Resin composition and product thereof

Abstract

The invention relates to a resin composition and a product thereof, the resin composition at least comprises modified polyphenyl ether resin, modified hydrocarbon resin and a crosslinking agent containing unsaturated bonds, a modified group of the modified polyphenyl ether resin has unsaturated double bonds, the modified hydrocarbon resin does not contain unsaturated bonds, and the tensile strength is more than 10 MPa. In the resin composition provided by the invention, the crosslinking agent containing unsaturated bonds can react with the modified polyphenyl ether resin with unsaturated double bonds, and forms an interpenetrating network with the saturated modified hydrocarbon resin with high tensile strength at the same time to obtain a polymer layer with high binding force, so that the aging resistance and humidity and heat resistance of the circuit substrate can be improved at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic industry, in particular to a resin composition and a product thereof. Background Art

[0002] Polyphenylene oxide (PPO) is widely used in circuit substrates due to its excellent dielectric properties. However, with the development of communications technology, the requirements for circuit substrates have gradually increased, and the dielectric properties of circuit substrates made with PPO no longer meet these requirements. Although compounding PPO with hydrocarbon resin can improve the dielectric properties of circuit substrates, the addition of hydrocarbon resin can lead to a rapid decline in the aging performance and moisture and heat resistance of the circuit substrate. Summary of the Invention

[0003] Based on this, it is necessary to provide a resin composition and a product thereof to address the above problems. The circuit substrate made of the resin composition has excellent aging resistance and moisture and heat resistance.

[0004] A resin composition comprises at least a modified polyphenylene ether resin, a modified hydrocarbon resin, and a crosslinking agent containing unsaturated bonds, wherein the modified group of the modified polyphenylene ether resin has an unsaturated double bond, and the modified hydrocarbon resin does not contain an unsaturated bond and has a tensile strength of more than 10 MPa.

[0005] In one embodiment, the modified polyphenylene ether resin is selected from at least one of vinylbenzyl polyphenylene ether resin, (meth)acryl polyphenylene ether resin, and vinyl polyphenylene ether resin.

[0006] In one embodiment, the modified groups of the modified polyphenylene ether resin contain only carbon and hydrogen elements.

[0007] In one embodiment, the modified hydrocarbon resin further satisfies at least one of the following conditions:

[0008] (1) Tensile strength is between 10MPa and 35MPa;

[0009] (2) The molecular chain of the modified hydrocarbon resin contains a styrene structure, and the content of the styrene structure is between 15wt% and 70wt%.

[0010] In one embodiment, the modified hydrocarbon resin is selected from at least one of hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-ethylene / propylene-styrene copolymer, and hydrogenated styrene-butadiene-divinylbenzene terpolymer.

[0011] In one embodiment, the cross-linking agent containing an unsaturated bond is selected from at least one of a diene compound, a trialkenyl isocyanurate compound, a multifunctional acrylate compound, and a multifunctional methacrylate compound.

[0012] In one embodiment, in the resin composition, based on 100 parts by weight of the modified polyphenylene ether resin, the amount of the modified hydrocarbon resin is 20 parts by weight to 100 parts by weight, and the amount of the cross-linking agent containing an unsaturated bond is 10 parts by weight to 50 parts by weight.

[0013] In one embodiment, the resin composition further comprises at least one of an initiator, a filler, a flame retardant, a hardening accelerator, an inorganic filler, a surface treatment agent, a colorant, a solvent, and a toughening agent.

[0014] In one embodiment, the initiator is selected from peroxide initiators.

[0015] A product made from the resin composition, comprising a prepreg, a circuit substrate, and a printed circuit board.

[0016] In the resin composition of the present invention, the crosslinking agent containing unsaturated bonds can react with the modified polyphenylene ether resin having unsaturated double bonds, and simultaneously form an interpenetrating network with the modified hydrocarbon resin having a specific tensile strength and saturation, thereby obtaining a polymer layer with high bonding strength, thereby simultaneously improving the aging resistance and moisture-heat resistance of the circuit substrate. DETAILED DESCRIPTION

[0017] To facilitate understanding of the present invention, the present invention will be described in more detail below. However, it should be understood that the present invention can be implemented in many different forms and is not limited to the embodiments or examples described herein. On the contrary, the purpose of providing these embodiments or examples is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments or embodiments and are not intended to limit the present invention. The optional scope of the term "and / or" used herein includes any one of two or more related listed items, and also includes any and all combinations of related listed items, including any two related listed items, any more related listed items, or the combination of all related listed items.

