Subdivision case

Abstract

The invention provides a subdivision case. The subdivision case comprises a plurality of cabins for accommodating a plurality of electronic components; each cabin comprises at least one isolation side plate and a bottom plate, and interval areas with certain widths are formed among the multiple cabins through the isolation side plates; the bottom plate of each cabin is in contact with the same plane, and the plurality of cabins are arranged on the plane according to a preset arrangement mode. The cabins comprise a first cabin provided with an ascending air duct and a second cabin provided with a horizontal air duct, the second cabin is arranged on one side of the first cabin in a separated mode, and an air inlet of the horizontal air duct is formed in an isolation side plate of the second cabin. According to the subdivision case provided by the invention, heat interference caused by stacking of the cabins in the vertical direction or the horizontal direction in the traditional technology can be avoided, independent heat dissipation of electronic components in the cabins is realized, meanwhile, the heat dissipation area of the whole case is increased, and the heat dissipation efficiency of the case is improved. And the independently arranged cabin is more convenient to independently maintain and replace.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a compartment chassis. Background Art

[0002] Traditional computer cases generally have six sides, which are made of different materials and treated in accordance with their different functions, serving the purpose of heat dissipation, fixation or display.

[0003] refer to Figure 1 (a) With the development of computer cases, side 1 is usually used as a display surface, usually made of glass or acrylic material, so that the internal hardware can be seen; side 2 is the main air inlet surface, which is the main source of heat dissipation airflow; side 3 is the main air outlet surface, which is usually used to install a water cooling radiator and is the main exhaust surface of the hot air in the case; reference Figure 1 (b) Surface 4 is the back of the main unit, inside of which is the channel for connecting wires between the main unit and parts and the storage of redundant lengths of connecting wires. This surface generally only has a shielding function; Surface 5 is the interface surface and secondary air outlet surface of the chassis; Surface 6 is the bottom of the chassis, which generally has a power supply air inlet surface.

[0004] refer to Figure 2 The current conventional configuration of traditional computer cases causes the main heat-generating hardware inside to interact with each other. Cold air (indicated by solid arrows in the figure) enters the case and mixes with the hot air from the graphics card (indicated by hollow arrows in the figure), passing through the water cooling radiator and then being discharged from the case. As the power consumption of graphics cards increases, this structure has certain problems: the air will be heated by the graphics card, causing the air temperature entering the radiator fan to be much higher than the room temperature. At the same time, the main air inlet surface of the graphics card is blocked by the power supply compartment, resulting in low heat dissipation efficiency. The upward air duct will also affect the air duct of the graphics card, causing the temperature of the entire machine to increase, and the cooling system to operate at a high load, which brings a poor user experience. Summary of the Invention

[0005] The embodiments of the present application provide a compartmented chassis, which solves the problems of mutual heat influence among the main heat-generating hardware and low heat dissipation efficiency in traditional chassis.

[0006] The compartment chassis provided in the present application includes multiple compartments, and the multiple compartments are used to accommodate multiple electronic components; wherein each compartment includes at least one isolation side panel and a bottom panel, and the isolation side panels form a spacing area of a certain width between the multiple compartments; the bottom panel of each compartment is in contact with the same plane, and the multiple compartments are arranged on the plane according to a predetermined arrangement; the multiple compartments include: a first compartment, which is provided with an ascending air duct; a second compartment, which is separated and arranged on one side of the first compartment; the second compartment is provided with a horizontal air duct; the air inlet of the horizontal air duct is arranged on the isolation side panel of the second compartment, and the isolation side panel is adjacent to the spacing area between the first compartment and the second compartment.

[0007] In another possible implementation, the first cabin also includes a top plate and at least one side plate, the bottom plate of the first cabin is provided with an air inlet, the top plate and / or the upper area of the side plate adjacent to the top plate is provided with an air outlet, the bottom of the bottom plate of the first cabin is provided with a support member, and the side of the support member is provided with a notch, and the notch is used for air intake; wherein the notch, the air inlet and the air outlet form an ascending air duct for dissipating heat from electronic components in the first cabin.

[0008] In another possible implementation, a graphics card is accommodated in the first compartment; the graphics card is arranged at the air inlet of the first compartment, and the graphics card dissipates heat through an ascending air duct.

