Normal-temperature curing high-temperature-resistant epoxy resin composition as well as preparation method and application thereof

Abstract

The invention discloses a normal-temperature curing high-temperature-resistant epoxy resin composition as well as a preparation method and application thereof. The composition comprises the following components in parts by mass: 10-30 parts of amino tetrafunctional epoxy resin, 80-120 parts of boron modified epoxy resin, 3-5 parts of modified graphene oxide, 5-10 parts of a curing agent, 5-15 parts of inorganic filler, 1-3 parts of a diluent and 1-3 parts of a defoaming agent. The preparation method of the modified graphene oxide comprises the step of adding boron modified epoxy resin into a graphene oxide dispersion liquid for reaction. The amino tetra-functional epoxy resin and the boron modified epoxy resin are taken as main components of the composition, so that the adhesive is endowed with good thermal stability, the adhesive has higher tensile-shear strength under a high-temperature condition, and the composition can be cured at room temperature due to rich reaction crosslinking sites of the boron modified epoxy resin.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy resin compositions, and in particular to a room-temperature curing high-temperature resistant epoxy resin composition, a preparation method thereof, and an application thereof. Background Art

[0002] Due to the presence of polar chemical structures such as epoxy groups, hydroxyl groups, and ether bonds in its structure, epoxy resin can produce strong interactions with the surfaces of various materials. When used in combination with a curing agent, it can be used as an excellent adhesive in a wide range of applications in the automotive industry, electronics, construction, shipbuilding, aerospace, and other fields. However, due to the structural limitations formed after curing, the heat resistance temperature of ordinary epoxy resin adhesives generally does not exceed 150°C. In addition, epoxy resin adhesives that can be cured at room temperature have a significantly lower curing temperature than those that cure at medium temperatures (120°C~130°C) and high temperatures (170°C~180°C), which can reduce energy consumption and simplify the bonding process. They are particularly suitable for construction environments and requirements where temperature curing is not possible. Given the rapid development of current integration and assembly technologies, packaging materials that combine heat resistance with excellent electrical properties are very important, and research on room temperature curing high-temperature resistant epoxy resin compositions has also attracted much attention.

[0003] Currently, the main methods for improving the heat resistance of epoxy compositions are to increase the crosslink density of the epoxy resin and the rigidity of the polymer chain, as well as to use an epoxy resin with excellent heat resistance as the matrix and incorporate high-heat-resistant fillers. CN116875244A discloses a high-temperature resistant, fast-curing epoxy adhesive and its preparation method. The adhesive comprises, by weight, a component A: 15-25% epoxy resin, 12-27% modified fluorine-phosphorus-containing biphenyl epoxy resin, 15-35% modified nanoparticle toughening agent, 15-25% diluent, and 1-1.5% coupling agent; and a component B: 12-15% curing agent, 30-45% inorganic filler, 5-7% thixotropic agent, 35-55% thermal conductivity, 5-10% accelerator, and 5-7% plasticizer. This adhesive cures at room temperature and exhibits high toughness, high thermal conductivity, and a high glass transition temperature. However, the preparation of modified fluorine-containing phosphorus biphenyl epoxy resin is relatively cumbersome, and a variety of catalysts are used. CN112961642A discloses a high-temperature resistant epoxy resin adhesive for lithium battery heating film. Its components are as follows by weight percentage: epoxy resin 40~55%, polyester resin 40~55%, antioxidant 1.5~3%, surfactant 0.3~1%, toughening agent 4~8%, and the balance is curing agent. The heat resistance of the adhesive is improved by modifying the high-temperature resistant epoxy resin and the high-temperature resistant polyester resin with a high-temperature resistant curing agent. However, the price of special resin raw materials is relatively high. At the same time, because the proportion of polyester resin is high and the content of curing agent is low, polyester will form an interpenetrating network structure in the epoxy resin system. It is difficult to form a stable structure with less curing agent, and the peel strength will drop significantly at 180°C. Summary of the Invention

[0004] In order to solve the problems existing in the prior art, the present invention provides a room temperature curing high temperature resistant epoxy resin composition, which comprises, by mass, 10 to 30 parts of amino tetrafunctional epoxy resin, 80 to 120 parts of boron modified epoxy resin, 3 to 5 parts of modified graphene oxide, 5 to 10 parts of curing agent, 5 to 15 parts of inorganic filler, 1 to 3 parts of diluent, and 1 to 3 parts of defoaming agent; The preparation method of the modified graphene oxide comprises adding boron-modified epoxy resin into a graphene oxide dispersion to carry out a reaction.

