A laser-compatible control system based on the STM32 microcontroller platform

By using a laser-compatible control system based on the STM32 microcontroller platform, multi-channel signal generation, real-time temperature control management, and multi-protocol communication were achieved. This solved the problems of insufficient scalability, limited compatibility, and insufficient real-time performance in existing technologies, and improved the response speed and control accuracy of the laser drive system.

CN120491532BActive Publication Date: 2026-01-30BEIJING NANOINSIGHTS-TECH CO LTD
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Patent Information

Application Number
CN202510624799.X
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2025-05-15
Publication Date
2026-01-30
Estimated Expiration
2045-05-15

AI Technical Summary

Technical Problem

Existing laser driving systems lack scalability and compatibility in multi-wavelength microscopy imaging systems, have limited real-time performance, and lack digital signal control interfaces, which affects response speed and control accuracy.

Method used

A laser-compatible control system based on the STM32 microcontroller platform is adopted, which integrates multi-channel signal switching function, including digital signal processing module, analog signal processing module and heat dissipation management module. It interacts with the core control unit through SPI bus, supports multiple communication protocols, and realizes multi-channel signal generation and real-time temperature control management.

Benefits of technology

It improves the system's scalability and compatibility, meets the requirements of multi-wavelength microscopic imaging systems for high precision, multiple channels, and fast response, and adapts to complex industrial application scenarios.

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Abstract

This application relates to the field of laser control technology, and in particular to a laser-compatible control system based on an STM32 microcontroller platform. The system includes a core control unit, a digital signal processing module, an analog signal processing module, and a thermal management module. The core control unit uses an STM32 series microcontroller and interacts with each module via an SPI bus. The digital signal processing module employs a shift register cascade architecture. The analog signal processing module shares the SPI bus through multiple digital-to-analog converter chips. The thermal management module implements temperature acquisition, fan drive, and speed feedback. The system supports RS232, RS485, and differential signal communication, and is compatible with various lasers. This application reduces I / O resource consumption, improves data transmission efficiency and response speed, achieves precise temperature control and intelligent speed regulation, enhances system compatibility, and meets the needs of complex industrial scenarios such as multi-wavelength microscopic imaging.
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Description

TECHNICAL FIELD

[0001] The application relates to the technical field of laser control, and particularly relates to a laser compatible control system based on an STM32 microcontroller platform. BACKGROUND

[0002] The laser control system has an internal control mode and an external control mode. In the internal control mode, the control instructions and states of the laser and fault diagnosis information are transmitted through a bus. Common industrial field buses of the laser include an RS-232 bus, an RS-485 bus and an Ethernet bus. The RS-232 bus adopts a single-end unbalanced transmission mode, has weak common-mode rejection capability and high interface level, and may have certain influence on circuit chips. The RS-485 bus adopts a combination of a balanced driver and a differential receiver, has good anti-noise interference performance, but the maximum communication rate is 10 Mbps, and due to the limitation of the polling communication mode, the communication rate will decrease with the increase of the number of slave machines and the transmission distance, and generally at most 32 nodes are supported. The Ethernet bus has a communication rate of 100 Mbps, allows different physical media to be used to build a flexible topology structure, but the free peer-to-peer communication framework lacks the concept of a master station and a slave station, the data packet utilization rate is low, the real-time performance is insufficient, and it is difficult to meet the application scenarios of high-precision and high-performance lasers.

[0003] In an automated microscopic imaging system, the output control, state feedback and multi-channel signal switching of the laser need efficient data interaction, and higher requirements are put forward for synchronization and real-time performance, and flexible expansion capability is needed to adapt to the application requirements of multi-wavelength lasers. With the development of multi-wavelength microscopic imaging technology, the market puts forward higher requirements for the multi-channel support and digital signal fast response capability of the laser driving system. Part of the existing driving systems only support limited double channels, and it is difficult to meet the needs of super multi-wavelength microscopic imaging systems. In addition, part of the systems do not provide digital signals (such as TTL level control interfaces, which may bring certain limitations to the realization of fast ON / OFF functions, thereby affecting the response speed and control accuracy of the laser.

