Resin composition and product thereof

Abstract

The invention relates to a resin composition and a product thereof, the resin composition at least comprises benzocyclobutene-modified hydrocarbon resin, modified hydrocarbon resin and a nitroxide-containing free radical compound, the benzocyclobutene-modified hydrocarbon resin contains carbon-carbon unsaturated bonds, the modified hydrocarbon resin does not contain unsaturated bonds, the tensile strength is more than 10 MPa, and the nitroxide-containing free radical compound contains nitrogen and oxygen radicals. The nitroxide free radical-containing compound has a # imgabs0 # structure, and X1 in the structure is an oxygen free radical or a hydroxyl group. In the resin composition, the nitroxide free radical-containing compound can promote benzocyclobutene modified hydrocarbon resin and high-tension-strength modified hydrocarbon resin to form a good interpenetrating network structure, the curing reaction speed and the fluidity are optimized, the curing reaction degree and the adhesive filling property are improved, the crosslinking degree is increased, the thermal expansion coefficient is reduced, and then the thermal expansion performance of the resin composition is improved. The Df of the circuit substrate prepared from the resin composition is less than 0.001 under 10GHz, and the circuit substrate has excellent interconnection structure reliability, thermal expansion coefficient and adhesive filling property.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic industry, in particular to a resin composition and a product thereof. Background Art

[0002] Hydrocarbon resins are increasingly used in the preparation of circuit substrates due to their excellent electrical properties. However, circuit substrates made with them often suffer from problems such as low interconnect reliability, large thermal expansion coefficient, and abnormal resin filling, resulting in poor reliability of printed circuit boards (PCBs). Summary of the Invention

[0003] Based on this, it is necessary to provide a resin composition and its products to address the above problems. The circuit substrate made of the resin composition has a Df of less than 0.001 at 10 GHz and has excellent interconnection structure reliability, thermal expansion coefficient and filling properties.

[0004] A resin composition comprising at least a benzocyclobutene-modified hydrocarbon resin, a modified hydrocarbon resin, and a nitrogen oxide free radical compound, wherein the benzocyclobutene-modified hydrocarbon resin contains a carbon-carbon unsaturated bond, the modified hydrocarbon resin does not contain an unsaturated bond and has a tensile strength of greater than 10 MPa, and the nitrogen oxide free radical compound has the following structure:

[0005] ;

[0006] And X1 in the structure is an oxygen free radical or a hydroxyl group.

[0007] In one embodiment, the benzocyclobutene-modified hydrocarbon resin further satisfies at least one of the following conditions:

[0008] (1) The content of benzocyclobutene structure is between 5wt% and 90wt%;

[0009] (2) The content of carbon-carbon unsaturated bonds is between 5wt% and 50wt%;

[0010] (3) The weight average molecular weight is between 1000-20000.

[0011] In one embodiment, the modified hydrocarbon resin further satisfies at least one of the following conditions:

[0012] (1) Tensile strength is between 10MPa and 35MPa;

[0013] (2) The molecular chain of the modified hydrocarbon resin contains a styrene structure, and the content of the styrene structure is between 10wt% and 70wt%.

[0014] In one embodiment, the modified hydrocarbon resin is selected from at least one of hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-ethylene / propylene-styrene copolymer, and hydrogenated styrene-butadiene-divinylbenzene terpolymer.

[0015] In one embodiment, the nitrogen-oxygen free radical compound is selected from 、 、 、 At least one of .

[0016] In one embodiment, in the resin composition, based on 100 parts by weight of the benzocyclobutene-modified hydrocarbon resin, the amount of the modified hydrocarbon resin is 50 parts by weight to 250 parts by weight, and the amount of the nitrogen oxide free radical-containing compound is 0.001 parts by weight to 1 part by weight.

[0017] In one embodiment, the resin composition further comprises at least one of a curing accelerator, a filler, a cross-linking agent, a flame retardant, a hardening accelerator, an inorganic filler, a surface treatment agent, a colorant, a solvent, and a toughening agent.

[0018] In one embodiment, the 1H half-life decomposition temperature of the curing accelerator is between 135°C and 200°C.

[0019] In one embodiment, the curing accelerator is selected from at least one of di-tert-butyl diisopropylbenzene peroxide and tert-butyl hydroperoxide.

