Laser device for micropore array processing and use method thereof

Abstract

The invention relates to the technical field of laser processing equipment, in particular to a laser device for micropore array processing and a using method of the laser device. The laser device for micropore array machining comprises an L-shaped machining table, an assembling mechanism is installed on the L-shaped machining table, the assembling mechanism comprises an installing structure and a laser head, the installing structure is connected in an up-down sliding mode in the height direction of the vertical face, an installing groove is formed in the lower end of the installing structure, and the laser head is located and assembled in the installing groove; first notch grooves are formed in at least two side edges of the mounting structure, second notch grooves are formed in at least two side edges of the laser head, the first notch grooves and the second notch grooves are formed in the same side in the same number, and positioning structures are assembled in the first notch grooves and the second notch grooves in the same side at the same time; and a filtering mechanism and a smoke removal mechanism are installed at the upper end and the lower end of the horizontal plane of the L-shaped machining table and communicate with each other, and the smoke removal mechanism is used for generating an air pressure difference, so that the filtering mechanism adsorbs impurities generated by the laser device and discharges purified gas through the smoke removal mechanism.

Description

Technical Field

[0001] The present invention relates to the technical field of laser processing equipment, and in particular to a laser device for processing a microhole array and a method for using the same. Background Art

[0002] In the field of modern precision machining, microhole array processing technology, with its high precision and high efficiency, is widely used in industries such as semiconductor chip manufacturing, biomedical device processing, and precision optical component fabrication. As the industry's demand for product refinement and miniaturization continues to increase, the requirements for the accuracy, efficiency, and processing quality of microhole array processing are becoming increasingly stringent. Laser processing technology, due to its non-contact processing, high energy density, and fast processing speed, has become one of the important means to achieve microhole array processing. Laser-based microhole array processing devices have also emerged and continued to develop. Currently, common laser devices for microhole array processing primarily consist of a laser generation system, a beam transmission and shaping system, a worktable and motion control system, and a laser processing head. The laser generation system generates a high-energy-density laser beam, which is focused onto the workpiece surface by the beam transmission and shaping system. The worktable and motion control system drive the workpiece to achieve point-by-point or scanning processing of the microhole array. The laser processing head, integrated with components such as a focusing lens, completes the final focusing and processing of the laser beam. Its operating principle is to utilize the high energy of the laser beam to rapidly melt and vaporize the workpiece material, thereby forming microholes. Through precise control of laser parameters and worktable motion, microhole arrays of varying specifications can be processed. However, existing laser devices have many problems in actual application scenarios. In semiconductor chip manufacturing, the precision requirements for microhole arrays are extremely high. Because the laser head of traditional laser devices is not stable enough through the screw mounting structure, small vibrations during long processing times can cause the laser head to shift, resulting in errors in the size and position of the processed microholes, affecting chip performance. When processing medical devices, laser processing generates a large amount of smoke and debris. The smoke not only pollutes the working environment, but also interferes with laser transmission, resulting in reduced processing quality and endangering the health of operators. Therefore, the present invention provides a laser device for processing microhole arrays to address the shortcomings of the existing technology. Summary of the Invention

[0003] The purpose of the present invention is to provide a laser device for processing microhole arrays, so as to solve the problems of low processing accuracy and environmental pollution in practical applications of laser devices for processing microhole arrays in the prior art.

[0004] In order to solve the above problems, the present invention proposes a laser device for microhole array processing, and the technical solution adopted is: A laser device for processing a microhole array comprises: an L-shaped processing table, an assembly mechanism is installed on the inner side of the vertical surface of the L-shaped processing table, the assembly mechanism comprises a mounting structure and a laser head, the mounting structure is connected by sliding up and down along the height direction of the vertical surface, and a mounting groove is provided at its lower end, the laser head is positioned and assembled in the mounting groove to achieve horizontal positioning of the laser head; at least two sides of the mounting structure are provided with notch groove 1, at least two sides of the laser head are provided with notch groove 2, and notch groove 1 and notch groove 2 are provided on the same side and in the same number, and positioning structures are simultaneously installed in notch groove 1 and notch groove 2 on the same side to achieve up and down positioning of the laser head; the upper and lower ends of the horizontal surface of the L-shaped processing table are respectively provided with a filtering mechanism and a smoke removal mechanism, and the filtering mechanism and the smoke removal mechanism are connected, and the smoke removal mechanism is used to generate an air pressure difference so that the filtering mechanism absorbs impurities generated by the laser device and discharges the purified gas through the smoke removal mechanism.