[0009] In another possible implementation, the first compartment accommodates a CPU, and the second compartment accommodates a radiator; wherein the radiator is connected to the CPU via a water-cooling pipe, and the CPU is cooled by the coolant in the water-cooling pipe.

[0010] In another possible implementation, the second compartment further contains a first fan, and the first fan is used to dissipate heat from the radiator.

[0011] In another possible implementation, the heat dissipating radiator is vertically arranged in the second compartment, the first fan is installed on one side of the heat dissipating radiator, and the first fan faces the air inlet of the second compartment.

[0012] In another possible implementation, a second fan is further provided between the graphics card and the air inlet, and the second fan is used to enhance the air inlet and outlet of the rising air duct.

[0013] In another possible implementation, the graphics card is disposed horizontally in the first compartment, and the heat dissipation surface of the graphics card faces the second fan.

[0014] In another possible implementation, the first compartment is further provided with a water cooling head and a water pump. The water cooling head is mounted on the CPU and connected to the water cooling pipe, and is used to dissipate heat from the CPU through the coolant in the water cooling pipe; the water pump is connected to the water cooling head through the water cooling pipe, and is used to drive the coolant to flow between the water cooling head and the heat dissipation radiator.

[0015] In another possible implementation, the first compartment further includes a mainboard, which is used to fix the CPU and the graphics card.

[0016] In another possible implementation, the top plate, the bottom plate, the at least one side plate and the at least one isolation side plate of the first compartment are connected by snap-fitting.

[0017] In another possible implementation, the multiple cabins also include a third cabin, wherein the third cabin is separated and arranged on one side of the first cabin; the third cabin is provided with a horizontal air duct; the air inlet of the horizontal air duct is arranged on the isolation side panel of the third cabin, and the isolation side panel is adjacent to the spacing area between the first cabin and the third cabin.

[0018] In another possible implementation, a power supply is accommodated in the third compartment, a third fan is installed on one side of the power supply, and the third fan faces the air inlet of the third compartment.

[0019] In another possible implementation, the multiple cabins also include a fourth cabin, wherein the fourth cabin is separated and arranged on one side of the first cabin; the fourth cabin is provided with a horizontal air duct; the air inlet of the horizontal air duct is arranged on the isolation side panel of the fourth cabin, and the isolation side panel is adjacent to the spacing area between the first cabin and the fourth cabin.

[0020] In another possible implementation, a hard disk is accommodated in the fourth compartment, a fourth fan is installed on one side of the hard disk, and the fourth fan faces the air inlet of the fourth compartment.

[0021] In another possible implementation, at least one hollow gallery bridge is further provided in the compartment chassis, and the hollow gallery bridge is used to hide water cooling pipes and electrical wires.

[0022] The present invention forms a certain width of separation area between multiple cabins through isolating side panels, and the bottom plates of each cabin are located on the same plane, so that each cabin is independent of each other in the horizontal direction. The first cabin is provided with an ascending air duct, and the second cabin is separated and arranged on one side of the first cabin and is provided with a horizontal air duct. In the compartmented chassis provided by the present invention, the horizontal air duct of the second cabin is independent of the ascending air duct of the first cabin, thereby avoiding mutual interference between the heat dissipation airflows of the two cabins during the heat dissipation process, and avoiding the heat interference caused by stacking cabins in the vertical or horizontal direction in traditional technologies, thereby achieving independent heat dissipation of electronic components in each cabin, and at the same time increasing the heat dissipation area of the entire chassis and improving the heat dissipation efficiency of the chassis. In addition, the independently arranged cabins are different from the integrated hardware frame of the traditional chassis body, which will be more convenient for independent maintenance and replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The following is a brief introduction to the drawings required for describing the embodiments or prior art.

