Epoxy packaging film for filter module and preparation method and application thereof

Abstract

The invention provides an epoxy packaging film for a filter module as well as a preparation method and application of the epoxy packaging film. The epoxy packaging film comprises the following components in percentage by mass: 30%-40% of silicon dioxide, 24%-42% of epoxy resin, 11%-25% of phenoxy resin, 2%-5% of core-shell rubber, 8%-14% of a phenolic aldehyde curing agent and 0.4%-0.6% of an imidazole accelerant. The epoxy resin is composed of polyurethane modified epoxy resin and low-modulus flexible epoxy resin; the molecular weight of the phenoxy resin is 52000 to 57000; the epoxy packaging film for the filter module prepared according to a specific formula proportion has excellent flexibility and mechanical property, the reliability of packaging of the filter module can be improved, the packaging process of the filter module is simplified, the process period is shortened, and the production cost is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of filter packaging, and in particular relates to an epoxy packaging film for a filter module, a preparation method thereof, and an application thereof. Background Art

[0002] Since the functional area on the surface of the filter chip requires a cavity to ensure the normal operation of the filter component, and other components in the module except the filter do not need a cavity structure and can be directly plastic-sealed, the current packaging of the filter module usually first performs wafer-level packaging on the filter to form a cavity structure, and then performs secondary packaging with other non-filter components; this method increases the packaging cycle and reduces production efficiency. The first wafer-level packaging will affect the thickness of the subsequent filter module packaging, increasing the packaging process and difficulty.

[0003] Existing technology typically encapsulates filter membrane groups by laminating: first, the filter module is laminated to form a cavity in the filter, and non-filter components that do not require a cavity also form a cavity. After lamination, it is first cured, and then the membrane material on the non-filter component is burned open by a laser, and then filled with plastic encapsulation material. However, due to the different sizes and heights of the filter and non-filter components, this places high demands on the performance of the laminating membrane material. If the lamination effect is not good, such as openings due to poor bonding, the product will have poor sealing and affect reliability. Alternatively, if the membrane breaks during the lamination process, subsequent plastic encapsulation material will intrude into the filter cavity, causing failure. Therefore, there is an urgent need for an epoxy encapsulation membrane suitable for filter modules that can effectively encapsulate the filter module.

[0004] That is, how to provide an epoxy packaging film for a filter module, using polyurethane-modified epoxy resin and low-modulus flexible epoxy resin as the matrix resin, and combining phenoxy resin and core-shell rubber to improve the toughness and strength of the epoxy packaging film, thereby simplifying the packaging process of the filter module and improving the packaging reliability, is a technical problem that technical personnel in this field urgently need to solve. Summary of the Invention

[0005] The object of the present invention is to provide an epoxy packaging film for a filter module and a preparation method and application thereof, so as to solve at least one of the above-mentioned technical problems.

[0006] To achieve the above objectives, the first aspect of the present invention provides an epoxy packaging film for a filter module, wherein the epoxy packaging film comprises the following components by mass percentage: 30% to 40% silicon dioxide, 24% to 42% epoxy resin, 11% to 25% phenoxy resin, 2% to 5% core-shell rubber, 8% to 14% phenolic curing agent, and 0.4% to 0.6% imidazole accelerator; the epoxy resin is composed of a polyurethane-modified epoxy resin and a low-modulus flexible epoxy resin; the molecular weight of the phenoxy resin is 52,000 to 57,000.

[0007] In the first aspect, the mass percentage of the polyurethane-modified epoxy resin is 8% to 16%, and the mass percentage of the low modulus flexible epoxy resin is 16% to 28%.

[0008] In the first aspect, the epoxy equivalent of the polyurethane-modified epoxy resin is 230 to 260 g / eq; and the epoxy equivalent of the low modulus flexible epoxy resin is 360 to 390 g / eq.

[0009] In the first aspect, the silica has a particle size D50 of 4.5 μm and a particle size D99 of 10 μm.

[0010] In the first aspect, the phenolic curing agent has a hydroxyl equivalent of 100 to 110 g / eq.

