Solder paste monitoring method, system and equipment and storage medium

Abstract

The invention relates to the technical field of solder paste management, in particular to a solder paste monitoring method, system and device and a storage medium, and the method comprises the steps: obtaining the amount range of solder paste to be taken and the available duration of residual solder paste of each production line; according to the solder paste temperature returning time interval and the available duration of the remaining solder paste, the material taking time interval of each production line is determined; sorting the material taking time intervals of the production lines according to a time sequence to obtain a solder paste discharging sequence table; according to a preset rule, based on the to-be-taken solder paste amount range of each production line and inventory information, matching a warehouse-out solder paste bottle combination for each material taking time interval in the solder paste discharging sequence table, and obtaining a plurality of temperature returning strategies corresponding to the solder paste warehouse-out sequence table; and the temperature returning strategy meeting the preset condition serves as a solder paste discharging temperature returning strategy, and a driving instruction is generated according to the solder paste discharging temperature returning strategy and the material taking time interval of each production line and sent to the control module. The method has the advantages that through pre-temperature-returning scheduling and resource pooling management, the temperature-returning waiting time is greatly shortened, and the production efficiency is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of solder paste management, and in particular to a solder paste monitoring method, system, device and storage medium. Background Art

[0002] As a core soldering material in surface mount technology (SMT), solder paste quality directly impacts the soldering reliability and product yield of electronic components. Solder paste typically needs to be stored at low temperatures (e.g., 2-10°C) to maintain its activity and must be fully warmed to room temperature before use to prevent condensation adsorption and solder powder oxidation caused by temperature differences, which can lead to defects such as solder voids and poor wetting. Furthermore, incompletely warmed solder paste can lead to unstable viscosity, which can easily cause printing offset or poor release, further impacting production efficiency.

[0003] Under the traditional solder paste management model, production lines must independently collect refrigerated solder paste according to production schedules and wait for it to return to temperature. However, this process has significant drawbacks: First, the inefficiency of the return-to-temperature waiting period: each production line operates independently, requiring repeated waiting times (typically 2-4 hours), resulting in idle equipment and disrupted production cycles; second, resource scheduling imbalances: when multiple production lines operate in parallel, solder paste collection can easily become concentrated or inventory shortages can occur, leading to increased waiting times and emergency transfer costs. Summary of the Invention

[0004] In order to significantly reduce the temperature recovery waiting time and ensure production efficiency through pre-temperature recovery scheduling and resource pooling management, the present application provides a solder paste monitoring method, system, equipment and storage medium.

[0005] The above-mentioned invention objective of this application is achieved through the following technical solutions:

[0006] A solder paste monitoring system, comprising:

[0007] Smart storage cabinets with rewarming chambers;

[0008] a first conveying path for storing unopened solder paste bottles and a first conveying device for conveying the solder paste bottles in the first conveying path to the rewarming chamber one by one;

[0009] a second conveying path for storing opened solder paste bottles and a second conveying device for conveying the solder paste bottles in the second conveying path to the rewarming chamber one by one;

[0010] A statistics module, used to obtain inventory information in the first conveyor lane and the second conveyor lane;

[0011] Processing module, including:

[0012] A calculation unit is used to obtain the range of solder paste to be taken from each production line and the remaining solder paste usable time;

[0013] The time interval determination module is used to determine the material collection time interval of each production line based on the solder paste temperature recovery time interval and the remaining solder paste available time of each production line;

[0014] A sequence table generating unit is used to sort the material collection time intervals of each production line in chronological order to obtain a solder paste discharge sequence table. If the material collection time intervals of two production lines overlap, the order of the two material collection time intervals in the original solder paste discharge sequence table is swapped to obtain a new solder paste discharge sequence table, thereby obtaining multiple solder paste discharge sequence tables;

[0015] A set generation unit is configured to match the solder paste bottle combinations for each extraction time interval in the solder paste extraction sequence table according to preset rules based on the solder paste amount range to be extracted from each production line and the inventory information, and obtain multiple temperature recovery strategies corresponding to the solder paste extraction sequence table;

[0016] The strategy generation unit is used to use the temperature recovery strategy that meets the preset conditions as the solder paste discharge temperature recovery strategy, generate a driving instruction according to the solder paste discharge temperature recovery strategy and the material collection time interval of each production line, and send it to the control module. The control module controls the operation of the first conveying device and the second conveying device according to the driving instruction.