[0005] Furthermore, the positioning structure includes an L-shaped positioning block and a fastening structure, the horizontal side of the L-shaped positioning block is a step structure, the vertical side of the L-shaped positioning block is positioned and assembled in notch groove one, and the lower end side of the step structure is positioned and assembled in notch groove two, so that the L-shaped positioning block is assembled with notch groove one and notch groove two at the same time to achieve the upper and lower positioning of the laser head; the fastening structure is used to fix the L-shaped positioning block on the mounting structure.

[0006] Furthermore, the fastening structure includes a baffle, two pins are installed at both ends of one side of the baffle, an assembly block is installed in the middle, and a handle is installed on the other side of the baffle; two sockets are provided on the side where the notch groove 1 is located on the mounting structure, close to both sides of the notch groove 1, and an assembly hole is provided on the vertical side of the L-shaped positioning block, the two pins are assembled in the two sockets, and the assembly block is assembled in the assembly hole to achieve the fixation of the L-shaped positioning block.

[0007] Furthermore, the smoke removal mechanism includes a driving mechanism, a transmission mechanism and an air pressure regulating mechanism. The transmission mechanism includes an active bevel gear, a driven bevel gear and a rotating rod. The driven bevel gear is fixedly mounted on the rotating rod, and the air pressure regulating mechanism is connected to one end of the rotating rod. The active bevel gear is connected to the driving mechanism, and the active bevel gear and the driven bevel gear are meshed for transmission. The driving mechanism drives the active bevel gear to transmit and drives the driven bevel gear to rotate, thereby driving the rotating rod to rotate. The rotating rod rotates to realize the adjustment of the air pressure by the air pressure regulating mechanism.

[0008] Furthermore, the air pressure regulating mechanism includes a telescopic structure and an air cylinder arranged at both ends of the telescopic structure, a piston is arranged inside the air cylinder, an exhaust port is opened at the bottom of the air cylinder, an end of the air cylinder away from the telescopic structure is connected to an air intake pipe, and a one-way valve is arranged inside the exhaust port and the air intake pipe; the telescopic structure is connected to one end of the rotating rod, and the two ends of the telescopic structure are connected to the piston, and under the rotation of the rotating rod, the piston is controlled to reciprocate along the length direction of the air cylinder to generate an air pressure difference. Furthermore, the telescopic structure includes a cross frame, a turntable and a shift rod arranged on the turntable, the turntable is installed at one end of the turntable, the cross frame is installed above the turntable, and the shift rod is rotatably assembled in the vertical frame of the cross frame, the two ends of the horizontal frame of the cross frame are connected to the pistons in the two air cylinders, and the turntable and the shift rod rotate under the rotation of the turntable to realize that the cross frame drives the piston to reciprocate along the length direction of the air cylinder.

[0009] Furthermore, the air pressure regulating mechanism also includes two sleeve rods, the horizontal frame of the cross frame can be slidably installed in the two sleeve rods, and the distance between the two sleeve rods is greater than the horizontal diameter of the turntable, so that the two sleeve rods are installed on both sides of the turntable along the horizontal direction.

[0010] Furthermore, the filtering mechanism includes a purification box and an adsorption net, the adsorption net is installed on one side of the purification box, and a plurality of air holes are provided on both sides of the purification box adjacent to the adsorption net, and the plurality of air holes are connected to the air inlet pipe. Furthermore, a detachable side panel is installed on the side of the purification box opposite to the adsorption net, a T-shaped block is fixedly connected to the top of the side panel, a socket is opened on the top of the purification box, and one side of the T-shaped block is engaged with the inside of the socket. The present invention also proposes a method for using a laser device for processing a microhole array, and the technical solution adopted is: A method for using a laser device for processing a microhole array, based on the above-mentioned laser device for processing a microhole array, comprises the following steps: Step 1: Insert the laser head into the installation slot and assemble the positioning structure into the notch 1 and notch 2 on the same side to achieve horizontal and vertical positioning of the laser head; Step 2: Start the smoke removal mechanism and generate air pressure difference; Step 3: Start the filter mechanism. The air pressure difference causes the filter mechanism to absorb impurities generated by the laser device and discharge the purified gas through the smoke removal mechanism.

