Device for measuring characteristics of laminated ceramic electronic component and method for manufacturing laminated ceramic electronic component

Abstract

The invention provides a device for measuring characteristics of a laminated ceramic electronic component and a method for manufacturing the same. When a measuring probe is contacted with the laminated ceramic electronic component to measure the characteristics, the laminated ceramic electronic component can be stably measured by keeping the laminated ceramic electronic component in a stable state. The present invention is provided with at least one measurement system that includes: a housing unit that houses a multilayer ceramic capacitor in a substantially horizontal state; a measuring unit including a pair of measuring probes which are disposed so as to face each other so as to be capable of advancing and retreating with respect to the pair of metal terminals of the multilayer ceramic capacitor housed in the housing unit, and which come into contact with the metal terminals facing the measuring probes when the measuring probes enter the housing unit; and a pressing part which is disposed so as to face a second main surface of a main body part disposed on the upper side of the laminated ceramic capacitor housed in the housing part so as to be capable of advancing and retreating, and which, when entering, presses the laminated ceramic capacitor from the second main surface while being in contact with the second main surface facing the pressing part.

Description

Technical Field

[0001] The present invention relates to a characteristic measuring device for a multilayer ceramic electronic component and a method for manufacturing the multilayer ceramic electronic component. Background Art

[0002] Conventionally, the characteristics of electronic components such as multilayer ceramic capacitors have been investigated to confirm whether they possess the desired characteristics. For example, measurement probes are brought into contact with a pair of terminals on either side of the electronic component, sandwiching the component, to measure the characteristics (see Patent Document 1, etc.).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Laid-Open No. 2000-214215

[0006] When a measuring probe is brought into contact with an electronic component, the electronic component may move due to the pressing force generated at that time, and normal measurement may not be performed. Therefore, there is room for improvement. Summary of the Invention

[0007] Problems to be solved by the invention

[0008] A main object of the present invention is to provide a multilayer ceramic electronic component characteristic measuring apparatus capable of holding the multilayer ceramic electronic component in a stable state when measuring characteristics by bringing a measuring probe into contact with the multilayer ceramic electronic component, thereby enabling stable measurement.

[0009] Technical solutions to solve problems

[0010] The characteristic measuring device of the laminated ceramic electronic component according to the present invention is a measuring device for measuring the characteristics of the laminated ceramic electronic component, wherein the laminated ceramic electronic component includes a main body portion having a substantially rectangular parallelepiped shape and a pair of metal terminals, wherein the main body portion has a pair of main surfaces opposing each other in the height direction, a pair of side surfaces opposing each other in the width direction, and a pair of end surfaces opposing each other in the length direction, wherein the pair of metal terminals are respectively arranged on the outer sides of the pair of end surfaces, wherein the characteristic measuring device of the laminated ceramic electronic component includes at least one measuring system, wherein the measuring system includes: a housing portion for housing the laminated ceramic electronic component so as to house the pair of main surfaces The surfaces are respectively arranged on the upper side and the lower side and the longitudinal direction and the width direction are both in a state of being approximately horizontal; a measuring part, including a pair of measuring probes, which are respectively arranged to be able to advance and retreat relative to the pair of metal terminals of the stacked ceramic electronic component accommodated in the accommodating part, and when entering, they contact the metal terminals opposite to themselves; and a pressing part, which is arranged to be able to advance and retreat relative to the main surface arranged on the upper side of the stacked ceramic electronic component accommodated in the accommodating part, and when entering, it contacts the main surface on the upper side opposite itself and presses the stacked ceramic electronic component from the main surface.

[0011] Effects of the Invention

[0012] According to the present invention, a characteristic measuring apparatus for a multilayer ceramic electronic component can be provided, which can hold the multilayer ceramic electronic component in a stable state when measuring characteristics by bringing a measuring probe into contact with the multilayer ceramic electronic component, thereby enabling stable measurement. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1A It is a side view of a first multilayer ceramic capacitor according to the embodiment.

[0014] Figure 1B yes Figure 1A A view taken along arrow IB is a top view of the first multilayer ceramic capacitor according to the embodiment.

[0015] Figure 2A It is a side view of a second multilayer ceramic capacitor according to the embodiment.

[0016] Figure 2B yes Figure 2A A view taken along the arrow IIB of FIG. 1 is a top view of the second multilayer ceramic capacitor according to the embodiment.

[0017] Figure 3A It is a front view showing the main parts of the characteristic measurement device according to the embodiment, and shows a measurement standby state.

[0018] Figure 3BIt is a front view showing the main parts of the characteristic measurement device according to the embodiment, and shows a measurement state.

[0019] Figure 4 It is a perspective view of the characteristic measurement device according to the embodiment with the pressing portion removed.

[0020] Figure 5 It is a plan view of the characteristic measurement device according to the embodiment with the pressing portion removed.

[0021] Figure 6 yes Figure 5 The enlarged view of the portion indicated by VI is a plan view showing a measurement state using a characteristic measurement device.

[0022] Description of Reference Numerals

[0023] 1: Multilayer ceramic capacitors (multilayer ceramic electronic components);

[0024] 1A: 1st laminated ceramic electronic component;

[0025] 1B: 2nd laminated ceramic electronic component;

[0026] 10: Main body;

[0027] 21: main surface of the main body;

[0028] 22: side of the main body;

[0029] 23: end face of the main body;

[0030] 60: Metal terminal;

[0031] 60A: 1st metal terminal;

[0032] 60B: Second metal terminal;

[0033] 100: characteristic measuring device;

[0034] 200: accommodating portion;

[0035] 240: Bottom;

[0036] 241: Slit (concave);

[0037] 250: next door;

[0038] 300: measurement unit;

[0039] 355B: 1st shielding wall (shielding wall);

[0040] 357B: 2nd shielding wall (shielding wall);

[0041] 400: measurement probe;

[0042] 411: 1st front end contact portion (front end contact portion);

[0043] 412: 1st rear end connection portion (rear end connection portion);

[0044] 421: 2nd front end contact portion (front end contact portion);

[0045] 422: 2nd rear end connection portion (rear end connection portion);

[0046] 500: pressing part;

[0047] 600: measurement system;

[0048] 610: 1st measurement system;

[0049] 620: The second measurement system. DETAILED DESCRIPTION

[0050] Hereinafter, an embodiment of the present disclosure will be described with reference to the accompanying drawings. This embodiment is a characteristic measuring device for a laminated ceramic electronic component and a method for manufacturing a laminated ceramic electronic component. Figures 1A to 2B A multilayer ceramic capacitor 1 as a multilayer ceramic electronic component according to an embodiment will be described. The multilayer ceramic capacitor 1 is manufactured while having predetermined characteristics measured by a characteristic measurement apparatus described later.

[0051] The multilayer ceramic capacitor 1 according to the embodiment includes Figure 1A as well as Figure 1B The first multilayer ceramic capacitor 1A shown as the first multilayer ceramic electronic component and Figure 2A as well as Figure 2B The second multilayer ceramic capacitor 1B is shown as a second multilayer ceramic electronic component. The first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B both include a pair of metal terminals 60 as external terminals. The pair of metal terminals 60 of the first multilayer ceramic capacitor 1A includes a pair of first metal terminals 60A. The pair of metal terminals 60 of the second multilayer ceramic capacitor 1B includes a pair of second metal terminals 60B. The pair of first metal terminals 60A of the first multilayer ceramic capacitor 1A are outwardly curved. The pair of second metal terminals 60B of the second multilayer ceramic capacitor 1B are inwardly curved. The first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B are different in type in that the shapes of the metal terminals 60 constituting the external terminals are different, but the structures other than the metal terminals 60 are the same.

[0052] A first multilayer ceramic capacitor 1A according to the embodiment will be described. Figure 1A It is a side view of the first multilayer ceramic capacitor 1A. Figure 1B yes Figure 1A The view taken along arrow IB is a top view of the first multilayer ceramic capacitor 1A. The first multilayer ceramic capacitor 1A includes a substantially rectangular parallelepiped main body 10 and the pair of first metal terminals 60A described above. The main body 10 includes an exterior material 20 and a multilayer ceramic capacitor main body 30 embedded within the exterior material 20.