[0005] Aminotetrafunctional epoxy resins contain four amino groups in their chemical structure. These functional groups impart a higher crosslink density and superior physical properties, resulting in a high glass transition temperature and good high-temperature performance. While their inclusion in composites can improve their heat resistance, their price is higher than that of standard epoxy resins, and their addition level should be controlled.

[0006] Furthermore, the preparation method of the boron-modified epoxy resin comprises: Bisphenol A diglycidyl ether and formaldehyde are mixed at a molar ratio of 1:1.1-1.3, and n-butanol is added in an amount of 5-8 times the volume of bisphenol A diglycidyl ether. After stirring and mixing, the temperature is raised to 60-80°C, and 0.2-0.5 mol / L ammonia water in an amount of 2%-5% by mass of bisphenol A diglycidyl ether is added as a catalyst to react to obtain an intermediate. The intermediate is mixed with boric acid in a mass ratio of 2 to 5:1, and the temperature is raised to react to obtain a boron-modified epoxy resin.

[0007] The boron-modified epoxy resin of the present invention is formed by reacting bisphenol A diglycidyl ether with formaldehyde under the catalysis of an acidic substance to form a benzylhydroxy-epoxy active intermediate, and then adding boric acid. The benzylhydroxyl group and the boron hydroxyl group in the boric acid undergo a dehydration condensation reaction to connect the molecules. Compared with ordinary epoxy resins such as E51, the boron-modified epoxy resin has multiple cross-linking sites on the molecule that can react with the curing agent, and forms a tight cross-linking network after curing, and has a smaller free volume and a more complete cross-linking network; the high-bond energy boron-oxygen bond is introduced into the epoxy resin cross-linking network, slowing down the decomposition of the resin due to chemical bond breakage in a high-temperature environment. The present invention uses amino tetrafunctional epoxy resin and boron-modified epoxy resin as the main components of the composition, giving the adhesive good thermal stability, so that it has higher tensile shear strength under high temperature conditions. The rich reactive cross-linking sites of the boron-modified epoxy resin also enable the composition to be cured at room temperature.

[0008] Graphene has attracted much attention due to its excellent thermal conductivity, mechanical strength, and layered barrier properties. When graphene is introduced into the resin cross-linked network, it can effectively hinder the movement of chain segments, increasing the glass transition temperature of the resin. At the same time, at high temperatures, the graphene sheets in the resin can block gas volatilization, reduce mass loss, and improve the thermal stability of the resin. However, graphene often agglomerates in the resin, affecting its dispersion. Compared to graphene, graphene oxide has more defects and surface functional groups at the edge, making it easier to modify and compound. Modifying the graphene oxide surface and interacting with the epoxy resin molecular chain can effectively improve the compatibility between graphene oxide and the resin matrix.

[0009] To this end, the present invention first disperses graphene oxide and 1,4,7-triazacyclononane-1,4,7-triacetic acid together. 1,4,7-triazacyclononane-1,4,7-triacetic acid has acetic acid groups connected to the nitrogen atoms at positions 1, 4, and 7, respectively. The presence of these acetic acid groups increases the hydrophilicity and acidity of the compound and provides active sites for reactions such as coordination with metal ions. 1,4,7-triazacyclononane-1,4,7-triacetic acid is adsorbed on the graphene oxide, and then the carboxyl groups are activated and reacted with polyethyleneimine and boron-modified epoxy resin to perform functionalization treatment on the graphene oxide.

[0010] Furthermore, the preparation method of the modified graphene oxide specifically includes: adding graphene oxide and 1,4,7-triazacyclononane-1,4,7-triacetic acid to a solvent at a mass ratio of 2-10:0.2-0.5:1000 and dispersing for 2-5 hours to obtain a graphene oxide dispersion; 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride, N-hydroxysuccinimide, polyethyleneimine, and boron-modified epoxy resin were added to a graphene oxide dispersion at a mass ratio of 1-3:0.5-1.5:2-5:3-10:200-500, stirred, and the pH was adjusted to 5.6-8.5 to obtain a reaction system; The reaction system is heated to 60-80° C. to carry out the reaction and obtain modified graphene oxide.

