Subsurface indicator illumination

Abstract

Presented herein are apparatuses / devices having indicator lights (visual indicators), such as light emitting diodes (LEDs), positioned below / below an outer surface of a housing of the apparatus. However, indicator lamps (sometimes referred to herein as "under-surface" or "under-housing" indicator lamps) positioned below the outer surface of the housing are optically coupled to the outer surface of the housing via one or more optical connectors (e.g., light guides, light conduits, light diffusers, etc. In this way, light emitted by the subsurface indicator lamp remains visible at the outer surface of the device housing.

Description

[0001] This application is a divisional application with application number 201980044475.1 and invention name “Subsurface Indicator Lighting”, which was filed on July 16, 2019, entered the Chinese national phase on December 30, 2020, and has the international application date of July 16, 2019. Technical Field

[0002] The present invention generally relates to indicator lights that are positioned below the surface of an equipment housing. Background Art

[0003] Medical devices having one or more implantable components, generally referred to herein as implantable medical devices, have provided a wide range of therapeutic benefits to recipients over the past several decades. In particular, partially or fully implanted medical devices such as hearing prostheses (e.g., bone conduction devices, mechanical stimulators, cochlear implants, etc.), implantable pacemakers, defibrillators, functional electrical stimulation devices, and other implantable medical devices have been successful over the years in performing lifesaving and / or lifestyle-enhancing functions.

[0004] Over the years, the types of implantable medical devices and the range of functions performed have increased. For example, many implantable medical devices now often include one or more instruments, devices, sensors, processors, controllers, or other functional mechanical or electrical components that are permanently or temporarily implanted in a recipient. These functional devices are generally used to diagnose, prevent, monitor, treat, or manage a disease / injury or symptom thereof, or to investigate, replace, or modify anatomy or physiological processes. Many of these functional devices utilize power and / or data received from an external device that is part of or operates in conjunction with the implantable medical device. Summary of the Invention

[0005] In one aspect, a device is provided that includes: a housing including at least one acoustic port; a microphone positioned within the housing in alignment with the acoustic port; at least one optical connector positioned within the acoustic port; and at least one indicator light positioned within the housing, wherein the at least one indicator light is optically coupled to the acoustic port via the optical connector such that light emitted from the at least one indicator light is visible externally of the housing via the acoustic port.

[0006] In another aspect, a device is provided that includes a housing including at least one acoustic port, an outer surface, and an inner surface; a printed circuit board (PCB) positioned within the housing proximate the acoustic port; a microelectromechanical system (MEMS) microphone mounted on the PCB aligned with the acoustic port; at least one indicator light co-located on the PCB below the inner surface of the housing with the MEMS microphone; and at least one optical connector optically coupling the at least one indicator light to the outer surface of the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Embodiments of the present invention are described herein with reference to the accompanying drawings, in which:

[0008] Figure 1A is a schematic diagram illustrating a cochlear implant according to certain embodiments presented herein;

[0009] Figure 1B According to certain embodiments presented herein Figure 1A A simplified block diagram of a cochlear implant;

[0010] Figure 2 is a cross-sectional view of a portion of a sound processing unit according to certain embodiments presented herein;

[0011] Figure 3 is a cross-sectional view of a portion of a sound processing unit according to certain embodiments presented herein;

[0012] Figure 4 is a cross-sectional view of a portion of a sound processing unit according to certain embodiments presented herein;

[0013] Figure 5A is a cross-sectional view of a portion of a sound processing unit according to certain embodiments presented herein;

[0014] Figure 5B According to certain embodiments presented herein Figure 5A a top view of a portion of a sound processing unit;

[0015] Figure 6A is a cross-sectional view of a portion of a sound processing unit according to certain embodiments presented herein; and

[0016] Figure 6B According to certain embodiments presented herein Figure 6A A top view of a portion of a sound processing unit. DETAILED DESCRIPTION

[0017] Presented herein are devices / apparatuses having indicator lights (e.g., light emitting diodes (LEDs)) positioned below / under the exterior surface of the device's housing. However, the indicator lights positioned below the exterior surface of the housing (sometimes referred to herein as "sub-surface" or "sub-housing" indicator lights) are optically coupled to the exterior surface of the housing via one or more optical connectors (e.g., light guides, light pipes, light diffusers, etc.). In this way, light emitted by the sub-surface indicator lights remains visible at the exterior surface of the device's housing.

[0018] For ease of description only, embodiments are described herein primarily with reference to one illustrative device / apparatus (i.e., an external component of a cochlear implant). However, it should be appreciated that the techniques presented herein may also be used with various other devices that include indicator lights. For example, the techniques presented herein may be used with other hearing prostheses including acoustic hearing aids, bone conduction devices, middle ear hearing prostheses, direct acoustic stimulators, auditory brain stimulators, and / or other devices such as mobile computing devices (e.g., mobile phones, tablet computers, and the like).

[0019] Figure 1A and Figure 1B The figure shows an exemplary cochlear implant 100 according to certain embodiments presented herein, which includes two subsurface indicator lights (indicator lights) 155 (A) and 155 (B). In this embodiment, the indicator lights are light emitting diodes (LEDs) and are therefore referred to as subsurface LEDs 155 (A) and 155 (B). Figure 1A is a schematic diagram of an exemplary cochlear implant 100, and Figure 1B is a block diagram of an exemplary cochlear implant 100. For ease of illustration, Figure 1A and Figure 1B will be described together.

[0020] Cochlear implant 100 includes an external component 102 and an internal / implantable component 104. External component 102 is configured to be attached directly or indirectly to the body of a recipient and typically includes an external coil 106 and typically includes a magnet (in a positional position) for securing the external coil 106 relative to the external coil 106. Figure 1A). The external component 102 also includes one or more sound input elements / devices 113 for receiving sound signals at the sound processing unit (sound processor) 112. In this example, the one or more sound input devices 113 include microphones 108 (A) and 108 (B) each configured to capture / receive acoustic signals, one or more auxiliary input devices 109 configured to receive (e.g., an audio port such as a direct audio input (DAI), a data port such as a universal serial bus (USB) port, a cable port, etc.), and a wireless transmitter / receiver (transceiver) 111, each of which is located in, on, or near the sound processing unit 112. The one or more auxiliary first input devices 109 and the wireless transceiver 111 are configured to receive electrical signals including sound data. In this way, the received sound signals may include acoustic signals, electrical signals including sound data, etc. It should also be appreciated that the sound processing unit 112 may also include other types of input devices 113 such as a telecoil, which have been removed for ease of illustration. Figure 1A and Figure 1B They are omitted.

[0021] The sound processing unit 112 includes a housing 140 that includes acoustic ports / openings 142(A) and 142(B) that allow acoustic sound to enter the housing. Microphones 108(A) and 108(B) are positioned within the housing 140 and adjacent to the acoustic ports 142(A) and 142(B), respectively, to detect acoustic sound signals entering through the acoustic ports 142. For example, at least one power source (e.g., a battery) 107, a radio frequency (RF) transceiver 121, and a processing module 125 including a sound processing engine 123 are also provided on the housing 140 of the sound processing unit 112. The processing module 125, and therefore the sound processing engine 123, can be formed by any one or a combination of one or more processors (e.g., one or more digital signal processors (DSPs), one or more uC cores, etc.), firmware, software, etc., arranged to perform the operations described herein. That is, the processing module 125 can be implemented on a printed circuit board (PCB) or some other arrangement.

[0022] exist Figure 1A and Figure 1BIn the example shown, the external component 102 includes a behind-the-ear (BTE) sound processing unit 112 and a separate coil 106. As such, the housing 140 is configured (i.e., shaped, sized, etc.) to be attached to and worn near the recipient's ear. However, it should be appreciated that embodiments of the present invention may be implemented using systems including other arrangements, such as systems including an outside-the-ear (OTE) sound processing unit (i.e., a component configured to be magnetically coupled to the recipient's head and including an integrated coil), a mini or micro BTE unit, an in-the-canal unit configured to be located in the recipient's ear canal, a wearable sound processing unit, etc.

