Trans-inductance voltage stabilizer and manufacturing method thereof

Abstract

The invention relates to the technical field of cross-inductance voltage stabilizers, and discloses a cross-inductance voltage stabilizer and a manufacturing method thereof. The cross-inductance voltage stabilizer comprises a coil module and a magnetic core module, the coil module comprises at least one phase of primary side coil and at least one phase of secondary side coil which are in one-to-one correspondence, the two ends of the primary side coil are provided with a first pin and a fourth pin, and the secondary side coil is provided with a second pin and a third pin; the magnetic core module comprises a magnetic layer and a functional layer, the insulativity and the pressure resistance of the functional layer are both higher than those of the magnetic layer, the functional layer is arranged at one end of the pin of the coil module and surrounds the circumferential direction at least wrapping the first pin, the second pin, the third pin and the fourth pin, and the magnetic layer wraps the other end of the coil module. According to the cross-inductance voltage stabilizer, the electrical characteristics of the cross-inductance voltage stabilizer are ensured, and meanwhile, the voltage resistance and the insulativity between the pins can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of trans-inductor voltage regulators, and in particular to a trans-inductor voltage regulator and a manufacturing method thereof. Background Art

[0002] The TLVR (Trans-Inductor Voltage Regulator) architecture is a VR (Voltage Regulator) power supply architecture. The biggest difference between it and traditional DC-to-DC buck and DC (direct current) architectures is that it replaces the traditional single-winding ordinary inductor with a dual-winding TLVR inductor, which is similar to a transformer. Ordinary inductors have only one set of windings and two pins, while TLVR inductors have two sets of mutually coupled windings and four pins. There is a huge difference in their structural form.

[0003] Because inductor coils are not closed-loop conductors, they have cutouts at the coil leads (i.e., the electrodes). This area places the conductor in direct contact with the magnet, leaving no insulation layer. For complex devices like TLVR inductors, relying solely on the magnetic material's inherent insulation for withstand voltage between coils presents a high risk. To address this issue, efforts are typically made to improve the withstand voltage of the magnetic material. These measures include increasing the glue content, finding glue with higher withstand voltages, and adding highly insulating materials to the magnetic powder. However, these measures typically result in reduced magnetic performance, affecting the inductor's electrical characteristics.

[0004] Therefore, there is an urgent need for a trans-inductor voltage regulator and a manufacturing method thereof to solve the above problems. Summary of the Invention

[0005] Based on the above, an object of the present invention is to provide a trans-inductor regulator and a manufacturing method thereof, which can effectively improve the voltage resistance and insulation between pins while ensuring the electrical characteristics of the trans-inductor regulator.

[0006] To achieve the above object, the present invention adopts the following technical solutions:

[0007] Trans-inductor voltage regulators, including:

[0008] The coil module includes a primary coil and a secondary coil in one-to-one correspondence with each other for at least one phase, wherein the primary coil is provided with a first pin and a fourth pin at both ends, and the secondary coil is provided with a second pin and a third pin;

[0009] The magnetic core module includes a magnetic layer and a functional layer. The insulation and pressure resistance of the functional layer are greater than those of the magnetic layer. The functional layer is arranged at one end of the pin of the coil module and is circumferentially arranged around the first pin, the second pin, the third pin and the fourth pin. The magnetic layer is covered on the other end of the coil module.

[0010] As a preferred solution of the trans-inductor regulator, the thickness of the larger one of the primary coil and the secondary coil is set to H, and the thickness of the functional layer is set to 0.5H-1.5H.

[0011] As a preferred solution of the trans-inductor voltage regulator, the magnetic layer and the functional layer are integrally formed.

[0012] As a preferred solution of the trans-inductor regulator, the primary coil and the secondary coil both include a conductor and an insulating layer covering the circumferential outer side of the conductor.

[0013] As a preferred solution of the trans-inductor voltage regulator, the leakage current of the trans-inductor voltage regulator is less than 500 microamperes when conducting a 120V DC test voltage for 0.5 seconds.

[0014] As a preferred solution of the trans-inductor regulator, the functional layer is arranged around the first pin, the second pin, the third pin and the fourth pin; or one end of the trans-inductor regulator is provided with the functional layer.

