Testing device with automatic feeding function for optical chip processing

Abstract

The invention provides a testing device with an automatic feeding function for optical chip processing, which is characterized in that a three-axis truss robot is arranged at the top of a testing platform, a mounting shell is arranged at the free end of the three-axis truss robot, a laser intensity detector is arranged in the mounting shell, and a vertically downward detection pipe is arranged at the bottom of the mounting shell; the top of the detection tube is connected with a negative pressure device through a pipeline, a sucker is arranged at the bottom of the detection tube, a cavity at the bottom of the sucker can only contain one laser diode, the sucker, the detection tube and the mounting shell are communicated with one another, and light emitted by the laser diode can irradiate the laser intensity detector. When the device is used, the three-axis truss robot can be controlled to sequentially pick up the laser diodes and drive the pins of the laser diodes to automatically make contact with the contacts, when the illumination intensity detected by the laser intensity detector is the same as a set value, it is proved that chips in the laser diodes are complete, and otherwise, it is proved that chips in the laser diodes are not complete. And if so, judging that the chip in the laser diode does not reach the standard.

Description

Technical Field

[0001] The present invention relates to the technical field of laser diode chip detection, in particular to a testing device for optical chip processing with an autonomous loading function. Background Art

[0002] The laser diode chip, commonly referred to as a laser chip, is the core component of a laser diode. Made of semiconductor materials, it is a miniaturized device used to generate laser light. It features miniaturization, high efficiency, and high precision. Testing a laser diode requires simply connecting the pins, allowing the diode to emit light, and observing its brightness. If the laser diode's brightness meets the preset requirements, the chip within the laser diode is confirmed to be qualified. Otherwise, the laser diode under test does not meet the requirements.

[0003] Existing methods for testing laser diode light emission rely on manual wiring. Specifically, an operator places a conductive clip on the laser diode's pins, causing the diode to emit light. The operator then tests the emitted laser diode against a laser intensity meter. This method is not only cumbersome and slow, but also unsuitable for rapid, high-volume testing. To address this issue, we propose a test device for optical chip processing with autonomous loading capabilities. Summary of the Invention

[0004] The present invention provides a testing device for optical chip processing with an autonomous loading function, which has the advantages of automatically picking up and automatically detecting laser diodes, and solves the problems raised in the above background technology.

[0005] The technical solution of the present invention is implemented as follows: a test device for optical chip processing with an autonomous loading function is designed, including a test platform, a three-axis truss robot is provided on the top of the test platform, a mounting shell is provided on the free end of the three-axis truss robot, a laser intensity detector is provided in the mounting shell, a detection tube is provided vertically downward at the bottom of the mounting shell, the top of the detection tube is connected to the negative pressure device through a pipeline, a suction cup is provided at the bottom of the detection tube, the cavity at the bottom of the suction cup can only accommodate one laser diode, the suction cup, the detection tube and the mounting shell are interconnected, so that the light emitted by the laser diode can be irradiated on the laser intensity detector, and contacts are provided on the top of the test platform with positions corresponding to the pin positions of the laser diode. Driven by the three-axis truss robot, the pins of the laser diode are respectively in contact with each contact, allowing the laser diode to be turned on and emit light.

[0006] Preferably, placement plates are provided on both sides of the top of the test platform, and a plurality of placement slots arranged in a matrix are provided on the top of the placement plates, and the placement slots are used to place laser diodes. A hole corresponding to the position of the pin of the laser diode is opened at the bottom of each placement plate.

[0007] Preferably, limit frames are provided on both sides of the top of the test platform, and support feet are provided at the four corners of the bottom of the placement plate. When the support feet are placed in the limit frames, the placement plate can be positioned. The placement plate is located in the working area of the three-axis truss robot, and the three-axis truss robot drives the suction cup to pick up the laser diode located in the placement plate.

[0008] Preferably, an annular support is provided on the top of the test platform, a plurality of support arms are symmetrically provided on the top of the annular support and radially arranged therewith, a telescopic mechanism is provided on the top of the support arm, a probe is provided at the end of the telescopic mechanism, and a contact is provided on each probe.