[0004] The existing laser driving system has the following limitations:

[0005] 1. Poor expansibility. Most driving systems only support a limited number of channels, and it is difficult to meet the needs of multi-wavelength microscopic imaging and other scenarios for more laser control channels.

[0006] 2. Limited compatibility. The diversification requirements of different types of lasers challenge the compatibility of the driving system, and part of the systems cannot fully support multiple communication protocols or signal types.

[0007] 3. Limited real-time performance. The absence of a digital signal control interface may affect the implementation of fast response functions, thereby affecting the control accuracy and efficiency of the laser. SUMMARY

[0008] The application aims to provide a high-speed bag inserting automatic bag inserting machine to solve the problem of inconvenient bag inserting in the cement packaging process.

[0009] To achieve the above-mentioned purpose, the application provides the following technical scheme: a laser compatible control system based on an STM32 microcontroller platform, the system comprising a main control chip and a plurality of digital signal generation modules, a plurality of analog signal generation modules, an intelligent temperature control module and a multi-protocol interface conversion module connected with the main control chip, the laser compatible control device further comprising at least one bidirectional level conversion module connected with the main control chip, the laser compatible control device further comprising one or any combination of a first communication module, a second communication module and a third communication module connected with the main control chip, the first communication module being connected with an external device control unit, the second communication module being connected with an external network bus, and the third communication module being connected with a waveform editing device, the laser compatible control device further comprising a TTL signal output port connected with the output end of the plurality of digital signal generation modules, a DAC signal output port connected with the output end of the plurality of analog signal generation modules, and a PWM fan driving port connected with the output end of the intelligent temperature control module, the TTL signal output port, the DAC signal output port and the PWM fan driving port being connected with the control board of the laser main body respectively.

[0010] Preferably, the plurality of digital signal generation modules comprise SN74HC595PWR shift registers, the SN74HC595PWR shift registers being connected in cascade, the QH pin of the upper chip being connected to the SER pin of the lower chip to form a serial transmission link of data.

[0011] Preferably, the plurality of analog signal generation modules comprise AD5328BRUZ-REEL7 DAC chips, 8 AD5328BRUZ-REEL7 chips sharing a group of SPI buses, the CS pin of each chip being connected to the GPIO pin of the main control chip, the main control chip sending data to the AD5328BRUZ-REEL7 chip through the SPI bus to complete the generation of channel analog signals, the output end realizing signal selection through a TMUX1308PWR multiplexer, the SEL pin of the TMUX1308PWR being connected to the GPIO pin of the main control chip to complete the switching control of 8 signals.

[0012] Preferably, the intelligent temperature control module comprises an NTC thermistor and a TXU0104PWR level conversion chip, one end of the NTC thermistor is connected to a power supply, the other end is connected to the ground through a voltage dividing resistor, the voltage dividing point is connected to the ADC pin of the master chip, the master chip is connected to the input end of the TXU0104PWR through the PWM signal output end, the output end of the TXU0104PWR is connected to the PWM fan, and the fan speed feedback signal is connected to the timer external signal counting mode input end of the master chip after being converted by the TXU0104PWR.

[0013] Preferably, the multi-protocol interface conversion module comprises a SN65C3232EDR chip, a SN74LVC1G14DBVR Schmitt trigger, a SN65HVD11DR chip, an AD8132ARZ-R7 differential amplifier and a DSLVDS1001DBVR low-voltage differential signal driver, the SN65C3232EDR chip converts the RS232 signal into a TTL signal, the SN74LVC1G14DBVR Schmitt trigger shapes the TTL signal, the SN65HVD11DR chip converts the TTL signal into an RS485 signal, the AD8132ARZ-R7 differential amplifier converts a single-ended signal into a differential signal, and the DSLVDS1001DBVR low-voltage differential signal driver converts a single-ended signal into a differential signal.

[0014] Preferably, the bidirectional level conversion module comprises a TXU0104PWR level conversion chip, the input end of the TXU0104PWR is connected to the GPIO pin of the master chip, and the output end is connected to the signal input end of an external device, thereby completing the level conversion from 3.3V to 5V or from 5V to 3.3V.