[0019] In the present invention, when referring to numerical ranges, unless otherwise specified, the numerical ranges are considered continuous and include the minimum and maximum values of the range, as well as every value between such minimum and maximum values. Furthermore, when a range refers to an integer, every integer between the minimum and maximum values of the range is included. In addition, when multiple ranges are provided to describe a feature or characteristic, the ranges can be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges subsumed therein.

[0020] The resin composition provided by the present invention comprises at least a modified polyphenylene ether resin, a modified hydrocarbon resin, and a crosslinker containing unsaturated bonds. The modified group of the modified polyphenylene ether resin comprises an unsaturated double bond, the modified hydrocarbon resin does not contain an unsaturated bond, and has a tensile strength of 10 MPa or greater. It is understood that the unsaturated double bonds in the crosslinker and the modified polyphenylene ether resin may be carbon-carbon double bonds or other unsaturated bonds.

[0021] In the resin composition of the present invention, the crosslinking agent containing unsaturated bonds can react with the modified polyphenylene ether resin having unsaturated double bonds, and simultaneously form an interpenetrating network with the modified hydrocarbon resin having a specific tensile strength and saturation, thereby obtaining a polymer layer with high bonding strength, thereby simultaneously improving the aging resistance and moisture-heat resistance of the circuit substrate.

[0022] Optionally, the modified polyphenylene ether resin having an unsaturated double bond in the modifying group can be selected from at least one of vinylbenzyl polyphenylene ether resin, (meth)acryl polyphenylene ether resin, and vinyl polyphenylene ether resin. Furthermore, when the modifying group in the modified polyphenylene ether resin contains only carbon and hydrogen elements and does not contain nitrogen, oxygen, or other impurities, it is more beneficial to improve the aging resistance and moisture-heat resistance of the circuit substrate. Therefore, the modified polyphenylene ether resin is more preferably vinylbenzyl polyphenylene ether resin or vinyl polyphenylene ether resin.

[0023] Optionally, the tensile strength of the modified hydrocarbon resin is controlled between 10 MPa and 35 MPa, and further controlled within the range of greater than or equal to 10 MPa and less than 20 MPa. This is beneficial to improving the aging resistance and moisture and heat resistance of the circuit substrate while also improving the processing performance of the circuit substrate.

[0024] Furthermore, the modified hydrocarbon resin contains a styrene structure in its molecular chain, and the content of the styrene structure is between 15 wt % and 70 wt %, which is beneficial for further improving the moisture and heat resistance of the circuit substrate.

[0025] Optionally, the modified hydrocarbon resin is selected from at least one of hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-ethylene / propylene-styrene copolymer, and hydrogenated styrene-butadiene-divinylbenzene terpolymer.

[0026] Optionally, the cross-linking agent containing an unsaturated bond is selected from at least one of a diene compound, a trialkenyl isocyanurate compound, a multifunctional acrylate compound, and a multifunctional methacrylate compound. Specifically, the diene compound can be selected from P,P'-divinyl-1,2-diphenylethane (BVPE), divinylbenzene, divinyl ether, etc., the trialkenyl isocyanurate compound can be selected from triallyl cyanurate (TAC), triallyl isocyanurate (TAIC), etc., the multifunctional acrylate compound can be selected from pentaerythritol tetraacrylate, diallyl isophthalate, etc., and the multifunctional methacrylate compound can be selected from dicyclopentadiene methacrylate, etc.

[0027] Furthermore, the cross-linking agent containing an unsaturated bond preferably contains vinylbenzene, such as bis(vinylphenyl)ethane, divinylbenzene, divinylbiphenyl, etc., which is beneficial to further increase the glass transition temperature (Tg) and bonding strength of the circuit substrate, thereby further improving the moisture and heat resistance of the circuit substrate.