[0017] In a preferred example, the present application can be further configured as follows: the computing unit includes:

[0018] The acquisition sub-unit is used to obtain the required solder paste amount, used solder paste amount, paste application rate, last solder paste amount and single solder paste amount range of each production line;

[0019] The calculation sub-unit is used to calculate the range of solder paste to be taken from each production line based on the required solder paste amount, the used solder paste amount and the range of solder paste amount taken in a single time of each production line, and to determine the remaining solder paste available time of each production line based on the previous solder paste amount taken and the paste usage rate of each production line.

[0020] In a preferred example, the present application can be further configured as follows: the range of the amount of solder paste taken at a single time is calculated based on the paste application rate and the recommended solder paste exposure time range.

[0021] In a preferred example, the present application may be further configured as follows: the inventory information includes the discharge sequence of unopened solder paste bottles in the first conveyor lane and the amount of solder paste in each solder paste bottle, and the discharge sequence of opened solder paste bottles in the second conveyor lane and the amount of solder paste in each solder paste bottle;

[0022] According to the preset rules, based on the range of the amount of solder paste to be taken from each production line and the inventory information, the solder paste bottle combinations for each material collection time interval in the solder paste discharge sequence table are matched to obtain multiple temperature recovery strategies corresponding to the solder paste discharge sequence table, including:

[0023] According to the bottle discharge order in the inventory information and the arrangement order of the solder paste discharge sequence list, a combination of discharged solder paste bottles is matched one by one for each material extraction time interval in the solder paste discharge sequence list to obtain a temperature recovery strategy for the solder paste discharge sequence list; the discharged solder paste bottle combination satisfies the requirement of containing at least one unopened solder paste bottle and being non-redundant; non-redundancy means that the amount of solder paste after any solder paste bottle is removed from the discharged solder paste bottle combination is less than the range of solder paste amount to be extracted for the production line corresponding to the material extraction time interval;

[0024] Repeat the above steps until all the temperature return strategies of the solder paste discharge sequence table are obtained. If the combination of solder paste bottles discharged from the warehouse corresponding to any material extraction time interval in the solder paste discharge sequence table is different, then different temperature return strategies are used.

[0025] In a preferred example, the present application can be further configured as follows: if each material collection time interval in the rewarming strategy corresponds to at least one unopened solder paste bottle, and the number of opened solder paste bottles used is the largest among all rewarming strategies, then the preset condition is met.

[0026] The second object of the present invention is achieved through the following technical solutions:

[0027] A solder paste monitoring method, comprising:

[0028] Obtain the range of solder paste to be taken and the remaining solder paste usable time of each production line;

[0029] Determine the material removal time interval for each production line based on the solder paste temperature recovery time interval and the remaining solder paste available time of each production line;

[0030] Arrange the material collection time intervals of each production line in chronological order to obtain a solder paste discharge sequence table. If the material collection time intervals of two production lines overlap, swap the order of the two material collection time intervals in the original solder paste discharge sequence table to obtain a new solder paste discharge sequence table, thereby obtaining multiple solder paste discharge sequence tables;

[0031] According to preset rules, based on the range of solder paste amounts to be taken from each production line and the inventory information, a combination of solder paste bottles to be taken out of the warehouse is matched to each taking time interval in the solder paste discharge sequence table, and multiple temperature recovery strategies corresponding to the solder paste discharge sequence table are obtained;

[0032] The temperature recovery strategy that meets the preset conditions is used as the solder paste discharge temperature recovery strategy. According to the solder paste discharge temperature recovery strategy and the material collection time interval of each production line, a driving instruction is generated and sent to the control module. The control module controls the operation of the first conveying device and the second conveying device according to the driving instruction.

[0033] The third object of the present invention is achieved through the following technical solutions:

[0034] A solder paste monitoring device is configured to include at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform the solder paste monitoring method described in any one of the above claims.

[0035] The fourth object of the present invention is achieved through the following technical solutions:

[0036] A non-transitory computer-readable storage medium storing computer instructions, wherein the computer instructions are used to cause the computer to execute any one of the above-mentioned solder paste monitoring methods.