[0011] In the first aspect, the imidazole accelerator includes at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methylimidazole.

[0012] In the first aspect, the core-shell rubber includes at least one of LP-4100 and LP-4200.

[0013] The second aspect of the present invention provides a method for preparing an epoxy encapsulation film for a filter module as described in the first aspect, the preparation method comprising: stirring and mixing the components according to their respective mass percentages, grinding the mixed components into a colloid using a bead mill, and then vacuum degassing to obtain a slurry, applying the slurry to a base film using a coater, and removing the base film after drying to obtain an epoxy encapsulation film; the epoxy encapsulation film has a thickness of 20-50 μm.

[0014] The third aspect of the present invention provides a packaging method for a filter module, which includes: stirring, mixing, bead milling and vacuum degassing the components in the epoxy packaging film for the filter module described in the first aspect to obtain a mixed slurry; coating the mixed slurry on a base film and drying it to obtain an epoxy packaging film on the base film; arranging a layer of silicone soft pad on the surface of the epoxy packaging film, and covering the epoxy packaging film on the top and around the filter module by vacuum hot pressing and bonding it to the substrate below to complete the packaging of the filter module; the conditions of the vacuum hot pressing include: pressure of 0.3~0.9MPa, temperature of 80~120℃, and time of 60~120s.

[0015] A fourth aspect of the present invention provides an application of the epoxy packaging film for a filter module described in the first aspect in the packaging of the filter module.

[0016] Beneficial effects: The present invention provides an epoxy packaging film for a filter module, comprising the following components, measured in percentage by mass: 30% to 40% silicon dioxide, 24% to 42% epoxy resin, 11% to 25% phenoxy resin, 2% to 5% core-shell rubber, 8% to 14% phenolic curing agent, and 0.4% to 0.6% imidazole accelerator; the epoxy resin comprises a polyurethane-modified epoxy resin and a low-modulus flexible epoxy resin; the molecular weight of the phenoxy resin is 52,000 to 57,000; by using the epoxy resin formed by mixing the polyurethane-modified epoxy resin and the low-modulus flexible epoxy resin as a matrix material, the epoxy film has good flexibility and elasticity, can adapt to large deformations and is not easily cracked, and utilizes the structural characteristics of the phenoxy resin to penetrate the matrix material, further improving the toughness and strength of the epoxy packaging film. At the same time, the core-shell rubber, which has the characteristics of a hard core and a soft shell, is mixed with the matrix material to form a "silver particle-nail-anchor" mechanism, effectively inhibiting crack propagation, thereby improving the toughening effect of the material. The present invention prepares an epoxy packaging film for a filter module through a specific formula ratio. The epoxy packaging film has excellent flexibility and mechanical properties, can improve the reliability of the filter module packaging, and can simplify the packaging process of the filter module, shorten the process cycle, and reduce production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1A schematic diagram of the application of an epoxy packaging film for a filter module provided by the present invention in the packaging of the filter module; Figure 2 This is a schematic diagram of the filter module packaging failure in Comparative Example 1 of the present invention; Figure 3 Schematic diagram of filter module packaging failure in Comparative Example 2 of the present invention; Reference numerals: 1. Substrate; 2. Filter components; 3. Non-filter components; 4. Epoxy encapsulation film; 5. Cavity; 6. Plastic encapsulation compound. DETAILED DESCRIPTION

[0019] The present invention will be described in detail below in conjunction with specific embodiments and examples, and the advantages and various effects of the present invention will be more clearly presented. It should be understood by those skilled in the art that these specific embodiments and examples are for illustrating the present invention, rather than for limiting the present invention.

[0020] Throughout this specification, unless otherwise specified, the terms used herein should be understood as having the same meaning as commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In the event of any conflict, the present specification shall take precedence.

[0021] Unless otherwise specified, various raw materials, reagents, instruments and equipment used in the present invention can be purchased from the market or obtained through existing methods.

