Optical module cold plate assembly, optical module heat dissipation equipment and electronic equipment

Abstract

The invention relates to the technical field of electronic equipment, provides an optical module cold plate assembly, and can solve the problem that in the prior art, it cannot be guaranteed that each optical module of an access system can be in full contact with a cold plate, and heat dissipation cannot be achieved. The optical module cold plate assembly comprises at least one cold plate; and the floating tolerance heat conduction assembly is hung on the cold plate in a floating manner, is arranged between the cooling surface of the cold plate and the heat dissipation surface of the optical module, and is in contact with the cooling surface and the heat dissipation surface of the optical module. According to the invention, the floating tolerance heat conduction assembly is hung on the cold plate in a floating manner, and the relative position of the floating tolerance heat conduction assembly and the cold plate can be automatically adjusted while the optical module is inserted into the accommodating cavity, so that the tolerance in the manufacturing and assembling processes can be absorbed, and the floating tolerance heat conduction assembly is ensured to be tightly attached to the heat dissipation surface of the optical module and the cooling surface of the cold plate. Therefore, an air gap caused by tolerance between the cooling surface of the cold plate and the heat dissipation surface of the optical module can be effectively reduced, and the heat conduction efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an optical module cold plate assembly, an optical module heat dissipation device, and an electronic device. Background Art

[0002] With the advancement of 5G, the domestic market demand for optical modules is increasing. For example, in the construction of large data centers, optical modules are a key component in achieving the Internet of Everything. Currently, to ensure that network data can meet requirements such as faster speeds and lower latency, optical modules serve as core components of optical communication equipment. However, heat dissipation is also a major challenge that must be overcome.

[0003] Because temperature uniformity in electronic devices affects overall device stability and failure probability, controlling the uniformity of their junction and chip temperatures is crucial. However, existing technologies typically use a single cold plate to bond multiple optical modules at the same height. Due to manufacturing tolerances, this approach cannot guarantee adequate contact and heat dissipation for each optical module connected to the system, and thus cannot guarantee the required heat dissipation performance for each module. Summary of the Invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes an optical module cold plate assembly, an optical module heat dissipation device and an electronic device, which at least solves the problem in the prior art that it is impossible to ensure that each optical module connected to the system can fully contact the cold plate and dissipate heat.

[0005] To achieve the above objectives, an embodiment of the present application provides an optical module cold plate assembly, comprising:

[0006] The floating tolerance heat conducting component can be suspended on the cold plate in a floating manner, and is used to be arranged between the cooling surface of the cold plate and the heat dissipation surface of the optical module, and maintain contact with the cooling surface and the heat dissipation surface of the optical module respectively.

[0007] In some embodiments, the floating tolerance thermally conductive component includes:

[0008] A floating bracket, configured to be disposed between the cooling surface of the cold plate and the heat dissipation surface of the optical module, and capable of being suspended on the cold plate in a floating manner;

[0009] a first tolerance heat conducting member, disposed between the floating support and the cooling surface, and configured to maintain contact with the floating support and the cooling surface respectively;

[0010] The second tolerance heat conductive member is used to be arranged between the floating bracket and the heat dissipation surface of the optical module, and is used to maintain contact with the floating bracket and the heat dissipation surface of the optical module respectively.

[0011] In some embodiments, the first tolerance heat conductive member comprises an elastic heat conductive member, and the elastic heat conductive member is configured to maintain contact with the floating bracket and the cooling surface respectively by generating elastic deformation.

[0012] In some embodiments, the second tolerance thermal conductive member includes a phase change thermal conductive member, which is configured to switch from a solid state to a fluid phase when its temperature exceeds a preset threshold, so as to maintain contact with the floating bracket and the heat dissipation surface of the optical module respectively.

[0013] In some embodiments, the floating bracket includes a bracket body and two hanging ears respectively provided at two ends of the bracket body, and the bracket body can be floatingly hung on the cold plate through the two hanging ears.

[0014] In some embodiments, the two hanging ears are relatively arranged at two ends of the bracket body in a first direction, and the first direction is parallel to the direction of the socket of the cage for inserting the optical module;

[0015] The hanging ear near the socket is provided with an inclined portion at the opening of the accommodating cavity corresponding to the squirrel cage for exposing the heat dissipation surface of the optical module. The inclined portion is inclined relative to the cooling surface, and the distance between the inclined portion and the heat dissipation surface of the optical module in a direction perpendicular to the heat dissipation surface decreases along the direction in which the optical module is inserted into the accommodating cavity.

[0016] In some embodiments, the floating tolerance thermal conductive component further includes: a scratch-resistant thermal conductive film, wherein the scratch-resistant thermal conductive film is disposed between the second tolerance thermal conductive component and the heat dissipation surface of the optical module.

[0017] In some embodiments, a circumferential edge of the scratch-resistant heat-conductive film is fixedly connected to the floating bracket, and a closed space for accommodating the second tolerance heat-conductive component is formed between the circumferential edge of the scratch-resistant heat-conductive film and the floating bracket.

[0018] In some embodiments, the system further comprises: a plurality of support columns; each support column is used to mount each cold plate on a printed circuit board, and to space each cold plate, and to space the cold plates adjacent to the printed circuit board from the printed circuit board;

[0019] The spacing between the printed circuit board and the adjacent cold plates and the spacing between the adjacent cold plates are both used to accommodate the accommodating cavity of the squirrel cage.

[0020] In some embodiments, at least one step surface is provided on the outer periphery of the support column, and each step surface is used to support each cold plate in a one-to-one correspondence.

[0021] In some embodiments, each cold plate may be floatingly mounted with a plurality of floating tolerance heat conducting components, and each floating tolerance heat conducting component mounted on each cold plate is configured to correspond one-to-one to the accommodation cavities of the plurality of cages located on the same layer.

