Series pressure type epoxy film curing jig

Abstract

The invention provides a series pressure type epoxy film curing jig, which comprises a rack, a pressing plate, a pressing plate, a pressing plate, a pressing plate, a pressing plate and a sliding rail, the plurality of pressure plates are configured to be horizontally stacked in the rack in series through a sliding rail; the head pressing plate is configured to be horizontally stacked in the rack together with a plurality of pressing plates in series through a sliding rail, and is in contact with the outermost pressing plate in the plurality of pressing plates through an ejector rod; and the pressure handle is configured to be connected with the rack through a pressure handle shaft hole and press the head pressing plate by rotating around the pressure handle shaft hole.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing, and more particularly to a serial pressure epoxy film curing jig. Background Art

[0002] During the manufacturing process of surface acoustic wave (CSP) packaged devices, an epoxy film is applied to the die to protect it and insulate it from the environment. Therefore, a layer of epoxy film is applied to the ceramic substrate (e.g., a 95mm x 95mm substrate) to which the die is soldered. The total thickness of the film-coated substrate (hereinafter referred to as the "film-coated substrate") is approximately 0.5mm.

[0003] In the lamination process, the epoxy film generally needs to undergo a curing process in an oven at 150°C for 3 hours.

[0004] In addition, a certain amount of pressure needs to be applied to the "laminated substrate" during the curing process to prevent thermal stress deformation caused by different thermal expansion coefficients of different materials.

[0005] The existing technology uses two flat pressure plates to sandwich the "film-coated substrate" between them. The pressure plates are either held in place by gravity or by spring clips, creating a jig. The jigs used in the existing technology are bulky and heavy, resulting in low oven space utilization and difficulty in transport.

[0006] In addition, there are also tooling jigs that stack the pressing plate and the "laminated substrate" at intervals and use gravity to flatten them. Although this jig solves the problems of weight and volume, the pressure on the upper and lower layers may gradually increase, making the pressure uneven and affecting the uniformity of the process. Summary of the Invention

[0007] One aspect of the present invention proposes a serial pressure epoxy film curing jig, comprising: a frame, comprising a front side plate, a rear side plate, a bottom plate, and a slide rail; a plurality of pressure plates, the plurality of pressure plates being configured to be horizontally stacked in the frame through the slide rail; a first pressure plate, which is configured to be horizontally stacked in the frame with the plurality of pressure plates through the slide rail, and to contact the outermost pressure plate of the plurality of pressure plates through a push rod; and a pressure handle, which is configured to be connected to the frame through a pressure handle shaft hole, and to press the first pressure plate by rotating around the pressure handle shaft hole.

[0008] One aspect of the present invention provides a serial pressure epoxy film curing jig, characterized in that a first pressure plate among the plurality of pressure plates is fixed to a front side plate.

[0009] One aspect of the present invention provides a serial pressure epoxy film curing jig, characterized in that the rear side plate is configured to have an axial hole designed thereon for installing a pressure handle, and the rear side plate is also configured with a pressure handle through hole so that the pressure handle contacts the first pressure plate through the pressure handle through hole.

[0010] One aspect of the present invention proposes a serial pressure epoxy film curing jig, characterized in that the front of the pressure plate is configured with a groove, and the back of the pressure plate is configured with a protrusion. When multiple pressure plates are stacked together, the protrusion on the back is pressed into the groove on the front of the next pressure plate, forming a cavity for accommodating the film-coated substrate.

[0011] One aspect of the present invention provides a serial pressure epoxy film curing jig, characterized in that the pressure plate is further provided with a connecting rod hole and a connecting rod long hole for installing a connecting rod and a hinge shaft.

[0012] One aspect of the present invention provides a serial pressure epoxy film curing jig, characterized in that it also includes a connecting rod and a hinge shaft, one end of the connecting rod is connected to the connecting rod hole of the pressure plate through the hinge shaft so that it can rotate around the hinge shaft, and the other end of the connecting rod is configured to be constrained in the connecting rod long hole of the adjacent pressure plate through the hinge shaft so that it can slide up and down along the connecting rod long hole.

