Vapor deposition furnace control method and system based on PLC and readable storage medium

Abstract

The invention provides a vapor deposition furnace control method and system based on a PLC and a readable storage medium, and belongs to the field of vapor deposition. The technical problems that in an existing vapor deposition technology, multivariable control precision is insufficient, fault diagnosis is lagged, and process operation is tedious are solved. According to the technical scheme, the vapor deposition furnace control system based on the PLC comprises the PLC and an upper computer, a CPU processor of the PLC communicates with the upper computer through the Ethernet, the CPU processor is electrically connected with a communication module and a switching value module, the communication module is further electrically connected with a plurality of heating devices, and the switching value module is electrically connected with the PLC. The switching value module is further electrically connected with an equipment state monitoring module, an analog quantity input module, a first relay and a plurality of second relays, the first relay is electrically connected to the alarm device, and the plurality of second relays are electrically connected with a pump set switch, a valve set switch, a heating enabling switch and a furnace door motor respectively.

Description

Technical Field

[0001] The present invention provides a PLC-based vapor deposition furnace control method, system and readable storage medium, belonging to the technical field of vapor deposition. Background Art

[0002] Vapor phase deposition (CVD) technology is widely used in high-tech industries such as semiconductors, photovoltaics, and thin film materials. It is a technology that generates solid thin films through chemical reactions of gaseous precursors on solid surfaces. This process requires extremely high control precision of process parameters such as temperature, gas flow, and pressure. The control system of the deposition furnace is directly related to the quality and performance of the deposited film, so the accuracy and stability of the control system are the key to the success of the process.

[0003] However, traditional deposition furnace control systems mostly use technologies such as PID controllers and analog control devices. These methods can meet the requirements for basic control tasks, but they are unable to cope with the challenges of high-precision, multi-variable coordinated control. Specifically, 1. The challenge of coordinated multi-parameter control: The vapor deposition process involves multiple parameters, such as temperature, airflow, and pressure, which influence each other and fluctuate over time and with environmental changes. Existing PID control systems, which rely primarily on simple feedback adjustments, are unable to effectively respond to real-time changes in multiple parameters. Under complex dynamic process conditions, it is difficult to ensure high-precision control and a stable production process, which in turn affects the quality and uniformity of the deposited film.

[0004] Second, a lack of intelligent functionality: Traditional deposition furnace control systems generally lack intelligent fault diagnosis and maintenance capabilities. Deposition furnaces operate in complex and demanding environments, where high temperatures, high pressures, and fluctuating gas flows can easily lead to equipment failures. Existing control systems often rely on manual inspection and maintenance. Equipment failures are difficult to detect and address in a timely manner, leading to production interruptions and product quality issues. This inefficient troubleshooting approach not only impacts production efficiency but also increases maintenance costs and risks.

[0005] 3. Precise temperature control and manual operation: The entire deposition process is carried out in a high-temperature and high-pressure environment, making precise temperature control of the control system particularly important. Currently, most deposition processes require manual control, which not only wastes human resources but also easily leads to deposition failures due to human factors. Summary of the Invention

[0006] In order to solve the technical problems of existing vapor deposition technology such as insufficient multivariable control accuracy, delayed fault diagnosis, and cumbersome process operation, the present invention proposes a PLC-based vapor deposition furnace control method, system and readable storage medium. The purpose is to improve the vapor deposition control system so as to meet the requirements of the vapor deposition process for high precision, high efficiency and high stability, thereby improving the quality of the deposited film and production efficiency.

