Alloy resistor laser degumming equipment based on large-breadth adsorption platform and processing method

Abstract

The invention discloses alloy resistor laser degumming equipment based on a large-breadth adsorption platform and a processing method of the alloy resistor laser degumming equipment. The alloy resistor substrate comprises a substrate body and a to-be-cut waste edge arranged around the edge of the substrate body. The equipment comprises a large-breadth adsorption platform and a laser glue removing device located above the large-breadth adsorption platform. The large-breadth adsorption platform comprises a vacuumizing base and an adsorption jig arranged on the vacuumizing base, a vacuumizing cavity is formed between the vacuumizing base and the adsorption jig, the adsorption jig is provided with a containing groove used for containing the alloy resistor substrate, the groove bottom of the containing groove is provided with a vacuumizing adsorption hole, and the side wall of the vacuumizing base is provided with an air pipe connector. According to the alloy resistor laser degumming equipment based on the large-breadth adsorption platform and the processing method, the situation that the alloy resistor substrate is warped due to heat generated in the laser processing process, and then air leakage of vacuumizing equipment is caused is prevented, and the alloy resistor laser degumming quality is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of alloy resistors, and in particular to a laser debonding device and a processing method for alloy resistors based on a large-scale adsorption platform. Background Art

[0002] like Figure 1 As shown in FIG, it is a schematic diagram of the structure of a large-format alloy resistor substrate 10. The length and width of the alloy resistor substrate 10 are approximately 1m×1m, and the thickness is approximately 0.5mm. During the processing, it is necessary to remove the epoxy resin glue covering the surface of the plate, for example, Figure 1 As shown, the epoxy resin glue covering the surface of the plate is partially removed by a laser device, thereby obtaining grooves arranged in a rectangular array.

[0003] Since the alloy resistor substrate 10 has a large format, during the production process, it is necessary to use a vacuum method to adsorb the bottom surface of the alloy resistor substrate 10. In this way, the entire board surface will be very flat, which is conducive to the laser equipment to accurately remove the epoxy resin glue covering the surface of the board.

[0004] However, during actual processing, it was discovered that the laser processing process generates a large amount of heat, causing the large-format alloy resistor substrate to warp to varying degrees. This can cause air leaks in the vacuum equipment, which in turn triggers alarms. The vacuum equipment cannot firmly hold the alloy resistor substrate, thus reducing the production yield.

[0005] Therefore, how to set up an alloy resistor laser degumming equipment and processing method based on a large-scale adsorption platform to prevent the heat generated during the laser processing from causing the alloy resistor substrate to warp, and then causing air leakage in the vacuum equipment, and improve the quality of alloy resistor laser degumming, is a technical problem that needs to be solved. Summary of the Invention

[0006] The purpose of the present invention is to overcome the shortcomings of the prior art and provide an alloy resistor laser degumming device and processing method based on a large-scale adsorption platform to prevent the heat generated during the laser processing from causing the alloy resistor substrate to warp, thereby causing the vacuum equipment to leak, thereby improving the quality of the alloy resistor laser degumming.

[0007] The object of the present invention is achieved through the following technical solutions: An alloy resistor laser debonding device based on a large-format adsorption platform is used to perform laser debonding on an alloy resistor substrate. The alloy resistor substrate includes a substrate body and a waste edge to be cut arranged around the edge of the substrate body. The waste edge to be cut is formed by stretching the edge of the substrate body. An arc-shaped extended transition portion is formed between the waste edge to be cut and the substrate body. The device includes a large-format adsorption platform and a laser debonding device located above the large-format adsorption platform. The large-format adsorption platform includes a vacuum base and an adsorption jig arranged on the vacuum base. A vacuum chamber is formed between the vacuum base and the adsorption jig. The adsorption jig is provided with a receiving groove for accommodating the alloy resistor substrate. The bottom of the receiving groove has a vacuum adsorption hole, and the side wall of the vacuum base is provided with an air pipe interface.

[0008] In one embodiment, The groove wall of the receiving groove is provided with an annular embedding groove, the annular embedding groove is recessed in the groove wall of the receiving groove, the annular embedding groove is arranged around the groove wall of the receiving groove, the edge of the waste material to be cut is embedded in the annular embedding groove, and the substrate body is attached to the groove bottom of the receiving groove.