[0015] Preferably, the first communication module comprises a MAX3232 chip, the MAX3232 chip converts a UART signal into an RS232 signal, the TxD and RxD pins of the MAX3232 are respectively connected to the UART interface of the master chip, and the RS232 signal is connected to an external device control unit through a DB9 interface.

[0016] Preferably, the laser compatible control system further comprises one or any combination of an external network bus and a waveform editing device.

[0017] Preferably, the laser main body comprises a control board, and the TTL signal output port, the DAC signal output port and the PWM fan driving port of the laser compatible control device based on the STM32 microcontroller platform are respectively connected to the control board of the laser main body.

[0018] Preferably, the laser compatible control system based on the STM32 microcontroller platform, the microscopic imaging equipment connected with the external equipment control unit through the external network bus and coordinated by the external equipment control unit, and the STM32 microcontroller platform-based microscopic imaging head connected with the STM32 microcontroller platform-based laser.

[0019] Compared with the prior art, the present application has the following beneficial effects:

[0020] The laser compatible control system based on the STM32 microcontroller platform comprises a core control unit integrated with a multi-channel signal switching function, a digital signal processing module, an analog signal processing module and a heat dissipation management module connected with the core control unit respectively, the core control unit adopts an STM32 series microcontroller as a main control chip, data interaction is carried out between the core control unit and the digital signal processing module and the analog signal processing module through an SPI bus, the digital signal processing module is composed of a shift register cascade architecture, the shift registers are connected through serial data pins, forming a multi-channel digital signal output channel, the analog signal processing module is composed of a plurality of digital-to-analog conversion chips sharing an SPI bus, each digital-to-analog conversion chip is independently controlled through an independent chip selection signal, the heat dissipation management module comprises a temperature acquisition circuit, a fan driving circuit and a rotating speed feedback circuit, the temperature acquisition circuit converts an analog signal of a thermistor into a voltage signal through a voltage dividing resistor network and inputs the voltage signal into the core control unit, the fan driving circuit converts a PWM signal output by the core control unit into a level signal suitable for fan operation through a level conversion chip, the rotating speed feedback circuit acquires a fan rotating speed signal through an external counting mode of a timer and feeds back the fan rotating speed signal to the core control unit, the core control unit further comprises one or any combination of a first interface module, a second interface module and a third interface module connected with external devices respectively, the first interface module communicates with a conventional laser through an RS232 protocol, the second interface module communicates with an OBIS laser through an RS485 protocol, the third interface module completes conversion of a single-ended signal into a differential signal through a differential signal processing circuit, the core control unit further comprises a digital signal port connected with an output end of the digital signal processing module, an analog signal port connected with an output end of the analog signal processing module and a temperature control signal port connected with an output end of the heat dissipation management module, the digital signal port, the analog signal port and the temperature control signal port are connected with a control interface of a laser main body respectively, and control of the laser is completed. Therefore, through the design of the shift register cascade architecture, the IO resource occupation of the microcontroller is significantly reduced, and the data transmission efficiency is improved; through the optimization of the SPI bus resource configuration, the data transmission time is shortened, and the response speed of the system is improved; through the closed-loop heat dissipation management design, accurate temperature control and intelligent speed regulation of the fan are realized, and long-term stable operation of the system is ensured; through the multi-protocol interface design, the communication requirements of various types of lasers are supported, and the compatibility of the system is enhanced. The laser compatible control system based on the STM32 microcontroller platform can meet the requirements of high precision, multi-channel and fast response of a multi-wavelength microscopic imaging system, and adapt to complex industrial application scenarios. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 It is a whole structural diagram of the application.

[0022] Figure 2 It is a circuit principle diagram of the multi-channel analog signal generation module of the application.

[0023] Figure 3 The circuit schematic diagram of the multi-protocol interface conversion module in the embodiment of the present application.

[0024] Figure 4 The circuit schematic diagram of the driver chip level stabilization circuit in the embodiment of the present application.

[0025] Figure 5 The circuit schematic diagram of the interface input end in the embodiment of the present application.

[0026] Figure 6 The circuit schematic diagram of the multi-channel digital signal control module in the embodiment of the present application.