[0022] As another technical solution, the present application also provides an optical module heat dissipation device, including:

[0023] The above-mentioned optical module cold plate assembly provided by this application;

[0024] at least one cage having at least one accommodating cavity for installing the optical module; and

[0025] A printed circuit board is provided, and the optical module cold plate assembly and the squirrel cage are mounted on the printed circuit board.

[0026] In some embodiments, the optical module cold plate assembly further includes a first confluence component and a second confluence component; the first confluence component and the second confluence component are respectively disposed on both sides of each cold plate along the second direction and are fixedly connected to each cold plate; the first confluence component and the second confluence component are both mounted on the printed circuit board, and the second direction is perpendicular to the direction in which the optical module is inserted into the accommodating cavity;

[0027] A cooling channel is provided in each of the cold plates, a main inlet channel is provided in the first confluence component, and a main outlet channel is provided in the second confluence component. The main inlet channel and the main outlet channel are used to communicate with the cooling channels in each of the cold plates. The main inlet channel is used to introduce cooling medium into the cooling channels; the main outlet channel is used to discharge the cooling medium in the cooling channels.

[0028] In some embodiments, it further includes:

[0029] The tray assembly comprises a support plate and at least one side plate arranged at the edge of the support plate, the support plate and each side plate forming a space for accommodating the printed circuit board, the optical module cold plate assembly and the squirrel cage; wherein the printed circuit board is mounted on the support plate; one of the side plates is provided with a plurality of first through holes, and the sockets of each accommodating cavity for inserting the optical module are respectively arranged through each of the first through holes; at least one second through hole is further provided in the side plate and located on the side of all the first through holes close to the support plate, and a plurality of light-emitting components are provided on the surface of the printed circuit board facing away from the squirrel cage, and each of the light-emitting components is respectively opposite to each of the second through holes.

[0030] In some embodiments, a shielding spring is provided on the outer periphery of the socket, the inner periphery of the shielding spring is used for elastically contacting with the optical module, and the outer periphery of the shielding spring is used for elastically contacting with the hole wall of the first through hole.

[0031] In some embodiments, at least one second through hole is further provided in the side plate and located on a side of all the first through holes close to the support plate;

[0032] A plurality of light-emitting elements are provided on a surface of the printed circuit board facing away from the cage, and each of the light-emitting elements is opposite to each of the second through holes in a one-to-one correspondence; the light-emitting elements are used to indicate the working status of the corresponding optical module.

[0033] As another technical solution, the present application further provides an electronic device, characterized in that it includes:

[0034] The above-mentioned optical module heat dissipation device provided in this application.

[0035] Other objects and features of the present application will become clear by reading the specification, claims and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0037] Figure 1 This is an overall structural diagram of the optical module cold plate assembly provided in an embodiment of the present application;

[0038] Figure 2 This is a structural exploded view of the optical module cold plate assembly provided in an embodiment of the present application;

[0039] Figure 3 is a cross-sectional view of the cooling channel of the cold plate in an embodiment of the present application;

[0040] Figure 4 This is a structural exploded view of the cold plate, the first confluence component, the second confluence component, and other components in an embodiment of the present application;

[0041] Figure 5 This is a partial structural diagram of the optical module cold plate assembly provided by an embodiment of the present application when an optical module is installed;

[0042] Figure 6 This is a partial structural diagram of the optical module cold plate assembly provided in an embodiment of the present application when no optical module is installed;

[0043] Figure 7 is a structural diagram of a squirrel cage in an embodiment of the present application;

[0044] Figure 8is a structural exploded view of a floating tolerance thermal conductive component in an embodiment of the present application;

[0045] Figure 9 is a structural diagram of a support column in an embodiment of the present application;

[0046] Figure 10 This is a structural exploded diagram of the optical module heat dissipation device provided in an embodiment of the present application;

[0047] Figure 11 is a partial longitudinal cross-sectional view of the optical module heat dissipation device provided in an embodiment of the present application;

[0048] Figure 12 is a structural diagram of a tray assembly in an embodiment of the present application;

[0049] Figure 13 This is a partial enlarged view of the outer side surface of the side panel of the optical module heat dissipation device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0050] The embodiments of the present application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application.

[0051] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more features. In the description of the present application, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0052] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0053] The disclosure below provides many different embodiments or examples for realizing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. In addition, the present application may repeat reference numbers and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art will appreciate the application of other processes and / or the use of other materials.

[0054] Throughout this specification, reference to terms such as "one embodiment," "certain embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present application. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0055] ICT (Information and Communication Technology) equipment is a general term for hardware devices and technologies used to process, transmit, and store information. In ICT equipment, optical modules are key components of communication networks, used to achieve high-speed data transmission. Optical modules generate a large amount of heat when operating at high speeds, and heat dissipation is particularly problematic in high-density deployments. However, existing technologies typically use a single cold plate to attach multiple optical modules at the same height. Due to manufacturing tolerances, there is no guarantee that each optical module connected to the system will be in full contact with the cold plate and dissipate heat, making it impossible to guarantee that the heat dissipation performance of each optical module meets the requirements.

[0056] To solve the above problems, please also refer to Figure 1 and Figure 2The present embodiment provides an optical module cold plate assembly 100 for dissipating heat from an optical module. The optical module cold plate assembly 100 includes at least one cold plate 1 and a floating tolerance thermal conductive assembly 2. While the present embodiment uses two cold plates 1 as an example, in actual applications, the number of cold plates 1 may be one, three, or more.