[0013] One aspect of the present invention provides a serial pressure epoxy film curing jig, characterized in that the hinge shaft is configured as a three-step shaft to constrain the hinge shaft to only slide or rotate in the groove of the connecting rod long hole, or rotate in the connecting rod hole.

[0014] One aspect of the present invention proposes a serial pressure epoxy film curing jig, characterized in that the first pressure plate includes: a push rod cylinder, an adjusting bolt, a pressure spring, a push rod, and a slide rail hole. The adjusting bolt is connected to the push rod cylinder through a thread, and the pressure on the pressure spring is adjusted by adjusting the screw-in distance relative to the push rod cylinder, thereby adjusting the pressure applied by the push rod to the pressure plate.

[0015] One aspect of the present invention provides a serial pressure epoxy film curing jig, characterized in that the pressure handle is configured in an L shape.

[0016] One aspect of the present invention provides a serial pressure epoxy film curing jig, characterized in that the pressure handle is configured to have a self-locking function when in a compressed state by making the compression force generated by the pressure spring equal to and in opposite directions to the supporting force of the rear side plate on the pressure handle. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 1 is a schematic diagram showing a serial pressure epoxy film curing jig according to an embodiment of the present invention;

[0018] Figure 21 is a schematic diagram showing a frame of a serial pressure epoxy film curing jig according to an embodiment of the present invention;

[0019] Figure 3 1 is a schematic diagram showing the front side of a pressure plate of a serial pressure epoxy film curing jig according to an embodiment of the present invention;

[0020] Figure 4 1 is a schematic diagram showing the back side of a pressure plate of a serial pressure epoxy film curing jig according to an embodiment of the present invention;

[0021] Figure 5 1 is a schematic diagram showing a first pressing plate of a serial pressing epoxy film curing jig according to an embodiment of the present invention;

[0022] FIG6( a ) is a schematic diagram showing a pressure handle of a serial pressure epoxy film curing jig in a loading state according to an embodiment of the present invention;

[0023] FIG6( b ) is a schematic diagram showing a pressure handle of a serial pressure epoxy film curing jig according to an embodiment of the present invention in a compressed state; and

[0024] Figure 7 Schematic diagram showing a hinge shaft and a connecting rod of a pressure plate of a serial pressure epoxy film curing jig according to an embodiment of the present invention. DETAILED DESCRIPTION

[0025] Before proceeding with the detailed description below, it may be beneficial to set forth the definitions of certain words and phrases used throughout this document. The terms "couple," "connect," and their derivatives refer to any direct or indirect communication between two or more elements, regardless of whether those elements are in physical contact with each other. The terms "transmit," "receive," and "communicate," and their derivatives, encompass both direct and indirect communication. The terms "include," "comprise," and their derivatives, mean including but not limited to. The term "or" is inclusive, meaning and / or. The phrase "associated with..." and its derivatives mean including, included within, interconnected, containing, contained within, connected or connected with, coupled or coupled with, communicate with, cooperate, intertwine, parallel, close to, bound or bound with, having, having attributes, having a relationship, or having a relationship with, etc. The term "controller" refers to any device, system, or part thereof that controls at least one operation. Such a controller can be implemented with hardware, or a combination of hardware and software and / or firmware. The functions associated with any particular controller can be centralized or distributed, whether local or remote. The phrase "at least one of," when used with a list of items, means that different combinations of one or more of the listed items may be used, and only one of the items in the list may be needed. For example, "at least one of A, B, and C" includes any of the following combinations: A, B, C, A and B, A and C, B and C, and A, B, and C.

[0026] Definitions for additional specific words and phrases are provided throughout this document. Those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior and future uses of such defined words and phrases.

[0027] In this invention document, the application combination of circuit blocks and the division of sub-circuit blocks are only for illustration, and the application combination of circuit blocks and the division of sub-circuit blocks may be in different ways without departing from the scope of the present disclosure.

