (not shown).

[0048] like Figure 6 As shown, the plate member 14a is clamped by the lower mold 61 and the upper mold 66 in a state where the electrode terminal 20 is inserted into the through hole 14b, and is pressurized. The convex portion 67a of the upper mold 66 is pressed against the second concave portion 14e of the inner side surface 14d of the plate member 14a. The plate member 14a is pressurized by the convex portion 62a of the lower mold 61 and the convex portion 67a of the upper mold 66, which are arranged at corresponding positions in the up and down directions. The convex portions 62a and 67a of the lower mold 61 and the upper mold 66 are pressed against the periphery of the through hole 14b (the second concave portion 14e in this embodiment). At this time, the convex portions 62a and 67a bite into the periphery of the through hole 14b, and deformation occurs around the portion pressed by the convex portions 62a and 67a. The convex portions 62a and 67a bite into the periphery of the through hole 14b, and the resin 31 (refer to Figure 7 ) flows into mold 60.

[0049] <Step S30 of Integrally Molding the Plate Member 14a and the Seal 30>

[0050] In step S30 of integrally molding the plate member 14a and the seal 30, resin is poured into the mold 60 to integrally mold the plate member 14a and the seal 30. Here, the plate member 14a, the electrode terminal 20, and the seal 30 are integrally molded. The seal 30 is a member that seals the plate member 14a.

[0051] like Figure 7 As shown, resin 31 is poured into mold 60, which is provided with electrode terminal 20 and plate member 14a. Electrode terminal 20 and plate member 14a are joined via sealant 30 by so-called injection molding. Here, resin 31 is poured from injection hole 69 of upper mold 66. Resin 31 flows into the space enclosed by recess 63 of lower mold 61, recess 68 of upper mold 66, plate member 14a, and electrode terminal 20.

[0052] Thermoplastic resins such as polyethylene, polyamide, polypropylene, and vinyl chloride resin can be used as resin 31. After the resin 31 is injected, the mold 60 is cooled, thereby also cooling the resin 31. The cooled resin 31 solidifies, forming the seal 30. The seal 30 thus fills the space between the electrode terminal 20 and the plate member 14a. Thus, the plate member 14a, electrode terminal 20, and seal 30 are integrally formed, thereby manufacturing the case member 14.

[0053] The roughened surface 14a1 of the plate member 14a has a high surface roughness, allowing the resin 31 to easily penetrate the surface of the roughened surface 14a1. The resin 31 solidifies while still in the roughened surface 14a1. This enhances the bond strength between the seal 30 and the electrode terminal 20 after solidification, through the so-called anchoring effect.

[0054] Furthermore, the plate member 14a and the electrode terminal 20 are arranged in the mold 60 so as not to contact each other. Therefore, a sealant 30 is interposed between the plate member 14a and the electrode terminal 20 in the case member 14. This prevents interference between the plate member 14a and the electrode terminal 20. The upper surface 24a of the plate portion 24 of the electrode terminal 20 is not covered by the sealant 30 and is exposed outside the case 10.

[0055] However, when the plate member is arranged in the mold and the convex portion of the mold is pressed against the periphery of the through-hole of the plate member, the plate member may be deformed due to being pressed by the convex portion. For example, due to being pressed by the convex portion of the mold, the portion of the plate member pressed by the convex portion may be concave. According to the present inventors' understanding, since the portion pressed by the convex portion is concave, there may be a situation where the surrounding area thereof bulges. For example, a portion bulging due to plastic deformation may be formed between the portion pressed by the convex portion and the through-hole. As a result, the flatness between the portion pressed by the convex portion and the through-hole may be impaired. As a result, the bonding between the plate member and the seal may be weakened.

