Optical module capable of achieving compact configuration by means of element height difference

Abstract

An optical module comprises a shell, an optical coupling piece, a main board, a daughter board, a first light emitting assembly, a second light emitting assembly, a light receiving assembly, a first internal optical fiber, a second internal optical fiber and a third internal optical fiber. The optical coupling piece is arranged on the shell. The mainboard is arranged in the shell. The daughter board is arranged in the shell and is arranged on the top surface of the main board. The first light emitting assembly is arranged on the top surface of the main board. The second light emitting assembly is arranged on the mounting surface of the daughter board, and the mounting surface is opposite to the top surface of the main board. The light receiving assembly is arranged on the top surface of the main board. The first internal optical fiber optically couples the first light emitting component with the optical coupler. The second internal optical fiber optically couples the second light emitting component with the optical coupler. The third internal optical fiber optically couples the optical receiving assembly with the optical coupling member.

Description

Technical Field

[0001] The present invention relates to an optical module, in particular to an optical module comprising an optical transmitting component and an optical receiving component. Background Art

[0002] Co-Packaged Optics (CPO) technology combines electronic integrated circuits (EICs) and photonic integrated circuits (PICs) on a single substrate. CPO brings optical communication components closer to the processing chip, addressing challenges faced by small form-factor pluggable optical transceivers, including thermal management, power consumption, bandwidth, and port density.

[0003] However, there are still some problems to be overcome in the application of co-packaging optical technology in existing optical modules. Summary of the Invention

[0004] The present invention provides an optical module, which helps to solve the problem of applying co-packaging optical technology in existing optical modules.

[0005] The optical module disclosed in the present invention includes a housing, at least one optical coupler, a mainboard, a daughterboard, a first optical transmitter, a second optical transmitter, a light receiving component, at least one first internal optical fiber, at least one second internal optical fiber, and a plurality of third internal optical fibers. The optical coupler is disposed in the housing. The mainboard is disposed in the housing. The daughterboard is disposed in the housing and disposed on the top surface of the mainboard. The first optical transmitter is disposed on the top surface of the mainboard. The second optical transmitter is disposed on the mounting surface of the daughterboard, and the mounting surface is opposite to the top surface of the mainboard. The light receiving component is disposed on the top surface of the mainboard. The first internal optical fiber optically couples the first optical transmitter to the optical coupler. The second internal optical fiber optically couples the second optical transmitter to the optical coupler. The third internal optical fiber optically couples the light receiving component to the optical coupler.

[0006] The optical module disclosed in the present invention further includes a main board, a daughter board, a first light emitting component, a second light emitting component, a light receiving component, an upper cover, a top cover, at least one first internal optical fiber, at least one second internal optical fiber, and a bent optical fiber array. The daughter board is arranged on the top surface of the main board. The first light emitting component is arranged on the top surface of the main board. The second light emitting component is arranged on the mounting surface of the daughter board, and the mounting surface is opposite to the top surface of the main board. The light receiving component is arranged on the top surface of the main board. The upper cover is arranged above the first light emitting component. The top cover is arranged above the second light emitting component. The first internal optical fiber is optically coupled to the first light emitting component. The second internal optical fiber is optically coupled to the second light emitting component, and the second internal optical fiber spans the upper cover. The bent optical fiber array includes multiple third internal optical fibers optically coupled to the light receiving component, and the third internal optical fibers span the top cover.

[0007] The present invention further discloses an optical module comprising a mainboard, a daughterboard, a light emitting assembly, a light receiving assembly, a top cover, at least one internal optical fiber, and a bent optical fiber array. The daughterboard is mounted on the top surface of the mainboard. The light emitting assembly is mounted on the daughterboard's mounting surface, the mounting surface being opposite to the mainboard's top surface. The light receiving assembly is mounted on the mainboard's top surface. The top cover is mounted above the light emitting assembly. The bent optical fiber array comprises a plurality of internal optical fibers optically coupled to the light receiving assembly, with the internal optical fibers extending across the top cover.