[0009] Preferably, the telescopic mechanism includes a linear guide rail arranged parallel to the top of the support arm, a mounting seat is provided on the top of the linear guide rail, the mounting seat is slidably installed on the linear guide rail through a slider, the mounting seat is provided with a support shaft parallel to the support arm, the probe is provided on the end of the support shaft, and a linear drive module parallel to the linear guide rail is also provided on the top of each support arm, the linear drive modules are respectively connected to the slider, and the linear drive module drives the probe to move closer to or away from the center of the annular support.

[0010] Preferably, an annular guide rail is provided on the top of the annular support, and L-shaped seat bodies corresponding in number to the support arms are provided on the outer side of the top of the annular support. The top of the L-shaped seat body is slidably set on the annular guide rail through a slider, and a driving device for driving it to move along the annular support is provided on the side of each L-shaped seat body. A rotating motor is provided on the top of each L-shaped seat body, and the end of the support arm away from the contact is installed on the rotating shaft of the rotating motor.

[0011] Preferably, the driving device includes an adjusting motor installed on the side of each L-shaped seat body, the rotating shaft of the adjusting motor extends to the side of the annular support, and a traveling gear is provided on the rotating shaft, and the traveling gears are all engaged with the annular ring gear, the annular ring gear is installed on the annular edge, and the annular edge is coaxially installed on the side of the annular support.

[0012] Preferably, a supporting cabinet is provided at the bottom of the test platform, a protective shell is provided at the top of the test platform, and two protective doors are rotatably provided on one side of the protective shell.

[0013] Preferably, a PLC control system is provided in the supporting cabinet, and the PLC control system is respectively connected to the three-axis truss robot, the laser intensity detector, the regulating motor, the rotating motor, the linear drive module, the negative pressure device, and the probe.

[0014] Compared with the prior art, when the present invention is used, the laser diodes to be tested are placed in a placement tray in sequence, and then the placement tray is positioned in a limit frame. Then, the three-axis truss robot can be controlled to pick up each laser diode in sequence, and drive the pins of the laser diode to automatically contact the contacts. When the light intensity detected by the laser intensity detector is the same as the set value, it proves that the chip inside the laser diode is intact. Otherwise, it can be judged that the chip inside the laser diode does not meet the standard. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0016] Figure 1 This is a schematic diagram of the structure of the present invention after the protective shell is installed.

[0017] Figure 2 This is a schematic diagram of the structure of the present invention after removing the protective shell.

[0018] Figure 3 It is a structural schematic diagram of the annular support of the present invention.

[0019] Figure 4 It is a schematic structural diagram of the support arm and L-shaped base of the present invention.

[0020] Figure 5 It is a structural schematic diagram of the placement plate of the present invention.

[0021] Figure 6 This is a schematic diagram of the structure of the contact and the laser diode pin matching of the present invention.

[0022] In the figure: 1. Support cabinet; 2. Test platform; 3. Protective door; 4. Protective shell; 5. Three-axis truss robot; 6. Support leg; 7. Laser intensity detector; 8. Suction cup; 9. Limit frame; 10. Annular guide rail; 11. Annular support; 12. L-shaped seat; 13. Adjustment motor; 14. Mounting shell; 15. Detection tube; 16. Contact; 17. Support shaft; 18. Travel gear; 19. Annular edge; 20. Annular gear ring; 21. Rotating motor; 22. Support arm; 23. Mounting seat; 24. Linear guide rail; 25. Linear drive module; 26. Probe; 27. Placement slot; 28. Placement plate. DETAILED DESCRIPTION

[0023] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] Reference Figures 1 to 6 The present invention provides a technical solution: a test device for optical chip processing with an autonomous loading function, comprising a test platform 2, a supporting cabinet 1 provided at the bottom of the test platform 2, a protective shell 4 provided on the top of the test platform 2, and two protective doors 3 rotatably provided on one side of the protective shell 4. The protective doors 3 are each provided with a transparent observation window, through which the situation inside the protective shell 4 can be observed.