[0037] In summary, this application includes at least one of the following beneficial technical effects:

[0038] 1. By building an intelligent storage cabinet with multiple conveyor lanes and rewarming chambers, a centralized solder paste resource pool is formed. Compared to the traditional decentralized management model where each production line independently collects and rewarms solder paste, this solution uses a statistical module to monitor inventory information in real time. Combined with the dynamic scheduling capabilities of the processing module, this solution centralizes the storage of refrigerated solder paste that was originally dispersed across multiple production lines. Physical isolation is implemented between the first conveyor lane (unopened) and the second conveyor lane (opened), establishing a standardized resource pool for classified storage. Through the coordinated operation of the first and second conveyor devices, solder paste in different states is delivered to the shared rewarming chamber on demand. Based on the intelligent scheduling of the time interval determination module and the sequence table generation unit, rewarming task scheduling across production lines is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a schematic diagram of the structure of the smart storage cabinet in one embodiment of the present application;

[0040] Figure 2 1 is a schematic diagram showing the connections between the various units of the processing module of the solder paste monitoring system in one embodiment of the present application;

[0041] Figure 3 This is a flowchart of the implementation of the solder paste monitoring method in one embodiment of the present application.

[0042] Description of the drawings: 1. Intelligent storage cabinet; 2. Temperature return chamber; 3. Material taking port; 4. First conveyor path; 5. Second conveyor path; 6. Weighing device; 7. First conveyor device; 8. Second conveyor device. DETAILED DESCRIPTION

[0043] The following description of exemplary embodiments of the present application is made in conjunction with the accompanying drawings, including various details of the embodiments of the present application to facilitate understanding. These details should be considered as merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present application. Similarly, for the sake of clarity and conciseness, descriptions of well-known functions and structures are omitted in the following description.

[0044] It should be noted that the terms "first," "second," and the like in the present invention are used to distinguish similar objects and are not necessarily used to describe a specific order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate, so that the embodiments of the present disclosure described herein can be implemented in an order other than that illustrated or described herein. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure.

[0045] In this document, the term "and / or" simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A exists alone, A and B exist simultaneously, or B exists alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates an "or" relationship between the related objects.

[0046] Figure 1 This is a schematic diagram of the structure of the smart storage cabinet according to the first embodiment of the present application. Figure 1 As shown, the solder paste monitoring system includes an intelligent storage cabinet 1 with a temperature-returning chamber 2 at its bottom, which provides a temperature-returning space for solder paste bottles to return to room temperature. The temperature-returning chamber 2 has a material access port 3 for workers to retrieve materials. A first conveyor 4 is provided within the intelligent storage cabinet 1. The first conveyor 4 is used to store unopened solder paste bottles and is connected to the first material inlet for workers to deposit solder paste bottles. The intelligent storage cabinet 1 also has a second conveyor 5. The second conveyor 5 is used to store opened solder paste bottles and is connected to the second material inlet for workers to deposit solder paste bottles.

[0047] It can be understood that the amount of solder paste in an unopened solder paste bottle is uniform, and an opened solder paste bottle refers to a solder paste bottle that has been opened and used and has the remaining solder paste. During the use of the production line, there are often solder paste bottles with residual solder paste after use, which are the opened solder paste bottles. The intelligent storage cabinet 1 is also provided with a first conveying device 7 for conveying the solder paste bottles in the first conveyor channel 4 to the return temperature chamber 2 one by one, and a second conveying device 8 for conveying the solder paste bottles in the second conveyor channel 5 to the return temperature chamber 2 one by one; the first conveying device 7 is arranged at the end of the first conveyor channel 4, and the second conveying device 8 is arranged at the end of the second conveyor channel 5. The first conveying device 7 and the second conveying device 8 can adopt conveyor belt conveying devices, that is, two conveyor belts on both sides of two relatively separated conveyor channels, the head end of the conveyor channel is connected to the feed port, and the end is lower than the head end, and the head end to the end is in an arc shape and the inner wall is smooth, so that the solder paste bottle can slide out of the conveyor channel by its own weight, and the solder paste bottle at the very end slides out between the two conveyor belts and is restricted by the friction force of the conveyor belt surface. The two conveyor belts are driven by a motor to convey in the same direction, and then the solder paste bottle at the very end slides out and is conveyed to the return temperature chamber 2. In addition to the conveyor belt conveying device, a blocking buckle can also be used. The blocking buckle can be installed on the inner wall at the end of the conveying path, and the blocking buckle can be driven electrically to cancel the blockage so that the last solder paste bottle falls into the temperature return chamber 2.