[0008] According to the optical module disclosed in the present invention, the first optical emitting component is arranged on the top surface of the main board, and the second optical emitting component is arranged on the mounting surface of the daughter board. The second optical emitting component and the first optical emitting component arranged on the main board are at different horizontal heights, that is, there is a height difference between the two. In addition, the bent optical fiber array optically coupled with the optical receiving component allows the optical fiber to span the first optical emitting component and the second optical emitting component, so that the optical receiving component can be arranged on the main board together with the first optical emitting component, and the two can be respectively located on opposite sides of the daughter board. In this way, it is helpful to configure the optical communication components at multiple positions along the length direction of the optical module, rather than being limited to configuring the optical communication components along the width direction of the optical module, which is conducive to achieving a compact configuration of the optical module.

[0009] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the spirit and principles of the present invention, and to provide further explanation for the protection scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 FIG. 4 is a perspective schematic diagram of an optical module according to an embodiment of the present invention.

[0011] Figure 2 for Figure 1 A three-dimensional schematic diagram of the internal components of the optical module.

[0012] Figure 3 for Figure 2 Schematic diagram of the internal components of the optical module.

[0013] Figure 4 for Figure 2 Schematic side view of the internal components of the optical module.

[0014] Figure 5 for Figure 2 A partially enlarged schematic diagram of the internal components of the optical module.

[0015] Figure 6 for Figure 2 Another partially enlarged schematic diagram of the internal components of the optical module.

[0016] Figure 7 for Figure 2Another partially enlarged schematic diagram of the internal components of the optical module.

[0017] Figure 8 for Figure 7 Schematic cross-section of the internal components of the optical module.

[0018] Figure 9 and Figure 10 To form Figure 8 Schematic diagram of the groove in the motherboard.

[0019] Figure 11 FIG. 1 is a schematic diagram of an optical communication system according to an embodiment of the present invention.

[0020] [Description of Reference Numerals]

[0021] Optical module 1

[0022] Optical communication system 2

[0023] Carrier board 21

[0024] External optical fiber 22

[0025] Application-specific integrated circuit chips 23

[0026] Housing 10

[0027] Optical coupler 20

[0028] Motherboard 30

[0029] Top surface 310

[0030] Groove 320

[0031] Groove 330

[0032] Daughterboard 40

[0033] Mounting surface 410

[0034] Groove 420

[0035] First light emitting assembly 50

[0036] Light emitting unit 510

[0037] Electronic components 520

[0038] Second light emitting module 60

[0039] Light emitting unit 610

[0040] Electronic components 620

[0041] Light receiving component 70

[0042] Light receiving unit 710

[0043] Electronic components 720

[0044] First internal optical fiber 810

[0045] Second internal optical fiber 820

[0046] The third internal optical fiber 830

[0047] Bend Fiber Array 90

[0048] Bearing seat 900

[0049] Upper cover 91

[0050] Top cover 92

[0051] Strip groove 920

[0052] Copper layer CU DETAILED DESCRIPTION

[0053] The following detailed description of the features and advantages of the present invention is intended to enable one of ordinary skill in the art to understand the technical content of the present invention and implement it accordingly. Furthermore, based on the disclosure, scope of protection, and accompanying drawings, one of ordinary skill in the art can readily understand the relevant objectives and advantages of the present invention. The following examples further illustrate the concepts of the present invention and are not intended to limit the scope of the present invention in any way.

[0054] With the increasing demand for higher transmission rates, such as 1.6Tbps, 3.2Tbps, and even 6.4Tbps, CPO technology is widely considered a promising solution. Currently, the Optical Internetworking Forum (OIF) has developed a Co-Packaging Framework for CPO to promote the compatibility of global optical internet products. Providing optical modules that can be configured with a wider range of active and passive components related to optical communications, while meeting the OIF's CPO framework, is one of the challenges currently facing the relevant industry.

[0055] According to an optical module of one embodiment of the present invention, the first optical emitting component is arranged on the top surface of the main board, and the second optical emitting component is arranged on the mounting surface of the daughter board. The second optical emitting component and the first optical emitting component arranged on the main board are at different levels, that is, there is a height difference between the two. In addition, the bent optical fiber array optically coupled with the optical receiving component allows the optical fiber to span the first optical emitting component and the second optical emitting component, so that the optical receiving component can be arranged on the main board together with the first optical emitting component, and the two can be respectively located on opposite sides of the daughter board. In this way, it is helpful to configure the optical communication components at multiple positions along the length direction of the optical module, rather than being limited to configuring the optical communication components along the width direction of the optical module, which is conducive to achieving a compact configuration of the optical module.

