Assembly error processing method of heat dissipation module, electronic device and storage medium

Abstract

The application discloses a heat dissipation module assembly error processing method, electronic equipment and a storage medium. The method comprises the following steps: taking the pre-determined theoretical assembly pose data as a reference, predicting the relative position deformation variable between the heat dissipation module and the heat generating component on the target circuit board; determining the assembly error compensation amount according to the relative position deformation variable and the pose error determined based on the theoretical assembly pose data and the actual assembly pose data, so as to realize real-time compensation adjustment of the error in the assembly process and realize continuous optimization of the assembly parameters. Through the method, the technical problem of excessive error caused by manual adjustment of the assembly error in the related art is solved, and the technical effect of improving the assembly precision in the assembly process of the switch heat dissipation module is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of computers, and in particular to a heat dissipation module assembly error processing method, an electronic device, and a storage medium. BACKGROUND

[0002] In the manufacturing process of a high-density switch, the assembly precision between the heat dissipation module and the printed circuit board is crucial to the performance and service life of the switch. In order to reduce the assembly error of the heat dissipation module, in the related art, the error compensation is mainly achieved by means of mechanical positioning and manual fine adjustment. That is, the preliminary positioning is achieved by means of a precision clamp and a positioning pin, and then the manual adjustment is performed by relying on the experience of an operator, so as to achieve good contact between the heat dissipation module and the PCB.

[0003] However, as the heat generating devices on the printed circuit board of the high-density switch continue to increase, the above-mentioned method of simply relying on mechanical positioning and manual adjustment is difficult to compensate for the assembly error of the heat dissipation module, and the problems of poor contact or uneven pressure distribution on the contact surface between the heat dissipation module and the circuit board are prone to occur, thereby causing the technical problem of excessive assembly error of the heat dissipation module. SUMMARY

[0004] The present application provides a heat dissipation module assembly error processing method, an electronic device, and a storage medium to at least solve the problem of excessive assembly error of the heat dissipation module in the switch in the related art. According to one aspect of an embodiment of the present application, a heat dissipation module assembly error processing method is provided, including: obtaining theoretical assembly pose data of a heat dissipation module, wherein the theoretical assembly pose data includes displacement information and attitude information of the heat dissipation module relative to a target circuit board; predicting a relative position deformation variable between the heat dissipation module and a heat generating component on the target circuit board based on the theoretical assembly pose data; determining a pose error based on actual assembly pose data of the heat dissipation module and the theoretical assembly pose data; determining an assembly error compensation amount based on the relative position deformation variable and the pose error, wherein the assembly error compensation amount is used to control an adjusted assembly pose to approach an expected assembly pose; and compensating and adjusting the pose error according to the assembly error compensation amount.

[0005] According to another aspect of the embodiments of the present application, a picture display device is also provided, comprising: a first obtaining unit configured to obtain theoretical assembly pose data of a heat dissipation module, wherein the theoretical assembly pose data comprises displacement information and attitude information of the heat dissipation module relative to a target circuit board; a predicting unit configured to predict a relative position deformation variable between the heat dissipation module and a heat generating component on the target circuit board based on the theoretical assembly pose data; a first processing unit configured to determine a pose error based on actual assembly pose data of the heat dissipation module and the theoretical assembly pose data; a second processing unit configured to determine an assembly error compensation amount based on the relative position deformation variable and the pose error, wherein the assembly error compensation amount is used to control an adjusted assembly pose to approach an expected assembly pose; and a first adjusting unit configured to compensate and adjust the pose error according to the assembly error compensation amount.

[0006] According to still another aspect of the embodiments of the present application, an electronic device is also provided, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to execute the steps of any of the assembly error processing methods of the heat dissipation module by using the computer program.

[0007] According to still another aspect of the embodiments of the present application, a computer readable storage medium is also provided, wherein the computer readable storage medium stores a computer program, and the computer program is configured to execute the steps of any of the assembly error processing methods of the heat dissipation module when running.

[0008] According to still another aspect of the embodiments of the present application, a computer program product or a computer program is provided, comprising computer instructions stored in a computer readable storage medium. A processor of a computer device reads the computer instructions from the computer readable storage medium, and the processor executes the computer instructions to make the computer device execute the steps of any of the assembly error processing methods of the heat dissipation module.

[0009] By using the above embodiments provided in the present application, the high-precision theoretical assembly pose data is obtained in advance, and is used as a reference to predict the relative position deformation variable between the heat dissipation module and the heat generating component that may occur in theory under the thermal deformation scenario. The assembly error compensation amount is determined based on the relative position deformation variable and the pose error in the actual assembly process, so as to adaptively adjust and compensate the assembly error in the actual assembly process, thereby realizing the continuous optimization of the assembly process, solving the technical problem of excessive assembly error caused by relying on manual rough adjustment in the related art, and realizing the technical effects of reducing the assembly error of the heat dissipation module and improving the heat dissipation performance of the heat dissipation module under complex working conditions. BRIEF DESCRIPTION OF DRAWINGS

[0010] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0011] Figure 1 It is a schematic diagram of an application scenario of a method for handling assembly errors of a heat dissipation module according to an embodiment of the present application.

[0012] Figure 2 This is the process intention of an optional assembly error processing method for a heat dissipation module according to an embodiment of the present application.

[0013] Figure 3 This is a flow chart of an optional one-time compensation for assembly error according to an embodiment of the present application.

[0014] Figure 4 This is a flow chart of an optional secondary compensation for assembly errors according to an embodiment of the present application.

[0015] Figure 5 This is an overall flow chart of an optional method for handling assembly errors of a heat dissipation module according to an embodiment of the present application.

[0016] Figure 6 This is a structural block diagram of an optional assembly error processing device for a heat dissipation module according to an embodiment of the present application. DETAILED DESCRIPTION

[0017] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application.

[0018] It should be noted that, in the description of this application, the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. The terms "first," "second," etc., in this application are used to distinguish similar objects, and are not used to describe a particular order or sequence.

[0019] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] According to an aspect of the embodiments of the present application, a method for processing assembly error of a heat dissipation module is provided. Optionally, in the embodiments, the method for processing assembly error of the heat dissipation module can be applied to, but is not limited to, the hardware scenario as shown in the figure, wherein the server device can include one or more processors 102 (the processor 102 can include, but is not limited to, a processing device such as a microprocessor MCU or a programmable logic device FPGA) and a memory 104 for storing data, wherein the server device can further include a transmission device 106 for communication function and an input and output device 108. Those skilled in the art can understand that the server device can further include more or less components, or have a different configuration from that shown in the figure. Figure 1 Figure 1 The processor 102 can be configured to execute various functional applications and process data, that is, implement the above method, by running the computer program stored in the memory 104. Figure 1 The structure shown in the figure is only schematic, which does not limit the structure of the server device. For example, the server device can further include more or less components than those shown in the figure, or have a different configuration from that shown in the figure. Figure 1 Figure 1 The memory 104 can be used to store computer programs, for example, software programs of application software and modules, such as the computer program corresponding to the method for processing assembly error of the heat dissipation module in the embodiments of the present application. The processor 102 can execute various functional applications and process data, that is, implement the above method, by running the computer program stored in the memory 104. The memory 104 can include a high-speed random access memory, and can further include a non-volatile memory, such as one or more magnetic storage devices, flash memories, or other non-volatile solid-state memories. In some examples, the memory 104 can further include a memory remotely arranged with respect to the processor 102, which can be connected to the server device through a network. Examples of the above network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0021] The transmission device 106 is configured to receive or send data via a network. The specific examples of the network can include a wireless network provided by a communication service provider of the server device. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, NIC) which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (Radio Frequency, RF) module which is configured to communicate with the Internet in a wireless manner.

[0022] The transmission device 106 is configured to receive or send data via a network. The specific examples of the network can include a wireless network provided by a communication service provider of the server device. In one example, the transmission device 106 includes a network adapter (Network Interface Controller, NIC) which can be connected to other network devices through a base station so as to communicate with the Internet. In one example, the transmission device 106 can be a radio frequency (Radio Frequency, RF) module which is configured to communicate with the Internet in a wireless manner.

[0023] ​​The assembly error processing method of the heat dissipation module can be executed by the server device, or executed by the server device in combination with at least one of the terminal device (which can also be understood as the input / output device 108). Wherein, the terminal device executing the assembly error processing method of the heat dissipation module can also be executed by the client installed thereon.

[0024] The technical solutions in the embodiments of the present application can be applied in scenarios requiring accurate control of the assembly accuracy of the heat dissipation module and the PCB (Printed Circuit Board), and are particularly suitable for the assembly process of high-density electronic devices with high temperature sensitivity, high power consumption and complex heat dissipation requirements. Specific examples of several common application scenarios are given below.

[0025] (1) Assembly of high-density switch heat dissipation module: A high-density switch can be but not limited to a switch with multiple heat-emitting components, such as multiple switch chips, memory modules, power modules and other modules, disposed on the PCB board of the switch. The heat emitted by the heat-emitting components can cause the relative position between the heat dissipation module and the PCB board to change, which is referred to as the relative position deformation. At the same time, it can also cause uneven distribution of contact pressure between the heat-emitting module and the PCB board, resulting in excessive assembly error of the heat dissipation module. The technical solutions of the present application can monitor the assembly pose in real time during the assembly process and continuously compensate for the assembly error, ensuring accurate docking between the heat dissipation module and the PCB board.

