Millimeter wave transceiver and method of state monitoring

Abstract

The application discloses a kind of millimeter wave transceiver and state monitoring method, belong to millimeter wave communication technical field.It includes transceiver circuit, and the transceiver circuit is arranged on transceiver structure;The transceiver circuit includes EMI circuit, power supply system, heat dissipation system, up-conversion component, local oscillator component, down-conversion component, one four filter power divider and monitoring system;The monitoring system is used to control the working state of each circuit, component, system and device, when receiving intermediate frequency signal, execute intermediate frequency signal processing procedure, when receiving millimeter wave signal, execute millimeter wave signal processing procedure.Integrated multiple components, through the way of tiling layout and modular design, improve the integration of millimeter wave transceiver, improve the product's beauty, safety, product integration is very high, small and exquisite, light, low hardware cost, product reliability is high, short in later period maintenance time, low maintenance cost.

Description

Technical Field

[0001] This invention relates to the field of millimeter-wave communication technology, and in particular to a millimeter-wave transceiver and its status monitoring method. Background Technology

[0002] With the rapid development of millimeter-wave communication technology, millimeter-wave transceivers have become the main equipment in millimeter-wave communication due to their low-cost advantage. Transceivers primarily receive and transmit millimeter-wave signals, then shift the spectrum to an intermediate frequency (IF) via up-conversion and down-conversion before transmitting the signal to the back-end digital terminal. Transceivers are the most important components in communication, radar, and electronic warfare systems, and the demand for them is increasing dramatically, with ever-higher requirements for high performance, multifunctionality, high reliability, and miniaturization.

[0003] Existing transceivers primarily utilize signal power amplification and signal reception technologies, with applications concentrated in mobile communications. They employ power amplifier chips for signal power amplification and low-noise amplifier chips for signal reception, integrating power supplies and simple control circuits. This type of transceiver has several drawbacks. Firstly, its design employs numerous single-chip or single-function RF modules interconnected via cable assemblies, resulting in low integration, large size, and weight, leading to low reliability and poor maintainability. Secondly, these products have limited functionality and weak monitoring capabilities, making them ill-suited for the complex environments of satellite communications. They exhibit poor environmental adaptability, difficulty in fault location, high repair difficulty, extremely high repair costs, and significant losses due to malfunctions. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a millimeter-wave transceiver and a status monitoring method.

[0005] The objective of this invention is achieved through the following technical solution: The first aspect of this invention provides: a millimeter-wave transceiver, including a transceiver circuit disposed on a transceiver structure; the transceiver circuit includes an EMI circuit, the EMI circuit being connected to a power supply system, the power supply system being connected to a monitoring system, a heat dissipation system, an up-conversion component, a local oscillator component, and a down-conversion component; the up-conversion component being connected to a power amplifier component, a local oscillator component, and a 1-to-4 filter power divider; the power amplifier component being connected to a waveguide coupler; the waveguide coupler being connected to a first detector and a waveguide circulator; the first detector being connected to the monitoring system; the waveguide circulator being connected to a waveguide filter and a down-conversion component; the down-conversion component being connected to a local oscillator component and a 1-to-4 filter power divider; the 1-to-4 filter power divider being connected to a second detector and a local oscillator component; the second detector being connected to the monitoring system; the monitoring system is used to control the operating status of various circuits, components, systems, and devices; when receiving an intermediate frequency (IF) signal, it executes an IF signal processing procedure; when receiving a millimeter-wave signal, it executes a millimeter-wave signal processing procedure.

[0006] Preferably, the intermediate frequency signal processing flow includes the following steps:

[0007] When the intermediate frequency (IF) signal and the reference clock signal enter the millimeter-wave transceiver from the IF connector, they are separated by a 1-to-4 filter power divider. The reference clock signal enters the local oscillator (LO) component to generate the LO signal, while the IF signal enters the up-conversion component to shift the IF signal to the millimeter-wave frequency band to form the millimeter-wave signal output. This signal then drives the power amplifier component for power amplification. The power signal passes through a waveguide coupler for output power detection, and finally passes through a waveguide circulator and a waveguide filter to achieve signal transmission and harmonic suppression.

[0008] Preferably, the millimeter-wave signal processing flow includes the following steps:

[0009] When the millimeter-wave signal enters the millimeter-wave transceiver from the RF waveguide, it passes through the waveguide filter to remove out-of-band spurious signals. Then, it passes through the waveguide circulator to switch the signal to the receiving branch. The millimeter-wave signal enters the downconverter component, which shifts the millimeter-wave signal to the intermediate frequency (IF) signal spectrum to form the IF signal output. After passing through the 1-to-4 filter power divider, it is filtered again and then output from the IF connector.

[0010] Preferably, the upconversion component includes a first filter, the first filter being connected to a first amplifier, the first amplifier being connected to a first mixer, the first mixer being connected to a second filter, the second filter being connected to a second amplifier, the second amplifier being connected to a second mixer, the second mixer being connected to a third filter, the third filter being connected to a linearizer, and the linearizer being connected to a drive amplifier.

