STM32 microcontroller platform-based laser compatible control system
Through the laser compatible control system based on the STM32 microcontroller platform, the problem of insufficient scalability and compatibility in multi-wavelength microscopy imaging system is solved, and high-precision, multi-channel fast response laser control is achieved to adapt to complex industrial application scenarios.
Patent Information
- Application Number
- CN202510624799.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-15
- Publication Date
- 2025-08-15
- Estimated Expiration
- 2045-05-15
AI Technical Summary
The existing laser drive system is insufficient in multi-wavelength microscopy imaging systems, limited compatibility, limited real-time performance, and the lack of digital signal control interfaces affects response speed and control accuracy.
It adopts a laser compatible control system based on the STM32 microcontroller platform, including multi-channel signal generation, analog signal processing, thermal management and multi-protocol interface conversion modules, and realizes efficient data interaction through the SPI bus and GPIO pins, supports RS232, RS485 and differential signal communication, and integrates a bidirectional level conversion module to adapt to different lasers.
It realizes high-precision and multi-channel fast response of multi-wavelength microscopy imaging system, enhances the compatibility and real-time nature of the system, and meets the needs of complex industrial application scenarios.
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Figure CN120491532A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of laser control, and in particular to a laser compatible control system based on an STM32 microcontroller platform. Background Art
[0002] Laser control systems have internal control modes and external control modes. In internal control mode, the laser's control instructions, status, and fault diagnosis information are transmitted via a bus. Commonly used industrial field buses for lasers include RS-232, RS-485, and Ethernet. The RS-232 bus uses a single-ended unbalanced transmission method, which has weak common-mode rejection and a high interface voltage, potentially impacting circuit chips. The RS-485 bus uses a combination of balanced drivers and differential receivers, offering good noise immunity, but with a maximum communication rate of 10 Mbps. Due to the limitations of polling communication, the communication rate decreases as the number of slaves and transmission distance increase, generally supporting a maximum of 32 nodes. The Ethernet bus has a communication rate of 100 Mbps, allowing for the construction of flexible topologies using different physical media. However, its free and peer-to-peer communication framework lacks the concept of master and slave stations, resulting in low packet utilization and insufficient real-time performance, making it difficult to meet the requirements of high-precision, high-performance laser applications.
[0003] In automated microscopy systems, the output control, state feedback, and multi-channel signal switching of lasers require efficient data interaction, and place high demands on synchronization and real-time performance. At the same time, flexible expansion capabilities are required to adapt to the application requirements of multi-wavelength lasers. With the development of multi-wavelength microscopy technology, the market has placed higher demands on the multi-channel support and rapid response capabilities of laser drive systems for digital signals. Some existing drive systems only support limited dual-channel output, which is difficult to meet the needs of ultra-multi-wavelength microscopy systems. In addition, some systems do not provide digital signals (such as TTL level control interfaces, which may impose certain restrictions on the implementation of fast ON / OFF functions, thereby affecting the response speed and control accuracy of the laser.
[0004] The laser drive system of the existing technology has the following limitations:
[0005] 1. Insufficient scalability. Most drive systems only support a limited number of channels, making it difficult to meet the demand for more laser control channels in scenarios such as multi-wavelength microscopy.
[0006] 2. Limited compatibility. The diverse requirements of different laser models pose a challenge to the compatibility of the drive system. Some systems fail to fully support multiple communication protocols or signal types.
[0007] 3. Limited real-time performance. The lack of a digital signal control interface may affect the realization of fast response functions, which in turn has a certain impact on the control accuracy and efficiency of the laser. Summary of the Invention
[0008] The object of the present invention is to provide an automatic bag inserting machine with high-speed bag insertion, so as to solve the problem of inconvenience in bag insertion during cement packaging proposed in the above background art.
[0009] To achieve the above-mentioned object, the present invention provides the following technical solution: a laser compatible control system based on an STM32 microcontroller platform, the system comprising a main control chip and a multi-channel digital signal generation module, a multi-channel analog signal generation module, an intelligent temperature control module and a multi-protocol interface conversion module respectively connected to the main control chip, the laser compatible control device also comprising at least one bidirectional level conversion module connected to the main control chip, the laser compatible control device also comprising one or any combination of a first communication module, a second communication module and a third communication module respectively connected to the main control chip, the first communication module being connected to an external device control unit, the second communication module being connected to an external network bus, and the third communication module being connected to a waveform editing device, the laser compatible control device also comprising a TTL signal output port connected to the output end of the multi-channel digital signal generation module, a DAC signal output port connected to the output end of the multi-channel analog signal generation module, and a PWM fan drive port connected to the output end of the intelligent temperature control module, the TTL signal output port, the DAC signal output port and the PWM fan drive port being respectively connected to the control board of the laser body.