[0020] A product made from the resin composition, comprising a prepreg, a circuit substrate, and a printed circuit board.

[0021] In the resin composition of the present invention, the nitrogen oxide free radical compound can promote the formation of a good interpenetrating network structure between the benzocyclobutene-modified hydrocarbon resin and the modified hydrocarbon resin with a specific tensile strength, optimize the curing reaction speed and fluidity, improve the curing reaction degree and filling properties, increase the crosslinking degree, and reduce the thermal expansion coefficient. As a result, the circuit substrate made of the resin composition of the present invention has a Df of less than 0.001 at 10 GHz and has excellent interconnection structure reliability, thermal expansion coefficient and filling properties. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present invention, the present invention will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. On the contrary, the purpose of providing these embodiments or examples is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments or embodiments and are not intended to limit the present invention. The optional scope of the term "and / or" used herein includes any one of two or more related listed items, and also includes any and all combinations of related listed items, including any two related listed items, any more related listed items, or the combination of all related listed items.

[0024] In the present invention, when referring to numerical ranges, unless otherwise specified, the numerical ranges are considered continuous and include the minimum and maximum values of the range, as well as every value between such minimum and maximum values. Furthermore, when a range refers to an integer, every integer between the minimum and maximum values of the range is included. In addition, when multiple ranges are provided to describe a feature or characteristic, the ranges can be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges subsumed therein.

[0025] The resin composition provided by the present invention comprises at least a benzocyclobutene-modified hydrocarbon resin, a modified hydrocarbon resin, a nitrogen oxide free radical compound, and a solvent, wherein the benzocyclobutene-modified hydrocarbon resin contains a carbon-carbon unsaturated bond, the modified hydrocarbon resin does not contain an unsaturated bond and has a tensile strength of 10 MPa or more, and the nitrogen oxide free radical compound has the following structure:

[0026] ;

[0027] And X1 in the structure is an oxygen free radical or a hydroxyl group.

[0028] In the resin composition of the present invention, the benzocyclobutene-modified hydrocarbon resin can self-cure, and the presence of the nitrogen oxide free radical compound can, on the one hand, optimize the curing reaction speed and fluidity of the benzocyclobutene-modified hydrocarbon resin, improve the degree of curing reaction and filling properties, increase the crosslinking degree, and reduce the thermal expansion coefficient. On the other hand, it can promote the formation of a good interpenetrating network structure between the benzocyclobutene-modified hydrocarbon resin and the modified hydrocarbon resin with high tensile strength. As a result, the circuit substrate made of the resin composition of the present invention has a Df of less than 0.001 at 10 GHz and has excellent interconnection structure reliability, thermal expansion coefficient, and filling properties.

[0029] Optionally, the content of the benzocyclobutene structure in the benzocyclobutene-modified hydrocarbon resin is controlled between 5wt% and 90wt%, preferably between 10wt% and 50wt%, and / or the content of carbon-carbon unsaturated bonds is controlled between 5wt% and 50wt%, preferably between 10wt% and 30wt%, both of which are beneficial to improving the reliability of the interconnection structure of the circuit substrate.

[0030] Optionally, the weight average molecular weight of the benzocyclobutene-modified hydrocarbon resin is controlled between 1,000 and 20,000, preferably between 1,500 and 8,000, which is beneficial to improving the reliability of the interconnection structure of the circuit substrate.

[0031] Optionally, the tensile strength of the modified hydrocarbon resin is controlled to be between 10 MPa and 35 MPa, which is beneficial to improving the reliability of the interconnection structure of the circuit substrate and the processing performance of the circuit substrate.

[0032] Optionally, the modified hydrocarbon resin contains a styrene structure in its molecular chain, and the content of the styrene structure is between 15wt% and 70wt%, which is beneficial to improving the reliability of the interconnection structure of the circuit substrate.

[0033] Furthermore, the modified hydrocarbon resin is selected from at least one of hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-ethylene / propylene-styrene copolymer, and hydrogenated styrene-butadiene-divinylbenzene terpolymer.

[0034] It should be noted that X1 in the nitrogen oxide free radical compound can be an oxygen free radical or a hydroxyl group. When X1 is a hydroxyl group, the hydroxyl group in the resin composition can remove hydrogen to form a nitrogen oxide free radical.

[0035] Optionally, the nitrogen-oxygen free radical compound is selected from 、 、 、 At least one of the above has a better effect.

