Heat dissipation device of case and heat dissipation control method

Abstract

The invention provides a case heat dissipation device and a heat dissipation control method.The case heat dissipation device comprises a heat dissipation cooling mechanism installed on the side face of a case body, the heat dissipation cooling mechanism comprises a heat dissipation motor and heat dissipation blades, an output shaft of the heat dissipation motor is connected with a guiding circular truncated cone, and a guiding spiral groove is formed in the surface circumference of the guiding circular truncated cone; a traction spring is arranged in the end, close to the heat dissipation motor, of the guide spiral groove, the end of the traction spring is connected with a guide sliding base, and the top face of the guide sliding base abuts against the bottom face of the heat dissipation blade. And targeted cooling is carried out while internal covering cooling of the case main body is realized, so that the pertinence is improved, and the internal temperature of the case main body is rapidly cooled.

Description

[0001] This application is a divisional application based on the original application with application number 202410716128.1, application date June 4, 2024, and invention name “A computer case and cooling system”. Technical Field

[0002] The present invention relates to the field of computer equipment, and in particular to a heat dissipation device and a heat dissipation control method for a chassis. Background Art

[0003] The design of computer cases and their cooling systems is constantly evolving. For example, by optimizing the air duct layout and fan configuration inside the case, the air circulation efficiency inside the case is improved, thereby reducing the temperature of the hardware. Alternatively, through the high thermal conductivity and fluidity of liquids, efficient heat dissipation of core components such as the CPU and GPU can be achieved.

[0004] According to a spring-type double-circulation supercomputer cooling system disclosed in Chinese patent number "CN110366359B", it includes a supercooler, a circulation pump, a blade chassis, a condenser, a secondary cooling system, as well as pipes and valves. The evaporative cooling medium is stored in the supercooler, the blade chassis and the connected pipes. The cooling system is divided into two interconnected cycles: the steam in the blade chassis rises to the condenser through the gas collecting pipe and the gas collecting valve to condense into liquid, and flows into the blade chassis through the return pipe to realize steam self-circulation; the high-temperature medium in the blade chassis enters the supercooler through the overflow pipe, and after cooling, flows into the blade chassis through the liquid inlet pipe to realize controllable circulation of the evaporative cooling medium. The present invention uses medium phase change and forced convection for heat exchange, which better solves the problem of equipment heat dissipation difficulties; it is energy-saving and environmentally friendly, has no external electromagnetic radiation, no dust pollution, and low noise; and has low operating costs and high heat dissipation efficiency, which can increase equipment placement density and improve the utilization rate of the computer room.

[0005] According to a computer dust-proof cooling system disclosed in Chinese patent number "CN114816007B", which relates to the field of computer technology, the following solution is proposed to address the problem of poor working performance of existing computers. The system includes a water tank and multiple chassis fixed on the top of the water tank. Multiple air guide holes are opened on both sides of the chassis, and air guide components are provided inside the air guide holes. A cooling component for cooling the chassis is provided inside the water tank. The present invention can help the computer to quickly and effectively dissipate heat, and can prevent external dust and debris from adhering to the computer host through the heat dissipation components, thereby effectively improving the dust-proof performance of the computer. The computer's dust-proof components can also be intermittently cleaned to prevent the dust-proof components from being blocked, thereby extending the battery life.

[0006] The above patent documents and prior art have the following technical problems when used:

[0007] Problem 1: Computer case cooling systems typically use a unified heat dissipation method, which fails to provide targeted cooling based on the temperature differences of components in different areas within the case. This results in some high-temperature areas not being effectively cooled, affecting overall performance.

[0008] The second problem is that there is a lack of effective isolation between components inside the chassis, which causes the heat generated by high-temperature components to easily affect surrounding components, causing the temperature inside the entire chassis to rise and increasing the difficulty of heat dissipation.

[0009] Problem three: Traditional cooling fans use a fixed structure and cannot automatically adjust the cooling effect according to the temperature changes inside the chassis. This results in unstable cooling efficiency when the temperature fluctuates greatly, and cannot meet the demand for efficient cooling.

[0010] Problem 4: The cooling systems of computer chassis are usually independent of each other, making it impossible to share cooling resources. This results in the need for more cooling equipment and resources when centrally cooling multiple chassis, resulting in a waste of resources.