[0010] Preferably, the multi-channel digital signal generation module includes an SN74HC595PWR shift register, and the SN74HC595PWR shift register is connected in a cascade manner, and the QH pin of the upper chip is connected to the SER pin of the lower chip to form a serial transmission link for data.
[0011] Preferably, the multi-channel analog signal generation module includes an AD5328BRUZ-REEL7 DAC chip, 8 AD5328BRUZ-REEL7 chips share a set of SPI buses, the CS pin of each chip is respectively connected to the GPIO pin of the main control chip, and the main control chip sends data to the AD5328BRUZ-REEL7 chip via the SPI bus to complete the generation of the channel analog signal. The output end realizes signal selection through the TMUX1308PWR multiplexer, and the SEL pin of TMUX1308PWR is connected to the GPIO pin of the main control chip to complete the switching control of the 8-channel signal.
[0012] Preferably, the intelligent temperature control module includes an NTC thermistor and a TXU0104PWR level conversion chip, one end of the NTC thermistor is connected to the power supply, and the other end is connected to the ground through a voltage divider resistor, the voltage divider point is connected to the ADC pin of the main control chip, the main control chip is connected to the input end of TXU0104PWR through the PWM signal output end, the output end of TXU0104PWR is connected to the PWM fan, and the fan speed feedback signal is converted by TXU0104PWR and connected to the timer external signal counting mode input end of the main control chip.
[0013] Preferably, the multi-protocol interface conversion module includes an SN65C3232EDR chip, an SN74LVC1G14DBVR Schmitt trigger, an SN65HVD11DR chip, an AD8132ARZ-R7 differential amplifier and a DSLVDS1001DBVR low-voltage differential signal driver. The SN65C3232EDR chip converts the RS232 signal into a TTL signal, the SN74LVC1G14DBVR Schmitt trigger shapes the TTL signal, the SN65HVD11DR chip converts the TTL signal into an RS485 signal, the AD8132ARZ-R7 differential amplifier converts the single-ended signal into a differential signal, and the DSLVDS1001DBVR low-voltage differential signal driver converts the single-ended signal into a differential signal.
[0014] Preferably, the bidirectional level conversion module includes a TXU0104PWR level conversion chip, the input end of TXU0104PWR is connected to the GPIO pin of the main control chip, and the output end is connected to the signal input end of the external device to complete the level conversion from 3.3V to 5V or 5V to 3.3V.
[0015] Preferably, the first communication module includes a MAX3232 chip, which converts the UART signal into an RS232 signal. The TxD and RxD pins of the MAX3232 are respectively connected to the UART interface of the main control chip, and the RS232 signal is connected to the external device control unit through the DB9 interface.
[0016] Preferably, the laser compatible control system further includes one or any combination of an external network bus and a waveform editing device.
[0017] Preferably, the laser body includes a control board, and the TTL signal output port, DAC signal output port and PWM fan drive port of the laser compatible control device based on the STM32 microcontroller platform are respectively connected to the control board of the laser body.
[0018] Preferably, a laser-compatible control system based on an STM32 microcontroller platform, a microscopic imaging device connected to an external device control unit via an external network bus and coordinated by the external device control unit, and a microscopic imaging head based on an STM32 microcontroller platform connected to a laser based on an STM32 microcontroller platform.