[0024] Figure 1 A schematic diagram of a traditional chassis structure provided in an embodiment of the present application; Figure 2 A schematic diagram of heat dissipation airflow conduction in a traditional chassis provided in an embodiment of the present application; Figure 3A schematic diagram of a compartment chassis structure provided in an embodiment of the present application; Figure 4 A schematic diagram of an improved structure of a compartment chassis provided in an embodiment of the present application; Figure 5 A schematic diagram of the disassembled structure of a compartment chassis provided in an embodiment of the present application; Figure 6 A schematic diagram of the assembly structure of a compartment chassis provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0026] In the description of this application, the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limiting this application.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "install", "connect" and "connect" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, a conflicting connection or an integrated connection. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] Figure 3 This is a schematic diagram of a compartment chassis structure provided by an embodiment of the present application. Figure 3 As shown, the compartmented chassis includes multiple compartments. These compartments are used to house multiple electronic components. It's easy to understand that these electronic components include core components (motherboard, CPU, graphics card, hard drive, etc.), power supplies and power supply equipment, cooling systems, expansion cards, interfaces and connectors, and other auxiliary components.

[0029] Specifically, each compartment includes at least one insulating side panel and a bottom panel. The insulating side panels create a spaced area of a certain width between the compartments. Furthermore, the bottom panel of each compartment is in contact with the same plane, and the compartments are arranged on this plane in a predetermined pattern. These patterns include, but are not limited to, a straight line, an L-shape, a U-shape, a T-shape, and a cross-shape.

[0030] It is worth mentioning that Figure 4 A schematic diagram of a compartment chassis improvement process provided in an embodiment of the present application. Figure 4 (a) shows the air inlet and outlet diagram of the chassis in the prior art. Figure 4 (b) is a schematic diagram showing the main view of the chassis after compartmentalization in the prior art. Figure 4 (c) is a top view of a conventional chassis after compartmentalization, wherein solid arrows represent cold air and hollow arrows represent hot air.

[0031] Further, back to Figure 3 , the plurality of compartments include a first compartment 100 and a second compartment 200. Figure 4 (b) The first compartment 100 is provided with an upward air duct, which can be used to dissipate heat from the electronic components inside the first compartment 100. Figure 4 (c) and Figure 5 The second compartment 200 is separated from the first compartment 100. The second compartment 200 is provided with a horizontal air duct, which can be used to dissipate heat from the electronic components in the second compartment 200. The air inlet of the horizontal air duct is located on the isolation side panel 204 of the second compartment 200. The air outlet can be located on other side surfaces or the top surface of the second compartment 200 other than the isolation side panel 204. Specifically, the isolation side panel 204 is adjacent to the separation area between the first compartment 100 and the second compartment 200.

[0032] As can be seen from this example, multiple compartments are independently spaced apart by a spacing area, and the bottoms of the compartments are all on the same plane, which can avoid the heat interference caused by stacking compartments in the vertical or horizontal direction in traditional technology, and achieve independent heat dissipation of electronic components in each compartment, while increasing the heat dissipation area of the entire chassis and improving the heat dissipation efficiency of the chassis. By spacing the second compartment 200 from the first compartment 100 and setting the air inlet of the second compartment 200 on the isolation side panel 204 adjacent to the spacing area, the horizontal air duct of the second compartment 200 and the rising air duct of the first compartment 100 can be made independent of each other, avoiding mutual interference of the heat dissipation airflow of the two compartments during the heat dissipation process. Furthermore, the independently arranged compartments are different from the integrated hardware frame of the traditional chassis body, which will be more convenient for independent maintenance and replacement.

[0033] In one example, reference Figure 5 The first compartment 100 includes not only the at least one isolation side panel 109 and the bottom panel 110 described in the above embodiment, but also a top panel 107 and at least one side panel 108 .

[0034] Further, refer to Figure 6 The bottom plate 110 of the first compartment 100 (not shown in the figure because it is blocked by the support member 106) is provided with an air inlet. Figure 5, an air outlet is provided in the upper area of the top plate 107 and / or the side plate 108 adjacent to the top plate 107 (not shown in the figure). The upper area refers to the area where the side plate 108 extends downward from the boundary line with the top plate 107 by ≤50% of the height of the side plate 108. A support member 106 is provided at the bottom of the bottom plate 110 of the first compartment 100, and a notch is provided on the side of the support member 106, and the notch can be used to allow air in. Specifically, the notch, the air inlet and the air outlet can form an ascending air duct, which can be used to dissipate heat from the electronic components in the first compartment 100.

[0035] As can be seen from this example, the rising air duct formed by the notch of the support member 106 and the air inlet and outlet of the first compartment 100 can utilize the physical property of the natural rise of hot air to avoid the accumulation of hot air in the first compartment 100, thereby further improving the heat dissipation efficiency of the first compartment 100 and reducing the energy consumption of the heat dissipation device.