[0056] In the above embodiment, the method for manufacturing the housing member 14 includes step S10 of preparing the plate member 14a, step S20 of placing the plate member 14a in the mold 60, and step S30 of integrally molding the plate member 14a and the seal 30. In step S30 of integrally molding the plate member 14a and the seal 30, resin 31 is flowed into the mold 60, thereby integrally molding the plate member 14a and the seal 30 that seals the plate member 14a. The mold 60 has protrusions 62a and 67a that are pressed against the periphery of the through-hole 14b of the plate member 14a. Step S20 of placing the plate member 14a in the mold 60 includes the step of pressing the protrusions 62a and 67a of the mold 60 against the periphery of the through-hole 14b of the plate member 14a. The plate member 14a has a recess 14f formed between the portion pressed by the protrusions 62a and 67a of the mold 60 and the through-hole 14b.

[0057] like Figure 8 As shown, deformation occurs around the area of the plate member 14a pressed by the protrusions 62a and 67a. At this time, by forming the recess 14f between the area pressed by the protrusions 62a and 67a of the mold 60 and the through-hole 14b, deformation is easily generated between the recess 14f and the area pressed by the protrusions 62a and 67a. For example, due to the pressure from the protrusions 62a and 67a, the area between the recess 14f and the area pressed by the protrusions 62a and 67a in the plate member 14a is easily deformed toward the recess 14f. Therefore, the deformation caused by the pressure from the protrusions 62a and 67a is unlikely to spread to areas closer to the through-hole 14b than the recess 14f. As a result, a flat state is easily maintained between the recess 14f and the through-hole 14b. As a result, the bondability between the integrally formed plate member 14a and the seal 30 is improved. As a result, in the electrical storage device 100 , the airtightness achieved by the seal 30 is improved.

[0058] The dimensions of recessed portion 14f are not particularly limited, but may be determined based on the amount of deformation caused by the convex portions 62a and 67a pressing against plate member 14a. For example, the volume of recessed portion 14f of plate member 14a may be set to be greater than the volume of plate member 14a that is encroached upon by convex portions 62a and 67a when pressed against through-hole 14b of mold 60. This makes it more difficult for deformation caused by the convex portions 62a and 67a to extend beyond recessed portion 14f to the through-hole 14b side.

[0059] In the above embodiment, the plate member 14a is roughened at least between the recessed portion 14f and the through-hole 14b to improve adhesion with the seal 30. This plate member 14a is also less susceptible to deformation between the recessed portion 14f and the through-hole 14b, making it easier to maintain the roughened portion. As a result, the anchoring effect improves adhesion between the plate member 14a and the seal 30.

[0060] In the above embodiment, the second recessed portion 14e is provided at the position of the plate member 14a pressed by the protrusions 62a and 67a of the mold 60. This facilitates positioning of the plate member 14a relative to the mold 60. Furthermore, by preliminarily recessing the position pressed by the protrusions 62a and 67a, the amount of deformation of the plate member 14a when pressed by the protrusions 62a and 67a can be reduced.

[0061] In the above embodiment, the through-hole 14b of the plate member 14a is rectangular. The second recess 14e is provided outside at least the corner 14b2 of the rectangular through-hole 14b. Compared to the straight portion 14b1, the area from the corner 14b2 of the through-hole 14b to the corner 14e2 of the second recess 14e is smaller than the area pressed by the protrusions 62a and 67a in the corner 14b2. Therefore, the amount of deformation per unit area between the corner 14b2 of the through-hole 14b and the corner 14e2 of the second recess 14e may increase. By providing the second recess 14e outside the corner 14b2, deformation can be easily reduced in areas where deformation is likely to increase. In the case where the recess 14f is provided locally around the through-hole 14b for the same reason, the recess 14f may also be provided outside the corner 14b2.

[0062] In the above embodiment, the second recess 14e of the plate member 14a surrounds the through hole 14b over the entire circumference. This makes it possible to easily suppress deformation even if any portion between the through hole 14b and the second recess 14e deforms.

[0063] Furthermore, the recessed portion 14f of the plate member 14a surrounds the through hole 14b over the entire circumference. This makes it possible to easily suppress deformation even when any portion between the through hole 14b and the second recessed portion 14e is deformed.

[0064] In the above embodiment, the projections 62a and 67a of the mold 60 are wedge-shaped. This prevents the resin 31 from flowing out of the mold 60. Furthermore, since the size of the biting plate member 14a is reduced, deformation of the plate member 14a can be suppressed.