[0019] Compared with the prior art, the present invention has the following beneficial effects:
[0020] The laser compatible control system based on the STM32 microcontroller platform includes a core control unit with integrated multi-channel signal switching function and a digital signal processing module, an analog signal processing module and a heat dissipation management module connected to the core control unit respectively. The core control unit adopts the STM32 series microcontroller as the main control chip, and exchanges data with the digital signal processing module and the analog signal processing module through the SPI bus. The digital signal processing module is composed of a cascaded shift register architecture. The shift registers are connected through serial data pins to form multiple digital signal output channels. The analog signal processing module is composed of multiple digital-to-analog conversion chips sharing a set of SPI buses. Each digital-to-analog conversion chip is independently controlled by an independent chip select signal. The heat dissipation management module includes a temperature acquisition circuit, a fan drive circuit and a speed feedback circuit. The temperature acquisition circuit converts the analog signal of the thermistor into a voltage signal through a voltage divider resistor network and inputs it to the core control unit. The fan drive circuit The circuit converts the PWM signal output by the core control unit into a level signal suitable for the operation of the fan through the level conversion chip. The speed feedback circuit collects the fan speed signal through the timer external counting mode and feeds it back to the core control unit. The core control unit also includes one or any combination of a first interface module, a second interface module and a third interface module respectively connected to external devices. The first interface module communicates with the conventional laser through the RS232 protocol, the second interface module communicates with the OBIS laser through the RS485 protocol, and the third interface module completes the conversion of single-ended signals to differential signals through the differential signal processing circuit. The core control unit also includes a digital signal port connected to the output end of the digital signal processing module, an analog signal port connected to the output end of the analog signal processing module, and a temperature control signal port connected to the output end of the heat dissipation management module. The digital signal port, the analog signal port and the temperature control signal port are respectively connected to the control interface of the laser body to complete the control of the laser. Therefore, the design of a cascaded shift register architecture significantly reduces the microcontroller's I / O resource usage while improving data transmission efficiency. By optimizing the SPI bus resource configuration, data transmission time is shortened and the system's response speed is improved. A closed-loop heat dissipation management design enables precise temperature control and intelligent fan speed regulation, ensuring long-term stable system operation. A multi-protocol interface design supports the communication needs of various laser types and enhances system compatibility. The laser-compatible control system based on the STM32 microcontroller platform can meet the high-precision, multi-channel, and fast-response requirements of multi-wavelength microscopy systems and adapt to complex industrial applications. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 This is a block diagram of the overall structure of the present invention.
[0022] Figure 2 This is a circuit schematic diagram of the multi-channel analog signal generation module of the present invention.
[0023] Figure 3 4 is a circuit diagram of a multi-protocol interface conversion module in an embodiment of the present invention.
[0024] Figure 4 This is a schematic diagram of the level stabilization circuit of the driver chip of the present invention.
[0025] Figure 5 This is the circuit principle diagram of the interface input end of the present invention.
[0026] Figure 6 This is a circuit diagram of a multi-channel digital signal control module of the present invention.
[0027] Figure 7 Schematic diagram of the voltage divider resistor network of the temperature acquisition circuit of the present invention DETAILED DESCRIPTION
[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.
[0029] refer to Figure 1-7 This embodiment provides a laser-compatible control device and system based on the STM32 microcontroller platform. The device includes a main control chip, a multi-channel digital signal generation module, a multi-channel analog signal generation module, an intelligent temperature control module, a multi-protocol interface conversion module, a bidirectional level conversion module, a first communication module, a second communication module, a third communication module, a TTL signal output port, a DAC signal output port, and a PWM fan drive port.
[0030] In this embodiment, the main control chip serves as the core control unit and adopts an STM32 series microcontroller. The main control chip is connected to the multi-channel digital signal generation module, the multi-channel analog signal generation module, the intelligent temperature control module, the multi-protocol interface conversion module, the bidirectional level conversion module, the first communication module, the second communication module, and the third communication module through GPIO pins. The main control chip transmits data with the multi-channel digital signal generation module and the multi-channel analog signal generation module via the SPI bus, and performs temperature data acquisition and PWM signal output with the intelligent temperature control module via the bus. The main control chip is also connected to the first communication module, the second communication module, and the third communication module via the UART interface to realize data exchange with the external device control unit, the external network bus, and the waveform editing device.
[0031] The core of the system is the SN74HC595PWR shift register, which is connected in cascade mode. The QH pin of the upper chip is connected to the SER pin of the lower chip, forming a serial data transmission link. The output end uses a TMUX1308PWR multiplexer to select signals. The SEL pin of the TMUX1308PWR is connected to the three GPIO pins of the main control chip 1 to complete the switching control of eight signals. The output signal and the blanking signal are processed through an AND gate and output to the TTL signal output port, which is ultimately connected to the control board of the laser body.
[0032] refer to Figure 2 The module uses eight AD5328BRUZ-REEL7 chips sharing a single SPI bus. The CS pin of each chip is connected to eight GPIO pins on the main control chip for independent control. The main control chip sends data to the AD5328BRUZ-REEL7 chip via the SPI bus, generating eight channels of analog signals. Signal selection is achieved at the output end using a TMUX1308PWR multiplexer. The TMUX1308PWR's SEL pin is connected to three GPIO pins on the main control chip, enabling flexible switching of the eight signals. The output signal is connected to the laser control board via the DAC signal output port.