[0053] The first multilayer ceramic capacitor 1A, the main body 10, and the multilayer ceramic capacitor body 30 have a common height direction, width direction, and length direction. These directions are based on the shape of the multilayer ceramic capacitor body 30, which is a substantially rectangular parallelepiped. Figure 1A as well as Figure 1B In FIG. 1 , the longitudinal directions of the first multilayer ceramic capacitor 1A, the main body 10 , and the multilayer ceramic capacitor body 30 are indicated by arrows L. Figure 1A In FIG. 1 , the height directions of the first multilayer ceramic capacitor 1A, the main body 10 , and the multilayer ceramic capacitor body 30 are indicated by arrows T. Figure 1B , arrows W indicate the width directions of the first multilayer ceramic capacitor 1A, the main body 10 , and the multilayer ceramic capacitor body 30 .

[0054] like Figure 1A as well as Figure 1B As shown, the exterior material 20 of the main body 10 includes a pair of main surfaces 21 opposing each other in the height direction T, a pair of side surfaces 22 opposing each other in the width direction W perpendicular to the height direction T, and a pair of end surfaces 23 opposing each other in the length direction L perpendicular to the height direction T and the width direction W. These main surfaces 21, side surfaces 22, and end surfaces 23 constitute the main surface 21, side surfaces 22, and end surfaces 23 of the main body.

[0055] A pair of main surfaces 21 are included in Figure 1A The first main surface 21a at the lower side and the Figure 1A The second main surface 21b is located on the upper side. A pair of side surfaces 22 are included in Figure 1B The first side surface 22a on the upper side and the Figure 1B The second side surface 22b is located at the lower side. A pair of end surfaces 23 are included in Figure 1A The first end face 23a on the left side and the Figure 1A The second end face 23b on the right side.

[0056] The first side surface 22a, the second side surface 22b, the first end surface 23a, and the second end surface 23b of the exterior material 20 each have a parting line PL approximately at the center in the height direction T. The parting line PL corresponds to the dividing surface of the mold used to mold the exterior material 20. A draft angle is provided on the surface of the exterior material 20, with the parting line PL serving as the boundary.

[0057] The first side surface 22a and the second side surface 22b of the exterior material 20 each have a surface 22c1 on the first principal surface 21a side and a surface 22c2 on the second principal surface 21b side. The first end surface 23a and the second end surface 23b of the exterior material 20 each have a surface 23c1 on the first principal surface 21a side and a surface 23c2 on the second principal surface 21b side. These surfaces 22c1 and 23c1 on the first principal surface 21a side and the surfaces 22c2 and 23c2 on the second principal surface 21b side are separated by a parting line PL.

[0058] Each of the surfaces 22c1 and 23c1 on the first principal surface 21a side has a draft angle such that the area of the LW cross section of the exterior material 20 along the longitudinal direction L and the width direction W decreases as it approaches the first principal surface 21a from the parting line PL. In other words, each of the surfaces 22c1 and 23c1 on the first principal surface 21a side has a tapered surface that tilts toward the interior of the exterior material 20 as it approaches the first principal surface 21a from the parting line PL.

[0059] Each of the surfaces 22c2 and 23c2 on the second main surface 21b side is provided with a draft angle such that the area of the LW cross section of the exterior material 20 along the longitudinal direction L and the width direction W decreases as the surface approaches the second main surface 21b from the parting line PL. In other words, each of the surfaces 22c2 and 23c2 on the second main surface 21b side is a tapered surface that inclines toward the interior of the exterior material 20 as the surface approaches the second main surface 21b from the parting line PL.

[0060] like Figure 1A as well as Figure 1B As shown, the laminated ceramic capacitor body 30 of the main body portion 10 includes a laminate 40 and external electrodes 50 provided at both ends of the laminate 40. The laminated ceramic capacitor body 30 of the embodiment has a generally known structure of a laminated ceramic capacitor.

[0061] The multilayer ceramic capacitor body 30 is disposed inside the exterior material 20 with its height T, width W, and length L aligned with those of the exterior material 20 .

[0062] The laminated body 40 of the laminated ceramic capacitor body 30 includes a pair of main surfaces 41 facing each other in the height direction T, a pair of side surfaces 42 facing each other in the width direction W perpendicular to the height direction T, and a pair of end surfaces 43 facing each other in the length direction L perpendicular to the height direction T and the width direction W.

[0063] A pair of main surfaces 41 are included in Figure 1A The first main surface 41a at the lower side and the Figure 1AThe second main surface 41b is located on the upper side. A pair of side surfaces 42 are included in Figure 1B The first side surface 42a on the upper side and the Figure 1B The second side surface 42b is located at the lower side. A pair of end surfaces 43 are included in Figure 1A The first end face 43a on the left side and the Figure 1A The second end face 43b on the right side.

[0064] The laminate 40 includes a plurality of dielectric layers and a plurality of internal electrode layers (not shown) alternately stacked in the height direction T. The laminate 40 functions as a capacitor that generates electrostatic capacitance. The plurality of dielectric layers are composed of a dielectric material such as a dielectric ceramic having a main component such as BaTiO3, CaTiO3, SrTiO3, or CaZrO3. Alternatively, the dielectric material may be a material to which secondary components such as Mn compounds, Fe compounds, Cr compounds, Co compounds, and Ni compounds are added to these main components.

[0065] The lengthwise dimension L of the laminate 40 is not necessarily longer than the widthwise dimension W. The corners and ridges of the laminate 40 are preferably rounded. A corner is where three surfaces of the laminate 40 intersect, and a ridge is where two surfaces of the laminate 40 intersect. Furthermore, concavities and convexities may be formed on part or all of the surface constituting the laminate 40.

[0066] The dimensions of the laminate 40 are not particularly limited, but its longitudinal dimension L is preferably 0.2 mm or more and 10 mm or less. Furthermore, the height dimension T of the laminate 40 is preferably 0.1 mm or more and 10 mm or less. Furthermore, the width dimension W of the laminate 40 is preferably 0.1 mm or more and 10 mm or less.

[0067] The external electrode 50 includes a first external electrode 50A disposed on the first end surface 43 a side of the stacked body 40 and a second external electrode 50B disposed on the second end surface 43 b side of the stacked body 40 .

[0068] The first external electrode 50A is arranged so as to cover the entire first end surface 43a of the stack 40 and partially cover the first principal surface 41a, the second principal surface 41b, the first side surface 42a, and the second side surface 42b. The first external electrode 50A is connected to the plurality of internal electrode layers of the stack 40 on the first end surface 43a. The portion of the first external electrode 50A arranged on the first principal surface 41a is connected to a first externally bent terminal 61, described below.

[0069] The second external electrode 50B is arranged so as to cover the entire second end surface 43b of the stack 40 and partially cover the first principal surface 41a, the second principal surface 41b, the first side surface 42a, and the second side surface 42b. On the second end surface 43b, the second external electrode 50B is connected to the plurality of internal electrode layers of the stack 40 that are not connected to the first external electrode 50A. The portion of the second external electrode 50B arranged on the first principal surface 41a is connected to the second outer bent terminal 62, described below.

[0070] Capacitor characteristics are exhibited between the first external electrode 50A and the second external electrode 50B.

[0071] The external electrodes 50 (the first external electrode 50A and the second external electrode 50B) preferably have a structure in which a plating layer is formed on the surface of a base electrode layer consisting of a sintered layer connected to the internal electrode layer of the laminate 40 , for example.

[0072] The composition of the base electrode layer, which is a sintered layer, is not limited, but preferably includes, for example, a metal component and either a glass component or a ceramic component, or both. The metal component may include, for example, at least one selected from Cu, Ni, Ag, Pd, an Ag-Pd alloy, Au, and the like. The glass component may include, for example, at least one selected from B, Si, Ba, Mg, Al, Li, and the like. The ceramic component may be the same or a different type of ceramic material as that of the dielectric layer. The ceramic component may include, for example, at least one selected from BaTiO3, CaTiO3, (Ba,Ca)TiO3, SrTiO3, CaZrO3, and the like. The base electrode layer may also comprise multiple layers.

[0073] In addition, the base electrode layer is not limited to a sintered layer, and can also be a thin film layer in which metal particles are deposited, formed by a thin film forming method such as sputtering or evaporation. When the base electrode layer is a thin film layer, the metal preferably includes at least one selected from the group consisting of Mg, Al, Ti, W, Cr, Cu, Ni, Ag, Co, Mo, and V. In this way, the adhesion of the external electrode 50 to the stack 40 can be improved. The thin film layer can be a single layer or can be formed by multiple layers. For example, it can also be formed by a two-layer structure of a NiCr layer and a NiCu layer.