[0009] In one embodiment, the laser glue removal device includes: a horizontal X-axis moving module, a horizontal Y-axis moving module, a vertical Z-axis moving module, and a laser head; the horizontal X-axis moving module is used to drive the laser head to move back and forth along the horizontal X-axis, the horizontal Y-axis moving module is used to drive the laser head to move back and forth along the horizontal Y-axis, and the vertical Z-axis moving module is used to drive the laser head to move back and forth along the vertical Z-axis.

[0010] In one embodiment, the laser head is used to partially remove the epoxy resin glue on the substrate body, and to cut and separate the substrate body and the waste edge to be cut.

[0011] In one embodiment, the adsorption jig is provided with a handle structure, and the adsorption jig is detachably connected to the vacuum base.

[0012] In one embodiment, the large-format adsorption platform further includes a vacuum suction device, and the vacuum suction device is used to provide vacuum adsorption force for the substrate body.

[0013] In one embodiment, the large-format adsorption platform further includes an embedding and pressing block, which is used to enable the waste edge to be cut to be densely embedded in the annular embedding groove.

[0014] A laser debonding method for alloy resistors based on a large-format adsorption platform is implemented based on the aforementioned large-format adsorption platform-based laser debonding equipment for alloy resistors, and includes the following steps: Step 1: forming an alloy resistor substrate by stretching with a stretching machine, wherein the alloy resistor substrate comprises a substrate body and a waste edge to be cut arranged around the edge of the substrate body, and an arc-shaped extended transition portion is formed between the waste edge to be cut and the substrate body; Step 2: Place the alloy resistor substrate in the receiving groove of the adsorption fixture, embed the waste edge to be cut in the annular embedding groove, and attach the substrate body to the bottom of the receiving groove; Step 3: Install the adsorption fixture together with the alloy resistor substrate on the vacuum base; Step 4: connect an external vacuum pumping device and evacuate the vacuum chamber through the air pipe interface so that the substrate body is adsorbed on the bottom of the receiving groove; Step 5: Start the laser glue removal device to remove the epoxy resin glue on the substrate body by laser. After the epoxy resin glue is removed, the substrate body and the waste edge to be cut are separated by laser. Step 6: Turn off the laser debonding device, first remove the substrate body from the receiving groove, and then remove the waste edge to be cut from the annular embedding groove.

[0015] The present invention provides an alloy resistor laser debonding device and processing method based on a large-scale adsorption platform, which prevents the heat generated during the laser processing from causing the alloy resistor substrate to warp, thereby causing the vacuum equipment to leak, thereby improving the quality of the alloy resistor laser debonding. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0017] Figure 1 This is a structural diagram of a traditional alloy resistor substrate; Figure 2 This is a structural diagram of an alloy resistor substrate obtained by stretching; Figure 3 A schematic diagram of an alloy resistor laser debonding device based on a large-format adsorption platform according to an embodiment of the present invention; Figure 4 for Figure 3 Combination diagram of the large-format adsorption platform shown; Figure 5 for Figure 4 Exploded view of the large-format adsorption platform shown; Figure 6 for Figure 4A cross-sectional view of the adsorption fixture of the large-format adsorption platform shown; Figure 7 Schematic diagram of installing the alloy resistor substrate on the adsorption fixture. DETAILED DESCRIPTION

[0018] To facilitate understanding of the present invention, the present invention will be described more fully below with reference to the accompanying drawings. The accompanying drawings illustrate preferred embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present disclosure.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly attached to the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention pertains. The terms used in this specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0021] The present invention discloses an alloy resistor laser debonding device 20 based on a large-scale adsorption platform, such as Figure 2 As shown, it is used to perform laser debonding on the alloy resistor substrate 10. The alloy resistor substrate 10 includes a substrate body 11 and a waste edge 12 to be cut arranged around the edge of the substrate body 11. The waste edge 12 to be cut is formed by stretching the edge of the substrate body 11, and an arc-shaped extended transition portion 13 is formed between the waste edge 12 to be cut and the substrate body 11.