[0036] Based on the above example, optionally, the top plate 107, the bottom plate 110, the at least one side plate 108 and the at least one isolation side plate 109 of the first compartment 100 can be connected by snapping together to facilitate assembly and disassembly of the first compartment 100.

[0037] In one example, reference Figure 5 The first compartment 100 can accommodate a graphics card 102. The graphics card 102 is arranged at the air inlet of the first compartment 100, and the graphics card 102 can be cooled by the rising air duct. Figure 4 (c) The second compartment 200 is separated from the first compartment 100. The second compartment 200 is equipped with a horizontal air duct, which can be used to dissipate heat from the electronic components within the second compartment 200. The air inlet of the horizontal air duct is located on the isolation side panel 204 of the second compartment 200. The air outlet can be located on other side surfaces or the top surface of the second compartment 200 other than the isolation side panel 204. Specifically, the isolation side panel 204 is adjacent to the separation area between the first compartment 100 and the second compartment 200.

[0038] It is worth noting that in this example, the updraft duct of the first compartment 100 can be the updraft duct formed by the notch of the support member 106, the air inlet, and the air outlet in the previous example. Other types of updraft ducts can also be used, such as a T-shaped directional duct (air inlet at the bottom, dual air outlets at the front and rear of the chassis), a three-dimensional duct (air inlet at the front and bottom, air outlet at the top and rear), etc., and this application does not limit this.

[0039] It is easy to understand that the graphics card 102 is arranged at the air inlet of the first compartment 100, and the graphics card 102 is cooled by the rising air duct, which can solve the problem in the prior art that the main air inlet surface of the graphics card is blocked by the power compartment (for example, Figure 1(b) The power supply is located within the air inlet surface 6, resulting in low heat dissipation efficiency for the graphics card. Furthermore, the horizontal air duct of the second compartment 200 and the ascending air duct of the first compartment 100 are independent of each other, preventing interference between the cooling airflow of the second compartment 200 and the graphics card 102 during the cooling process.

[0040] Based on the above examples, optionally, continue to refer to Figure 5 A second fan 104 is also provided between the graphics card 102 and the air inlet. The second fan 104 can enhance the air inlet and outlet of the rising air duct and improve the heat dissipation efficiency of the first compartment 100.

[0041] Furthermore, based on the above example, optionally, the graphics card 102 can be horizontally arranged in the first compartment 100, and the heat dissipation surface of the graphics card 102 faces the second fan 104, and the heat dissipation effect of the graphics card 102 can be improved by the second fan 104.

[0042] In one example, continue with reference Figure 5 The first compartment 100 may contain a CPU 101, and the second compartment 200 may contain a heat dissipation radiator 201. Specifically, the heat dissipation radiator 201 may be connected to the CPU 101 in the first compartment 100 via a water-cooling pipe 203. Furthermore, the heat dissipation radiator 201 may dissipate heat from the CPU 101 via the coolant in its water-cooling pipe 203. It is easy to understand that the CPU 101 may also dissipate heat through the air duct of the first compartment 100, and the heat dissipation radiator 201 may discharge heat through the air duct of the second compartment 200.

[0043] Based on the above examples, optionally, continue to refer to Figure 5 The second compartment 200 further contains a first fan 202 , which is used to dissipate heat from the radiator 201 .

[0044] Furthermore, based on the above example, optionally, continue to refer to Figure 5 The heat dissipation radiator 201 is vertically arranged in the second compartment 200 , and the first fan 202 is installed on one side of the heat dissipation radiator 201 , and the first fan 202 faces the air inlet of the second compartment 200 .

[0045] It is easy to understand that the first fan 202 can strengthen the horizontal air flow in and out of the second compartment 200, thereby improving the heat dissipation efficiency of the second compartment 200.

[0046] In one example, continue with reference Figure 5Not only can the first compartment 100 accommodate the CPU 101 and the second compartment 200 accommodate the radiator 201, but the first compartment 100 can also accommodate a water cooling head 103 and a water pump (not shown). Specifically, the water cooling head 103 can be mounted on the CPU 101 and connected to the water cooling pipe 203. The water cooling head 103 is used to dissipate heat from the CPU 101 using the coolant in the water cooling pipe 203. The water pump is connected to the water cooling head 103 via the water cooling pipe 203 and can be used to drive the coolant to flow between the water cooling head 103 and the radiator 201.