[0026] (2) High-performance computer component installation: High-performance computers have very high requirements for the precision and efficiency of the heat dissipation system. Through the method in the technical solutions of the present application, automatic error compensation on the high-performance computer component assembly line can be realized, not only reducing the uncertainty of human intervention, but also fine-tuning for individual differences of each component, improving the consistency and optimization of the overall system thermal efficiency.

[0027] (3) Assembly of aerospace electronic devices: Aerospace devices operate in extreme environments and have higher requirements for assembly precision and stability of components. The method provided in the embodiments of the present application can predict and compensate for future thermal deformation during the assembly process, even in the face of large temperature differences, to maintain the tightness of the heat dissipation interface, thereby ensuring the reliability and performance of the electronic device during the flight mission.

[0028] (4) Manufacturing of 5G base station communication devices: The communication devices in the 5G base station have high power density and are extremely sensitive to the assembly accuracy of the heat dissipation components. The method provided in the embodiments of the present application can monitor and compensate for small pose deviations during the assembly process, especially in outdoor base stations with large changes in ambient temperature, which can effectively cope with the challenge of thermal deformation under long-term work, ensuring the normal operation of the communication device.

[0029] The following takes the assembly error processing method of the heat dissipation module executed by the server in this embodiment as an example, Figure 2 is a flowchart of an optional heat dissipation module assembly error processing method according to an embodiment of the present application, as Figure 2 shown, the flow of the method can include steps S202 to S210.

[0030] Step S202, obtaining theoretical assembly pose data of a heat dissipation module, wherein the theoretical assembly pose data includes displacement information and attitude information of the heat dissipation module relative to a target circuit board.

[0031] Step S204, based on the theoretical assembly pose data, predicting the relative position deformation variable between the heat dissipation module and the heat generating component on the target circuit board.

[0032] Step S206, based on the actual assembly pose data of the heat dissipation module and the theoretical assembly pose data, determining the pose error.

[0033] Step S208, based on the relative position deformation variable and the pose error, determining an assembly error compensation amount, wherein the assembly error compensation amount is used to control the adjusted assembly pose to approach the desired assembly pose.

[0034] Step S210, compensating and adjusting the pose error according to the assembly error compensation amount.

[0035] For ease of understanding, in the embodiments of the present application, the processing process of the assembly error of the heat dissipation module in the high-density switch is taken as an example for explanation and description.

[0036] For high-density switches, a large number of components are distributed on the PCB, such as processors, chips, and memory modules, etc. These components usually generate a large amount of heat during operation, which will affect the performance of the switch, and even affect its service life if not handled in time.

[0037] Usually, the heat generated by the heat generating component is conducted to the heat dissipation module in the form of setting the heat dissipation module, so as to dissipate it from the switch in time. The heat dissipation module usually includes at least one heat dissipation fin, a heat pipe, a fan module, etc.

[0038] However, in the assembly process of the heat dissipation module, it is impossible to predict the relative position deformation variable between the heat dissipation module and the PCB due to thermal deformation, so it is impossible to predict how to compensate and adjust the assembly error during assembly.

[0039] To this end, in the present embodiment, a CMM (Coordinate Measuring Machine, high-precision three-coordinate measuring instrument) measuring instrument is generally used to measure the mounting holes on the heat dissipation module and the corresponding mounting studs on the PCB, so as to accurately calculate the theoretical assembly pose data of the heat dissipation module.

[0040] The so-called theoretical assembly pose data refers to the accurate displacement and attitude information of the heat dissipation module relative to the target circuit board (PCB) under ideal conditions. These data can be obtained by calibrating the mounting positions of the heat dissipation module and the PCB through a high-precision three-coordinate measuring instrument.

[0041] The so-called relative position deformation variable refers to the deformation of the relative position between the heat dissipation module and the heat generating components (such as chips) on the target circuit board due to thermal expansion and contraction caused by temperature changes in actual operation. In the present embodiment, this deformation variable can be predicted by a thermal-structural coupling simulation method, but is not limited thereto, to lay a foundation for subsequent compensation adjustment. The thermal-structural coupling simulation method is a multi-physical field numerical simulation technology used to study the two-way interaction between the temperature field and the structural deformation / stress field. Its core lies in simultaneously solving the heat conduction equation and the structural mechanics equation, or analyzing how they affect each other through sequential coupling.

[0042] In the present embodiments, the assembly pose data of the heat dissipation module includes but is not limited to two aspects: one is the displacement information of the heat dissipation module relative to the target circuit board, and the other is the attitude information or angle information of the heat dissipation module relative to the target circuit board.

[0043] Assuming that a three-dimensional coordinate system is created with the plane on which the target circuit board is located, the above-mentioned displacement information includes but is not limited to the geometric displacement of the heat dissipation module relative to the target circuit board on the x, y and z coordinate axes, and the above-mentioned attitude information includes but is not limited to the angle information of the rotation angle of the heat dissipation module relative to the target circuit board along the x, y and z coordinate axes.

[0044] For example, it is assumed that the bottom surface of the heat dissipation module is flat, but considering that in the actual assembly process, improper fastening of the mounting holes and the corresponding mounting studs on the PCB may cause the contact surface of the heat dissipation module and the PCB to be uneven, thereby generating the above-mentioned displacement information and angle information.

[0045] For another example, in the process of predicting the relative position deformation variable between the heat dissipation module and the heat generating components, it is assumed that due to the generation of a large amount of heat by the heat generating components, the heat generating components, the heat dissipation module, and the heat-conducting layer between the heat generating components and the heat dissipation module all undergo thermal deformation or thermal deformation. Then this thermal deformation will cause the relative position between the heat dissipation module and the heat generating components to deviate from the initial relative position when the initial assembly is completed, thereby causing an assembly error (which can also be understood as a pose error).

[0046] The expected assembly pose is determined based on the relative position deformation variable, is a best assembly pose after considering the relative position deformation variable, and is an assembly pose that enables the heat dissipation device to achieve the best heat dissipation effect.

[0047] The relative position deformation variable is usually in the form of a thermal expansion coefficient matrix. The pose error and the thermal expansion coefficient matrix are input into a dynamic compensation calculation module, and a total compensation amount (which can also be understood as an assembly error compensation amount) is obtained through Jacobian matrix mapping, thermal deformation coupling model calculation, and a weighted fusion algorithm. The total compensation amount is then decomposed into adjustment amounts of joints of the mechanical arm, and finally, pose compensation is realized through a PID (Proportional-Integral-Derivative Control) control algorithm.

[0048] The PID algorithm is a closed-loop feedback control algorithm that mainly calculates a control amount based on a current error, a historical error, and an error change trend, so that the output of the system can quickly, accurately, and stably approach a target value.

[0049] In combination with the technical solutions of the present application, the PID algorithm is used to minimize the deviation between actual assembly pose data and expected assembly pose data, so that the actual assembly pose is as close as possible to the ideal state. In other words, the PID control algorithm is used to dynamically correct the deviation between the actual pose and the optimized expected pose caused by various reasons (thermal deformation, mechanical system error, external disturbance, etc.), so as to ensure that the heat dissipation module can maintain an assembly pose in the best working state, thereby ensuring efficient heat conduction and long-term stability of the switch.

[0050] In the above manner, through high-precision measurement, thermal deformation prediction, multi-sensor information fusion, and application of an intelligent control algorithm, the embodiments of the present application can effectively solve the problems of pose deviation and thermal deformation in the assembly process of the high-density switch heat dissipation module, ensure the best contact between the heat dissipation module and the PCB, and thus guarantee long-term stable operation and efficient heat dissipation of the device.

[0051] By means of the above-mentioned embodiments provided in the present application, high-precision theoretical assembly pose data is acquired in advance, and is taken as a reference to predict the relative position deformation variable between the heat dissipation module and the heat generating component that may theoretically occur in the heat deformation scenario; the assembly error compensation amount is determined according to the relative position deformation variable and the pose error in the actual assembly process, so as to adaptively adjust and compensate the assembly error in the actual assembly process, thereby realizing continuous optimization of the assembly process, solving the technical problem of excessive assembly error caused by rough adjustment relying on manual operation in the related art, and achieving the technical effects of reducing the assembly error of the heat dissipation module and improving the heat dissipation performance of the heat dissipation module under complex working conditions.

[0052] In one exemplary embodiment, the above-mentioned acquiring of the theoretical assembly pose data of the heat dissipation module comprises: acquiring hole position coordinate data of a fixed hole position of the heat dissipation module; acquiring anchor point coordinate data of a mechanical connection anchor point on the target circuit board, wherein the fixed hole position and the mechanical connection anchor point are matched positioning and fixing assemblies; and generating the theoretical assembly pose data based on the hole position coordinate data and the anchor point coordinate data.

[0053] In the present embodiment, the center coordinates of four mounting holes (which can also be understood as fixed hole positions) of the heat dissipation module are measured by using a high-precision three-coordinate measuring instrument to obtain three-dimensional coordinate data (hole position coordinate data) of the mounting holes; the center coordinates of corresponding mounting studs (which can also be understood as mechanical connection anchor points) on the PCB are measured by using the same CMM measuring instrument to obtain three-dimensional coordinate data (anchor point coordinate data) of the studs.

[0054] The above-mentioned hole position coordinate data and anchor point coordinate data are calculated by using a least squares matching algorithm to obtain a pose transformation matrix. The pose transformation matrix is the theoretical assembly pose data.