[0011] When the intermediate frequency signal enters the upconverter component, it first passes through the first filter to remove out-of-band spurious signals, and then passes through the first amplifier to amplify the signal power. Then it enters the first mixer for the first spectrum shift, and after passing through the second filter to remove spurious signals generated during mixing, it enters the second amplifier for the second signal power amplification. Next, it enters the second mixer for the second spectrum shift, and then passes through the third filter to remove combined spurious signals generated during mixing. Then it passes through the linearizer to optimize the third-order intermodulation of the signal, and finally passes through the driver amplifier to form a millimeter-wave signal sufficient to drive the power amplifier component.

[0012] Preferably, the downconverter assembly includes a limiter connected to a low-noise amplifier, the low-noise amplifier connected to a fourth filter, the fourth filter connected to a third mixer, the third mixer connected to a fifth filter, the fifth filter connected to a third amplifier, the third amplifier connected to a fourth mixer, the fourth mixer connected to a sixth filter, and the sixth filter connected to the fourth amplifier.

[0013] When a millimeter-wave signal enters the downconverter, it first passes through a limiter to limit the amplitude of the received signal to protect the low-noise amplifier at the back end. Then, it is amplified by the low-noise amplifier, and after passing through the fourth filter to filter out unwanted out-of-band signals, it enters the third mixer for the first spectrum shift. Next, it passes through the fifth filter to filter out spurious signals generated during mixing, and then passes through the third amplifier for the third amplifier to amplify the signal again. Then, it enters the fourth mixer for the second spectrum shift. Next, it passes through the sixth filter to filter out combined spurious signals generated during mixing, and finally, after being amplified by the fourth amplifier, the intermediate frequency signal is output from the intermediate frequency connector.

[0014] Preferably, the power amplifier assembly includes a first waveguide power divider, the first waveguide power divider being connected to a multi-channel power amplifier module, and the power amplifier module being connected to a second waveguide power divider.

[0015] When the signal output from the upconverter enters the power amplifier, the first waveguide power divider divides the signal into multiple equal-amplitude and equal-phase signals, which are then transmitted to each power amplifier module. After the power amplifier module amplifies the signal, it is then combined by the second waveguide power divider, which superimposes the power output from the multiple power amplifier modules to achieve signal power combining.

[0016] Preferably, the local oscillator assembly includes a fifth amplifier connected to a step diode, the step diode connected to a first power divider, the first power divider connected to a seventh filter and an eighth filter; the seventh filter connected to a sixth amplifier, the sixth amplifier connected to an n-fold multiplier, the n-fold multiplier connected to a ninth filter, the ninth filter connected to the seventh amplifier; the eighth filter connected to an eighth amplifier, the eighth amplifier connected to a second power divider, the second power divider connected to two phase-locked loop (PLL) circuits, the PLL circuits connected to a switch, the switch connected to a tenth filter, and the tenth filter connected to the ninth amplifier;

[0017] When the reference clock signal enters the local oscillator component, it is first amplified by the fifth amplifier, which then drives the step diode to form a comb spectrum. The first power divider splits the comb spectrum into two signals. The first signal is filtered by the seventh filter to select the desired frequency component, then amplified by the sixth amplifier, and then multiplied by the n-fold frequency multiplier to obtain the desired frequency. Finally, it is filtered and amplified by the ninth filter and the seventh amplifier to form the first local oscillator signal. The second signal is filtered by the eighth filter to select the desired frequency component, then amplified by the eighth amplifier, and then split into two by the second power divider. These two signals enter two phase-locked loop (PLL) circuits respectively. The monitoring system controls the two PLL circuits to generate different frequencies at different times. Then, a switch selects one of the frequencies for output. Finally, the signal is filtered and amplified by the tenth filter and the ninth amplifier to form the second local oscillator signal.

[0018] Preferably, the phase-locked loop circuit includes a phase-locked loop, the input terminal of which is connected to a second power divider, and the output terminal of which is connected to the input terminal of a loop filter; the output terminal of the loop filter is connected to the input terminal of a voltage-controlled oscillator; and the output terminal of the voltage-controlled oscillator is connected to a switch.

[0019] Preferably, the transceiver structure includes a cavity. One side of the cavity is provided with a power connector, an RF connector, a network connector, and an air inlet cover. The other side of the cavity is provided with a waveguide port. One side of the cavity is provided with a cover plate, and the other side of the cavity is provided with a cooling structure. Inside the cavity are an AC-DC power supply structure, a down-converter component structure, a local oscillator component structure, an up-converter component structure, a waveguide circulator structure, a waveguide filter structure, a monitoring system board, a waveguide-to-coaxial converter, a waveguide power divider structure, a waveguide coupler structure, a power amplifier component control power adapter board, a detector structure, and a power amplifier module structure. The cooling structure includes a fan and heat dissipation fins. A waveguide sealing structure is provided at the waveguide port.