[0022] like Figure 3 As shown, the alloy resistor laser debonding equipment 20 based on the large-format adsorption platform includes a large-format adsorption platform 30 and a laser debonding device 40 located above the large-format adsorption platform 30 .

[0023] like Figure 4 and Figure 5As shown, the large-format adsorption platform 30 includes a vacuum base 100 and an adsorption fixture 200 arranged on the vacuum base 100. A vacuum chamber 300 is formed between the vacuum base 100 and the adsorption fixture 200. The adsorption fixture 200 is provided with a receiving groove 210 for accommodating the alloy resistor substrate 10. The bottom of the receiving groove 210 has a vacuum adsorption hole 211, and the side wall of the vacuum base 100 is provided with an air pipe interface 101.

[0024] Furthermore, if Figure 5 and Figure 6 As shown, the groove wall of the receiving groove 210 is provided with an annular embedding groove 220, which is recessed in the groove wall of the receiving groove 210. The annular embedding groove 220 is arranged around the groove wall of the receiving groove 210, and the waste edge 12 to be cut is embedded in the annular embedding groove 220, and the substrate body 11 is attached to the groove bottom of the receiving groove 210.

[0025] Next, the specific structure of the laser adhesive removal device 40 is described: The laser glue removal device 40 includes: a horizontal X-axis moving module, a horizontal Y-axis moving module, a vertical Z-axis moving module, a laser head 41 (such as Figure 3 ); the horizontal X-axis moving module is used to drive the laser head 41 to reciprocate along the horizontal X-axis, the horizontal Y-axis moving module is used to drive the laser head 41 to reciprocate along the horizontal Y-axis, and the vertical Z-axis moving module is used to drive the laser head 41 to reciprocate along the vertical Z-axis. In this embodiment, the horizontal X-axis moving module, the horizontal Y-axis moving module, and the vertical Z-axis moving module can adopt a motor-screw drive structure.

[0026] In the present invention, the laser head 41 is used to remove the epoxy resin adhesive portion on the substrate body 11 and to cut and separate the substrate body 11 and the waste edge 12 to be cut.

[0027] Furthermore, the adsorption fixture 200 is provided with a handle structure 230 (such as Figure 5 As shown in FIG, the adsorption jig 200 is detachably connected to the vacuum base 100. This allows the alloy resistor substrate 10 to be placed on the adsorption jig 200 and then mounted on the vacuum base 100 together with the adsorption jig 200. After laser debonding is complete, the adsorption jig 200 and the alloy resistor substrate 10 can be removed from the vacuum base 100, thereby improving production efficiency.

[0028] In the present invention, the large-format adsorption platform 30 further includes a vacuum suction device 300 (such as Figure 7As shown in FIG, the vacuum suction device 300 is used to provide vacuum suction force to the substrate body 11. By vacuum suctioning the substrate body 11 with the vacuum suction device 300, the alloy resistor substrate 10 can be more conveniently installed in the receiving groove 210 and removed from the receiving groove 210.

[0029] In the present invention, the large-format adsorption platform 30 further includes an embedding block 400 (e.g. Figure 7 As shown in FIG. 2 , the pressing block 400 is used to tightly fit the waste edge 12 to be cut into the annular groove 220. After the waste edge 12 to be cut is fitted into the annular groove 220, the worker uses the pressing block 400 to strike the waste edge 12 to further securely fit the waste edge 12 in the annular groove 220, thereby achieving a better sealing effect.