[0055] In addition, a laser confocal scanner is used to perform point-by-point scanning on the bottom surface of the heat dissipation module at a preset time interval (such as 50 m, 50 microseconds) to obtain surface height data. A Gaussian mixture model is used to fit the obtained surface height data to obtain a surface topography function as shown in the following formula (1):

[0056] (1)

[0057] wherein, is a surface height distribution function obtained by point-by-point scanning on the bottom surface of the heat dissipation module at a fixed numerical interval by using the laser confocal scanner, representing the height value (in units of microns or nanometers) of the surface at the coordinate (x, y) relative to the reference plane; 、 ​x k represents the center position coordinate of the spatial of the kth Gaussian component in the x-axis direction, y k represents the center position coordinate of the spatial of the kth Gaussian component in the y-axis direction, a k represents the amplitude of the kth Gaussian component, x k represents the center position coordinate of the spatial of the kth Gaussian component in the x-axis direction, x k represents the center position coordinate of the spatial of the kth Gaussian component in the x-axis direction, x k represents the center position coordinate of the spatial of the kth Gaussian component in the x-axis direction, σ k represents the standard deviation, and k is a positive integer greater than or equal to 1.

[0058] The stiffness of the surface topography function is analyzed by using a contact mechanics model, and the contact stiffness is obtained as shown in the following formula (2) :

[0059] (2)

[0060] The calculated pose transformation matrix is used as the theoretical assembly pose data, the surface topography function and the contact stiffness are used as the three-dimensional topography data of the contact surface, as shown in Figure 3 , which is used for calculating the local thermal deformation in the secondary compensation process of the running heat dissipation module.

[0061] It should be noted that the initial assembly pose between the heat dissipation module and the PCB is calibrated by using a high-precision three-coordinate measuring instrument, which aims to provide accurate theoretical reference for subsequent compensation control. By least square matching the coordinate data of the mounting hole and the stud, the assembly deviation caused by manufacturing and processing errors can be effectively eliminated. At the same time, the bottom topography is fitted by using laser confocal scanning combined with Gaussian mixture model, which can more truly reflect the microstructure characteristics of the contact surface and provide a basis for contact stiffness modeling.

[0062] The accuracy of the assembly reference is ensured by accurately measuring the heat dissipation module and the target circuit board and obtaining the coordinate data of the heat dissipation module fixing hole and the circuit board mechanical connection anchor point, and a reference basis is provided for the calculation of subsequent pose error and assembly error compensation.

[0063] In an exemplary embodiment, the above-mentioned based on the theoretical assembly pose data, predicting the relative position deformation variable between the heat dissipation module and the heat generating component on the target circuit board, comprises: obtaining a three-dimensional model of the heat dissipation module; dividing the three-dimensional model into grids, and determining one grid after division as a node to obtain a group of nodes; determining the sub-deformation variable between each node in the group of nodes and the heat generating component; based on the sub-deformation variable, determining the relative position deformation variable.

[0064] In the embodiment, the thermal deformation prediction of the theoretical assembly pose data can be performed by a thermal-structure coupling simulation method, but is not limited thereto, to obtain a thermal expansion coefficient matrix. Then, a finite element analysis software ANSYS is used to perform meshing on the three-dimensional CAD model of the heat dissipation module to obtain a finite element model containing N nodes, where N is a positive integer greater than or equal to 2.

[0065] The relative position deformation variable (for short, sub-deformation variable) between each node and the heat generating component is calculated, and the thermal deformation of the overall structure composed of the heat dissipation module and the heat generating component, i.e., the relative position deformation variable, is synthesized by the node displacement method.

[0066] The three-dimensional model of the heat dissipation module is usually constructed by CAD software in the design stage, and contains the geometric shape, size and material properties of the module. This model is the basis for thermal-structure coupling analysis and the original data for subsequent meshing.

[0067] For example, the three-dimensional model of the heat dissipation module can be a complex multi-layer structure containing aluminum heat dissipation fins, copper bottom plate and thermal pad components. In the embodiment, the complete three-dimensional model needs to be obtained first as the basis for subsequent meshing and thermal deformation prediction.

[0068] In determining the sub-deformation variable between each node in the set of nodes and the heat generating component, for each node, the deformation variable caused by temperature change is calculated by the thermal expansion formula. This process takes into account the thermal expansion coefficient of the material and the size characteristics of the node, thereby obtaining the relative displacement of each node with respect to the heat generating component.

[0069] By obtaining the sub-deformation variables of all nodes, and using the structural mechanics equation and the node displacement method, the thermal deformation displacement field of the overall structure is synthesized to obtain the relative position deformation variable between the heat dissipation module and the heat generating component, which is an important input for subsequent dynamic compensation calculation.

[0070] Through meshing of the three-dimensional model and thermal deformation prediction, the structural deformation of the high-density switch heat dissipation module at the working temperature can be accurately evaluated, thereby providing a scientific basis for subsequent dynamic compensation calculation. Not only the thermal expansion characteristics of the material are considered, but also the relative position change between the heat dissipation module and the heat generating component is comprehensively analyzed, effectively preventing the assembly pose deviation caused by thermal deformation, and ensuring the long-term stability and contact heat transfer efficiency of the heat dissipation system.

[0071] In an exemplary embodiment, the above-mentioned determination of the sub-shape variable between each node in the group of nodes and the heat-generating component includes: obtaining each node from the group of nodes in turn as the current node; obtaining the current temperature distribution of the current node under steady-state working conditions; and determining the current sub-shape variable of the current node based on the current temperature distribution, thermal conductivity and current heat flux density of the current node, wherein the thermal conductivity is used to represent the heat conduction performance of the heat-conducting layer between the heat dissipation module and the heat-generating component.

[0072] Specifically, the temperature field of the heat dissipation module under steady-state working conditions is solved by the following formula (3) to obtain the temperature distribution of each node: :

[0073] (3)

[0074] Where f represents the thermal conductivity of the thermal conductive material, represents the heat flux density at node n.

[0075] A temperature field can be understood, but is not limited to, as the temperature distribution across various parts of a heat dissipation module over a given period of time. A temperature field consists of two elements: spatial dimension and temperature value. Spatial distribution is a three-dimensional spatial distribution function, where each grid node or volume element has a specific temperature value, forming the overall temperature field distribution.

[0076] The thermal deformation of each node (i.e., sub-deformation) is calculated using the thermal expansion equation shown in the following formula (4):

[0077] (4)

[0078] Where α is the thermal expansion coefficient of the material, is the characteristic length of node n.

[0079] The stress distribution caused by thermal deformation is calculated using the structural mechanics equation shown in the following formula (5):

[0080] (5)

[0081] in, is the elastic modulus, is the strain tensor.

[0082] The node displacement method is used to synthesize the thermal deformation of the entire structure and obtain the thermal deformation displacement field, which is specifically achieved through the following formula (6):

[0083] (6)

[0084] in, The shape function.

[0085] The thermal deformation displacement field is fitted into a pose transformation form by a least square method, a thermal expansion coefficient matrix is obtained, and a thermal stress disturbance term is calculated by using a stress-temperature coupling equation, and the specific formula (7) is as follows:

[0086] (7)

[0087] Wherein, the integral region is the contact surface of the heat dissipation module and the PCB .

[0088] The embodiment mainly relies on the theoretical assembly pose data provided in the above embodiment to predict the thermal deformation that may occur under actual working conditions, and provides a reference basis for subsequent dynamic compensation.

[0089] It should be noted that by using the thermal-structure coupling simulation method, the temperature field, stress field and deformation field of the heat dissipation module under steady-state working conditions are comprehensively analyzed, the structural deformation of the heat dissipation module due to temperature rise during actual operation can be accurately predicted, the overall thermal deformation displacement field synthesized based on the finite element modeling and the node displacement method is further converted into a thermal expansion coefficient matrix in the form of pose through least square fitting, thereby providing a physical basis for subsequent dynamic compensation, and the stability of the contact surface affected by heat is evaluated through the thermal stress disturbance term.

[0090] By analyzing the temperature distribution, thermal conductivity and heat flux density of each node in the heat dissipation module, the sub-deformation variable of each node is determined, and micro-level data support is provided for overall thermal deformation prediction and assembly error compensation. It can deeply understand the influence of material thermal performance on equipment assembly accuracy, and through node-level thermal deformation analysis, the displacement and deformation of the heat dissipation module under steady-state working conditions can be comprehensively evaluated, which is crucial for preventing assembly pose deviation caused by thermal expansion.

[0091] The technical solution in the embodiment improves the accuracy of thermal deformation prediction, ensures the accuracy of subsequent dynamic compensation calculation, thereby effectively improving the assembly precision and thermal management efficiency of the heat dissipation system of electronic equipment such as high-density switch, and reducing the performance degradation caused by temperature change.

[0092] In one exemplary embodiment, the above determining the pose error based on the actual assembly pose data and the theoretical assembly pose data of the heat dissipation module comprises: acquiring images of the heat dissipation module during assembly to obtain a real-time image sequence; determining the actual assembly pose data by matching feature points of the real-time image sequence and a three-dimensional model projection image corresponding to the heat dissipation module; and determining the pose error based on the actual assembly pose data and the theoretical assembly pose data.

[0093] In this embodiment, the visual-force fusion detection method can be used to monitor the actual assembly pose in real time, and the pose deviation and contact pressure distribution are obtained. Specifically, the pose error (pose deviation) is calculated by the following steps.

[0094] S11, an industrial camera is used to collect images of the heat dissipation module during assembly, with a collection frequency of 30 frames per second, and a real-time image sequence is obtained.

[0095] S12, a feature point matching algorithm is used to compare the real-time image with the CAD model projection image, and the coordinate offset of each feature point is extracted and calculated.

[0096] S13, the Perspective-n-Point algorithm is used to calculate the actual assembly pose based on the feature point offset.

