Micro-nanostructures, preparation methods and applications of micro-nanostructures

Abstract

The present invention discloses a micro-nano structure, a preparation method of the micro-nano structure, and an application thereof. By injecting an excess amount of embossing adhesive into an embossing cavity of a template and then scraping off the excess embossing adhesive, an embossing adhesive layer with uniform thickness is formed on a first surface of the template. The adhesive layer is then directly embossed with a substrate to obtain a micro-nano structure with a uniform thickness of the residual adhesive layer, thereby solving the problem of uneven residual adhesive thickness and preventing the inconsistent residual adhesive layer thickness from affecting the subsequent structure transfer process.

Description

Technical Field

[0001] The present invention belongs to the field of nanoimprint technology, and in particular relates to a micro-nano structure, a preparation method of the micro-nano structure and an application thereof. Background Art

[0002] Ginseng Figure 1 As shown, the process for fabricating nanostructures using nanoimprint technology typically includes: spin-coating a uniformly thick imprint adhesive film 20' onto a target substrate 30'; placing an anti-sticking treated template 10' onto the imprint adhesive film; applying pressure to fill the cavities of the template 10' with the imprint adhesive; curing the imprint adhesive and demolding the template to produce an imprinted adhesive nanostructure that replicates the template in a 1:1 ratio. After removing the residual adhesive layer, the template pattern is transferred to the target substrate 30' using a dry or wet etching process, using the imprinted adhesive structure as a mask, to produce the substrate material's nanostructure.

[0003] Due to the inherent characteristics of nanoimprinting, when the nanostructures in the template 10 ′ have different duty cycles or heights, the thickness of the residual adhesive at each location after imprinting is different, e.g. Figure 1 In the example, the thickness of the adhesive residue layer at the first adhesive residue area 201' and the second adhesive residue area 202' is inconsistent. This uneven thickness of the adhesive residue layer will affect the subsequent structure transfer process. If the adhesive residue is removed based on the thinner adhesive residue, the thicker adhesive residue area will not be completely removed. If the adhesive residue is removed based on the thicker adhesive residue area, the target substrate 30' in the thinner adhesive residue area will lose height.

[0004] Therefore, in order to solve the above technical problems, it is necessary to provide a micro-nano structure, a preparation method of the micro-nano structure and an application thereof. Summary of the Invention

[0005] The purpose of the present invention is to provide a micro-nano structure, a preparation method of the micro-nano structure and its application, which solves the problem of uneven thickness of residual glue by injecting excess embossing glue into the embossing cavity of the template and scraping off the excess glue to retain an embossing glue layer of uniform thickness.

[0006] In order to achieve the above object, a specific embodiment of the present invention provides the following technical solutions:

[0007] A method for preparing a micro-nano structure, the method comprising:

[0008] Providing a template, the template comprising a first surface and a second surface disposed opposite to each other, wherein the first surface is provided with a recessed embossing cavity;

[0009] Filling the embossing cavity with embossing glue and causing the embossing glue to overflow out of the embossing cavity;

[0010] scraping off the embossed adhesive that is higher than the set thickness on the first surface to form an embossed adhesive layer with uniform thickness on the first surface;

[0011] Imprinting a substrate onto the imprint adhesive layer and curing the imprint adhesive;

[0012] The template is removed to obtain a micro-nano structure.

[0013] In one or more embodiments of the present invention, imprinting the substrate onto the imprinted adhesive layer includes: fixing the template and driving the substrate to move toward the imprinted adhesive layer so that the substrate and the imprinted adhesive layer are in contact with each other.

[0014] In one or more embodiments of the present invention, after the substrate is attached to the embossed adhesive layer, compressed air is used to apply a pressure of 1 to 40 bar to the substrate along the direction from the substrate toward the embossed adhesive layer to emboss the embossed adhesive layer and the substrate.

[0015] In one or more embodiments of the present invention, imprinting the substrate onto the imprinting adhesive layer includes: fixing the substrate and driving the template to move toward the substrate so that the substrate and the imprinting adhesive layer are in contact with each other.

[0016] In one or more embodiments of the present invention, after the substrate and the embossed adhesive layer are attached to each other, compressed air is used to apply a pressure of 1 to 40 bar to the template along the direction of the template toward the substrate to emboss the embossed adhesive layer and the substrate.