[0011] Furthermore, a soluble copper salt in an amount of 0.1 to 0.5 times the mass of the polyethyleneimine is added during the stirring process.

[0012] It should be noted that the solvent for dispersing graphene oxide in the present invention is not strictly limited and can be, for example, at least one of water, ethanol, acetone, dimethyl sulfoxide, N,N-dimethylformamide, etc. The type of soluble copper salt is not strictly limited and can be, for example, at least one of copper sulfate pentahydrate, copper chloride dihydrate, copper nitrate trihydrate, copper acetate monohydrate, etc.

[0013] Furthermore, the curing agent includes at least one of ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, polyetheramine, m-phenylenediamine, diphenylmethanediamine, isophoronediamine, polyamide, phthalic anhydride, and tetrahydrophthalic anhydride.

[0014] Furthermore, the inorganic filler includes at least one of calcium carbonate with a mesh size of 1000-3000, titanium dioxide, silicon dioxide, and talc.

[0015] Furthermore, the diluent includes at least one of phenyl glycidyl ether, butyl glycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and trimethylolpropane triglycidyl ether.

[0016] Furthermore, the defoaming agent includes at least one of a silicone defoaming agent, a polyether defoaming agent, and a mineral oil defoaming agent.

[0017] The present invention also provides a method for preparing the above-mentioned room temperature curing high temperature resistant epoxy resin composition, comprising: Boron-modified epoxy resin, modified graphene oxide, inorganic filler and diluent are stirred and mixed; then amino tetrafunctional epoxy resin, curing agent and defoaming agent are added, stirred and mixed, and vacuum degassed to obtain a flame-retardant epoxy resin adhesive.

[0018] The present invention also provides the use of the above-mentioned room temperature curing high temperature resistant epoxy resin composition in an adhesive.

[0019] Compared with the prior art, the present invention has the following beneficial effects: The present invention uses amino tetrafunctional epoxy resin and boron-modified epoxy resin as the main components of the composition, which gives the adhesive good thermal stability and enables it to have higher tensile shear strength under high temperature conditions. The abundant reactive cross-linking sites of the boron-modified epoxy resin also enable the composition to be cured at room temperature.

[0020] The present invention also introduces polyethyleneimine and boron-modified epoxy resin functionalized modified graphene oxide into the composition, which can effectively bind to the resin matrix and improve the thermal stability of the resin. DETAILED DESCRIPTION

[0021] The endpoints of the ranges and any values ​​disclosed herein are not limited to the precise ranges or values, and these ranges or values ​​should be understood to include values ​​close to these ranges or values. For numerical ranges, the endpoints of each range, the endpoints of each range and individual point values, and the individual point values ​​can be combined with each other to form one or more new numerical ranges, and these numerical ranges should be considered to be specifically disclosed in the present invention.

[0022] Introduction of some raw materials used in the examples and comparative examples of the present invention: Amino tetrafunctional epoxy resin, model AG-70, was purchased from Shanghai Huayi Resin Co., Ltd. Graphene oxide, thin or few layers, with a layer number distribution of about 2 to 5, was purchased from Nanjing Xianfeng Nanomaterials Technology.

[0023] The preparation method of boron-modified epoxy resin is as follows: Bisphenol A diglycidyl ether and formaldehyde are mixed at a molar ratio of 1:1.15, and n-butanol is added in an amount 6 times the volume of bisphenol A diglycidyl ether. The mixture is stirred at 300 rpm, then the temperature is raised to 70°C, and 0.25 mol / L ammonia water (2.5% by mass of bisphenol A diglycidyl ether) is added as a catalyst. The reaction is continued for 2.5 hours. After the reaction is completed, water and n-butanol are removed by vacuum distillation to obtain an intermediate. The intermediate was mixed with boric acid in a mass ratio of 4:1, the stirring rate was controlled at 350 rpm, the temperature was raised to 70°C and the reaction was carried out for 2.5 hours. After the reaction was completed, the boron-modified epoxy resin was obtained by vacuum distillation.