[0022] The present application provides an epoxy packaging film for a filter module, which comprises the following components by mass percentage: 30% to 40% silicon dioxide, 24% to 42% epoxy resin, 11% to 25% phenoxy resin, 2% to 5% core-shell rubber, 8% to 14% phenolic curing agent, and 0.4% to 0.6% imidazole accelerator; the epoxy resin is composed of polyurethane-modified epoxy resin and low-modulus flexible epoxy resin; the molecular weight of the phenoxy resin is 52,000 to 57,000.

[0023] Specifically, the present invention provides an epoxy packaging film for a filter module, which includes the following components in mass percentage: 30% to 40% silicon dioxide, 24% to 42% epoxy resin, 11% to 25% phenoxy resin, 2% to 5% core-shell rubber, 8% to 14% phenolic curing agent, and 0.4% to 0.6% imidazole accelerator; the epoxy resin is composed of polyurethane-modified epoxy resin and low-modulus flexible epoxy resin; the molecular weight of the phenoxy resin is 52,000 to 57,000; by using the epoxy resin composed of a mixture of polyurethane-modified epoxy resin and low-modulus flexible epoxy resin as the matrix material, the epoxy resin has good flexibility and elasticity, can adapt to large deformation and is not easy to break, and utilizes the structural characteristics of the phenoxy resin to run through the matrix material, further improving the toughness and strength of the epoxy packaging film. At the same time, the core-shell rubber has the characteristics of a hard core and a soft shell and is mixed with the matrix material to form a "silver particle-nail-anchor" mechanism, which effectively inhibits crack propagation, thereby improving the toughening effect of the material. The present invention prepares an epoxy packaging film for a filter module through a specific formula ratio. The epoxy packaging film has excellent flexibility and mechanical properties, can improve the reliability of the filter module packaging, and can simplify the packaging process of the filter module, shorten the process cycle, and reduce production costs.

[0024] It should be noted that in the prior art, the epoxy resin system needs to play a toughening role. On the one hand, it needs to induce the formation of silver streaks, and on the other hand, it needs to have the ability to prevent the expansion of silver streaks. The unmodified epoxy resin matrix is ​​prone to stress concentration at the sharp crack ends of the brittle resin and is quickly destroyed. Therefore, the present invention uses polyurethane-modified epoxy resin and low-modulus flexible epoxy resin as matrix materials, and combines phenoxy resin and core-shell rubber to improve the flexibility and film strength of the material. In addition, the use of phenoxy resin can improve the impact resistance of the epoxy encapsulation film after curing, which facilitates processing.

[0025] In some possible embodiments, the mass percentage of the polyurethane-modified epoxy resin is 8% to 16%, and the mass percentage of the low modulus flexible epoxy resin is 16% to 28%.

[0026] In some possible embodiments, the epoxy equivalent of the polyurethane-modified epoxy resin is 230 to 260 g / eq; and the epoxy equivalent of the low modulus flexible epoxy resin is 360 to 390 g / eq.

[0027] In the present invention, polyurethane-modified epoxy resin and low-modulus flexible epoxy resin are selected as matrix materials to provide basic flexibility and film strength for the epoxy encapsulation film. Specifically, the preferred model of polyurethane-modified epoxy resin is EPU-133L, and the preferred model of low-modulus flexible epoxy resin is AER-9000.

[0028] In some possible embodiments, the silica has a particle size D50 of 4.5 μm and a particle size D99 of 10 μm.

[0029] Furthermore, silica is used as a filler, and by controlling the particle size of silica, the thermal expansion coefficient of the epoxy packaging film is reduced to improve the adhesion with the filter components, thereby preventing foreign matter from entering the cavity of the filter components and affecting the packaging reliability of the filter module.

[0030] In some possible embodiments, the hydroxyl equivalent of the phenolic curing agent is 100 to 110 g / eq.

[0031] In some possible embodiments, the imidazole accelerator includes at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methylimidazole.

[0032] In the present application, the phenolic curing agent is selected to increase the shelf life of the epoxy encapsulation film, and the curing temperature and curing speed of the epoxy encapsulation film can be adjusted by the imidazole accelerator.

[0033] In some possible embodiments, the core-shell rubber includes at least one of LP-4100 and LP-4200.