[0074] The plating layer may include, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, an Ag-Pd alloy, Au, etc. The plating layer may also be formed of multiple layers. The plating layer preferably has a two-layer structure in which a Sn plating layer is formed on a Ni plating layer.

[0075] In addition, the external electrode 50 of this embodiment may also include, for example, a conductive resin layer comprising conductive particles of metal powder containing Ag and a thermosetting resin such as an epoxy resin, phenolic resin, polyurethane resin, silicone resin, or polyimide resin. When a conductive resin layer is provided as the base electrode layer, the conductive resin layer may be arranged to cover the sintered layer, or it may be arranged directly on the laminate 40 without providing a sintered layer. When the conductive resin layer is arranged to cover the sintered layer, it is arranged between the sintered layer and the plating layer. The conductive resin layer may completely cover the sintered layer or may cover a portion of the sintered layer.

[0076] The conductive resin layer composed of a thermosetting resin is more flexible than conductive layers composed of, for example, a plated film or a fired product of a conductive paste. Therefore, even when physical shock or shock resulting from thermal cycling is applied to the first multilayer ceramic capacitor 1A, the conductive resin layer functions as a buffer layer. Consequently, the conductive resin layer suppresses cracking in the multilayer ceramic capacitor 1A.

[0077] The lengthwise dimension L of the multilayer ceramic capacitor body 30, including the laminated body 40 and the external electrodes 50, is preferably 0.2 mm to 10 mm. Furthermore, the heightwise dimension T of the multilayer ceramic capacitor body 30 is preferably 0.1 mm to 10 mm. Furthermore, the widthwise dimension W of the multilayer ceramic capacitor body 30 is preferably 0.1 mm to 10 mm.

[0078] like Figure 1A as well as Figure 1B As shown, the pair of first metal terminals 60A includes a first outwardly bent terminal 61 and a second outwardly bent terminal 62 .

[0079] The first and second outwardly bent terminals 61, 62 are metal terminals that are attached to the mounting surface of a mounting substrate on which the multilayer ceramic capacitor 1 is to be mounted. The first and second outwardly bent terminals 61, 62 are, for example, plate-shaped lead frames. Furthermore, the first principal surface 41a of the laminated body 40 of this embodiment faces the mounting surface of the mounting substrate on which the first multilayer ceramic capacitor 1A is to be mounted.

[0080] like Figure 1AAs shown, the first outwardly bent terminal 61 is bent in the height direction T of the multilayer ceramic capacitor body 30 and extends in a direction away from the multilayer ceramic capacitor body 30 in the longitudinal direction L. The first outwardly bent terminal 61 includes a first joining portion 71A that opposes and is connected to a portion of the first external electrode 50A disposed on the first main surface 41a side; a first rising portion 72A that is connected to the first joining portion 71A and extends away from the mounting surface of the mounting substrate while being away from the opposing first end surface 43a; a first extended portion 73A that is connected to the first rising portion 72A and extends away from the multilayer ceramic capacitor body 30 in the longitudinal direction L; a first descending portion 74A that is connected to the first extended portion 73A and extends toward the mounting surface of the mounting substrate; and a first mounting portion 75A that is connected to the first descending portion 74A and extends in a direction along the mounting surface of the mounting substrate.

[0081] The second outwardly bent terminal 62 is bent in the height direction T of the multilayer ceramic capacitor body 30 and extends in a direction away from the multilayer ceramic capacitor body 30 in the longitudinal direction L. The second outwardly bent terminal 62 includes a second joining portion 71B that opposes and is connected to a portion of the second external electrode 50B disposed on the first main surface 41a side; a second rising portion 72B that is connected to the second joining portion 71B and extends away from the mounting surface of the mounting substrate while separating from the opposing second end surface 43b; a second extended portion 73B that is connected to the second rising portion 72B and extends away from the multilayer ceramic capacitor body 30 in the longitudinal direction L; a second descending portion 74B that is connected to the second extending portion 73B and extends toward the mounting surface of the mounting substrate; and a second mounting portion 75B that is connected to the second descending portion 74B and extends in a direction along the mounting surface of the mounting substrate.

[0082] The first bonding portion 71A of the first outer bent terminal 61 and the second bonding portion 71B of the second outer bent terminal 62 are bonded together by a bonding material (not shown). This bonding material is not limited, but is preferably solder. For example, it can be lead-free solder. Examples of lead-free solders include Sn-Sb, Sn-Ag-Cu, Sn-Cu, and Sn-Bi. For example, Sn-10Sb to Sn-15Sb solders can be preferably used.

[0083] If the external electrode 50 has a plated layer, and the plated layer is a Ni plated layer, this is preferred because it can prevent the base electrode layer from being corroded by the solder used to join the multilayer ceramic capacitor body 30 and the first metal terminal 60A. Furthermore, a Sn plated layer is preferred because it improves the wettability of the solder used to join the multilayer ceramic capacitor body 30 and the first metal terminal 60A, thereby facilitating the joining of the multilayer ceramic capacitor body 30 and the first metal terminal 60A.

[0084] By using the first metal terminal 60A, namely the first outwardly bent terminal 61 and the second outwardly bent terminal 62, as the metal terminal 60, the distance between the mounting substrate and the multilayer ceramic capacitor body 30 can be increased, thereby alleviating stress from the mounting substrate. Furthermore, the thickness of the exterior packaging material 20 provided on the mounting substrate side can be increased, thereby ensuring insulation.

[0085] The exterior material 20 covers the multilayer ceramic capacitor body 30 and a portion of the pair of first metal terminals 60A.

[0086] The exterior material 20 is configured, for example, to cover the entire first joining portion 71A, the entire first rising portion 72A, and at least a portion of the first extension portion 73A of the first outwardly curved terminal 61. Furthermore, the exterior material 20 is configured, for example, to cover the entire second joining portion 71B, the entire second rising portion 72B, and at least a portion of the second extension portion 73B of the second outwardly curved terminal 62.

[0087] Furthermore, in this embodiment, the first extension portion 73A of the first outwardly curved terminal 61 partially protrudes from the first end surface 23a of the exterior material 20 and is exposed. The second extension portion 73B of the second outwardly curved terminal 62 partially protrudes from the second end surface 23b of the exterior material 20 and is exposed. More specifically, the first extension portion 73A of the first outwardly curved terminal 61 partially protrudes from the parting line PL of the first end surface 23a of the exterior material 20 and is exposed. The second extension portion 73B of the second outwardly curved terminal 62 partially protrudes from the parting line PL of the second end surface 23b of the exterior material 20 and is exposed.

[0088] The first main surface 21a of the exterior packaging material 20 is preferably a planar surface with a predetermined degree of flatness. This can prevent suction defects in the mounter used when mounting the multilayer ceramic capacitor 1 on a mounting substrate. Consequently, the first multilayer ceramic capacitor 1A can be reliably mounted on the mounting substrate, thereby preventing mounting defects.

[0089] The minimum distance from the second main surface 21b of the exterior packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 100 μm or more and 4000 μm or less. The minimum distance from the first main surface 21a of the exterior packaging material 20 to the first joint portion 71A of the first outwardly bent terminal 61 is preferably 100 μm or more and 4000 μm or less. The minimum distance from the first side surface 22a of the exterior packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 100 μm or more and 4000 μm or less. The minimum distance from the second side surface 22b of the exterior packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 100 μm or more and 4000 μm or less.

[0090] The minimum distance from the first end face 23a of the exterior packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 300 μm or more and 5000 μm or less. The minimum distance from the second end face 23b of the exterior packaging material 20 to the surface of the multilayer ceramic capacitor body 30 is preferably 300 μm or more and 5000 μm or less. The average distance in the longitudinal direction L from the surface 23c1 of the first end face 23a of the exterior packaging material 20 on the first principal surface 21a side to the first rising portion 72A of the first outwardly curved terminal 61 is preferably 200 μm or more and 4900 μm or less. The average distance in the longitudinal direction L from the surface 23c1 of the second end face 23b of the exterior packaging material 20 on the first principal surface 21a side to the second rising portion 72B of the second outwardly curved terminal 62 is preferably 200 μm or more and 4900 μm or less.

[0091] The exterior material 20 is preferably formed from a resin. For example, the exterior material 20 can be formed by molding engineering plastics using transfer molding, injection molding, or other methods. In particular, the exterior material 20 preferably includes a thermosetting epoxy resin. This ensures close contact between the exterior material 20, the multilayer ceramic capacitor body 30, and the first metal terminal 60A, improving withstand voltage and moisture resistance. The exterior material 20 can also be formed by applying, for example, a liquid or powdered silicone, epoxy, or other resin.