[0097] In addition to calculating the pose error, a micro pressure sensor array can be used to measure the contact pressure between the heat dissipation module and the PCB, and obtain the pressure distribution data of the contact surface.

[0098] The Kalman filter algorithm is used to fuse the actual assembly pose data and pressure distribution data obtained by visual measurement, and output the optimized actual pose and fused pressure distribution.

[0099] Optionally, the pose deviation formula is used to calculate the deviation (or error) between the current actual assembly pose and the theoretical assembly pose, which is realized by the following formula (8):

[0100] (8)

[0101] Wherein, is the actual assembly pose data, is the theoretical assembly pose data, is the corresponding theoretical rotation matrix.

[0102] The pressure distribution reconstruction algorithm is used to interpolate the fused pressure data to generate a complete contact pressure distribution map.

[0103] This embodiment is based on the output results (theoretical assembly pose data and pressure data) in the above embodiment, which is used to monitor any deviation occurring during assembly in real time, and adjust the final assembly position according to these assembly deviations, to ensure that the heat dissipation module and the PCB maintain the best contact state, and provide input data for subsequent pressure optimization.

[0104] It should be noted that the visual-force fusion detection method aims to realize real-time state perception in the assembly process, wherein the image acquisition and feature point matching algorithm are used to obtain macroscopic pose information, and the pressure sensor array provides microscopic contact quality feedback, the actual assembly pose is solved by the Perspective-n-Point algorithm and compared with the theoretical assembly pose, and the assembly deviation can be quickly identified; the introduction of Kalman filter effectively improves the robustness and accuracy of multi-source information fusion, thereby providing reliable input data for closed-loop control.

[0105] In an exemplary embodiment, the above-mentioned determination of the actual assembly pose data by feature point matching between the real-time image sequence and the three-dimensional model projection image corresponding to the heat dissipation module includes: extracting the coordinate offset of each feature point by feature point matching between the real-time image sequence and the three-dimensional model projection image corresponding to the heat dissipation module; determining the actual assembly pose data based on the coordinate offset of each feature point.

[0106] In this embodiment, the method of real-time image sequence processing and actual assembly pose data determination is further refined, the coordinate offset is extracted by feature point matching, and then the actual assembly pose data of the heat dissipation module is calculated. The implementation process of this technical scheme will be explained in detail below.

[0107] By feature point matching between the real-time image sequence and the three-dimensional model projection image corresponding to the heat dissipation module, the coordinate offset of each feature point is extracted. In this process, feature point matching is a basic and important technology in the field of computer vision, which is used to identify and match significant visual features in different images. In the assembly process, the real-time image sequence of the heat dissipation module and the projection image of the three-dimensional model are matched by feature points, and the coordinate offset of each feature point, i.e. the actual displacement and rotation change relative to the theoretical assembly pose, can be accurately calculated.

[0108] For example, taking the feature points centered on the four mounting holes of the heat dissipation module as an example, it is assumed that these feature points are found to have changed coordinates in the real-time image sequence relative to the CAD model projection image, for example, the first feature point has an offset of 0.5 mm in the X-axis direction, an offset of 0.2 mm in the Y-axis direction, and a rotation angle change of 1 degree. These coordinate offsets reflect the small displacement and attitude change of the heat dissipation module during assembly, and are key data for real-time monitoring of assembly pose deviation.

[0109] Based on the coordinate offset of each feature point, the actual assembly pose data is determined, which refers to determining the actual assembly pose data after obtaining the coordinate offset of each feature point. This usually involves coordinate system conversion and calculation of pose transformation matrix. Through the coordinate offset of the feature points, the actual pose data of the heat dissipation module relative to the theoretical pose can be inversely solved, including position offset and attitude change.

[0110] Through real-time image sequence processing and feature point matching technology, the coordinate offset of each feature point is extracted, and the actual assembly pose data is determined based on these offset data, which provides accurate real-time feedback for subsequent pose error analysis and dynamic compensation calculation. Not only improves the intelligent level of the assembly process, but also ensures the accuracy and robustness of the pose measurement, which is especially important for the heat dissipation system of high-density switch and other electronic devices.

[0111] The above-mentioned through real-time image and three-dimensional model feature point matching, accurate extraction of coordinate offset, and determination of actual assembly pose of heat dissipation module, realize the dynamic monitoring and real-time quantification of pose deviation in the assembly process. Ensure that the small displacement and attitude change of high-density heat dissipation module in the assembly process can be captured and analyzed in time, which provides key data support for subsequent pose error correction and dynamic compensation.

[0112] In short, through the technical scheme provided by the embodiment, the adaptive control ability of the assembly process can be enhanced, and the assembly precision and contact stability between the heat dissipation module and the PCB board are significantly improved, which plays an important role in ensuring the thermal management efficiency and long-term operation reliability of electronic equipment.

[0113] In combination with the descriptions in Figure 3 , Figure 4 and the above-mentioned embodiments, the compensation adjustment of assembly error in the technical scheme of the present application includes one-time compensation before and during assembly, and two-time compensation of assembly error of the heat dissipation module during operation after assembly. Among them, the overall implementation process of one-time compensation includes the steps as shown in Figure 3 .

[0114] S302-1, calculate the theoretical assembly pose data.

[0115] Specifically, the center coordinates of the four mounting holes (which can also be understood as fixed hole positions) of the heat dissipation module can be measured by a high-precision three-coordinate measuring instrument, and three-dimensional coordinate data (hole coordinate data) of the mounting holes can be obtained. The center coordinates of the corresponding mounting studs (which can also be understood as mechanical connection anchor points) on the PCB board are measured by the same CMM measuring instrument, and three-dimensional coordinate data (anchor point coordinate data) of the studs are obtained.

[0116] The pose transformation matrix is obtained by calculating the hole coordinate data and the anchor point coordinate data through a least square matching algorithm. The pose transformation matrix is the theoretical assembly pose data.

[0117] S302-2, the three-dimensional topography data of the contact surface is calculated.

[0118] Reference can be made to the description of formula (1) in the above embodiments, which will not be repeated here.

[0119] S304, the theoretical thermal deformation data (i.e., the relative position deformation variable) is predicted.

[0120] S306-1, the deviation between the actual assembly pose data and the theoretical assembly pose data is calculated.

[0121] S306-2, the contact pressure distribution is calculated.

[0122] The data is used in the process of contact pressure homogenization in the secondary compensation.

[0123] S308, the assembly error compensation amount is calculated.

[0124] How to calculate the assembly error compensation amount will be described in detail below in combination with specific embodiments.

[0125] S310, the PID algorithm is used to decompose the assembly error compensation amount and to compensate and adjust the assembly error.

[0126] In an exemplary embodiment, the determination of the assembly error compensation amount based on the relative position deformation variable and the pose error includes: obtaining a first error compensation amount by mapping and converting the pose error; determining a second error compensation amount based on the relative position deformation variable; and obtaining the assembly error compensation amount by weighted sum of the first error compensation amount and the second error compensation amount.

[0127] The pose deviation and the thermal expansion coefficient matrix obtained are compensated in real time by using a dynamic compensation calculation method to obtain a compensation pose adjustment amount.

[0128] Further, the pose deviation (which can also be understood as a pose error) is mapped and converted by using a Jacobian matrix to obtain a geometric compensation amount (a first error compensation amount).

[0129] The thermal expansion coefficient matrix and the thermal stress disturbance term are calculated by using a thermal deformation coupling model to obtain a thermal compensation amount (which can also be understood as a thermal deformation compensation amount or a second error compensation amount); the geometric compensation amount and the thermal compensation amount The comprehensive processing is performed to obtain a total compensation amount (i.e. assembly error compensation amount) as shown in the following formula (9):

[0130] (9)

[0131] wherein, and are weight coefficients of geometric compensation and thermal compensation, respectively.

[0132] The kinematic inverse algorithm is used to decompose the total compensation amount to obtain adjustment amounts of the joints of the six-axis robot, and the PID control algorithm is used to implement closed-loop control on the adjustment amounts of the joints of the robot to achieve accurate pose compensation.

[0133] The embodiment integrates the data of the theoretical assembly pose data, thermal deformation prediction and real-time detection in the assembly process in the above embodiments, is a core compensation engine of the whole system, and embodies the characteristics of the collaborative action of multiple sources of information.

[0134] It should be noted that the dynamic compensation calculation method comprehensively considers the influence of geometric deviation and thermal deformation factors, maps the pose deviation into the executable motion compensation amount of the robot through the Jacobian matrix, obtains the thermal compensation component in combination with the thermal deformation coupling model, and sets reasonable weight coefficients according to the system characteristics in the weighting fusion strategy, so that the compensation result is closer to the actual working condition requirement; the PID control ensures the stability and response speed of the compensation process, and finally realizes the assembly precision of microns.

[0135] In an example embodiment, the determining the second error compensation amount based on the relative position deformation variable includes: obtaining a stress distribution of a contact surface between the heat dissipation module and the target circuit board due to thermal deformation; determining a thermal stress disturbance term based on the stress distribution, wherein the thermal stress disturbance term is used to indicate an influence degree of thermal stress generated by thermal deformation on structural stability of an assembly body, and the assembly body includes the heat dissipation module and the target circuit board; constructing a thermal deformation coupling model based on the thermal stress disturbance term and theoretical assembly pose data; and obtaining the second error compensation amount by inputting the relative position deformation variable into the thermal deformation coupling model.

[0136] The stress distribution of the contact surface between the heat dissipation module and the target circuit board due to thermal deformation is calculated through the above formula (5), and the thermal stress disturbance term is determined through the above formula (7). The thermal deformation coupling model is constructed based on the thermal stress disturbance term, the thermal expansion coefficient matrix and the thermal stress disturbance term are calculated through the model, and the thermal compensation amount (second error compensation amount) is obtained.

