Semiconductor element inspection device based on intelligent sensor

Abstract

The invention discloses a semiconductor element inspection device based on an intelligent sensor, and relates to the technical field of semiconductor element detection. The semiconductor element inspection device based on the intelligent sensor comprises a main body, a rotating disc is rotationally connected in the main body, and a fixing ring is fixedly connected to the top of the main body; a spherical protruding block is fixedly connected to the outer side of the rotating disc, an annular hydraulic block is fixedly connected to the interior of the fixing ring, a first pushing block is movably connected to the inner side of the annular hydraulic block, the rear side of the annular hydraulic block is fixedly connected with a first hydraulic block through a first hose, and a first rack is movably connected to the top of the first hydraulic block through a first movable block. A limiting block is fixedly connected to the top of the body, the interior of the limiting block is rotationally connected with a first fixing block through a first rotating shaft, and a first hydraulic block is movably connected with a third fixing block through a transmission piece. According to the semiconductor element inspection device based on the intelligent sensor, the turntable is started during use, so that chip elements are placed more standardly, and the equipment detection efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor component detection, and in particular to a semiconductor component inspection device based on an intelligent sensor. Background Art

[0002] Chip manufacturing involves complex, interconnected processes. Slight variations in materials, environment, and process parameters often lead to chip defects, impacting product yield. Chip quality inspection, a critical step in the chip production line, provides proactive feedback on product quality, enabling timely monitoring of the health of each production link. This has led to an increasingly prominent role for quality inspection technology within the production line.

[0003] Chinese patent CN112986143A, authorized and announced on June 18, 2021, discloses a semiconductor component inspection device based on an intelligent sensor, which includes a box with a hollow interior and an open top, a grooved wheel mechanism provided inside the box, a drive shaft provided at the output end of the grooved wheel mechanism, a turntable at the opening fixedly connected to the top of the drive shaft, an upper partition fixedly connected to the interior of the box, a first bearing for rotationally supporting the drive shaft provided on the upper partition, a track fixedly connected to the top of the upper partition, the track including a bottom horizontal section fixedly connected to the upper partition, an inclined ascending section, a top horizontal section and an inclined descending section, a number of chip placement mechanisms equidistantly installed on the turntable, a chip conveying mechanism and a microscope detection mechanism fixedly connected to the outer wall of the box, and the lens end of the microscope detection mechanism is directly above a group of chip placement mechanisms. In the above-mentioned application documents, when the equipment is loading, the chip components are prone to tilt on the chip placement mechanism, thereby affecting the detection results of the microscope detection mechanism and reducing the detection efficiency. At the same time, when unloading, the chip components are prone to fall and flip, affecting the subsequent packaging process of good chip components. Summary of the Invention

[0004] In response to the shortcomings of the prior art, the present invention provides a semiconductor component inspection device based on an intelligent sensor, which solves the problems raised in the above background technology. To achieve the above objectives, the present invention is implemented through the following technical solutions: A semiconductor component inspection device based on an intelligent sensor, comprising: A main body, wherein a microscope detection device is fixedly connected to the side of the main body via a bracket, a material receiving device is fixedly connected to the top of the side of the main body, a moving wheel is rotatably connected to the bottom of the main body, a turntable is rotatably connected to the interior of the main body via a rotating shaft, and a fixing ring is fixedly connected to the top of the main body; The outer side of the turntable is fixedly connected to a plurality of spherical protrusions, the interior of the fixed ring is fixedly connected to an annular hydraulic block, the inner side of the annular hydraulic block is movably connected to a push block 1, the rear side of the annular hydraulic block is fixedly connected to the hydraulic block 1 via a hose 1, the top of the hydraulic block 1 is movably connected to a movable block 1, the top of the movable block 1 is fixedly connected to a rack 1, the top of the main body is fixedly connected to a limit block, the interior of the limit block is rotatably connected to the fixed block 1 via a rotating shaft 1, the outer side of the rotating shaft 1 is fixedly connected to a gear 1, the rack 1 is meshed with the gear 1, and the hydraulic block 1 is movably connected to the fixed block 3 via a transmission member. The fixed block 1 is provided so that when the turntable rotates, the fixed block 1 is driven to flip, thereby causing the fixed block 3 to push the chip component, so that the chip component adjustment position is consistent with the inside of the fixed table, thereby making the detection results of the microscope detection equipment more accurate and improving the equipment detection efficiency.