[0028] The following discussion Figures 1 to 7 The various embodiments used to describe the principles of the present invention are for illustration only and should not be interpreted in any way as limiting the scope of the present disclosure. Those skilled in the art will understand that the principles of the present disclosure can be implemented in any appropriately arranged system or device.

[0029] In response to the problems of uneven pressure, poor adjustability, bulky size and heavy weight of existing jigs that are not suitable for transportation, the present invention provides a serial pressure epoxy film curing jig. The jig according to the present invention uses the elastic force generated by spring compression as the acting force, and adjusts the pressure by adjusting the compression amount of the spring.

[0030] Figure 1 Schematic diagram of a serial pressure epoxy film curing jig according to an embodiment of the present invention.

[0031] like Figure 1 As shown, the serial pressure epoxy film curing jig of an embodiment of the present invention includes: a frame 1-1; a plurality of pressure plates 1-2, which are horizontally stacked in the frame; a first pressure plate 1-3, which is configured to contact the outermost pressure plate of the plurality of pressure plates through a push rod; and a pressure handle 1-4, which is configured to be connected to the frame through a pressure handle shaft hole and to press the first pressure plate by rotating around the pressure handle shaft hole. The plurality of pressure plates 1-2 are also connected by a hinge shaft 1-5 and a connecting rod 1-6.

[0032] Figure 2 3 is a schematic diagram showing a frame of a serial pressure epoxy film curing jig according to an embodiment of the present invention.

[0033] refer to Figure 2 The frame according to the embodiment of the present invention includes a front side plate 2-1, a rear side plate 2-2, a bottom plate 2-3, and a slide rail 2-4. The front side plate 2-1, the rear side plate 2-2, the bottom plate 2-3, and the slide rail 2-4 constitute a structure supporting the jig and bear the pressure load during the lamination operation.

[0034] According to an embodiment of the present invention, a plurality of pressure plates and a front pressure plate are stacked in series on the slide rail 2 - 4 and slide along the axis of the slide rail 2 - 4 .

[0035] According to an embodiment of the present invention, the first pressure plate among the plurality of pressure plates is fixed on the front side plate 2 - 1 .

[0036] According to an embodiment of the present invention, the rear side plate 2-2 is configured to have an axial hole 2-5 designed thereon for installing a pressure handle. In addition, the rear side plate 2-2 is configured to have a pressure handle through hole 2-6 so that the pressure handle contacts the first pressure plate through the through hole 2-6.

[0037] According to an embodiment of the present invention, the rear side plate 2 - 2 is further configured to have a through hole 2 - 7 designed thereon, so that the push rod cylinder of the first pressure plate is installed through the through hole 2 - 7 .

[0038] Figure 3 and Figure 4 Schematic diagrams respectively show the front and back sides of a pressure plate of a serial pressure epoxy film curing jig according to an embodiment of the present invention.

[0039] refer to Figure 3 and Figure 4 The front of the pressure plate is designed with a groove, and the "film-coated substrate" is placed in the groove. The back of the pressure plate is convex. When multiple pressure plates are stacked together, the convex part on the back is pressed into the groove on the front of the next pressure plate, forming a cavity. The "film-coated substrate" is inserted into this cavity. When pressure is applied, the "film-coated substrate" is flattened.

[0040] According to an embodiment of the present invention, a slide rail hole 3 - 1 is designed on the pressure plate so that the pressure plate can slide along the slide rail.

[0041] According to an embodiment of the present invention, a connecting rod hole 3-2 and a connecting rod long hole 3-3 are also designed on the pressure plate for installing a connecting rod and a hinge shaft to constrain the movement of the pressure plate.

[0042] According to an embodiment of the present invention, a sheet taking slot 3-4 is also designed on the pressure plate to facilitate taking and placing the "film-covered substrate".

[0043] Figure 5 Schematic diagram showing the first pressing plate of the serial pressing epoxy film curing fixture according to an embodiment of the present invention.

