Preparation method and structure of electroplating-free glass substrate with buffer layer

Abstract

The invention discloses a preparation method of an electroplating-free glass substrate with a buffer layer, and relates to the technical field of glass substrate preparation, and the preparation method comprises the following steps: coating the outer surface of a metal wire with a first buffer layer to obtain a metal composite wire; a plurality of metal composite wires are vertically arranged in a mold; pouring molten glass into the mold, cooling and shaping, and demolding to obtain a glass block; and cutting the glass block into single pieces of glass to obtain the glass substrate. According to the preparation method and structure of the electroplating-free glass substrate with the buffer layer, the buffer layer matched with electroplating is omitted, the electroplating process and the seed layer process are omitted, the CMP process is carried out after electroplating, electric signal transmission is facilitated, 100% TGV through holes and 100% metal are filled without holes, the steps of punching and electroplating are completely avoided, void-free filling is naturally achieved, and the production efficiency is improved. The reliability is higher, cavities easily formed by electroplating are avoided, the metal wire is provided with the buffer layer, and the difficulty that the buffer layer cannot be uniformly prepared in the holes is also solved.

Description

Technical Field

[0001] The present invention relates to the technical field of glass substrate preparation, and in particular to a method and structure for preparing a glass substrate with a buffer layer without the need for electroplating. Background Art

[0002] The existing glass substrate preparation steps generally include: depositing a seed layer after drilling, electroplating to fill the holes, photolithography and development to form a pattern, and laminating the dielectric material before further processing. The defects of existing glass substrate preparation include: 1. An additional step is required after drilling to apply a surface buffer layer such as PI or LCP, which easily leads to buffer layer waste; 2. Filling copper into the TGV hole can easily lead to uneven filling or voids when electroplating deep holes; 3. A conductive seed layer must first be deposited on the inner wall of the glass hole. This step requires vacuum deposition equipment, which is complex and energy-intensive; 4. Chemical mechanical polishing is required after filling the hole to level the glass surface and the excess copper layer. This is not only a cumbersome process and high cost, but also poses a risk of glass breakage; 5. The TGV copper pillars formed by electroplating may have structures such as grain boundaries and voids, forming micro-reflection points, which are not conducive to the complete transmission of high-speed / high-frequency signals.

[0003] Therefore, the applicant has developed a method and structure for preparing a glass substrate with a buffer layer without the need for electroplating to solve the above problems. Summary of the Invention

[0004] The present invention proposes a method and structure for preparing a glass substrate with a buffer layer without electroplating, so as to solve the problems of existing glass substrate preparation methods such as wasting buffer layers, easily forming voids, complicated processes, high costs, and being unfavorable for the complete transmission of high-speed / high-frequency signals.

[0005] The present invention achieves the above-mentioned purpose through the following technical solutions: The present invention provides a method for preparing a glass substrate having a buffer layer without requiring electroplating, comprising: Coating a first buffer layer on the outer surface of the metal wire to obtain a metal composite wire; Arranging a plurality of the metal composite wires vertically in a mold, wherein the mold is a hollow shell; After pouring glass liquid into the mold, cooling and shaping it, and demoulding to obtain a glass block; The glass block is cut into individual pieces of glass to obtain a glass substrate.

[0006] Furthermore, a second buffer layer is wrapped on the outer surface of the single-piece glass, and then exposure and development are performed to expose the TGV opening, and the remaining portion of the second buffer layer is retained to obtain a glass substrate.

[0007] Furthermore, the first buffer layer and the second buffer layer are ABF glue or PI glue.

[0008] Furthermore, double-sided PI adhesive is applied to the glass substrate.

[0009] Furthermore, redistribution layers are provided on both sides of the glass substrate.

[0010] Furthermore, a first adhesive layer is provided between the metal wire and the first buffer layer.

[0011] Furthermore, a second adhesive layer is wrapped on the outer surface of the first buffer layer to obtain a metal composite wire.

[0012] The present invention also provides a glass substrate having a buffer layer that does not require electroplating. The glass substrate is prepared according to the method for preparing a glass substrate having a buffer layer that does not require electroplating.

[0013] The beneficial effects of the present invention are: The present invention proposes a method and structure for preparing a glass substrate with a buffer layer that does not require electroplating. This method eliminates the buffer layer required for electroplating, and also eliminates the electroplating process, seed layer process, and CMP process after electroplating. Through this method, straight through holes can be made, which facilitates the transmission of electrical signals. The through holes are 100% TGV and 100% metal-filled without voids, completely avoiding the steps of drilling and electroplating. Void-free filling is naturally achieved, resulting in higher reliability and avoiding the easy formation of voids during electroplating. The metal wire has its own buffer layer, which also solves the problem of the buffer layer being unable to be uniformly prepared in the hole. The overall process chain is shortened, the yield is higher, and the cost is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a flow chart of the method for preparing a glass substrate with a buffer layer without electroplating in this application. DETAILED DESCRIPTION

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the embodiments of the present invention. It should be understood that the described embodiments are only a portion of the embodiments of the present invention, not all of them. Generally, the components of the embodiments of the present invention described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0016] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort shall fall within the scope of protection of the present invention.