[0007] In order to solve the above technical problems, the technical solution adopted by the present invention is: a PLC-based vapor deposition furnace control method, comprising the following steps: Step S1, after receiving the preset temperature value, the CPU processor of the PLC controller outputs a heating control signal to the communication module and the analog input module. The communication module controls the start-up of the heating device to heat the vapor deposition furnace in a preset temperature control mode according to the heating control signal, and the analog input module controls the heating power of the heating device according to the heating control signal; at the same time, the analog input module receives the furnace temperature value uploaded by the temperature transmitter that communicates with the analog input module. When the furnace temperature value received by the analog input module does not reach the preset temperature value, the furnace temperature value is uploaded to the CPU processor and then a temperature adjustment signal is output according to a preset PID control algorithm. The output temperature adjustment signal is transmitted to the switch module and the analog input module. The switch module controls the heating state of the heating device according to the temperature adjustment signal, and the analog input module controls the output power of the heating device according to the temperature adjustment signal; Step S2: When the temperature value in the furnace reaches the preset temperature value, a signal indicating that the temperature value in the furnace reaches the preset temperature value is transmitted to the CPU processor, and the CPU processor transmits the signal to the switch module and the analog input module. After receiving the signal, the switch module controls the second relay to turn on the corresponding pump group switch to perform a vacuum operation on the vapor deposition furnace; the analog input module receives the furnace pressure value uploaded by the vacuum detection device that communicates with the analog input module and calculates the pressure rise rate value. When the pressure rise rate value does not reach the preset pressure rise rate value, the pressure rise rate value is uploaded to the CPU processor and a vacuum adjustment signal is output according to a preset PID control algorithm. The output vacuum adjustment signal is transmitted to the switch module, and the switch module controls the pump group switch by controlling the second relay to adjust the vacuum pump's vacuum extraction state; Step S3: When the pressure rise rate value received by the analog input module reaches a preset pressure rise rate value, a signal indicating that the pressure rise rate value reaches the preset pressure rise rate value is transmitted to the switch module and the analog input module through the CPU processor. After receiving the signal, the analog input module controls the gas delivery flow rate of the process gas delivery equipment. At the same time, the analog input module receives the deposition process gas flow rate value uploaded by the mass flow meter that communicates with the analog input module. When the deposition process gas flow rate value received by the analog input module does not reach the preset gas flow rate value, the analog input module uploads the received deposition process gas flow rate value to the CPU processor and outputs a gas flow control signal according to a preset PID control algorithm. The gas flow control signal is transmitted to the switch module. The switch module controls the gas flow rate of the process gas delivery equipment according to the gas flow control signal. Step S4: When the deposition process gas flow value received by the analog input module reaches the preset gas flow value, the signal that the deposition process gas flow value reaches the preset gas flow value is transmitted to the CPU processor. After receiving the signal, the CPU processor controls the deposition equipment to complete the deposition operation on the target workpiece.

[0008] Furthermore, the temperature control mode in step S1 is to heat the target deposition furnace at a preset temperature within a preset time.

[0009] Furthermore, the pressure rise rate value in step S2 reaches the preset pressure rise rate value when the increment of the pressure value in the deposition furnace detected by the vacuum detection device within a certain period of time reaches the preset pressure rise rate value.

[0010] Furthermore, the deposition furnace is subjected to gas extraction and leak detection before step S4.

[0011] Furthermore, the deposition furnace vacuum leak detection operation is that when the deposition furnace is in a sealed state, when the pressure value inside the deposition furnace detected by the vacuum detection device within a preset time does not reach a preset local pressure value, an alarm signal is output; when the pressure value inside the deposition furnace detected by the vacuum detection device within a preset time reaches a preset local pressure value, the CPU processor controls the deposition equipment to start the deposition operation according to the deposition process flow.

[0012] Furthermore, the preset pressure rise rate value is zero.

[0013] A PLC-based vapor deposition furnace control system, the PLC-based vapor deposition furnace control system is used to implement the above-mentioned PLC-based vapor deposition furnace control method, including a PLC controller and a host computer, the CPU processor of the PLC controller communicates with the host computer via Ethernet, the CPU processor is electrically connected to a communication module and a switch module, and the communication module is also electrically connected to a plurality of heating devices; including a PLC controller and a host computer, the CPU processor of the PLC controller communicates with the host computer via Ethernet, the CPU processor is electrically connected to a communication module and a switch module, and the communication module is also electrically connected to a plurality of heating devices; The switch quantity module is also electrically connected to the equipment status monitoring module, the analog input module, the first relay and a plurality of second relays, the first relay is electrically connected to the alarm device, and the plurality of second relays are respectively electrically connected to the pump group switch, the valve group switch, the heating enable switch and the furnace door motor, and the pump group switch, the valve group switch, the heating enable switch and the furnace door motor are respectively arranged at the control end of the corresponding equipment on the deposition furnace; The equipment status monitoring module includes a flow monitoring module, a valve group switch position module, a furnace door lifting position module, a furnace door advance and retreat position module and an alarm monitoring module. The flow monitoring module, the valve group switch position module, the furnace door lifting position module and the furnace door advance and retreat position module are all electrically connected to the alarm monitoring module; The analog input module is also electrically connected to a furnace environment monitoring device and an output control module. The furnace environment monitoring device includes a vacuum detection device, a temperature transmitter, and a mass flow meter. The vacuum detection device, the temperature transmitter, and the mass flow meter are respectively arranged at the required monitoring positions on the deposition furnace. The output control module includes a heating power given output module and a gas flow given module. The heating power given output module is electrically connected to the heating device, and the gas flow given module is electrically connected to the deposition process gas delivery equipment.

