Vacuum tracking detection device and method for moving magnetron sputtering cathode

Abstract

The present invention discloses a vacuum tracking detection device and method for a mobile magnetron sputtering cathode, and relates to the technical field of vacuum coating equipment. It is suitable for coating equipment that uses a mobile magnetron sputtering cathode in a vacuum chamber, and includes a thin film gauge vacuum gauge, a thin film gauge mounting cylinder, a thin film gauge mounting splint, a target surface gas collection tube, a flexible ventilation duct, and a flexible cable. The thin film gauge mounting splint fixes the thin film gauge vacuum gauge, the thin film gauge mounting cylinder, and the target surface gas collection tube on the magnetron sputtering cathode, so that the three can follow the magnetron sputtering cathode and move synchronously in the vacuum chamber of the coating equipment. The present invention achieves adaptive tracking by fixedly connecting the thin film gauge vacuum gauge to the magnetron sputtering cathode and using a flexible ventilation duct and a flexible cable to track and detect the vacuum degree of the moving cathode target surface in real time and feed back to the gas controller. The gas controller dynamically adjusts the gas supply flow according to the feedback data to maintain the stability of the sputtering gas pressure and significantly improve the uniformity of the thin film.

Description

Technical Field

[0001] The present invention relates to the technical field of vacuum coating equipment, and in particular to a vacuum tracking detection device and method for a mobile magnetron sputtering cathode. Background Art

[0002] Magnetron sputtering coating technology is widely used in the fields of semiconductors, optical thin films, and functional coatings. Its operating principle is as follows: In a vacuum, electrons, under the influence of an electric field, fly toward a substrate. During this process, they collide with inert gas atoms, ionizing the inert gas atoms and producing positive inert gas ions and new electrons. The positive inert gas ions are then accelerated by the electric field toward the cathode and bombard the target surface with high energy, causing the target material to sputter. The sputtered target atoms or molecules are then deposited on the substrate to form a thin film.

[0003] Currently, magnetron sputtering is commonly used for coating sheet materials, such as glass substrates. In traditional processes, the magnetron sputtering cathode in the vacuum chamber is usually fixed, and the vacuum detection device (such as a thin film gauge) is installed in a fixed position in the vacuum chamber.

[0004] However, as process requirements become more complex, dynamic moving cathode technology has been introduced to improve coating uniformity and efficiency. However, existing technologies do not allow the vacuum detection device to move synchronously with the cathode. This results in hysteresis and deviation in vacuum measurement when the cathode moves to different positions, and inability to provide real-time feedback on changes in target surface pressure. This problem directly affects the accuracy of gas flow control, leading to unstable sputtering pressure and reduced film uniformity. Summary of the Invention

[0005] The purpose of the present invention is to provide a vacuum tracking detection device and method for a mobile magnetron sputtering cathode, so as to solve the problem that the existing fixed vacuum detection device is difficult to reflect the actual vacuum state of the sputtering area in real time, resulting in a lag in gas flow regulation, affecting the stability of the sputtering gas pressure, and thus reducing the uniformity of the film and product quality.

[0006] To achieve the above objectives, the technical solutions adopted by the present invention are as follows:

[0007] A vacuum tracking detection device for a mobile magnetron sputtering cathode is suitable for coating equipment using a mobile magnetron sputtering cathode in a vacuum chamber. The vacuum tracking detection device includes a thin film gauge vacuum gauge, a thin film gauge mounting cylinder, a thin film gauge mounting clamp, a target surface gas collection pipe, a flexible ventilation pipe, and a flexible cable. The thin film gauge mounting cylinder is fixedly connected to the magnetron sputtering cathode via the thin film gauge mounting clamp, the thin film gauge vacuum gauge is sealed and installed in the thin film gauge mounting cylinder via a vacuum interface, the exhaust port of the target surface gas collection pipe is fixedly connected to the vacuum interface of the thin film gauge vacuum gauge, and the collection port of the target surface gas collection pipe is aligned with the surface of the magnetron sputtering cathode target. The flexible ventilation pipe and the flexible cable are both connected between the thin film gauge mounting cylinder and the vacuum chamber wall, and the flexible cable is communicatively connected to the signal end of the thin film gauge vacuum gauge. The flexible ventilation pipe is used to maintain the atmospheric state in the thin film gauge mounting cylinder, and the flexible cable is used to transmit the signal of the thin film gauge vacuum gauge to a gas controller. The gas controller adjusts the opening of the gas flow valve of the magnetron sputtering cathode according to the feedback signal of the thin film gauge vacuum gauge.