[0011] Compared with the prior art, this application has the following beneficial effects: (1) The present invention is an improved invention. The present invention provides a laser device for micro-hole array processing with a relatively simple structure. The present invention performs horizontal positioning of the laser head through an adaptive mounting groove, limits its large displacement in the horizontal direction, and can be quickly and conveniently disassembled and installed; and through the positioning structure, the notch groove 1 and the notch groove 2 are simultaneously assembled on at least two sides of the mounting structure and the laser head to achieve the upper and lower positioning of the laser head, improve the installation stability of the laser head, ensure the stability of the laser beam output, effectively prevent the laser head from loosening or offsetting due to vibration or external force during the processing, ensure the accuracy and stability of laser processing, and reduce processing errors and equipment failures caused by installation problems; the installation method of the laser device for micro-hole array processing is simple and easy to operate.

[0012] (2) The present invention provides a filtering mechanism and a smoke removal mechanism. The smoke removal mechanism is used to generate an air pressure difference. The filtering mechanism effectively absorbs impurities generated by the laser device and discharges the purified gas through the smoke removal mechanism. This can effectively improve the processing environment, protect the health of operators, and reduce the impact of smoke on laser transmission and processing.

[0013] (3) The present invention accurately ensures the movement and positioning of the L-shaped processing table and the laser head by setting up a mounting structure that slides up and down along the height direction of the vertical surface. The above structures work together to provide stable processing conditions for microhole array processing, effectively improve processing quality, and ensure the smooth progress of the processing process and the consistency of processing results.

[0014] The positioning structure includes an L-shaped positioning block and a fastening structure. The horizontal side of the L-shaped positioning block is a stepped structure. The vertical side of the L-shaped positioning block is positioned and assembled in notched groove 1. The lower end of the stepped structure is positioned and assembled in notched groove 2. The L-shaped positioning block is assembled with notched grooves 1 and 2 simultaneously to achieve vertical positioning of the laser head. The fastening structure is used to secure the L-shaped positioning block to the mounting structure. The L-shaped positioning block has a simple structure and can effectively achieve horizontal and vertical positioning of the laser head, further improving the accuracy and stability of laser processing.

[0015] The fastening structure includes a baffle with two latches mounted at both ends of one side of the baffle, an assembly block mounted in the middle, and a handle mounted on the other side of the baffle. Two sockets are provided on the side of the mounting structure where notch 1 is located, near either side of notch 1. The vertical side of the L-shaped positioning block is provided with an assembly hole. The two latches fit into the two sockets, and the assembly block fits into the assembly hole to secure the L-shaped positioning block. This structure strengthens the fixation of the L-shaped positioning block, firmly connecting the L-shaped positioning block, the laser head, and the mounting structure to form a stable overall structure. This further improves the installation stability of the laser head and reduces its deviation during processing, thereby ensuring the accuracy of laser processing.

[0016] The air pressure regulating mechanism includes a telescopic structure and air cylinders disposed at both ends of the telescopic structure. The air cylinders are internally mounted with pistons, and an exhaust port is defined at the bottom of the air cylinders. An air inlet pipe is connected to the end of the air cylinders away from the telescopic structure, and both the exhaust port and the intake pipe are internally provided with one-way valves. The telescopic structure is connected to one end of a rotating rod, and both ends of the telescopic structure are connected to the pistons. The rotation of the rotating rod controls the pistons to reciprocate along the length of the air cylinders to generate an air pressure differential. A single drive mechanism simultaneously controls both air cylinders, enhancing the purification effect. Furthermore, one-way valves are provided in both the exhaust port and the intake pipe, allowing the purified gas to flow in a specific direction, ensuring that the purified gas can smoothly enter the air cylinder through the intake pipe and be discharged from the exhaust port without backflow. The air pressure regulating mechanism also includes two sleeve rods, within which the horizontal frame of the cross frame is slidably mounted. The spacing between the two sleeve rods is greater than the horizontal diameter of the turntable, allowing the two sleeve rods to be horizontally mounted on either side of the turntable. Since the two sleeve rods play a guiding and limiting role on the cross, the cross frame can only perform precise linear reciprocating motion along the direction of the sleeve rods, thereby ensuring the stability and accuracy of the movement.