[0137] The specific process of obtaining the thermal compensation component (second error compensation amount) in combination with the thermal deformation coupling model is as follows.

[0138] S21, obtain a thermal expansion coefficient matrix.

[0139] The matrix records the thermal expansion characteristics of the heat dissipation module at different temperatures, including the thermal expansion direction and size of each part. It is the basis for thermal compensation calculation and reflects the impact of temperature changes on structural dimensions.

[0140] S22, combine the difference between the current working environment temperature of the heat dissipation module and the environmental reference temperature, and the thermal expansion coefficient matrix, to calculate the thermal deformation amount corresponding to each monitored temperature area.

[0141] S23, convert the calculated thermal deformation amount into a pose change form to analyze the impact of thermal deformation on the assembly pose.

[0142] The conversion here can be achieved through the shape function and node displacement method in structural mechanics, mapping the thermal deformation amount to the pose adjustment of the contact surface between the heat dissipation module and the PCB.

[0143] S24, establish a thermal deformation coupling model by combining the theoretical assembly pose data of the heat dissipation module and the PCB, and the impact of the thermal deformation amount on the pose.

[0144] The model considers the pose deviation caused by thermal deformation and integrates it with geometric pose deviation, providing a basis for subsequent compensation calculation.

[0145] S25, based on the thermal deformation coupling model, calculate the thermal compensation amount for compensating the impact of thermal deformation.

[0146] In this process, matrix operations, weighted fusion, and kinematics inverse solution methods are involved to ensure that the thermal compensation amount accurately reflects the actual impact of thermal deformation on the assembly pose.

[0147] Apply the calculated thermal compensation amount to the adjustment of the robot arm to achieve real-time compensation of the assembly pose of the heat dissipation module through closed-loop control. This ensures that the contact state between the heat dissipation module and the PCB remains optimal even under temperature changes, thereby ensuring the heat dissipation efficiency and the stability of the system.

[0148] Through the above steps, the thermal deformation caused by temperature changes can be effectively addressed, ensuring stable contact between the heat dissipation module and the circuit board, improving heat conduction efficiency, and achieving reliable heat dissipation and operation of high-density electronic devices under complex working conditions.

[0149] By deeply analyzing the impact of thermal deformation on the structural stability of the assembly, a thermal stress disturbance term is established, and a second error compensation amount is calculated, achieving accurate compensation of the assembly error caused by thermal deformation and enhancing the intelligent level and adaptive ability of the assembly process. It has important value for ensuring the heat dissipation efficiency and long-term operation stability of high-density electronic devices.

[0150] In an exemplary embodiment, the above-mentioned compensation adjustment of the posture error according to the assembly error compensation amount includes: decomposing the assembly error compensation amount to obtain the displacement adjustment amount of the heat dissipation module relative to the target circuit board on each coordinate axis and the angle adjustment amount of the rotation angle along each coordinate axis in the three-dimensional coordinate system, wherein the posture information includes the angle information of the rotation angle along each coordinate axis; adjusting the actual displacement information in the actual assembly posture data according to the displacement adjustment amount; adjusting the actual angle information in the actual assembly posture data according to the angle adjustment amount.

[0151] This embodiment describes how to decompose the calculated assembly error compensation amount into each axial direction of the three-dimensional coordinate system to guide the displacement and angle adjustment in the actual assembly process.

[0152] S31 , decomposing the assembly error compensation amount to obtain a displacement adjustment amount of the heat dissipation module relative to the target circuit board on each coordinate axis and an angle adjustment amount of the rotation angle along each coordinate axis in a three-dimensional coordinate system.

[0153] The assembly error compensation is a vector that combines the effects of positional error and thermal deformation, encompassing both displacement and attitude information. To accurately guide assembly adjustments, this vector must be decomposed into a three-dimensional coordinate system to determine the heat dissipation module's displacement adjustments along the X, Y, and Z axes, as well as the angular adjustments for rotation around these three axes.

[0154] For example: Assume that the calculated assembly error compensation is ( , , , , , 0.8°). This means the heat sink needs to move 0.2mm forward in the X-axis, 0.1mm backward in the Y-axis, and 0.15mm upward in the Z-axis. At the same time, it rotates 1° clockwise around the X-axis, 0.5° counterclockwise around the Y-axis, and 0.8° clockwise around the Z-axis to correct assembly errors caused by posture deviation and thermal deformation.

[0155] S32: Adjust the actual displacement information in the actual assembly posture data according to the displacement adjustment amount.

[0156] The decomposed displacement adjustment amount is used to guide the accurate adjustment of the actual assembly pose in terms of spatial displacement. This adjustment is usually achieved through the six-degree-of-freedom joint movement of the assembly robot or manipulator, with the movement amount of each joint strictly following the decomposed displacement adjustment amount, ensuring that the assembly displacement error between the heat dissipation module and the target circuit board is minimized.

[0157] Continuing with the above example, during the actual assembly process, the robot will follow the instructions of , , to achieve the consistency of the theoretical pose and the actual pose through the precise control of the six-degree-of-freedom joints.

[0158] S33, according to the angle adjustment amount, adjusting the actual angle information in the actual assembly pose data.

[0159] The decomposed angle adjustment amount is used to guide the attitude adjustment of the heat dissipation module relative to the target circuit board, ensuring that the optimal contact angle between the two is achieved. This adjustment also relies on the six-degree-of-freedom joint control of the assembly robot, with particular attention to the rotation angle adjustment along the X, Y, and Z axes to eliminate the angle deviation during assembly.

[0160] For example, assuming an angle adjustment amount of 1° clockwise rotation around the X axis, 0.5° counterclockwise rotation around the Y axis, and 0.8° clockwise rotation around the Z axis, the robot will perform the corresponding joint rotation action to accurately correct the attitude of the heat dissipation module, ensuring that the contact surface between it and the target circuit board is in the ideal alignment state.

[0161] By decomposing the assembly error compensation amount into specific displacement and angle adjustment amounts in the three-dimensional coordinate system, the fine control of the pose adjustment during the assembly of the heat dissipation module and the target circuit board is achieved. Specifically, the displacement adjustment amount ensures the accurate alignment of the heat dissipation module in space, while the angle adjustment amount further optimizes the attitude of the contact surface. The combination of the two significantly improves the assembly precision and the thermal conduction efficiency of the contact surface.

[0162] Through the precise control of the six-degree-of-freedom joints, the heat dissipation module and the target circuit board can be effectively corrected in each dimension, not only eliminating the assembly problems caused by pose deviation, but also effectively preventing the poor contact caused by thermal deformation, ensuring the long-term stability and operating efficiency of the heat dissipation system of high-density electronic equipment.

[0163] By accurately decomposing the assembly error compensation amount into displacement and angle adjustment in a three-dimensional coordinate system, the fine adjustment of the heat dissipation module and the target circuit board is guided, and the assembly precision and the thermal conductivity efficiency of the contact surface are improved. Specifically, the displacement adjustment amount ensures the accuracy of spatial positioning, and the angle adjustment amount optimizes the attitude of the contact surface. The combination of displacement adjustment and angle adjustment effectively eliminates the influence of assembly error and thermal deformation on the stability of the heat dissipation system, and ensures the thermal management efficiency and operation reliability of high-density electronic equipment under complex working conditions. In other words, the present embodiment realizes accurate conversion of the assembly error compensation amount, micron-level pose adjustment, and significantly enhances the accuracy of the heat dissipation module assembly and the long-term stability of the heat dissipation system.

[0164] In one exemplary embodiment, the above method further comprises: obtaining initial pressure distribution data of the contact surface between the heat dissipation module and the target circuit board; fusing the actual assembly pose data and the initial pressure distribution data to obtain fused pressure distribution data; obtaining an overall contact pressure distribution map by interpolating the fused pressure distribution data; and obtaining an optimal pressure distribution by iteratively optimizing the overall contact pressure distribution map by minimizing the objective function, wherein the optimal pressure distribution is used to optimize the thermal conductivity performance of the heat conduction layer and the target circuit board, and the heat conduction layer is used to conduct heat generated by the heat generating component to the heat dissipation module.

[0165] In the present embodiment, the thermal-mechanical coupling optimization method is mainly used to optimize the contact pressure distribution (which can also be understood as initial pressure distribution data) obtained by measuring the contact pressure between the heat dissipation module and the PCB board using a micro pressure sensor array in the above embodiment, to obtain an optimal pressure distribution, and to realize compensation through a dispensing machine.

[0166] Specifically, finite element analysis software can be used, but not limited to, to perform thermal-mechanical coupling analysis of the contact interface between the heat dissipation module and the PCB board, input the reconstructed contact pressure distribution and material property parameters, and establish a thermal-mechanical coupling model.

[0167] By introducing an objective function as shown in the following formula (10) into the thermal-mechanical coupling model:

[0168] (10)

[0169] Wherein, represents the contact pressure distribution in the optimization process, represents the average contact pressure value, and the optimization calculation is performed to minimize the objective function.

[0170] The gradient descent method or genetic algorithm and other optimization algorithms are used to iteratively optimize the contact pressure distribution until the objective function reach a minimum value, thereby obtaining an optimal pressure distribution.

[0171] According to the optimal pressure distribution, the area that needs to be adjusted and the required compensation amount thereof are determined, a dispensing path planning map is generated, and an automatic dispensing machine is used to apply a precisely controlled amount of glue at the specified location according to the generated dispensing path planning map, so as to achieve an optimized contact pressure distribution.