[0005] Preferably, the transmission member includes a hose 2, a hydraulic block 2, a push block 2, a slider 1, a spring 1, a fixed block 2, a hose 3, a hydraulic block 3, and a push block 3. The top of the side of the hydraulic block 1 is fixedly connected to one end of the hose 2, the other end of the hose 2 is fixedly connected to the side of the hydraulic block 2, the bottom of the hydraulic block 2 is fixedly connected to the fixed block 2, the bottom of the fixed block 2 is fixedly connected to the fixed block 1, the top of the hydraulic block 2 is movably connected with the push block 2, the outer side of the push block 2 is movably connected with the slider 1, the inside of the fixed block 2 is fixedly connected to the inner side of the slider 1, the side of the hydraulic block 2 is fixedly connected to one end of the hose 3, the other end of the hose 3 is connected to the side track of the hydraulic block 3, the bottom of the hydraulic block 3 is fixedly connected to the top of the fixed block 1, the top of the hydraulic block 3 is movably connected with the push block 3, and the top of the push block 3 is fixedly connected to the fixed block 3.

[0006] Preferably, the turntable is internally movably connected to a lifting device, the lifting device is externally movably connected to a fixed platform, the bottom of the rotating shaft is fixedly connected to a motor, the top of the material receiving device is movably connected to a material receiving adjustment component, and the microscope detection device is internally movably connected to a light absorbing component.

[0007] Preferably, the number of the lifting devices is six, and each of the lifting devices is distributed about the surface circumference of the turntable. The number of the spherical bumps is six, and each of the spherical bumps is distributed about the surface circumference of the turntable. The number of the hoses one is two, the number of the hydraulic blocks one is two, the number of the racks one is two, the number of the gears one is two, the number of the hoses two is two, the number of the hydraulic blocks two is two, the number of the push blocks two is two, the number of the sliders one is two, and each slider one is symmetrically distributed about the center line of the fixed block one. The number of the hoses three is two, the number of the hydraulic blocks three is two, and the number of the push blocks three is two.

[0008] Preferably, the material receiving and adjusting assembly includes a push block four, a hose four, a hydraulic block four, a push block five, a fixed block four, a rotating shaft two, a fixed block five, a hose five, a hydraulic block five, a push block six, a push plate, and a flip plate. The inner side of the annular hydraulic block is movably connected to the push block four, the outer side of the annular hydraulic block is fixedly connected to one end of the hose four, the other end of the hose four is fixedly connected to the outer side of the hydraulic block four, the top of the hydraulic block four is movably connected to the push block five, the top of the push block five is fixedly connected to the fixed block four, and the top of the material receiving equipment is fixedly connected to Two fixed blocks (5) are connected, and a flap is rotatably connected between the two fixed blocks (5) via a rotating shaft (2). A fixed block (4) is fixedly connected to the outside of the rotating shaft (2). The outside of the hydraulic block (4) is fixedly connected to one end of the hose (5), and the other end of the hose (5) is fixedly connected to the outside of the hydraulic block (5). A push block (6) is movably connected to the top of the hydraulic block (5). A push plate is fixedly connected to the top of the push block (6). The push plate is slidably connected to the flap via a chute provided on the surface of the flap. The bottom of the hydraulic block (5) is fixedly connected to the bottom of the chute. A receiving adjustment assembly is provided to prevent chip components from falling directly onto the receiving equipment after inspection, but to keep the chip components facing up, facilitating subsequent chip component pickup and packaging.

[0009] Preferably, the number of the hoses four is two, the number of the hydraulic blocks four is two, the number of the push blocks five is two, the number of the hoses five is two, the number of the hydraulic blocks five is two, the number of the push blocks six is two, and the number of the push plates is two.

[0010] Preferably, the distance between the tops of the two chutes is consistent with the width of the fixing platform.

[0011] Preferably, the light absorbing assembly includes a push block 7, a hose 6, a hydraulic block 6, a push block 8, a fixed block 6, and a light absorbing plate. The inner side of the annular hydraulic block is movably connected to the push block 7, the outer side of the annular hydraulic block is fixedly connected to one end of the hose 6, the other end of the hose 6 is fixedly connected to the side of the hydraulic block 6, the side of the hydraulic block 6 is movably connected to the push block 8, the side of the push block 8 is fixedly connected to the fixed block 6, the interior of the bracket is rotatably connected to the light absorbing plate via a rotating shaft, and the top of the rotating shaft is fixedly connected to the fixed block 6. The light absorbing assembly is provided so that when the microscope detection equipment detects chip components, the supplementary light to the surface of the equipment will generate reflected light, thereby blurring the image. The reflected light is absorbed by the light absorbing plate, thereby improving the clarity of the image and improving the detection efficiency of the equipment.