[0065] In the above embodiment, the recessed portion 14f is provided close to the position pressed by the convex portions 62a and 67a of the mold 60. This makes it easy to contain deformation of the plate member 14a caused by being pressed by the convex portions 62a and 67a within a narrow range.

[0066] like Figure 9 As shown, the case member 14 manufactured by the above manufacturing method includes a plate member 14a having a through-hole 14b formed therein, an electrode terminal 20 inserted into the through-hole 14b of the plate member 14a, and a seal 30 interposed between the plate portion 24 and the electrode terminal 20. The plate member 14a includes a continuous groove 14e surrounding the through-hole 14b, and a recess 14f formed between the groove 14e and the through-hole 14b. The seal 30 enters the recess 14f. The case member 14 can be used as the cover 14 of the electrical storage device 100. In addition, the electrode body is housed in the case body 12 by a known method, and the opening of the case body 12 is sealed using the cover 14, thereby manufacturing the electrical storage device 100.

[0067] Furthermore, the case member 14 is not limited to the above-described embodiment. When the electrode terminals and the seal are provided on the case body, the case member serving as the case body can also be manufactured using the above-described method. The case member disclosed herein can constitute the case body or the cover.

[0068] The case member 14 disclosed herein is integrally formed with the plate member 14a, the electrode terminal 20, and the seal 30. However, the present invention is not limited to this embodiment. The above-described method for manufacturing the case member 14 can also be applied to the case where a component intended to be integrally formed with the case 10, such as a safety valve, is manufactured as a separate body from the case 10.

[0069] The above describes various aspects of the technology disclosed herein. Unless otherwise specified, the embodiments and the like described herein do not limit the present invention. In addition, the technology disclosed herein can be modified in various ways. Unless special problems arise, the various components and the various processes mentioned herein can be appropriately omitted or appropriately combined. In addition, this specification includes the disclosures described in the following items.

[0070] Item 1:

[0071] A method for manufacturing a housing component for an electrical storage device, wherein:

[0072] The process includes the following steps, namely:

[0073] a step of preparing a plate-shaped plate member having a through hole formed therein;

[0074] a step of placing the plate member in a mold; and

[0075] a step of flowing resin into the mold to integrally mold the plate member and a sealant for sealing the plate member;

[0076] The mold has a convex portion that is pressed against the periphery of the through hole of the plate member.

[0077] The step of placing the plate member in a mold includes pressing the convex portion of the mold against the periphery of the through hole of the plate member.

[0078] The plate member has a recessed portion formed between a position pressed by the convex portion of the mold and the through hole.

[0079] Item 2:

[0080] In the method for manufacturing a case member for an electrical storage device according to item 1,

[0081] The plate member is subjected to a roughening process at least between the recessed portion and the through hole.

[0082] Item 3:

[0083] In the method for manufacturing a case member for an electrical storage device according to item 2,

[0084] The process of preparing the above-mentioned plate components includes the following steps, namely:

[0085] forming the recessed portion in the plate member; and

[0086] After the recess is formed, the roughening process is performed between the recess and the through hole.

[0087] Item 4:

[0088] In the method for manufacturing a case member for an electrical storage device according to any one of items 1 to 3,

[0089] A second recessed portion is provided at a position of the plate member that is pressed by the convex portion of the mold.

[0090] Item 5:

[0091] In the method for manufacturing a case member for an electrical storage device according to item 4,

[0092] The through hole of the plate member is rectangular.

[0093] The second recess is provided at least outside a corner of the rectangular through-hole.

[0094] Item 6:

[0095] In the method for manufacturing a case member for an electrical storage device according to item 4 or 5,

[0096] The second recess of the plate member surrounds the through hole over the entire circumference.

[0097] Item 7:

[0098] In the method for manufacturing a case member for an electrical storage device according to any one of items 1 to 6,

[0099] The volume of the recessed portion of the plate member is equal to or larger than a volume of the plate member caused by the protrusion of the mold being pressed against the periphery of the through-hole of the plate member.