[0011] Problem five: The heat generated inside the chassis is usually regarded as waste heat that needs to be removed and is not effectively utilized, resulting in energy waste. At the same time, in an emergency, the lack of backup power may cause the equipment to not work properly. Summary of the Invention

[0012] Technical problems solved

[0013] In view of the shortcomings of the prior art, the present invention provides a heat dissipation device and heat dissipation control method for a chassis, which solves the following problems:

[0014] 1. The temperature distribution of components inside the chassis is uneven, and there is a lack of targeted cooling measures;

[0015] 2. The components inside the chassis affect each other, making it difficult to achieve effective thermal insulation;

[0016] 3. The cooling fan has a fixed structure, which limits the cooling efficiency;

[0017] 4. The cooling systems of the chassis are independent of each other and cannot be shared;

[0018] 5. The heat inside the chassis is not effectively utilized, resulting in energy waste.

[0019] Technical Solution

[0020] To achieve the above objectives, the present invention is implemented through the following technical solutions: a computer case, comprising a case body and a case backplate, a control mainboard being provided inside the case body, heat dissipation cooling mechanisms being installed on the sides of the control mainboard and the case body, a heat dissipation cooling mechanism being connected to the surface of the control mainboard with an energy storage mechanism, a partitioned cooling mechanism being provided inside the case body, the partitioned cooling mechanism comprising a feed pipe and a cooling pipe, the cooling pipes being provided in multiple groups, a multi-way control valve being connected between adjacent ends of the cooling pipes, the feed pipe being connected to the inside of the feed pipe through the multi-way control valve, a partition plate being provided vertically inside the cooling pipe, cooling air guide mechanisms being symmetrically distributed on both sides of the surface of the cooling pipe, and sealing covers being provided at the ends of the cooling pipes.

[0021] Preferably, the heat dissipation cooling mechanism includes a heat dissipation motor and heat dissipation blades, the output shaft of the heat dissipation motor is connected to a guide frustum, a guide screw groove is opened on the circumference of the guide frustum surface, a traction spring is provided inside the guide screw groove close to the end of the heat dissipation motor, the end of the traction spring is connected to a guide slide, and the top surface of the guide slide is against the bottom surface of the heat dissipation blade.

[0022] Preferably, blade guide grooves are staggeredly provided on the back of the heat dissipation blades, an air guide platform is provided at the end of the guide cone, and air guide strips are distributed circumferentially on the surface of the air guide platform. A fan base is provided on the outside of the heat dissipation motor, and the heat dissipation motor is bolted to the inner wall of the fan base, and the fan base is screwed to the inner surface of the chassis body.

[0023] Preferably, the energy storage mechanism includes a heat collection plate and an energy storage component. The heat collection plate is located on one side of the heat dissipation cooling mechanism on the surface of the control mainboard. An energy heat pipe is connected to the surface of the heat collection plate. An energy storage component is provided on one side of the bottom surface of the chassis body. The top surface of the energy storage component is connected to the bottom end of the energy heat pipe. A heat conduction hole is provided on the surface of the heat collection plate where the surface overlaps with the energy heat pipe.

[0024] Preferably, a chassis back plate is bolted to the front of the chassis body, and cooling connection grooves for engaging with cooling pipes are provided on the main side of the chassis and the surface of the chassis back plate. Temperature monitoring components are provided at multiple positions inside the chassis body, and the temperature monitoring components are electrically connected to the partition cooling mechanism and the heat dissipation cooling mechanism.

[0025] Preferably, the inner back and both side surfaces of the chassis body are provided with chassis flow guide main grooves, chassis flow guide arc grooves are symmetrically distributed on both sides of the chassis flow guide main grooves, and the chassis flow guide arc grooves are evenly arrayed along the vertical direction of the chassis body, and the chassis flow guide arc grooves and the chassis flow guide main grooves are both blind grooves with the same groove depth.

[0026] Preferably, electrical components are connected to the surface of the control main board, a connection interface is provided on one side of the outer surface of the chassis body, and fan-shaped ventilation grooves are provided on the side surface of the chassis body away from the heat dissipation cooling mechanism, and the fan-shaped ventilation grooves are located between adjacent chassis guide arc grooves.