[0027] Figure 7 The voltage division resistor network schematic diagram of the temperature acquisition circuit in the embodiment of the present application DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.

[0029] REFERENCE Figures 1-7 The embodiment provides a laser compatible control device and system based on an STM32 microcontroller platform. The device comprises a master control chip, a multi-channel digital signal generation module, a multi-channel analog signal generation module, an intelligent temperature control module, a multi-protocol interface conversion module, a bidirectional level conversion module, a first communication module, a second communication module, a third communication module, a TTL signal output port, a DAC signal output port and a PWM fan driving port.

[0030] In the embodiment, the master control chip serves as a core control unit and adopts an STM32 series microcontroller. The master control chip is connected with the multi-channel digital signal generation module, the multi-channel analog signal generation module, the intelligent temperature control module, the multi-protocol interface conversion module, the bidirectional level conversion module, the first communication module, the second communication module and the third communication module through GPIO pins. The master control chip performs data transmission with the multi-channel digital signal generation module and the multi-channel analog signal generation module through an SPI bus, and performs temperature data acquisition and PWM signal output with the intelligent temperature control module through a bus. The master control chip is also connected with the first communication module, the second communication module and the third communication module through a UART interface, so as to realize data interaction with an external device control unit, an external network bus and a waveform editing device.

[0031] SN74HC595PWR shift register is the core of the construction, SN74HC595PWR shift register is connected by cascading, the QH pin of the upper chip is connected to the SER pin of the lower chip, forming a serial transmission link of data. The output end realizes signal selection through TMUX1308PWR multiplexer, the SEL pin of TMUX1308PWR is connected to 3 GPIO pins of the master chip 1, which is used to complete the switching control of 8-way signal. The output signal and the blanking signal are processed by the AND gate and then output to the TTL signal output port, finally connected to the control panel of the laser main body.

[0032] Reference Figure 2 : The module shares a group of SPI bus through 8 pieces of AD5328BRUZ-REEL7 chip, the CS pin of each chip is connected to 8 GPIO pins of the master chip respectively, realizing independent control. The master chip sends data to AD5328BRUZ-REEL7 chip through SPI bus, completing the generation of 8-channel analog signal. The output end realizes signal selection through TMUX1308PWR multiplexer, the SEL pin of TMUX1308PWR is connected to 3 GPIO pins of the master chip, which is used to complete the flexible switching of 8-way signal. The output signal is connected to the control panel of the laser main body through the DAC signal output port.

[0033] In specific implementation: one end of NTC thermistor is connected to the power supply, the other end is connected to the ground through the voltage dividing resistor, the voltage dividing point is connected to the ADC pin of the master chip, which is used to collect temperature data. The master chip calculates the current temperature value through Beta parameter algorithm, and dynamically adjusts the duty cycle of PWM signal according to temperature gradient. The PWM signal is converted to 5V signal by TXU0104PWR level conversion chip, which is used to drive PWM fan. The fan speed feedback signal is converted to 3.3V signal by TXU0104PWR chip, and then monitored in real time by the timer external signal counting mode of the master chip. The PWM fan driving port is connected to the control panel of the laser main body, which is used to complete the heat dissipation management.

[0034] Reference Figure 3The SN65C3232EDR chip converts the RS232 signal into a TTL signal, the TxD and RxD pins of the SN65C3232EDR are connected to the UART interface of the master control chip respectively, and data transmission is completed. The TTL signal is shaped by the SN74LVC1G14DBVR Schmitt trigger to improve the anti-interference ability. The module converts the TTL signal into an RS485 signal through the SN65HVD11DR chip, and the A and B pins of the SN65HVD11DR are connected to the external network bus to ensure communication stability. The analog signal part uses the AD8132ARZ-R7 differential amplifier to convert the single-ended signal into a differential signal, and the digital signal part uses the DSLVDS1001DBVR low-voltage differential signal driver to convert the single-ended signal into a differential signal, meeting the internal signal transmission requirements of the laser.

[0035] In specific implementation, the TXU0104PWR level conversion chip realizes level adaptation between the master control chip and the external device. The input end of the TXU0104PWR is connected to the GPIO pin of the master control chip, and the output end is connected to the signal input end of the external device, completing the level conversion from 3.3V to 5V or 5V to 3.3V.