[0023] Return to Figure 1A and Figure 1B In an exemplary embodiment of the present invention, the implantable assembly 104 includes an implant body (main module) 114, a lead region 116, and an intracochlear stimulation accessory 118, all of which are configured to be implanted beneath the skin / tissue (tissue) 105 of a recipient. The implant body 114 typically includes an airtight housing 115 in which an RF interface circuitry 124 and a stimulator unit 120 are disposed. The implant body 114 also includes an internal / implantable coil 122, which is typically external to the housing 115 but which is electrically connected to the stimulator via a sealed feedthrough (at the Figure 1B ) is connected to the RF interface circuit system 124.

[0024] The stimulation accessory 118 is configured to be at least partially implanted in the recipient's cochlea 137. The stimulation accessory 118 includes a plurality of longitudinally spaced intracochlear electrical stimulation contacts (electrodes) 126 that together form a contact or electrode array 128 for delivering electrical stimulation (current) to the recipient's cochlea. The stimulation accessory 118 extends through an opening in the recipient's cochlea (e.g., cochleostomy, round window, etc.) and has a lead region 116 and a sealed feedthrough (at Figure 1B The lead region 116 includes a plurality of conductors (wires) that electrically couple the electrodes 126 to the stimulator unit 120.

[0025] As indicated, the cochlear implant 100 includes an external coil 106 and an implantable coil 122. The coils 106 and 122 are typically wire antenna coils, each comprising multiple turns of electrically insulated single or multiple strands of platinum or gold wire. Typically, a magnet is secured relative to each of the external coil 106 and the implantable coil 122. The magnets secured relative to the external coil 106 and the implantable coil 122 facilitate operational alignment of the external coil with the implantable coil. This operational alignment of the coils 106 and 122 enables the external component 102 to transmit data, and possibly power, to the implantable component 104 via a tightly coupled wireless link formed between the external coil 106 and the implantable coil 122. For example, the tightly coupled wireless link is a radio frequency (RF) link. However, various other types of energy transfer, such as infrared (IR), electromagnetic, capacitive, and inductive transfer, may be used to transfer power and / or data from the external component to the implantable component, and as such, Figure 1B Only one example arrangement is shown.

[0026] The processing module 125 of the sound processing unit 112 is configured to convert the sound / audio signals received / captured at the one or more input elements / devices 113 into stimulation control signals 136 for stimulating the first ear of the recipient (i.e., the sound processing engine 123 is configured to perform sound processing on the input audio signals received at the sound processing unit 112). Figure 1B In an embodiment of the present invention, the stimulation control signal 136 is provided to the RF transceiver 121, which transmits the stimulation control signal 136 (e.g., in an encoded manner) transcutaneously to the implantable component 104 via the external coil 106 and the implantable coil 122. That is, the stimulation control signal 136 is received at the RF interface circuitry 124 via the implantable coil 122 and provided to the stimulator unit 120. The stimulator unit 120 is configured to utilize the stimulation control signal 136 to generate an electrical stimulation signal (e.g., an electrical current signal) for delivery to the recipient's cochlea via one or more stimulation contacts 126. In this manner, the cochlear implant 100 bypasses absent or defective hair cells (which normally convert acoustic vibrations into neural activity) to electrically stimulate the recipient's auditory nerve cells in a manner that causes the recipient to perceive one or more components of the input audio signal.

[0027] In cochlear implants and other medical devices, it is often necessary to convey information to a recipient of the device or another user. As such, external components of such medical devices typically include one or more indicator lights (visual indicators) that can illuminate in one or more ways to convey the desired information to the recipient or other user. For example, a typical sound processing unit for a hearing prosthesis (e.g., a BTE sound processing unit, an OTE sound processing unit, etc.) includes one or more indicator lights disposed on an exterior surface of the sound processing unit housing. In these conventional arrangements, the microphone and the indicator light are separated from one another such that the microphone (i.e., the associated acoustic port) and the indicator light occupy separate areas of the exterior surface of the sound processing unit housing. The indicator light also typically uses a somewhat geometrically defined radiation form or shape so that the emitted light is visible from multiple directions / angles.

[0028] The separation of the indicator lights and microphone is due, at least in part, to several design constraints. First, because the indicator lights are located on the exterior surface, they occupy some physical space, while the acoustic (microphone) port also occupies some different physical space. Second, and more importantly, the conventional microphone and conventional indicator lights are mounted on separate printed circuit boards (PCBs) within the sound processing unit. The result is a two-dimensional surface space savings on the sound processing unit's housing.

[0029] There is a growing desire to reduce the size of external components of medical devices. However, the requirement to mount the microphone and indicator light on separate PCBs, each occupying a different outer surface of the housing, limits size and flexibility when designing external components of a medical device. Additionally, the requirement to mount the indicator light(s) and microphone on their own PCBs increases the physical space / volume required for the sound processing unit. As detailed above, the embodiments presented herein eliminate the need for this additional space and allow for the manufacture of a more discrete / space-efficient sound processing unit.

[0030] More specifically, the embodiments presented herein address these and other issues by using a subsurface microphone that enables the design of a space-efficient sound processing unit (eg, conserving surface space on the housing) without compromising functionality.

[0031] In particular, as described in more detail below, the use of subsurface indicator lights is implemented at least in part using microelectromechanical systems (MEMS) microphone technology, and the arrangements presented herein are not particularly feasible when using conventional microphones. For example, the arrangements of conventional (e.g., electret) microphones are such that they locate the associated PCB relatively far from the outer surface of the sound processor (i.e., between the microphone and the outer surface of the sound processing unit). The reason for this separation is that conventional (e.g., electret) microphones cannot be reflow soldered and therefore cannot typically be mounted on the PCB in a manner sufficiently secure to be used in mechanical fixing. Therefore, for electret microphones, the microphone mechanical shape is used to retain the microphone within the housing. In such an arrangement, the PCB is on the back or side of the microphone (i.e., not between the microphone and the housing).

[0032] However, MEMS microphones employ a more advantageous architecture that allows the associated PCB to be positioned closer to the exterior surface of the sound processing unit. That is, MEMS microphones are specifically designed to be rigidly mounted on a rigid PCB and have a recommended application for such an embodiment. In such an arrangement, the acoustic path passes through the PCB (i.e., the PCB must be between the microphone and the housing). Thus, for a MEMS microphone, the PCB is positioned close to the housing, which is not the case for a conventional (e.g., electret) microphone. The arrangement presented herein can therefore take advantage of this and mount the indicator light(s) on the same PCB as the MEMS microphone (i.e., taking advantage of the fact that the PCB must be close to the interior surface of the housing so that the PCB can be used to mount both the microphone and the LED(s).

[0033] Although closer to the surface than conventional microphone arrangements, the PCB for the MEMS microphone remains within the housing. As a result, the indicator light(s), mounted on the same PCB as the MEMS microphone, are positioned below the surface of the device housing, rather than actually on the exterior surface of the housing as in conventional arrangements. In other words, by mounting the indicator light on the same PCB as the MEMS microphone, the arrangement presented herein deviates from the conventional requirement that the indicator light must be located at the surface of the housing. The arrangement presented herein addresses this issue by employing an optical connector (e.g., a light guide, a light pipe, a light diffuser, etc.) to optically couple the subsurface indicator light(s) to the surface of the housing, thereby enabling the indicator light(s) to be visible from the exterior of the housing and thereby providing their illumination function.

[0034] The techniques presented herein are primarily described with reference to MEMS microphones. However, it should be appreciated that the techniques presented herein may also be implemented using any other suitable microphone technology, now known or later developed, having similar characteristics to those of the MEMS microphones implementing the disclosed configurations (e.g., architectures that allow the associated PCB to be positioned closer to the exterior surface of the housing, architectures in which the microphone is specifically designed to be rigidly mounted on a rigid PCB, etc.).