[0020] Preferably, the waveguide sealing structure includes a first waveguide port and a second waveguide port, with a waveguide sealing window disposed between the first waveguide port and the second waveguide port; a waveguide sealing window mounting groove is disposed on the side of the first waveguide port near the waveguide sealing window; a first sealing ring mounting groove and a third sealing ring mounting groove are disposed on the side of the second waveguide port near the waveguide sealing window; a second sealing ring mounting groove is disposed on the side of the waveguide sealing window near the first waveguide port; during combined installation, the first sealing ring, the second sealing ring, and the third sealing ring are respectively installed in the first sealing ring mounting groove, the second sealing ring mounting groove, and the third sealing ring mounting groove to form a three-layer sealing structure.

[0021] A second aspect of the present invention provides: a method for monitoring the status of a millimeter-wave transceiver, used in any of the millimeter-wave transceivers described above, comprising the following steps:

[0022] It executes at least one of the following processes: power supply voltage and current monitoring process, temperature parameter monitoring process, output power monitoring process, input power monitoring process, and local oscillator lockout monitoring process, and provides real-time feedback of operating data. If any process fails, it automatically disconnects the faulty hardware and reports a fault code, thereby monitoring the working status.

[0023] The beneficial effects of this invention are:

[0024] 1) The local oscillator component adopts a combination of step diodes and dual phase-locked loops, which optimizes the phase noise of the product and reduces the frequency switching lock time, thus solving the problems existing in such products at a low cost.

[0025] 2) Integrating up and down frequency converters, power amplifiers, local oscillator components, etc., the integration of millimeter-wave transceivers is improved through a flat layout and modular design. The fan is sealed inside the product's air duct, which improves the product's aesthetics and safety. The product has extremely high integration, small size, light weight, low hardware cost, high reliability, short maintenance time, and low maintenance cost.

[0026] 3) The waveguide sealing window structure can isolate the external environment from the internal waveguide components, preventing the internal components from being affected by the environment, thus improving the stability and reliability of the product. This sealing window has the advantages of simple structure, low cost, convenient installation, and high reliability.

[0027] 4) The status monitoring method provides monitoring functions such as voltage and current, temperature parameters, output power, input excitation, and local oscillator lock. The entire monitoring method is simple and practical, with extremely high reliability, high safety factor, and strong system protection capability. Attached Figure Description

[0028] Figure 1 This is a block diagram of the transceiver circuit.

[0029] Figure 2 This is a structural outline drawing of the transceiver;

[0030] Figure 3 This is a schematic diagram of an air-cooled structure;

[0031] Figure 4 This is a schematic diagram of the internal layout of the cavity;

[0032] Figure 5 Left exploded view of the waveguide sealing structure;

[0033] Figure 6 Right exploded view of the waveguide sealing structure;

[0034] Figure 7 This is a cross-sectional view showing the sealing effect of the waveguide sealing structure.

[0035] Figure 8 Flowchart of a method for monitoring the status of millimeter-wave transceivers;

[0036] In the diagram, 101 is the power connector; 102 is the RF connector; 103 is the network connector; 104 is the air inlet cover; 105 is the cavity; 106 is the cover; 107 is the heat dissipation fins; 108 is the fan; 109 is the waveguide port; 201 is the AC-DC power supply structure; 202 is the down-converter assembly structure; 203 is the local oscillator assembly structure; 204 is the up-converter assembly structure; 205 is the waveguide circulator structure; 206 is the waveguide filter structure; and 207 is the monitoring system. 208 is the waveguide-to-coaxial converter structure; 209 is the waveguide power divider structure; 210 is the waveguide coupler structure; 211 is the power amplifier assembly control power adapter board; 212 is the detector structure; 213 is the power amplifier module structure; 301 is the first waveguide port; 302 is the waveguide sealing window; 303 is the second waveguide port; 304 is the third sealing ring mounting slot; 305 is the first sealing ring mounting slot; 306 is the second sealing ring mounting slot; 307 is the waveguide sealing window mounting slot. Detailed Implementation

[0037] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0038] See Figures 1-8The first aspect of the present invention provides: a millimeter-wave transceiver, including a transceiver circuit disposed on a transceiver structure; the transceiver circuit includes an EMI circuit, the EMI circuit being connected to a power supply system, the power supply system being connected to a monitoring system, a heat dissipation system, an up-conversion component, a local oscillator component, and a down-conversion component; the up-conversion component being connected to a power amplifier component, a local oscillator component, and a 1-to-4 filter power divider; the power amplifier component being connected to a waveguide coupler; the waveguide coupler being connected to a first detector and a waveguide circulator; the first detector being connected to the monitoring system; the waveguide circulator being connected to a waveguide filter and a down-conversion component; the down-conversion component being connected to a local oscillator component and a 1-to-4 filter power divider; the 1-to-4 filter power divider being connected to a second detector and a local oscillator component; the second detector being connected to the monitoring system; the monitoring system is used to control the operating status of various circuits, components, systems, and devices; when receiving an intermediate frequency signal, it executes an intermediate frequency signal processing procedure; when receiving a millimeter-wave signal, it executes a millimeter-wave signal processing procedure.