[0008] As a further solution of the present invention: the thin film gauge mounting clamp includes a mounting plate, a chuck and a locking bolt, one end of the mounting plate is fixedly connected to the magnetron sputtering cathode through the cooperation of the chuck and the locking bolt, and the other end of the mounting plate is fixedly installed with the thin film gauge mounting cylinder, and the connection between the thin film gauge mounting cylinder and the mounting plate is sealed by a No. 1 sealing ring.

[0009] As a further solution of the present invention: the top cover of the thin film gauge mounting cylinder is fixedly connected to the mounting plate, the vacuum interface of the thin film gauge vacuum gauge is fixed to the mounting plate by the snap engagement of the top cover, and the connection between the vacuum interface of the thin film gauge vacuum gauge and the mounting plate is sealed by a No. 2 sealing ring.

[0010] As a further solution of the present invention: the exhaust port of the target surface gas collection pipe is fixed to the mounting plate through a flange, the connection between the flange and the mounting plate is sealed by a No. 3 sealing ring, and the outer periphery of the target surface gas collection pipe is provided with a sealing sleeve, and the bottom end of the sealing sleeve is sealed and filled between the target surface gas collection pipe and the flange.

[0011] As a further solution of the present invention: a ventilation duct interface and a cable feeding interface are provided on the sealing bottom plate at the bottom of the film gauge mounting cylinder, one end of the flexible ventilation duct is vacuum-sealed connected to the ventilation duct interface through an air pipe feeding joint, and one end of the flexible cable is vacuum-sealed connected to the cable feeding interface through a cable feeding joint.

[0012] As a further solution of the present invention: the connection between the sealing bottom plate and the bottom of the film gauge installation cylinder is sealed by a No. 4 sealing ring.

[0013] As a further solution of the present invention: the distance between the collection port of the target surface gas collection pipe and the surface of the magnetron sputtering cathode target is 1-5 mm, which is used to capture the gas near the target surface.

[0014] As a further solution of the present invention: the thin film gauge vacuum measurement range is 0 Torr to 0.001 Torr, the accuracy is 0.5%, and the response time is 130 ms.

[0015] The present invention further provides a vacuum tracking detection method for a mobile magnetron sputtering cathode, which is applied to any of the above-mentioned vacuum tracking detection devices for a mobile magnetron sputtering cathode, and comprises the following steps:

[0016] S1, start the magnetron sputtering coating equipment, and the magnetron sputtering cathode moves along a preset path;

[0017] S2, the thin film vacuum gauge tracks and detects the vacuum degree data of the magnetron sputtering cathode target surface in real time, and feeds the data back to the gas controller;

[0018] S3, the gas controller adjusts the opening of the gas flow valve of the magnetron sputtering cathode in real time according to the vacuum data fed back by the thin film vacuum gauge, so that the gas supply flow dynamically matches the position of the magnetron sputtering cathode, maintains the sputtering gas pressure stable, and the gas supply flow adjustment response time is ≤100ms.

[0019] As a further solution of the present invention: the gas controller uses a PID algorithm to optimize flow regulation.

[0020] Beneficial effects of the present invention:

[0021] (1) The present invention fixes the thin film gauge vacuum gauge, the thin film gauge mounting tube, and the target surface gas collection tube on the magnetron sputtering cathode through a thin film gauge mounting clamp, so that the thin film gauge vacuum gauge, the thin film gauge mounting tube, and the target surface gas collection tube can move synchronously with the magnetron sputtering cathode in the vacuum chamber of the coating equipment. The collection port of the target surface gas collection tube is aligned with the surface of the magnetron sputtering cathode target material, and accurately captures the gas near the target material surface, so that the thin film gauge vacuum gauge can track and detect the vacuum degree data of the magnetron sputtering cathode target material surface in real time, and feed the data back to the gas controller. The gas controller compares the vacuum degree data fed back by the thin film gauge vacuum gauge with the preset vacuum degree data, and adjusts the opening of the gas flow valve of the magnetron sputtering cathode in real time according to the comparison result, so that the gas supply flow dynamically matches the position of the magnetron sputtering cathode in the vacuum chamber, and maintains the sputtering gas pressure stable; the stability of the magnetron sputtering process and the film quality are significantly improved, and it has a wide range of industrial application value;