[0048] The solder paste monitoring system also includes a statistical module, which is used to obtain inventory information in the first conveyor lane and the second conveyor lane; wherein the inventory information includes the bottle discharge sequence of unopened solder paste bottles in the first conveyor lane and the solder paste amount of each solder paste bottle, and the bottle discharge sequence of opened solder paste bottles in the second conveyor lane and the solder paste amount of each solder paste bottle; the statistical module includes a classification statistical unit, a weighing device and a counter. For example, the weighing device is set on the outer wall of the intelligent storage cabinet, and the counter is installed at the feed port. When feeding, the staff weighs the solder paste bottles on the weighing device to obtain the inventory information. When the solder paste is placed into the corresponding conveyor channel through the corresponding feed port, the classification and statistical unit records the amount of solder paste, that is, the weight of the solder paste bottle minus the gross weight of the empty bottle, and associates it with the number recorded by the counter of the corresponding conveyor channel, that is, forming the bottle discharge sequence of the unopened solder paste bottles in the first conveyor channel and the solder paste amount of each solder paste bottle, and the bottle discharge sequence of the opened solder paste bottles in the second conveyor channel and the solder paste amount of each solder paste bottle; the presentation form is the code sequence and corresponding solder paste amount value of the unopened solder paste bottles in the first conveyor channel, and the code sequence and corresponding solder paste amount value of the opened solder paste bottles in the second conveyor channel.

[0049] Combine Figure 2 ,The solder paste monitoring system also includes a processing module, which includes a ,computing unit, a sequence table generating unit, a set generating unit and a ,strategy generating unit.

[0050] The calculation unit is used to obtain the range of solder paste amount to be taken from each production line and the available time of the remaining solder paste.

[0051] Specifically, the calculation unit includes an acquisition subunit and a calculation subunit. The acquisition subunit is used to obtain the amount of solder paste required, the amount of solder paste used, the paste usage rate, the amount of solder paste taken last time, and the range of solder paste used in a single time for each production line. It can be understood that the system records the information data of each production line. The amount of solder paste required for each production line is estimated based on the production volume when the production line starts, and the total amount of solder paste required is obtained. The amount of solder paste used is calculated by counting the material collection and return conditions of each production line since the start of operation. The paste usage rate is the paste usage rate of the production line, which can be obtained by the quotient of the amount of solder paste used and the production line start-up time as the paste usage rate, or by the paste usage rate of the production line equipment. Similarly, the amount of solder paste taken last time is obtained by the system statistics of the material collection situation of the production line, and the range of solder paste used in a single time is calculated based on the paste usage rate and the recommended solder paste exposure time range. The recommended solder paste exposure time range can be set to 5 to 8 hours in actual settings to improve the overall quality control level. The product of the paste application rate and the recommended solder paste exposure time range is the single solder paste amount range.

[0052] The calculation subunit is used to calculate the range of solder paste to be taken from each production line based on the required solder paste amount, used solder paste amount and single solder paste amount range of each production line, and to determine the remaining solder paste available time of each production line based on the previous solder paste amount taken and the paste usage rate of each production line.

[0053] Specifically, the range of solder paste to be taken from a production line is based on the range of solder paste taken in a single batch. If the difference between the required solder paste amount and the used solder paste amount is less than the maximum range of solder paste taken in a single batch, the difference between the required solder paste amount and the used solder paste amount is used as the range of solder paste to be taken from the production line. If the difference between the required solder paste amount and the used solder paste amount is greater than the maximum range of solder paste taken in a single batch, the range of solder paste taken in a single batch is used as the range of solder paste to be taken from the production line.

[0054] Based on the product of the difference between the current time information and the previous time information of the production line and the paste usage rate, the used and remaining amounts of the last solder paste used by the production line can be calculated. Based on the quotient of the remaining amount and the paste usage rate, the remaining solder paste usage time of the production line can be obtained.

[0055] The time interval determination module is used to determine the material extraction time interval of each production line based on the solder paste temperature recovery time interval and the remaining solder paste available time of each production line.