[0036] Optionally, in the resin composition, based on 100 parts by weight of the benzocyclobutene-modified hydrocarbon resin, the amount of the modified hydrocarbon resin is 50 parts by weight to 250 parts by weight, and the amount of the nitrogen oxide free radical-containing compound is 0.001 parts by weight to 1 part by weight.

[0037] Optionally, the resin composition further includes at least one of a curing accelerator, a filler, a cross-linking agent, a flame retardant, a hardening accelerator, an inorganic filler, a surface treatment agent, a colorant, a solvent, and a toughening agent. Based on 100 parts by weight of the benzocyclobutene-modified hydrocarbon resin, the amount of the curing accelerator is less than or equal to 2 parts by weight, which is beneficial to improving the curing effect. The amount of the filler is 10 parts by weight to 300 parts by weight.

[0038] Furthermore, a curing accelerator with a 1H half-life decomposition temperature between 135°C and 200°C can be selected to cooperate with the nitrogen-oxygen free radical compound to promote the reaction of the benzocyclobutene-modified resin and the high-tensile strength modified hydrocarbon resin to form a good interpenetrating network structure, which is beneficial to further improve the interconnection structure reliability and thermal expansion coefficient of the circuit substrate.

[0039] Optionally, the curing accelerator is selected from at least one of di-tert-butyl diisopropylbenzene peroxide and tert-butyl hydroperoxide.

[0040] Optionally, the filler is selected from silicon dioxide, aluminum hydroxide, magnesium hydroxide, aluminum oxide, etc.

[0041] Optionally, the solvent in the resin composition is selected from organic solvents such as toluene and acetone.

[0042] The present invention also provides a product made from the resin composition described above, wherein the product includes a prepreg, a circuit substrate, and a printed circuit board.

[0043] Specifically, the prepreg includes a reinforcing material and the resin composition as described above attached to the reinforcing material.

[0044] The present invention does not limit the specific method for preparing the prepreg from the resin composition. The resin composition can be formed on the reinforcing material by dipping and / or coating, and then dried at a temperature of 112° C. to 170° C. to volatilize the solvent to obtain the prepreg.

[0045] In the present invention, there is no particular limitation on the reinforcing material, which is usually glass fiber cloth.

[0046] Specifically, the circuit substrate is made of the prepreg described above, and has a Df of less than 0.001 at 10 GHz and excellent interconnection structure reliability, thermal expansion coefficient, and adhesive filling properties.

[0047] Specifically, the circuit substrate includes an insulating layer and a conductive layer arranged on at least one surface of the insulating layer, wherein the insulating layer is pressed from one or more superimposed semi-cured sheets as described above, and the conductive layer is selected from conductive materials such as copper foil and aluminum foil. The present invention does not limit this, and copper foil is preferably used.

[0048] Specifically, the printed circuit board is made of the circuit substrate described above.

[0049] Specifically, the printed circuit board is mainly made of the circuit substrate through processes such as drilling, hole filling, micro-etching, pre-impregnation, activation, acceleration, chemical copper and copper thickening.

[0050] Below, the technical solution of the present invention will be further described by the following specific examples. However, it will be understood by those skilled in the art that the following examples are only used to illustrate the present invention and should not be construed as limiting the scope of the present invention. Where specific conditions are not specified in the examples, the procedures were carried out according to conventional conditions or the conditions recommended by the manufacturer. Where the manufacturer of the reagents or instruments is not specified, they are all conventional products that can be obtained commercially.

[0051] In the following examples, benzocyclobutene-modified hydrocarbon resins were prepared in-house with reference to the preparation methods disclosed in CN115991808A and the like.