[0035] return Figure 1A and Figure 1B As noted above, the sound processing unit 112 includes subsurface LEDs 155(A) and 155(B). The LEDs 155(A) and 155(B) are referred to herein as "subsurface" LEDs 155(A) and 155(B) because, unlike conventional arrangements, the LEDs 155(A) and 155(B) are not disposed on the exterior surface 149 of the housing 140, but are instead positioned within the housing 140 (i.e., below / under the exterior surface of the housing).

[0036] like Figure 1B As shown in FIG, subsurface LEDs 155(A) and 155(B) are co-located with microphones 108(A) and 108(B), respectively. Microphones 108(A) and 108(B) are each micro-electromechanical systems (MEMS) microphones, and in this arrangement, LEDs 155(A) and 155(B) and microphones 108(A) and 108(B) are mounted on the same printed circuit board (PCB) (in FIG). Figure 1B not shown).

[0037] As noted above, because subsurface LEDs 155(A) and 155(B) are positioned within housing 140, the light emitted by them may not be directly visible from outside the housing, but may be visible only from a narrow angle and / or only from certain directions. Thus, LEDs 155(A) and 155(B) are optically coupled to exterior surface 149 via optical connectors 146(A) and 146(B), respectively. That is, optical connectors 146(A) and 146(B) are positioned between subsurface LEDs 155(A) and 155(B) and exterior surface 149 and provide a path for light from subsurface LEDs 155(A) and 155(B) to reach exterior surface 149.

[0038] In general, optical connectors according to the examples presented herein, such as optical connectors 146(A) and 146(B), are formed of a translucent (e.g., transparent) material and are optimized at their inner surfaces to collect light emitted by subsurface LEDs and transmit the light to the surface of the device housing. In some examples, the inner surface of the optical connector is placed in contact with the subsurface LEDs. Optical connectors according to the examples presented herein can also have a minimum length, a minimum angle (e.g., a straight shape), and / or a polished surface. In one example, the optical connector is formed of an optically transparent polymer, such as polycarbonate (PC) or acrylic (PMMA).

[0039] Further details of different example arrangements of subsurface indicator lights and optical connectors are provided below. More specifically, referring first to Figure 2 , shows a cross-sectional view of a portion of a sound processing unit 212 according to certain embodiments presented herein. The sound processing unit 212 includes a housing 240, which in this example is formed from two layers, a structural inner shell 241 and a decorative outer shell 243. It should be appreciated that the use of a two-layer housing is illustrative and other embodiments may include a single-layer housing.

[0040] The illustrated portions of the housing 240 (e.g., the inner housing 241 and the outer housing 243) include an acoustic port 242 that allows acoustic sound to enter the interior of the housing. The microphone 208 is positioned within the housing 240 adjacent to the acoustic port 242 to detect acoustic sound signals entering through the acoustic port. Figure 2 In the example of FIG, the microphone 208 is a MEMS microphone mounted on a printed circuit board (PCB) 252. The microphone 208 includes an acoustic inlet 254 aligned with the acoustic port 242, and an acoustic membrane 268.

[0041] In operation, an acoustic sound signal (sound wave) entering the sound inlet 254 causes movement (vibration) of the acoustic diaphragm 268 disposed in the microphone 208. The microphone 208 includes components configured to convert the movement of the acoustic diaphragm 268 into an electrical microphone signal representing the acoustic sound signal impinging on the acoustic diaphragm.

[0042] The microphone 208 is electrically connected to the electrical circuit and is configured to provide an electrical microphone signal to the electrical circuit. Figure 2 In the example of FIG, the electrical circuit is implemented on the PCB 252. The sound processing unit 212 may also include other components, which have been removed for ease of description. Figure 2 These components are omitted.

[0043] Figure 2Also shown is a subsurface indicator light (subsurface visual indicator) 255 co-located with the microphone 208. That is, the subsurface indicator light 255 is also mounted on the PCB 252 (i.e., both the subsurface indicator light 255 and the microphone 208 are mounted on the same PCB 252). Figure 2 In the arrangement shown, the subsurface indicator light 255 is mounted on a first surface 257 of the PCB, and the microphone 208 is mounted on a second surface 259 of the PCB. However, it should be appreciated that the embodiments presented herein may include other arrangements of the microphone 208 and the subsurface indicator light 255.

[0044] exist Figure 2 In the example of FIG, the subsurface indicator light 255 is a light emitting diode (LED), and is therefore sometimes referred to herein as a subsurface LED 255. The subsurface LED 255 can be a single color or a multi-color subsurface LED. Figure 2 The figures show examples including LEDs, but it will be appreciated that the embodiments presented herein may be implemented using other types of indicator lights.

[0045] As noted, subsurface LED 255 is located within housing 240 (i.e., below / under outer surface 249 of housing 243). As such, light emitted by subsurface LED 255 may not be directly visible from outside of housing 240, but may only be visible from a slight angle and / or may only be visible from certain directions. Thus, LED 255 is optically coupled to outer surface 249 of housing 243 via optical connector 246. That is, optical connector 246 is positioned between subsurface LED 255 and outer surface 249 and provides a path for light to pass from subsurface LED 255 to outer surface 249. In some embodiments, subsurface LED 255 is in direct contact with optical connector 246.

[0046] exist Figure 2 , the optical connector 246 is also a microphone sealing gasket (microphone gasket) associated with the microphone 208. The microphone gasket 246 provides mechanical support for the microphone 208, mechanically isolates the microphone from vibrations delivered to the housing 240 (e.g., dampens and / or absorbs vibrations), and creates an acoustic seal between the microphone and the housing (e.g., prevents sound signals from being transmitted between the microphone and the housing). The microphone gasket 246 can have, for example, a cylindrical shape that extends circumferentially around the inner surface of the acoustic port 242 (i.e., the gasket is arranged along the inner surface of the acoustic port). In addition, the microphone gasket 246 is formed of a resilient, flexible material (e.g., silicone, rubber, etc.), and as Figure 2, it is attached to the inner shell 241 of the housing 240 and the PCB 252. In some examples, the microphone pad 246 can be overmolded onto the housing 240, attached to the housing via an adhesive, etc. Similar or other mechanisms can be used to attach the microphone pad 246 to the PCB 252.

[0047] In this example, the microphone gasket 246 defines a cylindrical cavity 260 that is aligned with the acoustic port 242. A filter cartridge 264 is disposed in the cavity 260. The filter cartridge 264 covers the sound inlet 254 of the microphone 208 and prevents dirt, dust, and other debris from entering the sound inlet. The filter cartridge 264 is sometimes referred to herein as being acoustically transparent (e.g., permeable to sound waves / sound energy without changing the frequency response). In some embodiments, the microphone gasket 246 is configured to compress the filter cartridge 264 to hold the filter cartridge in the cylindrical cavity 260 (e.g., a press fit). In other embodiments, the filter cartridge 264 can be attached directly to the housing 243. It should also be appreciated that the microphone gasket 246, the filter cartridge 264, or both can be flexible to form a press fit or form fit.

[0048] exist Figure 2 252. Microphone pad 246 is also shown attached to first surface 257 of PCB 252. Microphone 208 is directly mechanically coupled to (e.g., directly attached to) second surface 259 of PCB 252. In some embodiments, microphone 208 can be soldered to PCB 252 (with a hole / opening 261 in the PCB allowing an acoustic path through the PCB to the microphone's sound inlet 254).

[0049] As noted above, in addition to holding the filter cartridge 264, the microphone gasket 246 also serves as an optical connector for the light emitted by the subsurface LED 255. In other words, the microphone gasket 246 is a translucent element that will illuminate in response to illumination of the subsurface LED 255 and / or transmit light emitted by the subsurface LED 255 to the exterior surface 249 of the housing. Thus, the optical properties of the microphone gasket 246 ensure that the light emitted by the subsurface LED 255 will be visible on the exterior of the housing 240 via the acoustic port 242. In other words, the LED 255 is optically coupled to the acoustic port via the microphone gasket 246.