[0017] A removable side panel is mounted on the side of the purification box opposite the adsorption net. A T-shaped block is fixedly attached to the top of the side panel. A socket is provided on the top of the purification box, and one side of the T-shaped block engages within the socket. This structure facilitates removal and replacement of the adsorption net, ensuring that the filter mechanism maintains a consistently effective purification effect, maintaining a clean working environment for the laser device during processing, and guaranteeing smooth processing and stable processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a right perspective view of a laser device for processing a microhole array according to the present invention; Figure 2 It is a left perspective view of the laser device for processing microhole arrays of the present invention; Figure 3 is a rear perspective view of a laser device for processing a microhole array according to the present invention; Figure 4 is a bottom view of the laser device for processing a microhole array according to the present invention; Figure 5 It is a structural schematic diagram of the assembly mechanism of the laser device for processing microhole arrays of the present invention; Figure 6 It is a schematic diagram of the baffle structure in the laser device for processing microhole arrays of the present invention; Figure 7 It is a schematic structural diagram of the smoke removal mechanism in the laser device for processing microhole arrays of the present invention; Figure 8It is a schematic diagram of the cross frame structure of the laser device for processing microhole arrays of the present invention; Figure 9 It is a schematic structural diagram of the filtering mechanism in the laser device for processing micropore arrays of the present invention; In the figure, 1, L-shaped processing table; 2, guide rail; 3, connecting frame; 4, assembly mechanism; 401, mounting seat; 402, mounting slot; 403, laser head; 404, notch slot 1; 405, notch slot 2; 406, L-shaped positioning block; 407, socket; 408, assembly hole; 409, baffle; 410, handle; 411, assembly block; 412, latch; 413, card bead; 5, smoke removal mechanism; 501, L-shaped base; 50 2. Motor; 503. Rotating rod; 504. Driven bevel gear; 505. Turntable; 506. Push rod; 507. Driving bevel gear; 508. Sleeve rod; 509. Cross frame; 510. Air cylinder; 511. Piston; 512. Exhaust port; 513. Inlet pipe; 6. Filter mechanism; 601. Purification box; 602. Adsorption net; 603. Air hole; 604. Mounting shell; 605. Side panel; 606. T-block; 607. Socket. DETAILED DESCRIPTION

[0019] The following describes in detail embodiments of the present application, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0020] It should be noted that the terms "first", "second", etc. in the description and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0021] Specific embodiment 1 of the laser device for processing microhole arrays of the present invention: In this embodiment, Figure 1 、 Figure 2 、 Figure 3 and Figure 4As shown, the laser device for micro-hole array processing includes: an L-shaped processing table 1, an assembly mechanism 4 is installed on the inner side of the vertical surface of the L-shaped processing table 1, the assembly mechanism 4 includes a mounting structure and a laser head 403, the mounting structure is connected by sliding up and down along the height direction of the vertical surface, and a mounting groove 402 is provided at the lower end thereof, and the laser head 403 is positioned and assembled in the mounting groove 402 to achieve horizontal positioning of the laser head 403; the left and right sides of the mounting structure are provided with a notch groove 404, and the left and right sides of the laser head 403 are provided with a notch groove 404. The notch groove 405 is provided on the same side as the notch groove 404 and the notch groove 405. The notch groove 404 and the notch groove 405 on the same side are equipped with positioning structures to realize the upper and lower positioning of the laser head 403. The upper and lower ends of the horizontal surface of the L-shaped processing table 1 are respectively equipped with a filter mechanism 6 and a smoke removal mechanism 5. The filter mechanism 6 and the smoke removal mechanism 5 are connected. The smoke removal mechanism 5 is used to generate an air pressure difference so that the filter mechanism 6 absorbs impurities generated by the laser device and discharges the purified gas through the smoke removal mechanism 5. Figure 5 As shown, the mounting structure includes a mounting seat 401, and a mounting groove 402 is arranged at the lower end of the mounting seat 401; a guide rail 2 is fixedly connected to the inner side of the vertical surface of the L-shaped processing table 1, and a connecting frame 3 is installed on the movable seat of the guide rail 2. The mounting seat 401 is installed at the bottom of the connecting frame 3, and the laser head 403 slides up and down along the guide rail 2 driven by the mounting seat 401 to achieve the height limitation of the laser head 403.

[0022] Specifically, if Figure 5 and Figure 6 As shown, the positioning structure includes an L-shaped positioning block 406 and a fastening structure. The horizontal side of the L-shaped positioning block 406 is a step structure. The vertical side of the L-shaped positioning block 406 is positioned and assembled in the notch groove 1 404. The lower end of the step structure is positioned and assembled in the notch groove 2 405, so that the L-shaped positioning block 406 is assembled with the notch groove 1 404 and the notch groove 2 405 at the same time to realize the upper and lower positioning of the laser head 403; the fastening structure is used to fix the L-shaped positioning block 406 on the mounting structure. Among them, the fastening structure includes a baffle 409, two pins 412 are installed at both ends of one side of the baffle 409, an assembly block 411 is installed in the middle position, and a handle 410 is installed on the other side of the baffle 409; two sockets 407 are provided on the side where the notch groove 404 is located on the installation structure, close to both sides of the notch groove 404, and an assembly hole 408 is provided on the vertical side of the L-shaped positioning block 406. The two pins 412 are assembled in the two sockets 407, and the assembly block 411 is assembled in the assembly hole 408 to achieve the fixation of the L-shaped positioning block 406.