[0027] Preferably, the bottom surface of the cooling pipe is a plane, the top surface is an arc surface, the areas of the adjacent cooling pipe orifices are the same, the connection position between the cooling pipe and the multi-way control valve is sealed, and the end of the cooling pipe away from the multi-way control valve is against the inner wall of the chassis body.

[0028] Preferably, the cooling air guide mechanisms on both sides of the same cooling pipe surface are independently controlled, and the cooling air guide mechanisms on the same side of the same cooling pipe surface are synchronously controlled.

[0029] On the other hand, a cooling system suitable for the above-mentioned computer case is also provided, comprising:

[0030] The heat dissipation cooling system controls the heat dissipation cooling mechanism so that the heat dissipation motor can autonomously adjust its rotation speed according to the temperature monitoring status of the temperature monitoring component. At the same time, the heat dissipation blades can self-adjust their torsion angle to autonomously adjust and guide the air intake volume.

[0031] The partition cooling system uses the cooling pipes of the partition cooling mechanism to partition the chassis body, and the installation position of the temperature monitoring component corresponds to the partition position. The partition status is synchronized to the control system for feedback;

[0032] The cooling air guide system controls the zoned cooling mechanism, analyzes the relationship between zone and temperature using internal computer algorithms, calculates the cooling pipe position and coolant flow control rate for a specified zone, controls the opening and closing conditions and opening and closing rates of the cooling air guide mechanisms on both sides of the cooling pipes in the specified zone, and regulates and controls the equipment connected to the external side of the zoned cooling mechanism.

[0033] The temperature monitoring system monitors the temperature at the edge of the partitioned area of ​​the chassis body and provides feedback to the partitioned air guide system, heat dissipation cooling system, and control system;

[0034] The control system connects, integrates and regulates various systems, receives data from the temperature monitoring system, sets temperature monitoring thresholds, and automatically adjusts the status of the cooling air guide system and the heat dissipation cooling system to maintain the stability of the internal temperature of the chassis.

[0035] Beneficial effects

[0036] The present invention has the following beneficial effects:

[0037] 1. The present invention adopts a zoned cooling mechanism to partition the interior of the chassis body, and cooperates with a temperature monitoring component to perform temperature monitoring, and cooperates with a multi-way control valve to guide the coolant inside the cooling pipe at each regional position. After the temperature of the regional component position rises, it automatically adjusts the position to perform centralized cooling and temperature reduction treatment, and combines the internal algorithm to analyze the temperature and coolant flow to provide an accurate parameter relationship between the coolant flow and temperature, thereby achieving comprehensive cooling of the interior of the chassis body while performing targeted cooling and temperature reduction, improving the targetedness, and thus quickly cooling the internal temperature of the chassis body.

[0038] 2. The present invention adopts a zoned cooling mechanism and utilizes cooling pipes to divide the area inside the chassis body, divides the high-heating area and the low-heating area inside the chassis body, realizes regional spatial isolation, changes the traditional open design, and makes the connection between the internal areas unaffected. At the same time, targeted cooling and temperature reduction can be carried out through the cooling pipes to reduce the temperature difference, reduce heat radiation, realize the temperature insulation and temperature control inside the chassis body from its own mechanism, reduce the mutual influence of the temperature between the components inside the chassis body, thereby reducing the cooling difficulty and improving the cooling efficiency.

[0039] 3. The present invention changes the traditional fixed structure of the cooling fan inside the chassis body, and adopts a heat dissipation cooling mechanism set inside the chassis body for autonomous adjustment, so that the heat dissipation blades can adjust their own installation angle and torsion angle according to the rotation rate. Therefore, when the rotation rate increases, the air intake of the entire heat dissipation cooling structure is adjusted by converting the angle of the heat dissipation blades, thereby improving the heat dissipation efficiency. Therefore, without changing the volume and installation method of the heat dissipation blades, the air intake volume and the heat dissipation degree are controlled and adjusted to adapt. The adaptability is high, and it is convenient to carry out centralized adaptive heat dissipation treatment of the high-heating area inside the chassis body.

[0040] 4. The present invention interconnects the chassis bodies through cooling pipes, and reserves cooling connection grooves in the chassis bodies to realize the interconnection of the chassis body with the cooling system and the ordinary chassis body, and realize the sharing of the cooling system and device. It is convenient for the server to use multiple chassis bodies for centralized cooling and temperature reduction, realize the assembly between the chassis bodies and the sharing of the cooling systems, save resources while improving the cooling efficiency of the chassis body and improving the direct scalability of the chassis body.