[0034] Specifically, by utilizing the "hard core" and "soft shell" characteristics of the core-shell rubber, the flexibility and strength of the epoxy encapsulation film are improved, so that the epoxy encapsulation film can not only fit tightly with the filter components during the filter module packaging process, but also prevent the epoxy encapsulation film from breaking under the action of external forces, thereby effectively preventing foreign matter from entering the filter components and improving the reliability of the packaging.

[0035] Based on a general inventive concept, the present application also provides a method for preparing an epoxy packaging film for a filter module as described in the first aspect, the preparation method comprising: stirring and mixing the components according to their respective mass percentages, grinding the mixed components into a colloid using a bead mill, and then vacuum degassing to obtain a slurry, applying the slurry onto a base film using a coater, and removing the base film after drying to obtain an epoxy packaging film; the thickness of the epoxy packaging film is 20-50 μm.

[0036] Based on a general inventive concept, the present application also provides a packaging method for a filter module, which includes: stirring, mixing, bead milling and vacuum degassing the components in the epoxy packaging film for the filter module described in the first aspect to obtain a mixed slurry; coating the mixed slurry on a base film and drying it to obtain an epoxy packaging film on the base film; arranging a layer of silicone soft pad on the surface of the epoxy packaging film, and covering the epoxy packaging film on the top and around the filter module by vacuum hot pressing and bonding it to the substrate below to complete the packaging of the filter module; the conditions of the vacuum hot pressing include: pressure of 0.3~0.9MPa, temperature of 80~120℃, and time of 60~120s.

[0037] Specifically, the present invention mixes the raw material components according to a specific formula ratio, bead mills, and vacuum degasses to obtain a uniformly dispersed mixed slurry. The mixed slurry is then coated on a base film and dried to form an epoxy encapsulation film on the base film. The epoxy encapsulation film is then placed over the filter module to be encapsulated. The base film is then removed, and a layer of silicone cushion is placed to allow vacuum hot pressing of the epoxy encapsulation film. Utilizing the epoxy encapsulation film's excellent film breaking strength and elongation, the epoxy encapsulation film is tightly bonded to the top and sides of the filter module, completing the encapsulation of the filter module. Furthermore, epoxy encapsulation films of varying thicknesses can be prepared to suit different usage environments.

[0038] Based on a general inventive concept, the present application also provides an application of the epoxy packaging film for the filter module described in the first aspect in the packaging of the filter module.

[0039] Specifically, the epoxy packaging film provided in the present invention can be applied to filter module packaging, see Figure 1 A complete filter module includes several filter components 2 and several non-filter components 3. The filter components 2 and non-filter components 3 are indirectly arranged on the substrate 1 through copper pillars or solder balls. The epoxy packaging film 4 is covered on the filter components 2 and non-filter components 3 by vacuum hot pressing and bonded to the substrate 1. After the vacuum hot pressing is completed, the epoxy packaging film 4 attached to the non-filter components 3 is burned open by a laser, thereby forming a cavity 5 only between the filter components 2 and the substrate 1. Finally, the filter module is plastic-sealed with a plastic packaging material 6, so that the plastic packaging material 6 covers the epoxy packaging film 4, the non-filter components 3 and the copper pillars, thereby preventing the plastic packaging material 6 from entering the cavity 5 and improving the reliability of the filter module packaging.

[0040] It should be added that the filter component 2 needs to form a cavity 5 structure with the substrate 1, and no foreign matter can exist in the cavity 5 in order to work normally; while the non-filter component 3 does not need a cavity structure and can also complete its work, so it needs to be filled and sealed with plastic packaging material 6.

[0041] The present application will be further described below in conjunction with specific examples. It should be understood that these examples are intended to illustrate the present application only and are not intended to limit the scope of the present application. The experimental methods in the following examples where specific conditions are not specified are usually measured in accordance with national standards. If there are no corresponding national standards, then the methods are carried out in accordance with general international standards, conventional conditions, or according to the conditions recommended by the manufacturer.