[0028] Optionally, in the resin composition, based on 100 parts by weight of the modified polyphenylene ether resin, the amount of the modified hydrocarbon resin is 20 parts by weight to 100 parts by weight, and the amount of the cross-linking agent containing unsaturated bonds is 10 parts by weight to 50 parts by weight. Furthermore, by controlling the amount of the three components, the aging resistance and moisture and heat resistance of the circuit substrate can be further improved.

[0029] Optionally, the resin composition further comprises at least one of an initiator, a filler, a flame retardant, a hardening accelerator, an inorganic filler, a surface treatment agent, a colorant, a solvent, and a toughening agent. Based on 100 parts by weight of the modified polyphenylene ether resin, the amount of the initiator is 0.01 parts by weight to 3 parts by weight, and the amount of the filler is 50 parts by weight to 250 parts by weight.

[0030] Furthermore, the use of a peroxide initiator can better promote the reaction between the high-tensile-strength, saturated modified hydrocarbon resin, the unsaturated bond-containing crosslinker, and the modified polyphenylene ether resin having unsaturated double bonds to form a highly bonded polymer layer, thereby further improving the aging resistance and moisture-heat resistance of the circuit substrate. The peroxide initiator can be selected from dicumyl peroxide, for example.

[0031] Optionally, the filler is selected from silicon dioxide, aluminum hydroxide, magnesium hydroxide, aluminum oxide, etc.

[0032] Optionally, the solvent in the resin composition is selected from organic solvents such as toluene and acetone.

[0033] The present invention also provides a product made from the resin composition described above, wherein the product includes a prepreg, a circuit substrate, and a printed circuit board.

[0034] Specifically, the prepreg includes a reinforcing material and the resin composition as described above attached to the reinforcing material.

[0035] The present invention does not limit the specific method for preparing the prepreg from the resin composition. The resin composition can be formed on the reinforcing material by dipping and / or coating, and then dried at a temperature of 110° C. to volatilize the solvent to obtain the prepreg.

[0036] In the present invention, there is no particular limitation on the reinforcing material, which is usually glass fiber cloth.

[0037] Specifically, the circuit substrate is made of the prepreg described above, and the circuit substrate has excellent aging resistance and moisture and heat resistance.

[0038] Specifically, the circuit substrate includes an insulating layer and a conductive layer arranged on at least one surface of the insulating layer, wherein the insulating layer is pressed from one or more superimposed semi-cured sheets as described above, and the conductive layer is selected from conductive materials such as copper foil and aluminum foil. The present invention does not limit this, and copper foil is preferably used.

[0039] Specifically, the printed circuit board is made of the circuit substrate described above.

[0040] Specifically, the printed circuit board is mainly made of the circuit substrate through processes such as drilling, hole filling, micro-etching, pre-impregnation, activation, acceleration, chemical copper and copper thickening.

[0041] Below, the technical solution of the present invention will be further described by the following specific examples. However, it will be understood by those skilled in the art that the following examples are only used to illustrate the present invention and should not be construed as limiting the scope of the present invention. Where specific conditions are not specified in the examples, the procedures were carried out according to conventional conditions or the conditions recommended by the manufacturer. Where the manufacturer of the reagents or instruments is not specified, they are all conventional products that can be obtained commercially.

[0042] Example 1

[0043] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0044] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0045] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0046] Example 2

[0047] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 20 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1052, tensile strength of 11.8 MPa, styrene content of 20 wt%), 10 parts by weight of divinylbenzene (DVB), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0048] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0049] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0050] Example 3

[0051] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 100 parts by weight of hydrogenated styrene-ethylene / propylene-styrene copolymer (SEPS, brand Kraton G1641, tensile strength of 19 MPa, styrene content of 33 wt%), 50 parts by weight of triallyl isocyanurate (TAIC), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0052] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0053] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0054] Example 4

[0055] 100 parts by weight of (meth)acryloyl polyphenylene ether resin (brand name SA9000), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand name Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0056] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0057] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0058] Example 5

[0059] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), 0.5 parts by weight of di-tert-butyl dicumyl peroxide, and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0060] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0061] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0062] Example 6

[0063] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), 0.5 parts by weight of tert-butyl hydroperoxide, and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0064] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0065] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0066] Example 7

