Method for manufacturing liquid ejecting head

Abstract

The present disclosure provides a method of manufacturing a liquid ejecting head capable of easily aligning a plurality of head modules with each other. In a method of manufacturing a liquid ejecting head, the liquid ejecting head includes a plurality of head modules each including a chip including at least a nozzle plate in which a plurality of nozzles are formed, and a flow path opening forming member, and a holder that holds the plurality of head modules. The method of manufacturing the liquid ejecting head includes: a first positioning step of optically positioning the nozzle plate and the flow path opening forming member with respect to the nozzle; and a second positioning step of positioning the head module and the holder by pressing one of the first positioning portion of the flow path opening forming member and the second positioning portion of the holder into the other.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing a liquid ejecting head. Background Art

[0002] Conventionally, there has been proposed a liquid ejecting apparatus including a liquid ejecting head for ejecting liquid such as ink onto a medium such as printing paper.

[0003] The liquid ejecting head described in Patent Document 1 comprises a plurality of head chips (head modules), a fixing plate, and a bracket. The plurality of head chips are housed within a space enclosed by the fixing plate and the bracket. The plurality of head chips are aligned with the fixing plate and fixed to the cover fixing plate with adhesive. Furthermore, the fixing plate is fixed to the bracket with adhesive.

[0004] When some of the head modules among a plurality of head modules fail, there is a demand to repair the liquid ejecting head by removing only the failed head module and replacing it with a new head module.

[0005] However, in existing literature, when a portion of the head modules is to be removed from the bracket, the fixing plate needs to be removed from the bracket. Therefore, there is a possibility that the alignment of the multiple head modules relative to the fixing plate may deviate. Therefore, when performing an operation of replacing a portion of the multiple head modules of a liquid ejecting head to repair and replace the liquid ejecting head, it is desired to be able to easily align the multiple head modules with each other. Furthermore, it is not limited to the operation of replacing the liquid ejecting head, but it is desired to perform high-precision alignment of the modules with each other for multiple heads during the manufacture of the liquid ejecting head.

[0006] Patent Document 1: Japanese Patent Application Laid-Open No. 2022-42753 Summary of the Invention

[0007] In a method for manufacturing a liquid jet head according to one embodiment of the present invention, the liquid jet head comprises a plurality of head modules and a bracket, the plurality of head modules respectively having a chip including at least a nozzle plate having a plurality of nozzles formed thereon, and a flow channel opening forming component, the bracket holding the plurality of head modules, and the method for manufacturing the liquid jet head comprises: a first positioning step of optically positioning the nozzle plate and the flow channel opening forming component with the nozzle as a reference; and a second positioning step of positioning the head module and the bracket by pressing one of the first positioning portion of the flow channel opening forming component and the second positioning portion of the bracket into the other.

[0008] In a method for manufacturing a liquid jet head according to one embodiment of the present invention, a part of the first head module of a first liquid jet head having a plurality of first head modules and a first bracket for holding the plurality of first head modules is used to manufacture a second liquid jet head having a second bracket, and the method includes: a press-in release process of releasing a press-in state in which a first positioning portion of the first head module and a second positioning portion of the first bracket are pressed into the other; and a decomposition process of decomposing the first head module after the press-in state with the first bracket is released in the press-in release process into a first chip and a flow path opening forming component, wherein the first chip includes at least a first nozzle plate having a plurality of nozzles formed thereon, and a flow path opening forming component. The opening forming component is provided with the first positioning portion; a first positioning process is to optically position the second nozzle plate and the flow opening forming component based on the nozzle of the second nozzle plate for the flow opening forming component separated from the first chip in the decomposition process and the second chip including at least a second nozzle plate different from the first nozzle plate; a second positioning process is to position the second head module and the second bracket by pressing one of the first positioning portion of the flow opening forming component and the second positioning portion of the second bracket of the second head module having the second chip and the flow opening forming component positioned by the first positioning process into the other. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 It is a schematic diagram showing a configuration example of the liquid ejecting apparatus according to the first embodiment.

[0010] Figure 2 To express Figure 1 A plan view of the liquid ejecting unit is shown.

[0011] Figure 3 for Figure 2 The liquid ejecting head shown is a cross-sectional view viewed in the direction along the X-axis.

[0012] Figure 4 For Figure 2 The liquid ejecting head shown is a cross-sectional view viewed in the direction along the Y axis.

[0013] Figure 5 for Figure 3 A bottom view of the liquid ejecting head is shown.

[0014] Figure 6 for Figure 3 A cross-sectional view of a chip included in the head module is shown.

[0015] Figure 7 for Figure 4A top view of a flow channel opening forming member included in the head module is shown.

[0016] Figure 8 for Figure 4 An enlarged view of the flow channel opening forming component is shown.

[0017] Figure 9 To express Figure 4 Bottom view of the bracket and relay substrate shown.

[0018] Figure 10 for Figure 4 Top view of the bracket shown.

[0019] Figure 11 for Figure 4 A plan view of the lower portion of the bracket is shown.

[0020] Figure 12 for Figure 4 A top view of the sealing component is shown.

[0021] Figure 13 for Figure 4 Top view of the hood shown.

[0022] Figure 14 This is a flowchart showing a part of the method for manufacturing the liquid jet head according to the first embodiment.

[0023] Figure 15 For use in Figure 14 FIG. 1 is a diagram for explaining the first positioning step.

[0024] Figure 16 For use in Figure 14 FIG. 1 is a diagram for explaining the first positioning step.

[0025] Figure 17 For use in Figure 14 FIG. 1 is a diagram for explaining the first positioning step.

[0026] Figure 18 For use in Figure 14 FIG. 2 is a diagram for explaining the second positioning step.

[0027] Figure 19 This is a flowchart showing a part of the method for manufacturing the liquid jet head in the second embodiment.

[0028] Figure 20 For use in Figure 19 The figure shows the press-fitting release process.

[0029] Figure 21 For use in Figure 19 The diagram shows the decomposition process.

[0030] Figure 22 For use in Figure 19 FIG. 1 is a diagram for explaining the first positioning step.

[0031] Figure 23 For use in Figure 19 FIG. 2 is a diagram for explaining the second positioning step.

[0032] Figure 24 A cross-sectional view of a portion of a liquid ejecting head according to a first modified example. DETAILED DESCRIPTION

[0033] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In addition, in the accompanying drawings, the dimensions or scales of each part may be appropriately different from the actual situation, and there are also parts that are schematically shown for ease of understanding. In addition, in the following description, as long as there is no record indicating a particular limitation on the present invention, the scope of the present invention is not limited to these embodiments. In addition, "element β on element γ" is not limited to a structure in which element γ and element β are in direct contact, but also includes a structure in which element γ and element β are not in direct contact. "Element γ is equal to element β" only requires that element γ and element β are substantially equal, and may include measurement errors and manufacturing errors, etc. "Element γ is the same as element β" only requires that element γ and element β are substantially the same, and may include measurement errors and manufacturing errors, etc.

[0034] 1. First Implementation

[0035] 1-1. Overall Structure of Liquid Ejecting Device 100

[0036] Figure 1 This is a schematic diagram illustrating the structure of the liquid injection device 100 involved in the first embodiment. In the following, for the convenience of explanation, the X-axis, Y-axis and Z-axis that are orthogonal to each other are appropriately used for explanation. In addition, a direction along the X-axis is marked as the X1 direction, and the direction opposite to the X1 direction is marked as the X2 direction. Similarly, a direction along the Y-axis is marked as the Y1 direction, and the direction opposite to the Y1 direction is marked as the Y2 direction. A direction along the Z-axis is marked as the Z1 direction, and the direction opposite to the Z1 direction is marked as the Z2 direction. In addition, the Z1 direction is equivalent to the "first direction". The Z2 direction is equivalent to the "second direction that is the opposite direction to the first direction". In addition, the Z1 direction relative to a certain location is set as "below", and the Z2 direction from a certain location is set as "above". In addition, observation in the Z1 direction or the Z2 direction is set as "planar observation".

[0037] like Figure 1As shown, the liquid ejecting apparatus 100 includes a liquid storage portion 9 , a control unit 91 , a transport portion 92 , a head unit 10 , and a moving mechanism 40 .

[0038] The liquid reservoir 9 is a container for storing ink. Specific examples of the liquid reservoir 9 include an ink cartridge that is detachable from the liquid ejecting apparatus 100, a bag-shaped ink pack formed of a flexible film, and an ink tank capable of refilling ink. The type of ink stored in the liquid reservoir 9 is not particularly limited and may be any type.

[0039] The control unit 91 controls the operation of each component of the liquid ejecting device 100. The control unit 91 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array) and a storage circuit such as a semiconductor memory, to control the operation of each component of the liquid ejecting device 100.

[0040] The transport unit 92 transports the medium 90 in the direction DM based on the control performed by the control unit 91. The direction DM in this embodiment is the Y1 direction. Figure 1 In the example shown, the conveying unit 92 includes a conveying roller that is elongated along the X-axis and a motor that rotates the conveying roller. The conveying unit 92 is not limited to a structure using a conveying roller; for example, a structure using a roller or an endless belt that conveys the medium 90 while the medium 90 is attracted to the outer peripheral surface by static electricity or the like may also be used.

[0041] The moving mechanism 40 includes a conveyor belt that secures the unit base 11 of the head unit 10, and reciprocates the head unit 10 in the X1 and X2 directions based on control by the control unit 91. Based on control by the control unit 91, the head unit 10 ejects ink supplied from the liquid reservoir 9 from a plurality of nozzles N toward the medium 90 in the Z1 direction. By ejecting ink from the head unit 10 in parallel with the movement of the head unit 10 by the moving mechanism 40, an image formed by the ink is formed on the surface of the medium 90.

[0042] The number and arrangement of the plurality of liquid ejecting heads 1 included in the head unit 10 are not limited to Figure 1 Furthermore, when the head unit 10 is configured to circulate ink, the head unit 10 may be connected to the liquid storage portion 9 via a circulation mechanism for circulating ink within the head unit 10 .

[0043] 1-2. Head unit 10

[0044] Figure 2 To express Figure 1 The plan view of the head unit 10 is shown. Figure 2 As shown, the head unit 10 includes a unit base 11 and a plurality of liquid ejecting heads 1. The plurality of liquid ejecting heads 1 are fixed to the unit base 11. The unit base 11 is a component that holds the plurality of liquid ejecting heads 1. In the example shown in the figure, the number of liquid ejecting heads 1 relative to the unit base 11 is not particularly limited, and any number of liquid ejecting heads 1 may be used as long as there is at least one.