[0047] In another example, continue to refer to Figure 5 The first compartment 100 can accommodate both a CPU 101 and a graphics card 102, while the second compartment 200 can accommodate a radiator 201. Specifically, the graphics card 102 can dissipate heat through the rising air duct in the first compartment 100. The radiator 201 in the second compartment 200 can be connected to the CPU 101 in the first compartment 101 via a water-cooling pipe 203. The radiator 201 can dissipate heat from the CPU 101 via the coolant in its water-cooling pipe 203. In addition, the radiator 201 can dissipate heat through the air duct in the second compartment 200.

[0048] As can be seen from this example, the CPU 101 in the first compartment 100 is cooled by the radiator 201 in the second compartment 200, the radiator 201 is cooled by the second compartment 200, and the graphics card 102 is cooled by the rising air duct of the first compartment 100. This can achieve independent heat dissipation between the high-heat-generating components CPU 101 and the graphics card 102, avoiding the problem in the traditional chassis that the surrounding air of the radiator is heated by the graphics card, causing the air temperature entering the radiator fan to be much higher than the room temperature, reducing the heat interference between the CPU 101 and the graphics card 102, and improving the heat dissipation efficiency.

[0049] Based on the above examples, optionally, continue to refer to Figure 5 The first compartment 100 also includes a motherboard 105 , which can be used to fix the CPU 101 and the graphics card 102 .

[0050] In one example, returning to Figure 3 , the multiple compartments described in any one of the above examples further include a third compartment 300. Specifically, the third compartment 300 is separated and arranged on one side of the first compartment 100. Figure 4 (c) The third compartment 300 is provided with a horizontal air duct, combined with Figure 5 The air inlet of the horizontal air duct is set on the isolation side panel 303 of the third cabin 300. Specifically, the isolation side panel 303 is adjacent to the spacing area between the first cabin 100 and the third cabin 300.

[0051] It can be seen from this example that by spacing the third compartment 300 from the first compartment 100 and setting the air inlet of the third compartment 300 on the isolation side panel 303 adjacent to the spacing area, the horizontal air duct of the third compartment 300 and the ascending air duct of the first compartment 100 can be made independent of each other, thereby avoiding mutual interference of the heat dissipation airflows of the two compartments during the heat dissipation process.

[0052] Based on the above examples, optionally, refer to Figure 5 The third compartment 300 houses a power supply 301. A third fan 302 is mounted on one side of the power supply 301, facing the air inlet of the third compartment 300. It is easy to understand that the third fan 302 can enhance the horizontal airflow in and out of the third compartment 300, thereby improving the heat dissipation efficiency of the third compartment 300.

[0053] As can be seen in this example, the third compartment 300 is separated from the first compartment 100, allowing the third compartment 300 to utilize room temperature air to further cool the power supply, improving heat dissipation efficiency. This also solves the existing problem of power supply heat dissipation being interfered with by heat dissipation from other components in the same compartment, resulting in low heat dissipation efficiency.

[0054] In another example, continue to refer to Figure 5 The first compartment 100 contains a CPU 101 and a graphics card 102 , the second compartment 200 contains a heat sink 201 , and the third compartment 300 contains a power supply 301 .

[0055] Specifically, the graphics card 102 can be cooled through the ascending air duct in the first compartment 100. The radiator 201 in the second compartment 200 is connected to the CPU 101 in the first compartment 101 via a water-cooling pipe 203. The radiator 201 can cool the CPU 101 via the coolant in its water-cooling pipe 203. The power supply 301 can be cooled through the horizontal air duct in the third compartment 300. The heat of the radiator 201 in the second compartment 200 can be discharged through the horizontal air duct in the second compartment 200.

[0056] As can be seen from this example, the third compartment 300, the second compartment 200 and the first compartment 100 are independently separated and arranged, so that the power supply 301 can be cooled through the air duct of the third compartment 300, the radiator 201 can be cooled through the air duct of the second compartment 200, the CPU 101 can be cooled through the radiator 201 in the second compartment 200, and the graphics card 102 can be cooled through the rising air duct of the first compartment 100. The heat dissipation of the above-mentioned electronic components does not interfere with each other, which can improve the heat dissipation efficiency of the electronic components in the three compartments.