[0092] As described above, the exterior material 20 extensively covers the conductive metal portions such as the external electrodes 50 and the first metal terminal 60A, thereby ensuring a sufficient creepage distance (insulation surface distance) between the conductors. Furthermore, the extensive coverage of the conductive metal portions by the exterior material 20 prevents the risk of surface discharge.

[0093] The shape of the exterior material 20 is not particularly limited. For example, it may be a truncated cone such as a truncated pyramid. The shape of the corners of the exterior material 20 is not particularly limited and may be rounded.

[0094] The above is the structure of the first multilayer ceramic capacitor 1A according to the embodiment. Figure 2A as well as Figure 2B The second multilayer ceramic capacitor 1B shown in FIG. 1B is described below. As described above, the only difference between the second multilayer ceramic capacitor 1B and the first multilayer ceramic capacitor 1A is that the pair of metal terminals 60 are inwardly curved, unlike the outwardly curved shape of the first multilayer ceramic capacitor 1A. The exterior material 20 and the multilayer ceramic capacitor body 30, which are otherwise structured, are the same as those of the first multilayer ceramic capacitor 1A. Figure 2A as well as Figure 2B In the Figure 1A as well as Figure 1BComponents common to the first multilayer ceramic capacitor 1A (the exterior packaging material 20 and the multilayer ceramic capacitor body 30 ) are denoted by the same reference numerals and their description is omitted. Second metal terminals 60B, which are a pair of metal terminals 60 included in the second multilayer ceramic capacitor 1B, will be described.

[0095] Figure 2A It is a side view of the second multilayer ceramic capacitor 1B. Figure 2B yes Figure 2A The IIB arrow view is a top view of the second multilayer ceramic capacitor 1B. Figure 2A as well as Figure 2B As shown, the pair of second metal terminals 60B includes a first inward-bending terminal 65 and a second inward-bending terminal 66. The first inward-bending terminal 65 and the second inward-bending terminal 66 are metal terminals mounted on the mounting surface of the mounting substrate on which the multilayer ceramic capacitor 1 is to be mounted. The first inward-bending terminal 65 and the second inward-bending terminal 66 are, for example, plate-shaped lead frames.

[0096] like Figure 2A As shown, the first inwardly bent terminal 65 is bent in the height direction L of the multilayer ceramic capacitor body 30 , and the front end portion thereof is bent inward in the longitudinal direction L around the first main surface 21 a side of the exterior packaging material 20 . The first inwardly bent terminal 65 includes a first joining portion 81A facing and connected to a portion of the first external electrode 50A disposed on the first main surface 41a side; a first rising portion 82A connected to the first joining portion 81A and extending away from the mounting surface of the mounting substrate while separating from the opposing first end surface 43a; a first extended portion 83A connected to the first rising portion 82A and extending away from the multilayer ceramic capacitor body 30 in the longitudinal direction L; a first descending portion 84A connected to the first extended portion 83A and extending toward the mounting surface of the mounting substrate; and a first mounting portion 85A connected to the first descending portion 84A, bent to face the first main surface 21a of the exterior packaging material 20, and extending in a direction along the mounting surface of the mounting substrate. The first descending portion 84A extends toward the mounting surface in a direction substantially perpendicular to the mounting surface. The first mounting portion 85A extends along the mounting surface toward the center side in the longitudinal direction L of the multilayer ceramic capacitor body 30 , that is, toward the inner side.

[0097] The second inwardly bent terminal 66 is bent in the height direction T of the multilayer ceramic capacitor body 30 , and its front end portion is bent inward in the longitudinal direction L around the first main surface 21 a side of the exterior packaging material 20 . The second inwardly bent terminal 66 includes a second joining portion 81B that faces and is connected to a portion of the second external electrode 50B disposed on the first principal surface 41a side; a second rising portion 82B that is connected to the second joining portion 81B and extends away from the mounting surface of the mounting substrate while separating from the opposing second end surface 43b; a second extended portion 83B that is connected to the second rising portion 82B and extends away from the multilayer ceramic capacitor body 30 in the longitudinal direction L; a second descending portion 84B that is connected to the second extended portion 83B and extends toward the mounting surface of the mounting substrate; and a second mounting portion 85B that is connected to the second descending portion 84B and is bent to face the first principal surface 21a of the exterior packaging member 20 and extends in a direction along the mounting surface of the mounting substrate. The second descending portion 84B extends toward the mounting surface in a direction substantially perpendicular to the mounting surface. The second mounting portion 85B extends along the mounting surface toward the center side in the longitudinal direction L of the multilayer ceramic capacitor body 30 , that is, toward the inner side.

[0098] According to the second multilayer ceramic capacitor 1B having a pair of inward-curved second metal terminals 60B, the overall length L dimension is shortened. Therefore, the mounting area required when mounting the second multilayer ceramic capacitor 1B on a mounting substrate can be reduced, thereby achieving space saving.

[0099] Furthermore, the first mounting portion 85A and the second mounting portion 85B can extend parallel to the mounting surface, but can also extend obliquely, separating from the mounting surface as they move toward the center in the longitudinal direction L of the multilayer ceramic capacitor body 30. In this case, when mounting the second multilayer ceramic capacitor 1B on the mounting substrate, solder or other bonding material can be introduced into these portions, thereby improving assembly strength. Furthermore, the second multilayer ceramic capacitor 1B can be stably positioned on the mounting surface of the mounting substrate.

[0100] The above describes the first and second multilayer ceramic capacitors 1A and 1B as multilayer ceramic capacitors 1 according to the embodiment. In both the first and second multilayer ceramic capacitors 1A and 1B of the embodiment, a single multilayer ceramic capacitor body 30 is housed within the exterior material 20 to form the main body 10. However, the main body 10 is not limited to this. For example, multiple multilayer ceramic capacitor bodies 30 may be housed within the exterior material 20 to form the main body 10. For example, multiple multilayer ceramic capacitor bodies 30 may be housed within the exterior material 20 in a parallel arrangement. Alternatively, multiple multilayer ceramic capacitor bodies 30 may be housed within the exterior material 20 in a stacked state of two or more layers.

[0101] Next, refer to Figures 3A to 6 A characteristic measurement apparatus 100 according to an embodiment for measuring the characteristics of the first and second multilayer ceramic capacitors 1A, 1B according to the above-described embodiment will be described. In the following description, when there is no need to specifically distinguish between the first and second multilayer ceramic capacitors 1A, 1B, they are collectively referred to as the multilayer ceramic capacitor 1, and the first and second metal terminals 60A, 60B are also collectively referred to as the metal terminals 60.

[0102] Figure 3A as well as Figure 3B 1 is a front view showing the main parts of the characteristic measurement device 100 according to the embodiment. Figure 3A Shows the measurement standby state, Figure 3B The measurement status is shown. Figure 4 1 is a perspective view showing a state in which a pressing portion 500 described later is removed from the characteristic measuring apparatus 100. Figure 5 This is its top view. Figure 6 yes Figure 5 The enlarged view of the portion shown in VI is a top view showing the measurement state. Figures 3A to 6 In FIG. 1 , the length direction of the characteristic measuring device 100 is indicated by arrow X, the width direction perpendicular to the length direction X is indicated by arrow Y, and the height direction (vertical direction) perpendicular to the length direction X and the width direction Y is indicated by arrow Z. Figure 5 As shown, the characteristic measurement apparatus 100 has a bilaterally symmetrical structure with the center line CL in the width direction Y as a symmetry line. In addition, hereinafter, the width direction Y may be referred to as the left-right direction.

[0103] like Figure 3A as well as Figure 3B As shown, the characteristic measuring apparatus 100 includes: a base 110; a housing portion 200 for housing a multilayer ceramic capacitor 1; a measuring portion 300 including a pair of measuring probes 400 arranged on both sides of the housing portion 200 in the width direction Y; and a pressing portion 500 for pressing the multilayer ceramic capacitor 1 housed in the housing portion from above.

[0104] The base 110 includes a base plate 120 disposed substantially horizontally, a central table 130 disposed at the center of the base plate 120 in the width direction Y, and a pair of left and right first slider bases 141 and second slider bases 142 disposed on both sides of the base plate 120 in the width direction Y. A convex receiving block 150 is disposed on the central table 130.