[0015] As a preferred solution of the trans-inductor voltage regulator, the magnetic layer is formed by pressing a magnetic powder material, and the functional layer is formed by pressing a voltage-resistant insulating powder material.

[0016] As a preferred solution of the trans-inductor regulator, the first pin and the fourth pin are bent in directions away from each other, and the second pin and the third pin are bent in directions close to each other; and / or, the coil module includes the primary coils and the secondary coils corresponding to one another for two or more phases, and the primary coils and the secondary coils of adjacent phases are arranged in parallel and spaced apart.

[0017] A method for manufacturing a trans-inductor voltage regulator is used to manufacture the trans-inductor voltage regulator as described in any of the above schemes, the method for manufacturing the trans-inductor voltage regulator comprising: pressing to form the magnetic core module, assembling the coil module and the magnetic core module, and pressing the coil module and the magnetic core module to form the trans-inductor voltage regulator.

[0018] As a preferred solution for the manufacturing method of the trans-inductor voltage regulator, pressing to form the magnetic core module includes: laying magnetic powder material and voltage-resistant insulating powder material according to a preset shape, the magnetic powder material can form the magnetic layer after pressing, and the voltage-resistant insulating powder material can form a functional layer after pressing.

[0019] The beneficial effects of the present invention are:

[0020] The present invention provides a coil module and a magnetic core module wrapped around the outside of the coil module, which is used to connect the first, second, third, and fourth pins of the primary and secondary coils to various circuits as inductors to achieve filtering, energy storage, matching, resonance, and other functions. The magnetic core module also includes a functional layer, which has greater insulation and pressure resistance than the magnetic layer and is disposed at one end of the coil module pins and circumferentially around the first, second, third, and fourth pins. By providing the functional layer circumferentially around the first, second, third, and fourth pins, the pressure resistance and insulation levels between the two pins of the primary coil, between the two pins of the secondary coil, and between the pins of the primary and secondary coils can be effectively improved, reducing the dependence on and requirements for the pressure resistance and insulation performance of the magnetic layer, thereby significantly lowering the product design and manufacturing thresholds. At the same time, the other end of the coil module is also coated with a magnetic layer to ensure the normal electrical characteristics of the trans-inductor voltage regulator. That is, the trans-inductor voltage regulator can effectively improve the voltage resistance and insulation between pins while ensuring the electrical characteristics of the trans-inductor voltage regulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in describing the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without any creative work.

[0022] Figure 1 is a schematic diagram of a trans-inductor voltage regulator provided in a specific embodiment of the present invention;

[0023] Figure 2 is a bottom view of a trans-inductor voltage regulator provided in a specific embodiment of the present invention;

[0024] Figure 3 Schematic diagram of another trans-inductor regulator provided in a specific embodiment of the present invention.

[0025] In the picture:

[0026] 100, coil module; 110, primary coil; 111, first pin; 112, fourth pin; 120, secondary coil; 121, second pin; 122, third pin;

[0027] 200, magnetic core module; 210, magnetic layer; 220, functional layer. DETAILED DESCRIPTION

[0028] The following describes embodiments of the present invention in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present invention, but are not to be construed as limiting the present invention.

[0029] In the description of the present invention, it should be noted that the terms "center," "up," "down," "left," "right," "vertical," "horizontal," "inside," and "outside" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions.

[0030] Unless otherwise expressly specified or limited, the terms "mounted," "connected," "connect," and "fixed" should be interpreted broadly. For example, they may refer to fixed or removable connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on specific circumstances.

[0031] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0032] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0033] like Figure 1As shown, this embodiment provides a trans-inductor regulator, which includes a coil module 100 and a magnetic core module 200. The coil module 100 includes at least one primary coil 110 and a secondary coil 120 corresponding to each other. The first pin 111 and the fourth pin 112 are provided at both ends of the primary coil 110, and the secondary coil 120 is provided with a second pin 121 and a third pin 122; the magnetic core module 200 includes a magnetic layer 210 and a functional layer 220. The insulation and pressure resistance of the functional layer 220 are both greater than those of the magnetic layer 210. The functional layer 220 is provided at one end of the pin of the coil module 100 and is arranged around the first pin 111, the second pin 121, the third pin 122 and the fourth pin 112. The magnetic layer 210 covers the other end of the coil module 100.