[0036] The MAX3232 chip converts the UART signal into an RS232 signal, and the TxD and RxD pins of the MAX3232 are connected to the UART interface of the master control chip respectively, completing data transmission. The RS232 signal is connected to the external device control unit through the DB9 interface to realize data interaction.

[0037] The SN65HVD11DR chip is used to convert the UART signal into an RS485 signal, and the A and B pins of the SN65HVD11DR are connected to the external network bus to complete data transmission.

[0038] The FT232RL chip is used to convert the UART signal into a USB signal, and the TxD and RxD pins of the FT232RL are connected to the UART interface of the master control chip respectively, completing data transmission. The USB signal is connected to the waveform editing device through the USB interface to realize data interaction.

[0039] The laser compatible control system includes a laser compatible control device, an external device control unit, an external network bus, and a waveform editing device. The laser compatible control device is connected with the external device control unit through the first communication module, connected with the external network bus through the second communication module, and connected with the waveform editing device through the third communication module, completing multi-channel collaborative work.

[0040] The micro-imaging system comprises a micro-imaging device, a laser and a micro-imaging head. The laser is connected with the micro-imaging device through a laser-compatible control device, and the micro-imaging device is connected with the micro-imaging head through an external network bus, so that high-precision multi-channel collaborative work is completed.

[0041] In an actual application scenario, the main control chip generates control signals through a multi-channel digital signal generation module and a multi-channel analog signal generation module, and connects to the control board of the laser main body through a TTL signal output port and a DAC signal output port to complete power regulation and switch control of the laser. The intelligent temperature control module is connected to the control board of the laser main body through a PWM fan driving port to complete heat dissipation management. The multi-protocol interface conversion module interacts with external devices through multiple communication protocols, and the bidirectional level conversion module realizes level adaptation between the main control chip and external devices. The first communication module, the second communication module and the third communication module are connected with an external device control unit, an external network bus and a waveform editing device respectively to complete data transmission and collaborative work.

[0042] In order to better enable relevant persons in the art to fully understand and implement the present application, the specific implementation principles of the present application are further supplemented below in conjunction with specific application scenarios.

[0043] In actual application, the laser-compatible control system based on the STM32 microcontroller platform is deployed in a set of micro-imaging system. The system comprises multiple lasers, an external device control unit, an external network bus and a waveform editing device. Through the collaborative work of the main control chip and each functional module, multi-channel signal output, real-time temperature control management and multi-protocol communication adaptation are realized. The following will be described from the specific steps and operation principles.

[0044] Firstly, the main control chip sends data instructions to the multi-channel digital signal generation module through the SPI bus. The SN74HC595PWR shift register is connected in a cascaded manner, and the main control chip sends data through the DS pin. When the data transmission is completed, the TMUX1308PWR multiplexer selects the corresponding output channel according to the GPIO signal received by the SEL pin, and outputs the signal processed by the AND gate to the TTL signal output port. These TTL signals are finally connected to the control board of the laser main body for fast switch control and logic signal linkage. In this process, the main control chip significantly shortens the signal switching time through the efficient SPI cascaded architecture, while ensuring the stability of the signal.

[0045] Secondly, the master chip sends data instructions to the multi-channel analog signal generation module through another set of SPI buses. The AD5328BRUZ-REEL7 DAC chip shares a set of SPI buses, and the CS pin of each chip is controlled by an independent GPIO pin, thereby realizing independent generation of multi-channel signals. The master chip sends data in a non-interrupt mode and optimizes the IO switching time using the bit-band technology, so that the 8-channel update time of a single DAC chip is less than 150μs, and the total response time of the system is less than 1.3ms. After the output signal is selected by the TMUX1308PWR multiplexer, it is connected to the control panel of the laser main body through the DAC signal output port for adjusting the output power of the laser. This design ensures the high-precision generation and flexible switching of analog signals, meeting the needs of fast signal adjustment of the microscopic imaging system.