[0105] like Figure 4 as well as Figure 5As shown, a plurality of the receiving portions 200 are provided on the receiving block 150. The plurality of receiving portions 200 are adjacently arranged in parallel in the longitudinal direction X.

[0106] The housing portion 200 accommodates a single multilayer ceramic capacitor 1. The multilayer ceramic capacitor 1 is housed in the housing portion 200 with its longitudinal direction L aligned with the width direction Y of the characteristic measurement apparatus 100, its width direction W aligned with the longitudinal direction X of the characteristic measurement apparatus 100, and its height direction T aligned with the height direction Z of the characteristic measurement apparatus 100. The housing portion 200 is open at the top, and the multilayer ceramic capacitor 1 is dropped into the housing portion 200 through the opening and housed therein. The first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B are both housed in the housing portion 200 with their first principal surfaces 21a facing downward.

[0107] like Figure 4 as well as Figure 5 As shown, the receiving portion 200 includes a rectangular frame-shaped partition wall 210 standing on the upper surface of the receiving block 150. Inside the partition wall 210, a rectangular receiving space for receiving one multilayer ceramic capacitor 1 is formed.

[0108] like Figure 5 As shown, the partition wall 210 includes a pair of end wall portions 220 that face each other in the width direction Y and a pair of side wall portions 230 that face each other in the length direction X. An end notch 221 is formed at the center of each of the pair of end wall portions 220, extending through the width direction Y and open at the top. A side notch 231 is formed at the center of each of the pair of side wall portions 230, extending through the length direction X and open at the top.

[0109] The accommodating portion 200 includes a bottom surface 240 formed by the upper surface of the accommodating block 150. The bottom surface 240 is a substantially horizontal surface and supports the multilayer ceramic capacitor 1 in a substantially horizontal state, facing the first main surface 21a arranged on the lower side of the multilayer ceramic capacitor 1. The bottom surface 240 has a groove-shaped slit 241 as a recess extending in the longitudinal direction X. The slit 241 has a size that extends across the entire length of the multilayer ceramic capacitor 1 accommodated in the accommodating portion 200 in the width direction W. The slit 241 of the accommodating portion 200 of the embodiment is continuous in the parallel direction of the plurality of accommodating portions 200. That is, a single slit 242 extending along the longitudinal direction X is formed on the upper surface of the accommodating block 150, and this single slit 242 constitutes the slit 241 of each accommodating portion 200.

[0110] like Figure 4 as well as Figure 5As shown, the adjacent receiving portions 200 in the longitudinal direction X share a common side wall portion 230 . That is, one side wall portion 230 constitutes both side walls 230 . Therefore, the internal spaces of the adjacent receiving portions 200 are connected via the side notches 231 .

[0111] On the outer side of the width direction Y of the common side wall portion 230 of the adjacent housing portions 200, which is a side separated from the housing portion 200, a partition wall 250 extending along the width direction Y is formed. These partition walls 250 are erected on the upper surface of the housing block 150 in a continuous manner along the extension line from the side wall portion 230 toward the outer side in the width direction Y. The partition walls 250 are included in Figure 4 as well as Figure 5 The left side in the width direction Y and the first partition wall 251 on the side of the first slider 351 described later and Figure 4 as well as Figure 5 The middle portion is the second partition wall 252 on the right side in the width direction Y and on the side of the second slider 352 to be described later.

[0112] A portion of the metal terminals 60 of the multilayer ceramic capacitor 1 housed in the housing 200, which are exposed from the exterior packaging material 20, is exposed outward in the width direction W from the end notch 221. This allows the measurement probe 400, described later, to contact the metal terminals 60. The partition wall 250 is exposed in this manner and is positioned between a pair of adjacent metal terminals 60 in the longitudinal direction X. Specifically, the partition wall 250 isolates the metal terminals 60 of the multilayer ceramic capacitors 1 housed in adjacent housings 200 in the longitudinal direction X from each other in the direction in which the adjacent housings 200 are arranged.

[0113] When the first multilayer ceramic capacitor 1A is respectively accommodated in a pair of adjacent accommodating portions 200 in the longitudinal direction X, the first outwardly bent terminals 61 adjacent in the longitudinal direction X are isolated from each other in the parallel direction by the first partition wall 251, and the second outwardly bent terminals 62 adjacent in the longitudinal direction X are isolated from each other in the parallel direction by the second partition wall 252.

[0114] When the second multilayer ceramic capacitor 1B is respectively accommodated in a pair of adjacent accommodating portions 200 in the longitudinal direction X, the first inwardly bent terminals 65 adjacent in the longitudinal direction X are isolated from each other in the parallel direction by the first partition wall 251, and the second inwardly bent terminals 66 adjacent in the longitudinal direction X are isolated from each other in the parallel direction by the second partition wall 252.

[0115] When the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B are accommodated in a pair of adjacent accommodating portions 200 in the longitudinal direction X, the first outer bend terminal 61 and the first inner bend terminal 65 adjacent in the longitudinal direction X are isolated from each other in the parallel direction by the first partition wall 251, and the second outer bend terminal 62 and the second inner bend terminal 66 adjacent in the longitudinal direction X are isolated from each other in the parallel direction by the second partition wall 252.

[0116] The measuring section 300 includes a pair of measuring probes 400 that respectively contact a pair of metal terminals 60 of the multilayer ceramic capacitor 1 accommodated in the accommodating section 200 , and a pair of sliders 350 that allow the measuring probes 400 to move forward and backward relative to the metal terminals 60 .

[0117] The slider 350 includes a first slider 351 disposed on the first slider base 141 and a second slider 352 disposed on the second slider base 142. The pair of measuring probes 400 includes a first measuring probe 410 provided on the first slider 351 and a second measuring probe 420 provided on the second slider 352.

[0118] The first slider 351 is supported on the first slider base 141 via a sliding block 351a integrally fixed to its lower side so as to be slidable in the width direction Y. This allows the first slider 351 to advance or retract relative to the accommodating block 150, which includes a plurality of accommodating portions 200. The first slider 351 has a plurality of first measurement probes 410 built into it, corresponding to the accommodating portions 200 and extending generally along the width direction Y.

[0119] The first measuring probes 410 have first front contact portions 411 serving as front contact portions and first rear connection portions 412 serving as rear connection portions. The first front contact portions 411 of the first measuring probes 410 protrude from the front end in the entry direction of the first slider 351 toward the housing block 150. The plurality of first measuring probes 410 advance and retract relative to the corresponding housings 200, aligned with each first slider 351. During the forward movement of the first measuring probes 410, they face the metal terminals 60 of the multilayer ceramic capacitors 1 housed in the housings 200, and the first front contact portions 411 contact the facing metal terminals 60, enabling measurement.

[0120] The entry stroke of the first measuring probe 410 by the first slider 351 is set so that the first front contact portion 411 reliably contacts the metal terminal 60 of the multilayer ceramic capacitor 1. Furthermore, the first measuring probe 410 is supported by a spring (not shown) so that even if the distance between the metal terminal 60 and the first front contact portion 411 varies due to the shape of the metal terminal 60, the distance is absorbed and the first front contact portion 411 elastically contacts the metal terminal 60. Figure 5 as well as Figure 6 As shown, the first slider 351 has a first groove-shaped recess 351c on its opposite surface facing each first partition wall 251, so that when the first slider 351 is measured to enter the accommodating portion 200, each first partition wall 251 drills into the recess to allow the first slider 351 to enter.

[0121] At the end of the first slider 351 on the side in the backward direction, which separates from the accommodating block 150, a plurality of first grooves 355 are provided, corresponding to the plurality of first measuring probes 410. The first rear end connection portions 412 of the first measuring probes 410 are arranged in the first grooves 355. The first grooves 355 are open in the backward direction and upward of the first slider 351. The plurality of first grooves 355 are separated in the parallel direction of the plurality of first measuring probes 410 by a plurality of first rear wall portions 355A integral with the first slider 351. The first rear end connection portions 412 of the first measuring probes 410 are connected to wiring (not shown). Such wiring includes, for example, wiring for power supply and wiring for measurement signals. The first rear end connection portion 412 is arranged in the first grooves 355. The first rear wall portion 355A that separates adjacent first groove portions 355 from each other among the plurality of first rear wall portions 355A constitutes a first shielding wall 355B serving as a shielding wall that isolates a pair of first rear end connecting portions 412 adjacent in the parallel direction from each other in the parallel direction.