[0045] The unit base 11 is, for example, a plate-shaped component having a thickness direction along the Z axis. A recess 111 is provided on the unit base 11. The recess 111 is a depression provided on the unit base 11. A plurality of through holes 11H are provided on the bottom surface of the recess 111. The planar shape of each through hole 11H is, for example, a quadrangular shape. The through hole 11H is provided for each liquid ejecting head 1. A portion of the liquid ejecting head 1 is inserted into each through hole 11H. In addition, Figure 2 In order to show the through-hole 11H, illustration of a plurality of liquid ejecting heads 1 arranged in a part of the unit base 11 is omitted.

[0046] Furthermore, the unit base 11 is provided with four mounting holes 101 and two third positioning portions 102 for each through hole 11H. The four mounting holes 101 and the two third positioning portions 102 are provided outside the through hole 11H when viewed from above. The number and arrangement of the mounting holes 101 and the third positioning portions 102 are not limited to Figure 2 illustrative examples, but any number and configuration.

[0047] The mounting holes 101 are provided near four corners of the through hole 11H in plan view, for example. The mounting holes 101 are used to mount the liquid jet head 1 on the unit base 11. The mounting holes 101 penetrate the unit base 11 in the thickness direction, for example.

[0048] Each third positioning portion 102 is, for example, provided between two mounting holes 101 aligned along the X-axis to isolate them. Each third positioning portion 102 is used to position the unit base 11 during installation of the liquid jet head 1. Each third positioning portion 102 is, for example, a bottomed hole opening on the Z1-direction surface of the unit base 11. Each third positioning portion 102 can also be described as a recessed portion formed on the Z1-direction surface of the unit base 11.

[0049] Furthermore, the mounting holes 101 may not penetrate the unit base 11 in the thickness direction. Similarly, the third positioning portions 102 may penetrate the unit base 11 in the thickness direction. Furthermore, the shape of the unit base 11 is not limited to a plate shape, and may be a box shape, for example.

[0050] 1-3. Liquid ejecting head 1

[0051] Figure 3 for Figure 2 The illustrated liquid ejecting head 1 is a cross-sectional view viewed in the direction along the X-axis. Figure 4 For Figure 2 The liquid ejecting head 1 shown in FIG. 1 is a cross-sectional view observed along the Y-axis. Figure 4 As shown, in this embodiment, the liquid jet head 1 has a substantially symmetrical structure with respect to the central imaginary plane A10 along the XZ plane. However, the liquid jet head 1 may not have a symmetrical structure with respect to the central imaginary plane A10.

[0052] like Figure 3 as well as Figure 4 As shown in either of the figures, the liquid ejecting head 1 includes a plurality of head modules 2 , a sealing member 4 , a plurality of covers 5 , a holder 6 , a plurality of wiring substrates 7 , and a relay substrate 70 .

[0053] In the liquid ejecting head 1 , the cap 5 , the holder 6 , and the plurality of head modules 2 are detachable from each other. After the cap 5 is removed from the holder 6 , each head module 2 can be individually removed from the holder 6 .

[0054] Therefore, for example, when some of the multiple head modules 2 included in the head unit 10 are damaged, the liquid ejecting head 1 can be regenerated by replacing the subunit 15 including the damaged head module 2 with another subunit 15 including a healthy head module 2.

[0055] In addition, the cover 5 and the plurality of head modules 2 are preferably fixed with an adhesive, but each head module 2 may be configured so that the adhesive can be decomposed and removed from the cover 5 .

[0056] 1-3A. Head module 2

[0057] exist Figure 3 In the example of FIG, the plurality of head modules 2 are six head modules 2. In addition, the number of the head modules 2 is not limited to six, and may be one or more and five or less, or seven or more.

[0058] In this embodiment, a plurality of head modules 2 are arranged along the X axis. Figure 4As shown, each head module 2 is long and narrow along the Y axis. Each head module 2 ejects ink in the Z1 direction. The head module 2 includes a chip 20 and a flow channel opening forming member 25. The chip 20 is arranged in the Z1 direction relative to the flow channel opening forming member 25.

[0059] Figure 5 for Figure 3 The bottom view of the liquid ejecting head 1 is shown. Figure 5 As shown, each head module 2 has a plurality of nozzles N for ejecting ink. The plurality of nozzles N are arranged along the Y-axis. The plurality of nozzles N are divided into a nozzle column La and a nozzle column Lb arranged at intervals along the X-axis. The nozzle column La and the nozzle column Lb are respectively a collection of a plurality of nozzles N arranged in a straight line along the Y-axis. In addition, the surface of the head module 2 on which the openings of the plurality of nozzles N are formed is referred to as a nozzle surface SN. The nozzle surface SN is the surface of the chip 20 of the head module 2 facing the Z1 direction. In addition, for example, the plurality of nozzles N may also be arranged in a direction intersecting the X-axis and the Y-axis when viewed along the Z1 direction.

[0060] 1-3Aa. Chip 20

[0061] Figure 6 for Figure 3 The figure shows a cross-sectional view of the chip 20 included in the head module 2. The chip 20 has a structure in which the elements associated with each nozzle N in nozzle row La and the elements associated with each nozzle N in nozzle row Lb are arranged in a roughly plane-symmetrical manner. The following description focuses on the elements corresponding to nozzle row La, while the description of the elements corresponding to nozzle row Lb is omitted as appropriate. In the following text, when nozzle row La and nozzle row Lb are not distinguished, they are referred to as nozzle row L.

[0062] like Figure 6 As shown, the chip 20 included in each head module 2 includes, for example, a communication plate 202 , a pressure chamber substrate 203 , a vibration plate 204 , a nozzle plate 201 , a cover 206 , a plurality of driving elements E, and a sealing substrate 205 .

[0063] The connecting plate 202, pressure chamber substrate 203, vibration plate 204, nozzle plate 201, and cover 206 are each a narrow, long plate-shaped member extending along the Y axis. The pressure chamber substrate 203 is provided on the surface of the connecting plate 202 in the Z2 direction. The nozzle plate 201 and cover 206 are provided on the surface of the connecting plate 202 in the Z1 direction. These components are fixed to each other using, for example, an adhesive.

[0064] The nozzle plate 201 is a plate-shaped component with multiple nozzles N formed thereon. The nozzle plate 201 is the component of the head module 2 located closest to the Z1 direction. The surface of the nozzle plate 201 facing the Z1 direction is the nozzle surface SN. Each of the multiple nozzles N is a circular through-hole that ejects ink. The nozzle plate 201 is manufactured by processing a single crystal silicon (Si) substrate using semiconductor manufacturing techniques such as photolithography and etching.

[0065] A plurality of choke portions R1, a plurality of connecting flow channels R2, a connecting space Ra and a common flow channel Rb are formed on the connecting plate 202. The choke portion R1 and the connecting flow channel R2 are respectively through-holes extending in the Z1 direction and formed for each nozzle N. The connecting flow channel R2 overlaps with the nozzle N when viewed from a plane. The connecting space Ra is an opening formed as a long strip along the Y axis. The connecting space Ra extends along the Y axis. The common flow channel Rb is connected to the connecting space Ra and overlaps with the connecting space Ra when viewed from a plane. The common flow channel Rb extends along the Y axis. The common flow channel Rb is connected to the plurality of choke portions R1. In addition, the connecting space Ra is connected to the space Rc of the flow channel opening forming component 25.

[0066] The communicating space Ra, the common flow path Rb, and the space Rc form a common space R shared by the multiple nozzles N. The common space R functions as an ink reservoir. Ink stored in the common space R branches into each choke portion R1 and is supplied and filled in parallel to the multiple pressure chambers C.

[0067] Multiple pressure chambers C are formed on the pressure chamber substrate 203. The pressure chamber C is a space located between the connecting plate 202 and the vibration plate 204 and formed by the wall surface of the pressure chamber substrate 203. A pressure chamber C is formed for each nozzle N. The pressure chamber C is a long, strip-shaped space extending in the X1 direction. The multiple pressure chambers C are arranged along the Y axis.

[0068] The communication plate 202 and the pressure chamber substrate 203 are manufactured by processing a semiconductor substrate such as a silicon single crystal substrate, for example.

[0069] At the upper part of the pressure chamber C, there is provided a vibration plate 204 that can deform elastically. The vibration plate 204 is stacked on the upper pressure chamber substrate 203 and is in contact with the surface of the pressure chamber substrate 203 opposite to the connecting plate 202. The vibration plate 204 is a plate-like component in a narrow rectangular shape along the Y-axis when viewed in a plane. The pressure chamber C is connected to the connecting flow channel R2 and the choke portion R1. Therefore, the pressure chamber C is connected to the nozzle N via the connecting flow channel R2, and is connected to the connecting space Ra via the choke portion R1. In addition, a separate flow channel for each nozzle N is formed by the nozzle N, the connecting flow channel R2, the pressure chamber C, and the choke portion R1. In addition, although in Figure 6 Although the pressure chamber substrate 203 and the vibration plate 204 are illustrated as separate substrates for convenience of explanation, they are actually stacked on one silicon substrate.

[0070] A driving element E is formed on the surface of the vibration plate 204 opposite the pressure chambers C, corresponding to each pressure chamber C. The driving element E is a piezoelectric element that is elongated and extends along the X-axis when viewed in plan. The driving element E comprises, for example, a pair of electrodes and a piezoelectric body sandwiched between the electrodes. Alternatively, the driving element E may be a thermoelectric conversion element that generates thermal energy.

[0071] The sealing substrate 205 is a structure that protects the multiple driving elements E. The sealing substrate 205 is fixed to the surface of the vibration plate 204 using, for example, an adhesive. The multiple driving elements E are housed within a recessed portion formed on the surface of the sealing substrate 205 that faces the vibration plate 204. Furthermore, the sealing substrate 205 is provided with wiring holes 20H for inserting the wiring substrate 7, described later.