[0034] By setting up a coil module 100 and a magnetic core module 200 wrapped around the outside of the coil module 100, the first pin 111, the second pin 121, the third pin 122 and the fourth pin 112 of the primary coil 110 and the secondary coil 120 are connected to various circuits as inductors to achieve filtering, energy storage, matching, resonance and other functions. The magnetic core module 200 also includes a functional layer 220. This layer has greater insulation and voltage resistance than the magnetic layer 210 and is positioned at one end of the coil module 100 pins. It surrounds the first, second, third, and fourth pins 111, 121, 122, and 112. This functional layer 220, surrounding the first, second, third, and fourth pins 111, 121, 122, and 112 pins, effectively improves the voltage resistance and insulation between the two pins of the primary coil 110, between the two pins of the secondary coil 120, and between the pins of the primary and secondary coils 110, 120. This reduces the reliance on and requirements for the voltage resistance and insulation performance of the magnetic layer 210, significantly lowering the design and manufacturing requirements for the product. Furthermore, the other end of the coil module 100 is also coated with the magnetic layer 210 to ensure the proper electrical characteristics of the trans-inductor voltage regulator. That is, the trans-inductor voltage regulator can effectively improve the voltage resistance and insulation between pins while ensuring the electrical characteristics of the trans-inductor voltage regulator.

[0035] The primary coil 110 and the secondary coil 120 each include a conductor and an insulating layer circumferentially surrounding the conductor. The conductor is exposed at each pin, allowing for connection to an external circuit. This means that both the primary coil 110 and the secondary coil 120 have a conductor structure similar to enameled wire. Furthermore, the withstand voltage between the conductor and the magnet at the pins of the primary coil 110 and the secondary coil 120, i.e., the cutouts at the coils, requires additional attention. Therefore, a functional layer 220 is provided at the end of the pin where the cutouts are located for insulation.

[0036] In this embodiment, the thickness of the larger of the primary coil 110 and the secondary coil 120 is set to H, and the thickness of the functional layer 220 is set to 0.5H-1.5H. The thickness of the functional layer 220 is set to ensure both its withstand voltage insulation and its normal electrical characteristics. Therefore, when the thickness of the functional layer 220 is set to less than 0.5H, sufficient withstand voltage and insulation cannot be guaranteed. When the thickness of the functional layer 220 is set to greater than 1.5H, it will affect the thickness of the magnetic layer 210, thereby affecting the normal electrical characteristics of the trans-inductor voltage regulator. It is worth noting that, depending on the use requirements of different trans-inductor voltage regulators, the pins can be set to protrude from the functional layer 220. When the pins are protruded from the functional layer 220, the above thickness can be understood as the thickness of the primary coil 110 and the secondary coil 120 located in the magnetic core module 200.

[0037] In other embodiments, by providing a functional layer 220 on the magnetic core module 200, the leakage current across the inductor regulator is less than 500 microamperes under preset test conditions of conducting a 120V DC test voltage for 0.5 seconds, so as to reduce safety hazards caused by leakage and problems that may affect the normal operation and stability of the circuit. Smaller leakage current is more suitable for electronic equipment and circuits with extremely high safety requirements (such as heart monitors, ventilators, etc.), sensitive to electromagnetic interference (such as power modules in communication base stations, etc.), and scenarios with high voltage stability requirements (such as semiconductor manufacturing equipment, precision instruments in scientific research laboratories, etc.). It is worth noting that, under the conditions of meeting the above-mentioned detection requirements of detection voltage, detection time and leakage current, those skilled in the art can set the thickness, shape, etc. of the functional layer 220 according to actual needs, and no specific limitation is made here.