[0033] In specific implementation, one end of the NTC thermistor is connected to the power supply, and the other end is connected to ground via a voltage divider resistor. The voltage divider point is connected to the ADC pin of the main control chip for temperature data collection. The main control chip calculates the current temperature value using a Beta parameter algorithm and dynamically adjusts the PWM signal duty cycle based on the temperature gradient. The PWM signal is converted from a 3.3V signal to a 5V signal via the TXU0104PWR level conversion chip to drive the PWM fan. The fan speed feedback signal is converted to a 3.3V signal by the TXU0104PWR chip and then monitored in real time by the main control chip's timer external signal counting mode. The PWM fan drive port is connected to the laser control board for thermal management.
[0034] refer to Figure 3The SN65C3232EDR chip converts RS232 signals into TTL signals. The SN65C3232EDR's TxD and RxD pins are connected to the UART interface of the main control chip to complete data transmission. The TTL signal is shaped by the SN74LVC1G14DBVR Schmitt trigger to improve anti-interference capabilities. The module uses the SN65HVD11DR chip to complete the conversion of TTL signals to RS485 signals. The SN65HVD11DR's A and B pins are connected to the external network bus to ensure communication stability. The analog signal section uses the AD8132ARZ-R7 differential amplifier to convert single-ended signals to differential signals. The digital signal section uses the DSLVDS1001DBVR low-voltage differential signal driver to convert single-ended signals to differential signals to meet the internal signal transmission requirements of the laser.
[0035] In practice, the TXU0104PWR level shifter chip achieves voltage level adaptation between the main control chip and external devices. The TXU0104PWR's input is connected to the main control chip's GPIO pins, and its output is connected to the signal input of the external device, completing the 3.3V to 5V or 5V to 3.3V level conversion.
[0036] The MAX3232 chip converts the UART signal into an RS232 signal. The MAX3232's TxD and RxD pins are connected to the UART interface of the main control chip to complete the data transmission. The RS232 signal is connected to the external device control unit through the DB9 interface to achieve data exchange.
[0037] The SN65HVD11DR chip is used to convert UART signals into RS485 signals. The A and B pins of the SN65HVD11DR are connected to the external network bus to complete data transmission.
[0038] The FT232RL chip converts UART signals into USB signals. The FT232RL's TxD and RxD pins are connected to the UART interface of the main control chip to complete data transmission. The USB signal is connected to the waveform editing device through the USB interface to achieve data exchange.
[0039] The laser compatibility control system includes a laser compatibility control device, an external device control unit, an external network bus, and a waveform editing device. The laser compatibility control device is connected to the external device control unit via a first communication module, to the external network bus via a second communication module, and to the waveform editing device via a third communication module to achieve multi-channel collaborative operation.
[0040] The microscopic imaging system includes a microscopic imaging device, a laser, and a microscopic imaging head. The laser is connected to the microscopic imaging device via a laser-compatible control device, and the microscopic imaging device is connected to the microscopic imaging head via an external network bus, completing high-precision multi-channel collaborative operations.
[0041] In actual application scenarios, the main control chip generates control signals through a multi-channel digital signal generation module and a multi-channel analog signal generation module, and connects to the control board of the laser body through the TTL signal output port and the DAC signal output port to complete the power regulation and switch control of the laser. The intelligent temperature control module is connected to the control board of the laser body through the PWM fan drive port to complete the heat dissipation management. The multi-protocol interface conversion module exchanges data with external devices through multiple communication protocols, and the bidirectional level conversion module realizes the level adaptation between the main control chip and external devices. The first communication module, the second communication module and the third communication module are respectively connected to the external device control unit, the external network bus and the waveform editing device to complete data transmission and collaborative operation.
[0042] In order to better enable relevant personnel in this technical field to fully understand and implement the present invention, the specific implementation principles of the present invention are further supplemented below in combination with specific application scenarios.
[0043] In practical applications, a laser-compatible control system based on the STM32 microcontroller platform was deployed in a microscopy imaging system. This system includes multiple lasers, an external device control unit, an external network bus, and waveform editing equipment. The coordinated operation of the main control chip and various functional modules enables multi-channel signal output, real-time temperature control, and multi-protocol communication adaptation. The following describes the specific steps and operating principles.