[0022] (2) The modular design of the present invention is compact and uncomplicated, and can be easily integrated into existing magnetron sputtering equipment;

[0023] (3) The flexible ventilation duct and flexible cable are designed to adapt to complex motion trajectories, avoid signal interruption, and can adapt to the needs of long-term movement of the cathode, thereby extending the service life of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention will be further described below with reference to the accompanying drawings.

[0025] Figure 1 This is a schematic diagram of the three-dimensional structure of a vacuum tracking detection device for a mobile magnetron sputtering cathode according to the present invention;

[0026] Figure 2 This is a front schematic diagram of a vacuum tracking detection device for a mobile magnetron sputtering cathode according to the present invention;

[0027] Figure 3 This is a schematic diagram of the internal structure of a vacuum tracking detection device for a mobile magnetron sputtering cathode according to the present invention;

[0028] Figure 4 This is a schematic diagram of the internal structure of the film gauge installation cylinder of the present invention;

[0029] Figure 5 It is a block diagram of the connection between the gas controller, the gas flow valve and the diaphragm gauge vacuum gauge of the present invention;

[0030] Figure 6 yes Figure 3 A magnified schematic diagram of the structure in the middle.

[0031] In the figure: 1. Thin film gauge vacuum gauge; 2. Thin film gauge mounting cylinder; 201. Top cover; 202. Sealing bottom plate; 3. Thin film gauge mounting clamp; 301. Mounting plate; 302. Chuck; 303. Locking bolt; 4. Target surface gas collection tube; 5. Flexible ventilation duct; 6. Flexible cable; 7. Magnetron sputtering cathode; 8. Target material; 9. Gas controller; 10. Gas flow valve; 101. Vacuum interface; 12. No. 1 sealing ring; 13. No. 2 sealing ring; 14. Flange; 15. No. 3 sealing ring; 16. Gas pipe feeding connector; 17. Cable feeding connector; 18. No. 4 sealing ring; 19. Sealing sleeve. DETAILED DESCRIPTION

[0032] The following is a clear and complete description of the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts are within the scope of protection of the present invention.

[0033] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", "front", "back", etc. indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, and a specific direction structure and operation. Therefore, they cannot be understood as limiting the present invention.

[0034] In addition, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they can refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0035] Example 1

[0036] See also Figure 1-6 As shown, the first embodiment of the present invention provides a vacuum tracking detection device for a mobile magnetron sputtering cathode, particularly suitable for coating equipment using a mobile magnetron sputtering cathode for coating within a vacuum chamber. The vacuum tracking detection device may include at least a thin film gauge vacuum gauge 1, a thin film gauge mounting cylinder 2, a thin film gauge mounting clamp 3, a target surface gas collection pipe 4, a flexible ventilation pipe 5, a flexible cable 6, a gas pipe feed connector 16, a cable feed connector 17, and a gas controller 9.

[0037] Among them, the thin film vacuum gauge 1 needs to select a range that is more accurate and suitable for the magnetron sputtering coating process requirements. In this embodiment, the range used is 10 -5 Pa to 10 -1 Pa, an accuracy of ±1%, and a response time of less than 50ms. Figure 1 As shown, the thin film gauge mounting cylinder 2 made of stainless steel is fixedly connected to the magnetron sputtering cathode 7 through the thin film gauge mounting clamp 3, so that the thin film gauge mounting cylinder 2 can move synchronously with the magnetron sputtering cathode 7 in the vacuum chamber of the coating equipment.