[0023] When installing the laser head 403, inserting the laser head 403 into the installation slot 402 can provide preliminary positioning and support for the laser head 403, limiting its large horizontal displacement. At the same time, it is necessary to ensure that the position of the laser head 403 is accurate, so that the notch slot 2 405 corresponds precisely to the notch slot 1 404; then the L-shaped positioning block 406 is inserted into the notch slot 1 404 and the notch slot 2 405 on the same side. Since the outer side of the vertical side of the L-shaped positioning block 406 fits with the inner side of the notch slot 1 404, it can effectively limit the horizontal movement of the laser head 403, and also prevent the laser head 403 from loosening in the up and down directions to a certain extent; then the pin 412 is inserted into the socket 407, and the assembly block 411 is accurately The laser head 403 is locked into the assembly hole 408, which further enhances the stability of the installation of the laser head 403, so that the laser head 403 can remain stable during the processing, avoiding position displacement due to factors such as vibration, which affects the accuracy of the microhole array processing; at the same time, the two pins 412 are provided with a card bead 413 on the outside, and the card bead 413 is locked into the recess inside the socket 407, forming an additional locking mechanism, further enhancing the stability of the connection of the pin 412, preventing the pin 412 from accidentally slipping out due to factors such as vibration during the processing, ensuring that the laser head 403 is always firmly installed during the entire processing process, avoiding the quality and accuracy of the microhole array processing due to the looseness of the laser head 403, and realizing convenient and reliable installation of the laser head 403.

[0024] In other embodiments, the three sides of the mounting structure are all provided with notch groove 1 404 , and the three sides of the laser head 403 are all provided with notch groove 2 405 .

[0025] In other embodiments, the four sides of the mounting structure are all provided with notch groove 1 404 , and the four sides of the laser head 403 are all provided with notch groove 2 405 .

[0026] Specific embodiment 2 of the laser device for processing microhole arrays of the present invention: Based on the technical concept of the present invention described above, or based on the specific embodiment of the present invention described above, another embodiment is provided below.

[0027] In this embodiment, Figure 7 and Figure 8As shown, the smoke removal mechanism 5 includes a driving mechanism, a transmission mechanism, and an air pressure regulating mechanism. It also includes an L-shaped base 501. The ends of the vertical sides of the L-shaped base 501 are fixedly connected to the bottom of the L-shaped processing table. The smoke removal mechanism 5 is mounted on the horizontal surface of the L-shaped base 501. The driving mechanism is a motor 502. The transmission mechanism includes a driving bevel gear 507, a driven bevel gear 504, and a rotating rod 503. The rotating rod 503 is rotatably connected to the horizontal surface of the L-shaped base 501. The driven bevel gear 504 is fixedly mounted on the rotating rod 503. The driving bevel gear 507 is in transmission connection with the output end of the motor 502, and the driving bevel gear 507 and the driven bevel gear 504 are meshed for transmission. The air pressure regulating mechanism is connected to one end of the rotating rod 503. The driving mechanism drives the driving bevel gear 507 for transmission, which in turn drives the driven bevel gear 504 to rotate, thereby driving the rotating rod 503 to rotate. The rotating rod 503 rotates to enable the air pressure regulating mechanism to adjust the air pressure.

[0028] The air pressure regulating mechanism includes a telescopic structure and an air cylinder 510 disposed at each end of the telescopic structure. A piston 511 is disposed within the air cylinder 510, and an exhaust port 512 is provided at the bottom of the air cylinder 510. An air inlet pipe 513 is connected to the end of the air cylinder 510 away from the telescopic structure. Both the exhaust port 512 and the air inlet pipe 513 are equipped with one-way valves. These one-way valves ensure that gas can flow only in a specific direction, ensuring that the purified gas in the filter mechanism 6 can smoothly pass through the air inlet pipe 513 and enter the air cylinder 510 without backflow. The telescopic structure is connected to one end of the rotating rod 503, and both ends of the telescopic structure are connected to the piston 511. The rotation of the rotating rod 503 controls the piston 511 to reciprocate along the length of the air cylinder 510 to generate an air pressure differential. Specifically, when the piston 511 moves toward the end of the air cylinder 510 away from the air inlet pipe 513, the space inside the air cylinder 510 increases and the air pressure decreases. Under the action of the air pressure difference, the thick smoke and debris generated by the processing will pass through the gap at the top of the L-shaped processing table and enter the filter mechanism 6; when the piston 511 moves in the opposite direction, the space inside the air cylinder 510 decreases and the air pressure increases. Under the action of the air pressure difference, the purified gas in the filter mechanism 6 enters the air cylinder 510 through the air inlet pipe 513 and is discharged from the exhaust port 512, completing a gas circulation purification process. This cycle is repeated to continuously purify the thick smoke generated by the processing.