[0012] Preferably, the number of the hoses 6 is two, the number of the hydraulic blocks 6 is two, the number of the push blocks 8 is two, the number of the fixed blocks 6 is two, and the number of the light-absorbing plates is two.

[0013] Preferably, each of the light absorbing plates is symmetrically distributed about the midline of the bracket.

[0014] The present invention provides a semiconductor component inspection device based on an intelligent sensor. It has the following beneficial effects: (1) The semiconductor component inspection device based on the intelligent sensor starts the turntable to rotate the spherical bump, and cooperates with the push block 1, the annular hydraulic block, the hose 1, the hydraulic block 1, the rack 1, the gear 1, the hose 2, the hydraulic block 2, the push block 2, the slider 1, the hose 3, the hydraulic block 3, and the push block 3 to flip the fixed block 1, slide the slider 1 inward, and push the fixed block 3 outward, thereby adjusting the position of the chip component to be consistent with the inside of the fixed table, so that the detection result of the microscope detection equipment is more accurate.

[0015] (2) The semiconductor component inspection device based on the intelligent sensor, when the spherical bump rotates, cooperates with the push block four, the annular hydraulic block, the hose four, the hydraulic block four, the push block four, the fixed block four, the hose five, the hydraulic block five, and the push block five to rotate the flip plate upward and move the push plate inward, so that the chip component faces upward, which is convenient for subsequent chip component picking and packaging.

[0016] (3) The semiconductor component inspection device based on the intelligent sensor, when the hydraulic block 4 is compressed, cooperates with the hose 4, the hydraulic block 6, the rack 2, the gear 2, and the shaft 3 to rotate and close the flip cover, so that the cleaning liquid will not splash out during the cleaning process, thereby protecting the production workshop environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall front three-dimensional structure of the present invention; Figure 2It is a schematic diagram of the overall side structure of the present invention; Figure 3 It is a schematic diagram of the overall cross-sectional structure of the present invention; Figure 4 It is a schematic diagram of the structure of some components of the present invention; Figure 5 For the present invention Figure 4 A in the middle is an enlarged structural diagram; Figure 6 This is a schematic structural diagram of the material receiving and regulating component of the present invention; Figure 7 For the present invention Figure 8 The enlarged structural diagram at B in the middle; Figure 8 Schematic diagram of the light absorbing component structure of the present invention.