[0057] See also Figure 3 , a cooling channel 11 is provided in the cold plate 1 for transmitting a cooling medium. The main function of the cold plate 1 is to conduct heat from the optical module to a cooling medium (such as air, water, coolant, etc.), and to remove heat from the optical module through the cooling medium to prevent the optical module from overheating. The cold plate 1 is made of a material with a high thermal conductivity such as copper or aluminum, for example. In a specific embodiment, the cold plate 1 is a rectangular cold plate, and the cooling channel 11 in the cold plate 1 may include a plurality of mutually parallel straight channels, each of which extends along the length direction of the cold plate 1 and is arranged through the cold plate 1. The cross-sectional shape of each straight channel is circular, but the embodiment of the present application is not limited thereto, and the cross-sectional shape of each straight channel may also be square, rectangular, irregular, etc. In actual applications, cooling channels 11 of any other structure can be adopted according to specific heat dissipation requirements to ensure that the cooling medium flows evenly in the cold plate 1, thereby improving the cooling efficiency.

[0058] In some embodiments, please refer to Figures 1 to 5The optical module cold plate assembly 100 also includes a first conduit component 3a and a second conduit component 3b. The first and second conduit components 3a, 3b are respectively disposed on either side of each cold plate 1 along a second direction (parallel to the Y-axis) and are fixedly connected to each cold plate 1. The first and second conduit components 3a, 3b are both mounted on the printed circuit board 200. The second direction is perpendicular to the direction in which the optical module 5 is inserted into the cage 300 (parallel to the X-axis). The first conduit component 3a is provided with a main inlet channel 31, and the second conduit component 3b is provided with a main outlet channel (not shown in the figure). The main inlet channel 31 and the main outlet channel are used to communicate with the cooling channels 11 in each cold plate 1. The main inlet channel 31 is used to introduce cooling medium into the cooling channels 11, and the main outlet channel is used to discharge the cooling medium from each cooling channel 11. Taking the cooling channel 11 as an example, which includes multiple parallel straight channels, the total inlet channel 31 is provided with an inlet on the outer side surface of the first confluence component 3a, and the inlet is sealedly connected (for example, welded) with a joint 32, and the joint 32 is used to be sealedly connected to the inlet hose 33 of the cold source, and the total inlet channel 31 is provided with an outlet 31 on the inner side surface of the first confluence component 3a (the surface adjacent to the cold plate 1), and the outlet 31 is connected to one end of each straight channel of each cold plate 1; the total outlet channel is provided with an outlet on the outer side surface of the first confluence component 3a, and the outlet is also sealed with a joint 32, and the joint 32 is used to be sealed with the outflow hose 34 of the cold source, and the total outlet channel is provided with an inlet on the inner side surface of the second confluence component 3b (the surface adjacent to the cold plate 1), and the inlet is connected to the other end of each straight channel of each cold plate 1. During the cooling process, the cooling medium provided by the cold source flows into each linear channel of each cold plate 1 through the inlet hose 33 and the main inlet channel 31 in sequence, and then returns to the cold source through the main outlet channel and the outflow hose 34 in sequence, thereby realizing the circulation flow of the cooling medium.

[0059] The first confluence component 3a and the second confluence component 3b can not only achieve uniform distribution of the cooling medium provided by the cold source to the cooling channels 11 in each cold plate 1, and collect and discharge the cooling medium output from the cooling channels 11 in each cold plate 1, but also provide an installation and support basis for each cold plate 1, that is, each cold plate 1 is fixed to the printed circuit board 200 through the first confluence component 3a and the second confluence component 3b. Since the dimensions of the first confluence component 3a and the second confluence component 3b in the direction of the printed circuit board 200 perpendicular to the printed circuit board 200 (in the direction parallel to the Z axis) are larger than those of each cold plate 1, the two can resist the torque generated during the plugging and unplugging of the optical module 5, thereby preventing the cold plate 1 from flipping, tilting forward and backward, etc. during the plugging and unplugging of the optical module 5, reducing the deformation of the cold plate 1 caused by external force or vibration, thereby enhancing the structural stability of the optical module cold plate assembly 100.

[0060] Please also refer to Figures 5 to 7 , each cold plate 1 has a cooling surface, such as Figure 6 As shown, the two opposite surfaces of each cold plate 1 can be used as cooling surfaces, opposite to the heat dissipation surface of the optical module. In some embodiments, the optical module is installed in the accommodating cavity 41 of the cage 300, as shown in FIG. Figure 7 As shown, the accommodating cavity 41 is provided with an opening 411 on the side corresponding to the heat dissipation surface of the optical module. In this case, the cooling surface is used to face the accommodating cavity 41 of the cage 300 (the side where the opening 411 is located). Specifically, the cage 300 is a structure used to fix and support the optical module 5, ensuring that it remains stable during operation and is not displaced by vibration or external forces. Figure 5 FIG. 3 shows a scene in which a portion of the optical module 5 is inserted into the cage 300. Figure 7 As shown, the housing cavity 41 of the cage 300 generally has an opening 411 that exposes the heat dissipation surface of the optical module 5 and a socket 412 for inserting the optical module 5. The cooling surface of the cold plate 1 faces the opening 411 of the housing cavity 41, allowing the cold plate 1 to directly contact the heat dissipation surface of the optical module 5 through the floating tolerance thermal conductive assembly 2, thereby improving heat dissipation efficiency. The socket 412 of the housing cavity 41 facilitates the insertion and removal of the optical module 5, facilitating maintenance and replacement.

