Silicon-based immersed cooling liquid for electronic components

Abstract

The invention relates to a silicon-based immersed cooling liquid for electronic components and a preparation method of the silicon-based immersed cooling liquid. The silicon-based cooling liquid with the heat conductivity coefficient exceeding 0.50 W / m.K and good long-term stability can be obtained by mixing the branched-chain polysiloxane, the phenyl alkoxy silane and the modified silicone oil, the heat conductivity coefficient of the silicon-based cooling liquid is greatly improved compared with the heat conductivity coefficient of 0.110-0.220 W / m.K of a conventional silicon-based cooling liquid with low-viscosity silicone oil as a main body, and the silicon-based cooling liquid has a great application prospect in electronic components.

Description

Technical Field

[0001] The present invention relates to a preparation method and production technology of an immersion cooling liquid, and in particular to a silicon-based immersion cooling liquid for electronic components and a preparation method thereof. Background Art

[0002] As my country's industry continues to accelerate its digital transformation, the energy storage temperature control market is also developing rapidly. Currently, cold plate liquid cooling technology is relatively mature, accounting for 80% of the liquid cooling market. Immersion liquid cooling, due to its higher cooling efficiency, has become the current research and development focus of mainstream manufacturers. As liquid cooling technology continues to mature, it is expected that immersion cooling will become the mainstream cooling and heat dissipation solution for big data centers.

[0003] Currently, fluorinated fluids are the mainstream immersion coolant, with 3M being a leading manufacturer. However, due to their high cost and the environmental pollution and damage caused by fluorinated materials, fluorinated fluids are gradually being replaced by mineral oils, synthetic oils, and silicone oils.

[0004] CN 113969141 A discloses an immersion coolant for IT communication equipment and its preparation method. The coolant is primarily composed of hydrofluoroether compounds, which are mixed with halogenated hydrocarbons, alcohols, and other compounds to form an azeotrope. The coolant is supplemented with antioxidants, preservatives, and composite nanofluid additives to form a coolant composition. The added TiO2-SiO2 composite nanofluid is prepared using low-temperature hydrogen plasma. Compared to single nanooxides, the specific heat capacity is increased by approximately 30%, and the thermal conductivity is also improved. The coolant also exhibits good insulation and a high breakdown voltage. The coolant has a boiling point of 60-80°C, a viscosity of 10-20 cSt at 50°C, and a thermal conductivity of 0.100-0.16 W / mK.

[0005] CN 116731689 B relates to an immersion cooling liquid based on silicone oil for electronic components, the main component of which is 70% ~85% low viscosity silicone oil, 10%~20% silicone oil diluent, 5%~10% inorganic thermal conductive filler, the thermal conductivity of this immersion coolant is 0.110-0.220W / mK.

[0006] The above patents and documents show that the coolant with hydrofluoroether compounds as the main component pollutes and damages the atmosphere and has a thermal conductivity of no more than 0.200W / mK. In addition, the coolant with conventional low-viscosity silicone oil as the main component has a thermal conductivity of no more than 0.250W / mK, which means there is much room for improvement in efficient heat exchange.

[0007] In order to provide silicon-based coolant with better fluidity and improve its thermal conductivity, this patent provides a silicon-based immersion coolant for electronic components and a preparation method. Summary of the Invention

[0008] In order to provide silicon-based coolants with good fluidity and high thermal conductivity, this patent provides a silicon-based immersion coolant for electronic components and a preparation method.

[0009] A silicon-based immersion coolant comprises a component 1 of branched polysiloxane, a component 2 of a silane stabilizer, a component 3 of modified silicone oil, and a component 4 of a corrosion inhibitor.

[0010] After mixing components 1, 2 and 3, the temperature is raised to 60-100°C, and then component 4 is added, stirred for 0.5-1h, inert gas is introduced, and the temperature is maintained at 60-100°C and stirred for 2-10h. After cooling to room temperature and filling with inert gas, a silicon-based immersion coolant is obtained.

[0011] In some embodiments, the reaction is carried out in an enameled kettle with tetrafluoroethylene stirring.