[0018] In the picture: 100, main body; 200, microscope detection equipment; 300, material collection equipment; 400, bracket; 500, moving wheel; 600, turntable; 700, lifting device; 800, fixed platform; 900, fixed ring; 1001, spherical bump; 1002, push block 1; 1003, annular hydraulic block; 1004, hose 1; 1005, hydraulic block 1; 1006, rack 1; 1007, gear 1; 1008, rotating shaft 1; 1009, limit block; 1010, fixed block 1; 1011, hose 2; 1012, hydraulic block 2; 1013, push block 2; 1014, slider 1; 1015, spring 1; 1016, fixed block 2; 1017, hose 3; 1018, hydraulic block 3; 1019, push block 3; 1020, fixed block 3; 1100, material receiving and adjusting assembly; 1101, push block 4; 1102, hose 4; 1103, hydraulic block 4; 1104, push block 5; 1105, fixed block 4; 1106, rotating shaft 2; 1107, fixed block 5; 1108, hose 5; 1109, hydraulic block 5; 1110, push block 6; 1111, push plate; 1112, flap; 1200, light absorbing assembly; 1201, push block seven; 1202, hose six; 1203, hydraulic block six; 1204, push block eight; 1205, fixed block six; 1206, light absorbing plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0020] For example 1, please refer to Figures 1-4, a semiconductor component inspection device based on an intelligent sensor, comprising: The main body 100 has a microscope inspection device 200 fixedly connected to the side of the main body 100 through a bracket 400. The microscope inspection device 200 is set to detect defects on the surface of the chip component, thereby achieving the purpose of detecting the chip component. The top of the side of the main body 100 is fixedly connected to a material receiving device 300. The material receiving device 300 is set so that the chip component can be transferred to the next link through the material receiving device 300 after the inspection is completed. The bottom of the main body 100 is rotatably connected to a moving wheel 500. The moving wheel 500 is set to make the equipment easy to move. The interior of the main body 100 is rotatably connected to a turntable 600 through a rotating shaft. The interior of the turntable 600 is movably connected to a lifting device 700. The lifting device 700 is set so that the chip component can be lifted and poured out after the inspection is completed. The outer side of the lifting device 700 is movably connected to a fixed platform 800, the bottom of the rotating shaft is fixedly connected to a motor, the top of the material collecting device 300 is movably connected to a material collecting adjustment component 1100, the inner part of the microscope detection device 200 is movably connected to a light absorbing component 1200, and the top of the main body 100 is fixedly connected to a fixing ring 900; the outer side of the turntable 600 is fixedly connected to a plurality of spherical bumps 1001, the inner part of the fixing ring 900 is fixedly connected to an annular hydraulic block 1003, the inner side of the annular hydraulic block 1003 is movably connected to a push block 1002, the rear side of the annular hydraulic block 1003 is fixedly connected to the hydraulic block 1005 through a hose 1004, and the hose 1004 is provided so that the inner part of the hydraulic block 1005 is connected to the annular hydraulic block 1003. 3 are internally connected, the top of the hydraulic block 1005 is movably connected to the movable block 1, the top of the movable block 1 is fixedly connected to the rack 1006, the top of the main body 100 is fixedly connected to the limit block 1009, the interior of the limit block 1009 is rotatably connected to the fixed block 1010 through the rotating shaft 1008, the outer side of the rotating shaft 1008 is fixedly connected to the gear 1007, the rack 1006 is engaged with the gear 1007, the hydraulic block 1005 is movably connected to the fixed block 3 1020 through the transmission part, and the transmission part includes the hose 2 1011, the hydraulic block 2 1012, the push block 2 1013, the slider 1014, the spring 1015, the fixed block 2 1016, the hose 3 1017, the hydraulic block 3 1018, and the push block 3 101 9. The top of the side of hydraulic block 1005 is fixedly connected to one end of hose 2 1011. The other end of hose 2 1011 is fixedly connected to the side of hydraulic block 2 1012. The bottom of hydraulic block 2 1012 is fixedly connected to fixed block 2 1016. The bottom of fixed block 2 1016 is fixedly connected to fixed block 1 1010. The top of hydraulic block 2 1012 is movably connected to push block 2 1013. The outer side of push block 2 1013 is movably connected to slider 1 1014. A spring 1015 is fixedly connected between the inside of fixed block 2 1016 and the inside of slider 1 1014. The side of hydraulic block 2 1012 is fixedly connected to one end of hose 3 1017. The other end of hose 3 1017 is connected to the side track of hydraulic block 3 1018.The bottom of the hydraulic block 3 1018 is fixedly connected to the top of the fixed block 1010, the top of the hydraulic block 3 1018 is movably connected to the push block 3 1019, and the top of the push block 3 1019 is fixedly connected to the fixed block 3 1020. The number of lifting devices 700 is six, and each lifting device 700 is distributed around the surface circumference of the turntable 600. The number of spherical bumps 1001 is six, and each spherical bump 1001 is distributed around the surface circumference of the turntable 600. The number of hoses 1004 is two, the number of hydraulic blocks 1005 is two, the number of racks 1006 is two, the number of gears 1007 is two, and the number of hoses 2 1011 is There are two hydraulic blocks 1012, two push blocks 1013, and two sliders 1014. Each slider 1014 is symmetrically distributed about the centerline of fixed block 1010. There are two hoses 1017, two hydraulic blocks 1018, and two push blocks 1019. Fixed block 1010 is configured so that when turntable 600 rotates, fixed block 1010 flips, causing fixed block 3 1020 to push the chip component, aligning its adjusted position with the interior of fixed platform 800. This improves the accuracy of microscope inspection equipment 200's inspection results and enhances equipment inspection efficiency.