[0050] The cylindrical microphone pad has been described. Figure 2However, it should be appreciated that the microphone pad may alternatively have any of a variety of other shapes (e.g., oval, square, etc.). The microphone pad 246 may also have any of a variety of different colors or configurations to enable light from the subsurface LEDs 255 to reach the outer surface 249 of the housing 243 (e.g., a dye or color of the pad may cause it to light up a certain color).

[0051] Additionally, in alternative embodiments, microphone pad 246 may be replaced by a microphone mount formed of a rigid or semi-rigid material. In such embodiments, the microphone mount, while similar in shape to the microphone pad, may be used to hold microphone 208 in a desired position but may provide little or no vibration isolation.

[0052] In other embodiments, the microphone pad 246 can be formed from a combination of resiliently flexible and rigid materials. For example, the microphone pad 246 can be primarily formed from a resiliently flexible material but also include a rigid light guide embedded therein to transmit light from the LED 255 to the outer surface 249 of the housing 240.

[0053] The present invention has also been described with reference to a single subsurface LED 255 positioned adjacent to the microphone pad 246. Figure 2 It should be appreciated that in other embodiments, multiple LEDs may be positioned adjacent to the microphone pad 246 .

[0054] In short, Figure 2 The figure shows an embodiment in which a microphone pad is disposed between a subsurface LED and an outer surface of the housing. The microphone pad, in addition to being formed of a substantially flexible material (configured to mechanically isolate the microphone from vibrations delivered to the housing and to create an acoustic seal between the microphone and the housing), also has associated optical properties to provide a path for light emitted from the subsurface LED to reach the outer surface of the housing (i.e., the LED is optically coupled to the acoustic port via the microphone pad such that light emitted from at least one indicator light is visible on the exterior of the housing via the acoustic port). Additionally, the MEMS microphone is co-located with the LED (i.e., the MEMS microphone and LED(s) are mounted on the same PCB). Furthermore, Figure 2 The figure shows an arrangement in which the subsurface LED forms part of the sound channel (ie is arranged in an acoustic port that is in the path of the incoming sound signal).

[0055] Next reference Figure 3, shows a cross-sectional view of a portion of a sound processing unit 312 according to certain embodiments presented herein. The sound processing unit 312 includes a housing 340, which in this example is formed from two layers, a structural inner shell 341 and a decorative outer shell 343. It should be appreciated that the use of a two-layer housing is illustrative and other embodiments may include a single-layer housing.

[0056] The illustrated portions of the housing 340 (e.g., the inner housing 341 and the outer housing 343) include an acoustic port 342 that allows acoustic sound to enter the interior of the housing. The microphone 308 is positioned within the housing 340 and adjacent to the acoustic port 342 to detect acoustic sound signals entering through the acoustic port. Figure 3 In the example of FIG, the microphone 308 is a MEMS microphone mounted on a printed circuit board (PCB) 352. The microphone 308 includes an acoustic inlet 354 aligned with the acoustic port 342, and an acoustic membrane 368.

[0057] In operation, an acoustic sound signal (sound wave) entering the sound inlet 354 causes movement (vibration) of an acoustic diaphragm 368 disposed in the microphone 308. The microphone 308 includes components configured to convert the movement of the acoustic diaphragm 368 into an electrical microphone signal representative of the acoustic sound signal impinging on the acoustic diaphragm.

[0058] Microphone 308 is electrically connected to the electrical circuit and is configured to provide an electrical microphone signal to the electrical circuit. Figure 3 In the example of FIG, the electrical circuit is implemented on the PCB 352. The sound processing unit 312 may also include other components, which have been removed for ease of description. Figure 3 These components are omitted.

[0059] Figure 3 Also shown is a subsurface indicator light 355 co-located with the microphone 308. Figure 3 , the subsurface indicator light 355 is a single-color or multi-color subsurface LED co-located with the microphone 308 on the PCB 352 (i.e., the LED 355 and the microphone 308 are both mounted on the same PCB 352). In particular, the subsurface LED 355 is mounted on a first surface 357 of the PCB, while the microphone 308 is mounted on a second surface 359 of the PCB. However, it should be appreciated that the embodiments presented herein may include other arrangements of the microphone 308 and the subsurface LED 355. Furthermore, although Figure 3 The figures illustrate examples that include subsurface LEDs, but it will be appreciated that the embodiments presented herein may be implemented with other types of indicator lights.

[0060] As noted, subsurface LED 355 is located within housing 340 (i.e., below / under outer surface 349 of housing 343). As such, light emitted by subsurface LED 355 may not be directly visible from outside of housing 340, but may only be visible from a slight angle and / or may only be visible from certain directions. Thus, LED 355 is optically coupled to outer surface 349 of housing 343 via optical connector 346. That is, optical connector 346 is positioned between subsurface LED 355 and outer surface 349 and provides a path for light to travel from subsurface LED 355 to outer surface 349. In some embodiments, subsurface LED 355 is in direct contact with optical connector 346.

[0061] exist Figure 3 , the optical connector 346 is also a microphone pad associated with the microphone 308. The microphone pad 346 provides mechanical support for the microphone 308, mechanically isolates the microphone from vibrations delivered to the housing 340, and creates an acoustic seal between the microphone and the housing. The microphone pad 346 can have, for example, a cylindrical shape that defines a cylindrical interior cavity 360 that is aligned with the acoustic port 342. In addition, the microphone pad 346 is formed of a resiliently flexible material (e.g., silicone, rubber, etc.) and is as shown in FIG. Figure 3 , it is attached to the inner shell 341 of the housing 340. In some examples, the microphone pad 346 can be overmolded onto the housing 340.

[0062] like Figure 3 , a membrane 348 is disposed between the interior cavity 360 of the microphone pad 346 and the acoustic port 342. The membrane 348 is sometimes referred to herein as being acoustically transparent (e.g., permeable to sound waves / energy without altering the frequency response) and contamination resistant (e.g., impermeable to water, dust, and other contaminants).

[0063] The membrane 348 is connected to the microphone pad 346 to form an acoustic cavity with the internal cavity 360 of the microphone pad. Figure 3 In the example shown, the membrane 348 is integral / monolithic with the microphone cushion 346 (e.g., the microphone cushion and the membrane are formed as a single component). However, it should be appreciated that in alternative embodiments, the membrane 348 and the microphone cushion 346 can be separate elements that are joined / connected together via, for example, an adhesive, ultrasonic welding, etc.

[0064] exist Figure 3Also shown is a microphone plug 350, which includes a first end 362, a second end 363, and a through hole 351. The through hole 351 extends from the first end 362 to the second end 363. In addition, the first end 362 is directly mechanically coupled to (e.g., directly attached to) the first surface 357 of the PCB 352 (adjacent to the subsurface LED 355). As noted above, the microphone 308 is directly mechanically coupled to (e.g., directly attached to) the second surface 359 of the PCB 352. In other words, Figure 3 In FIG, the microphone plug 350 is indirectly coupled to the microphone 308 via the PCB 352 such that the PCB 352 is located between the microphone plug 350 and the sound inlet 354 .

[0065] In some embodiments, microphone 308 can be soldered to PCB 352 (with a hole / opening 361 in the PCB allowing an acoustic path through the PCB to the microphone's sound inlet 354). Barrel plug 350 can be, for example, soldered, glued, soldered and glued, etc., to PCB 352. Microphone plug 350 and microphone 308 can then be inserted into microphone pad 346.