[0012] The branched polysiloxane includes one or more combinations of methyl-T-branched polydimethylsiloxane, tetrachlorophenyl-T-branched polydimethylsiloxane, and phenyl-tris(trimethylsiloxane)silane, accounting for 90.0-99.0% of the coolant, preferably 96-98%.

[0013] The silane stabilizer comprises one or more of methylphenyldimethoxysilane, methylphenyldiethoxysilane, ethylphenyldimethoxysilane, and ethylphenyldiethoxysilane, accounting for 0.5-5.0% of the coolant, preferably 1-2%.

[0014] The modified silicone oil, one or more of polyether modified silicone oil, alkyl modified silicone oil, and polyether polyester multi-block silicone oil, has a viscosity of ≤100 cSt and a surface tension of ≤22.0 mN / m, and accounts for 0.1-5.0% of the coolant, preferably 1-1.5%.

[0015] The corrosion inhibitor includes one or more of benzotriazole, mercaptobenzothiazole, and methylbenzotriazole, accounting for 0.1-5.0% of the coolant, preferably 0.3-0.5%.

[0016] The inert gas includes nitrogen or argon with a purity greater than 99.99%.

[0017] The present invention also provides a silicon-based immersion coolant for electronic components, including the silicon-based immersion coolant.

[0018] The thermal conductivity of the coolant is greater than 0.5 W / (m·K), and more preferably greater than 0.6 W / (m·K).

[0019] The water content is less than 20 ppm, more preferably less than 15 ppm, and even more preferably less than 10 ppm.

[0020] On the other hand, the present invention also provides a new use of the silicon-based immersion coolant for electronic components as a coolant in any electronic component including lithium-ion batteries, sodium-ion batteries, solid-state batteries, CPUs, motherboards, memory sticks, hard disks, and integrated circuit boards.

[0021] Through the above technical solutions, the present invention has the following technical effects: Branched polysiloxane, due to its high thermal conductivity due to its T-shaped structure, is the main thermal conductive material. Phenyl alkoxy silane helps maintain the T-shaped structure of branched polysiloxane under the influence of temperature or other environmental factors. Modified silicone oil, due to its low surface tension, promptly eliminates foam on the substrate surface and promotes the infiltration of the coolant into the substrate, which helps to transfer heat to the substrate in a timely manner. Buffers reduce or eliminate the corrosion of the coolant on immersed components, thereby increasing the service life of the coolant.

[0022] Through the optimal formulation of branched polysiloxane, phenyl alkoxysilane, modified silicone oil, etc., a thermal conductivity of more than 0.50W / mK can be obtained and it is stable for at least 100 days at 120°C. It is a silicone-based coolant with good long-term stability. The thermal conductivity of the silicone-based coolant with conventional low-viscosity silicone oil as the main body is greatly improved by 0.110-0.220W / mK, and it has great application prospects in electronic components. DETAILED DESCRIPTION

[0023] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar modifications without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0024] The technical solution of the present invention provides a silicon-based immersion coolant on one hand, comprising: A silicon-based immersion coolant is composed of component 1, branched polysiloxane, component 2, silane stabilizer, component 3, modified silicone oil, component 4, corrosion inhibitor, etc. Components 1, 2, and 3 are added in proportion to an enamel kettle with tetrafluoroethylene stirring, the temperature is raised to 60-100°C, component 4 is added in proportion, and stirring is carried out for 0.5-1h. High-purity inert gas is blown into the bottom, the temperature is maintained at 60-100°C and stirring is continued for 2-10h, the temperature is cooled to room temperature, and the high-purity inert gas is filled and packaged.

[0025] The branched polysiloxane includes one or more combinations of methyl-T-branched polydimethylsiloxane, tetrachlorophenyl-T-branched polydimethylsiloxane, and phenyl-tris(trimethylsiloxane)silane, accounting for 90.0-99.0% of the coolant.

[0026] The silane stabilizer comprises one or more of methylphenyldimethoxysilane, methylphenyldiethoxysilane, ethylphenyldimethoxysilane, and ethylphenyldiethoxysilane, accounting for 0.5-5.0% of the coolant.

[0027] The modified silicone oil, one or more of polyether modified silicone oil, alkyl modified silicone oil, polyether polyester multi-block silicone oil, etc., has a viscosity of ≤100 cSt, a surface tension of ≤22.0 mN / m, and accounts for 0.1-5.0% of the coolant.