[0017] In one or more embodiments of the present invention, the preparation method further comprises: performing an anti-adhesion treatment on the template before filling the embossing glue.

[0018] In one or more embodiments of the present invention, the thickness of the embossed adhesive layer is 10 nm to 20 μm.

[0019] In one or more embodiments of the present invention, the viscosity of the embossing adhesive is 5 to 500 cP.

[0020] Another specific embodiment of the present invention further provides a micro-nano structure, which is prepared by the method for preparing a micro-nano structure described in any embodiment.

[0021] Another specific embodiment of the present invention further provides applications of micro-nano structures in new energy devices, biomedical detection devices, microfluidic devices, electronic devices, optical components or nanoimprinting.

[0022] Compared with the prior art, the micro-nanostructure, preparation method and application of the micro-nanostructure of the present invention can obtain a micro-nanostructure with a uniform thickness of the residual adhesive layer by injecting an excess amount of embossing adhesive into the embossing cavity of the template, scraping off the excess embossing adhesive and forming an embossing adhesive layer with uniform thickness on the first surface of the template, and then directly embossing the adhesive layer with the substrate, thereby solving the problem of uneven thickness of the residual adhesive and avoiding the influence of inconsistent thickness of the residual adhesive layer on the subsequent structure transfer process. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0024] Figure 1 It is a schematic diagram of the preparation process of the embossed adhesive nanostructure in the prior art;

[0025] Figure 2 This is a schematic structural diagram of the template in Example 1 of the present invention;

[0026] Figure 3 Schematic diagram of filling glue into the imprint cavity of the template in Example 1 of the present invention;

[0027] Figure 4 Schematic diagram of scraping off excess glue and preparing the glue layer in Example 1 of the present invention;

[0028] Figure 5 Schematic diagram of laminating a substrate and an adhesive layer in an implementation manner of Example 1 of the present invention;

[0029] Figure 6 This is a schematic diagram of laminating a substrate and an adhesive layer in another implementation manner of Example 1 of the present invention;

[0030] Figure 7 Schematic diagram of the micro-nano structure (including the substrate) in Example 1 of the present invention;

[0031] Figure 8 Schematic diagram of the structure of the device for preparing micro-nano structures in Example 2 of the present invention;

[0032] Figure 9 Schematic diagram of the structure of another micro-nanostructure preparation device in Example 2 of the present invention. DETAILED DESCRIPTION

[0033] In order to enable those skilled in the art to better understand the technical solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts should fall within the scope of protection of the present invention.

[0034] Unless expressly stated otherwise, throughout the specification and claims, the term "comprise" or variations such as "include" or "comprising", etc., will be understood to include the stated elements or components but not to exclude other elements or other components.

[0035] In the detailed description of the specification, reference is made to the accompanying drawings forming a part hereof, wherein like reference numerals designate like parts throughout, and wherein exemplary embodiments that may be implemented are shown by way of example. It should be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present application. Therefore, the following detailed description should not be construed in a limiting sense.

[0036] The present invention discloses a method for preparing a micro-nano structure, comprising:

[0037] A template is provided, the template comprising a first surface and a second surface disposed opposite to each other, and the first surface is provided with a recessed embossing cavity;

[0038] Filling the embossing cavity with embossing glue and causing the embossing glue to overflow out of the embossing cavity;

[0039] scraping off the embossed adhesive that is higher than the set thickness on the first surface to form an embossed adhesive layer with uniform thickness on the first surface;

[0040] Imprinting the substrate onto the imprint adhesive layer and curing the imprint adhesive;

[0041] The template is removed to obtain the micro-nanostructure.

[0042] This method injects an excess amount of embossing adhesive into the embossing cavity of the template, then scrapes away the excess adhesive, leaving a uniformly thick embossing adhesive layer on the first surface. The embossing adhesive layer is then directly embossed onto the substrate, resulting in the target micro-nanostructure. Because the embossing adhesive layer maintains a consistent thickness for the target micro-nanostructure, this method addresses the issue of residual adhesive non-uniformity when the embossing cavity has a non-uniform duty cycle or non-uniform height, preventing it from impacting the subsequent structure transfer process.

[0043] The present invention will be further described below with reference to specific embodiments.