[0067] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), 0.5 parts by weight of azobisisobutyronitrile, and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0068] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0069] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0070] Example 8

[0071] 100 parts by weight of ethylene benzyl polyphenylene ether resin (brand OPE-2ST 2200), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Kraton G1652, tensile strength of 38 MPa, styrene content of 30 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0072] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0073] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0074] Example 9

[0075] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 15 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0076] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0077] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0078] Example 10

[0079] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 105 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 30 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0080] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0081] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0082] Example 11

[0083] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 8 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0084] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0085] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0086] Example 12

[0087] 100 parts by weight of vinylbenzyl polyphenylene ether resin (brand OPE-2ST 2200), 60 parts by weight of hydrogenated styrene-butadiene copolymer (SEBS, brand Asahi Kasei H1051, tensile strength of 32.3 MPa, styrene content of 42 wt%), 55 parts by weight of P,P'-divinyl-1,2-diphenylethane (BVPE), and 150 parts by weight of spherical silica were added to a solvent consisting of 100 parts by weight of butanone and 600 parts by weight of toluene, and mixed uniformly to obtain a resin composition.

[0088] 1078K glass fiber cloth was immersed in the resin composition obtained above, taken out and dried to obtain a prepreg.

[0089] Two prepregs obtained above were stacked, and copper foil was coated on both sides of the prepregs. The prepregs were then placed in a vacuum hot press and hot pressed to obtain a circuit substrate.

[0090] Comparative Example 1

[0091] The only difference between Comparative Example 1 and Example 1 is that the vinylbenzyl polyphenylene ether resin is replaced by a polyphenylene ether resin (brand SA90) which is unmodified and has a hydroxyl group at the end.

[0092] Comparative Example 2

[0093] The only difference between Comparative Example 2 and Example 1 is that the hydrogenated styrene-butadiene copolymer is replaced by styrene-butadiene copolymer (SBS, brand Asahi Kasei P2000, tensile strength of 24.5 MPa, styrene content of 67 wt%).

[0094] Comparative Example 3

[0095] The only difference between Comparative Example 3 and Example 1 is that the vinylbenzyl polyphenylene ether resin is replaced by a polyphenylene ether resin (brand SA90), which is unmodified and has hydroxyl groups at the end, and the hydrogenated styrene-butadiene copolymer is replaced by a styrene-butadiene copolymer (SBS, brand Asahi Kasei P2000, with a tensile strength of 24.5 MPa and a styrene content of 67 wt%).

[0096] Comparative Example 4

[0097] The only difference between Comparative Example 4 and Example 1 is that the brand of hydrogenated styrene-butadiene copolymer is Asahi Kasei H1221, the tensile strength is 9.5 MPa, and the styrene content is 12 wt %.

[0098] Comparative Example 5

[0099] The only difference between Comparative Example 5 and Example 1 is that the brand of hydrogenated styrene-butadiene copolymer is Kraton G1726, the tensile strength is 2 MPa, and the styrene content is 30 wt%.

[0100] Comparative Example 6

[0101] The only difference between Comparative Example 6 and Example 1 is that P,P'-divinyl-1,2-diphenylethane (BVPE) is not contained.

[0102] Comparative Example 7

[0103] The only difference between Comparative Example 7 and Example 1 is that P,P'-divinyl-1,2-diphenylethane (BVPE) is replaced by 4,4'-diaminodiphenyl sulfone (DDS).

[0104] Performance tests were performed on the circuit substrates prepared in Examples 1-12 and Comparative Examples 1-7. The test results are shown in Table 1.

[0105] Aging resistance test: The copper-removed circuit substrates were used as samples. The test method was conducted according to IEC61189-2-721-2015, and the test conditions were 10 GHz. The initial dielectric loss was recorded as Df1. The samples were baked at 188°C for 12 hours, and then the dielectric loss was retested as Df2. The dielectric loss aging difference = Df2-Df1. Moisture and heat resistance test: Three circuit substrates were removed from the copper-removed circuit substrates and three samples, each 2 inches wide and 2 inches long, were pressure-cooked for 3 hours, 5 hours, and 7 hours (test temperature 121°C, relative humidity 100%), respectively, according to the method described in IPC-TM-650 2.6.16. Then, according to the method described in IPC-TM-650 2.4.23, they were immersed in a 288°C tin furnace for 20 seconds, removed, and inspected for delamination or cracking. The exploded panels are marked with X; the unexploded panels are marked with O. The exploded panels of the three samples are recorded. It should be noted that when all three samples pass the 3h moisture and heat resistance test, they can be considered to meet the moisture and heat resistance requirements.