[0057] In one example, the multiple compartments may include not only the first compartment 100, the second compartment 200, and the third compartment 300, but also a fourth compartment (not shown). Specifically, the fourth compartment is separated and disposed on one side of the first compartment 100. The fourth compartment 300 is further provided with a horizontal air duct, the air inlet of which is disposed on an isolation side panel of the fourth compartment. Specifically, the isolation side panel is adjacent to the space between the first compartment 100 and the fourth compartment.

[0058] As can be seen from this example, by spacing the fourth compartment from the first compartment 100 and arranging the air inlet of the fourth compartment on the isolation side panel adjacent to the spacing area, the horizontal air duct of the fourth compartment and the ascending air duct of the first compartment 100 can be made independent of each other, thereby avoiding interference between the cooling airflows of the two compartments during the cooling process. Based on the above example, optionally, a hard disk can be accommodated in the fourth compartment, and a fourth fan is also installed on one side of the hard disk, and the fourth fan faces the air inlet of the fourth compartment. It is easy to understand that the fourth fan can strengthen the air inlet and outlet of the horizontal air duct of the fourth compartment and improve the cooling efficiency of the fourth compartment.

[0059] As can be seen from this example, the fourth compartment is separated from the first compartment 100, allowing the fourth compartment to utilize room temperature air to further cool the hard drive, improving heat dissipation efficiency. This also solves the existing problem of hard drive heat dissipation being interfered with by other components in the same compartment, resulting in low heat dissipation efficiency.

[0060] In another example, continue to refer to Figure 5 The first compartment 100 contains a CPU 101 and a graphics card 102, the second compartment 200 contains a heat sink 201, the third compartment 300 contains a power supply 301, and the fourth compartment contains a hard disk (not shown in the figure).

[0061] Specifically, the graphics card 102 can be cooled through the ascending air duct in the first compartment 100. The radiator 201 in the second compartment 200 can be connected to the CPU 101 in the first compartment 101 via a water-cooling pipe 203. The radiator 201 can dissipate heat from the CPU 101 via the coolant in its water-cooling pipe 203. Heat from the radiator 201 in the second compartment 200 can be discharged through the horizontal air duct in the second compartment 200. The power supply 301 can be cooled through the horizontal air duct in the third compartment 300, and the hard drive can be cooled through the horizontal air duct in the fourth compartment.

[0062] As can be seen from this example, the third compartment 300, the second compartment 200, the first compartment 100 and the fourth compartment are independently separated and arranged, so that the hard disk can be cooled through the horizontal air duct of the fourth compartment, the power supply 301 is cooled through the air duct of the third compartment 300, the radiator 201 is cooled through the air duct of the second compartment 200, the CPU 101 is cooled through the radiator 201 in the second compartment 200, and the graphics card 102 is cooled through the rising air duct of the first compartment 100. The heat dissipation of the above-mentioned electronic components does not interfere with each other, which can improve the heat dissipation efficiency of the electronic components in the four compartments.

[0063] In one example, returning to Figure 3 (b) The compartmented machine chassis described in any of the above examples is further provided with at least one hollow gallery bridge 401. Specifically, the hollow gallery bridge 401 is used to conceal the water-cooling pipes 203 and electrical wiring. As will be readily understood, by concealing the water-cooling pipes 203 and electrical wiring, the hollow gallery bridge 401 facilitates their protection and facilitates the installation, inspection, and maintenance of the water-cooling pipes 203 and wiring, while also creating a neat and aesthetically pleasing appearance.

[0064] It is worth noting that this solution is not limited to dividing the compartmented chassis into the first compartment 100, the second compartment 200, the third compartment 300, and / or the fourth compartment. Separate compartments can also be set up for other heat-generating components. For example, a separate compartment can be set up for a memory module, a sound card, a network card, etc. to provide independent heat dissipation for each.

[0065] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0066] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application and do not limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the technical solutions of the embodiments of the present application.