[0056] The solder paste reheating time interval is set to 2 to 4 hours. The remaining solder paste available time of a certain production line is 5 hours. The current time is 18:00, then the material collection time interval of this production line is 21:00 to 23:00. That is, the current time plus the remaining solder paste available time of this production line minus the minimum value of the solder paste reheating time interval is used as the minimum value of the material collection time interval of this production line, and the current time plus the remaining solder paste available time of this production line is used as the maximum value of the material collection time interval to determine the material collection time interval of each production line.

[0057] The sequence table generation unit is used to sort the material collection time intervals of each production line in chronological order to obtain a solder paste discharge sequence table. If the material collection time intervals of two production lines overlap, the order of the two material collection time intervals in the original solder paste discharge sequence table is swapped to obtain a new solder paste discharge sequence table, thereby obtaining multiple solder paste discharge sequence tables.

[0058] It can be understood that the solder paste discharge sequence table sorts the production lines to represent the order of matching the solder paste bottles out of the warehouse; if the material collection time intervals of the two production lines overlap, they have the same priority to a certain extent, so the order of the two material collection time intervals in the original solder paste discharge sequence table can be swapped to form a new solder paste discharge sequence table.

[0059] The set generation unit is used to match the outgoing solder paste bottle combination for each material collection time interval in the solder paste discharge sequence table based on the range of solder paste quantity to be taken and inventory information of each production line according to preset rules, and obtain multiple temperature return strategies corresponding to the solder paste discharge sequence table.

[0060] Among them, according to the preset rules, based on the range of solder paste quantities to be taken and inventory information of each production line, each material collection time interval in the solder paste discharge sequence table is matched with a combination of solder paste bottles to be discharged, and multiple temperature recovery strategies corresponding to the solder paste discharge sequence table are obtained, including:

[0061] According to the bottle discharge order (bottle discharge sequence) in the inventory information and the arrangement order of the solder paste discharge sequence table, the outbound solder paste bottle combination is matched one by one for each material extraction time interval of the solder paste discharge sequence table to obtain a temperature recovery strategy for the solder paste outbound sequence table; the outbound solder paste bottle combination satisfies the requirement of containing at least one unopened solder paste bottle, and the solder paste bottle combination is not redundant; non-redundancy means that the amount of solder paste after reducing any solder paste bottle from the outbound solder paste bottle combination is less than the range of solder paste amount to be extracted for the production line corresponding to the material extraction time interval.

[0062] Repeat the above steps until all the rewarming strategies in the solder paste discharge sequence table are obtained. Different combinations of solder paste bottles discharged from the warehouse corresponding to any extraction time interval in the solder paste discharge sequence table are different rewarming strategies. In this way, all rewarming strategies are traversed.

[0063] The combination of solder paste bottles shipped out of the warehouse must contain at least one unopened solder paste bottle. When there is less remaining solder paste, the solder paste is more likely to be uneven, and the quality of the opened solder paste is slightly inferior to that of the unopened solder paste. Therefore, it is guaranteed that each combination of solder paste bottles shipped out of the warehouse contains at least one unopened solder paste bottle, which can be fully mixed with the opened solder paste after subsequent stirring. Or when the amount of solder paste used is so small that the amount of solder paste in a single opened solder paste bottle can also be met, using only unopened solder paste instead of opened solder paste can ensure production quality.

[0064] The strategy generation unit is used to use the temperature recovery strategy that meets the preset conditions as the solder paste discharge temperature recovery strategy, generate a driving instruction according to the solder paste discharge temperature recovery strategy and the material collection time interval of each production line, and send it to the control module. The control module controls the operation of the first conveying device and the second conveying device according to the driving instruction.

[0065] Generating drive instructions based on the solder paste discharge and rewarming strategy and the material collection time intervals for each production line means generating a corresponding drive instruction to the control module based on the combination of solder paste bottles leaving the warehouse two hours before the material collection time interval for each production line, in accordance with the order of the production lines in the solder paste discharge and rewarming strategy. The drive instruction includes the code in the bottle discharge sequence of the first conveyor and the code in the bottle discharge sequence of the second conveyor. Since only the solder paste bottles corresponding to the first codes in the bottle discharge sequence can be delivered first, they are output one by one in sequence to the rewarming chamber. Based on the drive instruction, the control module drives the corresponding number of solder paste bottles on the first conveyor to discharge into the rewarming chamber, and drives the corresponding number of solder paste bottles on the second conveyor to discharge into the rewarming chamber. The processing module also sends a reminder to collect materials to the production line during the material collection time interval to remind the staff to collect the materials.