[0029] The telescopic structure includes a cross frame 509, a turntable 505, and a lever 506 disposed on the turntable 505. The turntable 505 is mounted at one end of the rotating rod 503. The cross frame 509 is mounted above the turntable 505, and the lever 506 is rotatably mounted in the vertical frame of the cross frame 509. The ends of the horizontal frame of the cross frame 509 are connected to the pistons 511 in the two air cylinders 510. The turntable 505 and the lever 506 rotate under the rotation of the rotating rod 503, so that the cross frame 509 drives the pistons 511 to reciprocate along the length of the air cylinders 510. The air pressure regulating mechanism also includes two sleeve rods 508, which are fixedly connected to the bottom of the L-shaped processing table. The horizontal frame of the cross frame 509 is slidably mounted in the two sleeve rods 508. The spacing between the two sleeve rods 508 is greater than the horizontal diameter of the turntable 505, so that the two sleeve rods 508 are mounted horizontally on both sides of the turntable 505. Since the two sleeve rods 508 guide and limit the cross frame 509, the cross frame 509 can only perform precise linear reciprocating motion along the direction of the sleeve rods 508, thereby ensuring the stability and accuracy of the motion.

[0030] When laser head 403 begins processing the microhole array, it produces a large amount of thick smoke and processing debris. This smoke not only affects the processing environment and poses a health hazard to the operator, but also interferes with laser transmission and processing results. At this point, motor 502 is activated, and its output drives driving bevel gear 507 to rotate. Because driving bevel gear 507 meshes with driven bevel gear 504, driven bevel gear 504 rotates accordingly, in turn driving turntable 505, which is fixed to the top of rotating rod 503. As turntable 505 rotates, its top lever 506 continuously contacts the inside of cross frame 509, pushing it. Because the two sleeve rods 508 guide and limit the cross frame 509, cross frame 509 can only reciprocate within the two sleeve rods 508. As cross frame 509 reciprocates, piston 511 also reciprocates within cylinder 510, ensuring stable and accurate movement.

[0031] Specific embodiment 3 of the laser device for processing microhole arrays of the present invention: Based on the technical concept of the present invention described above, or based on the specific embodiment of the present invention described above, another embodiment is provided below.

[0032] In this embodiment, Figure 9As shown, the filtering mechanism 6 includes a purification box 601 and an adsorption net 602. The bottom of the purification box 601 is fixedly connected to the upper end of the horizontal surface of the L-shaped processing table. The adsorption net 602 is installed on one side of the purification box 601. A plurality of air holes 603 are provided on both sides of the purification box 601 adjacent to the adsorption net 602, and the plurality of air holes 603 are connected to the air inlet pipe 513; at the same time, the outside of the two sides of the purification box 601 adjacent to the adsorption net 602 are fixedly connected with a mounting shell 604, and the outer side of the mounting shell 604 is fixedly connected to one end of the air inlet pipe 513; a detachable side panel 605 is installed on the side of the purification box 601 opposite to the adsorption net 602, and a T-shaped block 606 is fixedly connected to the top of the side panel 605. A socket 607 is provided on the top of the purification box 601, and one side of the T-shaped block 606 is engaged with the inside of the socket 607. After a period of use, the adsorption capacity of the adsorption net 602 decreases and needs to be replaced. At this time, the side panel 605 is lifted upward, and the T-shaped block 606 at the top of the side panel 605 is disengaged from the socket 607 at the top of the purification box 601. The side panel 605 and the adsorption net 602 can then be removed together, completing the replacement of the adsorption net 602 conveniently and quickly. This ensures that the filter mechanism 6 can continuously and effectively purify the thick smoke and debris generated by the processing, ensuring that the laser device always has a clean working environment during the processing, ensuring smooth processing and stable processing quality. The adsorption net 602 is an activated carbon net, and its rich pore structure can effectively adsorb harmful gases and particulate matter in the thick smoke, playing a purification role.