[0030] The present invention also discloses a laser debonding method for alloy resistors based on a large-format adsorption platform, which is implemented based on the aforementioned large-format adsorption platform-based laser debonding device 20 and includes the following steps: Step 1: An alloy resistor substrate 10 is obtained by stretching the substrate 10 using a stretching machine. The alloy resistor substrate 10 includes a substrate body 11 and a waste edge 12 to be cut arranged around the edge of the substrate body 11, and an arc-shaped extended transition portion 13 is formed between the waste edge 12 and the substrate body 11; Step 2: Place the alloy resistor substrate 10 in the receiving groove 210 of the adsorption fixture 200, embed the waste edge 12 to be cut in the annular embedding groove 220, and attach the substrate body 11 to the bottom of the receiving groove 210; Step 3: Install the adsorption fixture 200 together with the alloy resistor substrate 10 on the vacuum base 100; Step 4: Connect an external vacuum pumping device to evacuate the vacuum chamber 300 through the air pipe interface, so that the substrate body 11 is adsorbed on the bottom of the receiving groove 210; Step 5: Start the laser glue removal device 40 to remove the epoxy resin glue on the substrate body 11 by laser. After the epoxy resin glue is removed, the substrate body 11 and the waste edge 12 to be cut are separated by laser. Step 6: Turn off the laser debonding device, first remove the substrate body 11 from the receiving groove 210 , and then remove the waste edge 12 to be cut from the annular embedding groove 220 .

[0031] Next, the design principle of the alloy resistor laser debonding device 20 based on the large-scale adsorption platform and its processing method are described: The traditional processing method is to directly Figure 1The unstretched alloy resistor substrate shown is placed directly on the adsorption platform, which then performs vacuum adsorption. However, during the laser debonding process, a large amount of heat is generated on the surface of the alloy resistor substrate, causing local warping and deformation of the alloy resistor substrate. This can cause air leakage in the vacuuming equipment, which in turn causes an alarm in the vacuuming equipment. Since the vacuuming equipment cannot tightly adsorb the alloy resistor substrate, the accuracy of debonding is reduced. In the present invention, in order to solve the above technical problems, the shape of the alloy resistor substrate 10 is first stretched. For example, the edge of the alloy resistor substrate 10 is bent and stretched by a stretching machine to form a waste edge 12 to be cut. An arc-shaped extended transition portion 13 is formed between the waste edge 12 to be cut and the substrate body 11. On the one hand, since the waste edge 12 to be cut and the substrate body 11 are integrally formed, no additional clamp is required, thereby ensuring airtightness. On the other hand, the waste edge 12 to be cut only occupies a small part of the substrate body 11 and can be cleverly cut and separated by laser in the later stage, reducing material waste. In order to adapt to the structure of the improved alloy resistor substrate 10, a large-scale adsorption platform 30 is set accordingly. The adsorption fixture 200 is provided with a receiving groove 210 for receiving the alloy resistor substrate 10. In particular, an annular embedding groove 220 is provided on the groove wall of the receiving groove 210. The waste edge 12 to be cut is embedded in the annular embedding groove 220 (for example, an embedding block 400 is used to knock the waste edge 12 to be cut). In this way, the airtightness between the waste edge 12 to be cut and the annular embedding groove 220 is improved. Since the four sides of the substrate body 11 are sealed, the airtightness between the waste edge 12 to be cut and the annular embedding groove 220 is improved. During the laser processing, even if the substrate body 11 is heated and partially warped, the overall airtightness is not affected, and the substrate body 11 can be firmly adsorbed on the bottom of the receiving groove 210. During the laser debonding process, a large amount of heat is generated, which causes the entire alloy resistor substrate 10 to expand. The expanded alloy resistor substrate 10 exerts a force on the annular embedding groove 220 through the waste edge 12 to be cut. The waste edge 12 to be cut is locked by the annular embedding groove 220 and is not easily separated, further improving the airtightness. In addition, when the substrate body 11 is heated and locally warped, the overall shape of the substrate body 11 will be stretched. However, the present invention forms an arc-shaped extended transition portion 13 (such as Figure 6 As shown), the arc-shaped extended transition portion 13 can be adaptively adjusted to adapt to the overall deformation of the substrate body 11, so that the waste edge 12 to be cut can still form a tight airtight connection with the annular embedding groove 220; After the laser glue removal is completed, since the waste edge 12 to be cut is embedded in the annular embedding groove 220, it is difficult to remove the entire alloy resistor substrate 10 from the receiving groove 210. Therefore, the alloy resistor substrate 10 is subjected to a circular cutting operation by laser to separate the substrate body 11 and the waste edge 12 to be cut. Then, the substrate body 11 is removed from the receiving groove 210 (for example, using a vacuum suction device 300). Since the substrate body 11 has been taken out, the waste edge 12 to be cut can be clamped out of the annular embedding groove 220 with the help of tools such as pliers.