[0021] When in use, start the turntable 600, so that the spherical protrusion 1001 rotates with the turntable 600, so that the push block 1002 is pushed inward by the spherical protrusion 1001, so that the internal pressure of the annular hydraulic block 1003 increases, and the internal pressure of the annular hydraulic block 1003 is transmitted to the inside of the hydraulic block 1005 through the hose 1004, so that the internal pressure of the hydraulic block 1005 increases, so that the rack 1006 is pushed upward, and the gear 1007 rotates clockwise, so that the fixed block 1010 flips over to contact with the limit block 1009. At this time, the excess pressure inside the hydraulic block 1005 is released through the hose 2 1011 is transmitted to the inside of hydraulic block two 1012, increasing the internal pressure of hydraulic block two 1012, pushing out push block two 1013 inward, and sliding block one 1014 inward. At the same time, the excess pressure inside hydraulic block two 1012 is transmitted to the inside of hydraulic block three 1018 through hose three 1017, increasing the internal pressure of hydraulic block three 1018, pushing out push block three 1019, and pushing out fixed block three 1020, so that the chip component adjustment position is consistent with the inside of the fixed table 800, thereby making the detection result of the microscope detection equipment 200 more accurate and improving the equipment detection efficiency.

[0022] For example 2, please refer to Figures 1-6On the basis of the first embodiment, the material collecting and adjusting component 1100 includes a push block 4 1101, a hose 4 1102, a hydraulic block 4 1103, a push block 5 1104, a fixed block 4 1105, a rotating shaft 2 1106, a fixed block 5 1107, a hose 5 1108, a hydraulic block 5 1109, a push block 6 1110, a push plate 1111, and a flap 1112. The inner side of the annular hydraulic block 1003 is movably connected to the push block 4 1101, the outer side of the annular hydraulic block 1003 is fixedly connected to one end of the hose 4 1102, and the other end of the hose 4 1102 is fixed to the hydraulic block 4. 1103 is fixedly connected on the outside, and the top of the hydraulic block 4 1103 is movably connected to the push block 5 1104, and the top of the push block 5 1104 is fixedly connected to the fixed block 4 1105. The top of the material receiving device 300 is fixedly connected to two fixed blocks 5 1107, and the two fixed blocks 5 1107 are rotatably connected to the flip plate 1112 through the rotating shaft 2 1106. The flip plate 1112 is set so that the chip component will not flip when it falls from the surface of the lifting device 700. The outer side of the rotating shaft 2 1106 is fixedly connected to the fixed block 4 1105. The outer side of the hydraulic block 4 1103 is connected to the soft One end of the fifth tube 1108 is fixedly connected, and the other end of the fifth hose 1108 is fixedly connected to the outside of the fifth hydraulic block 1109. The fifth hose 1108 is provided so that the fifth hydraulic block 1109 is communicated with the inside of the fourth hydraulic block 1103. The top of the fifth hydraulic block 1109 is movably connected with the sixth push block 1110. The top of the sixth push block 1110 is fixedly connected with the push plate 1111. The push plate 1111 is slidably connected to the flip plate 1112 through a chute provided on the surface of the flip plate 1112. The distance between the tops of the two chute is consistent with the width of the fixed platform 800. The chute is provided so that the push plate 1111 Moving along the direction of the slide, the bottom of the hydraulic block five 1109 is fixedly connected to the bottom of the slide, the number of hose four 1102 is two, the number of hydraulic blocks four 1103 is two, the number of push blocks five 1104 is two, the number of hose five 1108 is two, the number of hydraulic blocks five 1109 is two, the number of push blocks six 1110 is two, the number of push plates 1111 is two, and a material receiving adjustment component 1100 is provided so that the chip components will not fall directly onto the material receiving equipment 300 after inspection, so that the chip components face up, which is convenient for subsequent chip component picking and packaging.

[0023] During use, based on Example 1, when the spherical bump 1001 rotates, the push block four 1101 is pushed by the spherical bump 1001, so that the internal pressure of the annular hydraulic block 1003 increases, and the internal pressure of the annular hydraulic block 1003 is transmitted to the hydraulic block four 1103 through the hose four 1102, so that the internal pressure of the hydraulic block four 1103 increases, and the push block five 1104 is pushed outward, and the fixed block four 1105 rotates counterclockwise, and the flap 1112 rotates counterclockwise. At the same time, the excess pressure inside the annular hydraulic block 1003 is transmitted to the hydraulic block five 1109 through the hose five 1108, so that the internal pressure of the hydraulic block five 1109 increases, and the push block six 1110 is pushed outward, and the push plate 1111 follows the push block six 1110 to be pushed outward, so that the chip component is facing up, which is convenient for subsequent chip component picking and packaging.