[0066] In some examples, the microphone plug 350 is formed from a relatively more rigid material than the resiliently flexible material of the microphone cushion 346. Additionally, the inner dimension (e.g., inner diameter) between the sidewalls of the interior cavity 360 is smaller than the outer dimension (e.g., outer diameter) of the microphone plug 350. Thus, when the microphone plug 350 is inserted into the interior cavity 360 of the microphone cushion 346, the microphone plug 360 is configured to compress the sidewalls of the microphone cushion (i.e., the walls surrounding / defining the sides of the interior cavity 360). In some embodiments, the compression of the sidewalls is sufficient to retain the microphone plug 350 within the microphone cushion 346. However, in other embodiments, the sidewalls of the cavity 360 and the microphone plug 360 may include corresponding interlocking features configured to releasably lock the microphone plug within the microphone cushion.

[0067] As noted above, in addition to holding the microphone plug 350 (and the attached microphone 308), the microphone pad 346 also serves as an optical connector for the light emitted by the subsurface LED 355. In other words, the microphone pad 346 is a translucent element that will illuminate in response to illumination of the subsurface LED 355 and / or transmit light emitted by the subsurface LED 355 to the exterior surface 349 of the housing. Thus, the optical properties of the microphone pad 346 ensure that the light emitted by the subsurface LED 355 will be visible outside the housing 340 via the acoustic port 342. In other words, the LED 355 is optically coupled to the acoustic port via the microphone pad 346.

[0068] The cylindrical microphone pad has been described. Figure 3 However, it should be appreciated that the microphone pad may alternatively have any of a variety of other shapes (e.g., oval, square, etc.). The microphone pad 346 may also have any of a variety of different colors or configurations to enable light from the subsurface LEDs 355 to reach the outer surface 349 of the housing 343 (e.g., a dye or color of the pad may cause it to light up a certain color).

[0069] Additionally, in alternative embodiments, microphone pad 346 may be replaced by a microphone mount formed of a rigid or semi-rigid material. In such embodiments, the microphone mount, while similar in shape to the microphone pad, may be used to hold microphone 308 in a desired position but may provide little or no vibration isolation.

[0070] In other embodiments, the microphone pad 346 can be formed from a combination of resiliently flexible and rigid materials. For example, the microphone pad 346 can be primarily formed from a resiliently flexible material but also include a rigid light guide embedded therein to transmit light from the LED 355 to the outer surface 349 of the housing 340.

[0071] In short, Figure 3 The figure shows an embodiment in which a microphone pad is disposed between a subsurface LED and an outer surface of the housing. In addition to being formed of a substantially flexible material (configured to mechanically isolate the microphone from vibrations delivered to the housing and create an acoustic seal between the microphone and the housing), the microphone pad has associated optical properties to provide a path for light emitted from the subsurface LED to reach the outer surface of the housing (i.e., the LED is optically coupled to the acoustic port via the microphone pad such that light emitted from at least one indicator light is visible on the exterior of the housing via the acoustic port). Additionally, the MEMS microphone is co-located with the LED (i.e., the MEMS microphone and LED(s) are mounted on the same PCB). Furthermore, Figure 3 The figure shows an arrangement in which the subsurface LED forms part of the sound channel (ie is arranged in an acoustic port provided in the path of the incoming sound signal).

[0072] Figure 4 4 shows a cross-sectional view of a portion of a sound processing unit 412 according to some embodiments presented herein. The sound processing unit 412 includes a housing 440 including an outer surface 449 and an acoustic port 442. The acoustic port 442 allows acoustic sound to enter the interior of the housing 440. Figure 4, membrane 448 is attached (e.g., via an adhesive) to outer surface 449 of housing 440 and seals acoustic port 442. Membrane 448 is sometimes referred to herein as being acoustically transparent (e.g., permeable to sound waves / energy without altering the frequency response) and contamination-resistant (e.g., impermeable to water, dust, and other contaminants).

[0073] The microphone 408 is positioned within the housing 440 adjacent to the acoustic port 442 to detect acoustic sound signals entering through the acoustic port. Figure 4 In the example of FIG4 , the microphone 408 is a MEMS microphone mounted on a printed circuit board (PCB) 452 . The microphone 408 includes an acoustic inlet 454 aligned with the acoustic port 442 , and an acoustic membrane 468 .

[0074] In operation, an acoustic sound signal (sound wave) entering the sound inlet 454 causes movement (vibration) of the acoustic membrane 468 disposed in the microphone 408. The microphone 408 includes components configured to convert the movement of the acoustic membrane 468 into an electrical microphone signal representing the acoustic sound signal impinging on the acoustic membrane. The microphone 408 is electrically connected to an electrical circuit and configured to provide the electrical microphone signal to the electrical circuit. Figure 4 In the example of FIG, the electrical circuit is implemented on the PCB 452. The sound processing unit 412 may also include other components, which have been removed for ease of description. Figure 4 These components are omitted.

[0075] Figure 4 Also shown is a subsurface indicator light 455 co-located with the microphone 408. Figure 4 , the subsurface indicator light 455 is a single-color or multi-color subsurface LED that is also co-located with the MEMS microphone 408 on the PCB 452 (i.e., the LED 455 and the microphone 408 are both mounted on the same PCB 452). In particular, the subsurface LED 455 is mounted on a first surface 457 of the PCB, while the microphone 408 is mounted on a second surface 459 of the PCB. However, it should be appreciated that the embodiments presented herein may include other arrangements of the microphone 408 and the subsurface LED 455. Although Figure 4 The figures show examples including LEDs, but it will be appreciated that the embodiments presented herein may be implemented with other types of indicator lights.

[0076] As noted, the subsurface LED 455 is located within the housing 440 (i.e., below / under the exterior surface 449). As such, light emitted by the subsurface LED 455 may not be directly visible from outside the housing 440, but may only be visible from a slight angle and / or may only be visible from certain directions. However, in this example, the LED 455 is located within the acoustic port 442 and is optically coupled to the exterior surface 449 via the membrane 448. That is, the membrane 448 has optical properties such that it can serve as an optical connector for light from the subsurface LED 455 (i.e., transmits light from the subsurface LED 455 to the exterior surface 449). In some embodiments, the subsurface LED 455 is in direct contact with the membrane 448, or as Figure 4 As shown in FIG, a second optical connector (eg, light guide) 470 optically couples the LED 455 to the film 448. The film 448 is translucent (eg, transparent).

[0077] exist Figure 4 Also shown is a microphone pad 446, which provides mechanical support for the microphone 408 and creates an acoustic seal between the microphone and the housing 440. In some embodiments, the microphone pad 446 is formed of a flexible material (e.g., silicone, rubber, etc.) and also mechanically isolates the microphone from vibrations delivered to the housing 440.

[0078] The microphone gasket 446 can have, for example, a cylindrical shape that extends circumferentially around the lower edge of the acoustic port 442. Additionally, the microphone gasket 446 is attached to the PCB 452 and the inner surface of the housing 440. In some examples, the microphone gasket 446 can be overmolded onto the housing 440, attached to the housing via an adhesive, or the like. Similar or other mechanisms can be used to attach the microphone gasket 446 to the PCB 452. In some embodiments, the microphone gasket 446 is a sealing compound or a flexible adhesive.

[0079] In short, Figure 4 The figure shows an embodiment in which a subsurface LED is positioned in an acoustic port of a device housing (i.e., is part of the sound channel). The sealing membrane covering the acoustic port has optical properties such that light emitted by the subsurface LED is visible outside the housing. In other words, the sealing membrane and the optional optical assembly that optically couples the subsurface LED to the membrane provide a path for light emitted from the subsurface LED to reach the outer surface of the housing.

[0080] exist Figure 5A 5. A cross-sectional view of a portion of a sound processing unit 512 according to some embodiments presented herein is shown in FIG. The sound processing unit 512 includes a housing 540 including an outer surface 549 and an acoustic port 542. The acoustic port 542 allows acoustic sound to enter the interior of the housing 540. Figure 5A , membrane 548 is attached (e.g., via an adhesive) to outer surface 549 of housing 540 and seals acoustic port 542. Membrane 548 is sometimes referred to herein as being acoustically transparent (e.g., permeable to sound waves / acoustic energy without altering the frequency response) and contamination-resistant (e.g., impermeable to water, dust, and other contaminants).