[0044] Example 1:

[0045] Combine Figures 2 to 7 As shown, a method for preparing a micro-nano structure, the preparation method includes:

[0046] S1. Provide a template 10. The template 10 includes a first surface 11 and a second surface 12 that are opposite to each other. The first surface 11 is provided with a recessed imprinting cavity 101.

[0047] Reference Figure 2 A template 10 is provided. The template 10 includes a first surface 11 and a second surface 12 disposed opposite to each other. The imprinting cavity 101 extends from the first surface 11 to the second surface 12, and the imprinting cavity 101 does not penetrate the first surface 11 and the second surface 12.

[0048] Furthermore, template 10 is a soft template, and materials for template 10 include, but are not limited to, PC (polycarbonate), PMMA (polymethyl methacrylate), and PET (polyethylene terephthalate). In other alternative embodiments, template 10 is a hard template, and materials for template 10 include, but are not limited to, Si (silicon), Ni (nickel), and quartz. The thickness of template 10 can be selected based on actual needs, such as 0.5 mm.

[0049] The embossing cavities 101 are prepared based on the desired structure. In this embodiment, the depth and duty cycle of the embossing cavities 101 may vary (i.e., the depth of the embossing cavities 101 extending from the first surface 11 to the second surface 12 may vary, the cross-sectional dimensions of the embossing cavities 101 may vary, and the multiple embossing cavities 101 may be arranged at uneven intervals). It will be appreciated that in other alternative embodiments, the embossing cavities 101 of the template 10 may have the same depth and duty cycle and be evenly spaced.

[0050] Furthermore, one embodiment further includes performing an anti-adhesion treatment on the template 10. To facilitate subsequent demolding, the imprinted cavities 101 on the template 10 are all subjected to an anti-adhesion treatment. The anti-adhesion treatment can be performed by depositing an anti-adhesion layer on the surface using the principle of reactive ion etching, such as performing a C4F8 anti-adhesion treatment on the imprinted cavities 101 on the template 10.

[0051] S2 , filling the embossing glue 20 into the embossing cavity 101 and causing the embossing glue to overflow out of the embossing cavity 101 .

[0052] Furthermore, the viscosity of the embossing adhesive is 5 to 500 cP. In this embodiment, the viscosity of the embossing adhesive is 10 cP, 40 cP or 150 cP.

[0053] Reference Figure 3The embossing adhesive 20 is filled into the embossing cavity 101 of the template 10 and overflows the embossing cavity 101. The thickness of the embossing adhesive overflowing from the embossing cavity 101 is greater than the thickness of the target embossing adhesive layer.

[0054] S3 , scraping off the embossed adhesive that is higher than the set thickness on the first surface 11 to form an embossed adhesive layer 201 with uniform thickness on the first surface 11 .

[0055] Reference Figure 4 The scraper moves from one side of the template 10 to the other side of the template 10 in a direction perpendicular to the first surface 11 (i.e., the x direction in the figure) to scrape off the embossing adhesive 20 that overflows the embossing cavity 101 and has a thickness greater than a set thickness, thereby ensuring that the thickness of the adhesive layer 201 on the first surface 11 of the template 10 is uniform.

[0056] It is understandable that after scraping off excess embossing glue, the remaining glue includes the glue 202 filling the embossing cavity 101 and the embossing glue layer 201 located on the first surface 11 , and the embossing glue layer 201 is connected to the glue 202 filling the embossing cavity 101 .

[0057] Furthermore, the thickness of the embossed adhesive layer 201 is 10 nm to 20 μm, for example, the thickness of the embossed adhesive layer 201 is 10 nm, 1 μm or 20 μm.

[0058] In a specific embodiment, the thickness of the embossed adhesive layer 201 is 10 nm. After the embossed adhesive is cured, the embossed adhesive layer 201 not provided between the micro-nano unit and the substrate 30 is removed to obtain the embossed adhesive structure. The embossed adhesive structure is used as a mask to transfer the pattern of the template 10 to the substrate 30 using a dry etching process or a wet etching process, thereby obtaining the nanostructure of the substrate 30 material.

[0059] In another specific embodiment, the thickness of the embossed adhesive layer 201 is 20 μm, and the target micro-nano structure is directly obtained after the embossed adhesive is cured.