[0032] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A laser debonding device for alloy resistors based on a large-scale adsorption platform, used for laser debonding alloy resistor substrates, wherein the alloy resistor substrate comprises a substrate body and a waste edge to be cut arranged around the edge of the substrate body, the waste edge to be cut being formed by stretching the edge of the substrate body, and an arc-shaped extended transition portion being formed between the waste edge to be cut and the substrate body, characterized in that: It includes a large-format adsorption platform and a laser adhesive removal device located above the large-format adsorption platform; The large-format adsorption platform includes a vacuum base and an adsorption jig arranged on the vacuum base. A vacuum chamber is formed between the vacuum base and the adsorption jig. The adsorption jig is provided with a receiving groove for accommodating the alloy resistor substrate. The bottom of the receiving groove has a vacuum adsorption hole, and the side wall of the vacuum base is provided with an air pipe interface.

2. The alloy resistor laser debonding equipment based on a large-scale adsorption platform according to claim 1 is characterized in that: The groove wall of the receiving groove is provided with an annular embedding groove, the annular embedding groove is recessed in the groove wall of the receiving groove, the annular embedding groove is arranged around the groove wall of the receiving groove, the edge of the waste material to be cut is embedded in the annular embedding groove, and the substrate body is attached to the groove bottom of the receiving groove.

3. The alloy resistor laser debonding equipment based on a large-format adsorption platform according to claim 1 is characterized in that: The laser glue removal device includes: a horizontal X-axis moving module, a horizontal Y-axis moving module, a vertical Z-axis moving module, and a laser head; the horizontal X-axis moving module is used to drive the laser head to move back and forth along the horizontal X-axis, the horizontal Y-axis moving module is used to drive the laser head to move back and forth along the horizontal Y-axis, and the vertical Z-axis moving module is used to drive the laser head to move back and forth along the vertical Z-axis.

4. The alloy resistor laser debonding equipment based on a large-format adsorption platform according to claim 3 is characterized in that: The laser head is used to remove the epoxy resin glue portion on the substrate body and to cut and separate the substrate body and the waste edge to be cut.

5. The alloy resistor laser debonding equipment based on a large-scale adsorption platform according to claim 1 is characterized in that: The adsorption jig is provided with a handle structure, and the adsorption jig is detachably connected to the vacuum base.

6. The alloy resistor laser debonding equipment based on a large-format adsorption platform according to claim 1 is characterized in that: The large-format adsorption platform further includes a vacuum suction device, which is used to provide vacuum adsorption force for the substrate body.

7. The alloy resistor laser debonding equipment based on a large-format adsorption platform according to claim 1 is characterized in that: The large-format adsorption platform further comprises an embedding and pressing block, which is used to enable the waste material edges to be cut to be densely embedded in the annular embedding groove.

8. A laser debonding method for alloy resistors based on a large-scale adsorption platform, characterized in that: The alloy resistor laser debonding device based on the large-format adsorption platform according to any one of claims 2 to 7 is implemented, comprising the following steps: Step 1: forming an alloy resistor substrate by stretching with a stretching machine, wherein the alloy resistor substrate comprises a substrate body and a waste edge to be cut arranged around the edge of the substrate body, and an arc-shaped extended transition portion is formed between the waste edge to be cut and the substrate body; Step 2: Place the alloy resistor substrate in the receiving groove of the adsorption fixture, embed the waste edge to be cut in the annular embedding groove, and attach the substrate body to the bottom of the receiving groove; Step 3: Install the adsorption fixture together with the alloy resistor substrate on the vacuum base; Step 4: connect an external vacuum pumping device and evacuate the vacuum chamber through the air pipe interface so that the substrate body is adsorbed on the bottom of the receiving groove; Step 5: Start the laser glue removal device to remove the epoxy resin glue on the substrate body by laser. After the epoxy resin glue is removed, the substrate body and the waste edge to be cut are separated by laser. Step 6: Turn off the laser debonding device, first remove the substrate body from the receiving groove, and then remove the waste edge to be cut from the annular embedding groove.

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