[0072] The cover 206 is a relatively thin metal plate that forms the wall surface of the common flow channel Rb. The cover 206 has a thickness approximately equal to that of the nozzle plate 201. The planar shape of the cover 206 is, for example, a frame that surrounds the nozzle plate 201. A mold 207 made of resin is provided between the cover 206 and the nozzle plate 201. The surface of the cover 206 facing the Z1 direction constitutes a portion of the nozzle surface SN.

[0073] In the chip 20, when the driving element E contracts due to energization, the vibration plate 204 is bent and flexed in the direction of reducing the volume of the pressure chamber C, causing the pressure in the pressure chamber C to rise, so that the ink droplets are ejected from the nozzle N. At this time, the pressure also propagates from the pressure chamber C toward the choke portion R1, so that the ink also flows through the choke portion R1 to the common flow channel Rb. After the ink is ejected, the driving element E returns to its original position. At this time, the ink in the common flow channel Rb also vibrates from the nozzle N. Moreover, when the curved liquid surface of the nozzle N is restored, the ink is simultaneously supplied from the choke portion R1. Through the above series of actions, the ink is ejected from the nozzle N.

[0074] Although the chip 20 has Figure 6 However, the components of the chip 20 may not include all the components described above, and may further include additional components.

[0075] The chip 20 is, for example, a monolithic circuit structure and is a thinner component than the flow channel opening forming component 25, for example, a component having a thickness of less than 3000 μm. Alternatively, the chip 20 may be a component having a thickness of less than 1500 μm or less than 1000 μm. Furthermore, the chip 20 may have a thickness of less than 1 / 5 of the length of the short side when viewed along the thickness direction of the chip 20. Furthermore, the chip 20 only needs to include at least the nozzle plate 201, more preferably also includes the pressure chamber substrate 203, and particularly preferably also includes the connecting plate 202. Furthermore, at least one of the nozzle plate 201, the pressure chamber substrate 203, the connecting plate 202, or the drive element E, or the sealing substrate 205 may be considered as the chip 20. Furthermore, the chip 20 may be not only a stack of silicon substrates manufactured using a micro-electro-mechanical system (MEMS), but may also be a stack of thin plates such as ceramic sheets or metals, or a stack of thin plate-like components of the materials described above.

[0076] 1-3Ab. Flow channel opening forming member 25

[0077] like Figure 4 as well as Figure 6 As shown, a flow channel opening forming member 25 is arranged in the Z2 direction of the chip 20. The flow channel opening forming member 25 and the chip 20 are fixed to each other by, for example, an adhesive, etc. The flow channel opening forming member 25 has a flow channel for supplying ink to the chip 20, for example.

[0078] The flow path opening forming member 25 is preferably a member having a thickness of 3000 μm or more, more preferably 5000 μm or more, and even more preferably 8000 μm or more. The flow path opening forming member 25 may be formed of a single member or a laminate of multiple members.

[0079] In addition, although the flow channel opening forming part 25 is made of metal, it can also contain resin. By making the flow channel opening forming part 25 from a resin such as a thermosetting resin, low cost can be achieved. However, by making the flow channel opening forming part 25 from metal, it is easy to reuse the flow channel opening forming part 25 when the head module 2 is replaced. Therefore, compared with the case where it is made of resin, it is easy to reuse the flow channel opening forming part 25. In addition, compared with the case where the flow channel opening forming part 25 is a resin, by making it metal, it is possible to achieve high-precision positioning of the flow channel opening forming part 25 relative to the bracket 6.

[0080] like Figure 4As shown, the length of the flow channel opening forming member 25 along the Z axis, that is, its thickness, is greater than the thickness D2 of the chip 20. The thickness of the flow channel opening forming member 25 here refers to the thickness at the position overlapping with the sealing area 4S described later when viewed along the Z1 direction. In other words, the chip 20 is thinner than the flow channel opening forming member 25. Furthermore, the flow channel opening forming member 25 includes a surface 251 facing the Z1 direction and a surface 252 facing the Z2 direction.

[0081] Figure 7 for Figure 4 The top view of the flow channel opening forming part 25 of the head module 2 shown in FIG. Figure 7 As shown, the planar shape of the flow channel opening forming member 25 is larger than the planar shape of the chip 20. That is, when viewed along the Z1 direction, the chip 20 has a smaller outer shape than the flow channel opening forming member 25. The flow channel opening forming member 25 is arranged so as to overlap with the chip 20 and cover the chip 20 when viewed along the Z1 direction.

[0082] like Figure 4 as well as Figure 7 As shown, the flow channel opening forming member 25 has a flange portion 250 for fixing to the cover 5 described later. The planar shape of the flange portion 250 is a quadrangular frame surrounding the opening 5H of the cover 5 described later. Figure 4 As shown, the surface of the flange 250 facing the Z1 direction serves as a supported surface 2511, supported by the cover 5 (described later). Since the flange 250 has a planar shape that is a quadrangular frame surrounding the opening 5H, the supported surface 2511 also has a planar shape that is a quadrangular frame surrounding the opening 5H. The supported surface 2511 is located closer to the chip 20 in the Z2 direction. Therefore, the supported surface 2511 is located in the Z2 direction relative to the nozzle plate 201.

[0083] In addition, if Figure 7 As shown in FIG, a wiring hole 25H is provided on the flow channel opening forming member 25. A wiring substrate 7 described later is inserted into the wiring hole 25H. The wiring hole 25H is provided at the center of the flow channel opening forming member 25 when viewed from above. Figure 6 The wiring holes 25H overlap with the wiring holes 20H of the closing substrate 205 when viewed in plan.

[0084] like Figure 4 as well as Figure 6 As shown in FIG. 2 , a flow channel 25R is formed inside the flow channel opening forming member 25. The flow channel 25R is provided to supply ink to the chip 20. Figure 6 As shown in FIG. 1 , a space Rc is provided on the chip 20 side, that is, on the downstream side, of the flow channel 25R. The flow channel 25R communicates with the space Rc.

[0085] like Figure 4 As shown, a plurality of flow channel openings 251H are provided on the opposite side of the chip 20, i.e., on the upstream side, of the flow channel 25R of the flow channel opening forming component 25. Each flow channel opening 251H is an opening end of the flow channel 25R in the Z2 direction. The flow channel opening 251H is an opening for connecting the flow channel 25R of the flow channel opening forming component 25 of the head module 2 and the flow channel 6R of the bracket 6 described later. Figure 4 as well as Figure 7 As shown, a plurality of flow channel openings 251H are provided on the flange portion 250 of the flow channel opening forming member 25. The flow channel openings 251H are arranged outside the chip 20 when viewed in the Z1 direction. In this embodiment, two flow channel openings 251H are provided for each nozzle row L.

[0086] like Figure 4 as well as Figure 7 As shown, two fixing holes 215 are provided on each flow channel opening forming member 25. The head module 2 including the flow channel opening forming member 25 is detachable relative to the bracket 6. Each fixing hole 215 is used to fix the head module 2 relative to the bracket 6.

[0087] Each fixing hole 215 is provided on the surface 252 of the flow channel opening forming member 25 facing the Z2 direction. Each fixing hole 215 is a bottomed hole that opens on the surface 252 of the flow channel opening forming member 25 facing the Z2 direction. Each fixing hole 215 is a recessed portion provided on the surface 252 of the flow channel opening forming member 25 facing the Z2 direction, and can also be understood as a depression formed in the surface 252. One of the two fixing holes 215 is located in the Y1 direction relative to the chip 20 when viewed along the Z1 direction, and the other is located in the Y2 direction relative to the chip 20.

[0088] Figure 8 for Figure 4 The enlarged view of the flow channel opening forming part 25 is shown. Figure 8 In the figure, bushings 522 and 526 described later are omitted.

[0089] like Figure 8 As shown, each flow channel opening forming member 25 has a first positioning portion 210H and a through hole 211H. The first positioning portion 210H and the through hole 211H form a hole that penetrates the flow channel opening forming member 25 in the thickness direction. The first positioning portion 210H and the through hole 211H are respectively used to position the head module 2 relative to the bracket 6, etc. In particular, the first positioning portion 210H is a positioning hole used to position the head module 2 relative to the bracket 6 and corresponds to the second positioning portion 654 described later.

[0090] The first positioning portion 210H and the through-hole 211H are arranged along the Z-axis and communicate with each other. The through-hole 211H is located in the Z1 direction relative to the first positioning portion 210H. The surface 251 of the flow channel opening forming member 25 facing the Z1 direction includes the through-hole 211H, specifically, the open end of the through-hole 211H. The surface 252 of the flow channel opening forming member 25 facing the Z2 direction includes the first positioning portion 210H, specifically, the open end of the first positioning portion 210H.

[0091] In this embodiment, the opening area of the through hole 211H is larger than the opening area of the first positioning portion 210H. In other words, the outer diameter of the through hole 211H is larger than the outer diameter of the first positioning portion 210H. In addition, the opening area of the through hole 211H may be smaller than the opening area of the first positioning portion 210H. In addition, the length of the through hole 211H along the Z axis, that is, the depth D21, is larger than the depth D20 of the first positioning portion 210H. In addition, the depth D21 may be smaller than the depth D20. In addition, the width and opening area of the through hole 211H are constant, but they may not be constant. Similarly, the width and opening area of the first positioning portion 210H are constant, but they may not be constant.

[0092] like Figure 7 As shown, two first positioning portions 210H are provided on each flow channel opening forming member 25. Therefore, two through holes 211H are provided on each flow channel opening forming member 25. Figure 7 As shown, one of the two first positioning portions 210H is located in the Y1 direction relative to the chip 20 when viewed along the Z1 direction, and the other is located in the Y2 direction relative to the chip 20 .

[0093] In addition, although Figure 7 In the example shown, when viewed along the Z1 direction, the shortest distance between the chip 20 and the fixing hole 215 is shorter than the shortest distance between the chip 20 and the first positioning portion 210H, but it can also be longer than the shortest distance between the chip 20 and the first positioning portion 210H. Furthermore, while the first positioning portion 210H, the fixing hole 215, and the opening 5H are arranged along the length of the cover 5, they do not need to be arranged in this order. For example, the first positioning portions 210H can be provided on both sides of the opening 5H along the X-axis.

[0094] 1-3B. Bracket 6

[0095] like Figure 3 as well as Figure 4 As shown, a common flow path is provided for holding and accommodating the plurality of head modules 2 and supplying and distributing ink to the plurality of head modules 2. The holder 6 is common to the plurality of head modules 2.