[0024] All other raw materials not mentioned are commonly available. The above description is provided solely to illustrate the present invention and should not be construed as a strict limitation of the present invention. Those skilled in the art can purchase or prepare similar or similar raw materials commercially. These details will not be further detailed in the examples.

[0025] The following will be combined with specific embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Example

[0026] A method for preparing a room temperature curing high temperature resistant epoxy resin composition comprises the following steps: S1. Weigh 1.5 kg of amino tetrafunctional epoxy resin, 8.5 kg of boron-modified epoxy resin, 0.35 kg of modified graphene oxide, 1 kg of diphenylmethanediamine, 1 kg of 1000 mesh calcium carbonate, 0.2 kg of 1,4-butanediol diglycidyl ether, and 0.2 kg of a polyether defoamer; S2. Boron-modified epoxy resin, modified graphene oxide, 1000 mesh calcium carbonate and 1,4-butanediol diglycidyl ether are stirred and mixed at a speed of 1200 rpm; then amino tetrafunctional epoxy resin, diphenylmethane diamine and polyether defoaming agent are added and stirred and mixed at a speed of 1500 rpm, and then vacuum degassed to obtain a flame-retardant epoxy resin adhesive.

[0027] Wherein, the preparation method of modified graphene oxide is: T1. Add graphene oxide and 1,4,7-triazacyclononane-1,4,7-triacetic acid to N,N-dimethylformamide at a mass ratio of 5:0.3:1000 and disperse them ultrasonically at 150 W for 3 h to obtain a graphene oxide dispersion; T2. Add 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride, N-hydroxysuccinimide, polyethyleneimine, and boron-modified epoxy resin to the graphene oxide dispersion in a mass ratio of 1.5:0.8:3:8:300, stir at 350 rpm for 30 min, and adjust the pH to 7.3 to obtain a reaction system; T3. The reaction system was heated to 70° C. and stirred for 5 h. After centrifugation, the insoluble matter was collected and washed three times with water and ethanol respectively. The mixture was then transferred to an oven and dried to a constant weight to obtain modified graphene oxide. Example

[0028] A method for preparing a room temperature curing high temperature resistant epoxy resin composition comprises the following steps: S1. Weigh 1.5 kg of amino tetrafunctional epoxy resin, 8.5 kg of boron-modified epoxy resin, 0.35 kg of modified graphene oxide, 1 kg of diphenylmethanediamine, 1 kg of 1000 mesh calcium carbonate, 0.2 kg of 1,4-butanediol diglycidyl ether, and 0.2 kg of a polyether defoamer; S2. Boron-modified epoxy resin, modified graphene oxide, 1000 mesh calcium carbonate and 1,4-butanediol diglycidyl ether are stirred and mixed at a speed of 1200 rpm; then amino tetrafunctional epoxy resin, diphenylmethane diamine and polyether defoaming agent are added and stirred and mixed at a speed of 1500 rpm, and then vacuum degassed to obtain a flame-retardant epoxy resin adhesive.

[0029] Wherein, the preparation method of modified graphene oxide is: T1. Add graphene oxide and 1,4,7-triazacyclononane-1,4,7-triacetic acid to N,N-dimethylformamide at a mass ratio of 5:0.3:1000 and disperse them ultrasonically at 150 W for 3 h to obtain a graphene oxide dispersion; T2. Adding 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride, N-hydroxysuccinimide, polyethyleneimine, and boron-modified epoxy resin to the graphene oxide dispersion in a mass ratio of 1.5:0.8:3:8:300, stirring at 350 rpm for 30 min and adjusting the pH to 7.3, adding copper nitrate trihydrate (0.2 times the mass of polyethyleneimine) during stirring to obtain a reaction system; T3. The reaction system was heated to 70° C. and stirred for 5 h. After centrifugation, the insoluble matter was collected and washed three times with water and ethanol respectively. The mixture was then transferred to an oven and dried to a constant weight to obtain modified graphene oxide.

[0030] Comparative Example 1 Compared with Example 2, the difference is that graphene oxide is used instead of modified graphene oxide.