[0038] Exemplarily, the thickness of the functional layer 220 is set to 0.5H, 0.6H, 0.7H, 0.8H, 0.9H, 1H, 1.1H, 1.2H, 1.3H, 1.4H, and 1.5H. Specifically, taking a trans-inductor voltage regulator product with an inductance standard of 50nH-75nH, a larger thickness of the primary coil 110 and the secondary coil 120 set to 0.6mm, and a SiO2 functional layer 220 as an example, the average inductance value and leakage current value under preset test conditions (120V DC / 0.5s) for different thicknesses of the functional layer 220 are illustrated. When the thickness of the functional layer 220 is set to 0.5H, the average inductance of the trans-inductor voltage regulator is 65nH, and under the preset test conditions (120VDC / 0.5s), the leakage value is less than 600uA; when the thickness of the functional layer 220 is set to 0.6H, the average inductance of the trans-inductor voltage regulator is 63.5nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 200uA; when the thickness of the functional layer 220 is set to 0.7H, the average inductance of the trans-inductor voltage regulator is 62nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 100uA; when the thickness of the functional layer 220 is set to 0.8H, the average inductance of the trans-inductor voltage regulator is 60.5nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 50uA; when the thickness of the functional layer 220 is set to 0.9H, the average inductance of the trans-inductor voltage regulator is 59nH, and under the preset test conditions (120VDC / 0.5s), the leakage value is less than 20uA; when the thickness of the functional layer 220 is set to 1H, the average inductance of the trans-inductor voltage regulator is 57.5nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 1uA; when the thickness of the functional layer 220 is set to 1.1.H, the average inductance of the trans-inductor voltage regulator is 56nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 1uA; when the thickness of the functional layer 220 is set to 1.2H, the average inductance of the trans-inductor voltage regulator is 54.5nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 1uA; when the thickness of the functional layer 220 is set to 1.3H, the average inductance of the trans-inductor voltage regulator is 53nH, and under the preset test conditions (120VDC / 0.5s), the leakage value is less than 1uA; when the thickness of the functional layer 220 is set to 1.4H, the average inductance of the trans-inductor voltage regulator is 51.5nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 1uA; when the thickness of the functional layer 220 is set to 4.5H, the average inductance of the trans-inductor voltage regulator is 50nH, and under the preset test conditions (120V DC / 0.5s), the leakage value is less than 1uA.

[0039] It is worth noting that when the thickness of the functional layer 220 is set within the range of 0.5H-1.5H, the average inductance value of the trans-inductor voltage regulator is maximized when the thickness of the functional layer 220 is set to 0.5H. A larger inductance value is more suitable for low-frequency, high-power, and high-power stability application scenarios. For example, in some traditional low-frequency power conversion circuits, electric vehicle drive motor control systems, precision instruments, medical equipment, etc. At the same time, when the thickness of the functional layer 220 is set to 0.5H, the leakage value of the trans-inductor voltage regulator is also the largest under the preset test conditions (120V DC / 0.5s). Many of the above-mentioned application scenarios also have high requirements for leakage values. Therefore, the thickness of 0.5H is a relatively extreme and special case among the optional thicknesses of the functional layer 220. When the thickness of the functional layer 220 is set to 1.5H, the leakage value of the trans-inductor voltage regulator is also minimized under the preset test conditions (120VDC / 0.5s), and the average inductance value is also minimized. The smaller inductance value is more suitable for use in high-frequency, low-power, and less stringent output ripple requirements. For example, server power modules, portable electronic devices, and ordinary consumer electronic products. However, when the thickness of the functional layer 220 is set to 1.5H, the average inductance value of the trans-inductor voltage regulator is already 50nH, which is the standard inductance value. Therefore, the thickness of 1.5H is also a relatively extreme and special case among the optional thicknesses of the functional layer 220.

[0040] Furthermore, when the thickness of the functional layer 220 is set within the range of 0.6H-1H, the mean inductance of the trans-inductor regulator and the leakage current under the preset test conditions (120V DC / 0.5s) both vary with the thickness of the functional layer 220, showing a negative correlation with the thickness of the functional layer 220. Therefore, the specific thickness of the functional layer 220 should be determined based on the actual usage scenario and the mean inductance of the trans-inductor regulator and the leakage current under the preset test conditions (120V DC / 0.5s). When the thickness of the functional layer 220 is set within the range of 1H-1.5H, the leakage current remains consistently less than 1uA under the preset test conditions (120V DC / 0.5s). The inductance of the trans-inductor regulator continues to decrease as the thickness of the functional layer 220 increases, as only the mean inductance of the trans-inductor regulator needs to be considered.

[0041] In summary, a thickness of 0.5H or 1.5H is a relatively extreme and special case of the optional thickness of the functional layer 220. In a typical setting, the thickness of the functional layer 220 is set to 0.6H-1.4H. Furthermore, the thickness of the functional layer 220 is set to be the same as the larger thickness of the primary coil 110 or the secondary coil 120.