[0061] In addition, a cage 300 generally has a plurality of accommodating cavities 41 to accommodate high-density deployment of optical modules 5. Figure 7 Taking the 2*2 cage shown as an example, the cage 300 can accommodate 4 optical modules 5. Among them, "2*2" means that the 4 accommodating cavities 41 of a cage 300 are arranged in two rows and two columns. In this case, Figure 6 As shown, the optical module cold plate assembly 100 of the present application may include Figure 6 Two cold plates 1 are arranged parallel and spaced apart in the vertical direction, and each cold plate 1 is arranged along the second direction (ie Figure 6 The cage 300 may be multiple and extend along the second direction (i.e. Figure 6 The optical module cold plate assembly 100 is arranged in a row (in the left and right directions), with the two accommodating cavities 41 of the upper layer of each cage 300 spaced apart from the two accommodating cavities 41 of the lower layer in the vertical direction. One cold plate 1 is located above each cage 300, with its cooling surface facing the two accommodating cavities 41 of the upper layer of each cage 300, while the other cold plate 1 is located between the two accommodating cavities 41 of the upper layer of each cage 300 and the two accommodating cavities 41 of the lower layer, with its cooling surface facing the two accommodating cavities 41 of the lower layer of each cage 300. Of course, in actual applications, the optical module cold plate assembly 100 of the present application can also be applied to cages 300 of other structures, as long as the cooling surface of the cold plate 1 is opposite the accommodating cavities 41 of the cage 300.

[0062] like Figure 1、 Figure 2 、 Figure 5 、 Figure 6 and Figure 7 As shown, the floating tolerance thermal conductive assembly 2 can be floatably mounted on the cold plate 1, positioned between the cooling surface of the cold plate 1 and the heat dissipation surface of the optical module 5, and maintaining contact with both the cooling surface and the heat dissipation surface of the optical module 5. Specifically, when the optical module 5 is inserted into the receiving cavity 41 of the cage 300 through the socket 412, the heat dissipation surface of the optical module 5 is exposed through the opening 411 of the receiving cavity 41, allowing the floating tolerance thermal conductive assembly 2 to directly contact the heat dissipation surface of the optical module 5. Because the floating tolerance thermal conductive assembly 2 can be floatably mounted on the cold plate 1, it can automatically adjust its relative position to the cold plate 1 as the optical module 5 is inserted into the receiving cavity 41. This can absorb tolerances during the manufacturing and assembly processes, ensuring that the floating tolerance thermal conductive assembly 2 is tightly fitted to the heat dissipation surface of the optical module 5 and the cooling surface of the cold plate 1, respectively. This effectively reduces the air gap between the cooling surface of the cold plate 1 and the heat dissipation surface of the optical module 5 due to tolerances, thereby reducing thermal resistance and improving thermal conductivity efficiency. In addition, by allowing the floating tolerance thermal conductive component 2 to be floatably hung on the cold plate 1, the floating tolerance thermal conductive component 2 will not fall off the cold plate 1 when the optical module 5 is not installed in the accommodating cavity 41. Therefore, there is no need to perform any operations such as disassembly and assembly on the floating tolerance thermal conductive component 2 during the process of plugging and unplugging the optical module 5, thereby simplifying the plugging and unplugging process and improving efficiency.

[0063] In some embodiments, multiple floating tolerance thermal conductive components 2 maintain one-to-one contact with the heat dissipation surfaces of the optical modules 5 in the accommodating cavity 41 of the same layer. Each floating tolerance thermal conductive component 2 can be used to ensure that the heat dissipation surfaces of all optical modules 5 can fully contact and dissipate heat with the cold plate 1. This is particularly suitable for electronic equipment with high-density deployment of optical modules 5, and significantly improves the heat dissipation performance and operating stability of the electronic equipment.

[0064] See also Figure 8 The floating tolerance heat-conducting assembly 2 for realizing the above-mentioned function includes, for example, a floating bracket 21, a first tolerance heat-conducting member 22, and a second tolerance heat-conducting member 23, wherein the floating bracket 21 is used to be arranged between the cooling surface of the cold plate 1 and the heat dissipation surface of the optical module 5, and can be suspended on the cold plate 1 in a floating manner; the first tolerance heat-conducting member 22 is arranged between the floating bracket 21 and the cooling surface of the cold plate 1, and is used to maintain contact with the floating bracket 21 and the cooling surface of the cold plate 1 respectively; the second tolerance heat-conducting member 23 is used to be arranged between the floating bracket 21 and the heat dissipation surface of the optical module 5 when the optical module 5 is inserted into the accommodating cavity 41, and is used to maintain contact with the floating bracket 21 and the heat dissipation surface of the optical module 5 respectively.

[0065] Specifically, the floating bracket 21 provides a mounting and support base for the first tolerance heat conductor 22 and the second tolerance heat conductor 23. Floatingly mounted on the cold plate 1, it can float freely within a certain range (for example, the distance between the floating bracket 21 and the cooling surface of the cold plate 1 is floatable) to accommodate changes in the position of the optical module 5 when inserted into the accommodating cavity 41. The floating bracket 21 can be made of a material with good elasticity and thermal conductivity, such as nickel silver or stainless steel.

[0066] Furthermore, in some embodiments, in order to ensure that the floating bracket 21 can be hoisted on the cold plate 1 without falling off the cold plate 1 on the basis of achieving a floating connection, the floating bracket 21 includes a bracket body 211 and two hanging ears (212a, 212b) respectively arranged at both ends of the bracket body 211, and the bracket body 211 can be floatingly hung on the cold plate 1 through the two hanging ears (212a, 212b).

[0067] In some embodiments, the two hanging ears (212a, 212b) are provided at both side edges of the bracket body 211 in a first direction (i.e., a direction parallel to the X-axis), and the first direction is parallel to the direction of the socket 412 of the accommodating cavity 41 for inserting the optical module 5. In a specific example, the bracket body 211 is, for example, a rectangular plate, which is parallel to the cooling surface of the cold plate 1. The two hanging ears (212a, 212b) are respectively provided at the two short sides of the rectangular plate, and can specifically be a "hook-shaped" structure bent relative to the rectangular plate. The two hanging ears (212a, 212b) are respectively bent upward from both sides from below the cooling surface of the cold plate 1 to above the surface of the cold plate 1 facing away from the bracket body 211, and overlap the surface, so that the bracket body 211 can be suspended on the cold plate 1 in a floating manner.