[0060] S4 , imprinting the substrate 30 onto the imprinting adhesive layer 201 , and curing the imprinting adhesive.

[0061] Reference Figure 5 In one embodiment, the substrate 30 is embossed onto the embossed adhesive layer 201, specifically comprising:

[0062] The template 10 is fixed, and the substrate 30 is driven to move toward the embossed adhesive layer 201 so that the substrate 30 and the embossed adhesive layer 201 are bonded together;

[0063] After the substrate 30 is attached to the embossed adhesive layer 201 , compressed air is used to apply a pressure of 1 to 40 bar to the substrate 30 in a direction from the substrate 30 toward the embossed adhesive layer 201 , so as to emboss the embossed adhesive layer 201 and the substrate 30 .

[0064] Further, pressure is applied to the substrate 30 by compressed air.

[0065] Furthermore, the embossing adhesive is fixed by UV exposure on the side of the template 10 away from the substrate 30 , or by UV exposure on both the side of the template 10 away from the substrate 30 and the side of the substrate 30 away from the template 10 .

[0066] Reference Figure 6 In another embodiment, the substrate 30 is embossed onto the embossed adhesive layer 201, specifically comprising:

[0067] Fix the substrate 30 and drive the template 10 to move toward the substrate 30 so that the substrate 30 is in contact with the embossed adhesive layer 201;

[0068] After the substrate 30 is attached to the embossed adhesive layer 201 , compressed air is used to apply a pressure of 1 to 40 bar to the template 10 along the direction from the template 10 toward the substrate 30 to emboss the embossed adhesive layer 201 and the substrate 30 .

[0069] Furthermore, pressure is applied to the second surface 12 of the template 10 by compressed air.

[0070] Furthermore, the embossing adhesive is fixed by UV exposure on the side of the template 10 away from the substrate 30 , or by UV exposure on both the side of the template 10 away from the substrate 30 and the side of the substrate 30 away from the template 10 .

[0071] In other alternative embodiments, a heating stage is provided on the side of the substrate 30 away from the template 10 to cure the embossing adhesive 20 .

[0072] S5. Remove the template to obtain the micro-nano structure.

[0073] This method injects an excess of embossing adhesive 20 into the embossing cavity 101 of the template 10, and then scrapes off the excess adhesive to form an embossing adhesive layer 201 of uniform thickness on the first surface 11 of the template 10. The embossing adhesive layer 201 is then directly embossed onto the substrate 30 to obtain a micro-nano structure with a uniform thickness of the residual adhesive layer. In particular, when the embossing cavity 101 has a non-uniform duty cycle or a non-uniform height structure, the thickness of the embossing adhesive layer 201 is uniform. Figure 7 For example, the thickness of the embossed adhesive layer 201 in the first area 2011 , the second area 2012 and the third area 2013 is consistent, which solves the problem of uneven residual adhesive and avoids affecting the subsequent structure transfer process.

[0074] Another specific embodiment of the present invention provides a micro-nano structure, which is prepared by the above-mentioned micro-nano structure preparation method.

[0075] Another specific embodiment of the present invention provides the application of the above-mentioned micro-nano structure in new energy devices, biomedical detection devices, microfluidic devices, electronic devices, optical components or nanoimprinting.

[0076] Specifically, the prepared micro-nanostructure can be used as a template to create a sub-template, or to create a production template for large-scale imprinting. Furthermore, the micro-nanostructure preparation method of the present invention can be used to create anti-counterfeiting patterns, or the micro-nanostructure can be used as a template for imprinting anti-counterfeiting patterns.

[0077] Another embodiment of the present invention provides a nanoimprinting method based on the above-mentioned micro-nano structure and a substrate 30 disposed below the micro-nano structure, wherein the micro-nano structure includes micro-nano units (i.e. Figure 7 The structure formed by curing the glue liquid 202 filled in the imprint cavity 101 as shown) and the imprinted glue layer 201, which is located between the micro-nano unit and the substrate 30, specifically includes:

[0078] The embossed adhesive layer 201 not disposed between the micro-nano unit and the substrate 30 is removed to obtain the embossed adhesive structure. The embossed adhesive structure is used as a mask to transfer the pattern of the template 10 to the substrate 30 using a dry etching process or a wet etching process to obtain the nanostructure of the substrate 30 material.