[0066] The weighing device has a pick-up mode. By weighing and identifying the solder paste bottles, the pick-up method is confirmed to ensure the correct pick-up of the corresponding solder paste bottle combination. At the same time, the statistics module updates the inventory information based on the pick-up mode of the weighing device, that is, the bottle discharge sequence.

[0067] If each re-warming strategy's material collection time interval corresponds to at least one unopened solder paste bottle, and the number of opened solder paste bottles used is the highest among all re-warming strategies, then the preset conditions are met. This ensures that each outbound solder paste bottle combination delivered to the production line contains at least one unopened solder paste bottle, and that opened solder paste bottles are removed first whenever possible, reducing the redundancy of opened solder paste bottles and significantly improving overall soldering quality.

[0068] This application also provides a solder paste monitoring method, referring to Figure 3 ,include:

[0069] S1. Obtain the range of solder paste to be taken and the remaining solder paste usable time of each production line.

[0070] S2. Determine the material removal time interval for each production line based on the solder paste temperature recovery time interval and the remaining solder paste available time of each production line.

[0071] S3. Sort the material collection time intervals of each production line in chronological order to obtain a solder paste discharge sequence table. If the material collection time intervals of two production lines overlap, then swap the order of the two material collection time intervals in the original solder paste discharge sequence table to obtain a new solder paste discharge sequence table, thereby obtaining multiple solder paste discharge sequence tables.

[0072] S4. According to preset rules, based on the range of solder paste amounts to be taken from each production line and inventory information, a combination of solder paste bottles to be taken out of the warehouse is matched to each taking time interval in the solder paste discharge sequence table, and multiple temperature recovery strategies corresponding to the solder paste discharge sequence table are obtained.

[0073] S5. The temperature recovery strategy that meets the preset conditions is used as the solder paste discharge temperature recovery strategy. According to the solder paste discharge temperature recovery strategy and the material collection time interval of each production line, a driving instruction is generated and sent to the control module. The control module controls the operation of the first conveying device and the second conveying device according to the driving instruction.

[0074] Among them, S1 includes:

[0075] S11. Obtain the required solder paste amount, used solder paste amount, paste application rate, last solder paste amount, and single solder paste amount range for each production line.

[0076] S12, a calculation subunit, is used to calculate the range of solder paste to be taken from each production line based on the required solder paste amount, the used solder paste amount and the range of solder paste amount taken in a single time of each production line, and to determine the remaining solder paste available time of each production line according to the previous solder paste amount taken and the paste usage rate of each production line.

[0077] The inventory information includes the discharging sequence of unopened solder paste bottles in the first conveyor and the amount of solder paste in each solder paste bottle, and the discharging sequence of opened solder paste bottles in the second conveyor and the amount of solder paste in each solder paste bottle.

[0078] In one embodiment, S4 includes:

[0079] According to the bottle discharge order in the inventory information and the arrangement order of the solder paste discharge sequence list, the outbound solder paste bottle combination is matched one by one for each material extraction time interval of the solder paste discharge sequence list to obtain a temperature recovery strategy for the solder paste outbound sequence list; the outbound solder paste bottle combination satisfies the requirement of containing at least one unopened solder paste bottle, and the solder paste bottle combination is not redundant; non-redundancy means that the amount of solder paste after reducing any solder paste bottle from the outbound solder paste bottle combination is less than the range of solder paste amount to be extracted for the production line corresponding to the material extraction time interval.

[0080] Repeat the above steps until all the temperature return strategies of the solder paste discharge sequence table are obtained. If the combination of solder paste bottles discharged from the warehouse corresponding to any material extraction time interval in the solder paste discharge sequence table is different, then different temperature return strategies are used.

[0081] The specific definition of the solder paste monitoring method can be found in the above definition of the solder paste monitoring system, which will not be repeated here. Each step of the above solder paste monitoring method can be implemented in whole or in part by software, hardware or a combination thereof.

[0082] According to an embodiment of the present application, the present application also provides a solder paste monitoring device, comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions that can be executed by the at least one processor, and the instructions are executed by the at least one processor to enable the at least one processor to perform any of the above-mentioned solder paste monitoring methods.

[0083] The present application also provides a non-transitory computer-readable storage medium storing computer instructions, where the computer instructions are used to enable a computer to execute any of the above-mentioned solder paste monitoring methods.