[0028] The corrosion inhibitor includes one or more of benzotriazole, mercaptobenzothiazole, and methylbenzotriazole, accounting for 0.1-5.0% of the coolant.

[0029] The high-purity inert gas includes nitrogen or argon with a purity of 99.99%.

[0030] The electronic components include lithium-ion batteries, sodium-ion batteries, solid-state batteries, CPUs, motherboards, memory sticks, hard disks, integrated circuit boards, etc.

[0031] In view of the above technical content, the present invention provides the following embodiments Example 1 9.6 kg of methyl-branched-polydimethylsiloxane (CAS: 68037-74-77), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred and mixed at 60-65°C for 6 hours. The temperature was then lowered to room temperature, and the mixture was filled with nitrogen and packaged to obtain a transparent silicon-based coolant F1.

[0032] Example 2 9.6 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of 2-tert-butylhydroquinone and 0.05 kg of benzotriazole were added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred at 60-65°C for 6 hours. The mixture was cooled to room temperature, filled with nitrogen, and packaged to obtain a transparent silicon-based coolant F2.

[0033] Example 3 9.6 kg of phenyl-tris(trimethylsiloxane)silane (CAS: 2116-48-9), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of 2-tert-butylhydroquinone and 0.05 kg of benzotriazole were added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred at 60-65°C for 6 hours. The mixture was cooled to room temperature, filled with nitrogen, and packaged to obtain a transparent silicon-based coolant F3.

[0034] Comparative Example 1 9.6 kg KM-30LV dimethyl silicone oil (Yichang Kelin Silicon Materials Co., Ltd., brand KM-30LV, viscosity 29 cSt, volatile matter 0.25%), 0.2 kg methylphenyldimethoxysilane, and 0.15 kg modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, and 0.05 kg 2-tert-butylhydroquinone and 0.05 kg benzotriazole were added and stirred for 1 hour. 99.99% nitrogen was bubbled into the bottom, and the mixture was stirred at 60-65°C for 6 hours. The mixture was cooled to room temperature, filled with nitrogen, and packaged to obtain a transparent silicon-based coolant F1-1. Comparative Example 2 6.6 kg KM-30LV dimethyl silicone oil (Yichang Kelin Silicon Materials Co., Ltd., brand KM-30LV, viscosity 29 cSt, volatile matter 0.25%), 3 kg methyl-branched-polydimethylsiloxane (CAS: 68037-74-77), 0.2 kg methylphenyldimethoxysilane, and 0.15 kg modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, and 0.05 kg 2-tert-butylhydroquinone and 0.05 kg benzotriazole were added and stirred for 1 hour. 99.99% nitrogen was bubbled into the bottom, and the mixture was maintained at 60-65°C with stirring for 6 hours. The mixture was cooled to room temperature, filled with nitrogen, and packaged to obtain a transparent silicon-based coolant F1-2.

[0035] The test results of the samples of Examples 1-3 and Comparative Examples 1-2 are shown in Table 1.

[0036] Table 1 Test results of samples of Examples 1-3 and Comparative Examples 1-2

[0037] From the results in Table 1, we can see that the first is the coolant with 30 cSt dimethyl silicone oil as the main component, with a thermal conductivity of 0.153 W / mK; the second is the coolant with methyl-branched-polydimethylsiloxane, tetrachlorophenyl-T-branched polydimethylsiloxane, and phenyl-tris(trimethylsiloxane)silane as the main components, with thermal conductivity greater than 0.50 W / mK, among which the thermal conductivity of the coolant with tetrachlorophenyl-T-branched polydimethylsiloxane as the main component is as high as 0.650 W / mK.