[0039] In this embodiment, the present invention improves the system integration under the premise of lightweighting and miniaturization. This transceiver integrates power amplification, up-conversion, down-conversion and fast frequency hopping functions. The architecture is compact and the whole machine adopts a highly integrated modular design concept. The product is small in size, highly reliable and easy to maintain. Figure 1 In this configuration, IF stands for intermediate frequency signal; RF for radio frequency signal; LO for local oscillator signal; LNA for low-noise amplifier; DA for driver amplifier; and PA for power amplifier. The cooling system uses an air-cooled system, while the power supply system provides the necessary voltage. The monitoring system is the core of the system, responsible for communicating with the main control equipment and controlling the operating status of each module, while also monitoring the status of each module and automatically protecting them in case of malfunction. The EMI circuit isolates the system from the external environment, preventing external interference with normal product operation and preventing the product from interfering with the normal operation of external equipment. The air-cooling system dissipates heat generated by the product through airflow. Both the up-converter and down-converter components are double-converters.

[0040] In some embodiments, the intermediate frequency signal processing flow includes the following steps:

[0041] When the intermediate frequency (IF) signal and the reference clock signal enter the millimeter-wave transceiver from the IF connector, they are separated by a 1-to-4 filter power divider. The reference clock signal enters the local oscillator (LO) component to generate the LO signal, while the IF signal enters the up-conversion component to shift the IF signal to the millimeter-wave frequency band to form the millimeter-wave signal output. This signal then drives the power amplifier component for power amplification. The power signal passes through a waveguide coupler for output power detection, and finally passes through a waveguide circulator and a waveguide filter to achieve signal transmission and harmonic suppression.

[0042] In some embodiments, the millimeter-wave signal processing flow includes the following steps:

[0043] When the millimeter-wave signal enters the millimeter-wave transceiver from the RF waveguide, it passes through the waveguide filter to remove out-of-band spurious signals. Then, it passes through the waveguide circulator to switch the signal to the receiving branch. The millimeter-wave signal enters the downconverter component, which shifts the millimeter-wave signal to the intermediate frequency (IF) signal spectrum to form the IF signal output. After passing through the 1-to-4 filter power divider, it is filtered again and then output from the IF connector.

[0044] In some embodiments, the upconversion component includes a first filter connected to a first amplifier, the first amplifier connected to a first mixer, the first mixer connected to a second filter, the second filter connected to a second amplifier, the second amplifier connected to a second mixer, the second mixer connected to a third filter, the third filter connected to a linearizer, and the linearizer connected to a drive amplifier.

[0045] When the intermediate frequency signal enters the upconverter component, it first passes through the first filter to remove out-of-band spurious signals, and then passes through the first amplifier to amplify the signal power. Then it enters the first mixer for the first spectrum shift, and after passing through the second filter to remove spurious signals generated during mixing, it enters the second amplifier for the second signal power amplification. Next, it enters the second mixer for the second spectrum shift, and then passes through the third filter to remove combined spurious signals generated during mixing. Then it passes through the linearizer to optimize the third-order intermodulation of the signal, and finally passes through the driver amplifier to form a millimeter-wave signal sufficient to drive the power amplifier component.

[0046] In some embodiments, the downconverter assembly includes a limiter connected to a low-noise amplifier, the low-noise amplifier connected to a fourth filter, the fourth filter connected to a third mixer, the third mixer connected to a fifth filter, the fifth filter connected to a third amplifier, the third amplifier connected to a fourth mixer, the fourth mixer connected to a sixth filter, and the sixth filter connected to the fourth amplifier.

[0047] When a millimeter-wave signal enters the downconverter, it first passes through a limiter to limit the amplitude of the received signal to protect the low-noise amplifier at the back end. Then, it is amplified by the low-noise amplifier, and after passing through the fourth filter to filter out unwanted out-of-band signals, it enters the third mixer for the first spectrum shift. Next, it passes through the fifth filter to filter out spurious signals generated during mixing, and then passes through the third amplifier for the third amplifier to amplify the signal again. Then, it enters the fourth mixer for the second spectrum shift. Next, it passes through the sixth filter to filter out combined spurious signals generated during mixing, and finally, after being amplified by the fourth amplifier, the intermediate frequency signal is output from the intermediate frequency connector.

[0048] In some embodiments, the power amplifier assembly includes a first waveguide power divider, the first waveguide power divider being connected to a multi-channel power amplifier module, and the power amplifier module being connected to a second waveguide power divider.

[0049] When the signal output from the upconverter enters the power amplifier, the first waveguide power divider divides the signal into multiple equal-amplitude and equal-phase signals, which are then transmitted to each power amplifier module. After the power amplifier module amplifies the signal, it is then combined by the second waveguide power divider, which superimposes the power output from the multiple power amplifier modules to achieve signal power combining.