[0172] This embodiment is a deep optimization of the pressure distribution obtained in the above embodiment, and also provides an optimized heat conduction basis for subsequent infrared monitoring in the secondary compensation process, forming a closed-loop mechanism of "detection-optimization-feedback".

[0173] It should be noted that the thermal-force coupling optimization method models and optimizes the pressure distribution of the contact surface, aiming to improve the contact heat transfer efficiency between the heat dissipation module and the PCB, and the design of the objective function reflects the pursuit of pressure uniformity, and the selection of the optimization algorithm takes into account the convergence speed and global search ability; the cooperation of the dispensing path planning and the automatic dispensing system realizes non-contact and high-precision pressure compensation adjustment, with good process adaptability and repeatability.

[0174] By fusing the initial pressure distribution data of the contact surface and the actual assembly pose information, using the interpolation and objective function iterative optimization method, the precise adjustment of the contact pressure distribution is realized, the thermal conductivity of the thermal layer and the contact surface of the target circuit board is improved, and the efficient operation of the heat dissipation system and the long-term stability of the electronic equipment are ensured. At the same time, by fusing visual and force sensing information, a complete contact pressure distribution map is generated, and optimization calculation is carried out based on the minimum objective function, which enhances the thermal conductivity of the thermal layer and the stability of the contact surface, optimizes the contact quality of the heat dissipation module and the circuit board, avoids the problem of uneven pressure distribution caused by assembly deviation and thermal deformation, and ensures the heat dissipation performance and operation reliability of high-density electronic equipment under different temperature conditions.

[0175] In an exemplary embodiment, the above method further comprises: obtaining temperature distribution data by performing infrared thermal image scanning on the surface of the running heat dissipation module; obtaining a temperature gradient field by gradient processing the temperature distribution data, wherein the temperature gradient field is used to determine a local hot spot area in the contact surface between the target circuit board and the heat dissipation module, where the temperature change rate reaches a preset threshold; obtaining an overall thermal deformation compensation amount by fitting the thermal deformation amount of the local hot spot area; and correcting the assembly pose data of the running heat dissipation module based on the overall thermal deformation compensation amount to obtain corrected assembly pose data.

[0176] The embodiment mainly adopts infrared thermal imaging method to monitor the temperature field of the running heat dissipation module, obtains hotspot distribution data, and performs secondary compensation on assembly error based on thermal deformation pre-compensation formula.

[0177] Specifically, the infrared thermal imager is used to perform full-surface scanning on the running heat dissipation module to obtain temperature field distribution data; the obtained temperature field data is processed by using gradient calculation method through the following formula (11) to calculate the temperature gradient field . .

[0178] (11)

[0179] Among them, the area with a temperature change rate greater than 5℃ / cm is determined as a local hotspot area , and i is a positive integer greater than or equal to 1.

[0180] Based on the thermal deformation prediction model, local thermal deformation analysis is performed on each hotspot area , and the local thermal deformation amount is calculated through the following formula (12):

[0181] (12)

[0182] Among them, is the local thermal expansion coefficient of the material, is the temperature rise of the hotspot area, is the characteristic size.

[0183] The local thermal deformation amounts of all hotspot areas are fitted by using the least square method to obtain the overall thermal deformation compensation amount.

[0184] The corrected assembly pose data is calculated according to the pre-compensation formula, and is realized through the following formula (13):

[0185] (13)

[0186] Among them, is the current assembly pose, is the corrected pose (i.e. the corrected assembly pose data).

[0187] The embodiment forms a closed-loop feedback mechanism with the thermal deformation prediction and dynamic compensation calculation process in the above-mentioned embodiment, drives secondary compensation through the running thermal imaging data, so that the system has online adaptive ability, and further enhances the intelligence and robustness of the overall scheme.

[0188] It should be noted that the infrared thermal imaging monitoring method can capture the hotspot area and its corresponding temperature gradient change in real time in the running state of the equipment, provide dynamic input for thermal deformation secondary compensation, through a local thermal deformation prediction model, the structure deviation caused by the hot spot can be quantified and converted into a whole pose correction amount, this method not only improves the response ability of the system to sudden thermal disturbance, but also provides a feasible path for adaptive adjustment in long-term operation.

[0189] In combination with the above embodiments and Figure 4 It can be seen that, during the operation of the heat dissipation module, the assembly pose of the heat dissipation module can also be secondarily compensated during the pause time of the heat dissipation module to adjust the error generated during operation. The overall process of secondary compensation is as follows: S402~S410.

[0190] S402, contact pressure homogenization processing.

[0191] Among them, the contact pressure is homogenized based on the contact pressure distribution calculated in step S306-2. For details, please refer to the description in the above embodiments, which will not be repeated here.

[0192] S404, infrared thermal image scanning of the running heat dissipation module to obtain temperature field distribution data.

[0193] S406, calculate the local thermal deformation amount.

[0194] Among them, based on the three-dimensional topography data of the contact surface calculated in step S302-2, the local thermal deformation analysis of each hot spot area in the bottom surface (which can also be understood as the contact surface) of the heat dissipation module is carried out to obtain the local thermal deformation amount.

[0195] S408, determine the overall thermal deformation compensation amount according to the local thermal deformation amount.

[0196] S410, according to the overall thermal deformation compensation amount, secondarily compensate the assembly pose data of the running heat dissipation module to obtain the corrected assembly pose data.

[0197] Among them, the secondary compensation adjustment is to compensate and adjust the assembly error generated during operation within the short stopping time interval of the running heat dissipation module.

[0198] By monitoring the temperature distribution of the running heat dissipation module in real time, identifying the hot spot area, fitting the thermal deformation compensation amount, and dynamically correcting the assembly pose, the thermal deformation caused by temperature change is effectively prevented and corrected, the thermal conduction performance and stability of the contact surface between the heat dissipation module and the target circuit board under dynamic working conditions are guaranteed, the uneven thermal expansion caused by local hot spots is prevented, and the heat dissipation efficiency and operation reliability of high-density electronic equipment in complex working environments are ensured.

[0199] Through real-time infrared thermal imaging monitoring and temperature gradient analysis, thermal deformation in local hotspot areas of the heat dissipation module during operation is identified and compensated, enabling dynamic correction and optimization of the assembly position. This effectively improves the thermal conductivity efficiency and stability of the heat dissipation system, ensuring the heat dissipation performance and operational reliability of high-density electronic equipment under complex working conditions. By achieving thermal deformation compensation in local hotspot areas, not only is the thermal conductivity efficiency of the heat dissipation system improved, but its long-term operational stability is also enhanced, which has a significant effect on quality control and production efficiency improvement in mass production environments. It can also effectively prevent and correct thermal deformation problems caused by temperature fluctuations, enhancing the heat dissipation efficiency and operational stability of the equipment.

[0200] Through real-time temperature monitoring and dynamic posture correction, the thermal deformation problem caused by local hot spots during operation is effectively addressed, the thermal conduction efficiency and stability of the contact surface between the heat dissipation module and the circuit board are improved, and the heat dissipation performance and operational reliability of high-density electronic equipment under complex working conditions are guaranteed. This is of great value in improving the adaptability and efficiency of the thermal management system in actual operation.

[0201] In an exemplary embodiment, the above method also includes: obtaining historical assembly posture data between the heat dissipation module and the target circuit board; performing feature extraction on the historical assembly posture data to obtain key feature vectors; based on the key feature vectors, training the initial assembly posture model to obtain a trained assembly posture model; using the trained assembly posture model to determine the target assembly parameters between the heat dissipation module to be assembled and the target circuit board, wherein the assembly posture data includes the target assembly parameters.

[0202] In this embodiment, an iterative learning control (ILC) method is used to train historical assembly data to obtain optimized assembly parameters for assembly compensation of the next device (such as the next switch).

[0203] Specifically, a data acquisition system is used to extract historical assembly pose data from a database. This data is then processed using a feature extraction algorithm to extract key feature vectors. This key feature vector is then used to train an initial assembly pose model, resulting in a trained assembly pose model (also known as an assembly parameter update model).

[0204] The assembly parameter update model is established as shown in the following formula (14):

[0205] (14)

[0206] in, Indicates the Secondary assembly parameters, is the learning rate, is a 6x6 learning gain matrix, is a forgetting factor, k is a positive integer greater than or equal to 1.

[0207] The updated assembly parameters are optimized by using a parameter optimization algorithm The feasibility is verified to ensure that it is located in the preset parameter feasible region.

[0208] This embodiment is the learning and evolution module of the whole system. Through summarizing the assembly process data of each device in the above embodiments, the assembly strategy is gradually optimized, and the intelligent level and generalization ability of the whole system are improved.

[0209] When facing a new assembly task, by inputting the relevant features of the current heat dissipation module and the target circuit board into the trained assembly pose model, the model will output the optimal target assembly parameters according to the learned knowledge to guide the actual assembly process, ensuring that each assembly can achieve the best state.

[0210] It should be noted that through the learning and parameter updating of historical assembly data by the iterative learning control method (Iterative Learning Control, English abbreviation ILC), the continuous optimization of the assembly strategy is realized. By extracting the key feature vector and establishing a recursive updating model, the control system has the ability of memory and self-correction, which improves the consistency and success rate of new device assembly. This method is especially suitable for batch production scenes. On the basis of continuously accumulating data, the system performance will tend to be optimal with the increase of iteration times.

[0211] In order to more clearly understand the above-mentioned heat dissipation module assembly error processing method, it will be further described below in conjunction with the overall flowchart shown in Figure 5 .