[0038] In this example, see Figure 2As shown, the thin film gauge mounting clamp 3 includes a mounting plate 301, a chuck 302 and a locking bolt 303. One end of the mounting plate 301 is fixedly connected to the magnetron sputtering cathode 7 through the cooperation of the chuck 302 and the locking bolt 303. One end of the mounting plate 301 and the chuck 302 are respectively wrapped and clamped on the outside of the magnetron sputtering cathode 7, and then locked from both sides by the locking bolt 303, so that the thin film gauge mounting clamp 3 and the magnetron sputtering cathode 7 can be detachably fixed together, and disassembly and assembly are convenient and quick. At the same time, the distance between the mounting plate 301 and the chuck 302 is adjustable, and can be installed on magnetron sputtering cathodes 7 of different sizes. The thin film gauge mounting cylinder 2 is fixedly installed on the bottom of the other end of the mounting plate 301 by bolts. The setting of the thin film gauge mounting clamp 3 enables the thin film gauge mounting cylinder 2 to move synchronously with the magnetron sputtering cathode 7 in the vacuum chamber of the coating equipment.

[0039] Further, see Figure 4 As shown, the connection between the film gauge mounting cylinder 2 and the mounting plate 301 is sealed by a No. 1 sealing ring 12. The No. 1 sealing ring 12 makes the sealing between the film gauge mounting cylinder 2 and the mounting plate 301 better, ensuring that the air in the film gauge mounting cylinder 2 will not overflow into the vacuum chamber of the coating equipment.

[0040] See also Figure 4 As shown, the thin film gauge vacuum gauge 1 is sealed and mounted within the thin film gauge mounting cylinder 2 via a vacuum interface 101. Specifically, the top cover 201 of the thin film gauge mounting cylinder 2 is fixedly connected to the bottom of the mounting plate 301 via bolts. The vacuum interface 101 of the thin film gauge vacuum gauge 1 is fixed to the mounting plate 301 by the engagement of the top cover 201, thereby securing the thin film gauge vacuum gauge 1 within the thin film gauge mounting cylinder 2. This allows the thin film gauge mounting clamp 3, the thin film gauge mounting cylinder 2, and the thin film gauge vacuum gauge 1 to move synchronously within the vacuum chamber of the coating equipment, following the magnetron sputtering cathode 7.

[0041] Further, see Figure 4 As shown, the connection between the vacuum interface 101 of the thin film gauge vacuum gauge 1 and the mounting plate 301 is sealed by the No. 2 sealing ring 13. The No. 2 sealing ring 13 makes the sealing between the thin film gauge vacuum gauge 1 and the mounting plate 301 better, ensuring that the air in the thin film gauge mounting tube 2 will not penetrate into the thin film gauge vacuum gauge 1 from the vacuum interface 101, making the detection result of the thin film gauge vacuum gauge 1 more accurate.

[0042] See also Figure 3As shown, the exhaust port of the target surface gas collection pipe 4 is fixedly connected to the vacuum interface 101 of the thin film gauge vacuum gauge 1, so that the thin film gauge mounting clamp 3, the thin film gauge mounting cylinder 2, the thin film gauge vacuum gauge 1 and the target surface gas collection pipe 4 can move synchronously with the magnetron sputtering cathode 7 in the vacuum chamber of the coating equipment. The collection port of the target surface gas collection pipe 4 is aligned with the surface of the target material 8 of the magnetron sputtering cathode 7 to collect the gas near the surface of the target material 8. Preferably, the distance between the collection port of the target surface gas collection pipe 4 and the surface of the target material 8 of the magnetron sputtering cathode 7 is 1-5 mm to ensure accurate capture of the gas near the surface of the target material 8.

[0043] Further, see Figure 6 As shown, the exhaust port of the target surface gas collection tube 4 is fixed to the mounting plate 301 via a flange 14, and the connection between the flange 14 and the mounting plate 301 is sealed via a No. 3 sealing ring 15, and a sealing sleeve 19 is provided on the outer periphery of the target surface gas collection tube 4, and the bottom end of the sealing sleeve 19 is sealed and filled between the target surface gas collection tube 4 and the flange 14. The flange 14 is preferably a quick-release flange, and the flange 14 makes the connection between the exhaust port of the target surface gas collection tube 4 and the mounting plate 301 more secure, ensuring that the target surface gas collection tube 4 does not shake during movement. The sealing sleeve 19 and the No. 2 sealing ring 13 make the sealing between the target surface gas collection tube 4 and the mounting plate 301 better, ensuring that all the gas collected by the target surface gas collection tube 4 enters the thin film gauge vacuum gauge 1 from the vacuum interface 101, making the detection result of the thin film gauge vacuum gauge 1 more accurate.