[0044] refer to Figure 5 The first pressure plate is configured to include: a push rod cylinder 5-1, an adjusting bolt 5-2, a pressure spring 5-3, a push rod 5-4, and a slide rail hole 5-5. The adjusting bolt 5-2 is threaded onto the push rod cylinder 5-1. Adjusting the screw distance of the adjusting bolt 5-2 relative to the push rod cylinder 5-1 adjusts the pressure on the pressure spring 5-3, and thus adjusts the pressure applied by the push rod 5-4 to the pressure plate, achieving the pushing operation.

[0045] According to an embodiment of the present invention, the first pressure plate is configured to be pushed by the pressure handle to press the pressure plate.

[0046] In addition, according to an embodiment of the present invention, by controlling the compression amount of the pressure spring 5-3 by adjusting the bolt 5-2, pressure control during extrusion is achieved to provide further control and adjustment of the pressure between the pressure handle and the pressure plate.

[0047] According to an embodiment of the present invention, the first pressure plate is configured to be designed with a slide rail hole 5 - 5 for being installed on the slide rail and sliding thereon.

[0048] 6( a ) and 6 ( b ) are schematic diagrams showing a pressure handle of a serial pressure epoxy film curing jig according to an embodiment of the present invention in a loading state and a pressing state, respectively.

[0049] 6( a ) and 6 ( b ), the pressure handle 6 - 4 is configured in an L-shape and is configured to be connected to the frame through the pressure handle shaft hole 6 - 5 .

[0050] According to an embodiment of the present invention, the pressure handle 6-4 is configured to have a working length R to meet the cavity distance a1 between multiple pressure plates 6-2 when in a loaded state; and the cavity distance a2 when in a compressed state, that is, the thickness of the "laminated substrate 6-1".

[0051] By turning the pressure handle, the distance between the front end of the first pressure plate 6-3 and the rear side plate changes between c1-c2, and by adjusting the bolt, the length of the pressure spring changes between b1-b2 to provide further adjustment of the pressure of the first pressure plate.

[0052] According to an embodiment of the present invention, the pressure handle is further configured to have a self-locking function in the compressed state. When the pressure handle is in the compressed state, it is constrained by the rear side plate of the frame, so that the compression force generated by the pressure spring and the supporting force of the rear side plate on the pressure handle are equal and opposite in direction, thereby achieving self-locking.

[0053] Those skilled in the art should understand that, although according to an embodiment of the present invention, the pressure handle is configured in an L shape, and the rear side plate is configured with a pressure handle through-hole so that the pressure handle contacts the first pressure plate through the through-hole, the above example is only for demonstration and does not limit the scope of the present invention. Without departing from the scope of the present invention, it can also be configured in other shapes, for example, the pressure handle is configured in the shape of an eccentric wheel, and the pressure handle is provided on the surface of the rear side plate facing the first pressure plate to press the first pressure plate by rotating around the shaft hole.

[0054] Figure 7Schematic diagram showing a hinge shaft and a connecting rod of a pressure plate of a serial pressure epoxy film curing jig according to an embodiment of the present invention.

[0055] refer to Figure 7 One end of the connecting rod 7-2 is connected to the connecting rod hole of the pressure plate via a hinge shaft 7-1, allowing it to rotate about the hinge shaft 7-1. The other end of the connecting rod 7-2 is configured to be constrained by the hinge shaft within the connecting rod slot of the adjacent pressure plate, allowing it to slide up and down. According to an embodiment of the present invention, the hinge shaft 7-1 is configured as a three-step shaft to constrain the hinge shaft 7-1 to slide or rotate only within the slot of the connecting rod slot or rotate within the connecting rod hole.

[0056] According to an embodiment of the present invention, the connecting rod is configured to enable multiple pressure plates to move simultaneously and equidistantly in the direction of the slide rail. Since the pressure plate is constrained by the slide rail of the frame, the connecting rod, the hinge shaft, the connecting rod hole of the pressure plate, and the connecting rod slot, when loading, if any one of the pressure plates is pulled apart along the axis of the slide rail, all the stacked pressure plates will be equidistantly separated.