[0024] For example three, please refer to Figures 1-8 On the basis of the first and second embodiments, the light absorbing assembly 1200 includes a push block 7 1201, a hose 6 1202, a hydraulic block 6 1203, a push block 8 1204, a fixed block 6 1205, and a light absorbing plate 1206. The inner side of the annular hydraulic block 1003 is movably connected to the push block 7 1201, the outer side of the annular hydraulic block 1003 is fixedly connected to one end of the hose 6 1202, and the other end of the hose 6 1202 is fixedly connected to the side of the hydraulic block 6 1203. The hose 6 1202 is provided to make the interior of the hydraulic block 6 1203 communicate with the interior of the annular hydraulic block 1003. The side of the hydraulic block 6 1203 is movably connected to the push block 8 1204, and the side of the push block 8 1204 is fixedly connected to the fixed block 6 1205. The interior of the bracket 400 is connected to the outer side of the annular hydraulic block 1003. The rotating shaft is rotatably connected to the light-absorbing plate 1206, and a fixed block six 1205 is fixedly connected to the top of the rotating shaft. There are two hoses six 1202, two hydraulic blocks six 1203, two push blocks eight 1204, two fixed blocks six 1205, and two light-absorbing plates 1206. Each light-absorbing plate 1206 is symmetrically distributed about the center line of the bracket 400. The light-absorbing plate 1206 is arranged so that the reflected light around the device is absorbed by the light-absorbing plate 1206. The light-absorbing component 1200 is arranged so that when the microscope detection device 200 detects chip components, the fill light to the device surface will generate reflected light, thereby blurring the image. The reflected light is absorbed by the light-absorbing plate 1206, thereby improving the clarity of the image and improving the detection efficiency of the device.

[0025] During use, based on the first and second embodiments, when the spherical protrusion 1001 rotates, the push block seven 1201 is driven inward by the spherical protrusion 1001, so that the internal pressure of the annular hydraulic block 1003 is transmitted to the inside of the hydraulic block six 1203 through the hose six 1202, so that the internal pressure of the hydraulic block six 1203 increases, and the push block eight 1204 is pushed outward, so that the fixed block six 1205 rotates, and the two light-absorbing plates 1206 follow the fixed block six 1205 to rotate and close, so that the reflected light is absorbed by the light-absorbing plates 1206, so that the clarity of the picture is improved, and the detection efficiency of the equipment is improved.

[0026] The above are only preferred specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with this technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solutions and inventive concepts of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A semiconductor component inspection device based on an intelligent sensor, characterized in that: include: A main body, wherein a microscope detection device is fixedly connected to the side of the main body via a bracket, a material receiving device is fixedly connected to the top of the side of the main body, a moving wheel is rotatably connected to the bottom of the main body, a turntable is rotatably connected to the interior of the main body via a rotating shaft, and a fixing ring is fixedly connected to the top of the main body; The outer side of the turntable is fixedly connected to a plurality of spherical protrusions, the interior of the fixed ring is fixedly connected to an annular hydraulic block, the inner side of the annular hydraulic block is movably connected to a push block 1, the rear side of the annular hydraulic block is fixedly connected to the hydraulic block 1 through a hose 1, the top of the hydraulic block 1 is movably connected to a movable block 1, the top of the movable block 1 is fixedly connected to a rack 1, the top of the main body is fixedly connected to a limit block, the interior of the limit block is rotatably connected to the fixed block 1 through a rotating shaft 1, the outer side of the rotating shaft 1 is fixedly connected to a gear 1, the rack 1 is meshed with a gear 1, and the hydraulic block 1 is movably connected to the fixed block 3 through a transmission member.

2. The semiconductor component inspection device based on smart sensors according to claim 1, characterized in that: The transmission part includes hose 2, hydraulic block 2, push block 2, slider 1, spring 1, fixed block 2, hose 3, hydraulic block 3, and push block 3. The top of the side of the hydraulic block 1 is fixedly connected to one end of the hose 2, the other end of the hose 2 is fixedly connected to the side of the hydraulic block 2, the bottom of the hydraulic block 2 is fixedly connected to the fixed block 2, the bottom of the fixed block 2 is fixedly connected to the fixed block 1, the top of the hydraulic block 2 is movably connected with the push block 2, the outer side of the push block 2 is movably connected with the slider 1, the inside of the fixed block 2 is fixedly connected with the inner side of the slider 1, the side of the hydraulic block 2 is fixedly connected to one end of the hose 3, the other end of the hose 3 is connected to the side track of the hydraulic block 3, the bottom of the hydraulic block 3 is fixedly connected to the top of the fixed block 1, the top of the hydraulic block 3 is movably connected with the push block 3, and the top of the push block 3 is fixedly connected to the fixed block 3.