[0044] See also Figure 3 As shown, the flexible ventilation duct 5 and the flexible cable 6 are both connected between the thin film gauge mounting cylinder 2 and the vacuum chamber wall. External air enters the thin film gauge mounting cylinder 2 through the flexible ventilation duct 5, so that the thin film gauge mounting cylinder 2 maintains an atmospheric state. The flexible cable 6 transmits the detection signal of the thin film gauge vacuum gauge 1 to the gas controller 9. The gas controller 9 adjusts the opening of the gas flow valve 10 of the magnetron sputtering cathode 7 according to the feedback signal of the thin film gauge vacuum gauge 1. Specifically, a ventilation duct interface and a cable feeding interface are provided on the sealing bottom plate 202 at the bottom of the thin film gauge mounting cylinder 2. One end of the flexible ventilation duct 5 is vacuum-sealed and connected to the ventilation duct interface through the air pipe feeding connector 16, and one end of the flexible cable 6 is vacuum-sealed and connected to the cable feeding interface through the cable feeding connector 17.

[0045] It should be noted that when setting up the flexible ventilation duct 5 and flexible cable 6, it is necessary to ensure that the flexible ventilation duct 5 and flexible cable 6 can follow the movement of the magnetron sputtering cathode 7 within the vacuum chamber of the coating equipment. Specifically, the flexible ventilation duct 5 is a corrugated stainless steel tube, and its length can be adjusted and extended as the magnetron sputtering cathode 7 moves. The flexible cable 6 is a high-temperature resistant shielded cable, and its two ends are connected to the thin film vacuum gauge 1 and the electrode interface of the vacuum chamber respectively through cable feed connectors 17. The joints are filled with silicone sealant to prevent air leakage. The flexible ventilation duct 5 and flexible cable 6 must show no signs of aging or breakage after 1000 hours of continuous operation to verify their durability.

[0046] Further, see Figure 4 As shown, the connection between the sealing bottom plate 202 and the bottom of the film gauge mounting tube 2 is sealed by a No. 4 sealing ring 18. The No. 4 sealing ring 18 makes the sealing between the sealing bottom plate 202 and the film gauge mounting tube 2 better, ensuring that the air in the film gauge mounting tube 2 will not overflow from the connection between the sealing bottom plate 202 and the film gauge mounting tube 2 into the vacuum chamber of the coating equipment.

[0047] The gas controller 9 can be an industrial-grade PLC. Its PID function module communicates with the flexible cable 6 and the gas flow valve 10. The control cycle is set to 100 ms, ensuring that the gas controller 9 receives the vacuum level signal detected by the thin film vacuum gauge 1 in real time. As the magnetron sputtering cathode 7 moves to different positions, the gas controller 9 calculates the target opening of the gas flow valve 10 using a PID algorithm and adjusts the argon gas flow rate to maintain the vacuum level within ±5% of the set value. If a vacuum level anomaly is detected, the gas controller 9 triggers an audible and visual alarm and stops cathode movement until the vacuum level returns to a stable state.

[0048] It should be noted that the thin film gauge can be replaced with an ionization gauge or a compound vacuum gauge, which is suitable for different measuring range requirements; the thin film gauge mounting clamp 3 can be designed as an adjustable angle structure to adapt to cathode targets of different shapes; the gas controller 9 can be integrated into the equipment master control system to achieve multi-parameter coordinated control.