[0042] Regarding the shape setting of the functional layer 220, in some embodiments, as Figure 2 As shown, the functional layer 220 is arranged around the first pin 111, the second pin 121, the third pin 122 and the fourth pin 112, that is, the cross-section of the functional layer 220 is adapted to the shape of the pins, and can be as small as possible while meeting the thickness and detection requirements to ensure more magnetic layer 210 area to ensure better electrical performance; or in other embodiments, one end of the cross-inductor regulator is set as the functional layer 220, that is, the functional layer 220 is laid flat, which is more convenient to process and has better voltage resistance and insulation performance.

[0043] The magnetic layer 210 and the functional layer 220 are integrally formed. The integrally formed magnetic layer 210 and the functional layer 220 have no air gap, which effectively reduces the corrosion of the coil and ensures the reliability and service life of the trans-inductor voltage regulator.

[0044] To facilitate integrated molding, the magnetic layer 210 is formed by pressing a magnetic powder material, and the functional layer 220 is formed by pressing a pressure-resistant insulating powder material. In various embodiments, the pressure-resistant insulating powder material can be a powder material that possesses both pressure resistance and insulation properties, or it can be formed by adding a pressure-resistant insulating material to a magnetic powder material, without specific limitation herein.

[0045] In this embodiment, the first pin 111 and the fourth pin 112 are bent in directions away from each other, and the second pin 121 and the third pin 122 are bent in directions close to each other; the shapes of the windings of the primary coil 110 and the secondary coil 120 are not specifically limited here. In addition, the coil module 100 includes primary coils 110 and secondary coils 120 corresponding to one another for more than two phases. Specifically, the coil module 100 includes primary coils 110 and secondary coils 120 corresponding to one another for two to eight phases, that is, the trans-inductor voltage regulator can be as follows Figure 3 In the two-phase inter-inductor voltage regulator shown, or in the three-phase inter-inductor voltage regulator, four-phase inter-inductor voltage regulator, five-phase inter-inductor voltage regulator, six-phase inter-inductor voltage regulator, seven-phase inter-inductor voltage regulator, or eight-phase inter-inductor voltage regulator, the primary coils 110 and secondary coils 120 of adjacent phases are arranged in parallel and spaced apart. It is understandable that as the number of phases increases, the voltage withstand requirements also increase simultaneously. Therefore, when the inter-inductor voltage regulator is set to multi-phase, the thickness of the functional layer 220 can be appropriately increased to ensure voltage withstand and insulation.

[0046] This embodiment also discloses a method for manufacturing a trans-inductor voltage regulator, which is used to manufacture the trans-inductor voltage regulator as described in any of the above schemes. The method for manufacturing the trans-inductor voltage regulator includes: pressing to form a magnetic core module 200, assembling the coil module 100 and the magnetic core module 200, and pressing the coil module 100 and the magnetic core module 200 to form a trans-inductor voltage regulator.

[0047] Compared to the prior art assembly process, the above-mentioned method for manufacturing a trans-inductor voltage regulator has higher electrical characteristics, magnetic shielding effect, and coplanarity of electrode terminals. The manufactured trans-inductor voltage regulator not only ensures the electrical characteristics of the trans-inductor voltage regulator, but also effectively improves the voltage resistance and insulation between the pins. At the same time, it reduces the dependence and requirements on the voltage resistance and insulation performance of the magnetic layer 210, which significantly lowers the product design and manufacturing thresholds. It is worth noting that the above-mentioned method for manufacturing the trans-inductor voltage regulator is a non-sintering one-piece molding process, that is, baking and curing molding within 200°C. Because a non-sintering one-piece molding process is used instead of high-temperature sintering, it is not necessary to use inorganic insulating materials to coat the conductors. Instead, the primary coil 110 and the secondary coil 120 can be set as organic resin or enameled wire type conductors. In addition, the functional layer 220 does not necessarily have to be an inorganic insulating material. It can be a metal magnet, or, if necessary, an organic insulating material or even a mixture of several types of materials. This is not specifically limited here.