[0042] The raw material components in Examples 1-4 and Comparative Examples 1-6 of the present application are shown in Table 1-2 below in terms of mass percentage: Table 1 Distribution ratio of each group of raw materials in the comparative example Table 2 Distribution ratio of each group of raw materials in the embodiment The performance test of the epoxy encapsulation films provided in Examples 1-5 and Comparative Examples 1-6 was performed. The specific test process is as follows: 1. Membrane tensile strength and elongation at break: Cut a 10mm×50mm film material, tear off the light release film, stick the two ends of the sample with tape, clamp the tape at both ends of the universal material testing machine, tear off the heavy release film, and test the tensile strength and elongation at break of the film; 2. Storage modulus: Reference standard: ASTM E2254-2018, take a sample that is fully cured at 100℃ / 1H+175℃ / 2H, the size of the test sample is 55mm×10mm×2mm, measurement mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10μm, heating rate: 5℃ / min, storage modulus takes the values ​​at 25℃ and 150℃; 3. Glass transition temperature Tg: Reference standard: ASTM E2254-2018, take a sample that is fully cured at 100℃ / 1H + 175℃ / 2H, prepare a test sample with a size of 55mm×10mm×2mm, and measure it using DMA, measurement mode: dual cantilever mode, vibration frequency: 1Hz, amplitude: 10μm, heating rate: 5℃ / min; 4. Coefficient of Thermal Expansion: Method: Reference standard: ASTM E831-2019. Prepare a 5mm×5mm×2mm sample after fully curing at 100°C / 1H + 175°C / 2H. Use TMA (compression mode) to test the thermal expansion coefficient of the sample. TMA parameter settings: preload force: 0.05N, first scan: room temperature to 250°C (heating rate 10°C / min), second scan: room temperature to 250°C (heating rate 10°C / min), and data from the second heating period. The thermal expansion coefficient CTE1 / 2 is taken at temperatures of 40°C-70°C and 180°C-210°C, respectively. 5. Silicon wafer / copper sheet adhesion test method: Transfer a 2mm×2mm film (thickness 20-50μm) between two silicon wafers / copper sheets. After curing at 100℃ / 1H+175℃ / 2H, use a universal tensile testing machine to test the shear bond strength.

[0043] The test results are shown in Table 3 below: Table 3 Test results From the above table we can see that: (1) Comparative Example 1 does not use low modulus flexible epoxy resin. The elongation at break of the epoxy packaging film prepared is small, resulting in low elongation of the epoxy packaging film. During the packaging process, the epoxy packaging film cannot be attached to the substrate and cannot be attached at 90 degrees to the filter components and the substrate. The filter module packaging fails (e.g. Figure 2 As shown in FIG2 ), the polyurethane modified epoxy resin EPU-133L was not used in Comparative Example 2. The prepared epoxy encapsulation film had low tensile strength, and the film would break during the encapsulation process. In the subsequent plastic encapsulation process, the plastic encapsulation material could not be prevented from penetrating into the cavity, resulting in the failure of the filter module encapsulation (as shown in FIG2 ). Figure 3 shown); (2) The amount of silicon dioxide added in Comparative Example 3 exceeds the range specified in this application, the content of polyurethane-modified epoxy resin and low-modulus flexible epoxy resin in Comparative Example 4 is lower than the range specified in this application, and the content of silicon dioxide, polyurethane-modified epoxy resin and low-modulus flexible epoxy resin in Comparative Example 5 all exceeds the range specified in this application, resulting in the prepared epoxy packaging film having a high thermal expansion coefficient and low silicon wafer adhesion and copper sheet adhesion, which cannot meet the packaging requirements of the filter module; (3) Comparative Example 6 uses flexible liquid epoxy resin YX-7400N to replace low modulus flexible epoxy resin AER-9000. Its film tensile strength is low, and the film elongation at break is not high enough. The film may break during the vacuum pressing process. In addition, its expansion coefficient is high, TG is low, and the adhesion between the silicon wafer and the copper sheet is also low, which has a great impact on the reliability of the subsequent filter module packaging. (4) Examples 1-5 use a mixture of low modulus flexible epoxy resin and polyurethane modified epoxy resin. The addition amounts of silica, phenoxy resin and core-shell rubber are all within the optimal usage range, showing good film elongation at break and strength, so that it can completely fit the filter components during the vacuum pressing operation without film breakage. At the same time, its storage modulus is low, which can prevent the molding compound from invading the cavity of the filter components during the subsequent liquid molding process. Its low expansion coefficient, high TG and silicon wafer copper sheet adhesion are all the basis for improving the reliability of filter module packaging.