[0122] The second slider 352 is supported on the second slider base 142 via a sliding block 352a integrally fixed to its lower side so as to be slidable in the width direction Y. Thus, the second slider 352 advances or retracts relative to the accommodating block 150, which includes a plurality of accommodating portions 200. The second slider 352 has a plurality of second measurement probes 420 built into it, corresponding to the plurality of accommodating portions 200 and extending generally along the width direction Y.

[0123] The second measuring probes 420 have a second front contact portion 421 serving as a front contact portion and a second rear connection portion 422 serving as a rear connection portion. The second front contact portion 421 of the second measuring probes 420 protrudes from the front end in the entry direction of the second slider 352 toward the housing block 150. The plurality of second measuring probes 420 advance and retract relative to the corresponding housings 200, aligned with each second slider 352. During the forward movement of the second measuring probes 420, they come into contact with the metal terminals 60 of the multilayer ceramic capacitors 1 housed in the housings 200. The second front contact portions 421 contact the opposing metal terminals 60, enabling measurement.

[0124] The entry stroke of the second measuring probe 420 by the second slider 352 is set so that the second front end contact portion 421 reliably contacts the metal terminal 60 of the multilayer ceramic capacitor 1. Furthermore, the second measuring probe 420 is supported by a spring (not shown) so that even if the distance between the metal terminal 60 and the second front end contact portion 421 varies due to the shape of the metal terminal 60, the distance is absorbed and the second front end contact portion 421 elastically contacts the metal terminal 60. Figure 5 as well as Figure 6 As shown, the second slider 352 has a second groove-shaped recess 352c on its opposite surface facing each second partition wall 252, so that when the second slider 352 is measured to enter the accommodating portion 200, each second partition wall 252 drills into it to allow the second slider 352 to enter.

[0125] At the end of the second slider 352 on the side in the backward direction, which separates from the accommodating block 150, a plurality of second grooves 357 are provided, corresponding to the plurality of second measuring probes 420. The second rear end connection portions 422 of the second measuring probes 420 are arranged in the second grooves 357. The second grooves 357 are open in the backward direction and upward of the second slider 352. The plurality of second grooves 357 are separated in the parallel direction of the plurality of second measuring probes 420 by a plurality of second rear walls 357A integral with the second slider 352. The second rear end connection portions 422 of the second measuring probes 420 are connected to wiring (not shown). Such wiring includes, for example, wiring for power supply and wiring for measurement signals. The second rear end connection portion 422 is arranged within the second grooves 357. The second rear wall portions 357A that separate adjacent second groove portions 357 among the plurality of second rear wall portions 357A constitute second shielding walls 357B that serve as shielding walls that isolate a pair of second rear end connecting portions 422 adjacent in the parallel direction from each other in the parallel direction.

[0126] like Figure 3A as well as Figure 3B As shown, the pressing portion 500 is vertically movable above the housing portion 200. That is, the pressing portion 500 is arranged to face the upper second main surface 21b of the multilayer ceramic capacitor 1 housed in the housing portion 200 so as to be movable forward and backward.

[0127] The pressing portion 500 includes a pressing pin 510 for pressing the multilayer ceramic capacitor 1 accommodated in the accommodation portion 200 from above. The pressing pin 510 is provided for each of the multiple accommodation portions 200. Multiple pressing pins 510 are provided on the lower end surface of the vertical moving head 520. The vertical moving head 520 is driven up and down by a driving portion 530 composed of a cylinder or the like. Therefore, the multiple pressing pins 510 are moved up and down together via the vertical moving head 520 by the driving portion 530. When the vertical moving head 520 descends, the pressing pin 510 contacts the second main surface 21b of the outer packaging material 20 facing upward of the multilayer ceramic capacitor 1 accommodated in the accommodation portion 200, and presses the outer packaging material 20 downward from the second main surface 21b. The pressing pin 510 can also press the outer packaging material 20 downward with a slight pressing force.

[0128] The characteristic measurement apparatus 100 of the embodiment includes a plurality of housing sections 200 arranged side by side in the longitudinal direction X. Each of these housing sections 200 is equipped with a pair of measuring probes 400 (a first measuring probe 410 and a second measuring probe 420) of the measuring section 300 and a pressing pin 510 of the pressing section 500. In the embodiment, a single housing section 200, the first and second measuring probes 410, 420 assigned to this single housing section 200, and a single pressing pin 510 constitute a single measurement system 600. Therefore, the characteristic measurement apparatus 100 of the embodiment includes a plurality of measurement systems 600 arranged side by side in the longitudinal direction X.

[0129] The above is the structure of characteristic measurement apparatus 100 according to the embodiment. With characteristic measurement apparatus 100, the characteristics of multilayer ceramic capacitor 1 can be measured as follows. The measured characteristics include dielectric loss tangent and withstand voltage, which are measured by applying voltage, but are not limited to these.

[0130] First, if Figure 3A As shown, the first slider 351 and the second slider 352 are retracted from the receiving block 150 to the outside in the width direction W, thereby setting the measuring section 300 to a standby state in which the first measuring probe 410 and the second measuring probe 420 are separated from the receiving section 200. Figure 3A As shown, the vertical moving head 520 is moved upward from the receiving block 150 , so that the pressing portion 500 is set to a standby state in which the pressing pin 510 is separated upward from the receiving portion 200 .

[0131] In the standby state, the multilayer ceramic capacitors 1 are housed in the plurality of housing sections 200. The multilayer ceramic capacitors 1 are placed on the bottom surfaces 240 of the housing sections 200 with the first main surfaces 21a of the exterior packaging material 20 facing downward, thereby being supported by the bottom surfaces 240. A portion of the metal terminal 60 is exposed outward in the width direction W from the end notches 221 of the end wall section 220.

[0132] Next, the vertical moving head 520 is lowered, causing the pressing pin 510 to enter the housing 200 and contact the multilayer ceramic capacitor 1. The pressing pin 510 contacts the upward-facing second main surface 21b of the exterior packaging material 20, thereby preventing the exterior packaging material 20 from moving upward or horizontally. This holds the multilayer ceramic capacitor 1 in the housing 200.

[0133] Next, the first slider 351 and the second slider 352 are moved to the measuring position toward the receiving block 150 , and the first measuring probe 410 and the second measuring probe 420 are brought into contact with the pair of metal terminals 60 of the multilayer ceramic capacitor 1 , thereby establishing a measuring state. Figure 3B as well as Figure 6 The measurement status is shown in FIG. Figure 6 As shown, the first partition wall 251 is bored into the first groove-shaped recess 351 c of the first slider 351 , and the first partition wall 252 is bored into the second groove-shaped recess 352 c of the second slider 352 .

[0134] When the multilayer ceramic capacitor 1 accommodated in the accommodation portion 200 is the first multilayer ceramic capacitor 1A, the first tip contact portion 411 of the first measuring probe 410 contacts the outer surface of the first outwardly curved terminal 61 of the first metal terminal 60A, and the second tip contact portion 421 of the second measuring probe 420 contacts the outer surface of the second outwardly curved terminal 62 of the first metal terminal 60A. For example, the first tip contact portion 411 contacts the first descending portion 74A of the first outwardly curved terminal 61, and the second tip contact portion 421 contacts the second descending portion 74B of the second outwardly curved terminal 62.

[0135] When the multilayer ceramic capacitor 1 accommodated in the accommodation portion 200 is the second multilayer ceramic capacitor 1B, the first tip contact portion 411 of the first measuring probe 410 contacts the outer surface of the first inwardly bent terminal 65 of the second metal terminal 60B, and the second tip contact portion 421 of the second measuring probe 420 contacts the outer surface of the second inwardly bent terminal 66 of the second metal terminal 60B. For example, the first tip contact portion 411 contacts the first descending portion 84A of the first inwardly bent terminal 65, and the second tip contact portion 421 contacts the second descending portion 84B of the second inwardly bent terminal 66.

[0136] Measurement is performed by applying a predetermined measurement voltage to the multilayer ceramic capacitor 1 from the first and second measurement probes 410, 420 using a predetermined measuring instrument. The measurement signal is fed back to the measuring instrument via the first and second measurement probes 410, 420. When the measurement is completed, the first and second sliders 351, 352 are retracted from the accommodating block 150, returning the measurement unit 300 to the standby state. The first and second measurement probes 410, 420 are then separated from the multilayer ceramic capacitor 1.

[0137] Next, the vertical moving head 520 is raised and returned to the standby state, and the pressing pin 510 is separated upward from the accommodating portion 200 .