[0050] In some embodiments, the local oscillator assembly includes a fifth amplifier connected to a step diode, the step diode connected to a first power divider, the first power divider connected to a seventh filter and an eighth filter; the seventh filter connected to a sixth amplifier, the sixth amplifier connected to an n-times multiplier, the n-times multiplier connected to a ninth filter, the ninth filter connected to the seventh amplifier; the eighth filter connected to an eighth amplifier, the eighth amplifier connected to a second power divider, the second power divider connected to two phase-locked loop (PLL) circuits, the PLL circuits connected to a switch, the switch connected to a tenth filter, and the tenth filter connected to the ninth amplifier;

[0051] When the reference clock signal enters the local oscillator component, it is first amplified by the fifth amplifier, which then drives the step diode to form a comb spectrum. The first power divider splits the comb spectrum into two signals. The first signal is filtered by the seventh filter to select the desired frequency component, then amplified by the sixth amplifier, and then multiplied by the n-fold frequency multiplier to obtain the desired frequency. Finally, it is filtered and amplified by the ninth filter and the seventh amplifier to form the first local oscillator signal. The second signal is filtered by the eighth filter to select the desired frequency component, then amplified by the eighth amplifier, and then split into two by the second power divider. These two signals enter two phase-locked loop (PLL) circuits respectively. The monitoring system controls the two PLL circuits to generate different frequencies at different times. Then, a switch selects one of the frequencies for output. Finally, the signal is filtered and amplified by the tenth filter and the ninth amplifier to form the second local oscillator signal.

[0052] In this embodiment, the local oscillator (LO) component outputs two LO signals during operation. The first LO signal has a fixed frequency, while the second LO signal is generated by a phase-locked loop (PLL) circuit. The monitoring system generates the frequency according to the required frequency of the product. By using two PLL circuits, the frequency can be generated alternately at different times. The LO frequency output is switched via a switch, achieving a rapid frequency switching function. The LO component uses a step diode to form a comb-shaped spectrum. Using the spectral components for frequency multiplication and as a reference signal for the PLL circuit can greatly reduce the degradation of system phase noise. This architecture improves frequency switching time and reduces phase noise while also significantly reducing costs.

[0053] In some embodiments, the phase-locked loop circuit includes a phase-locked loop, the input of which is connected to a second power divider, and the output of which is connected to the input of a loop filter; the output of the loop filter is connected to the input of a voltage-controlled oscillator; and the output of the voltage-controlled oscillator is connected to a switch.

[0054] In some embodiments, the transceiver structure includes a cavity 105. A power connector 101, an RF connector 102, a network connector 103, and an air inlet cover 104 are provided on one side of the cavity 105. A waveguide port 109 is provided on the other side of the cavity 105. A cover 106 is provided on one side of the cavity, and a wind-cooling structure is provided on the other side of the cavity 105. Inside the cavity, an AC-DC power supply structure 201, a down-converter component structure 202, a local oscillator component structure 203, an up-converter component structure 204, a waveguide circulator structure 205, a waveguide filter structure 206, a monitoring system board 207, a waveguide-to-coaxial converter 208, a waveguide power divider structure 209, a waveguide coupler structure 210, a power amplifier component control power adapter board 211, a detector structure 212, and a power amplifier module structure 213 are provided. The wind-cooling structure includes a fan 108 and heat dissipation fins 107. A waveguide sealing structure is provided at the waveguide port 109.

[0055] In this embodiment, both the power connector 101 and the network connector 103 are circular. The entire device adopts a highly integrated modular design, with each module evenly arranged within the cavity 105. The air-cooling structure consists of a high-reliability fan 108 and heat dissipation fins 107. The air-cooling structure is located on the other side of the cavity 105 and is enclosed within the product by a cover plate, forming an effective airflow channel to improve heat dissipation and avoiding safety hazards to users from the fan blades. The fan 108 and the air inlet cover 104 are designed as an integral unit; during repairs, only the air inlet cover 104 needs to be removed for complete replacement, making maintenance quick and convenient. This transceiver architecture improves the maintainability and safety of the product, and modular replacement during repairs reduces repair costs and improves repair efficiency.

[0056] Within the transceiver housing 105, various modules are tightly arranged. A monitoring system board 207 is located at the circular network connector entrance. The monitoring system board 207 comprises an FPGA, storage chips, a control conversion chip, and a network port. An AC-DC power supply structure containing EMI circuitry is located at the circular power connector entrance. This power supply structure provides power to the monitoring system via shielded power cables. The monitoring system, in turn, interconnects with each module via shielded control cables and provides system control commands. The power amplifier module structure 213... The frequency converter component structure 204, local oscillator component structure 203, down-converter component structure 202, waveguide circulator structure 205, and waveguide filter structure 206 are fastened to the cavity with screws. An indium silver sheet is laid on the contact surface between the bottom of the cavity 105 and the power amplifier module structure 213 to increase thermal conductivity. The waveguide power divider structure 209 is then fastened to the power amplifier module structure 213 with screws. Finally, the waveguide circulator structure 205, waveguide filter structure 206, and waveguide coupler structure 210 are sequentially fastened inside the cavity 105. By increasing the integration of the modules and their close arrangement, the system's integration is improved. The reasonable flat layout avoids the traditional stacked layout, shortening maintenance time and reducing maintenance costs.