[0068] The lug 212a near the socket 412 is provided with an inclined portion 212a1 at the opening 411 of the corresponding accommodating cavity 41. The inclined portion 212a1 is tilted relative to the cooling surface of the cold plate 1, and the distance between the inclined portion 212a1 and the heat dissipation surface of the optical module 5 in a direction perpendicular to the heat dissipation surface decreases as the optical module 5 is inserted into the accommodating cavity 41. In other words, the closer the heat dissipation surface of the optical module 5 from the socket 412 is to the socket 412, the smaller the distance between the inclined portion 212a1 and the heat dissipation surface. This allows the optical module 5 to enter the accommodating cavity 41 more smoothly during insertion. The other lug 212b, located farther from the socket 412, can omit the inclined portion 212a1.

[0069] In addition, in some embodiments, both mounting ears (212a, 212b) are further provided with a vertical portion 2121 and an overlapping portion 2122. For mounting ear 212a, the vertical portion 2121 is located on the side of the inclined portion 212a1 away from the bracket body 211 and is integrally connected to the inclined portion 212a1. The vertical portion 2121 is engaged with the side surface of the cold plate 1. For mounting ear 212b, the vertical portion 2121 is integrally connected to the bracket body 211 and engages with the side surface of the adjacent cold plate 1. By means of the vertical portions 2121 of the two mounting ears (212a, 212b) engaging with the two side surfaces of the cold plate 1, the relative position of the floating bracket 21 and the cold plate 1 in the first direction can be limited, so that the floating bracket 21 floats only in a direction perpendicular to the heat dissipation surface. Thus, the floating bracket 21 can only approach or move away from the cooling surface of the cold plate 1 without swaying in the first direction, thereby enhancing the stability of the floating bracket 21. The overlapping portions 2122 of the two hanging ears (212a, 212b) are integrally connected to their respective vertical portions 2121. The overlapping portions 2122 overlap the surface of the cold plate 1 away from the bracket body 211 to ensure that the floating bracket 21 does not fall off the cold plate 1.

[0070] The first tolerance heat conductor 22 is arranged between the floating bracket 21 (i.e., the bracket body 211) and the cooling surface of the cold plate 1, and is used to absorb tolerances while transferring heat, so that the first tolerance heat conductor 22 can maintain good contact with the cooling surfaces of the floating bracket 21 and the cold plate 1 respectively. The first tolerance heat conductor 22 that realizes this function includes, for example, an elastic heat conductor, which is used to maintain contact with the cooling surfaces of the floating bracket 21 and the cold plate 1 respectively by generating elastic deformation. In some embodiments, the elastic heat conductor that realizes the above function includes, for example, graphene, thermally conductive gel or thermal pad, etc. Specifically, the first tolerance heat conductor 22 preferably has high thermal conductivity, is used to transfer heat, ensure heat transfer efficiency, and also has compression resilience to absorb tolerances, ensure that the first tolerance heat conductor 22 can reliably contact the cooling surfaces of the floating bracket 21 and the cold plate 1 respectively, and reduce contact thermal resistance. The shape and size of the first tolerance heat conductive member 22 are, for example, compatible with the bracket body 211 of the floating bracket 21. For example, both are rectangular plates, and the plate surface of the first tolerance heat conductive member 22 substantially completely covers the plate surface of the bracket body 211 to maximize the contact area. Furthermore, to limit the relative position of the first tolerance heat conductive member 22 and the bracket body 211, two limiting flanges 213 can be provided on the two long sides of the bracket body 211. The two limiting flanges 213 and the two hanging ears (212a, 212b) can enclose the first tolerance heat conductive member 22 therein, thereby preventing the first tolerance heat conductive member 22 from shifting or dislodging relative to the bracket body 211 during the pressure process, thereby enhancing the structural stability of the floating tolerance heat conductive assembly 2.

[0071] The second tolerance heat conductor 23 is arranged between the floating bracket 21 and the heat dissipation surface of the optical module 5 to absorb the tolerance so that the second tolerance heat conductor 23 can maintain good contact with the heat dissipation surface of the floating bracket 21 and the optical module 5 respectively. The second tolerance heat conductor 23 that realizes this function includes, for example, a phase change heat conductor, which is used to switch from a solid state to a fluid phase when its temperature exceeds a preset threshold, so as to be able to maintain contact with the heat dissipation surface of the floating bracket 21 and the optical module 5 respectively, thereby increasing the contact area and increasing the contact reliability. The preset threshold is, for example, 45°C, which varies according to the different materials of the phase change heat conductor, and the embodiments of the present application are not limited to this. The phase change heat conductor adopts, for example, a phase change material with high viscosity to reduce the risk of leakage when switching from a solid state to a fluid phase. The enclosed space formed between the scratch-resistant heat-conductive film 24 (described in detail later) and the floating bracket 21 can also be used to seal the second tolerance heat conductor 23 therein to prevent leakage.

[0072] There may be slight tolerances in the manufacturing and installation process of the optical module 5. These tolerances may cause a gap to appear between the heat dissipation surface of the optical module 5 and the floating bracket 21, thereby increasing the thermal resistance. In response to this, the present application adopts a phase-change thermal conductive member, which undergoes a phase change when a certain temperature is reached, for example, from a solid state to a semi-solid state. At this time, it has good fluidity and wettability, so that it can automatically fill the tiny gap between the floating bracket 21 and the heat dissipation surface of the optical module 5 due to tolerance, reduce the contact thermal resistance, and thus ensure good contact with the floating bracket 21 and the heat dissipation surface of the optical module 5. In addition, the optical module 5 may undergo slight displacement due to thermal expansion or mechanical vibration during operation. These dynamic changes may cause poor contact. In response to this, by arranging the phase-change thermal conductive member between the floating bracket 21 and the heat dissipation surface of the optical module 5, it is possible to adapt to these dynamic changes and ensure that stable thermal conductivity performance is always maintained during the operation of the optical module 5.