[0041] 5. The present invention sets up a separate area inside the chassis body for energy storage, and adds an energy storage component at the air guide position of the heat dissipation and cooling mechanism to collect heat energy. The temperature difference is converted into an electric potential difference through the Seebeck effect to generate electrical energy and store it through the energy storage component. It is stored as backup electrical energy inside the chassis body, which is convenient for emergency use, increases energy utilization, is green and safe, achieves sustainable development, and provides electrical energy safety for the entire chassis body when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 This is a structural diagram of the main body of the computer case of the present invention;

[0043] Figure 2 This is a structural diagram of the chassis body of the present invention;

[0044] Figure 3 This is a structural diagram of the chassis body of the present invention;

[0045] Figure 4 This is a diagram showing the internal structure of the chassis body of the present invention;

[0046] Figure 5 This is a structural diagram of the partitioned cooling mechanism of the present invention;

[0047] Figure 6 This is a structural diagram of the heat dissipation and cooling mechanism of the present invention;

[0048] Figure 7 This is a partial structural diagram of the heat dissipation and cooling mechanism of the present invention;

[0049] Figure 8 This is a back structural diagram of the heat dissipation and cooling mechanism of the present invention;

[0050] Figure 9 This is a flow diagram of the external connection plane of the partitioned cooling mechanism of the present invention;

[0051] Figure 10 This is a plan view of the internal partitions of the chassis body of the present invention;

[0052] Figure 11 It is a schematic diagram of the internal partitions of the chassis body of the present invention.

[0053] Among them: 1. Chassis body; 2. Chassis back plate; 3. Partition cooling mechanism; 301. Feed pipe; 302. Multi-way control valve; 303. Cooling pipe; 304. Partition plate; 305. Cooling air guide mechanism; 306. Sealing cover; 4. Heat dissipation cooling mechanism; 401. Fan base; 402. Heat dissipation motor; 403. Guide round table; 404. Guide screw groove; 405. Pull spring; 406. Heat dissipation blade; 407. Guide slide Seat; 408, air guide platform; 409, air guide strip; 410, blade guide groove; 5, energy storage mechanism; 501, heat collection plate; 502, energy heat pipe; 503, energy storage component; 504, heat conduction hole; 504, thermoelectric conversion element; 6, control main board; 7, electrical components; 8, chassis guide main groove; 9, chassis guide arc groove; 10, fan-shaped ventilation groove; 11, cooling connection groove; 12, temperature monitoring component; 13, connection interface. DETAILED DESCRIPTION

[0054] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention. Specific embodiment one:

[0056] like Figure 1-11 As shown, a computer case includes a case body 1 and a case back plate 2. The case back plate 2 is bolted to the front of the case body 1. A control motherboard 6 is provided inside the case body 1. The surface of the control motherboard 6 is connected with an electrical component 7. A connection interface 13 is provided on one side of the outer surface of the case body 1. A heat dissipation cooling mechanism 4 is installed on the side of the control motherboard 6 and the side of the case body 1. The heat dissipation cooling mechanism 4 on the surface of the control motherboard 6 is connected with an energy storage mechanism 5. A partition cooling mechanism 3 is provided inside the case body 1. When the entire device is actually used, the edge of the case back plate 2 is fitted with the surface of the case body 1 by screws or bolts to maintain the entire covered environment outside the case body 1 to prevent In order to prevent internal components from being directly exposed to the external air environment, in addition to installing the control main board 6 and electrical components 7 inside the chassis body 1, the partition cooling structure, heat dissipation cooling mechanism 4, energy storage mechanism 5 and temperature monitoring component 12 must also be installed. After installation, the partition cooling structure partitions the interior of the chassis, and performs targeted cooling and cooling treatment on the interior of the chassis body 1 according to the partition structure combined with the temperature monitoring component 12. The heat dissipation cooling mechanism 4 performs auxiliary cooling and cooling. The energy storage mechanism 5 conducts heat energy at the heat dissipation cooling mechanism 4 position in the high-heating area of ​​the entire chassis body 1, and converts the heat energy into electrical energy and stores it in the energy storage mechanism 5 for use as a backup power supply.