[0057] In some embodiments, the waveguide sealing structure includes a first waveguide port 301 and a second waveguide port 303, with a waveguide sealing window 302 disposed between the first waveguide port 301 and the second waveguide port 303; a waveguide sealing window mounting groove 307 is disposed on the side of the first waveguide port 301 near the waveguide sealing window 302; a first sealing ring mounting groove 305 and a third sealing ring mounting groove 304 are disposed on the side of the second waveguide port 303 near the waveguide sealing window 302; a second sealing ring mounting groove 306 is disposed on the side of the waveguide sealing window 302 near the first waveguide port 301; during combined installation, the first sealing ring, the second sealing ring, and the third sealing ring are respectively installed in the first sealing ring mounting groove 305, the second sealing ring mounting groove 306, and the third sealing ring mounting groove 304 to form a three-layer sealing structure.

[0058] In this embodiment, the millimeter-wave transceiver is interconnected with the antenna via a waveguide port. A waveguide is a hollow metal tube. When the waveguide port is exposed, liquids or impurities can directly enter the product. Accumulation of liquids or impurities in the waveguide can affect signal transmission, thus impacting product specifications and potentially damaging waveguide filters and circulators, rendering the product unusable. To address this issue, a novel waveguide sealing structure is used in this transceiver. A waveguide sealing window 302 is added at the waveguide interconnection interface to seal and isolate the waveguide port from the internal waveguide components. The second waveguide port 303 is designed with a third sealing ring mounting groove 304 and a first sealing ring mounting groove 305. The waveguide sealing window 302 is designed with a second sealing ring mounting groove 306. The first waveguide port 301 is designed with a waveguide sealing window mounting groove 307. When the first waveguide port 301 and the second waveguide port 303 are assembled and installed using screws, the waveguide sealing window 302 and the sealing ring are embedded in the waveguide interface, forming a three-layer seal. The first layer of seal is the first sealing ring in the first sealing ring mounting groove 305, which can ensure the sealing of the waveguide port during interconnection. The second layer of seal is the second sealing ring in the second sealing ring mounting groove 306, which can ensure the sealing isolation between the external waveguide port and the internal waveguide assembly. The third layer of seal is the third sealing ring in the third sealing ring mounting groove 304, which can be further sealed. Even if the first and second layers of seal fail, the sealing effect of the product can still be ensured. The core component of this sealing structure is the waveguide sealing window 302. This design uses polytetrafluoroethylene (PTFE) (but is not limited to this material). PTFE has advantages such as low dielectric constant and dielectric loss over a wide frequency range, excellent plasticity and ductility, good temperature characteristics, and high power tolerance. This waveguide sealing structure not only has excellent sealing performance and superior performance indicators, but also features simple structure, low cost, convenient installation, and high reliability.

[0059] A second aspect of the present invention provides: a method for monitoring the status of a millimeter-wave transceiver, used in any of the millimeter-wave transceivers described above, comprising the following steps:

[0060] It executes at least one of the following processes: power supply voltage and current monitoring process, temperature parameter monitoring process, output power monitoring process, input power monitoring process, and local oscillator lockout monitoring process, and provides real-time feedback of operating data. If any process fails, it automatically disconnects the faulty hardware and reports a fault code, thereby monitoring the working status.

[0061] In this embodiment, the system's operating status can be monitored online in real time, and the system can automatically determine its operating status. If the status is normal, operation continues; if a system fault occurs, the faulty part is automatically disconnected and a fault code is reported to ensure the normal operation of other parts of the system. The system is interconnected with the host via a network port, and can provide real-time feedback of operating data, providing curves of data from each monitored part over time to observe the long-term operational stability of the system. Status monitoring mainly includes power supply voltage and current monitoring, temperature parameter monitoring, output power monitoring, input excitation monitoring, and local oscillator lock-in monitoring, which can comprehensively cover the system status and ensure product safety.

[0062] The power supply voltage and current monitoring process includes the following steps: First, read the input voltage and current data of the AC-DC power supply component, and then read the output voltage and current data of the AC-DC power supply component; Second, verify the input voltage and current data of the AC-DC power supply component against the design threshold, and then verify the output voltage and current data of each group of the AC-DC power supply component against the design threshold; further calculate the sum of the input power and output power of the AC-DC power supply component, and check the threshold of the power difference; Third, judge all the verification results. If the judgment is qualified, continue to run and continuously output data; if the judgment is unqualified, proceed with the fault handling process; Fourth, automatically handle system faults according to the judgment in the third step, shut down the corresponding back-end load module, and report abnormal module voltage or current information.

[0063] The temperature parameter monitoring process includes the following steps: First, read the temperature data collected from each module; second, calibrate the temperature data of each module with the design threshold; further, calculate the junction temperature of the power amplifier chip based on the output power and the power amplifier module temperature, and calibrate it with the power amplifier chip junction temperature threshold; third, judge all calibration results, if the judgment is qualified, continue to run and continuously output data, if the judgment is unqualified, proceed with the fault handling process; fourth, automatically handle system faults based on the judgment in the third step, shut down the corresponding back-end load module, and report abnormal module temperature parameter information.