[0073] The synergistic effect of the first tolerance thermal conductor 22 and the second tolerance thermal conductor 23 can accommodate tolerances between components in the heat transfer path, such as the cold plate 1, the optical module 5, and the cage 300, during the manufacturing and assembly processes. This ensures good contact between the floating bracket 21, the cooling surface of the cold plate 1, and the heat dissipation surface of the optical module 5, thereby quickly transferring heat generated by the optical module 5 to the cooling surface of the cold plate 1 and ensuring efficient heat dissipation. Furthermore, the first tolerance thermal conductor 22 and the second tolerance thermal conductor 23 can jointly adapt to the dynamic changes of the optical module 5 during operation, ensuring stable thermal conductivity. In an embodiment where the first tolerance thermal conductor 22 is an elastic thermal conductor and the second tolerance thermal conductor 23 is a phase change thermal conductor, the elastic thermal conductor can provide a stable thermal conduction path, while the phase change thermal conductor further optimizes contact at high temperatures, ensuring efficient heat conduction. Therefore, the synergistic effect of the elastic thermal conductor and the phase change thermal conductor reduces failures of the optical module 5 caused by poor contact or poor heat dissipation. The present application improves the heat dissipation efficiency of the optical module 5 by adding a floating tolerance heat-conducting component 2, thereby helping to meet the high power consumption and heat dissipation requirements of the high-speed optical module.

[0074] In some embodiments, the floating tolerance thermal conductive component 2 further includes: a scratch-resistant thermal conductive film 24, which is disposed between the second tolerance thermal conductive component 23 and the heat dissipation surface of the optical module 5. The scratch-resistant thermal conductive film 24 has wear resistance and scratch resistance, and is used to ensure that the heat dissipation surface of the optical module 5 remains intact as much as possible during multiple plugging and unplugging processes, thereby reducing poor contact caused by surface damage. At the same time, the thermal conductivity of the scratch-resistant thermal conductive film 24 ensures stable heat conduction. The scratch-resistant thermal conductive film 24 includes, for example, a stainless steel film, a high molecular polymer film, etc., and the thickness of the scratch-resistant thermal conductive film 24 is, for example, less than or equal to 0.05 mm.

[0075] Furthermore, in some embodiments, the circumferential edge of the scratch-resistant thermally conductive film 24 is provided with an adhesive flange 241 for bonding to the floating bracket 21. For example, the flange 241 of the scratch-resistant thermally conductive film 24 can be bonded to the two limiting flanges 213 and the two lugs (212a, 212b). This connection method can form an enclosed space between the scratch-resistant thermally conductive film 24 and the floating bracket 21 for accommodating the second tolerance thermal conductive member 23. On the one hand, the scratch-resistant thermally conductive film 24 can provide an installation and support base for the second tolerance thermally conductive member 23, while effectively preventing the second tolerance thermally conductive member 23 from shifting or falling out when subjected to pressure or vibration. On the other hand, in an embodiment where the second tolerance thermal conductor 23 adopts a phase change thermal conductor, the fluid phase change thermal conductor can be sealed in a closed space to avoid leakage, ensuring that it can still maintain good thermal conductivity at high temperatures, and the scratch-resistant thermal conductive film 24 has a certain elasticity to adapt to the flow of the phase change thermal conductor, ensuring that the phase change thermal conductor can automatically fill the tiny gap between the floating bracket 21 and the heat dissipation surface of the optical module 5 due to tolerance.

[0076] In some embodiments, as Figure 1 、 Figure 4 、 Figure 6 and Figure 9 As shown, the optical module cold plate assembly 100 further includes a plurality of support columns 6. Each support column 6 is used to support each cold plate 1, spacing the cold plates 1 apart, and spacing the cold plates 1 adjacent to the printed circuit board 200 apart from the printed circuit board 200. For example, the cold plate 1 is mounted on a printed circuit board assembly (PCBA) 200. If there is only one cold plate 1, the cold plate 1 is spaced apart from the printed circuit board 200 by the plurality of support columns 6. In other words, the support columns 6 provide a mounting and support base for the cold plate 1 and also form a space between the cold plate 1 and the printed circuit board 200 to accommodate the accommodating cavity 41 of the same layer of each cage 300.

[0077] In the case of multiple cold plates 1, in one example, the multiple cold plates 1 can be arranged in the same layer, that is, the distances between the multiple cold plates 1 and the printed circuit board 200 are the same. In another example, the multiple cold plates 1 can be arranged in different layers, that is, the distances between the multiple cold plates 1 and the printed circuit board 200 are different, and the multiple cold plates 1 are arranged in a sequentially spaced manner in a direction perpendicular to and away from the printed circuit board 200.

[0078] Take the cold plate 1 as an example, which is divided into two and arranged in different layers. Figure 6 and Figure 9 As shown, each support column 6 includes a first segment 61 and a second segment 62 connected in sequence along its axial direction. The first segment 61 supports the printed circuit board 200 and the adjacent cold plate 1, and the second segment 62 supports the two cold plates 1. This allows multiple cold plates 1 to be spaced apart in a direction away from the printed circuit board 200. Spacing spaces are formed between the printed circuit board 200 and the adjacent cold plate 1, as well as between two adjacent cold plates 1, to accommodate the two-layer accommodating cavities 41 of each cage 300. While providing support, each support column 6 can also support each cold plate 1 at different locations, reducing the deflection of each cold plate 1 due to its smaller thickness. As the deployment density of optical modules 5 increases, it is required that the height (dimension parallel to the Z axis) of the optical module heat dissipation device 1000 does not exceed a preset height threshold and that a certain number of optical modules can be arranged. In order to ensure that the height of the optical module heat dissipation device 1000 does not exceed the height threshold under the premise of ensuring the layout of a certain number of optical modules, with the help of the support column 6 and the synergistic effect of the floating tolerance thermal conductive component 2, the deflection of the cold plate 1 of a certain thickness can be controlled within a smaller numerical range, and the height of the optical module heat dissipation device 1000 can be controlled below the height threshold, thereby ensuring optimal plug-in maintenance and meeting the heat dissipation requirements.