[0057] When zoning the internal area of ​​the chassis body 1, it is generally selected to divide it according to the installation position of the control main board 6, electrical components 7 and other devices and the heat generation conditions during use, and the interior of the chassis body 1 is divided into a high heat zone and a low heat zone. The cooling pipe 303 is used as the area edge to set a group on the top and bottom surfaces of the chassis body 1 to divide the space in the area. After the division, the cooling pipe 303 of the corresponding length is selected and assembled with the multi-way control valve 302 of the corresponding channel. If it is divided into four areas, the multi-way control valve 302 can be an eight-way valve or a four-way valve. After the area division, the temperature monitoring component 12 is installed according to the area division result. After installation, the partition situation and the installation situation of the temperature monitoring component 12 are synchronized with the system to complete the area division and area monitoring of the interior of the chassis body 1. The number and position of the area division can be adjusted according to the actual use of the interior of the chassis body 1.

[0058] When installing the heat dissipation cooling mechanism 4, the cooling pipe 303 and the chassis body 1 can be installed in a corresponding manner according to actual usage requirements, such as direct surface bonding, installation through a clamp, installation by setting a slot, etc. Any existing reasonable installation method can be used inside the chassis body 1 to complete the fixation of the end of the cooling pipe 303 and the inner wall of the chassis body 1 to maintain the stability of the cooling pipe 303.

[0059] In actual use, the temperature monitoring component 12 is generally composed of multiple temperature sensor patches. The control system connects and controls the multiple temperature sensor patches through the MCU, and numerically adjusts the temperature monitoring threshold and range of the temperature sensor patch through the control system. For easy installation, the temperature sensor patch is installed and connected by wireless bonding. Each temperature sensor patch has a corresponding number. The bonded temperature sensor patch is positioned in the control system to form a spatial installation area, which is convenient for the control system to adapt, adjust and integrate the position of the partitioned temperature sensor patch, so as to adapt to the targeted cooling of the partitioned cooling system. Specific embodiment two:

[0061] like Figure 1-11 As shown, when performing targeted cooling of the area, it is mainly achieved through the partition cooling mechanism 3. The specific structure is that the partition cooling mechanism 3 includes a feed pipe 301 and a cooling pipe 303. The cooling pipe 303 is provided with multiple groups. A multi-way control valve 302 is connected between the ends of adjacent cooling pipes 303. The feed pipe 301 is connected to the inside of the feed pipe 301 through the multi-way control valve 302. A partition plate 304 is provided in the vertical position inside the cooling pipe 303. Cooling air guide mechanisms 305 are symmetrically distributed on both sides of the surface of the cooling pipe 303. A sealing cover 306 is provided at the end of the cooling pipe 303. The coolant enters through the feed pipe 301 and passes through the multi-way control valve 302 regulates and controls the opening and closing of each cooling tube 303, and the partition plate 304 divides the two side areas inside the cooling tube 303, so that the cooling tube 303 can perform independent and targeted cooling treatment on the areas on both sides without interfering with each other. The end of the cooling tube 303 is sealed by the sealing cover 306 to prevent the leakage of coolant. At the same time, the bottom surface of the cooling tube 303 is flat and the top surface is curved. The orifice areas of adjacent cooling tubes 303 are the same. The connection position of the cooling tube 303 and the multi-way control valve 302 is sealed. The end of the cooling tube 303 away from the multi-way control valve 302 is against the inner wall of the chassis body 1. When cooling and lowering the temperature, the cooling tube 303 is sealed with the sealing cover 306. Figure 11Taking the partition as an example, the entire chassis body 1 is divided into four areas ABCD through the cooling pipe 303, and the four cooling pipes 303 are connected with the eight-way multi-way control valve 302. Since each cooling pipe 303 has two channels separated by the partition plate 304, when the four cooling pipes 303 are assembled, in order to facilitate targeted control of each channel, the eight-way multi-way control valve 302 is selected for connection. Figure 11 As shown, when it is monitored that the temperature in area A is too high and exceeds the set threshold, the multi-way control valve 302 opens the valve ports at the corresponding A1 and A2 positions to inject coolant into the side channels of the AD tube and the AB tube in area A. The cooling air guide structure on the surface of the cooling tube 303 operates to drive the air inside the coolant to exchange heat with the air inside area A, thereby achieving centralized cooling. The cooling efficiency of area A is controlled by controlling the entry rate and amount of the coolant, thereby achieving centralized control when the temperature in area A is too high. In this way, targeted cooling and cooling treatment of the partitioned areas inside the chassis body 1 can be achieved. By adopting this cooling principle, the control method and positioning method for other partitioning conditions inside the chassis body 1 are the same. The specific partitioning conditions and positioning positions can be selected and used according to the actual usage scenario.