[0106] Table 1

[0107]

[0108] From the comparative examples, it can be seen that the use of unmodified polyphenylene ether resin, the use of hydrocarbon resin containing unsaturated bonds, the use of modified hydrocarbon resin with a tensile strength of less than 10 MPa, and the use of no cross-linking agent containing unsaturated bonds cannot simultaneously improve the aging resistance and moisture and heat resistance of the circuit substrate.

[0109] In addition, it can be seen from Example 4 that when the modifying group of the modified polyphenylene ether resin contains only carbon and hydrogen elements and does not contain impurity elements such as nitrogen and oxygen, it is more conducive to improving the aging resistance and moisture-heat resistance of the circuit substrate; it can be seen from Examples 5-7 that when a peroxide initiator is added, the aging resistance and moisture-heat resistance of the circuit substrate can be better improved; it can be seen from Example 8 that when the tensile strength of the modified hydrocarbon resin is controlled between 10 MPa and 35 MPa, it is more conducive to improving the aging resistance and moisture-heat resistance of the circuit substrate; it can be seen from Examples 9-12 that by controlling the amount of modified polyphenylene ether resin, modified hydrocarbon resin and cross-linking agent containing unsaturated bonds, the aging resistance and moisture-heat resistance of the circuit substrate can be further improved.

[0110] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0111] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A resin composition, characterized in that The invention comprises at least a modified polyphenylene ether resin, a modified hydrocarbon resin and a cross-linking agent containing unsaturated bonds, wherein the modified group of the modified polyphenylene ether resin has an unsaturated double bond, and the modified hydrocarbon resin does not contain an unsaturated bond and has a tensile strength of more than 10 MPa.

2. The resin composition according to claim 1, wherein The modified polyphenylene ether resin is at least one selected from vinylbenzyl polyphenylene ether resin, (meth)acryl polyphenylene ether resin, and vinyl polyphenylene ether resin.

3. The resin composition according to claim 1, wherein The modified groups of the modified polyphenylene ether resin contain only carbon and hydrogen elements.

4. The resin composition according to claim 1, wherein The modified hydrocarbon resin further satisfies at least one of the following conditions: (1) Tensile strength is between 10MPa and 35MPa; (2) The molecular chain of the modified hydrocarbon resin contains a styrene structure, and the content of the styrene structure is between 15wt% and 70wt%.

5. The resin composition according to claim 4, characterized in that The modified hydrocarbon resin is at least one selected from hydrogenated styrene-butadiene copolymer, hydrogenated styrene-isoprene copolymer, hydrogenated styrene-butadiene-maleic anhydride terpolymer, hydrogenated styrene-ethylene / propylene-styrene copolymer, and hydrogenated styrene-butadiene-divinylbenzene terpolymer.

6. The resin composition according to claim 1, characterized in that The cross-linking agent containing an unsaturated bond is selected from at least one of a diene compound, a trialkenyl isocyanurate compound, a multifunctional acrylate compound, and a multifunctional methacrylate compound.

7. The resin composition according to claim 1, characterized in that In the resin composition, based on 100 parts by weight of the modified polyphenylene ether resin, the amount of the modified hydrocarbon resin is 20 parts by weight to 100 parts by weight, and the amount of the cross-linking agent containing an unsaturated bond is 10 parts by weight to 50 parts by weight.

8. The resin composition according to any one of claims 1 to 7, characterized in that The resin composition further comprises at least one of an initiator, a filler, a flame retardant, a hardening accelerator, an inorganic filler, a surface treatment agent, a dye, a solvent, and a toughening agent.

9. The resin composition according to claim 8, characterized in that The initiator is selected from peroxide initiators.

10. A product made from the resin composition according to any one of claims 1 to 9, characterized in that: The products include prepregs, circuit substrates, and printed circuit boards.

Images