[0079] Furthermore, in some embodiments, in order to maintain a certain distance between the printed circuit board 200 and the adjacent cold plates 1 and between each two adjacent cold plates 1 to form the above-mentioned spacing space, the outer periphery of the support column 6 is provided with at least one step surface, each step surface is used to support each cold plate 1 in a one-to-one correspondence, that is, each step surface overlaps with the cooling surface of each cold plate 1. Taking two cold plates 1 as an example, Figure 9 As shown, the outer diameter of the first segment 61 is larger than that of the second segment 62, forming a first stepped surface between the first segment 61 and the second segment 62. This first stepped surface is used to support the cold plate 1 adjacent to the printed circuit board 200. Similarly, the support column 6 also includes a third segment 63, whose outer diameter is smaller than that of the second segment 62, forming a second stepped surface between the second segment 62 and the third segment 63. This second stepped surface is used to support another cold plate 1 not adjacent to the printed circuit board 200. A positioning hole is also provided on the cold plate 1 at a position corresponding to the third segment 63. The third segment 63 is inserted into the positioning hole to define the position of the cold plate 1. By using the stepped surface to support the cold plate 1, the spacing between the printed circuit board 200 and its adjacent cold plate 1, as well as the spacing between two adjacent cold plates 1, can be ensured to be within a preset tolerance range.

[0080] As another technical solution, please also refer to Figure 10 and Figure 11 The present invention also provides an optical module heat dissipation device 1000, comprising an optical module cold plate assembly 100, at least one cage 300, and a printed circuit board 200. The optical module cold plate assembly 100 utilizes the aforementioned optical module cold plate assembly provided in the present invention. The cage 300 has at least one cavity 41 for mounting an optical module 5. The optical module cold plate assembly 100 and the cage 300 are mounted on the printed circuit board 200.

[0081] In some embodiments, as Figure 11 As shown, in the optical module cold plate assembly 100, a threaded hole is provided on the end face of the support column 6 close to one end of the printed circuit board 200, and a mounting hole is correspondingly provided on the printed circuit board 200. The fastening screw 64 passes through the mounting hole and is threadedly connected to the threaded hole of the support column 6, thereby fixing the support column 6 to the printed circuit board 200.

[0082] In some embodiments, please refer to Figures 11 to 13 , the optical module heat dissipation device 1000 further includes: a tray assembly 400 having a support plate 401 and at least one side plate 402 arranged at the edge of the support plate 401, for example Figure 12Three side panels 402 are shown. The support panel 401 and the side panels 402 form a space for accommodating the printed circuit board 200, the optical module cold plate assembly 100 and the cage 300. The printed circuit board 200 is mounted on the support panel 401. One of the side panels 402 is provided with a plurality of first through holes 402a. The sockets 412 of the accommodating cavities 41 are correspondingly arranged in the first through holes 402a. Figure 13 As shown, a cage 300 has two layers of accommodating cavities 41 , with two accommodating cavities 41 on each layer. Therefore, a cage 300 has four sockets 412 . In this case, every four of all the first through holes 402 a correspond one-to-one to the four sockets 412 of a cage 300 .

[0083] Furthermore, in some embodiments, a shielding spring 413 is provided on the periphery of the socket 412. The inner periphery of the shielding spring 413 is configured to elastically contact the optical module, while the outer periphery of the shielding spring 413 is configured to elastically contact the wall of the first through-hole 402a. In this way, the shielding spring 413 can be used to achieve reliable contact between the cage 300 and the tray assembly 400 (i.e., the side panel 402), as well as reliable contact between the cage 300 and the optical module. Furthermore, it can provide a shielding effect between the optical module and the side panel 402 to protect the optical module.

[0084] In some embodiments, as Figure 12 and Figure 13 As shown, at least one second through hole 402b is further provided in the side panel 402 and located on the side (i.e., the lower side) of all the first through holes 402a close to the support plate 401. A plurality of light-emitting elements 7 are provided on the surface (i.e., the lower surface) of the printed circuit board 200 facing away from the cage 300. Each light-emitting element 7 corresponds to each second through hole 402b, so that light can be emitted through the corresponding second through hole 402b. The light-emitting element 7 is used to indicate the working status of the corresponding optical module. Specifically, as Figure 13 As shown, taking a cage 300 having four sockets 412 as an example, four second through-holes 402b are provided below each of the four first through-holes 402a for allowing light emitted by the four light-emitting elements 7 on the printed circuit board 200 corresponding to the four light modules in each cage 300 to pass through in a one-to-one correspondence. A user can observe the light-emitting status of the light-emitting elements 7 inside from the outside of the side panel 402 through the second through-holes 402b.

[0085] As another technical solution, an embodiment of the present application further provides an electronic device, including: the above-mentioned optical module heat dissipation device 1000 provided in an embodiment of the present application.

[0086] It is understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present application, and the present application is not limited thereto. Those skilled in the art may make various modifications and improvements without departing from the spirit and substance of the present application, and such modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. An optical module cold plate assembly, characterized in that: include: at least one cold plate; The floating tolerance heat conducting component can be suspended on the cold plate in a floating manner, and is used to be arranged between the cooling surface of the cold plate and the heat dissipation surface of the optical module, and maintain contact with the cooling surface and the heat dissipation surface of the optical module respectively.