[0033] Specific embodiment 1 of the method for using a laser device for processing a microhole array of the present invention: The present application also provides a method for using a laser device for processing a microhole array, based on the above-mentioned laser device for processing a microhole array, comprising the following steps: Step 1: Insert the laser head 403 into the mounting slot 402 and assemble the positioning structure into the notch slot 1 404 and the notch slot 2 405 on the same side to achieve horizontal and vertical positioning of the laser head 403; Step 2: Start the smoke removal mechanism 5 and generate an air pressure difference; Step 3: Start the filter mechanism 6 , and the air pressure difference causes the filter mechanism 6 to absorb impurities generated by the laser device and discharge the purified gas through the smoke removal mechanism 5 .

[0034] Specifically, the method for using the laser device for processing a microhole array includes the following steps: Step 1: Insert the laser head 403 into the mounting slot 402, and then snap the L-shaped positioning block 406 into the notch 1 404 and notch 2 405 on the same side. This will lock the bottom of the laser head 403 and limit its horizontal and vertical positioning. Step 2: Insert the pin 412 into the socket 407. The assembly block 411 is then snapped into the assembly hole 408, and the bead 413 is snapped into the recess inside the socket 407. This completes the convenient installation of the laser head 403. Step 3: When the laser head 403 is working, thick smoke is generated. At this time, the motor 502 is started to drive the active bevel gear 507 to rotate, which in turn drives the driven bevel gear 504 to rotate the turntable 505. Then, the lever 506 pushes the cross frame 509 to move back and forth, which makes the two pistons 511 move back and forth. Under the action of the air pressure difference, the thick smoke is sucked into the purification box 601 through the adsorption net 602. The adsorption net 602 acts as an activated carbon net to absorb the thick smoke. Step 4: The gas preliminarily purified by the adsorption net 602 enters the gas cylinder 510 through the air inlet pipe 513 and is discharged from the exhaust port 512.

[0035] Here, those skilled in the art will understand that the specific operation of the method for using the laser device for processing the microhole array has been described in the above reference. Figures 1 to 9 The laser device for processing a microhole array has been described in detail in the description of the laser device for processing a microhole array, so its repeated description will be omitted.

[0036] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. The scope of patent protection of the present invention shall be based on the claims. Any equivalent structural changes made using the contents of the description and drawings of the present invention shall be included in the scope of protection of the present invention.

Claims

1. A laser device for processing microhole arrays, characterized in that: include: An L-shaped processing table (1) is provided with an assembly mechanism (4) installed on the inner side of the vertical surface of the L-shaped processing table (1), the assembly mechanism (4) comprising a mounting structure and a laser head (403), the mounting structure being connected by sliding up and down along the height direction of the vertical surface, and a mounting groove (402) being provided at the lower end thereof, the laser head (403) being positioned and assembled in the mounting groove (402) to achieve horizontal positioning of the laser head (403); at least two sides of the mounting structure are provided with a notch groove 1 (404), and at least two sides of the laser head (403) are provided with a notch groove 2 (405). The notch groove 1 (404) and the notch groove 2 (405) are arranged on the same side in the same number, and the notch groove 1 (404) and the notch groove 2 (405) on the same side are simultaneously equipped with a positioning structure to achieve the upper and lower positioning of the laser head (403); the upper end and the lower end of the horizontal surface of the L-shaped processing table (1) are respectively installed with a filter mechanism (6) and a smoke removal mechanism (5), and the filter mechanism (6) and the smoke removal mechanism (5) are connected, and the smoke removal mechanism (5) is used to generate an air pressure difference, so that the filter mechanism (6) absorbs impurities generated by the laser device and discharges the purified gas through the smoke removal mechanism (5).

2. The laser device for processing microhole arrays according to claim 1, characterized in that: The positioning structure comprises an L-shaped positioning block (406) and a fastening structure, wherein the horizontal side of the L-shaped positioning block (406) is a stepped structure, the vertical side of the L-shaped positioning block (406) is positioned and assembled in the notch groove 1 (404), and the lower end side of the stepped structure is positioned and assembled in the notch groove 2 (405), so that the L-shaped positioning block (406) is assembled with the notch groove 1 (404) and the notch groove 2 (405) at the same time to realize the upper and lower positioning of the laser head (403); the fastening structure is used to fix the L-shaped positioning block (406) on the mounting structure.