3. The semiconductor component inspection device based on smart sensors according to claim 1, characterized in that: The turntable is internally movably connected to a lifting device, the lifting device is externally movably connected to a fixed platform, the bottom of the rotating shaft is fixedly connected to a motor, the top of the material receiving device is movably connected to a material receiving adjustment component, and the microscope detection device is internally movably connected to a light absorbing component.

4. The semiconductor component inspection device based on smart sensors according to claim 1, characterized in that: There are six lifting devices, each of which is distributed around the circumference of the turntable surface. There are six spherical bumps, each of which is distributed around the circumference of the turntable surface. There are two hoses one, two hydraulic blocks one, two racks one, two gears one, two hoses two, two hydraulic blocks two, two push blocks two, two sliders one, and each slider one is symmetrically distributed around the center line of the fixed block one. There are two hoses three, two hydraulic blocks three, and two push blocks three.

5. The semiconductor component inspection device based on smart sensors according to claim 3, characterized in that: The material receiving and adjusting assembly includes a push block 4, a hose 4, a hydraulic block 4, a push block 5, a fixed block 4, a rotating shaft 2, a fixed block 5, a hose 5, a hydraulic block 5, a push block 6, a push plate, and a flip plate. The inner side of the annular hydraulic block is movably connected to the push block 4, the outer side of the annular hydraulic block is fixedly connected to one end of the hose 4, the other end of the hose 4 is fixedly connected to the outer side of the hydraulic block 4, the top of the hydraulic block 4 is movably connected to the push block 5, the top of the push block 5 is fixedly connected to the fixed block 4, and the top of the material receiving equipment is fixedly connected to Two fixed blocks five, a flap is rotatably connected between the two fixed blocks five via a rotating shaft two, a fixed block four is fixedly connected to the outer side of the rotating shaft two, the outer side of the hydraulic block four is fixedly connected to one end of the hose five, the other end of the hose five is fixedly connected to the outer side of the hydraulic block five, the top of the hydraulic block five is movably connected to a push block six, the top of the push block six is fixedly connected to a push plate, the push plate is slidably connected to the flap through a slide groove provided on the surface of the flap, and the bottom of the hydraulic block five is fixedly connected to the bottom of the slide groove.

6. The semiconductor component inspection device based on smart sensors according to claim 5, characterized in that: The number of the hoses four is two, the number of the hydraulic blocks four is two, the number of the push blocks five is two, the number of the hoses five is two, the number of the hydraulic blocks five is two, the number of the push blocks six is two, and the number of the push plates is two.

7. The semiconductor component inspection device based on smart sensors according to claim 5, characterized in that: The distance between the tops of the two chutes is consistent with the width of the fixing platform.

8. The semiconductor component inspection device based on smart sensors according to claim 5, characterized in that: The light absorbing assembly includes a push block seven, a hose six, a hydraulic block six, a push block eight, a fixed block six, and a light absorbing plate. The inner side of the annular hydraulic block is movably connected to the push block seven, the outer side of the annular hydraulic block is fixedly connected to one end of the hose six, the other end of the hose six is fixedly connected to the side of the hydraulic block six, the side of the hydraulic block six is movably connected to the push block eight, the side of the push block eight is fixedly connected to the fixed block six, the inside of the bracket is rotatably connected to the light absorbing plate through a rotating shaft, and the top of the rotating shaft is fixedly connected to the fixed block six.

9. The semiconductor component inspection device based on smart sensors according to claim 8, characterized in that: The number of the hoses 6 is two, the number of the hydraulic blocks 6 is two, the number of the push blocks 8 is two, the number of the fixed blocks 6 is two, and the number of the light absorbing plates is two.

10. The semiconductor component inspection device based on smart sensors according to claim 8, characterized in that: Each of the light absorbing plates is symmetrically distributed about the center line of the bracket.

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