Claims

1. A compartmented chassis, characterized in that: The device comprises a plurality of compartments for accommodating a plurality of electronic components; wherein each compartment comprises at least one isolation side panel and a bottom panel, and the isolation side panels form a spacing area of a certain width between the compartments; the bottom panel of each compartment contacts the same plane, and the compartments are arranged on the plane in a predetermined arrangement; the compartments comprise: The first cabin is provided with an ascending air duct; The second cabin is separated and arranged on one side of the first cabin; the second cabin is provided with a horizontal air duct; the air inlet of the horizontal air duct is arranged on the isolation side panel of the second cabin, and the isolation side panel is adjacent to the interval area between the first cabin and the second cabin.

2. The compartmented chassis according to claim 1, characterized in that: The first cabin also includes a top plate and at least one side plate. The bottom plate of the first cabin is provided with an air inlet, and the upper area of the top plate and / or the side plate adjacent to the top plate is provided with an air outlet. The bottom of the bottom plate of the first cabin is provided with a support member, and the side of the support member is provided with a notch, and the notch is used for air intake; wherein the notch, the air inlet and the air outlet form an ascending air duct for dissipating heat from electronic components in the first cabin.

3. The compartmented machine box according to claim 1 or 2, characterized in that: The first compartment houses a graphics card; the graphics card is arranged at the air inlet of the first compartment, and the graphics card dissipates heat through an ascending air duct.

4. The compartmented chassis according to claim 3, characterized in that: The first compartment contains a CPU, and the second compartment contains a heat dissipation radiator. The heat dissipation radiator is connected to the CPU via a water cooling pipe, and the CPU is cooled by the coolant in the water cooling pipe.

5. The compartmented machine box according to claim 4, characterized in that: The second compartment further contains a first fan, which is used to dissipate heat from the radiator.

6. The compartmented machine box according to claim 5, characterized in that: The heat dissipation radiator is vertically arranged in the second compartment, the first fan is installed on one side of the heat dissipation radiator, and the first fan faces the air inlet of the second compartment.

7. The compartmented machine box according to claim 3, characterized in that: A second fan is further provided between the graphics card and the air inlet, and the second fan is used to enhance the air inlet and outlet of the rising air duct.

8. The compartmented machine box according to claim 7, characterized in that: The graphics card is arranged horizontally in the first compartment, and the heat dissipation surface of the graphics card faces the second fan.

9. The compartmented machine box according to claim 4, characterized in that: The first compartment also contains a water cooling head and a water pump. The water cooling head is installed on the CPU and connected to the water cooling pipe, and is used to dissipate heat from the CPU through the coolant in the water cooling pipe; the water pump is connected to the water cooling head through the water cooling pipe, and is used to drive the coolant to flow between the water cooling head and the heat dissipation radiator.

10. The compartmented machine box according to claim 4, characterized in that: The first compartment also includes a mainboard, which is used to fix the CPU and the graphics card.

11. The compartmented machine box according to claim 2, characterized in that: The top plate, the bottom plate, the at least one side plate and the at least one isolation side plate of the first compartment are connected by snapping.

12. The compartmented machine box according to any one of claims 1-2 or 4-11, characterized in that: The multiple cabins also include a third cabin, wherein the third cabin is separated and arranged on one side of the first cabin; the third cabin is provided with a horizontal air duct; the air inlet of the horizontal air duct is arranged on the isolation side panel of the third cabin, and the isolation side panel is adjacent to the spacing area between the first cabin and the third cabin.

13. The compartmented machine box according to claim 12, characterized in that: The third compartment contains a power supply, and a third fan is installed on one side of the power supply, and the third fan faces the air inlet of the third compartment.

14. The compartmented machine box according to claim 12, characterized in that: The multiple cabins also include a fourth cabin, wherein the fourth cabin is separated and arranged on one side of the first cabin; the fourth cabin is provided with a horizontal air duct; the air inlet of the horizontal air duct is arranged on the isolation side panel of the fourth cabin, and the isolation side panel is adjacent to the spacing area between the first cabin and the fourth cabin.

15. The compartmented machine box according to claim 14, characterized in that: A hard disk is accommodated in the fourth compartment, a fourth fan is installed on one side of the hard disk, and the fourth fan faces the air inlet of the fourth compartment.

16. The compartmented machine box according to any one of claims 1-2, 4-11 or 13-15, characterized in that: At least one hollow gallery bridge is also provided in the compartment chassis, and the hollow gallery bridge is used to hide water cooling pipes and electrical wires.

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