[0025] A three-axis truss robot 5 is provided on the top of the test platform 2. Of course, the three-axis truss robot 5 is located inside the support cabinet 1. A mounting shell 14 is provided on the free end of the three-axis truss robot 5. A laser intensity detector 7 is provided inside the mounting shell 14. Figure 1 As shown, a detection tube 15 extending vertically downward is provided at the bottom of the mounting shell 14. The top of the detection tube 15 is connected to the negative pressure device through a pipe. A suction cup 8 is provided at the bottom of the detection tube 15. When the negative pressure device is working, the negative pressure device will form a negative pressure inside the detection tube 15, so that the suction cup 8 can pick up the light-supplying chip.

[0026] It should be noted that the sizes of the suction cup 8 and the laser diode must match. Specifically, the cavity at the bottom of the suction cup 8 can only accommodate one laser diode, that is, the top of the laser diode is placed inside the suction cup 8, and the pins of the laser diode are located below the suction cup 8. The suction cup 8, the detection tube 15, and the mounting shell 14 must be interconnected. Because the light-emitting part of the laser diode is at the top, when the laser diode emits light, the light emitted by the laser diode can directly illuminate the laser intensity detector 7, allowing the laser intensity detector 7 to detect the intensity of the light emitted by the laser diode, thereby determining the quality of the chip. That is, when the light intensity detected by the laser intensity detector 7 is the same as the set value, it proves that the chip inside the laser diode is intact. Otherwise, it can be determined that the chip inside the laser diode does not meet the standards.

[0027] Furthermore, in order to make the laser diode conduct, a contact 16 is provided on the top of the test platform 2 at a position corresponding to the pin position of the laser diode. The specific working process is as follows: the laser diode is picked up by the three-axis truss robot 5, and then the pins of the laser diode are respectively contacted with each contact 16 by the three-axis truss robot 5. The contact 16 is energized, so the laser diode is conducted and emits light. Figure 6As shown, the light it emits directly illuminates the laser intensity detector 7 in the mounting housing 14;

[0028] In order to be able to test multiple laser diodes at one time, placement trays 28 are provided on both sides of the top of the test platform 2. The placement trays 28 are used to place laser diodes, that is, a number of placement slots 27 arranged in a matrix are provided on the top of the placement tray 28. The size of the placement slots 27 matches the size of the laser diodes. The placement slots 27 are used to place laser diodes. Holes corresponding to the positions of the pins of the laser diodes are provided at the bottom of each placement tray 28. Specifically, the pins of the laser diodes are inserted into the holes. In actual application, the holes in each placement slot 27 are different colors, which can correspond to the pins of the laser diodes, making it convenient to correctly insert the pins of the laser diodes into the holes.

[0029] Next, in order to position the tray 28, Figure 2 As shown, limit frames 9 are provided on both sides of the top of the test platform 2, and support feet 6 are provided at the four corners of the bottom of the placement tray 28. When the support feet are placed in the limit frames 9, the placement tray 28 can be positioned. It should also be emphasized that the placement tray 28 is located in the working area of the three-axis truss robot 5, and the three-axis truss robot 5 drives the suction cup 8 to pick up the laser diode located in the placement tray 28. The specific process is as follows: the three-axis truss robot 5 drives the laser diode in the placement tray 28 on the left to pick up the laser diode, and then aligns the laser diode with the contact 16 to make the laser diode conduct and emit light. This process can test a laser diode, and the laser diode that has been tested is placed in the placement tray 28 again to facilitate the collection of the diode.