[0084] Various implementations of the systems and techniques described herein can be realized in digital electronic circuit systems, integrated circuit systems, dedicated ASICs (application specific integrated circuits), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system that includes at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0085] These computer programs (also referred to as programs, software, software applications, or code) include machine instructions for a programmable processor and can be implemented using high-level procedural and / or object-oriented programming languages, and / or assembly / machine languages. As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, apparatus, and / or device (e.g., a magnetic disk, an optical disk, a memory, a programmable logic device (PLD)) for providing machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal for providing machine instructions and / or data to a programmable processor.

[0086] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0087] The systems and techniques described herein can be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer having a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), and the Internet.

[0088] It should be understood that the various forms of the processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this application can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions disclosed in this application can be achieved. This is not a limitation herein.

[0089] The above specific embodiments do not constitute a limitation on the scope of protection of this application. Those skilled in the art will appreciate that various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application shall be included within the scope of protection of this application.

Claims

1. Solder paste monitoring system, characterized in that, include: Smart storage cabinets with rewarming chambers; a first conveying path for storing unopened solder paste bottles and a first conveying device for conveying the solder paste bottles in the first conveying path to the rewarming chamber one by one; a second conveying path for storing opened solder paste bottles and a second conveying device for conveying the solder paste bottles in the second conveying path to the rewarming chamber one by one; A statistics module, used to obtain inventory information in the first conveyor lane and the second conveyor lane; Processing module, including: A calculation unit is used to obtain the range of solder paste to be taken from each production line and the remaining solder paste usable time; The time interval determination module is used to determine the material collection time interval of each production line based on the solder paste temperature recovery time interval and the remaining solder paste available time of each production line; A sequence table generating unit is used to sort the material collection time intervals of each production line in chronological order to obtain a solder paste discharge sequence table. If the material collection time intervals of two production lines overlap, the order of the material collection time intervals of the two production lines in the original solder paste discharge sequence table is swapped to obtain a new solder paste discharge sequence table, thereby obtaining multiple solder paste discharge sequence tables; A set generation unit is configured to match the solder paste bottle combinations for each extraction time interval in the solder paste extraction sequence table according to preset rules based on the solder paste amount range to be extracted from each production line and the inventory information, and obtain multiple temperature recovery strategies corresponding to the solder paste extraction sequence table; The strategy generation unit is used to use the temperature recovery strategy that meets the preset conditions as the solder paste discharge temperature recovery strategy, generate a driving instruction according to the solder paste discharge temperature recovery strategy and the material collection time interval of each production line, and send it to the control module. The control module controls the operation of the first conveying device and the second conveying device according to the driving instruction.

2. The solder paste monitoring system according to claim 1, wherein: The computing unit includes: The acquisition sub-unit is used to obtain the required solder paste amount, used solder paste amount, paste application rate, last solder paste amount and single solder paste amount range of each production line; The calculation sub-unit is used to calculate the range of solder paste to be taken from each production line based on the required solder paste amount, the used solder paste amount and the range of solder paste amount taken in a single time of each production line, and to determine the remaining solder paste available time of each production line based on the previous solder paste amount taken and the paste usage rate of each production line.

3. The solder paste monitoring system according to claim 2, wherein: The range of solder paste amount taken at a single time is calculated based on the paste application rate and the recommended solder paste exposure time range.

4. The solder paste monitoring system according to claim 1, wherein: The inventory information includes the discharge sequence of unopened solder paste bottles in the first conveyor and the amount of solder paste in each solder paste bottle, and the discharge sequence of opened solder paste bottles in the second conveyor and the amount of solder paste in each solder paste bottle; According to the preset rules, based on the range of the amount of solder paste to be taken from each production line and the inventory information, the solder paste bottle combinations for each material collection time interval in the solder paste discharge sequence table are matched to obtain multiple temperature recovery strategies corresponding to the solder paste discharge sequence table, including: According to the bottle discharge order in the inventory information and the arrangement order of the solder paste discharge sequence list, a combination of discharged solder paste bottles is matched one by one for each material extraction time interval in the solder paste discharge sequence list to obtain a temperature recovery strategy for the solder paste discharge sequence list; the discharged solder paste bottle combination satisfies the requirement of containing at least one unopened solder paste bottle and being non-redundant; non-redundancy means that the amount of solder paste after any solder paste bottle is removed from the discharged solder paste bottle combination is less than the range of solder paste amount to be extracted for the production line corresponding to the material extraction time interval; Repeat the above steps until all the temperature return strategies of the solder paste discharge sequence table are obtained. If the combination of solder paste bottles discharged from the warehouse corresponding to any material extraction time interval in the solder paste discharge sequence table is different, then different temperature return strategies are used.