[0079] Example 2:

[0080] Ginseng Figure 8 As shown, this embodiment provides a micro-nano structure preparation device for implementing the micro-nano structure preparation method in Example 1. The preparation device specifically includes:

[0081] The housing 100 has a chamber disposed therein. A partition 1001 is provided inside the housing 100 . The partition 1001 is used to separate the chamber into a first cavity 110 and a second cavity 120 that are sequentially disposed along a first direction.

[0082] A first stage 21, a glue injection mechanism 300 and a glue scraping mechanism 400 are provided in the first cavity 110. The first stage 21 is used to carry the template 10. The glue injection mechanism 300 is used to inject embossing glue into the embossing cavity 101 of the template 10. The glue scraping mechanism 400 is located next to the glue injection mechanism 300. The glue scraping mechanism 400 includes a scraper 401. The scraper 401 extends along the second direction and is used to scrape off at least part of the embossing glue on the surface of the template 10. The second direction is perpendicular to the first direction. The first direction is Figure 8 X direction shown.

[0083] The second cavity 120 is provided with a second stage 22, an imprint assembly 60 and a curing assembly arranged above the second stage 22. The second stage 22 is used to carry the substrate 30 or the template 10, the imprint assembly 60 is used to imprint the template 10 and the substrate 30, and the curing assembly is used to cure the imprint glue.

[0084] The transfer mechanism 80 is disposed inside the chamber and located between the first stage 21 and the second stage 22 , and is used to transfer the template 10 from the first stage 21 to the second stage 22 .

[0085] The glue injection mechanism 300 injects an excess amount of embossing glue into the embossing cavity of the template 10, filling the embossing cavity 101 and overflowing onto the template 10. The scraping mechanism 400 scrapes away the embossing glue above the set thickness of the first surface, leaving a layer of embossing glue 201 of uniform thickness on the side of the template 10 away from the first stage 21.

[0086] In a specific embodiment, the glue injection mechanism 300 includes one or more combinations of a glue injection gun, a glue injection dropper, and a glue injection nozzle 301 , and the glue scraping mechanism 400 includes a scraper 401 .

[0087] Furthermore, the length of the scraper 401 is greater than or equal to the width of the template 10 (ie, the size of the template 10 in the second direction). Specifically, the scraper 401 is controlled to move from one side of the template 10 to the other side along the first direction to scrape off excess embossing glue.

[0088] It can be understood that part of the embossed adhesive layer in this embodiment can be regarded as the "residual adhesive layer" in the prior art, and the thickness of the "residual adhesive layer" is ensured to be consistent through the two steps of adhesive injection and adhesive scraping.

[0089] Ginseng Figure 8 As shown, in a specific embodiment, a driving mechanism 50 is further provided in the first cavity 110, and the driving mechanism 50 is connected to the glue injection mechanism 300 and the glue scraping mechanism 400, and is at least used to drive the glue injection mechanism 300 and the glue scraping mechanism 400 to move in a direction parallel to the first stage 21 or perpendicular to the first stage 21.

[0090] Furthermore, the driving mechanism 50 includes a first telescopic assembly 51 , a second telescopic assembly 52 , a sliding assembly 53 and a position sensor 54 .

[0091] The first end of the first telescopic component 51 is fixedly connected to the first side of the sliding component 53, and the second end is fixedly connected to the glue injection mechanism 300, which is used to drive the glue injection mechanism 300 to move in a direction perpendicular to the first worktable 21. The telescopic length of the first telescopic component 51 can control the distance between the glue injection mechanism 300 and the first worktable 21 (that is, the distance between it and the template 10), thereby enabling the glue injection mechanism 300 to adapt to templates 10 of different thicknesses.

[0092] The first end of the second telescopic component 52 is fixedly connected to the first side of the sliding component 53, and the second end is fixedly connected to the scraper 401, which is used to drive the scraper 401 to move in a direction perpendicular to the first stage 21. The telescopic length of the second telescopic component 52 can control the distance between the scraper 401 and the template 10, thereby controlling the thickness of the embossed adhesive layer 201.