[0081] The microphone 508 is positioned in the housing 540 to align with the acoustic port 542 to detect acoustic sound signals entering through the acoustic port. Figure 5A In the example of , microphone 508 is a MEMS microphone mounted on a printed circuit board (PCB) 552. Similar to the microphones described elsewhere herein, microphone 508 is configured to convert an acoustic sound signal entering acoustic port 542 into an electrical microphone signal representative of the acoustic sound signal. Microphone 508 is electrically connected to an electrical circuit and configured to provide the electrical microphone signal to the electrical circuit. Figure 5A In the example of FIG, the electrical circuit is implemented on the PCB 552. The sound processing unit 512 may also include other components, which have been removed for ease of description. Figure 5A These components are omitted.

[0082] Figure 5A The sound processing unit 512 is also shown to include a subsurface indicator light 555. The subsurface indicator light 555 is a single-color or multi-color subsurface LED that is co-located with the microphone 508 on the same PCB 552 (i.e., the LED 555 and the microphone 508 are both mounted on the same PCB 552). In particular, the subsurface LED 555 is mounted on a first surface 557 of the PCB, while the microphone 508 is mounted on a second surface 559 of the PCB. However, it should be appreciated that the embodiments presented herein may include other arrangements of the microphone 508 and the subsurface LED 555. Although Figure 5A The figures show examples including LEDs, but it will be appreciated that the embodiments presented herein may be implemented with other types of indicator lights.

[0083] As noted, the subsurface LED 555 is located within the housing 540 (i.e., below / under the exterior surface 549). As such, light emitted by the subsurface LED 555 may not be directly visible from outside the housing 540, but may only be visible from a slight angle and / or may only be visible from certain directions. However, in this example, the LED 555 is optically coupled to the exterior surface 549 via the optical connector 570. That is, the optical connector 570 provides a path for light to travel from the subsurface LED 555 to the exterior surface 549. In some embodiments, the subsurface LED 555 is in direct contact with the optical connector 570. In this example, the optical connector 570 is disposed in an illumination port 573 of the housing 540.

[0084] exist Figure 5A Also shown is a microphone pad 546, which provides mechanical support for the microphone 508 and creates an acoustic seal between the microphone and the housing 540. In some embodiments, the microphone pad 546 is formed of a flexible material (e.g., silicone, rubber, etc.) and also mechanically isolates the microphone from vibrations delivered to the housing 540.

[0085] The microphone gasket 546 can have, for example, a cylindrical shape that extends circumferentially around the lower edge of the acoustic port 542. Additionally, the microphone gasket 546 is attached to the PCB 552 and the inner surface of the housing 540. In some examples, the microphone gasket 546 can be overmolded onto the housing 540, attached to the housing via an adhesive, or the like. Similar or other mechanisms can be used to attach the microphone gasket 546 to the PCB 552. In some embodiments, the microphone gasket 546 is a sealing compound or a flexible adhesive.

[0086] In short, Figure 5A The figure shows an embodiment in which a subsurface LED is co-located on the same PCB as a MEMS microphone. As a result, the acoustic port and the illumination port in the housing are positioned adjacent to each other. In addition, an optical connector optically couples the subsurface LED to the exterior surface of the housing, making light emitted by the subsurface LED visible outside the housing via the illumination port.

[0087] Figure 5B yes Figure 5A A top view of a larger portion of the sound processing unit 512. More specifically, Figure 5B The figure shows that the optical connector 570 is positioned adjacent to the first microphone membrane 548 (associated with the first microphone), the button 571 and the second microphone membrane 548 (associated with the second microphone). Figure 5B Embodiments of the invention may be applied to one or more of the microphones of a sound processing unit or other device, allowing the indicator light to be placed directly next to the acoustic opening of the microphone(s).

[0088] Figure 6A and Figure 6B The figure shows an arrangement for another device, such as a sound processing unit, according to the embodiments presented herein. More specifically, Figure 6A is a cross-sectional view of a portion of the sound processing unit 612, and Figure 6B is a top view of the same portion of the sound processing unit 612.

[0089] The sound processing unit 612 includes a housing 640 including an outer surface 649 and an acoustic port 642. The acoustic port 642 allows acoustic sound to enter the interior of the housing 640. The microphone 608 is positioned within the housing 640 in alignment with the acoustic port 642 so as to detect acoustic sound signals entering through the acoustic port. In the example of Figure 6, the microphone 608 is a MEMS microphone mounted on a printed circuit board (PCB) 652. Similar to the microphones described elsewhere herein, the microphone 608 is configured to convert the acoustic sound signal entering the acoustic port 642 into an electrical microphone signal representing the acoustic sound signal. The microphone 608 is electrically connected to the electrical circuit and is configured to provide the electrical microphone signal to the electrical circuit. Figure 6A and Figure 6B In the example of FIG6 , the electrical circuit is implemented on the PCB 652. The sound processing unit 612 may also include other components, which have been omitted for ease of illustration.

[0090] like Figure 6A and Figure 6B As shown in FIG, a microphone protector 675 (e.g., a filter cartridge, a membrane, etc.) is disposed between the outer surface 649 of the housing 640 and the microphone 608. The microphone protector 675 is acoustically transparent and protects the microphone 608 from the ingress of dirt, dust, and / or other debris.

[0091] Figure 6A and Figure 6B The figure shows that the sound processing unit 612 includes a subsurface indicator light 655. The subsurface indicator light 655 is a single-color or multi-color subsurface LED that is co-located with the microphone 608 on the PCB 652 (i.e., the LED 655 and the microphone 608 are both mounted on the same PCB 652). In particular, the subsurface LED 655 is mounted on a first surface 657 of the PCB, while the microphone 608 is mounted on a second surface 659 of the PCB. However, it should be appreciated that the embodiments presented herein may include other arrangements of the microphone 608 and the subsurface LED 655. Although Figure 6A and Figure 6B The figures show examples including LEDs, but it will be appreciated that the embodiments presented herein may be implemented with other types of indicator lights.

[0092] As noted, the subsurface LED 655 is located within the housing 640 (i.e., below / under the exterior surface 649). As such, light emitted by the subsurface LED 655 may not be directly visible from outside the housing 640, but may only be visible from a slight angle and / or may only be visible from certain directions. However, in this example, the LED 655 is located within the acoustic port 642 and is optically coupled to the exterior surface 649 via the microphone pad 646. That is, the microphone pad 646 is similar to the arrangement described above and is formed of a translucent (e.g., transparent) material that provides a path for light to travel from the subsurface LED 655 to the exterior surface 649. In some embodiments, the subsurface LED 655 is in direct contact with the microphone pad 646. Figure 6A Also shown in FIG65 is a secondary microphone pad 647 disposed between the PCB and pad 646. In an alternative embodiment, the secondary microphone pad 647 may be omitted, and the microphone pad 646 may be in direct contact with the PCB 652.

[0093] exist Figure 6A and Figure 6B In the example shown, microphone pad 646 is positioned within optical port 642 and defines cavity 660 within which microphone guard 675 is positioned. In some embodiments, microphone guard 675 can be integral with or attached to optical microphone pad 646. Alternatively, microphone guard 675 can be configured for an interference fit or friction fit with microphone pad 646. For example, microphone pad 646 can be configured (e.g., sized, dimensioned, etc.) to exert a compressive force on microphone guard 675 when positioned within cavity 660. Microphone pad 646 can be attached to PCB 652 (e.g., using an adhesive) and provide mechanical support for microphone 608 and create an acoustic seal between the microphone and housing 640. In some embodiments, microphone pad 646 is formed from a flexible material (e.g., silicone, rubber, etc.) and also mechanically isolates the microphone from vibrations delivered to housing 640.