[0038] Example 4 4.8 kg of methyl-branched polydimethylsiloxane (CAS: 68037-74-77), 4.8 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred and mixed at 60-65°C for 6 hours. The temperature was then lowered to room temperature, and the mixture was filled with nitrogen and packaged to obtain a transparent silicon-based coolant F4. Comparative Example 3 4.9 kg of methyl-branched polydimethylsiloxane (CAS: 68037-74-77), 4.9 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred at 60-65°C for 6 hours. The mixture was cooled to room temperature, filled with nitrogen, and packaged to obtain a transparent silicon-based coolant F1-3. Example 5 4.8 kg of methyl-branched-polydimethylsiloxane (CAS: 68037-74-77), 4.8 kg of phenyl-tris(trimethylsiloxane)silane (CAS: 2116-48-9), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred and mixed at 60-65°C for 6 hours. The temperature was then lowered to room temperature, and the mixture was filled with nitrogen and packaged to obtain a transparent silicon-based coolant F5. Comparative Example 4 4.9 kg of methyl-branched-polydimethylsiloxane (CAS: 68037-74-77), 4.85 kg of phenyl-tris(trimethylsiloxane)silane (CAS: 2116-48-9), and 0.20 kg of methylphenyldimethoxysilane were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C. 0.05 kg of benzotriazole was added and stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred at 60-65°C for 6 hours. The temperature was then lowered to room temperature, and the mixture was filled with nitrogen and packaged to obtain a transparent silicon-based coolant F1-4. Example 6 4.8 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), 4.8 kg of phenyl-tris(trimethylsiloxane) silane (CAS: 2116-48-9), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred and mixed at 60-65°C for 6 hours. The temperature was then cooled to room temperature, and the mixture was filled with nitrogen and packaged to obtain a transparent silicon-based coolant F5.

[0039] Comparative Example 5 4.85 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), 4.8 kg of phenyl-tris(trimethylsiloxane)silane (CAS: 2116-48-9), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, and 99.99% nitrogen was introduced into the bottom of the kettle. The mixture was stirred and maintained at 60-65°C for 6 hours. The temperature was then lowered to room temperature, and the mixture was filled with nitrogen to obtain a transparent silicone-based coolant F1-5. The test results of the samples of Examples 4-6 and Comparative Examples 3-5 are shown in Table 2.

[0040] Table 2 Test results of Examples 4-6 and Comparative Examples 3-5

[0041] Note: 1. For substrate wetting rate, select a fixed model circuit board, apply 2 drops of coolant to a fixed point on the circuit board, and calculate the area wetted within 5 seconds; 2. Copper strip corrosion, refer to the standard GB / T 5096 "Petroleum products copper strip corrosion test method".

[0042] As shown in Table 2, Example 4 and Comparative Example F1-3 show that methylphenyldimethoxysilane can increase the viscosity stability of the coolant after 120°C*100 days; Example 5 and Comparative Example F1-4 show that Dow FZ-3196 modified silicone oil helps to increase the wetting rate of the coolant on the substrate; Example 6 and Comparative Example F1-5 show that the corrosion inhibitor benzotriazole helps to slow down the corrosion of the coolant on the copper sheet.

[0043] Example 7 3.2 kg of methyl-branched-polydimethylsiloxane (CAS: 68037-74-77), 6.4 kg of phenyl-tris(trimethylsiloxane)silane (CAS: 2116-48-9), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred and mixed at 90-95°C for 6 hours. The mixture was cooled to room temperature, filled with nitrogen, and packaged to obtain a transparent silicon-based coolant F7. Example 8 3.2 kg of methyl-branched-polydimethylsiloxane (CAS: 68037-74-77), 3.2 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), 3.2 kg of phenyl-tris(trimethylsiloxane)silane, 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and the mixture was stirred for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred and mixed at 90-95°C for 6 hours. The temperature was then cooled to room temperature, and the mixture was filled with nitrogen and packaged to obtain a transparent silicon-based coolant F8. Comparative Example 6 3.2 kg of methyl-branched polydimethylsiloxane (CAS: 68037-74-77), 3.2 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), 3.2 kg of phenyl-tris(trimethylsiloxane)silane (CAS: 2116-48-9), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, 0.05 kg of benzotriazole was added, and stirring was carried out for 1 hour. 99.99% nitrogen was introduced into the bottom of the kettle, and the mixture was stirred at 40-45°C for 8 hours. The temperature was then cooled to room temperature, and the mixture was filled with nitrogen and packaged to obtain a transparent silicon-based coolant F1-6. Comparative Example 7 3.2 kg of methyl-branched polydimethylsiloxane (CAS: 68037-74-77), 3.2 kg of tetrachlorophenyl-T-branched polydimethylsiloxane (CAS: 68857-05-1), 3.2 kg of phenyl-tris(trimethylsiloxane)silane (CAS: 2116-48-9), 0.2 kg of methylphenyldimethoxysilane, and 0.15 kg of modified silicone oil (Dow FZ-3196, viscosity 3 cSt, surface tension 20.4 mN / m) were added to an enameled kettle with a tetrafluoroethylene stirrer. The temperature was raised to 60-65°C, and 0.05 kg of benzotriazole was added and stirred for 1 hour. The mixture was maintained at 90-95°C with stirring for 8 hours. The temperature was then cooled to room temperature and the mixture was packaged in an open container to obtain a transparent silicone-based coolant F1-7. The test results of the samples of Example 7, Comparative Examples 1-6 and Comparative Examples 1-7 are shown in Table 3.