[0064] The output power monitoring process includes the following steps: First, read the power amplifier output data; second, calculate the power amplifier output power and check it against the design threshold; third, judge all the calibration results. If the judgment is qualified, continue to run and continuously output data. If the judgment is not qualified, proceed with the fault handling process; fourth, based on the judgment in the third step, automatically handle system faults, shut down the power amplifier module, and report abnormal power amplifier module output power information.

[0065] The input excitation monitoring process includes the following steps: First, read the input excitation power acquisition data; second, calibrate the input intermediate frequency signal power against the design threshold, and then calibrate the input reference signal power against the design threshold; third, judge all calibration results. If the judgment is qualified, continue to run and continuously output data; if the judgment is unqualified, proceed with the fault handling process; fourth, automatically handle system faults based on the judgment in the third step, shut down RF-related components, and report input excitation abnormal information.

[0066] The local oscillator lockout monitoring process includes the following steps: First, read the local oscillator output acquisition data and then detect the local oscillator chip lockout indication signal; second, calibrate the local oscillator signal power against the design threshold and then calibrate the local oscillator signal lockout indication; third, judge all calibration results. If the judgment is qualified, continue to run and continuously output data; if it is unqualified, proceed with the fault handling process; fourth, automatically handle system faults based on the judgment in the third step, shut down RF-related components, and report local oscillator lockout abnormal information.

[0067] The above description is merely a preferred embodiment of the present invention. It should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A millimeter-wave transceiver, characterized in that: The transceiver circuit is mounted on the transceiver structure. The transceiver circuit includes an EMI circuit connected to a power supply system, which in turn connects to a monitoring system. The monitoring system connects to a heat dissipation system, an up-conversion component, a local oscillator component, and a down-conversion component. The up-conversion component connects to a power amplifier component, a local oscillator component, and a 1-to-4 filter power divider. The power amplifier component connects to a waveguide coupler, which in turn connects to a first detector and a waveguide circulator. The first detector connects to the monitoring system. The waveguide circulator connects to a waveguide filter and a down-conversion component. The down-conversion component connects to the local oscillator component and the 1-to-4 filter power divider. The 1-to-4 filter power divider connects to a second detector and the local oscillator component. The second detector connects to the monitoring system. The monitoring system controls the operating status of each circuit, component, system, and device. When an intermediate frequency (IF) signal is received, it executes an IF signal processing procedure; when a millimeter-wave (MW) signal is received, it executes a MW signal processing procedure. The local oscillator assembly includes a fifth amplifier connected to a step diode, which is connected to a first power divider. The first power divider is connected to a seventh filter and an eighth filter. The seventh filter is connected to a sixth amplifier, which is connected to an n-fold multiplier. The n-fold multiplier is connected to a ninth filter, which is connected to the seventh amplifier. The eighth filter is connected to an eighth amplifier, which is connected to a second power divider. The second power divider is connected to two phase-locked loop (PLL) circuits. The PLL circuits are connected to a switch, which is connected to a tenth filter. The tenth filter is connected to the ninth amplifier. When the reference clock signal enters the local oscillator component, it is first amplified by the fifth amplifier, which then drives the step diode to form a comb spectrum. The first power divider splits the comb spectrum into two signals. The first signal is filtered by the seventh filter to select the desired frequency component, then amplified by the sixth amplifier, and then multiplied by the n-fold multiplier to obtain the desired frequency. Finally, it is filtered and amplified by the ninth filter and the seventh amplifier to form the first local oscillator signal. The second signal is filtered by the eighth filter to select the desired frequency component, then amplified by the eighth amplifier, and then split into two by the second power divider. These two signals enter two phase-locked loop (PLL) circuits respectively. The monitoring system controls the two PLL circuits to generate different frequencies at different times. One of the frequencies is then selected for output by a switch. Finally, it is filtered and amplified by the tenth filter and the ninth amplifier to form the second local oscillator signal. The upconversion component includes a first filter, the first filter being connected to a first amplifier, the first amplifier being connected to a first mixer, the first mixer being connected to a second filter, the second filter being connected to a second amplifier, the second amplifier being connected to a second mixer, the second mixer being connected to a third filter, the third filter being connected to a linearizer, and the linearizer being connected to a drive amplifier. When the intermediate frequency signal enters the upconversion component, it first passes through a first filter to remove out-of-band spurious signals, and then passes through a first amplifier to amplify the signal power. Next, it enters a first mixer for the first spectrum shift, then passes through a second filter to remove spurious signals generated during mixing, and then enters a second amplifier for further signal power amplification. It then enters a second mixer for the second spectrum shift, and then passes through a third filter to remove combined spurious signals generated during mixing. Finally, it passes through a linearizer to optimize the third-order intermodulation of the signal, and finally passes through a driver amplifier to form a millimeter-wave signal sufficient to drive the power amplifier component. The first mixer uses the first local oscillator signal for mixing, and the second mixer uses the second local oscillator signal for mixing.