[0056] In an optical module according to one embodiment of the present invention, a top cover disposed above the first optical transmission component and a top cover disposed above the second optical transmission component help prevent optical fibers from interfering with the optical transmission of underlying optical communication components. For example, the top cover prevents the second internal optical fiber from interfering with the optical transmission of the first optical transmission component, and the top cover prevents the third internal optical fiber from interfering with the optical transmission of the second optical transmission component.

[0057] Part or all of the technical features disclosed in one or more embodiments of the present invention may be configured in combination to achieve corresponding effects.

[0058] Please refer to Figures 1 to 4 ,in Figure 1 is a three-dimensional schematic diagram of an optical module according to an embodiment of the present invention, Figure 2 for Figure 1 A three-dimensional schematic diagram of the internal components of the optical module, Figure 3 for Figure 2 The exploded diagram of the internal components of the optical module in Figure 4 for Figure 2 Schematic side view of the internal components of the optical module in this embodiment. In this embodiment, the optical module 1 may include a housing 10, an optical coupling element 20, a main board 30, a daughter board 40, a first optical transmitting component 50, a second optical transmitting component 60, a light receiving component 70 and a plurality of internal optical fibers. In order to make the present invention easier to understand, Figure 3 The internal optical fiber is omitted from the illustration. The optical module 1 can be understood as an optical transceiver.

[0059] The housing 10 may be a housing that complies with the CPO architecture established by OIF.

[0060] The optical coupling element 20 may be disposed in the housing 10 . Specifically, at least a portion of the optical coupling element 20 may be exposed to the outside. One end of the internal optical fiber may be coupled to the optical coupling element 20 . Figures 1 to 4The optical module 1 is shown as including three optical coupling elements 20, but the number of the optical coupling elements 20 is not intended to limit the present invention. The optical coupling element 20 can be understood as an optical fiber connector or an active optical cable (AOC).

[0061] The main board 30 is, for example, a printed circuit board assembly (PCBA), and the daughterboard 40 is, for example, another PCBA. The main board 30 and the daughterboard 40 may be disposed within the housing 10, with the daughterboard 40 disposed on the top surface 310 of the main board 30. More specifically, the daughterboard 40 may be secured to the top surface 310 of the main board 30 to allow electrical connection between the circuitry of the daughterboard 40 and the circuitry of the main board 30. Furthermore, the daughterboard 40 may have a mounting surface 410 opposite the top surface 310. More specifically, the mounting surface 410 may be the top surface of the daughterboard 40.

[0062] The first light emitting assembly 50 can be disposed on the top surface 310 of the main board 30. Figure 5 ,for Figure 2 In order to make the present invention easier to understand, Figure 5 Internal optical fibers are omitted from illustration. The first optical transmission assembly 50 may include a light emitting unit 510 and an electronic component 520. The light emitting unit 510 may be, for example, a laser diode, and the electronic component 520 may be, for example, a driver chip. Specifically, the electronic component 520 may be understood as a PIC. The first optical transmission assembly 50 may further include an optical modulator, a wavelength division multiplexer, a collimating lens, and / or a digital signal processor (DSP). Figure 5 Two first light emitting components 50 are shown as an example, and each first light emitting component 50 includes two light emitting units 510 , but the number of the first light emitting components 50 is not intended to limit the present invention.

[0063] The second light emitting assembly 60 can be disposed on the mounting surface 410 of the daughter board 40. Figure 6 ,for Figure 2 Another partially enlarged schematic diagram of the internal components of the optical module in FIG. In order to make the present invention easier to understand, Figure 6 The internal optical fibers are omitted from illustration. The second optical transmission assembly 60 may include a light emitting unit 610 and an electronic component 620. Light emitting unit 610 may be, for example, a laser diode, and electronic component 620 may be, for example, a driver chip. Specifically, electronic component 620 may be understood as a PIC. The second optical transmission assembly 60 may also include an optical modulator, a wavelength division multiplexer, a collimating lens, and / or a DSP. Figure 6 Two second light emitting components 60 are shown as an example, and each second light emitting component 60 includes two light emitting units 610 , but the number of the second light emitting components 60 is not intended to limit the present invention.