[0044] First, the main control chip sends data instructions to the multi-channel digital signal generation module via the SPI bus. The SN74HC595PWR shift registers are connected in cascade, and the main control chip sends data through the DS pin. Once the data transmission is complete, the TMUX1308PWR multiplexer selects the corresponding output channel based on the GPIO signal received on the SEL pin and outputs the signal processed by the AND gate to the TTL signal output port. These TTL signals are ultimately connected to the laser's control board for fast switching control and logic signal linkage. In this process, the main control chip significantly shortens signal switching time while ensuring signal stability through the efficient SPI cascade architecture.
[0045] Secondly, the main control chip sends data instructions to the multi-channel analog signal generation module via another SPI bus. The AD5328BRUZ-REEL7 DAC chips share a single SPI bus, with the CS pin of each chip controlled by an independent GPIO pin, enabling independent generation of multi-channel signals. The main control chip sends data in a non-interrupt manner and utilizes bit-band technology to optimize I / O switching time, resulting in an eight-channel update time of less than 150μs for a single DAC chip and a total system response time of less than 1.3ms. The output signal is selected by the TMUX1308PWR multiplexer and connected to the laser control board via the DAC signal output port for adjusting the laser's output power. This design ensures high-precision analog signal generation and flexible switching, meeting the microscopy imaging system's requirements for rapid signal adjustment.
[0046] Meanwhile, the intelligent temperature control module collects ambient temperature data using an NTC thermistor. The NTC thermistor and a voltage divider resistor form a voltage divider circuit, with the divider point connected to an ADC pin on the main control chip to acquire analog voltage values. The main control chip calculates the current temperature using a Beta parameter algorithm and dynamically adjusts the PWM signal duty cycle based on the temperature gradient. The PWM signal is boosted to 5V by the TXU0104PWR level converter chip to drive the PWM fan. The fan speed feedback signal is then stepped down to 3.3V by the TXU0104PWR chip and monitored in real time by the main control chip's timer in external signal counting mode. This closed-loop feedback mechanism ensures accurate and reliable thermal management, preventing damage to the device due to overheating.
[0047] Next, the multi-protocol interface conversion module exchanges data with external devices through various communication protocols. The SN65C3232EDR chip converts RS232 signals into TTL signals, which are then shaped by the SN74LVC1G14DBVR Schmitt trigger to enhance anti-interference capabilities. The SN65HVD11DR chip converts TTL signals into RS485 signals, with the A and B pins connected to the external network bus to ensure communication stability. Furthermore, the AD8132ARZ-R7 differential amplifier and DSLVDS1001DBVR low-voltage differential signal driver respectively complete the conversion from single-ended signals to differential signals, meeting the internal signal transmission requirements of the laser. The design of this module significantly improves the system's compatibility and scalability, adapting to the needs of various communication scenarios.
[0048] The bidirectional level conversion module then uses the TXU0104PWR level conversion chip to achieve voltage level adaptation between the main control chip and external devices. The TXU0104PWR chip's input is connected to the main control chip's GPIO pins, and its output is connected to the signal input of the external device, completing the 3.3V to 5V or 5V to 3.3V level conversion. This design ensures seamless connection between devices with different voltage standards, avoiding signal distortion or damage caused by voltage mismatch.
[0049] The first communication module converts UART signals into RS232 signals via the MAX3232 chip, with the TxD and RxD pins connected to the UART interface of the main control chip 1 for data transmission. The RS232 signal is connected to the external device control unit via the DB9 interface for data exchange. The second communication module 8 converts UART signals into RS485 signals via the SN65HVD11DR chip, with the A and B pins connected to the external network bus for data transmission. The third communication module 9 converts UART signals into USB signals via the FT232RL chip, and the USB signal is connected to the waveform editing device via the USB interface for data exchange. The design of these three communication modules ensures efficient data transmission and collaborative operation between the system and external devices.
[0050] Finally, the laser-compatible control system achieves multi-channel signal output, real-time temperature control management, and multi-protocol communication adaptation through the coordinated operation of the aforementioned modules. The microscopic imaging device in the system is connected to the laser and microscopic imaging head via an external network bus, forming a complete microscopic imaging system. The control signals generated by the main control chip are connected to the laser's control board via TTL and DAC signal output ports, completing power regulation and on / off control of the laser. The intelligent temperature control module is connected to the laser's control board via a PWM fan drive port to manage heat dissipation.
[0051] In summary, the present invention realizes multi-channel signal generation, real-time temperature control management and multi-protocol communication adaptation through the close cooperation between the main control chip and various functional modules, solving the problems of insufficient multi-channel scalability, lack of digital signal control, and difficulty in balancing real-time and anti-interference capabilities in the existing technology.