2. The millimeter-wave transceiver according to claim 1, characterized in that: The intermediate frequency signal processing flow includes the following steps: When the intermediate frequency (IF) signal and the reference clock signal enter the millimeter-wave transceiver from the IF connector, they are separated by a 1-to-4 filter power divider. The reference clock signal enters the local oscillator (LO) component to generate the LO signal, while the IF signal enters the up-conversion component to shift the IF signal to the millimeter-wave frequency band to form the millimeter-wave signal output. This signal then drives the power amplifier component for power amplification. The power signal passes through a waveguide coupler for output power detection, and finally passes through a waveguide circulator and a waveguide filter to achieve signal transmission and harmonic suppression.

3. The millimeter-wave transceiver according to claim 1, characterized in that: The millimeter-wave signal processing flow includes the following steps: When the millimeter-wave signal enters the millimeter-wave transceiver from the RF waveguide, it passes through the waveguide filter to remove out-of-band spurious signals. Then, it passes through the waveguide circulator to switch the signal to the receiving branch. The millimeter-wave signal enters the downconverter component, which shifts the millimeter-wave signal to the intermediate frequency (IF) signal spectrum to form the IF signal output. After passing through the 1-to-4 filter power divider, it is filtered again and then output from the IF connector.

4. The millimeter-wave transceiver according to claim 1, characterized in that: The downconverter assembly includes a limiter connected to a low-noise amplifier, the low-noise amplifier connected to a fourth filter, the fourth filter connected to a third mixer, the third mixer connected to a fifth filter, the fifth filter connected to a third amplifier, the third amplifier connected to a fourth mixer, the fourth mixer connected to a sixth filter, and the sixth filter connected to the fourth amplifier. When a millimeter-wave signal enters the downconverter, it first passes through a limiter to limit the amplitude of the received signal to protect the low-noise amplifier at the back end. Then, it is amplified by the low-noise amplifier, and after passing through the fourth filter to filter out unwanted out-of-band signals, it enters the third mixer for the first spectrum shift. Next, it passes through the fifth filter to filter out spurious signals generated during mixing, and then passes through the third amplifier for the third amplifier to amplify the signal again. Then, it enters the fourth mixer for the second spectrum shift. Next, it passes through the sixth filter to filter out combined spurious signals generated during mixing, and finally, after being amplified by the fourth amplifier, the intermediate frequency signal is output from the intermediate frequency connector.

5. The millimeter-wave transceiver according to claim 1, characterized in that: The power amplifier assembly includes a first waveguide power divider, which is connected to a multi-channel power amplifier module, and the power amplifier module is connected to a second waveguide power divider. When the signal output from the upconverter enters the power amplifier, the first waveguide power divider divides the signal into multiple equal-amplitude and equal-phase signals, which are then transmitted to each power amplifier module. After the power amplifier module amplifies the signal, it is then combined by the second waveguide power divider, which superimposes the power output from the multiple power amplifier modules to achieve signal power combining.

6. The millimeter-wave transceiver according to claim 1, characterized in that: The phase-locked loop circuit includes a phase-locked loop, the input of which is connected to a second power divider, and the output of which is connected to the input of a loop filter; the output of the loop filter is connected to the input of a voltage-controlled oscillator; and the output of the voltage-controlled oscillator is connected to a switch.

7. The millimeter-wave transceiver according to any one of claims 1-6, characterized in that: The transceiver structure includes a cavity. One side of the cavity is equipped with a power connector, an RF connector, a network connector, and an air inlet cover. The other side of the cavity has a waveguide port. One side of the cavity has a cover plate, and the other side has a cooling structure. Inside the cavity are an AC-DC power supply structure, a down-converter assembly structure, a local oscillator assembly structure, an up-converter assembly structure, a waveguide circulator structure, a waveguide filter structure, a monitoring system board, a waveguide-to-coaxial converter, a waveguide power divider structure, a waveguide coupler structure, a power amplifier assembly control power adapter board, a detector structure, and a power amplifier module structure. The cooling structure includes a fan and heat dissipation fins. A waveguide sealing structure is provided at the waveguide port.

8. The millimeter-wave transceiver according to claim 7, characterized in that: The waveguide sealing structure includes a first waveguide port and a second waveguide port, with a waveguide sealing window disposed between the first waveguide port and the second waveguide port; a waveguide sealing window mounting groove is disposed on the side of the first waveguide port near the waveguide sealing window; a first sealing ring mounting groove and a third sealing ring mounting groove are disposed on the side of the second waveguide port near the waveguide sealing window; a second sealing ring mounting groove is disposed on the side of the waveguide sealing window near the first waveguide port; during combined installation, the first sealing ring, the second sealing ring, and the third sealing ring are respectively installed in the first sealing ring mounting groove, the second sealing ring mounting groove, and the third sealing ring mounting groove to form a three-layer sealing structure.

9. A method for monitoring the status of a millimeter-wave transceiver, characterized in that: For a millimeter-wave transceiver as described in any one of claims 1-8, the following steps are included: It executes at least one of the following processes: power supply voltage and current monitoring process, temperature parameter monitoring process, output power monitoring process, input power monitoring process, and local oscillator lockout monitoring process, and provides real-time feedback of operating data. If any process fails, it automatically disconnects the faulty hardware and reports a fault code, thereby monitoring the working status.

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