[0048] It is worth noting that in the manufacturing method of the trans-inductor voltage regulator, it is necessary to first press the magnetic core module 200, and then assemble it with the coil module 100 and press it into shape at one time. The magnetic core module 200 can serve as a support for the coil module 100 to prevent the coil module 100 from being deformed too much during press molding. The shape of the magnetic core module 200 is not limited and can be an E-type similar to a transformer or other shapes. During assembly, the primary coil 110 and the secondary coil 120 are implanted separately to prepare for press molding. The final molding can be room temperature press molding or hot pressing molding, mainly to form the magnetic core module 200 and the coil module 100 into a whole.

[0049] In one embodiment, forming the magnetic core module 200 by pressing includes laying magnetic powder and pressure-resistant insulating powder according to a predetermined shape. The magnetic powder forms the magnetic layer 210 after pressing, and the pressure-resistant insulating powder forms the functional layer 220 after pressing. Accordingly, the pressure-resistant insulating powder is laid at locations corresponding to the first pin 111, the second pin 121, the third pin 122, and the fourth pin 112, and the magnetic powder is laid at other locations, i.e., powder filling is performed in stages, so that the functional layer 220 and the magnetic layer 210 are formed accordingly after pressing.

[0050] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there may be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.

Claims

1. Trans-inductor voltage regulator, characterized in that, include: A coil module (100) comprises a primary coil (110) and a secondary coil (120) in one-to-one correspondence with at least one phase, wherein two ends of the primary coil (110) are provided with a first pin (111) and a fourth pin (112), and the secondary coil (120) is provided with a second pin (121) and a third pin (122); A magnetic core module (200) comprises a magnetic layer (210) and a functional layer (220); the insulation and pressure resistance of the functional layer (220) are both greater than those of the magnetic layer (210); the functional layer (220) is arranged at one end of the pin of the coil module (100) and is arranged around the first pin (111), the second pin (121), the third pin (122) and the fourth pin (112); and the magnetic layer (210) is coated on the other end of the coil module (100).

2. The trans-inductor regulator according to claim 1, wherein: The thickness of the larger one of the primary coil (110) and the secondary coil (120) is set to H, and the thickness of the functional layer (220) is set to 0.5H-1.5H.

3. The trans-inductor regulator according to claim 1, wherein: The magnetic layer (210) and the functional layer (220) are integrally formed.

4. The trans-inductor regulator according to claim 1, wherein: The primary coil (110) and the secondary coil (120) both include a conductor and an insulating layer covering the circumferential outer side of the conductor.

5. The trans-inductor regulator according to claim 1, wherein: The leakage current of the trans-inductor regulator when conducting a 120V DC test voltage for 0.5 seconds is less than 500 microamperes.

6. The trans-inductor regulator according to claim 1, wherein: The functional layer (220) is arranged around the first pin (111), the second pin (121), the third pin (122) and the fourth pin (112); or one end of the trans-inductor regulator is provided with the functional layer (220).

7. The trans-inductor regulator according to claim 1, wherein: The magnetic layer (210) is formed by pressing a magnetic powder material, and the functional layer (220) is formed by pressing a pressure-resistant insulating powder material.

8. The trans-inductor regulator according to any one of claims 1 to 7, characterized in that: The first pin (111) and the fourth pin (112) are bent in directions away from each other, and the second pin (121) and the third pin (122) are bent in directions approaching each other; and / or, the coil module (100) comprises the primary coils (110) and the secondary coils (120) corresponding to one another for two or more phases, and the primary coils (110) and the secondary coils (120) of adjacent phases are arranged in parallel and spaced apart.

9. A method for manufacturing a trans-inductor voltage regulator, characterized in that: Used to manufacture a trans-inductor voltage regulator as described in any one of claims 1 to 8, the manufacturing method of the trans-inductor voltage regulator comprises: pressing to form the magnetic core module (200), assembling the coil module (100) and the magnetic core module (200), and pressing the coil module (100) and the magnetic core module (200) to form the trans-inductor voltage regulator.

10. The method for manufacturing a trans-inductor regulator according to claim 9, wherein: Pressing to form the magnetic core module (200) includes: laying magnetic powder material and pressure-resistant insulating powder material according to a preset shape, the magnetic powder material being pressed to form the magnetic layer (210), and the pressure-resistant insulating powder material being pressed to form the functional layer (220).

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