[0094] In short, Figure 6A and Figure 6B The figure shows an embodiment in which a subsurface LED is co-located with a MEMS microphone on the same PCB. In addition, the subsurface LED is located within the acoustic port, and an optical housing insert (optical connector) optically couples the subsurface LED to the exterior surface of the housing so that light emitted by the subsurface LED is visible outside the housing. Figure 2 In contrast, Figure 6A and Figure 6BIn the embodiment, the LED is located opposite the microphone pad, and Figure 2 This is not the case with LEDs.

[0095] As detailed above, this document presents an arrangement for a device such as a sound processing unit that utilizes subsurface indicator lights. The arrangement presented herein is achieved at least in part through the use of MEMS microphone technology, and the arrangement presented herein is not particularly feasible when using conventional microphones. MEMS microphones employ a more advantageous architecture that allows the associated PCB to be positioned closer to the external surface of the sound processing unit. Therefore, the arrangement presented herein takes advantage of this and mounts the indicator light(s) on the same PCB as the MEMS microphones. This is in contrast to conventional arrangements in which the indicator light(s) are mounted on their own PCB.

[0096] However, despite being closer to the surface than conventional microphone arrangements, the PCB for the MEMS microphone remains below the surface of the device housing. As a result, the indicator light(s) mounted on the same PCB as the MEMS microphone are also below the surface of the housing. In other words, by mounting the indicator lights on the same PCB as the MEMS microphone, the arrangement presented herein deviates from the conventional requirement that the indicator lights must be located at the surface of the housing. The arrangement presented herein addresses this issue by optically coupling the subsurface indicator light(s) to the surface of the housing using an optical connector, thereby enabling the indicator light(s) to be visible from the exterior of the housing and thereby providing their illumination function.

[0097] As noted above, while the techniques presented herein are primarily described with reference to MEMS microphones, it should be appreciated that the techniques presented herein may also be implemented using any other suitable microphone technology now known or later developed having similar characteristics to those used to implement MEMS microphones. For example, the techniques presented herein may be implemented using architectures that allow the associated PCB to be positioned closer to the exterior surface of the housing, architectures in which the microphone is specifically designed to be rigidly mounted on a rigid PCB, and the like.

[0098] It should be appreciated that the embodiments presented herein are not mutually exclusive and that various embodiments can be combined with another embodiment in any of a variety of different ways.

[0099] The invention described and claimed herein is not limited in scope by the specific preferred embodiments disclosed herein, as these embodiments are intended to illustrate, rather than limit, several aspects of the present invention. Any equivalent embodiments are intended to fall within the scope of the present invention. In fact, in addition to those shown and described herein, various modifications of the present invention will become apparent to those skilled in the art based on the foregoing description. Such modifications are also intended to fall within the scope of the appended claims.

Claims

1. A device comprising: a housing comprising at least one acoustic port; a microphone positioned within the housing in alignment with the acoustic port; at least one optical connector positioned within the acoustic port; as well as At least one indicator light is separate from the microphone and positioned within the housing, wherein the at least one indicator light is optically coupled to the acoustic port via the optical connector so that light emitted from the at least one indicator light is visible outside the housing via the acoustic port. 2 . The apparatus of claim 1 , wherein the at least one optical connector is a microphone gasket configured to mount the microphone to the housing and create an acoustic seal between the microphone and the housing.

3. The apparatus of claim 2, wherein the microphone pad is formed of a substantially flexible material and is configured to mechanically isolate the microphone from vibrations delivered to the housing.

4. The apparatus of claim 2, wherein the microphone pad is formed of a substantially flexible material and includes one or more translucent rigid members extending therethrough to transmit light emitted by the at least one indicator light to the acoustic port. 5 . The device of claim 1 , wherein the at least one optical connector comprises a microphone membrane configured to be attached to an outer surface of the housing.

6. The device of claim 5, wherein the at least one optical connector comprises the microphone membrane and a second optical connector, the second optical connector optically coupling the at least one indicator light to the microphone membrane.

7. The apparatus of claim 1, wherein the at least one optical connector further comprises an optical housing insert disposed in the acoustic port, wherein the optical housing insert includes a cavity to retain a microphone protector therein.

8. The device of claim 1, wherein the microphone is a micro-electromechanical system (MEMS) microphone electrically mounted on a printed circuit board (PCB) within the housing, and wherein the at least one indicator light is also electrically mounted on the PCB.

9. The apparatus of claim 8, wherein the MEMS microphone is mounted on a first surface of the PCB and the at least one indicator light is mounted on a second surface of the PCB, wherein The first surface of the PCB and the second surface of the PCB are located on opposite sides of the PCB.

10. The device of claim 8, wherein the at least one indicator light comprises one or more light emitting diodes (LEDs).

11. The device of claim 10, wherein the one or more LEDs include at least one multi-color LED.

12. The device of claim 1, wherein the device is an external component of a hearing prosthesis and the housing is shaped as a behind-the-ear (BTE) unit configured to be worn on an ear of a recipient of the hearing prosthesis.

13. An apparatus comprising: a housing comprising at least one acoustic port, an outer surface, and an inner surface; a printed circuit board (PCB) positioned within the housing adjacent to the acoustic port; a micro-electromechanical system (MEMS) microphone mounted on the PCB in alignment with the acoustic port; at least one indicator light separate from the MEMS microphone and mounted on the PCB below the inner surface of the housing; as well as At least one optical connector optically couples the at least one indicator light to the exterior surface of the housing.

14. The apparatus of claim 13 , wherein the at least one indicator light is mounted on the PCB in proximity to the acoustic port and is optically coupled to the acoustic port via the optical connector so that light emitted from the at least one indicator light is visible at the outer surface of the housing via the acoustic port. 15 . The apparatus of claim 14 , wherein the at least one optical connector is a microphone gasket configured to mount the MEMS microphone to the housing and create an acoustic seal between the MEMS microphone and the housing.

16. The apparatus of claim 15, wherein the microphone pad is formed of a substantially flexible material and is configured to mechanically isolate the MEMS microphone from vibrations delivered to the housing.

17. The apparatus of claim 14, wherein the at least one optical connector comprises a microphone membrane configured to be attached to the outer surface of the housing.

18. The device of claim 17, wherein the at least one optical connector comprises the microphone membrane and a second optical connector optically coupling the at least one indicator light to the microphone membrane.

19. The apparatus of claim 14, wherein the at least one optical connector further comprises an optical housing insert disposed in the acoustic port, wherein the optical housing insert includes a cavity to retain a microphone protector therein.

20. The device of claim 13, wherein the at least one optical connector optically couples the at least one indicator light to the exterior surface of the housing via an optical port, the optical port being separate from the acoustic port.

21. An apparatus comprising: a housing comprising at least one acoustic port; a microphone positioned within the housing; as well as at least one light source separate from the microphone and positioned within the housing, wherein light emitted from the at least one light source is observable externally of the housing via at least one translucent member located at the at least one acoustic port, and: (i) wherein the at least one translucent member is disposed in the at least one acoustic port, and wherein the at least one translucent member is a microphone cushion configured to mount the microphone to the housing and create an acoustic seal between the microphone and the housing; or (ii) the at least one translucent member is disposed in the at least one acoustic port, and wherein the at least one translucent member comprises a microphone membrane configured to be attached to an exterior surface of the housing; or (iii) wherein the at least one translucent member comprises an optical insert disposed in the at least one acoustic port, wherein the optical housing insert comprises a cavity to retain the microphone protector therein; or (iv) wherein the microphone is a micro-electromechanical system (MEMS) microphone electrically mounted on a printed circuit board (PCB) within the housing, and wherein the at least one light source is also electrically mounted on the PCB.

22. The apparatus of claim 21, wherein the microphone pad is formed of a substantially flexible material and is configured to mechanically isolate the microphone from vibrations delivered to the housing.

23. The apparatus of claim 21, wherein the microphone pad is formed of a substantially flexible material and includes one or more translucent rigid members extending therethrough to transmit light emitted by the at least one light source to the at least one acoustic port.