[0093] The second side of the sliding assembly 53 is slidably connected to the shell 100, and is used to drive the glue injection mechanism 300 and the scraper 401 to move in a direction parallel to the first stage 21. The sliding assembly 53 controls the horizontal movement of the glue injection mechanism 300 to ensure that the embossing glue is filled into each embossing cavity of the template 10. The sliding assembly 53 controls the horizontal movement of the scraper 401 to ensure that the scraper 401 scrapes off the excess embossing glue at each location on the template 10, and retains a layer of embossing glue 201 with uniform thickness on the side of the template 10 away from the first stage 21.

[0094] Position sensor 54 is fixedly mounted on a first side of sliding assembly 53 and located between first telescopic assembly 51 and second telescopic assembly 52. ​​The sensor is used to obtain position information of glue injection mechanism 300 and scraper 401. Furthermore, position sensor 54 is a micron-level displacement sensor, and an external controller controls first telescopic assembly 51, second telescopic assembly 52, and sliding assembly 53 based on this position information.

[0095] It is understandable that the first telescopic assembly 51, the second telescopic assembly 52 and the sliding assembly 53 are well known in the prior art and therefore will not be described in detail herein. Any known or unknown sliding assembly 53 and telescopic assembly may be used herein without restriction.

[0096] Furthermore, the preparation device also includes a first clamping mechanism 1101, which is arranged in the first cavity 110, the first end of the first clamping mechanism 1101 is fixedly connected to the shell 100, and the second end is provided with a first clamping claw. The first clamping mechanism 1101 is at least used to clamp the template 10, and the template 10 can be flipped or moved by the first clamping mechanism 1101, for example, the flipped template 10 is placed on the conveying mechanism 80.

[0097] The curing assembly includes one or more combinations of a heating stage 701 and an ultraviolet radiation element 702 (eg, a UV lamp).

[0098] Ginseng Figure 8 As shown, the curing component in this embodiment includes a heating platform 701 and an ultraviolet irradiation element 702, wherein the second stage 22 includes a carrying surface, the heating platform 701 is arranged on the side of the second stage 22 away from the carrying surface, and the ultraviolet irradiation element 702 is arranged on the side facing the carrying surface.

[0099] In other alternative embodiments, the curing assembly only includes the heating stage 701 , or the curing assembly only includes the ultraviolet irradiation element 702 , wherein the ultraviolet irradiation element 702 is disposed on a side away from the carrying surface.

[0100] In another alternative embodiment, the ultraviolet irradiation element 702 is disposed on a side facing the carrying surface and a side away from the carrying surface.

[0101] The imprint assembly 60 includes a plurality of spaced-apart gas nozzles 601 disposed above the second stage 22 and fixedly connected to the housing 100. The preparation apparatus also includes an air compressor 603 and an air pipe 602. The air compressor 603 is connected to the housing 100 via the air pipe 602 and is in communication with the gas nozzles 601 via the air pipe 602. The air compressor 603 generates compressed air to apply a certain force to the substrate 30 or the template 10, thereby imprinting the template 10 and the substrate 30.

[0102] Furthermore, the preparation apparatus further includes a vacuum generating device 1202, which is disposed beside the second chamber 120 and communicates with the chamber, and is used to evacuate the chamber to a vacuum state. In a specific embodiment, the vacuum generating device 1202 includes a vacuum pump.

[0103] It will be appreciated that the partition 1001 in this embodiment is an openable and closable partition 1001. For example, in a first state, the partition 1001 is open, the first cavity 110 and the second cavity 120 are connected, and the transfer mechanism 80 can transfer the template 10 from the first loading platform 21 to the second loading platform 22. In a second state, the partition 1001 is closed, separating the first cavity 110 from the second cavity 120. In other words, based on the open or closed state of the partition 1001, the vacuum generating device 1202 can either evacuate both the first cavity 110 and the second cavity 120, or only the second cavity 120.

[0104] Furthermore, the preparation device also includes a second clamping mechanism 1201, which is arranged in the second cavity 120, with a first end of the second clamping mechanism 1201 fixedly connected to the shell 100 and a second end provided with a second clamping claw. The second clamping mechanism 1201 is at least used to clamp the substrate 30.