[0064] The light receiving assembly 70 can be disposed on the top surface 310 of the main board 30. Figures 6 to 8 ,in Figure 7 for Figure 2 Another partially enlarged schematic diagram of the internal components of the optical module, and Figure 8 for Figure 7 Schematic cross-section of the internal components of the optical module. The optical receiving assembly 70 may include an optical receiving unit 710 and an electronic component 720. The optical receiving unit 710 may be, for example, a photodiode, and the electronic component 720 may be, for example, a transimpedance amplifier. Specifically, the electronic component 720 may be understood as an EIC. The optical receiving assembly 70 may also include a wavelength division multiplexer (WDM) and / or a DSP. Figure 7 and Figure 8 Eight light receiving components 70 are shown as an example, and each light receiving component 70 includes four light receiving units 710, but the number of light receiving components 70 is not intended to limit the present invention. Figure 7 and Figure 8 The figure also shows eight light receiving components 70 arranged in a double row with four components forming one row, but the present invention is not limited thereto.

[0065] The internal optical fiber may include a first internal optical fiber 810 optically coupling the first light emitting assembly 50 to the optical coupler 20, a second internal optical fiber 820 optically coupling the second light emitting assembly 60 to the optical coupler 20, and a third internal optical fiber 830 optically coupling the light receiving assembly 70 to the optical coupler 20. The optical signal generated by the first light emitting assembly 50 may be transmitted to the external optical fiber via the first internal optical fiber 810 and the optical coupler 20. The optical signal generated by the second light emitting assembly 60 may be transmitted to the external optical fiber via the second internal optical fiber 820 and the optical coupler 20. The optical signal transmitted by the external optical fiber may be received by the light receiving assembly 70 via the optical coupler 20 and the third internal optical fiber 830. Figure 2 Four first internal optical fibers 810 , four second internal optical fibers 820 , and eight third internal optical fibers 830 are exemplarily depicted, and the third internal optical fibers 830 may be ribbon optical fibers, but the number of optical fibers is not intended to limit the present invention.

[0066] In some embodiments, the first optical transmitting assembly 50 and the second optical transmitting assembly 60 can be understood as a transmitting optical sub-assembly (TOSA), and the optical receiving assembly 70 can be understood as a receiving optical sub-assembly (ROSA).

[0067] According to one embodiment of the present invention, the second light emitting component 60 and each of the first light emitting component 50 and the light receiving component 70 may be located at different heights. Figure 4 As shown, the first optical emitting assembly 50 and the optical receiving assembly 70 are disposed on the top surface 310 of the main board 30 at a lower level. In contrast, the second optical emitting assembly 60 is disposed on the mounting surface 410 of the daughter board 40 at a higher level.

[0068] According to one embodiment of the present invention, the third internal optical fiber 830 may be included in a bent optical fiber array, and the bent optical fiber array is optically coupled to the light receiving assembly 70. Figure 7 and Figure 8 As shown, the bent optical fiber array 90 may include a support base 900 and a third inner optical fiber 830. The support base 900 accommodates the third inner optical fiber 830 and bends the third inner optical fiber 830.

[0069] According to one embodiment of the present invention, the second light emitting component 60 may be further away from the optical coupler 20 than the first light emitting component 50, and the light receiving component 70 may be further away from the optical coupler 20 than the second light emitting component 60. More specifically, along the length direction of the optical module 1, the first light emitting component 50, the second light emitting component 60, and the light receiving component 70 are sequentially arranged from the optical coupler 20.

[0070] Because the second optical transmitter assembly 60 is mounted on the daughterboard 40, it is located at a different level than the first optical transmitter assembly 50 mounted on the mainboard 30, i.e., there is a height difference between the second optical transmitter assembly 60 and the first optical transmitter assembly 50. Furthermore, the bent optical fiber array 90 optically coupled to the optical receiver assembly 70 allows optical fibers to span between the first optical transmitter assembly 50 and the second optical transmitter assembly 60. This allows the optical receiver assembly 70 to be mounted on the mainboard 30 together with the first optical transmitter assembly 50, with both being located on opposite sides of the daughterboard 40. This facilitates the configuration of optical communication components in multiple locations along the length of the optical module 1, rather than being limited to configuration along the width of the optical module 1. This facilitates a compact configuration of the optical module 1.