[0096] like Figure 4 As shown, the bracket 6 has a flow channel 6R. The flow channel 6R supplies ink to each head module 2 and distributes the ink to each head module 2. The flow channel 6R is a common flow channel common to multiple head modules 2 and has a common portion 6RA extending along the X-axis and a plurality of branch portions 6RB branching from the common portion 6RA and extending in the Z1 direction. Although not shown in the figure, a flow channel joint for connecting to a supply flow channel outside the liquid injection head 1 is provided on the bracket 6 in order to communicate with the liquid storage portion 9. The unillustrated flow channel joint is exposed to the outside of the liquid injection head 1, for example, via an unillustrated opening formed on the bracket 6.

[0097] Furthermore, the holder 6 may include multiple flow channels 6R communicating with multiple head modules 2. In other words, the flow channel 6R may not include the common portion 6RA communicating with multiple head modules 2, but may include multiple flow channels 6R communicating with multiple head modules 2, respectively.

[0098] A flow channel opening 650H is provided on the head module 2 side, i.e., on the downstream side, of the flow channel 6R. The flow channel opening 650H is the open end of the flow channel 6R in the Z1 direction. The flow channel opening 650H is provided to correspond to the flow channel opening 251H of the head module 2. The flow channel opening 650H is used to connect the flow channel 25R of the head module 2 and the flow channel 6R of the bracket 6.

[0099] Figure 9 To express Figure 4 The bottom view of the bracket 6 and the relay substrate 70 is shown. Figure 3 、 4 As shown in FIG9 , the bracket 6 is box-shaped and has a recessed portion 610 opening in the Z1 direction. Multiple head modules 2 are arranged within the storage space within the recessed portion 610 of the bracket 6. Furthermore, it can be understood that the bracket 6 and the cover 5 (described later) form a storage space for multiple head modules 2. The bracket 6 is made of a metal such as aluminum or stainless steel.

[0100] like Figure 4 as well as Figure 9 As shown, the recess 610 includes a first recess 611 and a second recess 612 . like Figure 4 As shown, a second recess 612 is formed on the bottom surface of the first recess 611. The first recess 611 is located closer to the Z1 direction than the center of the bracket 6 on the Z axis. The second recess 612 is located closer to the Z2 direction than the center of the bracket 6 on the Z axis. The opening area of the second recess 612 is smaller than that of the first recess 611. Therefore, the recess 610 has a stepped surface.

[0101] The relay substrate 70 is bonded, for example, by an adhesive, to the bottom surface of the recess 610, specifically the bottom surface of the second recess 612. Although not shown in detail, the bracket 6 has an opening for inserting wiring components external to the liquid ejecting head 1 for electrically connecting the relay substrate 70 and the control unit 91.

[0102] like Figure 3 As shown, the bracket 6 includes a flat plate portion 61, a side wall portion 62, and two flange portions 64. The flat plate portion 61, the side wall portion 62, and the two flange portions 64 are formed in an integral manner.

[0103] Figure 10 for Figure 3 A top view of the support 6 is shown. Figure 11 for Figure 3 The plan view of the lower part of the bracket 6 is shown. Figure 3 、 4 As shown in FIG. 10 , the flat plate portion 61 is a flat plate-shaped portion extending along the XY plane and positioned in the Z2 direction relative to the multiple head modules 2. The side wall portion 62 extends from the outer edge of the flat plate portion 61 in the Z1 direction. The side wall portion 62 has a square frame-like plan view. The stepped surface described above is provided on the inner surface of the side wall portion 62.

[0104] In addition, if Figure 4 As shown, the bracket 6 has a plurality of fixing holes 651H, a plurality of fixing holes 652H, and a plurality of second positioning portions 654. Each fixing hole 651H is used to fix the bracket 6 to the head module 2. Each fixing hole 652H is used to fix the bracket 6 to the cover 5. Each second positioning portion 654 is used to position the head module 2 relative to the bracket 6.

[0105] Each fixing hole 651H is a hole that passes through the bracket 6 in the Z1 direction. Two fixing holes 651H are provided for each head module 2. Each fixing hole 651H is provided in the Y1 direction or the Y2 direction relative to the second recess 612 when viewed along the Z1 direction. The two fixing holes 651H are provided corresponding to the two fixing holes 215 described above, and overlap with the two fixing holes 215 when viewed along the Z1 direction. Each fixing hole 651H does not overlap with the chip 20 when viewed along the Z1 direction, but overlaps with the flow channel opening forming component 25. The open end of each fixing hole 651H in the Z1 direction opens on the bottom surface of the first recess 611.

[0106] Each fixing hole 652H is a hole that passes through the bracket 6 in the Z1 direction. Figure 11As shown, the plurality of fixing holes 652H are, for example, four fixing holes 652H, each of which is provided at the four corners of the quadrangular bracket 6 when viewed along the Z1 direction. Each fixing hole 652H does not overlap with the recess 610 when viewed along the Z1 direction.

[0107] Each second positioning portion 654 is a protrusion provided on the surface 605 of the bracket 6 facing the Z1 direction, specifically, on the bottom surface of the first recess 611. More specifically, each second positioning portion 654 is a positioning pin that protrudes from the first recess 611 in the Z1 direction. In this embodiment, two second positioning portions 654 are provided for each head module 2. The two second positioning portions 654 are provided corresponding to the two first positioning portions 210H described above and overlap with the two first positioning portions 210H when viewed along the Z1 direction. Therefore, the multiple second positioning portions 654 are provided in a one-to-one correspondence with the multiple first positioning portions 210H.

[0108] When viewed along the Z1 direction, among the fixing hole 651H, the second positioning portion 654, and the fixing hole 652H, the fixing hole 651H is closest to the chip 20, and the fixing hole 652H is farthest from the chip 20. Furthermore, the distances between the fixing hole 651H, the second positioning portion 654, and the fixing hole 652H and the chip 20, when viewed along the Z1 direction, may be the same or different.

[0109] Each second positioning portion 654 is pressed into the first positioning portion 210H described above to position the cover 5 relative to the bracket 6. The first positioning portion 210H and the second positioning portion 654 facilitate positioning of the head module 2 when mounted on the bracket 6.

[0110] Furthermore, the plurality of head modules 2 can be aligned with each other with high precision by a simple method of pressing the first positioning portion 210H into the second positioning portion 654. Therefore, a desired head module 2 among the plurality of head modules 2 can be easily replaced. Therefore, replacement can be performed on a per-head module basis, thereby facilitating repair of the liquid ejecting head 1.

[0111] Furthermore, the first positioning portion 210H and the second positioning portion 654 are provided for each head module 2. By providing the first positioning portion 210H and the second positioning portion 654 for each head module 2, multiple head modules 2 can be aligned with each other with high precision. Therefore, when only a few of the multiple head modules 2 are replaced, it is not necessary to repeat the alignment of all the head modules 2.

[0112] In addition, if Figure 4As shown, a plurality of fourth positioning portions 642 are provided on the bracket 6. Figure 4 As shown, the fourth positioning portion 642 is a protrusion protruding from the Z2 direction surface of the flange portion 64 of the bracket 6 toward the Z2 direction. Figure 2 The plurality of third positioning portions 102 included in the illustrated unit base 11 are provided in a one-to-one correspondence.

[0113] The fourth positioning portion 642 is pressed against one of the third positioning portions 102 provided on the unit base 11 to position the liquid ejecting head 1 relative to the unit base 11. Therefore, the alignment accuracy of the plurality of liquid ejecting heads 1 relative to the unit base 11 can be improved.

[0114] In addition, if Figure 10 As shown, the flange portion 64 is provided with mounting holes 64H. The mounting holes 64H correspond to the mounting holes 101 of the unit base 11. For example, screws (not shown) are inserted through the mounting holes 64H and the mounting holes 101 in that order to secure the flange portion 64 and the unit base 11. As a result, the liquid ejecting head 1 is secured to the unit base 11.

[0115] 1-3C. Sealing component 4

[0116] like Figure 3 as well as Figure 4 As shown, the sealing member 4 is provided between each head module 2 and the bracket 6 in the Z1 direction. The sealing member 4 is provided for each head module 2. The sealing member 4 has elasticity. The sealing member 4 is made of an elastic material such as an elastomer. In this embodiment, the length of the sealing member 4 along the Z axis, that is, the thickness, is constant. The thickness of the sealing member 4 is thinner than the thickness of the flow channel opening forming member 25 and the bracket 6. The sealing member 4 is flattened by the head module 2 and the bracket 6.

[0117] Figure 12 for Figure 4 The top view of the sealing member 4 is shown. Figure 12 In the example shown, two sealing components 4 are provided for each head module 2. The two sealing components 4 are provided at both ends in the longitudinal direction of one head module 2. Each sealing component 4 is quadrangular when viewed along the Z1 direction. Each sealing component 4 overlaps with the flange portion 250 of the flow channel opening forming component 25 of the head module 2 when viewed along the Z1 direction. On the other hand, in this embodiment, the sealing component 4 is provided at a position different from the chip 20 when viewed along the Z1 direction. That is, the sealing component 4 does not overlap with the chip 20 when viewed along the Z1 direction.

[0118] like Figure 4 as well as Figure 12 As shown, each sealing member 4 has two communication ports 4H. Figure 4 As shown, each communication port 4H is provided corresponding to one flow channel opening 251H of the flow channel opening forming member 25 and one flow channel opening 650H of the bracket 6. Figure 12 As shown, the communication port 4H overlaps with the flow channel opening 650H and the flow channel opening 251H when viewed along the Z1 direction. Figure 4 As shown, the communication port 4H is connected to the flow channel 25R via the flow channel opening 251H. The communication port 4H is connected to the flow channel 6R via the flow channel opening 650H. Therefore, the flow channels 25R and 6R are connected via the communication port 4H. Specifically, the sealing member 4 is compressed between the flow channel opening forming member 25 and the bracket 6, thereby connecting the flow channels 25R and 6R via the communication port 4H.

[0119] The sealing member 4 is a member that fluid-tightly connects the flow channel opening 251H of the head module 2 and the flow channel opening 650H of the holder 6. Ink flowing through the flow channel 6R of the holder 6 flows through the communication port 4H to the flow channel 25R of the flow channel opening forming member 25, and is then supplied to the individual flow channels of the chip 20 through the common space R.