[0014] Furthermore, the vacuum detection device is a vacuum gauge.

[0015] Furthermore, the temperature transmitter is electrically connected to an infrared thermometer, a temperature-controlling thermocouple and a calibration thermocouple, and the infrared thermometer, the temperature-controlling thermocouple and the calibration thermocouple are arranged at different positions on the deposition furnace.

[0016] A readable storage medium stores a computer program, which implements the method steps described above when executed by a processor.

[0017] The beneficial effects of the present invention compared to the prior art are: 1. The present invention integrates a communication module, a switch module, an equipment status monitoring module, and an analog input module into a PLC controller, and achieves high stability and high precision control of multivariable parameters through a preset PID control algorithm, thereby simplifying the operation of the deposition process and improving the quality of the deposited film and production efficiency; 2. The present invention electrically connects the flow monitoring module, the valve group switch position module, the furnace door lifting and lowering position module and the furnace door advancing and retreating position module with the alarm monitoring module, and electrically connects the vacuum detection device with the alarm monitoring module, so as to facilitate the maintenance of the normal operation of the deposition furnace, improve the operation efficiency of the deposition furnace, reduce the number of times the deposition furnace is interrupted, and reduce the losses caused by failures. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The present invention will be further described below with reference to the accompanying drawings: Figure 1 Schematic diagram of the system structure of the present invention; Figure 2 It is a workflow diagram of the present invention; Figure 3 This is a flowchart of the gas extraction and leak detection process of the deposition furnace of the present invention. DETAILED DESCRIPTION

[0019] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate relative positions or positional relationships, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second" and the like may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0020] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0021] like Figures 1 to 3As shown, the present invention provides a PLC-based vapor deposition furnace control system, comprising a PLC controller and a host computer. The PLC controller's CPU processor communicates with the host computer via Ethernet. The CPU processor is electrically connected to a communication module and a switch module, and the communication module is also electrically connected to several heating devices. In this embodiment, three heating devices are provided, each communicating with the CPU processor via RS-485 MODBUS. The host computer and the CPU processor communicate via Ethernet.

[0022] The switch module is also electrically connected to the equipment status monitoring module, the analog input module, the first relay and several second relays. The first relay is electrically connected to the alarm device, and the multiple second relays are respectively electrically connected to the pump group switch, the valve group switch, the heating enable switch and the furnace door motor. The pump group switch, the valve group switch, the heating enable switch and the furnace door motor are respectively electrically connected to the control ends of the corresponding equipment on the deposition furnace.

[0023] The equipment status monitoring module includes a flow monitoring module, a valve group switch position module, a furnace door lifting and lowering position module, a furnace door advance and retreat position module and an alarm monitoring module. The flow monitoring module, the valve group switch position module, the furnace door lifting and lowering position module and the furnace door advance and retreat position module are all electrically connected to the alarm monitoring module.

[0024] The flow monitoring module is installed on the cooling device of the deposition furnace and is used to monitor the flow signal of the cooling water in the cooling device. The valve group switch position module is used to monitor whether the various valves installed on the deposition furnace are in the open or closed position. The furnace door lifting and lowering position module is used to monitor whether the furnace door of the deposition furnace is in the open or closed position. The alarm monitoring module is used to monitor the signals collected by the flow monitoring module, the valve group switch position module, the furnace door lifting and lowering position module and the furnace door advance and retreat position module. When the collected signal value exceeds the preset threshold in the alarm detection module, the alarm signal is transmitted to the switch quantity module. The switch quantity module transmits the alarm signal to the alarm device by controlling the first relay and sends out the alarm signal. The switch quantity module controls the corresponding pump group switch and / or valve group switch and / or heating enable switch and / or furnace door motor by controlling the corresponding second relay.