[0071] According to one embodiment of the present invention, the optical module 1 may further include an upper cover 91 disposed above the first light emitting component 50. Figure 2 As shown, the second internal optical fiber 820 spans the upper cover 91 to optically couple with the second optical emitting assembly 60. In addition, the optical module 1 may further include a top cover 92 disposed above the second optical emitting assembly 60. Figure 2 As shown, the third internal optical fiber 830 spans the top cover 92 to optically couple with the optical receiving assembly 70. The upper cover 91 and the top cover 92 help prevent the optical fibers from interfering with the optical transmission of the optical communication components located below. For example, the upper cover 91 prevents the second internal optical fiber 820 from interfering with the optical transmission of the first optical transmitting assembly 50, and the top cover 92 prevents the third internal optical fiber 830 from interfering with the optical transmission of the second optical transmitting assembly 60.

[0072] According to one embodiment of the present invention, the top cover 92 may have a strip groove 920, such as Figure 2 and Figure 3 As shown, the third internal optical fiber 830 is disposed in the strip-shaped groove 920 . Figure 3 The top cover 92 is exemplarily shown as having four strip grooves 920 , which respectively accommodate four third inner optical fibers 830 in the form of ribbon optical fibers. However, the number of the strip grooves 920 is not intended to limit the present invention.

[0073] According to one embodiment of the present invention, the main board 30 may have a groove 320 located on the top surface 310. Figure 3 and Figure 5 As shown, at least a portion of the first light emitting assembly 50 may be disposed in the recess 320 . More specifically, the electronic component 520 of the first light emitting assembly 50 may be disposed in the recess 320 .

[0074] According to one embodiment of the present invention, the daughter board 40 may have a groove 420 located on the mounting surface 410. Figure 3 and Figure 6 As shown, at least a portion of the second light emitting assembly 60 may be disposed in the recess 420 . More specifically, the electronic component 620 of the second light emitting assembly 60 may be disposed in the recess 420 .

[0075] According to one embodiment of the present invention, the main board 30 may have a groove 330 located on the top surface 310. Figure 4 and Figure 8 As shown, at least a portion of the light receiving assembly 70 may be disposed in the groove 330. More specifically, the electronic component 720 of the light receiving assembly 70 may be disposed in the groove 330. The depth of the groove 330 may be greater than half the thickness of the mainboard 30.

[0076] The grooves 320 , 330 and 420 can reduce the wiring length, thereby helping to reduce signal transmission loss between electronic components.

[0077] According to one embodiment of the present invention, the depth of groove 320 may be greater than half the thickness of mainboard 30, the depth of groove 330 may be greater than half the thickness of mainboard 30, and the depth of groove 420 may be greater than half the thickness of daughterboard 40. Furthermore, if the substrate (mainboard 30 or daughterboard 40) is a multi-layer structure, a majority of the substrate may be removed by CNC machining, and then CO2 laser machining may be performed to ensure that the copper layer CU in the substrate is exposed. Figure 9 and Figure 10 To form Figure 8 Schematic diagram of the groove in the motherboard.

[0078] According to one embodiment of the present invention, the two light receiving components 70 may be located at different heights. Figure 8As shown, the light receiving components 70 in the front row are arranged on a thinner supporting seat, and the light receiving components 70 in the back row are arranged on a thicker supporting seat, so that the light receiving components 70 in the front row are lower than the light receiving components 70 in the back row.

[0079] Figure 11 FIG. 2 is a schematic diagram of an optical communication system according to an embodiment of the present invention. The optical communication system 2 may include: Figure 1 The optical module 1 is shown, and the optical module 1 can be fixed on a carrier board 21 containing an application-specific integrated circuit (ASIC) chip 23. The optical interface of the optical module 1 can be adapted to the external optical fiber 22, and the electrical interface of the optical module 1 can be electrically connected to the ASIC chip 23. Figure 11 The optical communication system 2 exemplarily includes a total of sixteen optical modules 1 , wherein each optical module 1 can have a signal transmission rate of 3.2 Tbps, and the ASIC chip 23 can have a signal transmission rate of 51.2 Tbps.

Claims

1. An optical module, characterized in that: Include: a housing; At least one optical coupling element is disposed on the housing; a mainboard disposed in the housing; a daughterboard disposed in the housing and on a top surface of the mainboard; a first light emitting component, disposed on the top surface of the mainboard; a second light emitting assembly disposed on a mounting surface of the daughter board, wherein the mounting surface is opposite to the top surface of the main board; a light receiving component, disposed on the top surface of the mainboard; At least one first internal optical fiber optically couples the first light emitting assembly to the at least one optical coupling element; At least one second internal optical fiber optically coupling the second light emitting assembly to the at least one optical coupling element; as well as A plurality of third internal optical fibers optically couple the light receiving component to the at least one optical coupling element.