[0030] The specific installation structure of the contact 16 will be described below. That is, an annular support 11 is provided on the top of the test platform 2. A plurality of support arms 22 are symmetrically provided on the top of the annular support 11 and radially arranged therewith. A telescopic mechanism is provided on the top of the support arm 22. A probe 26 is provided at the end of the telescopic mechanism. The contact 16 is respectively provided on each probe 26. Figure 4 As shown, the telescopic mechanism includes a linear guide rail 24 arranged parallel to the top of the support arm 22, a mounting seat 23 is provided on the top of the linear guide rail 24, the mounting seat 23 is slidably mounted on the linear guide rail 24 through a slider, and a support shaft 17 parallel to the support arm 22 is provided on the mounting seat 23, as shown in FIG. Figure 4 As shown, the probe 26 is specifically arranged on the end of the support shaft 17. The top of each support arm 22 is also provided with a linear drive module 25 parallel to the linear guide rail 24, and the linear drive module 25 is respectively connected to the slider;

[0031] The linear drive module 25 is a screw linear drive module or a linear motor. When the linear drive module 25 moves back and forth, the linear drive module 25 will drive the mounting seat 23 to move back and forth along the linear guide rail 24, so that the linear drive module 25 can drive the probe 26 toward or away from the center of the annular support 11, thereby changing the position of the probe 26. Because the position of the laser diode pin of each model is different, this difference can be compensated and corrected by changing the position of the probe 26.

[0032] Further, such as Figure 3 As shown, an annular guide rail 10 is provided on the top of the annular support 11, and L-shaped seats 12 corresponding in number to the support arms 22 are provided on the outside of the top of the annular support 11. The tops of the L-shaped seats 12 are slidably arranged on the annular guide rail 10 through sliders, so that each L-shaped seat 12 can perform a circular motion around the annular support 11;

[0033] Each L-shaped seat 12 is equipped with a drive device on its side to drive it along the annular support 11. The drive device includes an adjustment motor 13 mounted on the side of each L-shaped seat 12. The shaft of the adjustment motor 13 extends to the side of the annular support 11 and is equipped with a travel gear 18. The travel gear 18 is meshed with an annular ring gear 20, which is mounted on an annular edge 19. The annular edge 19 is coaxially mounted on the side of the annular support 11. A rotation motor 21 is installed on the top of each L-shaped seat 12, and the end of the support arm 22 away from the contact 16 is mounted on the rotation shaft of the rotation motor 21.

[0034] Therefore, when the adjustment motor 13 rotates, it can travel on the annular gear ring 20 via the travel gear 18, thereby driving the L-shaped base 12 to change position, allowing the L-shaped base 12 to be adjusted. In addition, the rotation motor 21 can drive the support arm 22 to rotate, thereby changing the position of the support arm 22 and changing the position of the probe 26 at the end of the support arm 22. It should be noted that although the pin positions of different models of laser diodes are different, due to the small size of laser diodes, the differences between the pin positions of different models of laser diodes are very small. Therefore, the position adjustment of the L-shaped base 12, the support arm 22, and the contact 16 are all slight.

[0035] Based on the above embodiment, further optimization can be performed, such as Figure 6 As shown, after the suction cup 8 sucks the laser diode, the three-axis truss robot 5 drives the laser diode to stay in the space surrounded by the contacts 16. At this time, the position of the contacts 16 corresponds to the position of the pins. Driven by the linear drive module 25, each contact 16 can be brought into contact with each pin.

[0036] Based on the above embodiment, further optimization can be performed. A PLC control system is provided in the support cabinet 1. The PLC control system has been widely used as an intelligent control system for machine tools. The PLC control system is respectively connected to the three-axis truss robot 5, the laser intensity detector 7, the adjustment motor 13, the rotating motor 21, the linear drive module 25, the negative pressure device, and the probe 26, so that each component can travel according to the set route.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A testing device for optical chip processing with an autonomous loading function, comprising a testing platform (2), a three-axis truss robot (5) being provided on the top of the testing platform (2), characterized in that: A mounting shell (14) is provided on the free end of the three-axis truss robot (5), and a laser intensity detector (7) is provided in the mounting shell (14); A detection tube (15) extending vertically downward is provided at the bottom of the mounting shell (14), the top of the detection tube (15) is connected to a negative pressure device via a pipeline, a suction cup (8) is provided at the bottom of the detection tube (15), and the cavity at the bottom of the suction cup (8) can only accommodate one laser diode. The suction cup (8), the detection tube (15) and the mounting shell (14) are interconnected, so that light emitted by the laser diode can be irradiated on the laser intensity detector (7); The top of the test platform (2) is provided with contacts (16) whose positions correspond to the positions of the pins of the laser diode. Driven by the three-axis truss robot (5), the pins of the laser diode respectively contact the respective contacts (16), allowing the laser diode to conduct and emit light.