[0046] At the same time, the intelligent temperature control module collects environmental temperature data through the NTC thermistor. The NTC thermistor and the voltage dividing resistor form a voltage dividing circuit, and the voltage dividing point is connected to the ADC pin of the master chip to collect the analog voltage value. The master chip calculates the current temperature value through the Beta parameter algorithm, and dynamically adjusts the duty cycle of the PWM signal according to the temperature gradient. After the PWM signal is boosted to 5V by the TXU0104PWR level conversion chip, it drives the PWM fan to rotate. The fan speed feedback signal is reduced to 3.3V by the TXU0104PWR chip, and then monitored in real time by the timer external signal counting mode of the master chip. This closed-loop feedback mechanism ensures the accuracy and reliability of the heat dissipation management, preventing equipment damage caused by overheating.

[0047] Then, the multi-protocol interface conversion module interacts with external devices through multiple communication protocols. The SN65C3232EDR chip converts RS232 signals to TTL signals, and the TTL signals are shaped by the SN74LVC1G14DBVR Schmitt trigger to improve the anti-interference ability. The SN65HVD11DR chip converts TTL signals to RS485 signals, and the A and B pins are connected to the external network bus to ensure communication stability. In addition, the AD8132ARZ-R7 differential amplifier and the DSLVDS1001DBVR low-voltage differential signal driver respectively complete the conversion of single-ended signals to differential signals, meeting the requirements of internal signal transmission of the laser. The design of this module significantly improves the compatibility and expandability of the system, adapting to various communication scenarios.

[0048] Then, the bidirectional level conversion module realizes the level adaptation between the master control chip and external devices through the TXU0104PWR level conversion chip. The input end of the TXU0104PWR chip is connected to the GPIO pin of the master control chip, and the output end is connected to the signal input end of the external device, completing the level conversion from 3.3V to 5V or 5V to 3.3V. This design ensures seamless connection between devices with different level standards, avoiding signal distortion or damage caused by level mismatch.

[0049] The first communication module converts the UART signal into an RS232 signal through the MAX3232 chip, and the TxD and RxD pins are connected to the UART interface of the master control chip 1 to complete data transmission. The RS232 signal is connected to the external device control unit through the DB9 interface to realize data interaction. The second communication module 8 converts the UART signal into an RS485 signal through the SN65HVD11DR chip, and the A and B pins are connected to the external network bus to complete data transmission. The third communication module 9 converts the UART signal into a USB signal through the FT232RL chip, and the USB signal is connected to the waveform editing device through the USB interface to realize data interaction. The design of these three communication modules ensures efficient data transmission and collaborative work between the system and external devices.

[0050] Finally, the laser compatible control system completes multi-channel signal output, real-time temperature control management and multi-protocol communication adaptation through the collaborative work of the above modules. The microscopic imaging device in the system is connected with the laser and the microscopic imaging head through the external network bus, forming a complete microscopic imaging system. The control signal generated by the master control chip is connected to the control board of the laser main body through the TTL signal output port and the DAC signal output port, completing the power adjustment and switch control of the laser; the intelligent temperature control module is connected to the control board of the laser main body through the PWM fan driving port, completing the heat dissipation management.

[0051] In summary, the application realizes multi-channel signal generation, real-time temperature control management and multi-protocol communication adaptation through the close cooperation of the master control chip and various functional modules, solving the problems of insufficient multi-channel expansion, lack of digital signal control and difficulty in balancing real-time performance and anti-interference capability in the prior art.

[0052] The above content is only a specific embodiment of the application and does not limit the protection scope of the application. Any modification, equivalent replacement or improvement within the spirit and principles of the application shall be included in the protection scope of the application.