[0052] Example 1

[0053] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0054] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0055] Example 2

[0056] 100 parts by weight of benzocyclobutene-modified butadiene-styrene copolymer (benzocyclobutene structure content is 30wt%, carbon-carbon unsaturated bond content is 10wt%, weight average molecular weight is 5000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1052, tensile strength is 11.8MPa, styrene content is 20wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0057] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0058] Example 3

[0059] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 70wt%, carbon-carbon unsaturated bond content of 5wt%, weight average molecular weight of 3500), 200 parts by weight of hydrogenated styrene-ethylene / propylene-styrene copolymer (SEPS, brand: Kraton G1730, tensile strength of 20MPa, styrene content of 20wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0060] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0061] Example 4

[0062] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 75wt%, carbon-carbon unsaturated bond content of 2wt%, weight average molecular weight of 3600), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0063] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0064] Example 5

[0065] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content is 3wt%, carbon-carbon unsaturated bond content is 46wt%, weight average molecular weight is 3100), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength is 32.3MPa, styrene content is 42wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0066] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0067] Example 6

[0068] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand name Kraton G1652, tensile strength of 38MPa, styrene content of 30wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0069] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0070] Example 7

[0071] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand name Kraton G1645, tensile strength of 10MPa, styrene content of 13wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0072] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0073] Example 8

[0074] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.1 parts by weight of 0.5 parts by weight of di-tert-butyl dicumyl peroxide (1H half-life decomposition temperature is 140° C.) and 200 parts by weight of spherical silica are added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0075] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0076] Example 9

[0077] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.1 parts by weight of , 0.5 parts by weight of tert-butyl hydroperoxide (1H half-life decomposition temperature is 185° C.), and 200 parts by weight of spherical silica are added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0078] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0079] Example 10

[0080] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.1 parts by weight of , 0.5 parts by weight of benzoyl peroxide (1H half-life decomposition temperature is 90° C.), and 200 parts by weight of spherical silica are added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0081] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0082] Example 11

[0083] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 45 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0084] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0085] Example 12

[0086] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 260 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0087] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0088] Example 13

[0089] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 0.0009 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0090] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0091] Example 14

[0092] 100 parts by weight of benzocyclobutene-modified polybutadiene (benzocyclobutene structure content of 40wt%, carbon-carbon unsaturated bond content of 25wt%, weight average molecular weight of 3000), 200 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3MPa, styrene content of 42wt%), 1.1 parts by weight of 200 parts by weight of spherical silica were added to 1000 parts by weight of toluene solvent and mixed uniformly to obtain a resin composition.

[0093] 1078Q glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg with a glue content of 70%.

[0094] Comparative Example 1

[0095] The only difference between Comparative Example 1 and Example 1 is that the content of benzocyclobutene structure in the benzocyclobutene-modified polybutadiene is 65 wt %, the content of carbon-carbon unsaturated bonds is 0 wt %, and the weight average molecular weight is 3600.

[0096] Comparative Example 2

[0097] The only difference between Comparative Example 2 and Example 1 is that the brand of hydrogenated styrene-butadiene copolymer is Asahi Kasei H1221, the tensile strength is 9.5 MPa, and the styrene content is 12 wt %.

[0098] Comparative Example 3

[0099] The only difference between Comparative Example 3 and Example 1 is that the brand of hydrogenated styrene-butadiene copolymer is Kraton G1726, the tensile strength is 2 MPa, and the styrene content is 30 wt%.

[0100] Comparative Example 4

[0101] The difference between Comparative Example 4 and Example 1 is that no .

[0102] Comparative Example 5

[0103] The only difference between Comparative Example 5 and Example 1 is that Replace with .

[0104] Comparative Example 6

[0105] The difference between Comparative Example 6 and Example 1 is that no , but add 0.5 parts by weight of di-tert-butyl diisopropylbenzene peroxide (1H half-life decomposition temperature is 140°C).

[0106] The performance tests of the prepregs prepared in Examples 1-14 and Comparative Examples 1-6 were conducted. The test results are shown in Table 1. The test method is as follows:

[0107] 1. Dielectric loss Df: Two prepreg sheets were stacked and coated with copper foil on both sides. The sheets were then placed in a vacuum hot press and cured at 210°C for 100 minutes to form a circuit board. This test was conducted in accordance with IEC 61189-2-721-2015 at 10 GHz.

[0108] 2. Z-CTE: Ten prepregs were stacked and coated with copper foil on both sides. The resulting circuit board was then heat-pressed in a vacuum hot press and cured at 210°C for 100 minutes. This test was conducted in accordance with IPC-TM-650 2.4.24C.

[0109] 3. IST: The test method is based on IPC-TM650 2.6.26. Samples are heated from room temperature to 150°C and then back to room temperature (heating for 3 minutes, cooling for 2 minutes, with a 5-minute cycle). If the resistance change is greater than or equal to 10%, failure is indicated. The number of cycles at this point is recorded.