[0120] like Figure 12 As shown, the sealing component 4 has a sealing area 4S. In the present embodiment, the entire area of the sealing component 4 corresponds to the sealing area 4S. The sealing area 4S is in contact with both the flow channel opening forming component 25 and the bracket 6, and is an area of the sealing component 4 that is clamped by the flow channel opening forming component 25 and the bracket 6. The sealing area 4S is an area that receives load from the flow channel opening forming component 25 and the bracket 6 and is squeezed in order to connect the flow channel opening 251H and the flow channel opening 650H to each other in a liquid-tight manner. In other words, even if it is an area of the sealing component 4 that is clamped between the flow channel opening forming component 25 and the bracket 6, the part that does not receive load from the two components and is squeezed and thus does not substantially contribute to connecting the flow channel opening 251H and the flow channel opening 650H to each other in a liquid-tight manner is not included in the sealing area 4S.

[0121] like Figure 12As shown, since the sealing member 4 is positioned at a different position from the chip 20 when viewed along the Z1 direction, the sealing region 4S is also positioned at a different position from the chip 20 when viewed along the Z1 direction. That is, the sealing region 4S does not overlap with the chip 20 when viewed along the Z1 direction. By preventing the sealing region 4S from overlapping with the chip 20 when viewed along the Z1 direction, the reaction force of the sealing member 4 is less likely to act on the chip 20 than when the sealing region 4S overlaps with the chip 20. Consequently, the reliability of the head module 2 can be improved.

[0122] Furthermore, the seal region 4S is positioned in the Y1 or Y2 direction, which is the longitudinal direction of the head module 2, relative to the chip 20 when viewed along the Z1 direction. By positioning the seal region 4S in this longitudinal direction of the chip 20, it is possible to avoid positioning the seal region 4S between adjacent chips 20. This prevents the seal region 4S from increasing the distance between adjacent chips 20, thus minimizing the impact on printing quality.

[0123] Furthermore, the sealing region 4S may be provided in the direction in which the plurality of head modules 2 are arranged, i.e., in the short side direction of the head module 2, relative to the chip 20. The sealing member 4 may also be provided in the direction in which the plurality of head modules 2 are arranged, i.e., in the short side direction of the head module 2, relative to the chip 20.

[0124] 1-3D.Hood 5

[0125] Figure 3 as well as Figure 4 The cover 5 shown is a supporting component for supporting multiple head modules 2. The cover 5 is common to multiple head modules 2, but can also be set separately for each head module 2. The cover 5 is a plate-shaped component with the direction along the Z axis as the thickness direction. The cover 5 is arranged in the Z1 direction relative to the multiple flow channel opening forming components 25. The cover 5 is a component that clamps the sealing component 4 and the flow channel opening forming component 25 between the bracket 6. As shown in FIG. Figure 4 As shown, the cover 5 includes a surface 511 facing the Z1 direction and a surface 512 facing the Z2 direction. The cover 5 is a member that does not have a flow path for ink to flow.

[0126] The cover 5 is made of metal, for example. The cover 5 is made of metal such as aluminum and stainless steel, for example. The cover 5 has rigidity for supporting the plurality of head modules 2 .

[0127] Figure 13 for Figure 4 The top view of the cover 5 is shown. Figure 4 as well as Figure 13As shown, the cover 5 is provided with a plurality of openings 5H. Each opening 5H is a hole that penetrates the cover 5 in the thickness direction. Each opening 5H is provided to expose a portion of the head module 2 to the outside. Specifically, the chip 20 is exposed through the opening 5H. Therefore, the plurality of nozzles N are exposed through the opening 5H.

[0128] The cover 5 includes a plurality of support surfaces 5S. The support surface 5S is a portion of the surface 512 of the cover 5 facing the Z2 direction, and is a surface that contacts the flow channel opening forming member 25 and supports the flow channel opening forming member 25. The support surface 5S is in a frame shape surrounding the opening 5H of the cover 5. Figure 13 In FIG. 5 , the support surface 5S is marked with a mesh hatching.

[0129] like Figure 4 As shown, a portion of the surface 251 of the flow channel opening forming member 25 described above, which faces the Z1 direction, has a supported surface 2511. The supported surface 2511 is a surface that contacts the support surface 5S of the cover 5 and is supported by the support surface 5S. The contact between the supported surface 2511 and the support surface 5S holds the head module 2 in the cover 5.

[0130] Furthermore, by using the cover 5 to hold the flow path opening forming member 25 rather than the chip 20, the chip 20 can be arranged within the opening 5H of the cover 5. Therefore, the chip 20 does not need to be excessively exposed in the Z1 direction relative to the cover 5. Consequently, the distance between the chip 20 and the medium 90, i.e., the paper gap, can be prevented from increasing.

[0131] Furthermore, the thickness D5 of the cover 5 in the Z1 direction is thicker than the thickness D2 of the chip 20 in the Z1 direction. This can reduce the possibility of deformation of the cover 5 due to the reaction force of the sealing member 4.

[0132] Furthermore, the nozzle surface SN of the chip 20 and the surface 511 of the cover 5 facing the Z1 direction are approximately in the same plane. Therefore, the increase in the paper gap can be suppressed. Furthermore, it is easy to wipe the surface 511 of the cover 5 facing the Z1 direction and the nozzle surface SN together. In addition, in the case where the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction are approximately in the same plane, in addition to the case where these surfaces are completely in the same plane, there is also a case where there is a certain degree of height difference including manufacturing errors. In addition, the nozzle surface SN and the surface 511 of the cover 5 facing the Z1 direction may not be approximately in the same plane.

[0133] like Figure 4 As shown, the cover 5 has a plurality of fixing holes 503. Each fixing hole 503 is used to fix the cover 5 relative to the bracket 6. Figure 4As shown, each fixing hole 503 is provided on the surface 512 of the cover 5 facing the Z2 direction. Each fixing hole 503 is a bottomed hole provided on the surface 512 of the cover 5 facing the Z2 direction. Furthermore, each fixing hole 503 is a recessed portion provided on the surface 512 of the cover 5 facing the Z2 direction, and can also be understood as a depression formed on the surface 512. The plurality of fixing holes 503 correspond one-to-one with the plurality of fixing holes 652H described above, and overlap when viewed along the Z1 direction.

[0134] In addition, although one cover 5 is provided for each bracket 6 as described above, a plurality of covers 5 may be provided. For example, a cover 5 for holding three of the six head modules 2 and a cover 5 for holding the remaining three head modules 2 may be provided.

[0135] For example, two or more head modules 2 that are replaced at the same timing are held by one cover 5. Thus, since the two or more head modules 2 that are replaced at the same timing can be collectively replaced, the work becomes easier.

[0136] Specifically, for example, it is preferable that the cover 5 holds multiple head modules 2 that eject the same type of liquid. This allows chips with similar lifespans, such as those with colors that eject more frequently, to be replaced collectively. This improves the workability during replacement. Furthermore, the two or more head modules 2 held by a single cover 5 do not necessarily eject the same type of ink. Furthermore, a single head module 2 can be configured to eject either a single ink or two or more inks.

[0137] 1-3E. Fixed component group 150

[0138] like Figure 4 As shown, the fixing component set 150 includes a plurality of fixing components 155 and a plurality of fixing components 157 .

[0139] The fixing member 155 secures the bracket 6 and the cover 5. The fixing member 155 is inserted through the through-hole fixing hole 652H and the recessed fixing hole 503 in that order. Therefore, the fixing member 155 is not exposed on the nozzle surface SN side. On the other hand, a portion of the fixing member 155 is exposed on the surface 606 of the bracket 6 facing the Z2 direction.

[0140] The fixing member 157 directly secures the bracket 6 and the head module 2. The fixing member 157 is inserted through the through-hole fixing hole 651H and the recessed fixing hole 215 in that order. Therefore, the fixing member 157 is not exposed on the nozzle surface SN side. On the other hand, a portion of the fixing member 157 is exposed on the surface 606 of the bracket 6 facing the Z2 direction.

[0141] By not exposing the fixing members 155 and 157 on the nozzle surface SN side, it is possible to prevent ink mist from adhering to and solidifying the fixing members 155 and 157. This prevents the fixing members 155 and 157 from becoming difficult to remove due to the adhesion of the mist.

[0142] In addition, if Figure 10 As shown, multiple fixing members 155 are provided near the corners of the bracket 6, which is a square when viewed in the Z1 direction. Multiple fixing members 157 are provided for each head module 2. Specifically, two fixing members 157 are provided for each head module 2. One of the two fixing members 157 is arranged in the Y1 direction of the head module 2 when viewed in the Z1 direction, and the other is arranged in the Y2 direction of the head module 2.

[0143] The fixing members 155 and 157 are preferably screws. In this case, for example, internal threads are formed on the walls forming the fixing holes 651H, 652H, the fixing holes 215, and the fixing holes 503. By using screws as the fixing members 155 and 157, the cover 5 and the multiple head modules 2 can be easily released from the bracket 6 by rotating the screws to tighten the screws. Using screws as the fixing members 155 and 157 allows the multiple head modules 2 and the cover 5 to be freely attached to and detached from the bracket 6 without the use of adhesive.

[0144] In addition, the fixing parts 155 and 157 can also be parts other than screws. For example, they can also be a structure that includes an L-shaped or T-shaped pin that bends the top end in the Z1 direction into a right angle, and an elastic part such as a leaf spring or a coil spring, and uses the elastic force of the elastic part to fix the bracket 6 and the cover 5.

[0145] Thus, the fixing member 155 may have any structure as long as it fixes the holder 6 and the cover 5 to each other. The fixing member 157 may have any structure as long as it fixes the holder 6 and the head module 2 to each other.

[0146] 1-3F. Wiring board 7, relay board 70, and connector 71

[0147] like Figure 3As shown, the wiring substrate 7 is provided for each head module 2. The wiring substrate 7 is inserted into the wiring hole 25H of the chip 20 and the wiring hole 20H of the flow channel opening forming component 25. The relay substrate 70 is electrically connected to the plurality of head modules 2. The wiring substrate 7 is bonded to the vibration plate 204. The wiring substrate 7 protrudes from the vibration plate 204 in the Z2 direction. The wiring substrate 7 is a mounting component on which a plurality of wirings for electrically connecting the chip 20 and the relay substrate 70 are formed. The wiring substrate 7 is, for example, a flexible substrate such as an FPC (Flexible Printed Circuit) and a COF (Chip On Film) or a rigid substrate. A driving signal and a reference voltage for driving the driving element E are supplied from the wiring substrate 7 to each driving element E.