[0212] S502, a high-precision three-coordinate measuring instrument is used to calibrate the initial assembly pose of the heat dissipation module and the circuit board, and the theoretical assembly pose data and the three-dimensional topography data of the contact surface are obtained.

[0213] S504, a thermal-structure coupling simulation method is used to predict the thermal deformation of the obtained theoretical assembly pose data, and a thermal expansion coefficient matrix is obtained.

[0214] S506, a visual-haptic fusion detection method is used to monitor the actual assembly pose in real time, and the pose deviation and contact pressure distribution are obtained.

[0215] S508, a dynamic compensation calculation method is used to compensate the obtained pose deviation and thermal expansion coefficient matrix in real time, and a compensation pose adjustment amount is obtained.

[0216] S510, the uniformity of the obtained contact pressure distribution is optimized by using a thermal-force coupling optimization method, an optimal pressure distribution is obtained, and compensation is realized through a dispensing machine.

[0217] S512, the temperature field of the running heat dissipation module is monitored by using an infrared thermal imaging method, hotspot distribution data are obtained, and secondary compensation is carried out based on a thermal deformation pre-compensation formula.

[0218] S514, the historical assembly data are trained by using an iterative learning control method, and optimized assembly parameters are obtained, which are used for assembly compensation of the next device.

[0219] Among them, the steps S502-S508 are the first compensation for the assembly error of the heat dissipation module before and during assembly, and the three-dimensional topography data of the contact surface obtained in step S502 are used for the calculation of the local thermal deformation in the secondary compensation process in step S512, and the contact pressure distribution obtained in step S506 is used for the contact pressure uniformization process in step S510.

[0220] The steps S510-S512 are the specific implementation process of the secondary compensation for the assembly pose error of the heat dissipation module during operation, and step S514 is to improve the intelligent level of the assembly of the heat dissipation module and the target circuit board through learning and analysis of historical assembly pose data, so as to ensure that each assembly can reach the optimal state.

[0221] Through the high-precision three-coordinate measurement and contact surface topography modeling described in the above embodiments, high-precision calibration of the initial state of the assembly of the heat dissipation module and the PCB board is realized, and the accuracy of the assembly reference is improved. Secondly, the thermal-structure coupling simulation and infrared thermal imaging online monitoring technology are introduced, and a full-process compensation system from static geometric error to dynamic thermal deformation is constructed, which significantly improves the stability and adaptability of the technical scheme of the present application under complex working conditions. Finally, the visual-force fusion detection and iterative learning control method are adopted, multi-source information cooperation and assembly parameter continuous optimization are realized, and the intelligent level and self-adaptive ability of the assembly process are enhanced.

[0222] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be realized by means of software and the necessary general hardware platform, of course, it can also be realized by hardware, but in many cases the former is a better embodiment.

[0223] According to another aspect of the embodiments of the present application, a heat dissipation module assembly error processing device is also provided, and the structural schematic diagram of the system is as follows Figure 6As shown, comprises the following modules: a first acquisition unit, configured to acquire theoretical assembly pose data of a heat dissipation module, wherein the theoretical assembly pose data comprises displacement information and attitude information of the heat dissipation module relative to a target circuit board; a prediction unit, configured to predict a relative position deformation variable between the heat dissipation module and a heat generating component on the target circuit board based on the theoretical assembly pose data; a first processing unit, configured to determine a pose error based on actual assembly pose data of the heat dissipation module and the theoretical assembly pose data; a second processing unit, configured to determine an assembly error compensation amount based on the relative position deformation variable and the pose error, wherein the assembly error compensation amount is used to control an adjusted assembly pose to approach an expected assembly pose; and a first adjustment unit, configured to compensate and adjust the pose error according to the assembly error compensation amount.

[0224] The specific execution steps involved in the various calculation processes in the above modules and the dynamic optimization of the storage space are described above, and will not be described here.

[0225] Obviously, the above-mentioned screen display device can be used to implement the assembly error processing method of the heat dissipation module provided in the above-mentioned embodiments, which has been described. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware, or a combination of software and hardware is also possible and is contemplated.

[0226] It should be noted that the first acquisition unit 602 in this embodiment can be used to perform the above-mentioned step S202, the prediction unit 604 in this embodiment can be used to perform the above-mentioned step S204, the first processing unit 606 in this embodiment can be used to perform the above-mentioned step S206, the second processing unit 608 in this embodiment can be used to perform the above-mentioned step S208, and the first adjustment unit 610 in this embodiment can be used to perform the above-mentioned step S210.

[0227] In one exemplary embodiment, the first acquisition unit 602 described above comprises: a first acquisition module, configured to acquire hole coordinate data of a fixed hole position of the heat dissipation module; a second acquisition module, configured to acquire anchor point coordinate data of a mechanical connection anchor point on the target circuit board, wherein the fixed hole position and the mechanical connection anchor point are matched positioning and fixing components; and a first processing module, configured to generate the theoretical assembly pose data based on the hole coordinate data and the anchor point coordinate data.

[0228] In an example embodiment, the prediction unit 604 comprises: a third obtaining module configured to obtain a three-dimensional model of the heat dissipation module; a division module configured to divide the three-dimensional model into meshes, and determine one mesh as one node to obtain a set of nodes; a second processing module configured to determine a sub-deformation variable between each node in the set of nodes and the heat generating component; and a third processing module configured to determine the relative position deformation variable based on the sub-deformation variable.

[0229] In an example embodiment, the second processing module comprises: a first obtaining sub-module configured to sequentially obtain each node in the set of nodes as a current node; a second obtaining sub-module configured to obtain a current temperature distribution of the current node under a steady state working condition; and a first processing sub-module configured to determine a current sub-deformation variable of the current node based on the current temperature distribution, a thermal conductivity coefficient, and a current heat flux density of the current node, wherein the thermal conductivity coefficient is used to represent a heat conduction performance of a heat conduction layer between the heat dissipation module and the heat generating component.

[0230] In an example embodiment, the first processing unit 606 comprises: an acquisition module configured to acquire images of the heat dissipation module during assembly to obtain a real-time image sequence; a matching module configured to determine the actual assembly pose data by performing feature point matching on the real-time image sequence and a projection image of a three-dimensional model corresponding to the heat dissipation module; and a fourth processing module configured to determine the pose error based on the actual assembly pose data and the theoretical assembly pose data.

[0231] In an example embodiment, the matching module comprises: a matching sub-module configured to perform feature point matching on the real-time image sequence and the projection image of the three-dimensional model corresponding to the heat dissipation module to extract coordinate offsets of each feature point; and a second processing sub-module configured to determine the actual assembly pose data based on the coordinate offsets of each feature point.

[0232] In an example embodiment, the second processing unit 608 comprises: a conversion module configured to obtain a first error compensation amount by mapping and converting the pose error; a fifth processing module configured to determine a second error compensation amount based on the relative position deformation variable; and a sixth processing module configured to obtain the assembly error compensation amount by performing weighted summation on the first error compensation amount and the second error compensation amount.

[0233] In an example embodiment, the fifth processing module described above includes: a third acquisition submodule for acquiring a stress distribution of a contact surface between the heat dissipation module and the target circuit board due to thermal deformation; a third processing submodule for determining a thermal stress disturbance term based on the stress distribution, wherein the thermal stress disturbance term is used to indicate an influence degree of thermal stress generated by thermal deformation on structural stability of an assembly including the heat dissipation module and the target circuit board; a construction submodule for constructing a thermal deformation coupling model based on the thermal stress disturbance term and theoretical assembly pose data; and a fourth processing submodule for obtaining the second error compensation amount by inputting the relative position deformation variable into the thermal deformation coupling model.

[0234] In an example embodiment, the first adjustment unit 610 described above includes: a decomposition module for decomposing the assembly error compensation amount to obtain displacement adjustment amounts of the heat dissipation module relative to the target circuit board in each coordinate axis and angle adjustment amounts of rotation angles along the each coordinate axis in a three-dimensional coordinate system, wherein the pose information includes angle information of rotation angles along the each coordinate axis; a first adjustment module for adjusting actual displacement information in the actual assembly pose data according to the displacement adjustment amounts; and a second adjustment module for adjusting actual angle information in the actual assembly pose data according to the angle adjustment amounts.

[0235] In an example embodiment, the device described above further includes: a second acquisition unit for acquiring initial pressure distribution data of a contact surface between the heat dissipation module and the target circuit board; a fusion unit for fusing the actual assembly pose data and the initial pressure distribution data to obtain fused pressure distribution data; an interpolation unit for obtaining an overall contact pressure distribution map by performing interpolation processing on the fused pressure distribution data; and a third processing unit for performing iterative optimization on the overall contact pressure distribution map by minimizing an objective function to obtain an optimal pressure distribution, wherein the optimal pressure distribution is used to optimize thermal conduction performance of a heat conduction layer to the target circuit board, and the heat conduction layer is used to conduct heat generated by the heat generating component to the heat dissipation module.

[0236] In an example embodiment, the apparatus further includes: a scanning unit configured to obtain temperature distribution data by performing infrared thermal imaging scanning on a surface of the running heat dissipation module; a fourth processing unit configured to perform gradient processing on the temperature distribution data to obtain a temperature gradient field, wherein the temperature gradient field is used to determine a local hotspot region in which a temperature change rate in a contact surface between the target circuit board and the heat dissipation module reaches a preset threshold; a fitting unit configured to obtain an overall thermal deformation compensation amount by fitting a thermal deformation variable of the local hotspot region; and a correction unit configured to correct assembly pose data of the running heat dissipation module based on the overall thermal deformation compensation amount to obtain corrected assembly pose data.