[0110] 4. Resin Fill Agglomeration: Overlay two prepreg sheets, attach a printed circuit board (PCB) with 2oz copper foil to the top and bottom, and press in a vacuum press at 400 PSI and a temperature increase of 3.0°C / min until the material temperature reaches 200°C. Remove the sample, slice it, and observe the resin fill under an optical microscope. Normal: The filler is evenly dispersed, with no resin agglomeration or cavitation. Agglomeration: The filler is absent from the resin. Resin agglomeration: The resin is not completely filled in the PCB, and cavitation: The resin does not completely fill the PCB, but rather has voids.

[0111] Table 1

[0112]

[0113] As shown in the Examples and Comparative Examples, circuit substrates made with the resin composition of the present invention exhibit a Df of less than 0.001 at 10 GHz, while also exhibiting excellent interconnect reliability, thermal expansion coefficient, and adhesive properties. Furthermore, Examples 4-5 demonstrate that the content of benzocyclobutene structures and carbon-carbon unsaturated bonds can affect the reliability and thermal expansion coefficient of the interconnect structure. Examples 6-7 demonstrate that the tensile strength and styrene content of the modified hydrocarbon resin can also affect the reliability of the interconnect structure. Examples 8-10 demonstrate that the addition of a curing accelerator with a 1H half-life decomposition temperature between 135°C and 200°C can help improve the reliability and thermal expansion coefficient of the interconnect structure. Examples 11-14 demonstrate that controlling the amount of benzocyclobutene-modified hydrocarbon resin, modified hydrocarbon resin, and nitrogen oxide-containing free radical compound can further improve the reliability and thermal expansion coefficient of the interconnect structure.

[0114] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0115] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A resin composition, characterized in that At least comprising a benzocyclobutene-modified hydrocarbon resin, a modified hydrocarbon resin, and a nitrogen-oxygen free radical compound, wherein the benzocyclobutene-modified hydrocarbon resin contains a carbon-carbon unsaturated bond, the modified hydrocarbon resin does not contain an unsaturated bond and has a tensile strength of more than 10 MPa, and the nitrogen-oxygen free radical compound has the following structure: ； And X1 in the structure is an oxygen free radical or a hydroxyl group.

2. The resin composition according to claim 1, wherein The benzocyclobutene-modified hydrocarbon resin further satisfies at least one of the following conditions: (1) The content of benzocyclobutene structure is between 5wt% and 70wt%; (2) The content of carbon-carbon unsaturated bonds is between 5wt% and 45wt%; (3) The weight average molecular weight is between 1000-20000.

3. The resin composition according to claim 1, wherein The modified hydrocarbon resin further satisfies at least one of the following conditions: (1) Tensile strength is between 10MPa and 35MPa; (2) The molecular chain of the modified hydrocarbon resin contains a styrene structure, and the content of the styrene structure is between 15wt% and 70wt%.

4. The resin composition according to claim 3, characterized in that The modified hydrocarbon resin is at least one selected from hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-ethylene / propylene-styrene copolymer, and hydrogenated styrene-butadiene-divinylbenzene terpolymer.

5. The resin composition according to claim 1, wherein The nitrogen-oxygen free radical compound is selected from 、 、 、 At least one of .

6. The resin composition according to claim 1, characterized in that In the resin composition, based on 100 parts by weight of the benzocyclobutene-modified hydrocarbon resin, the amount of the modified hydrocarbon resin is 50 parts by weight to 250 parts by weight, and the amount of the nitrogen oxide free radical-containing compound is 0.001 parts by weight to 1 part by weight.

7. The resin composition according to any one of claims 1 to 6, characterized in that The resin composition further comprises at least one of a curing accelerator, a filler, a cross-linking agent, a flame retardant, a hardening accelerator, an inorganic filler, a surface treatment agent, a dye, a solvent, and a toughening agent.

8. The resin composition according to claim 7, characterized in that The 1H half-life decomposition temperature of the curing accelerator is between 135°C and 200°C.

9. The resin composition according to claim 8, characterized in that The curing accelerator is selected from at least one of di-tert-butyl dicumyl peroxide and tert-butyl hydroperoxide.

10. A product made from the resin composition according to any one of claims 1 to 9, characterized in that: The products include prepregs, circuit substrates, and printed circuit boards.

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