[0031] Comparative Example 2 Compared with Example 2, the difference is that the preparation method of modified graphene oxide is: T1. Add graphene oxide to N,N-dimethylformamide at a mass ratio of 5:1000 and disperse the mixture at 150W ultrasonication for 3 h to obtain a graphene oxide dispersion. T2. Adding 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride, N-hydroxysuccinimide, polyethyleneimine, and boron-modified epoxy resin to the graphene oxide dispersion in a mass ratio of 1.5:0.8:3:8:300, stirring at 350 rpm for 30 min and adjusting the pH to 7.3, adding copper nitrate trihydrate (0.2 times the mass of polyethyleneimine) during stirring to obtain a reaction system; T3. The reaction system was heated to 70° C. and stirred for 5 h. After centrifugation, the insoluble matter was collected and washed three times with water and ethanol respectively. The mixture was then transferred to an oven and dried to a constant weight to obtain modified graphene oxide.

[0032] Comparative Example 3 Compared with Example 2, the difference is that no modified graphene oxide is added.

[0033] Test Case The epoxy resin compositions prepared in the above examples and comparative examples were applied to a release film by knife coating to form a 60 μm thick film. The film was then laminated to an aluminum substrate, the release film removed, and laminated to another aluminum substrate. The film was pressed at 1.0 MPa at 25°C for 5 minutes, followed by natural curing at 25°C for 2 hours. Shear strength was tested at 25°C and after aging in air at 210°C for 2 hours, in accordance with the national standard GB / T 33332-2016, "Test Method for Dynamic Shear Strength of Adhesive Tapes." The results are shown in Table 1.

[0034] Table 1 Shear strength test results 25℃ shear strength (MPa) Shear strength after aging at 210℃ (MPa) Example 1 21.7 17.1 Example 2 24.3 21.6 Comparative Example 1 16.3 8.1 Comparative Example 2 19.8 11.8 Comparative Example 3 18.5 9.6 The test results in Table 2 show that the epoxy resin compositions of the present invention exhibit a shear strength greater than 8 MPa even after aging at 210°C. This is because the aminotetrafunctional epoxy resin and boron-modified epoxy resin selected as the main components of the present invention impart good thermal stability, resulting in good tensile shear strength under high-temperature conditions. It is worth noting that the shear strength and temperature resistance of Comparative Example 1, which incorporates graphene oxide, are inferior to those of Comparative Example 3, which does not incorporate it. This is because the graphene oxide is difficult to effectively disperse within the resin matrix, which in turn reduces the mechanical properties of the composition. Comparative Example 2 exhibits inferior performance compared to Examples 1 and 2. This is due to the low number of active groups on the graphene oxide surface. Even if activated, the limited carboxyl groups present are difficult to effectively interact with polyethyleneimine and the boron-modified epoxy resin. In both Examples 1 and 2, the graphene oxide and 1,4,7-triazacyclononane-1,4,7-triacetic acid were dispersed prior to the reaction, and carboxyl groups were modified on the graphene oxide surface to enhance the interaction. The presence of copper ions further promotes the reaction of activated carboxyl groups on the surface of graphene oxide with polyethyleneimine and boron-modified epoxy resin, further enhancing the dispersibility and compatibility of modified graphene oxide in the resin matrix. At the same time, the promoting effect of multiple groups in curing significantly improves the shear strength of the composition.

[0035] Neutral salt spray aging was also carried out in a salt spray chamber for 1000 h using a 5 wt % sodium chloride aqueous solution with a pH of 6.5 to 7.2 as the spray solution. The shear strength after aging was tested and the strength retention was calculated. The results are shown in Table 2.

[0036] Table 2 Neutral salt spray resistance test results Shear strength retention rate (%) Example 1 88.9 Example 2 92.3 Comparative Example 1 65.8 Comparative Example 2 79.2 Comparative Example 3 70.3 It can also be seen from the test results in Table 2 that the epoxy resin composition of the embodiment of the present invention has better neutral salt spray resistance.