[0062] Furthermore, when the cooling pipe 303 of the partition cooling mechanism 3 is cooling, in addition to the coolant set inside, in order to improve the cooling effect, a cooling air guide structure is set on the side of the cooling pipe 303 for heat exchange. The specific structure is that the cooling air guide mechanisms 305 on both sides of the surface of the same cooling pipe 303 are independently controlled, and the cooling air guide mechanisms 305 on the same side of the surface of the same cooling pipe 303 are synchronously controlled. The cooling air guide mechanism 305 is mainly used to blow out the cold air of the coolant inside the cooling pipe 303 through air cooling, and perform heat exchange with the air inside the area, thereby achieving cooling. Therefore, according to the use of the cooling air guide structure Depending on the usage scenario and method, the specific structure of the cooling air guide mechanism 305 in actual use can be the fan structure inside the existing chassis main body 1. In order to improve the cooling efficiency of the cooling air guide structure, the cooling air guide mechanism 305 can adopt the same structure as the heat dissipation cooling mechanism 4. Through this structure, the rotation speed of the cooling air guide mechanism 305 can be directly controlled in actual use. At the same time, the torsion angle can be independently adjusted through the heat dissipation blades 406 during rotation to adjust the air intake volume. The specific structural type of the cooling air guide structure is selected according to the actual use needs and construction difficulty. Generally, an electric control structure is selected to facilitate one-button opening and closing. Specific embodiment three:

[0064] In order to increase the scalability and sharing of the cooling system when the entire chassis body 1 is used, cooling connection grooves 11 that engage with the cooling pipes 303 are opened on the main side of the chassis and the surface of the chassis back plate 2. Temperature monitoring components 12 are provided at multiple positions inside the chassis body 1, and the temperature monitoring components 12 are electrically connected to the partition cooling mechanism 3 and the heat dissipation cooling mechanism 4. After removing the sealing cover 306 at the end of the cooling pipe 303, a new cooling pipe 303 or other pipe is inserted between adjacent cooling connection grooves 11 to connect the two chassis bodies 1, so that the cooling pipe 303 inside one chassis body 1 can be interconnected with the internal space of the other chassis body 1. The end portion after the connection remains sealed, and the inside of the other chassis body 1 can be connected through the new cooling pipe 303 or other pipe. The cooling air guide mechanism 305 on the surface of the linked cooling pipe 303 is used for cooling and lowering the temperature. The cooling connection groove 11 can be used between adjacent chassis bodies 1, and is directly plugged in and sealed through the cooling pipe 303. The adjacent chassis bodies 1 are interconnected through the cooling pipe 303. The cooling connection groove 11 is reserved by the chassis body 1 to realize the interconnection between the chassis body 1 with the cooling system and the ordinary chassis body 1, and the sharing of the cooling system and device is realized, which is convenient for the use of the server. When multiple chassis bodies 1 are cooled and lowered, the assembly between the chassis bodies 1 and the sharing between the cooling systems are realized, which saves resources while improving the cooling efficiency of the chassis body 1 and improving the direct scalability of the chassis body 1.