2. The optical module according to claim 1, wherein: The optical module is based on a co-packaged optical structure.

3. The optical module according to claim 1, wherein: The second light emitting component is located at a different height from that of the first light emitting component and the light receiving component.

4. The optical module according to claim 1, wherein: The plurality of third internal optical fibers are included in a bent optical fiber array, and the bent optical fiber array is optically coupled to the light receiving component.

5. The optical module according to claim 1, wherein: The second light emitting component is further away from the optical coupling element than the first light emitting component, and the light receiving component is further away from the optical coupling element than the second light emitting component.

6. The optical module according to claim 1, wherein: The main board has a groove on the top surface. At least a portion of the first light emitting component is disposed in the groove. The depth of the groove is greater than half of the thickness of the main board.

7. The optical module according to claim 1, wherein: The invention further comprises an upper cover disposed above the first light emitting component, wherein the at least one second internal optical fiber spans the upper cover.

8. The optical module according to claim 1, wherein: The daughter board has a groove located on the mounting surface. At least a portion of the second light emitting component is disposed in the groove. The depth of the groove is greater than half of the thickness of the daughter board.

9. The optical module according to claim 1, wherein: The invention further comprises a top cover disposed above the second light emitting assembly, wherein the plurality of third internal optical fibers span the top cover.

10. The optical module according to claim 9, wherein: The top cover has a strip-shaped groove, and the plurality of third internal optical fibers are arranged in the strip-shaped groove.

11. The optical module according to claim 1, wherein: The main board has a groove located on the top surface. At least a portion of the light receiving component is disposed in the groove. The depth of the groove is greater than half of the thickness of the main board.

12. An optical module, characterized in that: Include: a motherboard; a daughter board, disposed on a top surface of the main board; a first light emitting component, disposed on the top surface of the mainboard; a second light emitting assembly disposed on a mounting surface of the daughter board, wherein the mounting surface is opposite to the top surface of the main board; a light receiving component, disposed on the top surface of the mainboard; a top cover, disposed above the first light emitting assembly; a top cover, disposed above the second light emitting assembly; at least one first internal optical fiber optically coupled to the first optical transmission assembly; At least one second internal optical fiber optically coupled to the second light emitting assembly, and the at least one second internal optical fiber spans the upper cover; as well as A bent optical fiber array includes a plurality of third internal optical fibers optically coupled to the light receiving component, and the plurality of third internal optical fibers span the top cover.

13. The optical module according to claim 12, wherein: The optical module is based on a co-packaged optical structure.

14. The optical module according to claim 12, wherein: The second light emitting component is located at a different height from that of the first light emitting component and the light receiving component.

15. The optical module according to claim 12, wherein: The main board has a groove on the top surface. At least a portion of the first light emitting component is disposed in the groove. The depth of the groove is greater than half of the thickness of the main board.

16. The optical module according to claim 12, wherein: The daughter board has a groove located on the mounting surface. At least a portion of the second light emitting component is disposed in the groove. The depth of the groove is greater than half of the thickness of the daughter board.

17. The optical module according to claim 12, wherein: The top cover has a strip-shaped groove, and the plurality of third internal optical fibers are arranged in the strip-shaped groove.

18. The optical module according to claim 12, wherein: The main board has a groove located on the top surface. At least a portion of the light receiving component is disposed in the groove. The depth of the groove is greater than half of the thickness of the main board.

19. An optical module, characterized in that: Include: a motherboard; a daughter board, disposed on a top surface of the main board; a light emitting component disposed on a mounting surface of the daughter board, wherein the mounting surface is opposite to the top surface of the main board; a light receiving component, disposed on the top surface of the mainboard; a top cover, disposed above the light emitting assembly; as well as A bent optical fiber array includes a plurality of inner optical fibers optically coupled to the light receiving component, and the plurality of inner optical fibers span the top cover.

20. The optical module according to claim 19, wherein: The top cover has a strip-shaped groove, and the plurality of internal optical fibers are arranged in the strip-shaped groove.

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