[0148] The relay substrate 70 is fixed to the bottom surface of the recessed portion 610 in the Z1-direction surface 605 of the flat plate portion 61 of the bracket 6. The relay substrate 70 is flat and is fixed to the bracket 6 by adhesive or the like. The relay substrate 70 is electrically connected to the control unit 91. A plurality of connectors 71 are mounted on the relay substrate 70. The plurality of connectors 71 are arranged one-to-one with the plurality of wiring substrates 7. The ends of the wiring substrates 7, which are provided with a plurality of terminals, are inserted into each connector 71 in a detachable manner. In other words, the wiring substrate 7 is preferably a rigid body in order to facilitate insertion and removal of the ends of the wiring substrate 7 relative to the connectors 71. When the wiring substrate 7 is formed using a flexible substrate, it is desirable to attach a rigid body to support the flexible substrate. By inserting the ends of the wiring substrate 7 into the connectors 71, the wiring substrate 7 is electrically connected to the control unit 91 via the relay substrate 70.

[0149] 1-3G. Bushing

[0150] like Figure 4 As shown, a bushing 526 is arranged between the flow channel opening forming part 25 and the cover 5. Although not shown in detail, for example, the bushing 526 is arranged in the Y1 direction and the Y2 direction of each flow channel opening forming part 25 when viewed along the Z1 direction. In addition, a bushing 522 is arranged between the bracket 6 and the cover 5. Although not shown in detail, for example, the bushing 522 is arranged in a square frame shape along the outer edge of the bracket 6 when viewed along the Z1 direction. The bushings 526 and 522 are made of, for example, elastic resin materials. By providing the bushings 526 and 522, the possibility of ink mist and the like intruding from the outside of the liquid ejecting head 1 into the storage space within the recess 610 of the bracket 6 can be reduced.

[0151] 1-4. Method for Manufacturing Liquid Jet Head 1

[0152] Figure 14 FIG. 1 is a flow chart showing a part of the method for manufacturing the liquid ejecting head 1 according to the first embodiment. Figure 14 As shown, the method for manufacturing the liquid jet head 1 includes a first positioning step s01, a bonding step s03, a second positioning step s02, and a fixing step s04 in the following order. The first positioning step s01 and the bonding step s03 allow the head module 2 to be manufactured by mounting the chip 20 on the flow channel opening forming member 25. The second positioning step s02 and the fixing step s04 allow the head module 2 to be mounted on the bracket 6.

[0153] By providing the first positioning step s01 and the second positioning step s02 , it is possible to achieve high precision in the positional alignment of the plurality of head modules 2 , and in particular, in the alignment of the nozzles N of the plurality of head modules 2 .

[0154] 1-4A. First positioning step s01

[0155] In the first positioning step s01, the chip 20 and the flow path opening forming member 25 are positioned. Specifically, the nozzle plate 201 of the chip 20 and the flow path opening forming member 25 are optically positioned with an arbitrary nozzle N among the plurality of nozzles N as a reference.

[0156] Figure 15 、 Figure 16 as well as Figure 17 They are used for Figure 14 In the first positioning step s01, the first positioning portion 210H and the nozzle N are positioned relative to each other with reference to the predetermined nozzle N, thereby positioning the nozzle plate 201 and the flow path opening forming member 25. Figure 15 、 16 In 17 and 17 , a predetermined nozzle N among the plurality of nozzles N is simply illustrated.

[0157] like Figure 15 As shown, in the first positioning step s01, a thermosetting adhesive 23, for example, is first applied to the surface 251 of the flow channel opening forming member 25 facing the Z1 direction, and then the chip 20 is brought into contact with the adhesive 23. At this time, the nozzle plate 201 of the chip 20 is located on the opposite side of the adhesive 23.

[0158] Next, if Figure 16 As shown, a light-transmitting mask M is disposed in a state separated from the chip 20 in the Z1 direction of the chip 20. The mask M is, for example, a plate-shaped member having a light transmittance of 70% or more for visible light. The mask M is formed of a light-transmitting material such as glass.

[0159] The mask M is provided with a mark MN corresponding to the predetermined nozzle N and a mark M2 corresponding to the first positioning portion 210H. The marks MN and M2 are provided at positions where the predetermined nozzle N and the first positioning portion 210H are spaced at a desired distance from each other. The marks MN and M2 have a light-shielding property with a visible light transmittance of 70% or less, enabling imaging.

[0160] Furthermore, multiple marks MN and M2 are provided to improve positioning accuracy. In the illustrated example, two marks MN and two marks M2 are provided on the mask M. Furthermore, to improve positioning accuracy, the two marks MN and two marks M2 are preferably arranged in a straight line. The number and arrangement of the marks MN and M2 are not limited to the illustrated example.

[0161] Next, if Figure 17 As shown, the two marks MN and two marks M2 on the mask M, the two predetermined nozzles N on the nozzle plate 201, and the two first positioning portions 210H on the flow path opening forming member 25 are positioned using the imaging unit 99. The two predetermined nozzles N on the nozzle plate 201 and the two first positioning portions 210H on the flow path opening forming member 25 each function as an alignment mark for positioning.

[0162] The imaging unit 99 is arranged in a state separated from the chip 20 in the Z1 direction of the chip 20 via the mask M. Therefore, the mask M is arranged between the imaging unit 99 and the chip 20. In addition, the mask M and the imaging unit 99 are separated.

[0163] The imaging unit 99 is a camera including an imaging element such as a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor, and a focusing lens for focusing light from the imaging element. The imaging unit 99 is used to optically position the two marks MN and two marks M2 on the mask M, the two predetermined nozzles N, and the two first positioning portions 210H.

[0164] Specifically, using images captured by the imaging unit 99, etc., the two predetermined nozzles N and two first positioning portions 210H, which serve as a plurality of alignment marks, are overlapped with the plurality of marks on the mask M. Thus, the chip 20 and the flow channel opening forming member 25 are positioned with the nozzles N as a reference. Furthermore, the first positioning portions 210H are captured via the through-holes 211H. Furthermore, while the illustrated example shows a single camera capable of capturing the entire mask M as the imaging unit 99, the imaging unit 99 may also include a plurality of cameras positioned at respective positions facing the plurality of alignment marks.

[0165] According to the above-described first positioning step s01 , the chip 20 and the flow path opening forming member 25 can be positioned with high precision using the nozzle N as a reference.

[0166] As described above, in the first positioning step s01 , the first positioning portion 210H is used as an alignment mark to position the first positioning portion 210H relative to the nozzle N, thereby aligning the chip 20 and the flow path opening forming member 25 .

[0167] The first positioning portion 210H is used to position the head module 2 and the holder 6 in the second positioning step s02 described later. Therefore, by using the first positioning portion 210H used in the second positioning step s02 as an alignment mark in the first positioning step s01, there is no need to provide a separate alignment mark in the first positioning step s01. Furthermore, by using the same first positioning portion 210H in both the first positioning step s01 and the second positioning step s02, the relative positioning accuracy of the chip 20, the flow channel opening forming member 25, and the holder 6 can be improved.

[0168] In addition, in the first positioning step s01 , instead of using the first positioning portion 210H as the alignment mark, another alignment mark may be provided on the flow path opening forming member 25 .

[0169] Furthermore, as described above, in the first positioning step s01, the first positioning portion 210H and the nozzle N are optically detected by the imaging unit 99 positioned in the Z1 direction of the nozzle N opening relative to the nozzle plate 201 and the flow path opening forming member 25. This method allows the nozzle plate 201 and the flow path opening forming member 25 to be positioned simply and with high precision with respect to the nozzle N.

[0170] Specifically, the first positioning portion 210H is optically detected via a through-hole 211H that opens on the surface 251 of the flow path opening forming member 25 facing the Z1 direction. As previously described, the through-hole 211H is arranged in the Z1 direction relative to the first positioning portion 210H and communicates with the first positioning portion 210H. It is also larger in size than the first positioning portion 210H. The presence of the through-hole 211H facilitates optical detection of the position of the first positioning portion 210H through the through-hole 211H.

[0171] In addition, if Figure 8 As shown, the depth D21 of the through-hole 211H is deeper than the depth D20 of the first positioning portion 210H. In other words, the depth D20 is shallower than the depth D21. Therefore, positioning can be performed with high precision. Furthermore, by making the depth D20 shallower than the depth D21, the first positioning portion 210H and the second positioning portion 654 can be more easily attached and detached than when the depths D20 and D21 are deeper.

[0172] Furthermore, the first positioning portion 210H does not overlap with the chip 20 when viewed along the Z1 direction. Therefore, the nozzle N and the first positioning portion 210H do not overlap when viewed along the Z1 direction. Therefore, the nozzle N and the first positioning portion 210H serve as alignment marks, enabling optical alignment of the chip 20 and the flow channel opening forming member 25 from below the chip 20.

[0173] 1-4B. Bonding process s03

[0174] In the bonding step s03, after the first positioning step s01, the adhesive 23 for fixing the chip 20 and the flow channel opening forming member 25 is cured. For example, when the adhesive 23 is a thermosetting resin, the adhesive 23 is cured by applying heat.

[0175] In this embodiment, a bonding step s03 is performed between the first positioning step s01 and the second positioning step s02. After the first positioning step s01, bonding the chip 20 to the flow channel opening forming member 25 improves the positioning accuracy of the chip 20 having the nozzle N and the flow channel opening forming member 25. Therefore, for example, the wiring holes 20H and 25H can be positioned with high precision, as can the space Rc and the communication space Ra.

[0176] 1-4C. Second positioning step s02

[0177] In the second positioning step s02 , the head module 2 and the holder 6 are positioned. Specifically, the second positioning portion 654 of the holder 6 is press-fitted into the first positioning portion 210H of the flow path opening forming member 25 , thereby positioning the head module 2 and the holder 6 .

[0178] Figure 18 For use in Figure 14 The second positioning step s02 is illustrated in FIG. In the second positioning step s02, the head module 2 is brought closer to the holder 6 as indicated by arrow A2. The second positioning portion 654 is then pressed into the first positioning portion 210H. This allows the head module 2 and holder 6 to be positioned.