[0065] At the same time, in order to perform local heat dissipation in the chassis body 1, auxiliary heat dissipation and cooling are performed through the heat dissipation cooling mechanism 4. The specific structure is as follows: the heat dissipation cooling mechanism 4 includes a heat dissipation motor 402 and a heat dissipation blade 406. The output shaft of the heat dissipation motor 402 is connected with a guide round table 403. The surface circumference of the guide round table 403 is provided with a guide groove 404 to guide the movement of the heat dissipation blade 406, optimize the air duct and enhance the guiding effect of the wind force. A traction spring 405 is provided inside the guide groove 404 at one end close to the heat dissipation motor 402. The top surface of the guide slide 407 is against the bottom surface of the heat dissipation blade 406. The heat dissipation motor 402 is used as the driving force for driving the heat dissipation blade 406. In actual use, it can be replaced with any type of motor that is compatible with it. The heat dissipation motor 402 drives the heat dissipation blade 406 on the surface to rotate through the guide cone 403 to achieve wind diversion and air exchange. The guide cone 403 adopts a trapezoidal cone structure. The cross-section of the guide cone 403 at one end close to the heat dissipation motor 402 is smaller than the cross-section at the other end. In actual use, the heat dissipation The thermomotor 402 rotates, driving the guide circular table 403 to rotate, and the heat dissipation blades 406 rotate synchronously. Under the action of the traction force, the guide slide 407 drives the heat dissipation blades 406 to slide toward one end of the air guide table 408 inside the guide screw groove 404. The traction spring 405 keeps the traction on the guide slide 407. As the speed increases, the traction force on the edge of the heat dissipation blade 406 increases, driving the heat dissipation blade 406 to move. The heat dissipation blade 406 follows the shape of the guide screw groove 404, and its own torsion angle deflects. As the angle deflects When the rotation speed of the heat dissipation motor 402 decreases, the traction force becomes smaller, and under the action of the traction spring 405, the heat dissipation blade 406 gradually returns to its initial position, thereby realizing the adjustment of the torsion angle of the heat dissipation blade 406, realizing the adjustment of the air intake volume, and improving the heat dissipation efficiency. Therefore, without changing the volume and installation method of the heat dissipation blade 406, the air intake volume and the heat dissipation degree are controlled and adjusted, and the adaptability is high, which facilitates the centralized adaptive heat dissipation treatment of the high-heating area inside the chassis body 1.

[0066] In order to improve the heat dissipation effect and adjust the air flow of the entire heat dissipation cooling mechanism 4, blade guide grooves 410 are staggeredly distributed on the back of the heat dissipation blades 406, which help to more effectively disperse and guide the airflow and improve the heat dissipation efficiency. An air guide platform 408 is provided at the end of the guide cone 403, and air guide strips 409 are distributed circumferentially on the surface of the air guide platform 408. A fan base 401 is provided on the outside of the heat dissipation motor 402, and the heat dissipation motor 402 is bolted to the inner wall of the fan base 401, and the fan base 401 is screwed to the inner surface of the chassis body 1. The wind speed during rotation is guided by the guide grooves on the back of the heat dissipation blades 406, which facilitates the rapid diffusion of the air volume. The air volume brought out by the heat dissipation blades 406 is gathered by the air guide platform 408, so that the air volume on the surface of the heat dissipation blades 406 is gathered through the air guide strips 409 and the air guide platform 408, so as to facilitate the collection of heat energy from the energy storage mechanism 5. Specific embodiment four:

[0068] In order to improve the energy utilization rate of the entire device, an energy storage mechanism 5 is set to convert the released heat energy. Specifically, the energy storage mechanism 5 includes a heat collection plate 501 and an energy storage component 503. The heat collection plate 501 is located on one side of the heat dissipation cooling mechanism 4 on the surface of the control main board 6. An energy heat pipe 502 is connected to the surface of the heat collection plate 501. An energy storage component 503 is provided on one side of the bottom surface of the chassis body 1. The top surface of the energy storage component 503 is connected to the bottom end of the energy heat pipe 502. A heat conduction hole 504 is provided on the surface of the heat collection plate 501 where the surface and the energy heat pipe 502 overlap. A heat storage component 503 is provided at the connection position with the energy heat pipe 502. The thermoelectric conversion element is used to convert thermal energy. The heat collection plate 501 conducts and collects the hot air emitted by the heat dissipation and cooling mechanism 4 in the high-heating area. A separate area is set inside the chassis body 1 for energy storage, and an energy storage mechanism 5 is added at the air guide position of the heat dissipation and cooling mechanism 4 to collect thermal energy. The temperature difference is converted into an electric potential difference through the Seebeck effect to generate electrical energy and store it through the energy storage component 503. It is stored as backup electrical energy inside the chassis body 1, which is convenient for emergency use, increases energy utilization, is green and safe, achieves sustainable development, and provides electrical energy safety for the entire chassis body 1 when in use.