[0025] The analog input module is also electrically connected to a furnace environment monitoring device and an output control module. The furnace environment monitoring device includes a vacuum detection device, a temperature transmitter, and a mass flowmeter. The vacuum detection device, temperature transmitter, and mass flowmeter are respectively installed at the required monitoring locations on the deposition furnace. They are used to monitor the furnace pressure value, furnace temperature signal, and deposition process gas flow signal, respectively, to obtain the deposition furnace pressure rise rate value, furnace temperature value, and deposition process gas flow value, and feed the furnace pressure rise rate value, furnace temperature value, and deposition process gas flow value back to the analog input module. The vacuum detection device communicates with the alarm monitoring module. In this embodiment, the vacuum detection device is a vacuum gauge.

[0026] The output control module includes a heating power setting output module and a gas flow setting module. The heating power setting output module is electrically connected to the heating device, and the gas flow setting module is electrically connected to the deposition process gas delivery equipment. The analog input module can transmit the monitored furnace temperature value to the heating power setting output module. The heating power setting output module compares and analyzes the furnace temperature value with the preset temperature value and outputs a heating power output value. This heating power output value is transmitted to the corresponding heating device to control the heating power output of the heating device. The analog input module can compare and analyze the monitored deposition process gas flow value with the preset deposition process gas flow value and output a gas flow control signal. This output gas flow control signal is output to the corresponding deposition process gas delivery equipment to control the gas flow output of the deposition process gas delivery equipment.

[0027] The present invention provides a PLC-based vapor deposition furnace control method, which adopts the above-mentioned PLC-based vapor deposition furnace control system and includes the following steps: Step S1: An operator enters a preset temperature and heating time for the heating deposition furnace on the host computer. The preset temperature range is 1000°C to 1200°C. In this embodiment, the preset temperature is set to 1100°C and the heating time is 3 hours. The host computer transmits the preset temperature value to the CPU of the PLC controller via Ethernet using the TCP / IP protocol. After receiving the preset temperature value, the CPU outputs a heating control signal to the communication module and the analog input module. After receiving the heating control signal, the communication module activates the heating device to heat the deposition furnace in the preset temperature control mode. After receiving the heating control signal, the analog input module controls the heating power of the heating device through the heating power setting output module. At the same time, the analog input module receives the furnace temperature value uploaded by the temperature transmitter. If the furnace temperature value received by the analog input module does not reach the preset temperature value, it uploads the received furnace temperature value to the CPU processor and outputs a temperature adjustment signal according to the preset PID control algorithm. The output temperature adjustment signal is transmitted to the switching module and the analog input module. The switching module controls the operation of the heating enable switch by controlling the operation of the second relay, thereby controlling the heating state of the heating device. The analog input module controls the output power of the heating device through the heating power setting output module. More specifically, the temperature transmitter is used to receive temperature signals monitored by an infrared thermometer, a temperature control thermocouple, and a calibration thermocouple installed at different locations on the deposition furnace.

[0028] Step S2: When the temperature value in the furnace reaches the preset temperature value, a signal indicating that the temperature value in the furnace reaches the preset temperature value is transmitted to the CPU processor. The output end of the CPU processor transmits the signal to the switch module and the analog input module. After receiving the signal, the switch module controls the second relay to turn on the corresponding pump group switch to vacuum the deposition furnace. At the same time, the analog input module receives the furnace pressure value uploaded by the vacuum detection device and calculates the pressure rise rate value. When the pressure rise rate value does not reach the preset pressure rise rate value, the preset pressure rise rate value is zero. After uploading the pressure rise rate value to the CPU processor, a vacuum adjustment signal is output according to the preset PID control algorithm. The output vacuum adjustment signal is transmitted to the switch module. The switch module controls the pump group switch by controlling the second relay to adjust the vacuum pump's vacuum extraction state.

[0029] The pressure rise rate value reaches the preset pressure rise rate value specifically when the pressure increment in the deposition furnace detected by the vacuum detection device reaches the preset pressure rise rate value within a certain period of time. In this embodiment, the time set is 5 minutes.

[0030] Step S3: When the pressure rise rate value received by the analog input module reaches the preset pressure rise rate value, a signal indicating that the pressure rise rate value has reached the preset pressure rise rate value is transmitted to the CPU processor. The CPU processor transmits the signal to the switch module and the analog input module. After receiving the signal, the analog input module controls the gas delivery flow of the process gas delivery equipment through the gas flow setting module. At the same time, the analog input module receives the deposition process gas flow value uploaded by the mass flow meter. When the deposition process gas flow value received by the analog input module does not reach the preset gas flow value, the analog input module uploads the received deposition process gas flow value to the CPU processor and outputs a gas flow control signal according to a preset PID control algorithm to the switch module. The switch module controls the valve group switching action by controlling the action of the second relay, thereby controlling the size of the gas flow delivered by the process gas delivery equipment.