[0138] When there is a new multilayer ceramic capacitor 1 to be measured, the multilayer ceramic capacitor 1 is housed in the housing portion 200 and the above-mentioned measurement process is performed in the same manner.

[0139] According to the characteristic measurement apparatus 100 of the embodiment, a plurality of measurement systems 600 including the housing portion 200 are provided, and therefore, a plurality of types of multilayer ceramic capacitors 1, namely, the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B in the embodiment, can be measured continuously or simultaneously, and these multilayer ceramic capacitors 1A and 1B can be manufactured.

[0140] That is, here, Figure 6 As shown in FIG. 6 , at least one of the plurality of measurement systems 600 is set as a first measurement system 610, and at least one of the other measurement systems 600 is set as a second measurement system 620. Figure 6 Specifically, two first measurement systems 610 and one second measurement system 620 are set. First multilayer ceramic capacitor 1A is accommodated in housing 200 of first measurement system 610, and second multilayer ceramic capacitor 1B is accommodated in housing 200 of second measurement system 620. Subsequently, through the aforementioned measurement process, first multilayer ceramic capacitor 1A is measured in first measurement system 610, and second multilayer ceramic capacitor 1B is measured in second measurement system 620.

[0141] Here, if the first measurement process involves bringing the pair of measurement probes 400 into contact with the pair of first metal terminals 60A of the first multilayer ceramic capacitor 1A in the first measurement system 610, and the second measurement process involves bringing the pair of measurement probes 400 into contact with the pair of second metal terminals 60B of the second multilayer ceramic capacitor 1B in the second measurement system 620, the first and second measurement processes can be performed continuously or simultaneously. This allows different types of multilayer ceramic capacitors 1A and 1B to be measured and manufactured without requiring production adjustments to change settings depending on the type of multilayer ceramic capacitor 1.

[0142] According to the embodiment described above, the following effects are achieved.

[0143] (1) A characteristic measuring device 100 according to an embodiment is a measuring device for measuring the characteristics of a multilayer ceramic capacitor 1 as a multilayer ceramic electronic component. The multilayer ceramic capacitor 1 includes a main body 10 having a substantially rectangular parallelepiped shape and a pair of metal terminals 60. The main body 10 has a pair of main surfaces 21 facing each other in a height direction T, a pair of side surfaces 22 facing each other in a width direction W, and a pair of end surfaces 23 facing each other in a length direction L. The pair of metal terminals 60 are respectively arranged on the outer sides of the pair of end surfaces 23. The characteristic measuring device 100 includes at least one measuring system 600. The measuring system 600 includes: a housing 200 for housing the multilayer ceramic capacitor 1 so as to A pair of main surfaces 21 are respectively arranged on the upper side and the lower side and are in a state where the longitudinal direction L and the width direction W are both approximately horizontal; a measuring portion 300 includes a pair of measuring probes 400, which are respectively arranged to be able to advance and retreat relative to a pair of metal terminals 60 of the stacked ceramic capacitor 1 accommodated in the accommodating portion 200, and when entering, they contact the metal terminals 60 they are facing; and a pressing portion 500, which is arranged to be able to advance and retreat relative to the second main surface 21b arranged on the upper side of the stacked ceramic capacitor 1 accommodated in the accommodating portion 200, and when entering, it contacts the second main surface 21b on the upper side it is facing and presses the stacked ceramic capacitor 1 from the second main surface 21b.

[0144] According to the characteristic measurement apparatus 100 of the embodiment, when the pair of measuring probes 400 are brought into contact with the metal terminals 60 of the multilayer ceramic capacitor 1 to measure characteristics, the multilayer ceramic capacitor 1 is pressed by the pressing pins 510 of the pressing portion 500, thereby being held in the housing 200. Therefore, the multilayer ceramic capacitor 1 can be stably held in the housing 200. If the multilayer ceramic capacitor 1 were not pressed by the pressing pins 510 of the pressing portion 500, then in this state, when the pair of measuring probes 400 contact the metal terminals 60, the multilayer ceramic capacitor 1 would move, for example, bounce upward, due to the pressing force from the measuring probes 400, potentially causing the measuring probes 400 to fail to reliably contact the metal terminals 60. However, according to the characteristic measurement apparatus 100 of the embodiment, when the measuring probes 400 contact the metal terminals 60 of the multilayer ceramic capacitor 1, they are pressed by the pressing pins 510, restricting their movement. Therefore, there is no risk of movement of the multilayer ceramic capacitor 1 causing contact failure of the measuring probes 400. Therefore, the measurement can be performed stably.

[0145] (2) In the characteristic measurement apparatus 100 according to the embodiment, the housing portion 200 preferably includes a bottom surface 240 that supports the multilayer ceramic capacitor 1 while facing the first main surface 21 a disposed on the lower side, and the bottom surface 240 has a slit 241 as a recessed portion that extends over at least the entire length in the width direction W of the multilayer ceramic capacitor 1 housed in the housing portion 200.

[0146] Thus, the multilayer ceramic capacitor 1 can lengthen the substantial creepage distance between the pair of metal terminals 60 when housed in the housing portion 200 , and thereby suppress discharge between the pair of metal terminals 60 .

[0147] (3) In the characteristic measurement apparatus 100 according to the embodiment, preferably, a plurality of measurement systems 600 are provided. In the plurality of measurement systems 600, the housing portions 200 are adjacently arranged so that the multilayer ceramic capacitors 1 housed in the housing portions 200 are arranged side by side in the width direction W, and the plurality of measurement systems 600 have partition walls 250 that isolate the metal terminals 60 of the multilayer ceramic capacitors 1 housed in adjacent housing portions 200 from each other in the direction in which the adjacent housing portions 200 are arranged side by side.

[0148] This can suppress discharge between the metal terminals 60 of adjacent multilayer ceramic capacitors 1 .

[0149] (4) In the characteristic measuring device 100 according to the embodiment, preferably, the first measuring probe 410 as the measuring probe 400 includes a first front end contact portion 411 and a first rear end connection portion 412 that are in contact with the metal terminal 60, and the second measuring probe 420 as the measuring probe 400 includes a second front end contact portion 421 and a second rear end connection portion 422 that are in contact with the metal terminal 60, and has a first shielding wall 355B that isolates a pair of first rear end connection portions 412 adjacent to each other in the parallel direction from each other in the parallel direction, and has a second shielding wall 357B that isolates a pair of second rear end connection portions 422 adjacent to each other in the parallel direction from each other in the parallel direction.

[0150] This can suppress discharge between the first rear end connecting portions 412 and the second rear end connecting portions 422 of the adjacent multilayer ceramic capacitors 1 .

[0151] (5) Regarding a method for manufacturing a multilayer ceramic capacitor according to an embodiment, in the method, a first multilayer ceramic capacitor 1A having a pair of metal terminals 60 serving as first metal terminals 60A and a second multilayer ceramic capacitor 1B having a pair of metal terminals 60 serving as second metal terminals 60B are prepared as multilayer ceramic capacitors, and the first multilayer ceramic capacitor 1A and the second multilayer ceramic capacitor 1B are measured using a characteristic measurement apparatus 100 according to the embodiment, wherein at least one of a plurality of measurement systems 600 of the characteristic measurement apparatus 100 is set as a first measurement system 610, and measurement systems other than the first measurement system 610 are set as At least one of 600 is set as a second measuring system 620, and the manufacturing method of the multilayer ceramic capacitor comprises: a first measuring process, in which the first multilayer ceramic capacitor 1A is accommodated in the accommodation portion 200 of the first measuring system 610, and a pair of measuring probes 400 of the first measuring system 610 are respectively brought into contact with a pair of first metal terminals 60A; and a second measuring process, in which the second multilayer ceramic capacitor 1B is accommodated in the accommodation portion 200 of the second measuring system 620, and a pair of measuring probes 400 of the second measuring system 620 are respectively brought into contact with a pair of second metal terminals 60B, and the first measuring process and the second measuring process are performed continuously or simultaneously.

[0152] This allows measurement and manufacture of different types of multilayer ceramic capacitors 1A, 1B without performing production adjustments to change settings according to the multiple types of multilayer ceramic capacitors 1A, 1B.