3. The laser device for processing microhole arrays according to claim 2, characterized in that: The fastening structure includes a baffle (409), two latches (412) are installed at both ends of one side of the baffle (409), an assembly block (411) is installed in the middle, and a handle (410) is installed on the other side of the baffle (409); two sockets (407) are provided on the side where the notch groove 1 (404) is located on the mounting structure, close to both sides of the notch groove 1 (404), and an assembly hole (408) is provided on the vertical side of the L-shaped positioning block (406), the two latches (412) are assembled in the two sockets (407), and the assembly block (411) is assembled in the assembly hole (408), so as to achieve the fixation of the L-shaped positioning block (406).

4. The laser device for processing microhole arrays according to claim 1, characterized in that: The smoke removal mechanism (5) comprises a driving mechanism, a transmission mechanism and an air pressure regulating mechanism. The transmission mechanism comprises an active bevel gear (507), a driven bevel gear (504) and a rotating rod (503). The driven bevel gear (504) is fixedly mounted on the rotating rod (503), and the air pressure regulating mechanism is connected to one end of the rotating rod (503). The active bevel gear (507) is in transmission connection with the driving mechanism, and the active bevel gear (507) and the driven bevel gear (504) are meshed for transmission. The driving mechanism drives the active bevel gear (507) to transmit, and drives the driven bevel gear (504) to rotate, thereby driving the rotating rod (503) to rotate. The rotating rod (503) rotates to achieve air pressure regulation by the air pressure regulating mechanism.

5. The laser device for processing microhole arrays according to claim 4, characterized in that: The air pressure regulating mechanism comprises a telescopic structure and air cylinders (510) arranged at both ends of the telescopic structure, a piston (511) being arranged inside the air cylinder (510), an exhaust port (512) being provided at the bottom of the air cylinder (510), an air inlet pipe (513) being connected to one end of the air cylinder (510) away from the telescopic structure, and one-way valves being arranged inside both the exhaust port (512) and the air inlet pipe (513); the telescopic structure is connected to one end of a rotating rod (503), and both ends of the telescopic structure are connected to the piston (511), and under the rotation of the rotating rod (503), the piston (511) is controlled to reciprocate along the length direction of the air cylinder (510) to generate an air pressure difference.

6. The laser device for processing a microhole array according to claim 5, characterized in that: The telescopic structure comprises a cross frame (509), a rotating disk (505), and a shifting rod (506) arranged on the rotating disk (505); the rotating disk (505) is mounted on one end of the rotating rod (503); the cross frame (509) is mounted above the rotating disk (505); and the shifting rod (506) is rotatably assembled in the vertical frame of the cross frame (509); both ends of the horizontal frame of the cross frame (509) are connected to the pistons (511) in the two air cylinders (510); the rotating disk (505) and the shifting rod (506) rotate under the rotation of the rotating rod (503), so that the cross frame (509) drives the piston (511) to reciprocate along the length direction of the air cylinder (510).

7. The laser device for processing a microhole array according to claim 6, characterized in that: The air pressure regulating mechanism further comprises two sleeve rods (508), the horizontal frame of the cross frame (509) being slidably mounted in the two sleeve rods (508), and the distance between the two sleeve rods (508) is greater than the horizontal diameter of the turntable (505), so that the two sleeve rods (508) are mounted on both sides of the turntable (505) along the horizontal direction.

8. The laser device for processing a microhole array according to claim 5, characterized in that: The filtering mechanism (6) comprises a purification box (601) and an adsorption net (606), wherein the adsorption net (606) is mounted on one side of the purification box (601), and a plurality of air holes (603) are provided on both sides of the purification box (601) adjacent to the adsorption net (606), wherein the plurality of air holes (603) are in communication with the air inlet pipe (513).

9. The laser device for processing a microhole array according to claim 8, characterized in that: A detachable side panel (605) is installed on the side of the purification box (601) opposite to the adsorption net (606), and a T-shaped block (606) is fixedly connected to the top of the side panel (605). A socket (607) is provided on the top of the purification box (601), and one side of the T-shaped block (606) is engaged with the inside of the socket (607).

10. A method for using a laser device for processing a microhole array, characterized in that: The laser device for processing a microhole array according to any one of claims 1 to 9 comprises the following steps: Step 1: Insert the laser head (403) into the mounting groove (402), and assemble the positioning structure into the notch groove 1 (404) and the notch groove 2 (405) on the same side to achieve horizontal positioning and vertical positioning of the laser head (403); Step 2: Start the smoke removal mechanism (5) and generate an air pressure difference; Step 3: Start the filter mechanism (6), and the pressure difference causes the filter mechanism (6) to absorb impurities generated by the laser device and discharge the purified gas through the smoke removal mechanism (5).

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