5. The solder paste monitoring system according to claim 4, wherein: If each material extraction time interval in the temperature recovery strategy corresponds to at least one unopened solder paste bottle, and the number of opened solder paste bottles used is the largest among all temperature recovery strategies, then the preset condition is met.

6. A solder paste monitoring method based on the solder paste monitoring system according to any one of claims 1 to 5, characterized in that: include: Obtain the range of solder paste to be taken and the remaining solder paste usable time of each production line; Determine the material removal time interval for each production line based on the solder paste temperature recovery time interval and the remaining solder paste available time of each production line; Arrange the material collection time intervals of each production line in chronological order to obtain a solder paste discharge sequence table. If the material collection time intervals of two production lines overlap, swap the order of the material collection time intervals of the two production lines in the original solder paste discharge sequence table to obtain a new solder paste discharge sequence table, thereby obtaining multiple solder paste discharge sequence tables; According to preset rules, based on the range of solder paste amounts to be taken from each production line and the inventory information, a combination of solder paste bottles to be taken out of the warehouse is matched to each taking time interval in the solder paste discharge sequence table, and multiple temperature recovery strategies corresponding to the solder paste discharge sequence table are obtained; The temperature recovery strategy that meets the preset conditions is used as the solder paste discharge temperature recovery strategy. According to the solder paste discharge temperature recovery strategy and the material collection time interval of each production line, a driving instruction is generated and sent to the control module. The control module controls the operation of the first conveying device and the second conveying device according to the driving instruction.

7. The solder paste monitoring method according to claim 6, wherein: Obtain the range of solder paste to be taken and the remaining solder paste usable time for each production line, including: Obtain the required solder paste volume, used solder paste volume, paste application rate, last solder paste volume, and single solder paste volume range for each production line; The calculation sub-unit is used to calculate the range of solder paste to be taken from each production line based on the required solder paste amount, the used solder paste amount and the range of solder paste amount taken in a single time of each production line, and to determine the remaining solder paste available time of each production line based on the previous solder paste amount taken and the paste usage rate of each production line.

8. The solder paste monitoring method according to claim 6, wherein: The inventory information includes the discharge sequence of unopened solder paste bottles in the first conveyor and the amount of solder paste in each solder paste bottle, and the discharge sequence of opened solder paste bottles in the second conveyor and the amount of solder paste in each solder paste bottle; According to the preset rules, based on the range of the amount of solder paste to be taken from each production line and the inventory information, the solder paste bottle combinations for each material collection time interval in the solder paste discharge sequence table are matched to obtain multiple temperature recovery strategies corresponding to the solder paste discharge sequence table, including: According to the bottle discharge order in the inventory information and the arrangement order of the solder paste discharge sequence list, a combination of discharged solder paste bottles is matched one by one for each material extraction time interval in the solder paste discharge sequence list to obtain a temperature recovery strategy for the solder paste discharge sequence list; the discharged solder paste bottle combination satisfies the requirement of containing at least one unopened solder paste bottle and being non-redundant; non-redundancy means that the amount of solder paste after any solder paste bottle is removed from the discharged solder paste bottle combination is less than the range of solder paste amount to be extracted for the production line corresponding to the material extraction time interval; Repeat the above steps until all the temperature return strategies of the solder paste discharge sequence table are obtained. If the combination of solder paste bottles discharged from the warehouse corresponding to any material extraction time interval in the solder paste discharge sequence table is different, then different temperature return strategies are used.

9. Solder paste monitoring equipment, characterized in that, include: at least one processor; as well as a memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor. The instructions are executed by the at least one processor to enable the at least one processor to perform the solder paste monitoring method according to any one of claims 6 to 8.

10. A non-transitory computer-readable storage medium storing computer instructions, characterized in that The computer instructions are used to enable the computer to execute the solder paste monitoring method according to any one of claims 6 to 8.

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