[0044] Table 3 Test results of samples of Examples 7-8 and Comparative Examples 1-6 and Comparative Examples 1-7

[0045] As can be seen from Table 3, the volume resistivity of Examples 7 and 8 is relatively large. The high-purity N2 of not less than 99.99% can effectively remove moisture from the coolant and isolate moisture from the air during packaging, which helps to improve the electrical performance of the coolant.

[0046] The specific embodiments in this application are merely explanations of this application and are not limitations of this application. After reading this specification, those skilled in the art may make modifications to the embodiments without creative contribution as needed.

Claims

1. A silicon-based immersion coolant, characterized in that: The invention comprises component 1, branched polysiloxane, component 2, silane stabilizer, component 3, modified silicone oil and component 4, corrosion inhibitor.

2. The silicon-based immersion coolant according to claim 1, characterized in that: After mixing components 1, 2 and 3, the temperature is raised to 60-100°C, and then component 4 is added, stirred for 0.5-1h, inert gas is introduced, and the temperature is maintained at 60-100°C and stirred for 2-10h. After cooling to room temperature and filling with inert gas, a silicon-based immersion coolant is obtained.

3. The silicon-based immersion coolant according to claim 1, characterized in that: The branched polysiloxane includes one or more combinations of methyl-T-branched polydimethylsiloxane, tetrachlorophenyl-T-branched polydimethylsiloxane, and phenyl-tris(trimethylsiloxane)silane, accounting for 90.0-99.0% of the coolant, preferably 96-98%.

4. The silicon-based immersion coolant according to claim 1, characterized in that: The silane stabilizer comprises one or more of methylphenyldimethoxysilane, methylphenyldiethoxysilane, ethylphenyldimethoxysilane, and ethylphenyldiethoxysilane, accounting for 0.5-5.0% of the coolant, preferably 1-2%.

5. The silicon-based immersion coolant according to claim 1, characterized in that: The modified silicone oil, one or more of polyether modified silicone oil, alkyl modified silicone oil, and polyether polyester multi-block silicone oil, has a viscosity of ≤100 cSt and a surface tension of ≤22.0 mN / m, and accounts for 0.1-5.0% of the coolant, preferably 1-1.5%.

6. The silicon-based immersion coolant according to claim 1, characterized in that: The corrosion inhibitor includes one or more of benzotriazole, mercaptobenzothiazole, and methylbenzotriazole, accounting for 0.1-5.0% of the coolant, preferably 0.3-0.5%.

7. The silicon-based immersion coolant according to claim 2, characterized in that: The inert gas includes nitrogen or argon with a purity greater than 99.99%.

8. A silicon-based immersion coolant for electronic components, characterized in that: The method comprises the silicon-based immersion cooling liquid according to any one of claims 1 to 7.

9. The silicon-based immersion coolant for electronic components according to claim 8, characterized in that: The thermal conductivity of the coolant is greater than 0.5 W / (m·K), and more preferably greater than 0.6 W / (m·K).

10. A novel use of the silicon-based immersion coolant for electronic components according to claim 8 or 9 as a coolant in any electronic component including lithium-ion batteries, sodium-ion batteries, solid-state batteries, CPUs, motherboards, memory sticks, hard disks, and integrated circuit boards.

Images