[0105] The preparation device in this embodiment is used to implement the two imprinting methods in Example 1. Specifically:

[0106] Combine Figure 5As shown, in a specific embodiment, the template 10 is placed on the second stage 22, the substrate 30 is clamped by the second clamping mechanism 1201, and the substrate 30 is placed on the side of the template 10 away from the second stage 22, so that the substrate 30 is in contact with the embossed adhesive layer 201, and compressed air is used to apply a pressure of 1 to 40 bar to the substrate 30 along the direction of the substrate 30 toward the embossed adhesive layer to emboss the embossed adhesive layer 201 and the substrate 30.

[0107] Combine Figure 6 As shown, in another specific embodiment, the substrate 30 is placed on the second stage 22, and the template 10 is placed on the substrate 30 by the conveying mechanism 80 so that the substrate 30 is in contact with the embossing adhesive layer. Compressed air is used to apply a pressure of 1 to 40 bar to the substrate 30 along the direction of the template 10 toward the substrate 30 to emboss the embossing adhesive layer and the substrate 30.

[0108] Furthermore, the transfer mechanism 80 includes a manipulator 81, which is located between the first loading platform 21 and the second loading platform 22. The first end of the manipulator 81 is fixedly connected to the housing 100, and the second end is provided with a clamp, which clamps the template 10 to move the template 10 from the first loading platform 21 to the second loading platform 22. It is understood that any known or unknown manipulator can be used here without restriction, and no further description is given here.

[0109] Ginseng Figure 9 As shown, in other alternative embodiments, the conveying mechanism 80 includes a conveyor belt, which extends along a first direction and connects the first loading platform 21 and the second loading platform 22. The conveyor belt includes a plurality of transmission rollers 82 arranged in sequence along the first direction, and rollers arranged on the transmission rollers 82 in sequence along the second direction, and the transmission rollers extend along the second direction.

[0110] It can be seen from the above technical solutions that the present invention has the following beneficial effects:

[0111] The present invention injects an excess amount of embossing glue into the embossing cavity of the template and then scrapes off the excess embossing glue to form an embossing glue layer with uniform thickness on the first surface of the template. The glue layer is then directly embossed with the substrate to obtain a micro-nano structure with uniform thickness of the residual glue layer, thereby solving the problem of uneven thickness of the residual glue layer and preventing the inconsistent thickness of the residual glue layer from affecting the subsequent structure transfer process.

[0112] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0113] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. A method for preparing a micro-nano structure, characterized in that: The preparation method comprises: Providing a template, the template comprising a first surface and a second surface disposed opposite to each other, wherein the first surface is provided with a recessed embossing cavity; Filling the embossing cavity with embossing glue and causing the embossing glue to overflow out of the embossing cavity; scraping off the embossed adhesive that is higher than the set thickness on the first surface to form an embossed adhesive layer with uniform thickness on the first surface; Imprinting a substrate onto the imprint adhesive layer and curing the imprint adhesive; The template is removed to obtain a micro-nano structure.

2. The method for preparing a micro-nano structure according to claim 1, wherein: Imprinting the substrate onto the imprinted adhesive layer includes: fixing the template and driving the substrate to move toward the imprinted adhesive layer so that the substrate and the imprinted adhesive layer are adhered to each other.

3. The method for preparing a micro-nano structure according to claim 2, wherein: After the substrate is attached to the embossed adhesive layer, compressed air is used to apply a pressure of 1 to 40 bar to the substrate along a direction from the substrate toward the embossed adhesive layer, so as to emboss the embossed adhesive layer and the substrate.

4. The method for preparing a micro-nano structure according to claim 1, wherein: Imprinting a substrate onto the imprinting adhesive layer includes: fixing the substrate, and driving the template to move toward the substrate so that the substrate and the imprinting adhesive layer are attached.

5. The method for preparing a micro-nano structure according to claim 4, characterized in that: After the substrate is attached to the embossed adhesive layer, compressed air is used to apply a pressure of 1 to 40 bar to the template along the direction of the template toward the substrate to emboss the embossed adhesive layer and the substrate.

6. The method for preparing a micro-nano structure according to claim 1, wherein: The preparation method further comprises: performing anti-adhesion treatment on the template before filling with the embossing glue.

7. The method for preparing a micro-nano structure according to claim 1, wherein: The thickness of the embossed adhesive layer is 10 nm to 20 μm.

8. The method for preparing a micro-nano structure according to claim 1, wherein: The viscosity of the embossing adhesive is 5 to 500 cP.

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