24. The device of claim 21, wherein the at least one translucent member comprises the microphone membrane and an optical connector optically coupling the at least one light source to the microphone membrane.

25. The apparatus of claim 21, wherein the MEMS microphone is mounted on a first surface of the PCB and the at least one light source is mounted on a second surface of the PCB, and wherein the first surface of the PCB and the second surface of the PCB are on opposite sides of the PCB.

26. The device of claim 21, wherein the at least one light source comprises one or more light emitting diodes (LEDs).

27. The device of claim 21, wherein the at least one light source comprises an indicator light.

28. The device of claim 21, wherein the at least one translucent member optically couples the at least one light source to the exterior surface of the housing via an optical port, the optical port being separate from the at least one acoustic port.

29. An apparatus comprising: a housing comprising at least one acoustic port, an outer surface, and an inner surface; a printed circuit board (PCB) positioned within the housing adjacent to the at least one acoustic port; A micro-electromechanical system (MEMS) microphone is disposed in the housing; as well as at least one light source, separate from the MEMS microphone and mounted on the PCB below the inner surface of the housing, wherein an optical signal emitted by the at least one light source is observable at the outer surface of the housing via at least one translucent member disposed at the at least one acoustic port, and: (i) wherein the at least one translucent member is a microphone gasket configured to mount the MEMS microphone to the housing and create an acoustic seal between the MEMS microphone and the housing; or (ii) wherein the at least one translucent member comprises a microphone membrane configured to be attached to the outer surface of the housing; or (iii) wherein the at least one translucent member further comprises an optical housing insert disposed within the at least one acoustic port, wherein the optical housing insert comprises a cavity to retain the microphone protector therein.

30. The apparatus of claim 29, wherein the microphone pad is formed of a substantially flexible material and is configured to mechanically isolate the MEMS microphone from vibrations delivered to the housing.

31. The device of claim 29, wherein the at least one translucent member comprises the microphone membrane, and wherein an optical connector optically couples the at least one light source to the microphone membrane.

32. The device of claim 29, wherein the at least one light source comprises an indicator light.

33. The device of claim 29, wherein the at least one light source comprises one or more light emitting diodes (LEDs).

34. An apparatus comprising: a housing comprising at least one acoustic port; a microphone, positioned in the housing; as well as at least one light source separate from the microphone and positioned within the housing, wherein light emitted from the at least one light source is observable externally of the housing via at least one translucent member located at the at least one acoustic port; wherein the microphone is a micro-electromechanical system (MEMS) microphone, the MEMS microphone being electrically mounted on a printed circuit board (PCB) within the housing, and wherein the at least one light source is also electrically mounted on the PCB, The MEMS microphone is mounted on a first surface of the PCB, and the at least one light source is mounted on a second surface of the PCB, and the first surface of the PCB and the second surface of the PCB are located on opposite sides of the PCB.

35. The device of claim 34, wherein the at least one translucent member is disposed in the at least one acoustic port.

36. The apparatus of claim 35, wherein the at least one translucent member is a microphone pad configured to mount the microphone to the housing and create an acoustic seal between the microphone and the housing.

37. The apparatus of claim 35, wherein the at least one translucent member comprises a microphone membrane configured to be attached to an outer surface of the housing.

38. The device of claim 34, wherein the at least one translucent member comprises an optical housing insert disposed in the acoustic port, wherein the optical housing insert includes a cavity to retain a microphone protector therein.

39. The device of claim 34, wherein the at least one light source comprises one or more light emitting diodes (LEDs).

40. The device of claim 34, wherein the at least one light source comprises an indicator light.

41. An apparatus comprising: a housing comprising at least one acoustic port; a functional element positioned within the housing; at least one light source, separate from the functional element and positioned within the housing; as well as at least one translucent member disposed in the at least one port so that light emitted from the at least one light source can be observed outside the housing via the at least one translucent member located at the at least one port, and: (i) wherein the at least one translucent member is a gasket configured to mount the functional element to the housing and create a seal between the functional element and the housing; or (ii) wherein the at least one translucent member comprises a functional element film, the functional element film being configured to be attached to an outer surface of the housing; or (iii) wherein the at least one translucent member comprises an optical insert disposed in the at least one port, wherein the optical housing insert comprises a cavity to retain the functional element protector therein; or (iv) wherein the functional element is a micro-electromechanical system (MEMS) microphone, the MEMS microphone being electrically mounted on a printed circuit board (PCB) within the housing, and wherein the at least one light source is also electrically mounted on the PCB.

42. The apparatus of claim 41, wherein the pad is formed of a substantially flexible material and is configured to mechanically isolate the functional element from vibrations delivered to the housing.

43. The device of claim 41, wherein the liner is formed of a substantially flexible material and includes one or more translucent rigid members extending therethrough to transmit light emitted by the at least one light source to the at least one port.

44. The device of claim 41, wherein the at least one translucent member comprises the functional element film and an optical connector optically coupling the at least one light source to the functional element film.

45. The apparatus of claim 41, wherein the MEMS microphone is mounted on a first surface of the PCB and the at least one light source is mounted on a second surface of the PCB, and the first and second surfaces of the PCB are on opposite sides of the PCB.

46. ​​The device of claim 41, wherein the at least one light source comprises one or more light emitting diodes (LEDs).

47. The device of claim 41, wherein the at least one light source comprises an indicator light.

48. The device of claim 41, wherein the at least one translucent member optically couples the at least one light source to the exterior surface of the housing via an optical port separate from the at least one port.

49. An apparatus comprising: a housing comprising at least one port, an outer surface, and an inner surface; a printed circuit board (PCB) positioned within the housing adjacent to the at least one port; a functional element, disposed in the housing; as well as at least one light source, separate from the functional element and mounted on the PCB below the inner surface of the housing, wherein an optical signal emitted by the at least one light source is observable on the outer surface of the housing via at least one translucent member provided at the at least one port, and: (i) wherein the at least one translucent member is a gasket configured to mount the functional element to the housing and create a seal between the functional element and the housing; or (ii) wherein the at least one translucent member comprises a film configured to be attached to the outer surface of the housing; or (iii) wherein the at least one translucent member further comprises an optical housing insert disposed in the at least one port, wherein the optical housing insert comprises a cavity to retain a functional element protector therein.

50. The apparatus of claim 49, wherein the pad is formed of a substantially flexible material and is configured to mechanically isolate the functional element from vibrations delivered to the housing.

51. The device of claim 49, wherein the at least one translucent member comprises the film, and wherein an optical connector optically couples the at least one light source to the film.

52. The device of claim 49, wherein the at least one light source comprises an indicator light.

53. The device of claim 49, wherein the at least one light source comprises one or more light emitting diodes (LEDs).

54. An apparatus comprising: a housing comprising at least one port; a functional element positioned within the housing; as well as At least one light source is separate from the functional element and positioned within the housing, wherein light emitted by the at least one light source is observable outside the housing via at least one translucent member positioned at the at least one port. The functional element is electrically mounted on a printed circuit board PCB in the housing, and the at least one light source is also electrically mounted on the PCB. The functional element is mounted on a first surface of the PCB, and the at least one light source is mounted on a second surface of the PCB, and the first surface of the PCB and the second surface of the PCB are located on opposite sides of the PCB.

55. The device of claim 54, wherein at least one translucent member is disposed in the at least one port.

56. The device of claim 55, wherein the at least one translucent member is a gasket configured to mount the functional element to the housing and create a seal between the functional element and the housing.

57. The device of claim 55, wherein the at least one translucent member comprises a film configured to be attached to an outer surface of the housing.

58. The apparatus of claim 54, wherein the at least one translucent member comprises an optical housing insert disposed in the at least one port, wherein the optical housing insert includes a cavity to retain a functional element protector therein.

59. The device of claim 54, wherein the at least one light source comprises one or more light emitting diodes (LEDs).

60. The device of claim 54, wherein the at least one light source comprises an indicator light.

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