[0017] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0018] In the description of the present invention, it should be understood that the terms "upper", "lower", "inside", "outside", "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. These are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0019] Furthermore, the terms “first”, “second”, etc. are merely used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it should also be noted that, unless otherwise expressly specified or limited, terms such as "disposed" and "connected" should be understood in a broad sense. For example, "connected" can mean a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also mean internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0021] The specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0022] The present invention achieves the above-mentioned purpose through the following technical solutions: like Figure 1 As shown, the present invention provides a method for preparing a glass substrate having a buffer layer without electroplating, comprising: Coating a first buffer layer on the outer surface of the metal wire to obtain a metal composite wire; Arranging a plurality of the metal composite wires vertically in a mold, wherein the mold is a hollow shell; After pouring glass liquid into the mold, cooling and shaping it, and demoulding to obtain a glass block; The glass block is cut into individual pieces of glass to obtain a glass substrate.

[0023] The glass liquid can be made of quartz glass, soda-lime glass, aluminosilicate glass, or lead silicate glass.

[0024] In one embodiment, a second buffer layer is wrapped around the outer surface of the single-piece glass, and then exposure and development are performed to expose the TGV opening, while the remaining portion of the second buffer layer is retained to obtain a glass substrate.

[0025] In one embodiment, the first buffer layer and the second buffer layer are made of ABF glue or PI glue.

[0026] In one embodiment, double-sided PI adhesive is applied to the glass substrate.

[0027] In one embodiment, redistribution layers are provided on both sides of the glass substrate.

[0028] In one embodiment, a first adhesive layer is provided between the metal wire and the first buffer layer, thereby preventing the first buffer layer from falling off.

[0029] In one embodiment, a second adhesive layer is wrapped around the outer surface of the first buffer layer to obtain a metal composite wire, thereby preventing the metal composite wire from falling off the mold.

[0030] In one embodiment, the mold has a length of 510 mm, a width of 515 mm, and a height of 0.01-5 m.

[0031] In one embodiment, the thickness of the single piece of glass is in the range of 0.5 mm.

[0032] In one embodiment, the first buffer layer, the second buffer layer, the first adhesive layer, and the second adhesive layer may be wrapped by immersing the metal wire / single glass into a corresponding wrapping material liquid, or by slit coating, spary spraying, or the like.

[0033] The first adhesive layer and the second adhesive layer can be made of adhesive materials such as epoxy resin glue, nickel-chromium alloy adhesive layer, organic silicone, polymer-based adhesive, etc.

[0034] The present invention also provides a glass substrate having a buffer layer that does not require electroplating. The glass substrate is prepared according to the method for preparing a glass substrate having a buffer layer that does not require electroplating.

[0035] In traditional processes, before electroplating, in order to prevent stress cracking on the glass surface or enhance metal adhesion, a soft film layer is often coated on the glass as an "electroplating auxiliary buffer layer" or "seed layer auxiliary film". However, the preparation of the buffer layer is difficult and costly. Therefore, the present invention proposes a method for preparing a glass substrate with a buffer layer that does not require electroplating. The buffer layer for electroplating is eliminated, and the electroplating process, seed layer process, and CMP process after electroplating are omitted. Through this method, straight through holes can be made, which is conducive to the transmission of electrical signals. The 100% TGV through holes and 100% metal filling without voids completely avoid the steps of drilling and electroplating, and naturally achieve void-free filling, which has higher reliability and avoids the easy formation of voids by electroplating. The metal wire has its own buffer layer, which also solves the difficulty of uniformly preparing the buffer layer in the hole. The overall process chain is shorter, the yield is higher, and the cost is lower.

[0036] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. A method for preparing a glass substrate having a buffer layer without electroplating, characterized in that: include: Coating a first buffer layer on the outer surface of the metal wire to obtain a metal composite wire; Arranging a plurality of the metal composite wires vertically in a mold, wherein the mold is a hollow shell; After pouring glass liquid into the mold, cooling and shaping it, and demoulding to obtain a glass block; The glass block is cut into individual pieces of glass to obtain a glass substrate.

2. The method for preparing a glass substrate having a buffer layer without electroplating according to claim 1, wherein: A second buffer layer is wrapped on the outer surface of the single-piece glass, and then exposure and development are performed to expose the TGV opening, while the remaining portion of the second buffer layer is retained to obtain a glass substrate.

3. The method for preparing a glass substrate having a buffer layer without electroplating according to claim 2, wherein: The first buffer layer and the second buffer layer are ABF glue or PI glue.

4. The method for preparing a glass substrate having a buffer layer without electroplating according to claim 1 or 2, characterized in that: PI glue is coated on both sides of the glass substrate.

5. The method for preparing a glass substrate having a buffer layer without electroplating according to claim 1 or 2, characterized in that: A redistribution layer is provided on both sides of the glass substrate.

6. The method for preparing a glass substrate having a buffer layer without electroplating according to claim 1, wherein: A first adhesive layer is disposed between the metal line and the first buffer layer.

7. The method for preparing a glass substrate having a buffer layer without electroplating according to claim 1, wherein: A second adhesive layer is wrapped on the outer surface of the first buffer layer to obtain a metal composite wire.

8. A glass substrate having a buffer layer without the need for electroplating, characterized in that: The glass substrate is a glass substrate prepared according to the method for preparing a glass substrate having a buffer layer without electroplating according to any one of claims 1 to 7.

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