[0049] Example 2

[0050] A second embodiment of the present invention provides a vacuum tracking detection method for a mobile magnetron sputtering cathode 7, which is performed using a vacuum tracking detection device for a mobile magnetron sputtering cathode 7 in the first embodiment, and includes the following steps:

[0051] The magnetron sputtering coating device is started, and the magnetron sputtering cathode 7 moves along a preset path;

[0052] The thin film gauge vacuum gauge 1 accurately captures the gas near the surface of the target material 8 through the collection port of the target surface gas collection pipe 4, so that the thin film gauge vacuum gauge 1 tracks and detects the surface vacuum data of the magnetron sputtering cathode 7 target material 8 in real time, and feeds the data back to the gas controller 9;

[0053] The gas controller 9 adjusts the opening of the gas flow valve 10 of the magnetron sputtering cathode 7 in real time based on the vacuum data fed back by the thin film vacuum gauge 1, and compares the real-time vacuum data with the preset vacuum data. Based on the comparison result, the gas controller 9 dynamically adjusts the gas flow to dynamically match the position of the magnetron sputtering cathode 7, maintains the sputtering gas pressure stable, and the gas flow adjustment response time is ≤100ms.

[0054] It should be noted that the gas controller 9 uses a PID algorithm to optimize flow regulation. The implementation of the PID algorithm is based on the following control logic:

[0055] 1. Error calculation: Real-time acquisition of the actual vacuum value P detected by the thin film vacuum gauge 实际 , and the preset target value P 设定 (e.g. 0.5Pa) and calculate the error:

[0056] .

[0057] 2. Proportional term (P): adjust the control amount proportionally according to the current error, the proportional gain coefficient K P Determines the response speed. For example, K P If it is set to 0.8, the control amount increment is:

[0058] .

[0059] 3. Integral term (I): accumulates historical errors to eliminate steady-state errors, and the integral time constant T i Determines the strength of the integral action. The integral term is calculated as:

[0060] .

[0061] In this device, T i Set it to 10 seconds to avoid overshoot caused by excessive accumulation.

[0062] 4. Differential term (D): predicts the error change trend to suppress oscillation, differential time constant T d Determines the degree of advance regulation. The differential term is calculated as:

[0063] .

[0064] Here T d Set it to 2 seconds to balance response speed and stability.

[0065] 5. Total control quantity output: Superimpose the three items to obtain the final control quantity:

[0066] ,

[0067] And converted into the opening instruction of the gas flow valve (0-100%).

[0068] The gas controller also needs to have the following functions:

[0069] Parameter optimization and adaptive adjustment;

[0070] During the equipment commissioning phase, the PID parameters (K P ,T i ,T d ), ensuring fast system response (e.g. rise time < 1 second) and low overshoot (< 5%) when the cathode moves.

[0071] For different process gases (such as argon and nitrogen), the gas controller has multiple sets of PID parameter presets built in, and users can switch according to process requirements.

[0072] Exception handling mechanism:

[0073] When it is detected that the vacuum degree deviates continuously from the set value by more than ±10% (such as >0.55 Pa or <0.45 Pa), the gas controller triggers the integral reset to avoid control failure caused by integral saturation.

[0074] If the differential item detects a sudden change in vacuum (such as rate > 5Pa / s), the emergency gas flow valve closing procedure is initiated to prevent equipment damage.

[0075] Through the refined design of the PID algorithm, this device achieves rapid and stable control of the vacuum level during the movement of the magnetron sputtering cathode 7, significantly improving the uniformity and quality of magnetron sputtering coatings. It also offers excellent anti-interference capabilities and safety, meeting the requirements of industrial-grade applications. Application of this device in a coating production line has improved film thickness uniformity from ±15% to ≤2.5%.

[0076] In summary, the present invention significantly improves the stability of the magnetron sputtering process and the film quality by synchronously moving the vacuum detection device and the target of the magnetron sputtering cathode 7, combined with flexible connection and intelligent feedback control, and has wide industrial application value.

[0077] The above detailed description of the preferred embodiments of the present invention should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent of the present invention.

Claims

1. A vacuum tracking detection device for a mobile magnetron sputtering cathode, suitable for coating equipment using a mobile magnetron sputtering cathode in a vacuum chamber, characterized by: It includes a thin film gauge vacuum gauge, a thin film gauge mounting tube, a thin film gauge mounting splint, a target surface gas collection tube, a flexible ventilation duct, and a flexible cable; wherein, the thin film gauge mounting tube is fixedly connected to the magnetron sputtering cathode through the thin film gauge mounting splint, the thin film gauge vacuum gauge is sealed and installed in the thin film gauge mounting tube through a vacuum interface, the exhaust port of the target surface gas collection tube is fixedly connected to the vacuum interface of the thin film gauge vacuum gauge, the collection port of the target surface gas collection tube is aligned with the surface of the magnetron sputtering cathode target material, the flexible ventilation duct and the flexible cable are both connected between the thin film gauge mounting tube and the vacuum chamber wall, and the flexible cable is communicatively connected to the signal end of the thin film gauge vacuum gauge, the flexible ventilation duct is used to maintain the atmospheric state in the thin film gauge mounting tube, and the flexible cable is used to transmit the signal of the thin film gauge vacuum gauge to the gas controller, and the gas controller adjusts the opening of the gas flow valve of the magnetron sputtering cathode according to the feedback signal of the thin film gauge vacuum gauge.