Claims

1. A laser compatible control system based on STM32 microcontroller platform, characterized in that, The system comprises a master chip and a plurality of digital signal generation modules, a plurality of analog signal generation modules, an intelligent temperature control module and a multi-protocol interface conversion module connected with the master chip respectively, the laser compatible control system further comprises at least one bidirectional level conversion module connected with the master chip, the laser compatible control system further comprises one or any combination of a first communication module, a second communication module and a third communication module connected with the master chip respectively, the first communication module is connected with an external device control unit, the second communication module is connected with an external network bus, and the third communication module is connected with a waveform editing device, the laser compatible control system further comprises a TTL signal output port connected with the output end of the plurality of digital signal generation modules, a DAC signal output port connected with the output end of the plurality of analog signal generation modules, and a PWM fan driving port connected with the output end of the intelligent temperature control module, and the TTL signal output port, the DAC signal output port and the PWM fan driving port are connected with the control panel of the laser main body respectively; The plurality of digital signal generation modules comprise SN74HC595PWR shift registers, the SN74HC595PWR shift registers are connected in cascade, the QH pin of the upper chip is connected to the SER pin of the lower chip, and a serial transmission link of data is formed; The plurality of analog signal generation modules comprise AD5328BRUZ-REEL7 DAC chips, eight AD5328BRUZ-REEL7 chips share a group of SPI buses, the CS pin of each chip is connected to the GPIO pin of the master chip respectively, the master chip sends data to the AD5328BRUZ-REEL7 chip through the SPI bus, the generation of 8-channel analog signals is completed, the output end realizes signal selection through a TMUX1308PWR multiplexer, the SEL pin of the TMUX1308PWR is connected to the GPIO pin of the master chip, and the switching control of 8 signals is completed.

2. The STM32 microcontroller platform based laser compatible control system according to claim 1, wherein, The intelligent temperature control module comprises an NTC thermistor and a TXU0104PWR level conversion chip, one end of the NTC thermistor is connected to a power supply, the other end is connected to the ground through a voltage dividing resistor, the voltage dividing point is connected to the ADC pin of the master chip, the master chip is connected to the input end of the TXU0104PWR through the PWM signal output end, the output end of the TXU0104PWR is connected to the PWM fan, and the fan speed feedback signal is connected to the timer external signal counting mode input end of the master chip after being converted by the TXU0104PWR.

3. The STM32 microcontroller platform based laser compatible control system according to claim 1, wherein, The multi-protocol interface conversion module comprises an SN65C3232EDR chip, an SN74LVC1G14DBVR Schmitt trigger, an SN65HVD11DR chip, an AD8132ARZ-R7 differential amplifier and a DSLVDS1001DBVR low-voltage differential signal driver, the SN65C3232EDR chip converts an RS232 signal into a TTL signal, the SN74LVC1G14DBVR Schmitt trigger shapes the TTL signal, the SN65HVD11DR chip converts the TTL signal into an RS485 signal, the AD8132ARZ-R7 differential amplifier converts a single-ended signal into a differential signal, and the DSLVDS1001DBVR low-voltage differential signal driver converts a single-ended signal into a differential signal.

4. The STM32 microcontroller platform based laser compatible control system according to claim 1, wherein, The bidirectional level conversion module comprises a TXU0104PWR level conversion chip, an input end of the TXU0104PWR is connected to a GPIO pin of the master control chip, and an output end is connected to a signal input end of an external device, so as to complete level conversion from 3.3V to 5V or from 5V to 3.3V.

5. The STM32 microcontroller platform based laser compatible control system according to claim 1, wherein, The first communication module comprises a MAX3232 chip, the MAX3232 chip converts a UART signal into an RS232 signal, TxD and RxD pins of the MAX3232 are respectively connected to a UART interface of the master control chip, and the RS232 signal is connected to an external device control unit through a DB9 interface.

6. The STM32 microcontroller platform based laser compatible control system according to claim 1, wherein, The laser compatible control system further comprises one or any combination of an external network bus and a waveform editing device.

7. The STM32 microcontroller platform based laser compatible control system according to claim 1, wherein, The laser main body comprises a control panel, and a TTL signal output port, a DAC signal output port and a PWM fan driving port of the laser compatible control system based on the STM32 microcontroller platform are connected to the control panel of the laser main body.

8. A microscopy system based on STM32 microcontroller platform, characterized in that, The microscopic imaging system comprises the laser compatible control system based on the STM32 microcontroller platform according to any one of claims 1-7, a microscopic imaging device connected to an external device control unit through an external network bus and coordinated by the external device control unit, and a microscopic imaging head based on the STM32 microcontroller platform connected to the laser based on the STM32 microcontroller platform.

Citation Information

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