2. The optical module cold plate assembly according to claim 1, wherein: The floating tolerance thermal conductive component comprises: A floating bracket, configured to be disposed between the cooling surface of the cold plate and the heat dissipation surface of the optical module, and capable of being suspended on the cold plate in a floating manner; a first tolerance heat conducting member, disposed between the floating support and the cooling surface, and configured to maintain contact with the floating support and the cooling surface respectively; The second tolerance heat conductive member is used to be arranged between the floating bracket and the heat dissipation surface of the optical module, and is used to maintain contact with the floating bracket and the heat dissipation surface of the optical module respectively.

3. The optical module cold plate assembly according to claim 2, wherein: The first tolerance heat conductive member includes an elastic heat conductive member, and the elastic heat conductive member is configured to maintain contact with the floating bracket and the cooling surface respectively by generating elastic deformation.

4. The optical module cold plate assembly according to claim 2, wherein: The second tolerance heat conductive member includes a phase change heat conductive member, which is used to switch from a solid state to a fluid phase when its temperature exceeds a preset threshold, so as to maintain contact with the floating bracket and the heat dissipation surface of the optical module respectively.

5. The optical module cold plate assembly according to claim 2, wherein: The floating bracket includes a bracket body and two hanging ears respectively arranged at both ends of the bracket body. The bracket body can be floatably hung on the cold plate through the two hanging ears.

6. The optical module cold plate assembly according to claim 5, wherein: The two hanging ears are oppositely arranged at two ends of the bracket body in a first direction, and the first direction is parallel to the direction of the socket of the cage for inserting the optical module; The hanging ear near the socket is provided with an inclined portion at the opening of the accommodating cavity corresponding to the squirrel cage for exposing the heat dissipation surface of the optical module. The inclined portion is inclined relative to the cooling surface, and the distance between the inclined portion and the heat dissipation surface of the optical module in a direction perpendicular to the heat dissipation surface decreases along the direction in which the optical module is inserted into the accommodating cavity.

7. The optical module cold plate assembly according to claim 2, wherein: The floating tolerance heat conductive component further includes a scratch-resistant heat conductive film, and the scratch-resistant heat conductive film is arranged between the second tolerance heat conductive component and the heat dissipation surface of the optical module.

8. The optical module cold plate assembly according to claim 7, wherein: The circumferential edge of the scratch-resistant heat-conductive film is fixedly connected to the floating bracket, and a closed space for accommodating the second tolerance heat-conductive component is formed between the circumferential edge of the scratch-resistant heat-conductive film and the floating bracket.

9. The optical module cold plate assembly according to any one of claims 1 to 8, wherein: Also includes: A plurality of support columns; each support column is used to mount each cold plate on a printed circuit board, and to space each cold plate, and to space the cold plate adjacent to the printed circuit board from the printed circuit board; The spacing between the printed circuit board and the adjacent cold plates and the spacing between the adjacent cold plates are both used to accommodate the accommodating cavity of the squirrel cage.

10. The optical module cold plate assembly according to claim 9, wherein: The outer periphery of the support column is provided with at least one step surface, and each step surface is used to support each cold plate in a one-to-one correspondence.

11. The optical module cold plate assembly according to any one of claims 1 to 8, wherein: Each of the cold plates can be floatingly hung with a plurality of floating tolerance heat conducting components, and each of the floating tolerance heat conducting components hung on each cold plate is used to be arranged in a one-to-one correspondence with the accommodating cavities of the multiple cages located on the same layer.

12. An optical module heat dissipation device, characterized in that: include: The optical module cold plate assembly according to any one of claims 1 to 11; at least one cage having at least one accommodating cavity for installing the optical module; as well as A printed circuit board is provided, and the optical module cold plate assembly and the squirrel cage are mounted on the printed circuit board.

13. The optical module heat dissipation device according to claim 12, characterized in that: The optical module cold plate assembly further includes a first confluence component and a second confluence component; the first confluence component and the second confluence component are respectively arranged on both sides of each cold plate along the second direction and are fixedly connected to each cold plate; the first confluence component and the second confluence component are both mounted on the printed circuit board, and the second direction is perpendicular to the direction in which the optical module is inserted into the accommodating cavity; A cooling channel is provided in each of the cold plates, a main inlet channel is provided in the first confluence component, and a main outlet channel is provided in the second confluence component. The main inlet channel and the main outlet channel are used to communicate with the cooling channels in each of the cold plates. The main inlet channel is used to introduce cooling medium into the cooling channels; the main outlet channel is used to discharge the cooling medium in the cooling channels.

14. The optical module heat dissipation device according to claim 12, characterized in that: Also includes: The tray assembly comprises a support plate and at least one side plate arranged at the edge of the support plate, the support plate and each side plate forming a space for accommodating the printed circuit board, the optical module cold plate assembly and the squirrel cage; wherein the printed circuit board is mounted on the support plate; one of the side plates is provided with a plurality of first through holes, and the sockets of each accommodating cavity for inserting the optical module are respectively arranged through each of the first through holes; at least one second through hole is further provided in the side plate and located on the side of all the first through holes close to the support plate, and a plurality of light-emitting components are provided on the surface of the printed circuit board facing away from the squirrel cage, and each of the light-emitting components is respectively opposite to each of the second through holes.

15. The optical module heat dissipation device according to claim 14, characterized in that: A shielding spring is provided on the outer periphery of the socket, the inner periphery of the shielding spring is used for elastically contacting with the optical module, and the outer periphery of the shielding spring is used for elastically contacting with the hole wall of the first through hole.

16. The optical module heat dissipation device according to claim 14, characterized in that: At least one second through hole is further provided in the side plate and located on a side of all the first through holes close to the support plate; A plurality of light-emitting elements are provided on a surface of the printed circuit board facing away from the cage, and each of the light-emitting elements is opposite to each of the second through holes in a one-to-one correspondence; the light-emitting elements are used to indicate the working status of the corresponding optical module.

17. An electronic device, characterized in that: include: The optical module heat dissipation device according to any one of claims 12 to 16.

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