[0037] In summary, the present invention utilizes aminotetrafunctional epoxy resin and boron-modified epoxy resin as the primary components of the composition, imparting excellent thermal stability to the adhesive, resulting in higher tensile shear strength at high temperatures. The boron-modified epoxy resin's abundant reactive crosslinking sites also enable the composition to cure at room temperature. The present invention also incorporates modified graphene oxide functionalized with polyethyleneimine and boron-modified epoxy resin, enabling good crosslinking between the resin matrix and enhancing the resin's thermal stability.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A room temperature curing high temperature resistant epoxy resin composition, characterized in that, The composition comprises, by mass, 10 to 30 parts of amino tetrafunctional epoxy resin, 80 to 120 parts of boron-modified epoxy resin, 3 to 5 parts of modified graphene oxide, 5 to 10 parts of curing agent, 5 to 15 parts of inorganic filler, 1 to 3 parts of diluent, and 1 to 3 parts of defoaming agent; The preparation method of the modified graphene oxide comprises adding boron-modified epoxy resin into a graphene oxide dispersion to carry out a reaction.

2. The room temperature curing high temperature resistant epoxy resin composition according to claim 1, characterized in that The preparation method of the modified graphene oxide specifically includes: adding graphene oxide and 1,4,7-triazacyclononane-1,4,7-triacetic acid to a solvent at a mass ratio of 2-10:0.2-0.5:1000 and dispersing for 2-5 hours to obtain a graphene oxide dispersion; 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide hydrochloride, N-hydroxysuccinimide, polyethyleneimine, and boron-modified epoxy resin were added to a graphene oxide dispersion at a mass ratio of 1-3:0.5-1.5:2-5:3-10:200-500, stirred, and the pH was adjusted to 5.6-8.5 to obtain a reaction system; The reaction system is heated to 60-80° C. to carry out the reaction and obtain modified graphene oxide.

3. The room temperature curing high temperature resistant epoxy resin composition according to claim 2, characterized in that During the stirring process, a soluble copper salt accounting for 0.1 to 0.5 times the mass of the polyethyleneimine is also added.

4. The room temperature curing high temperature resistant epoxy resin composition according to claim 1, characterized in that The preparation method of the boron-modified epoxy resin comprises: Bisphenol A diglycidyl ether and formaldehyde are mixed at a molar ratio of 1:1.1-1.3, and n-butanol is added in an amount of 5-8 times the volume of bisphenol A diglycidyl ether. After stirring and mixing, the temperature is raised to 60-80°C, and 0.2-0.5 mol / L ammonia water in an amount of 2%-5% by mass of bisphenol A diglycidyl ether is added as a catalyst to react to obtain an intermediate. The intermediate is mixed with boric acid in a mass ratio of 2 to 5:1, and the temperature is raised to react to obtain a boron-modified epoxy resin.

5. The room temperature curing high temperature resistant epoxy resin composition according to claim 1, characterized in that The curing agent includes at least one of ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, polyetheramine, m-phenylenediamine, diphenylmethanediamine, isophoronediamine, polyamide, phthalic anhydride, and tetrahydrophthalic anhydride.

6. The room temperature curing high temperature resistant epoxy resin composition according to claim 1, characterized in that The inorganic filler includes at least one of calcium carbonate, titanium dioxide, silicon dioxide and talc with a mesh size of 1000-3000.

7. The room temperature curing high temperature resistant epoxy resin composition according to claim 1, characterized in that The diluent includes at least one of phenyl glycidyl ether, butyl glycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, and trimethylolpropane triglycidyl ether.

8. The room temperature curing high temperature resistant epoxy resin composition according to claim 1, characterized in that: The defoaming agent includes at least one of an organosilicon defoaming agent, a polyether defoaming agent, and a mineral oil defoaming agent.

9. A method for preparing a room temperature curing high temperature resistant epoxy resin composition according to any one of claims 1 to 8, characterized in that: include, Boron-modified epoxy resin, modified graphene oxide, inorganic filler and diluent are stirred and mixed; then amino tetrafunctional epoxy resin, curing agent and defoaming agent are added, stirred and mixed, and vacuum degassed to obtain a flame-retardant epoxy resin adhesive.

10. Use of the room temperature curing high temperature resistant epoxy resin composition according to any one of claims 1 to 8 in an adhesive.