[0031] Step S4: When the deposition process gas flow value received by the analog input module reaches the preset gas flow value, the signal that the deposition process gas flow value reaches the preset gas flow value is transmitted to the CPU processor. After receiving the signal, the CPU processor controls the deposition equipment to perform deposition operations on the target workpiece.

[0032] Furthermore, before step S4, the deposition furnace is evacuated and leak-checked. The CPU processor presets a local pressure value of 0 Pa and a pressure-holding time of 15 minutes. When the pressure in the deposition furnace detected by the vacuum detection device does not reach the preset local pressure value within the preset time, a signal indicating that the pressure in the deposition furnace has not reached the preset local pressure value is transmitted to the alarm monitoring module. Upon receiving this signal, the alarm monitoring module controls the first relay via the switching module, which triggers the alarm device. When the pressure in the deposition furnace reaches the preset local pressure value within the preset time, the CPU processor controls the deposition equipment to perform deposition operations according to the deposition process flow.

[0033] The deposition furnace is heated in a temperature control mode, that is, the deposition furnace is heated at a preset temperature within a preset time. In this embodiment, the sampling period is 5 seconds and the preset time is 3 hours.

[0034] A readable storage medium stores a computer program, which implements the above method steps when executed by a processor.

[0035] Regarding the specific structure of the present invention, it should be noted that the connection relationship between the various component modules adopted in the present invention is definite and feasible. Except for those specifically described in the embodiments, the specific connection relationship can bring about corresponding technical effects and solve the technical problems raised by the present invention without relying on the execution of corresponding software programs. The components, modules, models of specific components appearing in the present invention, the connection methods between each other, and the conventional usage methods and expected technical effects brought about by the above-mentioned technical features, except for those specifically described, all belong to the disclosed contents in patents, journal articles, technical manuals, technical dictionaries, and textbooks that can be obtained by technical personnel in this field before the application date, or belong to the existing technologies such as conventional technology and common knowledge in this field. There is no need to elaborate, so that the technical solution provided in this case is clear, complete, and feasible, and the corresponding physical products can be reproduced or obtained based on this technical means.

[0036] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the above embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A PLC-based vapor deposition furnace control method, characterized in that: The following steps are involved: Step S1, after receiving the preset temperature value, the CPU processor of the PLC controller outputs a heating control signal to the communication module and the analog input module. The communication module controls the start-up of the heating device to heat the vapor deposition furnace in a preset temperature control mode according to the heating control signal, and the analog input module controls the heating power of the heating device according to the heating control signal; at the same time, the analog input module receives the furnace temperature value uploaded by the temperature transmitter that communicates with the analog input module. When the furnace temperature value received by the analog input module does not reach the preset temperature value, the furnace temperature value is uploaded to the CPU processor and then a temperature adjustment signal is output according to a preset PID control algorithm. The output temperature adjustment signal is transmitted to the switch module and the analog input module. The switch module controls the heating state of the heating device according to the temperature adjustment signal, and the analog input module controls the output power of the heating device according to the temperature adjustment signal; Step S2: When the temperature value in the furnace reaches the preset temperature value, a signal indicating that the temperature value in the furnace reaches the preset temperature value is transmitted to the CPU processor, and the CPU processor transmits the signal to the switch module and the analog input module. After receiving the signal, the switch module controls the second relay to turn on the corresponding pump group switch to perform a vacuum operation on the vapor deposition furnace; the analog input module receives the furnace pressure value uploaded by the vacuum detection device that communicates with the analog input module and calculates the pressure rise rate value. When the pressure rise rate value does not reach the preset pressure rise rate value, the pressure rise rate value is uploaded to the CPU processor and a vacuum adjustment signal is output according to a preset PID control algorithm. The output vacuum adjustment signal is transmitted to the switch module, and the switch module controls the pump group switch by controlling the second relay to adjust the vacuum pump's vacuum extraction state; Step S3: When the pressure rise rate value received by the analog input module reaches a preset pressure rise rate value, a signal indicating that the pressure rise rate value reaches the preset pressure rise rate value is transmitted to the switch module and the analog input module through the CPU processor. After receiving the signal, the analog input module controls the gas delivery flow rate of the process gas delivery equipment. At the same time, the analog input module receives the deposition process gas flow rate value uploaded by the mass flow meter that communicates with the analog input module. When the deposition process gas flow rate value received by the analog input module does not reach the preset gas flow rate value, the analog input module uploads the received deposition process gas flow rate value to the CPU processor and outputs a gas flow control signal according to a preset PID control algorithm. The gas flow control signal is transmitted to the switch module. The switch module controls the gas flow rate of the process gas delivery equipment according to the gas flow control signal. Step S4: When the deposition process gas flow value received by the analog input module reaches the preset gas flow value, the signal that the deposition process gas flow value reaches the preset gas flow value is transmitted to the CPU processor. After receiving the signal, the CPU processor controls the deposition equipment to complete the deposition operation on the target workpiece.