[0044] To summarize, by using epoxy encapsulation films configured within the specific range of this application as the raw material components, and selecting specific polyurethane-modified epoxy resins and low-modulus flexible epoxy resins, an epoxy encapsulation film with excellent flexibility and elongation can be obtained, thereby completely adhering to the filter components and forming a cavity during the filter module packaging process, preventing foreign matter from penetrating the cavity, and improving the reliability and life of the package; further, by preparing epoxy encapsulation films of different thicknesses, it can be suitable for the packaging of different types of filter modules.

[0045] Finally, it should be noted that the terms "comprises," "includes," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements, but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0046] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0047] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. An epoxy packaging film for a filter module, characterized in that: The epoxy encapsulation film includes the following components by mass percentage: 30% to 40% silicon dioxide, 24% to 42% epoxy resin, 11% to 25% phenoxy resin, 2% to 5% core-shell rubber, 8% to 14% phenolic curing agent, and 0.4% to 0.6% imidazole accelerator; the epoxy resin is composed of polyurethane-modified epoxy resin and low-modulus flexible epoxy resin; the molecular weight of the phenoxy resin is 52,000 to 57,000.

2. The epoxy packaging film for the filter module according to claim 1, characterized in that: The mass percentage of the polyurethane modified epoxy resin is 8% to 16%, and the mass percentage of the low modulus flexible epoxy resin is 16% to 28%.

3. The epoxy packaging film for the filter module according to claim 1, characterized in that: The epoxy equivalent of the polyurethane modified epoxy resin is 230 to 260 g / eq; the epoxy equivalent of the low modulus flexible epoxy resin is 360 to 390 g / eq.

4. The epoxy packaging film for the filter module according to claim 1, wherein: The silica had a particle size D50 of 4.5 μm and a particle size D99 of 10 μm.

5. The epoxy packaging film for the filter module according to claim 1, wherein: The hydroxyl equivalent of the phenolic curing agent is 100 to 110 g / eq.

6. The epoxy packaging film for the filter module according to claim 1, characterized in that: The imidazole accelerator includes at least one of 2-ethyl-4-methylimidazole and 2-phenyl-4-methylimidazole.

7. The epoxy packaging film for the filter module according to claim 1, characterized in that: The core-shell rubber includes at least one of LP-4100 and LP-4200.

8. A method for preparing an epoxy packaging film for a filter module according to any one of claims 1 to 7, characterized in that: The preparation method comprises: The components are stirred and mixed according to their respective mass percentages, and the mixed components are ground into a colloid using a bead mill. The slurry is then vacuum degassed to obtain a slurry, which is coated on a base film using a coater. The base film is removed after drying to obtain an epoxy encapsulation film; the thickness of the epoxy encapsulation film is 20-50 μm.

9. A method for packaging a filter module, characterized in that: The packaging method comprises: Stirring, mixing, bead milling and vacuum degassing the components of the epoxy packaging film for the filter module according to any one of claims 1 to 7 to obtain a mixed slurry; The mixed slurry is coated on a base film and dried to obtain an epoxy encapsulation film on the base film; A layer of silicone pad is provided on the surface of the epoxy packaging film, and the epoxy packaging film is covered on the top and around the filter module by vacuum hot pressing and bonded to the substrate below to complete the packaging of the filter module; the conditions of the vacuum hot pressing include: pressure of 0.3-0.9 MPa, temperature of 80-120°C, and time of 60-120s.

10. Use of the epoxy packaging film for a filter module according to any one of claims 1 to 7 in filter module packaging.

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