[0100] Item 8:

[0101] In the method for manufacturing a case member for an electrical storage device according to any one of items 1 to 7,

[0102] The recessed portion of the plate member surrounds the through hole over the entire circumference.

[0103] Item 9:

[0104] In the method for manufacturing a case member for an electrical storage device according to any one of items 1 to 8,

[0105] The convex portion of the mold has a wedge shape.

[0106] Item 10:

[0107] In the method for manufacturing a case member for an electrical storage device according to any one of items 1 to 9,

[0108] The recessed portion is provided close to a position pressed by the raised portion of the mold.

[0109] Item 11:

[0110] A housing component for an electrical storage device, comprising:

[0111] a plate member having a plate shape and formed with a through hole;

[0112] an electrode terminal inserted into the through hole of the plate member; and

[0113] a seal member interposed between the plate member and the electrode terminal;

[0114] The plate member includes a continuous groove surrounding the through hole, and a recess formed between the groove and the through hole.

[0115] The sealing member enters the recess.

[0116] Item 12:

[0117] An electric storage device comprising:

[0118] Electrode body;

[0119] a shell body having an opening for accommodating the electrode body; and

[0120] a cover mounted on the opening,

[0121] The case body or the cover is the case member for the electrical storage device according to Item 11.

Claims

1. A method for manufacturing a housing component for an electrical storage device, characterized in that: The process includes the following steps, namely: a step of preparing a plate-shaped plate member having a through hole formed therein; a step of placing the plate member in a mold; and a step of causing resin to flow into the mold to integrally mold the plate member and a sealant for sealing the plate member; The mold has a convex portion that is pressed against the periphery of the through hole of the plate member. The step of placing the plate member on a mold includes pressing the convex portion of the mold against the periphery of the through hole of the plate member. The plate member has a recessed portion formed between a position pressed by the convex portion of the mold and the through-hole.

2. The method for manufacturing a case member for an electrical storage device according to claim 1, wherein: The plate member is subjected to a roughening process at least between the recessed portion and the through-hole.

3. The method for manufacturing a case member for an electrical storage device according to claim 2, wherein: The process of preparing the plate component includes the following steps, namely: forming the recess in the plate member; and After the recessed portion is formed, the roughening process is performed between the recessed portion and the through-hole.

4. The method for manufacturing a case member for an electrical storage device according to any one of claims 1 to 3, wherein: A second recessed portion is provided at a position of the plate member that is pressed by the raised portion of the mold.

5. The method for manufacturing a case member for an electrical storage device according to claim 4, wherein: The through hole of the plate member is rectangular, The second recess is provided at least outside a corner of the rectangular through-hole.

6. The method for manufacturing a case member for an electrical storage device according to claim 4, wherein: The second recess of the plate member surrounds the through hole over the entire circumference.

7. The method for manufacturing a case member for an electrical storage device according to any one of claims 1 to 3, wherein: The volume of the recessed portion of the plate member is equal to or larger than the volume of the plate member that is bitten into by the convex portion when the convex portion of the mold is pressed against the periphery of the through-hole of the plate member.

8. The method for manufacturing a case member for an electrical storage device according to any one of claims 1 to 3, wherein: The recessed portion of the plate member surrounds the through hole over the entire circumference.

9. The method for manufacturing a case member for an electrical storage device according to any one of claims 1 to 3, wherein: The convex portion of the mold has a wedge shape.

10. The method for manufacturing a case member for an electrical storage device according to any one of claims 1 to 3, wherein: The recessed portion is provided close to a position pressed by the raised portion of the mold.

11. A housing component for an electrical storage device, characterized in that: have: a plate member having a plate shape and formed with a through hole; an electrode terminal inserted into the through hole of the plate member; and a seal member interposed between the plate member and the electrode terminal, The plate member includes a continuous groove surrounding the through hole and a recess formed between the groove and the through hole. The seal enters the recess.

12. An electric storage device, characterized in that: have: Electrode body; a shell body having an opening for accommodating the electrode body; and a cover mounted on the opening, The case body or the cover is the case member for an electrical storage device according to claim 11 .

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