[0179] Furthermore, when the second positioning portion 654 is pressed into the first positioning portion 210H, the sealing member 4 is interposed between the head module 2 and the bracket 6. At this time, the sealing member 4 is positioned such that, when viewed along the Z1 direction, the communication port 4H of the sealing member 4 overlaps the flow channel opening 650H of the bracket 6. Furthermore, when the second positioning portion 654 is pressed into the first positioning portion 210H, the wiring substrate 7 is inserted into the connector 71.

[0180] 1-4D. Fixing process s04

[0181] In the fixing step s04, the head module 2 is mounted on the bracket 6. Specifically, the fixing member 157 is inserted through the fixing hole 651H and the fixing hole 215 in this order. If the fixing member 157 is a screw, the head module 2 is fixed to the bracket 6 by being screwed with the fixing member 157.

[0182] By the above method, the chip 20 is mounted on the flow channel opening forming member 25 , and the head module 2 is mounted on the holder 6 .

[0183] As described above, the manufacturing method of the liquid jet head 1 includes a first positioning step s01 and a second positioning step s02. Since the chip 20 and the flow channel opening forming component 25 are positioned with the nozzle N as a reference in the first positioning step s01, the head module 2 and the bracket 6 can be positioned with the nozzle N as a reference simply by pressing the flow channel opening forming component 25 into the bracket 6. Therefore, the position accuracy of each head module 2 relative to the bracket 6 can be improved. In addition, the nozzle alignment of the plurality of head modules 2 can be achieved with high precision. Therefore, when a part of the plurality of head modules 2 of the liquid jet head 1 needs to be replaced with another head module 2 due to a malfunction or the like, the nozzle alignment of the plurality of head modules 2 can be ensured with high precision. Therefore, the operation of replacing the head module 2 for regeneration can be easily performed.

[0184] Furthermore, as previously described, the direction in which one of the first positioning portion 210H and the second positioning portion 654 is pressed into the other is the same as the direction in which the flow channel opening 650H overlaps the flow channel opening 251H. Therefore, by attaching the head module 2 to the bracket 6, the flow channel 6R and the flow channel 25R can be easily and accurately connected.

[0185] Furthermore, a plurality of second positioning portions 654 are arranged on the bottom surface of the first recess 611. Furthermore, the first positioning portion 210H is arranged on the surface 252 of the cover 5 facing the Z2 direction, which is opposite to the Z1 direction. This arrangement of the first positioning portions 210H and the second positioning portions 654 allows for easy attachment and detachment of only the head module 2 to be replaced from below the holder 6.

[0186] In addition, if Figure 4 As shown, the fixing member 157 is arranged so that it does not overlap with the chip 20 when viewed in the Z1 direction and that the sealing member 4 is sandwiched between the chip 20 and the fixing member 157. By not overlapping the chip 20 when viewed in the Z1 direction, the load generated by the fixing member 157 during the fixing step s04 is less likely to act on the chip 20 than when the fixing member 157 overlaps the chip 20. Furthermore, by arranging the sealing member 4 between the fixing member 157 and the chip 20 when viewed in the Z1 direction, the distance between the chip 20 and the fixing member 157 can be increased by the amount of the sealing member 4. Therefore, the load generated by the fixing member 157 during the fixing step s04 is less likely to act on the chip 20.

[0187] 2. Second Implementation

[0188] In the following embodiments, elements having the same functions or effects as those of the first embodiment are denoted by the same reference numerals as those used in the first embodiment, and detailed descriptions thereof are omitted as appropriate.

[0189] 2-1. Method of Manufacturing Liquid Jet Head 1

[0190] The method for manufacturing a liquid ejecting head 1 in this embodiment is a method in which the head module 2 of a certain liquid ejecting head 1 is removed and repaired, and a new liquid ejecting head 1 is manufactured using the repaired head module 2. Hereinafter, the certain liquid ejecting head 1 is referred to as a "first liquid ejecting head 1a," and the new liquid ejecting head 1 is referred to as a "second liquid ejecting head 1b."

[0191] Specifically, the manufacturing method of the liquid ejection head 1 of this embodiment includes the following method, namely, after removing a specific head module 2 from a certain bracket 6, repairing the specific head module to manufacture a new head module 2, and then installing the new head module 2 on another bracket 6.

[0192] Hereinafter, a certain bracket 6 is referred to as a "first bracket 6a", and the multiple head modules 2 mounted on the first bracket 6a are referred to as "first head module 2a". The above-mentioned specific head module 2 is one or more first head modules 2a among the multiple first head modules 2a. In addition, another new bracket 6 is referred to as a "second bracket 6b", and the multiple head modules 2 mounted on the second bracket 6b are referred to as "second head module 2b". The new head module 2 after replacing the first head module 2a is referred to as the second head module 2b. In addition, the chip 20 possessed by the first head module 2a is referred to as the "first chip 20a", and the nozzle plate 201 possessed by the first chip 20a is referred to as the "first nozzle plate 201a". The chip 20 possessed by the second head module 2b is referred to as the "second chip 20b", and the nozzle plate 201 possessed by the second chip 20b is referred to as the "second nozzle plate 201b".

[0193] Figure 19 FIG. 1 is a flow chart showing a part of the method for manufacturing the liquid ejecting head 1 in the second embodiment. Figure 19 As shown, the method for manufacturing the liquid jet head 1 of this embodiment includes a fixing release step s05 , a press-fitting release step s06 , a disassembly step s07 , a first positioning step s01 , a bonding step s03 , a second positioning step s02 , and a fixing step s04 .

[0194] 2-1A. Fixing release process s05

[0195] In the unfastening step s05, the first bracket 6a of the first liquid ejecting head 1a and the first head module 2a are unfastened. Specifically, the fixing member 157 is removed from the fixing hole 651H and the fixing hole 215, thereby releasing the first bracket 6a from the first head module 2a. Prior to this unfastening step s05, the cover 5 is removed from the first bracket 6a.

[0196] 2-1B. Press-release process s06

[0197] Figure 20 For use in Figure 19 FIG. 5 is a diagram for explaining the press-in release step s06. Figure 20 As shown, in the press-release step s06, the second positioning portion 654 of the first bracket 6a is released from the press-fit state relative to the first positioning portion 210H of the first head module 2a. A worker grasps the first head module 2a and pulls it downward in the direction indicated by arrow A3, thereby releasing the press-fit and removing the first head module 2a from the first bracket 6a.

[0198] In addition, for example, after removing the fixing component 157 from the fixing hole 651H and the fixing hole 215, a narrow rod-shaped component is inserted into the fixing hole 651H and the fixing hole 215, and the component is used to press the first head module 2a in the Z1 direction. In this way, the first head module 2a can be easily released from the first bracket 6a. In other words, by using the fixing hole 651H as a hole for releasing the press-in, the first head module 2a can be easily released from the first bracket 6a. In addition, the depth of the fixing hole 651H is deeper than the depth of the fixing hole 215. Therefore, it is easier to remove the flow channel opening forming component 25 from the bracket 6.

[0199] Furthermore, the relay substrate 70 is arranged in the Z2 direction relative to the multiple head modules 2. Furthermore, the first positioning portion 210H is provided on the surface 252 of the flow channel opening forming member 25 that faces the Z2 direction. Therefore, it is easier to attach and detach the first head module 2a and wiring substrate 7 to be replaced from below the first bracket 6a and relay substrate 70. Consequently, there is no need to disconnect the electrical connections of any first head module 2a other than the one being replaced, simplifying the assembly and detachment process.

[0200] The "press-fit state" refers to a tightly fitted or partially fitted state, and refers to a state in which the second positioning portion 602 contacts the first positioning portion 502 at at least two points upon completion of insertion of the second positioning portion 602 into the first positioning portion 502. Furthermore, before press-fitting, when viewed along the Z-axis, the length of the longest line segment connecting two points on the outer circumference of the second positioning portion 602, which serves as a positioning pin, is greater than the diameter of the largest circle inscribed in the first positioning portion 502, which serves as a positioning hole. Furthermore, in the press-fit state, the force generated by the press-fit ensures that the head module 2 is fitted to the holder 6 to a degree that prevents it from falling due to its own weight.

[0201] 2-1C. Decomposition process s07

[0202] Figure 21 For use in Figure 19 The decomposition process s07 is described in detail. Figure 21 As shown, in the disassembly step s07, the first chip 20a and the flow channel opening forming member 25 of the first head module 2a are disassembled. Specifically, the first chip 20a including the first nozzle plate 201a is removed from the flow channel opening forming member 25. For example, if the adhesive 23 is a thermosetting resin, a release agent or the like is used for the adhesive 23. If the adhesive 23 is a thermoplastic resin, the adhesive 23 is heated using a heater (not shown) to soften the adhesive 23, thereby separating the first chip 20a and the flow channel opening forming member 25.

[0203] 2-1D. First positioning step s01

[0204] Figure 22 For use in Figure 19 The first positioning step s01 is described in detail in FIG. Figure 22 As shown, in the first positioning step s01 of this embodiment, the flow path opening forming member 25, which has been separated from the first chip 20a in the disassembly step s07, and the second chip 20b including at least the second nozzle plate 201b that is different from the first nozzle plate 201a, are optically positioned using the nozzles N of the second nozzle plate 201b as a reference. In other words, the second nozzle plate 201b and the flow path opening forming member 25 are optically positioned using the nozzles N as a reference.

[0205] The positioning method is the same as that in the first embodiment. Specifically, Figure 22 As shown, this positioning is performed using the mask M and the imaging unit 99. Therefore, even for the second chip 20b having the new second nozzle plate 201b, the second chip 20b and the flow path opening forming member 25 can be aligned with high precision.

[0206] The bonding step s03 of this embodiment is the same as the bonding step s03 of the first embodiment. Through the bonding step s03 of this embodiment, the second chip 20b and the flow channel opening forming member 25 are bonded together using the adhesive 23. As a result, a second head module 2b including the second chip 20b and the flow channel opening forming member 25 is produced.

[0207] 2-1E. Second positioning step s02

[0208] Figure 23 For use in Figure 19 The second positioning step s02 is described in detail in FIG. Figure 23 As shown, in the second positioning step s02, the second head module 2b and the second bracket 6b are positioned by pressing the second positioning portion 654 of the new second bracket 6b different from the first bracket 6a into the first positioning portion 210H of the flow channel opening forming part 25 of the second head module 2b.