[0052] The above contents are only specific embodiments of the present invention and do not limit the scope of protection of the present invention. Any modification, equivalent replacement or improvement within the spirit and principle of the present invention should be included in the scope of protection of the present invention.
Claims
1. A laser compatible control system based on STM32 microcontroller platform, characterized in that: The system includes a main control chip and a multi-channel digital signal generation module, a multi-channel analog signal generation module, an intelligent temperature control module and a multi-protocol interface conversion module respectively connected to the main control chip. The laser compatible control device also includes at least one bidirectional level conversion module connected to the main control chip. The laser compatible control device also includes one or any combination of a first communication module, a second communication module and a third communication module respectively connected to the main control chip, the first communication module is connected to the external device control unit, the second communication module is connected to the external network bus, and the third communication module is connected to the waveform editing device. The laser compatible control device also includes a TTL signal output port connected to the output end of the multi-channel digital signal generation module, a DAC signal output port connected to the output end of the multi-channel analog signal generation module, and a PWM fan drive port connected to the output end of the intelligent temperature control module. The TTL signal output port, the DAC signal output port and the PWM fan drive port are respectively connected to the control board of the laser body.
2. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that, The multi-channel digital signal generation module includes an SN74HC595PWR shift register, which is connected in a serial cascade manner, with the QH pin of the upper chip connected to the SER pin of the lower chip to form a serial transmission link for data.
3. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that, The multi-channel analog signal generation module includes an AD5328BRUZ-REEL7 DAC chip. Eight AD5328BRUZ-REEL7 chips share a set of SPI buses. The CS pin of each chip is connected to the GPIO pin of the main control chip. The main control chip sends data to the AD5328BRUZ-REEL7 chip via the SPI bus to complete the generation of 8-channel analog signals. The output end realizes signal selection through the TMUX1308PWR multiplexer. The SEL pin of TMUX1308PWR is connected to the GPIO pin of the main control chip to complete the switching control of the 8-channel signals.
4. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that, The intelligent temperature control module includes an NTC thermistor and a TXU0104PWR level conversion chip. One end of the NTC thermistor is connected to the power supply, and the other end is connected to the ground through a voltage divider resistor. The voltage divider point is connected to the ADC pin of the main control chip. The main control chip is connected to the input end of TXU0104PWR through the PWM signal output end. The output end of TXU0104PWR is connected to the PWM fan. The fan speed feedback signal is converted by TXU0104PWR and connected to the timer external signal counting mode input end of the main control chip.
5. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that, The multi-protocol interface conversion module includes an SN65C3232EDR chip, an SN74LVC1G14DBVR Schmitt trigger, an SN65HVD11DR chip, an AD8132ARZ-R7 differential amplifier and a DSLVDS1001DBVR low-voltage differential signal driver. The SN65C3232EDR chip converts RS232 signals into TTL signals, the SN74LVC1G14DBVR Schmitt trigger shapes the TTL signals, the SN65HVD11DR chip converts TTL signals into RS485 signals, the AD8132ARZ-R7 differential amplifier converts single-ended signals into differential signals, and the DSLVDS1001DBVR low-voltage differential signal driver converts single-ended signals into differential signals.
6. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that, The bidirectional level conversion module includes a TXU0104PWR level conversion chip. The input end of TXU0104PWR is connected to the GPIO pin of the main control chip, and the output end is connected to the signal input end of the external device to complete the level conversion from 3.3V to 5V or from 5V to 3.3V.
7. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that: The first communication module includes a MAX3232 chip, which converts UART signals into RS232 signals. The TxD and RxD pins of the MAX3232 are respectively connected to the UART interface of the main control chip, and the RS232 signal is connected to the external device control unit through the DB9 interface.
8. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that: The laser compatible control system further includes one or any combination of an external network bus and a waveform editing device.
9. The laser compatible control system based on the STM32 microcontroller platform according to claim 1, characterized in that, The laser body includes a control board, and a TTL signal output port, a DAC signal output port and a PWM fan drive port of a laser compatible control device based on an STM32 microcontroller platform are respectively connected to the control board of the laser body.
10. A microscopic imaging system based on the STM32 microcontroller platform, characterized in that: The microscopic imaging system includes a laser-compatible control system based on an STM32 microcontroller platform as described in claims 1-9, a microscopic imaging device connected to an external device control unit via an external network bus and coordinated by the external device control unit, and a microscopic imaging head based on an STM32 microcontroller platform connected to a laser based on the STM32 microcontroller platform.
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