[0153] Furthermore, in an embodiment, as Figure 6As shown, during measurement, the first partition wall 251 penetrates the first groove-shaped recess 351c of the first slider 351, and the second partition wall 252 penetrates the second groove-shaped recess 352c of the second slider 352. Consequently, a pair of adjacent first measuring probes 410 in the longitudinal direction X are isolated from each other by the first partition wall 251 and the first slider 351, thereby suppressing discharge between these first measuring probes 410. Furthermore, a pair of adjacent second measuring probes 420 in the longitudinal direction X are isolated from each other by the second partition wall 252 and the second slider 352, thereby suppressing discharge between these second measuring probes 420.

[0154] Although the embodiment has been described above, the present disclosure is not limited to the embodiment and can be implemented in various forms within the scope not departing from the gist of the present disclosure.

[0155] In the above embodiment, a laminated ceramic capacitor using dielectric ceramics is exemplified as a laminated ceramic electronic component. However, the laminated ceramic electronic component of the present disclosure is not limited to this application and can also be applied to various laminated ceramic electronic components, such as piezoelectric components using piezoelectric ceramics, thermistors using semiconductor ceramics, and inductors using magnetic ceramics. Examples of piezoelectric ceramics include PZT (lead zirconate titanate) ceramics, semiconductor ceramics include spinel ceramics, and magnetic ceramics include ferrites.

[0156] The present disclosure includes the following combinations. [1]

[0158] A device for measuring the characteristics of a multilayer ceramic electronic component is provided. The device is used to measure the characteristics of the multilayer ceramic electronic component. The multilayer ceramic electronic component includes a main body portion having a substantially rectangular parallelepiped shape and a pair of metal terminals. The main body portion has a pair of main surfaces opposing each other in the height direction, a pair of side surfaces opposing each other in the width direction, and a pair of end surfaces opposing each other in the length direction. The pair of metal terminals are respectively arranged on the outer sides of the pair of end surfaces.

[0159] The characteristic measuring apparatus of the multilayer ceramic electronic component includes at least one measuring system, wherein the measuring system includes:

[0160] a housing portion for housing the multilayer ceramic electronic component in a state in which the pair of main surfaces are arranged on an upper side and a lower side, respectively, and the longitudinal direction and the width direction are both substantially horizontal;

[0161] a measuring portion including a pair of measuring probes, each of the pair of measuring probes being arranged to be able to advance and retreat relative to a pair of the metal terminals of the multilayer ceramic electronic component housed in the housing portion, and contacting the metal terminals to which the pair of measuring probes are opposed when entering the housing portion; and

[0162] The pressing portion is arranged to be able to advance and retreat relative to the main surface arranged on the upper side of the multilayer ceramic electronic component accommodated in the accommodation portion, and when entering, it contacts the main surface on the upper side to which it is opposed and presses the multilayer ceramic electronic component from this main surface. [2]

[0164] According to the characteristic measuring device of the laminated ceramic electronic component described in [1],

[0165] The housing portion includes a bottom surface facing the main surface arranged on the lower side and supporting the multilayer ceramic electronic component.

[0166] The bottom surface has a recessed portion extending over at least the entire width direction of the multilayer ceramic electronic component accommodated in the accommodation portion. [3]

[0168] The characteristic measuring device of the multilayer ceramic electronic component according to [1] or [2], wherein:

[0169] having a plurality of the measurement systems,

[0170] In a plurality of the measurement systems, the housings are arranged adjacent to each other so that the multilayer ceramic electronic components housed in the housings are aligned in the width direction.

[0171] The device includes partition walls that isolate the metal terminals of the multilayer ceramic electronic components housed in adjacent housing portions from each other in a parallel direction of the adjacent housing portions. [4]

[0173] According to the characteristic measuring device of the laminated ceramic electronic component described in [3],

[0174] The measuring probe includes a front contact portion that contacts the metal terminal and a rear connection portion that is connected to the wiring.

[0175] The invention comprises a shielding wall for isolating a pair of the rear end connecting portions adjacent to each other in the parallel direction from each other in the parallel direction. [5]

[0177] A method for manufacturing a laminated ceramic electronic component, wherein a pair of first laminated ceramic electronic components, each of which has a first metal terminal, and a pair of second laminated ceramic electronic components, each of which has a second metal terminal, are prepared as the laminated ceramic electronic components, and the first and second laminated ceramic electronic components are measured using the laminated ceramic electronic component characteristic measuring apparatus described in [3] or [4], wherein:

[0178] at least one of the plurality of measurement systems is set as a first measurement system, and at least one of the measurement systems other than the first measurement system is set as a second measurement system,

[0179] The method for manufacturing a multilayer ceramic electronic component comprises:

[0180] a first measuring step of accommodating the first multilayer ceramic electronic component in the accommodating portion of the first measuring system and bringing a pair of measuring probes of the first measuring system into contact with a pair of first metal terminals, respectively; and

[0181] The second measuring step comprises accommodating the second multilayer ceramic electronic component in the accommodating portion of the second measuring system and bringing the pair of measuring probes of the second measuring system into contact with the pair of second metal terminals, respectively.

[0182] The first measurement step and the second measurement step are performed continuously or simultaneously.

Claims

1. A device for measuring the characteristics of a multilayer ceramic electronic component, the device being used to measure the characteristics of the multilayer ceramic electronic component, the multilayer ceramic electronic component comprising a substantially rectangular parallelepiped main body and a pair of metal terminals, the main body having a pair of main surfaces opposing each other in the height direction, a pair of side surfaces opposing each other in the width direction, and a pair of end surfaces opposing each other in the length direction, the pair of metal terminals being respectively arranged on the outer sides of the pair of end surfaces, wherein: The characteristic measuring apparatus of the multilayer ceramic electronic component includes at least one measuring system, wherein the measuring system includes: a housing portion for housing the multilayer ceramic electronic component in a state in which the pair of main surfaces are arranged on an upper side and a lower side, respectively, and the longitudinal direction and the width direction are both substantially horizontal; a measuring portion including a pair of measuring probes, each of the pair of measuring probes being arranged to be able to advance and retreat relative to a pair of metal terminals of the multilayer ceramic electronic component housed in the housing portion, and contacting the metal terminals when entering the housing portion; as well as The pressing portion is arranged to be able to advance and retreat relative to the main surface of the multilayer ceramic electronic component accommodated in the accommodation portion. When entering, it contacts the main surface on the upper side and presses the multilayer ceramic electronic component from the main surface.

2. The characteristic measuring apparatus for a multilayer ceramic electronic component according to claim 1, wherein The housing portion includes a bottom surface facing the main surface arranged on the lower side and supporting the multilayer ceramic electronic component. The bottom surface has a recessed portion extending over at least the entire width direction of the multilayer ceramic electronic component accommodated in the accommodation portion.

3. The characteristic measuring device of a multilayer ceramic electronic component according to claim 1 or 2, wherein: having a plurality of the above-mentioned measuring systems, In a plurality of the measurement systems, the housings are arranged adjacent to each other so that the multilayer ceramic electronic components housed in the housings are aligned in the width direction. The device includes partition walls that isolate the metal terminals of the multilayer ceramic electronic components housed in adjacent housing portions from each other in a parallel direction of the adjacent housing portions.

4. The characteristic measuring apparatus of a multilayer ceramic electronic component according to claim 3, wherein The measuring probe includes a front contact portion that contacts the metal terminal and a rear connection portion that is connected to the wiring. The invention comprises a shielding wall for isolating a pair of the rear end connecting portions adjacent to each other in the parallel direction from each other in the parallel direction.

5. A method for manufacturing a multilayer ceramic electronic component, wherein a first multilayer ceramic electronic component and a second multilayer ceramic electronic component are prepared as the multilayer ceramic electronic components, and the first and second multilayer ceramic electronic components are measured using the multilayer ceramic electronic component characteristic measuring apparatus according to claim 3 or 4, wherein the pair of metal terminals of the first multilayer ceramic electronic component are first metal terminals, and the pair of metal terminals of the second multilayer ceramic electronic component are second metal terminals, wherein: at least one of the plurality of measurement systems is set as a first measurement system, and at least one of the measurement systems other than the first measurement system is set as a second measurement system, The method for manufacturing a multilayer ceramic electronic component comprises: a first measuring step of accommodating the first multilayer ceramic electronic component in the accommodating portion of the first measuring system and bringing a pair of measuring probes of the first measuring system into contact with a pair of first metal terminals, respectively; as well as The second measuring step comprises accommodating the second multilayer ceramic electronic component in the accommodating portion of the second measuring system and bringing the pair of measuring probes of the second measuring system into contact with the pair of second metal terminals, respectively. The first measurement step and the second measurement step are performed continuously or simultaneously.

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