2. The optical chip processing test device with autonomous loading function according to claim 1, characterized in that: Placement trays (28) are provided on both sides of the top of the test platform (2). The top of the placement tray (28) is provided with a plurality of placement slots (27) arranged in a matrix. The placement slots (27) are used to place laser diodes. A hole corresponding to the position of a pin of the laser diode is provided at the bottom of each placement tray (28).

3. The optical chip processing test device with autonomous loading function as claimed in claim 2, characterized in that: Limiting frames (9) are respectively provided on both sides of the top of the test platform (2), and supporting feet (6) are respectively provided at the four corners of the bottom of the placement plate (28). When the supporting feet are placed in the limiting frames (9), the positioning can be achieved; The placement plate (28) is located in the working area of the three-axis truss robot (5), and the three-axis truss robot (5) drives the suction cup (8) to pick up the laser diode located in the placement plate (28).

4. The optical chip processing test device with autonomous loading function as claimed in claim 3, characterized in that: An annular support (11) is provided on the top of the test platform (2), a plurality of support arms (22) are symmetrically provided on the top of the annular support (11) and are radially arranged therewith, a telescopic mechanism is provided on the top of the support arm (22), a probe (26) is provided at the end of the telescopic mechanism, and a contact (16) is respectively provided on each probe (26).

5. The optical chip processing test device with autonomous loading function as claimed in claim 4, characterized in that: The telescopic mechanism comprises a linear guide rail (24) arranged parallel to the top of the support arm (22); a mounting seat (23) is provided on the top of the linear guide rail (24); the mounting seat (23) is slidably mounted on the linear guide rail (24) via a slider; a support shaft (17) parallel to the support arm (22) is provided on the mounting seat (23); and a probe (26) is arranged on the end of the support shaft (17); A linear drive module (25) parallel to the linear guide rail (24) is also provided on the top of each support arm (22). The linear drive module (25) is connected to the sliders respectively. The linear drive module (25) drives the probe (26) to move toward or away from the center of the annular support (11).

6. The optical chip processing test device with autonomous loading function according to claim 5, characterized in that: An annular guide rail (10) is provided on the top of the annular support (11), and L-shaped seat bodies (12) corresponding in number to the support arms (22) are provided on the outside of the top of the annular support (11), and the top of the L-shaped seat bodies (12) is slidably arranged on the annular guide rail (10) via a slider; A driving device is provided on the side of each L-shaped seat body (12) for driving it to move along the annular support (11); A rotating motor (21) is provided on the top of each L-shaped seat body (12), and one end of the support arm (22) away from the contact (16) is mounted on the rotating shaft of the rotating motor (21).

7. The optical chip processing test device with autonomous loading function according to claim 6, characterized in that: The driving device includes an adjusting motor (13) installed on the side of each L-shaped seat (12), the rotating shaft of the adjusting motor (13) extends to the side of the annular support (11), and a traveling gear (18) is provided on the rotating shaft; The traveling gears (18) are all meshed with the annular gear ring (20), and the annular gear ring (20) is mounted on the annular edge (19), and the annular edge (19) is coaxially mounted on the side surface of the annular support (11).

8. The optical chip processing test device with autonomous loading function according to any one of claims 1 to 7, characterized in that: A supporting cabinet (1) is provided at the bottom of the test platform (2), a protective shell (4) is provided at the top of the test platform (2), and two protective doors (3) are rotatably provided on one side of the protective shell (4).

9. The optical chip processing test device with autonomous loading function according to claim 8, characterized in that: A PLC control system is provided in the supporting cabinet 1, and the PLC control system is respectively connected to the three-axis truss robot (5), the laser intensity detector (7), the regulating motor (13), the rotating motor (21), the linear drive module (25), and the probe (26).

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