[0209] Since the second chip 20b and the flow channel opening forming member 25 are aligned with the nozzles N as a reference in the first positioning step s01, simply by pressing the flow channel opening forming member 25 into the second holder 6b, the second head module 2b and the second holder 6b can be positioned with the nozzles N as a reference. Therefore, simply by pressing the flow channel opening forming member 25 into the second holder 6b, highly accurate alignment of the nozzles N between the multiple second head modules 2b can be ensured. Therefore, using a head module 2 that has been repaired by reusing the flow channel opening forming member 25 facilitates replacement of the liquid ejecting head 1.

[0210] Next, the second head module 2b is fixed to the second holder 6b through the fixing step s04 similar to that of the first embodiment.

[0211] Furthermore, the first bracket 6a may also be an example of a "second bracket." That is, the first bracket 6a and the second bracket 6b described above may also be the same bracket 6. Specifically, the second head module 2b may be manufactured by repairing the first head module 2a that has been removed from the first bracket 6a of the first liquid ejecting head 1a through the fixing release step s05 to the bonding step s03, and then positioning and fixing the second head module 2b relative to the first bracket 6a of the first liquid ejecting head 1a in the second positioning step s02 and the fixing step s04, thereby manufacturing the second liquid ejecting head 1b.

[0212] The method described above allows the second liquid ejecting head 1b to be manufactured from the first liquid ejecting head 1a. From another perspective, the method described above allows the liquid ejecting head 1 to be regenerated by reusing the flow path opening forming member 25.

[0213] Furthermore, the flow channel opening forming member 25 is preferably made of metal. By making the flow channel opening forming member 25 of metal, the flow channel opening forming member 25 can be easily reused compared to when it is made of resin.

[0214] 3. Modifications

[0215] The first embodiment illustrated above can be modified in various ways. Specific modifications applicable to the first embodiment described above are exemplified below. Two or more embodiments arbitrarily selected from the following examples can be appropriately combined within a range that does not contradict each other.

[0216] 3-1. First Modification

[0217] Figure 24 It is a cross-sectional view of a portion of the liquid jet head 1 according to the first modified example. Figure 24 The liquid jet head 1 of the first modified example shown includes a holder 8. The holder 8 includes a first holder 81 and a second holder 82. The first holder 81 is substantially the same as the holder 6 of the first embodiment, except that the flange portion 64 is omitted.

[0218] The second bracket 82 is identical to the cover 5 of the first embodiment, except for the following elements. The second bracket 82 has a portion that extends in the Y1 or Y2 direction relative to the first bracket 81 when viewed in the Z1 direction. A fourth positioning portion 824 is provided in this extended portion. The fourth positioning portion 824 has the same structure as the fourth positioning portion 642 of the first embodiment and is press-fitted into the third positioning portion 102 of the unit base 11.

[0219] The second bracket 82 also has multiple second positioning portions 822. Two second positioning portions 822 are provided for each head module 2. Although not illustrated in detail, one of the two second positioning portions 822 is located in the Y1 direction relative to the chip 20 when viewed along the Z1 direction, and the other is located in the Y2 direction. The second positioning portion 822 is a hole opening on the surface 512 of the second bracket 82 facing the Z2 direction. The second positioning portion 822 is a recess formed on the surface 512 of the second bracket 82 facing the Z2 direction, or rather, a depression provided on the surface 512.

[0220] The head module 2 also has a first positioning portion 217 corresponding to the second positioning portion 822. The first positioning portion 217 is a protrusion that projects in the Z1 direction from the surface 251 of the flow path opening forming member 25 that faces the Z1 direction. The first positioning portion 217 is press-fitted into the second positioning portion 822. This ensures that the head module 2 is positioned relative to the bracket 8 including the second bracket 82.

[0221] Furthermore, for example, the second bracket 82 and each head module 2 are fixed together by an adhesive or the like. When the second bracket 82 and each head module 2 are fixed together by an adhesive, if the adhesive can be melted and separated by heat, for example, then the second bracket 82 and each head module 2 can be understood to be fixed together in a detachable manner.

[0222] In the liquid injection head 1 of this modified example, since in the first positioning step s01, the first positioning portion 217 arranged on the surface 251 facing the Z1 direction in the flow channel opening forming part 25 and the nozzle N opened on the nozzle surface SN of the surface facing the Z1 direction of the nozzle plate 201 of the chip 20 can be optically detected by using a camera unit located in the Z1 direction relative to the nozzle plate 201 and the flow channel opening forming part 25, the optical positioning of the nozzle plate 201 and the flow channel opening forming part 25 can be simply and accurately implemented with the nozzle N as a reference.

[0223] 3-2. Other Modifications

[0224] Furthermore, for example, a dedicated through hole for releasing the press-fitting of the first positioning portion 210H and the second positioning portion 654 may be formed in the bracket 6. For example, the through hole may have an opening area larger than that of the fixing hole 651H.

[0225] In the above description, the sealing member 4 is provided for each head module 2 , but the sealing member 4 may be integrated and shared among a plurality of head modules 2 .

[0226] The structures of the embodiments and modifications described above are not particularly limited as long as the "first positioning portion" and the "second positioning portion" are configured such that one is pressed into the other. Therefore, although the embodiments described above have a structure in which the "second positioning portion" is pressed into the "first positioning portion," a structure in which the "first positioning portion" is pressed into the "second positioning portion" may also be employed.

[0227] In addition to devices specifically used for printing, "liquid ejection devices" can also be used in various devices such as fax machines and copiers. The use of liquid ejection devices is not limited to printing. For example, a liquid ejection device that ejects a solution of a color material can be used as a manufacturing device for forming color filters for display devices such as liquid crystal display panels. In addition, a liquid ejection device that ejects a solution of a conductive material can be used as a manufacturing device for forming wiring and electrodes for relay substrates. In addition, a liquid ejection device that ejects a solution of an organic substance related to a living organism can be used as a manufacturing device for manufacturing, for example, a biochip.

[0228] Although the present invention has been described above based on preferred embodiments, the present invention is not limited to the embodiments described above. In addition, the structure of each part of the present invention can be replaced with any structure that has the same function as the embodiment described above, and any structure can be added.

[0229] Explanation of symbols

[0230] 1…Liquid ejecting head; 1a…First liquid ejecting head; 1b…Second liquid ejecting head; 2…Head module; 2a…First head module; 2b…Second head module; 3…Supply flow path member; 4…Seal member; 5…Cover; 6…Bracket; 6a…First bracket; 6b…Second bracket; 7…Wiring substrate; 10…Liquid ejecting head unit; 20…Chip; 20a…First chip; 20b…Second chip; 23…Adhesive; 25…Flow path opening forming member; 70…Relay substrate; 71…Connector; 100…Liquid ejecting device; 157 …fixing component; 201…nozzle plate; 201a…first nozzle plate; 201b…second nozzle plate; 210H…first positioning portion; 211H…through hole; 251H…flow channel opening; 650H…flow channel opening; 654…second positioning portion; M…mask; M2…mark; MN…mark; N…nozzle; SN…nozzle surface; s01…first positioning step; s02…second positioning step; s03…bonding step; s04…fixing step; s05…fixing release step; s06…pressing release step; s07…disassembly step.

Claims

1. A method for manufacturing a liquid ejecting head, characterized in that: The liquid ejecting head includes a plurality of head modules, each of which includes a chip including at least a nozzle plate having a plurality of nozzles formed thereon and a flow path opening forming member, and a holder for holding the plurality of head modules. The method for manufacturing the liquid ejecting head includes: a first positioning step of optically positioning the nozzle plate and the flow channel opening forming member with the nozzle as a reference; In the second positioning step, the head module and the holder are positioned by pressing one of the first positioning portion of the flow path opening forming member and the second positioning portion of the holder into the other.

2. The method for manufacturing a liquid ejecting head according to claim 1, wherein: The method further includes a bonding step of curing an adhesive for fixing the chip and the flow channel opening forming member after the first positioning step.

3. The method for manufacturing a liquid ejecting head according to claim 1, wherein: In the first positioning step, relative positions of the first positioning portion and the nozzle are positioned.

4. The method for manufacturing a liquid ejecting head according to claim 3, wherein: In the first positioning step, the first positioning portion and the nozzle are optically detected by an imaging unit positioned in a first direction in which the nozzle opens relative to the nozzle plate and the flow path opening forming member.

5. The method for manufacturing a liquid ejecting head according to claim 4, wherein: In the first positioning step, the first positioning portion and the nozzle, which are arranged on the surface of the flow path opening forming member facing the first direction, are optically detected.

6. The method for manufacturing a liquid ejecting head according to claim 4, wherein: The first positioning portion is a positioning hole for pressing a positioning pin serving as the second positioning portion into. The surface of the flow path opening forming member facing the first direction has a through hole. The through hole is arranged in the first direction relative to the positioning hole, communicates with the positioning hole, and has a larger outer shape than the positioning hole.

7. The method for manufacturing a liquid ejecting head according to claim 6, wherein: The depth of the through hole is deeper than the depth of the positioning hole.

8. A method for manufacturing a liquid ejecting head, characterized in that: A second liquid ejecting head including a second holder is manufactured using a portion of the first head module of a first liquid ejecting head including a plurality of first head modules and a first holder for holding the plurality of first head modules, and includes: a press-release step of releasing a state in which one of the first positioning portion of the first head module and the second positioning portion of the first bracket is pressed into the other; a disassembly step of disassembling the first head module after the press-fitting state with the first bracket is released in the press-fitting releasing step into a first chip and a flow channel opening forming member, wherein the first chip includes at least a first nozzle plate having a plurality of nozzles formed thereon, and the flow channel opening forming member is provided with the first positioning portion; a first positioning step of optically positioning the flow channel opening forming member separated from the first chip in the decomposition step and a second chip including at least a second nozzle plate different from the first nozzle plate, using the nozzles of the second nozzle plate as a reference; The second positioning step positions the second head module and the second bracket by pressing one of the first positioning portion of the flow channel opening forming component and the second positioning portion of the second bracket of the second head module having the second chip and the flow channel opening forming component positioned by the first positioning step into the other.

9. The method for manufacturing a liquid ejecting head according to claim 8, wherein: The flow channel opening forming member is made of metal.

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