2. The vacuum tracking detection device for a movable magnetron sputtering cathode according to claim 1, characterized in that: The film gauge mounting clamp includes a mounting plate, a chuck and a locking bolt. One end of the mounting plate is fixedly connected to the magnetron sputtering cathode through the cooperation of the chuck and the locking bolt. The other end of the mounting plate is fixedly mounted with a film gauge mounting cylinder. The connection between the film gauge mounting cylinder and the mounting plate is sealed by a No. 1 sealing ring.

3. The vacuum tracking detection device for a movable magnetron sputtering cathode according to claim 2, characterized in that: The top cover of the film gauge mounting cylinder is fixedly connected to the mounting plate, the vacuum interface of the film gauge vacuum gauge is fixed to the mounting plate by the snap engagement of the top cover, and the connection between the vacuum interface of the film gauge vacuum gauge and the mounting plate is sealed by a No. 2 sealing ring.

4. The vacuum tracking detection device for a movable magnetron sputtering cathode according to claim 2, characterized in that: The exhaust port of the target surface gas collection pipe is fixed to the mounting plate through a flange, the connection between the flange and the mounting plate is sealed by a No. 3 sealing ring, and a sealing sleeve is provided on the outer periphery of the target surface gas collection pipe, and the bottom end of the sealing sleeve is sealed and filled between the target surface gas collection pipe and the flange.

5. The vacuum tracking detection device for a movable magnetron sputtering cathode according to claim 1, characterized in that: A ventilation duct interface and a cable feed interface are provided on the sealing bottom plate at the bottom of the film gauge mounting tube. One end of the flexible ventilation duct is vacuum-sealed and connected to the ventilation duct interface through the trachea feed joint, and one end of the flexible cable is vacuum-sealed and connected to the cable feed interface through the cable feed joint.

6. The vacuum tracking detection device for a movable magnetron sputtering cathode according to claim 5, characterized in that: The connection between the sealing bottom plate and the bottom of the film gauge installation cylinder is sealed by a No. 4 sealing ring.

7. The vacuum tracking detection device for a movable magnetron sputtering cathode according to claim 1, characterized in that: The distance between the collecting port of the target surface gas collecting pipe and the surface of the magnetron sputtering cathode target material is 1-5 mm, and is used to capture the gas near the target surface.

8. The vacuum tracking detection device for a movable magnetron sputtering cathode according to claim 1, characterized in that: The thin film vacuum gauge has a range of 0 Torr to 0.001 Torr, an accuracy of 0.5%, and a response time of 130 ms.

9. A vacuum tracking detection method for a mobile magnetron sputtering cathode, applied to a vacuum tracking detection device for a mobile magnetron sputtering cathode according to any one of claims 1 to 8, characterized in that: The following steps are involved: S1, start the magnetron sputtering coating equipment, and the magnetron sputtering cathode moves along a preset path; S2, the thin film vacuum gauge tracks and detects the vacuum degree data of the magnetron sputtering cathode target surface in real time, and feeds the data back to the gas controller; S3, the gas controller adjusts the opening of the gas flow valve of the magnetron sputtering cathode in real time according to the vacuum data fed back by the thin film vacuum gauge, so that the gas supply flow dynamically matches the position of the magnetron sputtering cathode, maintains the sputtering gas pressure stable, and the gas supply flow adjustment response time is ≤100ms.

10. The vacuum tracking detection method for a mobile magnetron sputtering cathode according to claim 9, characterized in that: The gas controller uses a PID algorithm to optimize flow regulation.

Images