[0057] According to the serial pressure epoxy film curing jig of the present invention, by designing concave and convex pressure plates, the pressure plates are embedded in each other when stacked to form a cavity for loading, thereby saving the types of parts and the volume of the jig; by designing a slide rail on the frame, the pressure plate is constrained from moving along the axial direction of the slide rail; by designing a pressure handle on the frame, when the pressure plate is pushed to perform the pressing work, it can self-lock in the pressing state; by designing a first pressure plate, the first pressure plate is placed between the pressure handle and the pressure plate, and is used to adjust and control the pressure of the pressing work; by designing a connecting rod constraint between the pressure plates, the movement distance between all the pressure plates is always equal.

[0058] Although the present disclosure has been described with exemplary embodiments, various changes and modifications may be suggested to one skilled in the art. It is intended that the present disclosure encompass such changes and modifications as fall within the scope of the appended claims.

[0059] Any description in the present invention should not be construed as implying that any particular element, step, or function is essential to be included in the claims scope. The scope of the inventive subject matter is limited only by the claims.

Claims

1. A serial pressure epoxy film curing fixture, comprising: A rack, including a front side panel, a rear side panel, a bottom panel, and slide rails; a plurality of pressure platens, the plurality of pressure platens being configured to be horizontally stacked in a rack via slide rails; a first pressure plate, which is configured to be stacked horizontally with a plurality of pressure plates in a frame via a slide rail and to contact an outermost pressure plate among the plurality of pressure plates via a push rod; as well as The pressure handle is configured to be connected to the frame through the pressure handle shaft hole and to press the first pressure plate by rotating around the pressure handle shaft hole.

2. The serial pressure epoxy film curing fixture according to claim 1, characterized in that: A first pressure plate of the plurality of pressure plates is fixed to the front side plate.

3. The serial pressure epoxy film curing jig according to claim 1, characterized in that: The rear side plate is configured to have an axial hole designed thereon for mounting a pressure handle. The rear side plate is further configured with a pressure handle through hole, so that the pressure handle contacts the first pressure plate through the pressure handle through hole.

4. The serial pressure epoxy film curing fixture according to claim 1, characterized in that: The front of the pressure plate is configured with a groove, and the back of the pressure plate is configured with a protrusion. When multiple pressure plates are stacked together, the protrusion on the back is pressed into the groove on the front of the next pressure plate to form a cavity for accommodating the laminated substrate.

5. The serial pressure epoxy film curing jig according to claim 1, characterized in that: The pressure plate is also provided with a connecting rod hole and a connecting rod long hole for installing the connecting rod and the hinge shaft.

6. The serial pressure epoxy film curing jig according to claim 5, characterized in that: It also includes connecting rods and hinge shafts, One end of the connecting rod is connected to the connecting rod hole of the pressure plate through a hinge shaft so that it can rotate around the hinge shaft, and the other end of the connecting rod is configured to be constrained in the connecting rod long hole of the adjacent pressure plate through the hinge shaft so that it can slide up and down along the connecting rod long hole.

7. The serial pressure epoxy film curing jig according to claim 6, characterized in that: The hinge shaft is configured as a three-step shaft to constrain the hinge shaft to only slide or rotate in the groove of the connecting rod long hole, or rotate in the connecting rod hole.

8. The serial pressure epoxy film curing jig according to claim 1, characterized in that: The first pressure plate includes: a push rod cylinder, an adjusting bolt, a pressure spring, a push rod, and a slide rail hole. The adjusting bolt is connected to the push rod cylinder through a thread, and the pressure on the pressure spring is adjusted by adjusting the screw-in distance relative to the push rod cylinder, thereby adjusting the pressure applied by the push rod to the pressure plate.

9. The serial pressure epoxy film curing jig according to claim 1, characterized in that: The pressure handle is configured in an L-shape.

10. The serial pressure epoxy film curing jig according to claim 8, characterized in that: The pressure handle is configured to have a self-locking function when in a compressed state by making the compression force generated by the pressure spring equal to and opposite in direction to the supporting force of the rear side plate on the pressure handle.

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