[0237] In an example embodiment, the apparatus further includes: a third obtaining unit configured to obtain historical assembly pose data between the heat dissipation module and the target circuit board; a feature extraction unit configured to perform feature extraction on the historical assembly pose data to obtain a key feature vector; a training unit configured to train an initial assembly pose model based on the key feature vector to obtain a trained assembly pose model; and a fifth processing unit configured to determine a target assembly parameter between a heat dissipation module to be assembled and the target circuit board by using the trained assembly pose model, wherein the assembly pose data includes the target assembly parameter.

[0238] It should be noted that each of the above modules can be implemented by software or hardware, and for the latter, the following implementation manners can be used, but are not limited thereto: all of the above modules are located in the same processor; or the above modules are located in different processors in any combination.

[0239] According to still another aspect of the embodiments of the present application, an electronic device is provided, which includes a memory and a processor, the memory stores a computer program, and the processor is configured to run the computer program to perform the steps in any of the above-mentioned heat dissipation module assembly error processing method embodiments.

[0240] According to still another aspect of the embodiments of the present application, a computer readable storage medium is provided, which stores a computer program, and the computer program is configured to perform the steps in any of the above-mentioned heat dissipation module assembly error processing method embodiments when running.

[0241] In an example embodiment, the computer readable storage medium can include, but is not limited to, a U disk, a read-only memory (ROM), a random access memory (RAM), a mobile hard disk, a magnetic disk or an optical disk, and various media that can store computer programs.

[0242] According to still another aspect of the embodiments of the present application, a computer program product is provided, which includes a computer program. The computer program, when executed by a processor, implements the steps in any of the heat dissipation module assembly error processing method embodiments.

[0243] The embodiments of the present application also provide another computer program product, which includes a non-volatile computer readable storage medium. The non-volatile computer readable storage medium stores a computer program. The computer program, when executed by a processor, implements the steps in any of the heat dissipation module assembly error processing method embodiments.

[0244] Those skilled in the art will further appreciate that the functions of the examples described herein, including any related steps of a method, can be implemented using electronic hardware, computer software, or any combination of the two. To clearly illustrate this interchangeability of hardware and software, various examples have been described herein generally in terms of their functionality. Whether such functionality is implemented as hardware or software depends on the particular application and design constraints imposed on the overall system. Skilled artisans can implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

[0245] The above provides a heat dissipation module assembly error processing method. The principles and implementation manners of the present application are described by applying specific examples. The above descriptions of the examples are only used to help understand the method of the present application and its core idea. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, some improvements and modifications can be made to the present application. These improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A method for handling assembly errors of a heat dissipation module, characterized by: include: Acquiring theoretical assembly posture data of the heat dissipation module, wherein the theoretical assembly posture data includes displacement information and posture information of the heat dissipation module relative to the target circuit board; Based on the theoretical assembly pose data, the relative position deformation between the heat dissipation module and the heat generating component on the target circuit board is predicted, wherein a three-dimensional model of the heat dissipation module is obtained; the three-dimensional model is meshed, and each mesh after the division is determined as a node to obtain a group of nodes; a sub-deformation between each node in the group of nodes and the heat generating component is determined; based on the sub-deformation, the relative position deformation is determined, wherein the relative position deformation is in the form of a thermal expansion coefficient matrix; Determining a posture error based on the actual assembly posture data of the heat dissipation module and the theoretical assembly posture data; Based on the relative position deformation and the posture error, an assembly error compensation amount is determined by a dynamic compensation calculation method, wherein the assembly error compensation amount is used to control the adjusted assembly posture to approach the desired assembly posture, and the dynamic compensation calculation method includes: inputting the posture error and the thermal expansion coefficient matrix into a dynamic compensation calculation module, and obtaining the assembly error compensation amount through Jacobian matrix mapping, thermal deformation coupling model calculation and weighted fusion algorithm; The position error is compensated and adjusted according to the assembly error compensation amount.

2. The method according to claim 1, characterized in that The obtaining of theoretical assembly pose data of the heat dissipation module includes: Obtaining hole coordinate data of fixed holes of the heat dissipation module; Acquiring anchor point coordinate data of a mechanical connection anchor point on the target circuit board, wherein the fixing hole position and the mechanical connection anchor point are positioning and fixing components used in conjunction with each other; The theoretical assembly pose data is generated based on the hole position coordinate data and the anchor point coordinate data.

3. The method according to claim 1, characterized in that Determining the sub-shape amount between each node in the group of nodes and the heat-generating component includes: Obtain each node from the set of nodes in turn as a current node; Obtaining a current temperature distribution of the current node under steady-state working conditions; Based on the current temperature distribution, thermal conductivity and current heat flux density of the current node, the current sub-shape variable of the current node is determined, wherein the thermal conductivity is used to represent the heat conduction performance of the heat conduction layer between the heat dissipation module and the heat-generating component.

4. The method according to claim 1, wherein The determining of the posture error based on the actual assembly posture data of the heat dissipation module and the theoretical assembly posture data includes: Capture images of the heat dissipation module during assembly to obtain real-time image sequences; Determining the actual assembly posture data by performing feature point matching on the real-time image sequence and the three-dimensional model projection image corresponding to the heat dissipation module; The pose error is determined based on the actual assembly pose data and the theoretical assembly pose data.

5. The method according to claim 4, characterized in that The determining of the actual assembly posture data by performing feature point matching on the real-time image sequence and the three-dimensional model projection image corresponding to the heat dissipation module includes: Extracting the coordinate offset of each feature point by matching the real-time image sequence with the three-dimensional model projection image corresponding to the heat dissipation module; The actual assembly pose data is determined based on the coordinate offsets of the respective feature points.

6. The method according to claim 1, characterized in that The determining of the assembly error compensation amount based on the relative position deformation amount and the posture error includes: Obtaining a first error compensation amount by performing mapping conversion on the posture error; determining a second error compensation amount based on the relative position deformation amount; The assembly error compensation amount is obtained by performing weighted summation on the first error compensation amount and the second error compensation amount.

7. The method according to claim 6, characterized in that The determining of a second error compensation amount based on the relative position deformation amount includes: Obtaining stress distribution on the contact surface between the heat dissipation module and the target circuit board caused by thermal deformation; Determining a thermal stress disturbance term based on the stress distribution, wherein the thermal stress disturbance term is used to indicate the degree of influence of thermal stress generated by thermal deformation on the structural stability of an assembly, the assembly including the heat dissipation module and the target circuit board; Constructing a thermal deformation coupling model based on the thermal stress disturbance term and theoretical assembly posture data; The second error compensation amount is obtained by inputting the relative position deformation amount into the thermal deformation coupling model.

8. The method according to claim 1, characterized in that The compensating and adjusting the posture error according to the assembly error compensation amount includes: Decomposing the assembly error compensation amount to obtain a displacement adjustment amount of the heat dissipation module relative to the target circuit board on each coordinate axis and an angular adjustment amount of the rotation angle along each coordinate axis in a three-dimensional coordinate system, wherein the posture information includes angular information of the rotation angle along each coordinate axis; Adjusting the actual displacement information in the actual assembly posture data according to the displacement adjustment amount; According to the angle adjustment amount, the actual angle information in the actual assembly posture data is adjusted.

9. The method according to any one of claims 1 to 8, characterized in that The method further comprises: Acquiring initial pressure distribution data of the contact surface between the heat dissipation module and the target circuit board; fusing the actual assembly posture data and the initial pressure distribution data to obtain fused pressure distribution data; An overall contact pressure distribution map is obtained by performing interpolation processing on the fused pressure distribution data; By minimizing the objective function, the overall contact pressure distribution diagram is iteratively optimized to obtain the optimal pressure distribution, wherein the optimal pressure distribution is used to optimize the thermal conductivity performance of the heat-conducting layer and the target circuit board, and the heat-conducting layer is used to conduct the heat generated by the heat-generating component to the heat dissipation module.

10. The method according to any one of claims 1 to 8, characterized in that The method further comprises: Obtaining temperature distribution data by performing infrared thermal imaging scanning on the surface of the running heat dissipation module; Performing gradient processing on the temperature distribution data to obtain a temperature gradient field, wherein the temperature gradient field is used to determine a local hot spot area in the contact surface between the target circuit board and the heat dissipation module where the temperature change rate reaches a preset threshold; By fitting the thermal deformation variable of the local hot spot area, the overall thermal deformation compensation amount is obtained; Based on the overall thermal deformation compensation amount, the assembly posture data of the running heat dissipation module is corrected to obtain the corrected assembly posture data.

11. The method according to any one of claims 1 to 8, characterized in that The method further comprises: Acquiring historical assembly posture data between the heat dissipation module and the target circuit board; Performing feature extraction on the historical assembly pose data to obtain key feature vectors; Based on the key feature vectors, the initial assembly pose model is trained to obtain a trained assembly pose model; Utilizing the trained assembly pose model, target assembly parameters between the heat dissipation module to be assembled and the target circuit board are determined, wherein the assembly pose data includes the target assembly parameters.

12. An electronic device, characterized in that: include: Memory for storing computer programs; A processor is configured to implement the steps of the method for handling assembly errors of a heat dissipation module according to any one of claims 1 to 11 when executing the computer program.

13. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, wherein when the computer program is executed by a processor, the steps of the method for handling assembly errors of a heat dissipation module according to any one of claims 1 to 11 are implemented.

14. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method for handling assembly errors of a heat dissipation module according to any one of claims 1 to 11 are implemented.

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