2. The PLC-based vapor deposition furnace control method according to claim 1, characterized in that: The temperature control mode in step S1 is to heat the target deposition furnace at a preset temperature within a preset time.

3. The PLC-based vapor deposition furnace control method according to claim 1, characterized in that: The pressure rise rate value in step S2 reaches the preset pressure rise rate value when the increment of the pressure value in the deposition furnace detected by the vacuum detection device reaches the preset pressure rise rate value within a certain period of time.

4. The PLC-based vapor deposition furnace control method according to claim 1, characterized in that: Before step S4, the deposition furnace is evacuated and leak-checked.

5. The PLC-based vapor deposition furnace control method according to claim 4, characterized in that: The deposition furnace vacuum leak detection operation is as follows: when the deposition furnace is in a sealed state, an alarm signal is output when the pressure value inside the deposition furnace detected by the vacuum detection device within a preset time does not reach a preset local pressure value; when the pressure value inside the deposition furnace detected by the vacuum detection device within a preset time reaches a preset local pressure value, the CPU processor controls the deposition equipment to start the deposition operation according to the deposition process flow.

6. The PLC-based vapor deposition furnace control method according to claim 1, characterized in that: The preset pressure rise rate value is zero.

7. A PLC-based vapor deposition furnace control system, characterized in that: The PLC-based vapor deposition furnace control system is used to implement the PLC-based vapor deposition furnace control method according to any one of claims 1 to 6, comprising a PLC controller and a host computer, wherein the CPU processor of the PLC controller communicates with the host computer via Ethernet, the CPU processor is electrically connected to a communication module and a switch module, and the communication module is also electrically connected to a plurality of heating devices; The switch quantity module is also electrically connected to the equipment status monitoring module, the analog input module, the first relay and a plurality of second relays, the first relay is electrically connected to the alarm device, and the plurality of second relays are respectively electrically connected to the pump group switch, the valve group switch, the heating enable switch and the furnace door motor, and the pump group switch, the valve group switch, the heating enable switch and the furnace door motor are respectively arranged at the control end of the corresponding equipment on the deposition furnace; The equipment status monitoring module includes a flow monitoring module, a valve group switch position module, a furnace door lifting position module, a furnace door advance and retreat position module and an alarm monitoring module. The flow monitoring module, the valve group switch position module, the furnace door lifting position module and the furnace door advance and retreat position module are all electrically connected to the alarm monitoring module; The analog input module is also electrically connected to a furnace environment monitoring device and an output control module. The furnace environment monitoring device includes a vacuum detection device, a temperature transmitter, and a mass flow meter. The vacuum detection device, the temperature transmitter, and the mass flow meter are respectively arranged at the required monitoring positions on the deposition furnace. The output control module includes a heating power given output module and a gas flow given module. The heating power given output module is electrically connected to the heating device, and the gas flow given module is electrically connected to the deposition process gas delivery equipment.

8. The PLC-based vapor deposition furnace control system according to claim 1, characterized in that: The vacuum detection device is a vacuum gauge.

9. The PLC-based vapor deposition furnace control system according to claim 1, characterized in that: The temperature transmitter is electrically connected to an infrared thermometer, a temperature-controlling thermocouple and a calibration thermocouple, and the infrared thermometer, the temperature-controlling thermocouple and the calibration thermocouple are arranged at different positions on the deposition furnace.

10. A readable storage medium, characterized in that: The readable storage medium stores a computer program, which, when executed by a processor, implements the method steps according to any one of claims 1 to 6.

Images