[0069] Furthermore, in order to improve the wind guiding effect and cooling efficiency of the entire chassis main body 1 when in use, a chassis guide main groove 8 is provided on the back and both sides of the chassis main body 1. Chassis guide arc grooves 9 are symmetrically distributed on both sides of the chassis guide main groove 8, and the chassis guide arc grooves 9 are evenly distributed in an array along the vertical direction of the chassis main body 1. The chassis guide arc grooves 9 and the chassis guide main grooves 8 are blind grooves with the same groove depth. By setting the chassis guide main grooves 8 and the chassis guide arc grooves 9, the wind passing through the inner wall of the chassis main body 1 is guided. Guide, realize the control of flow rate, increase the contact area between the air volume and the inner wall of the chassis body 1, thereby improving the cooling effect, at the same time, the chassis body 1 is provided with a fan-shaped ventilation groove 10 on the side surface away from the heat dissipation cooling mechanism 4, and the fan-shaped ventilation groove 10 is located between the adjacent chassis guide arc grooves 9, and the fan-shaped ventilation grooves 10 are provided to perform direct ventilation and heat dissipation in the physical structure, and the fan-shaped ventilation grooves are provided to correspond in shape with the surface chassis guide arc grooves 9, which facilitates the rapid flow of gas, thereby improving the cooling effect. Specific embodiment five:

[0071] This embodiment provides a cooling system applicable to the computer case described in any one of Embodiments 1 to 4, which includes the following contents:

[0072] The heat dissipation cooling system controls the heat dissipation cooling mechanism 4 so that the heat dissipation motor 402 can autonomously adjust its rotation speed according to the temperature monitoring condition of the temperature monitoring component 12. The heat dissipation blades 406 can also be used to self-regulate the torsion angle during rotation, thereby autonomously adjusting and guiding the air intake volume.

[0073] The partition cooling system partitions the chassis body 1 through the cooling pipes 303 of the partition cooling mechanism 3, and makes the installation position of the temperature monitoring component 12 correspond to the partition position. The partition situation is synchronized to the control system for feedback;

[0074] The cooling air guide system controls the zoned cooling mechanism 3, analyzes the relationship between zone and temperature using an internal computer algorithm, calculates the position of the cooling pipe 303 and the coolant flow control rate in a specified zone, controls the opening and closing conditions and opening and closing rates of the cooling air guide mechanisms 305 on both sides of the cooling pipe 303 in the specified zone, and regulates and controls the equipment connected to the zoned cooling mechanism 3.

[0075] The temperature monitoring system monitors the temperature at the edge of the area after the chassis body 1 is partitioned, and feeds back the temperature to the partition air guide system, heat dissipation cooling system and control system;

[0076] The control system connects, integrates and regulates various systems, receives temperature monitoring system data, sets temperature monitoring thresholds, automatically adjusts the status of the cooling air guide system and the heat dissipation cooling system, and maintains the stability of the internal temperature of the chassis body 1.

[0077] The specific algorithm used in the cooling control system of the chassis body 1 is as follows:

[0078] Cooling air guide system: controls the partitioned cooling mechanism 3, analyzes the relationship between the area and temperature based on the internal computer algorithm, calculates the position and flow control rate of the cooling pipe 303, and controls the opening and closing conditions and opening and closing rate of the cooling air guide mechanism 305.

[0079] Temperature monitoring system: monitors the temperature at the edge of the area after the chassis body 1 is partitioned, and feeds the data back to the heat dissipation cooling system and control system;

[0080] Control system: Centrally controls and integrates the functions of all the above systems, receives temperature monitoring data, sets temperature monitoring thresholds, and automatically adjusts the status of other systems to ensure the stability of the internal temperature of the chassis.

[0081] Heat dissipation adjustment algorithm: According to the data of the temperature monitoring component 12, the rotation speed of the heat dissipation motor 402 and the torsion angle of the heat dissipation blade 406 are dynamically adjusted to meet the real-time cooling requirements inside the chassis body 1.

[0082] The automatic adjustment of the torsion angle and the rotation speed of the heat dissipation blades 406 allows the air intake volume to be optimized according to the changes in the internal temperature, thereby achieving more efficient heat dissipation.

[0083] This algorithm is designed to automatically adjust the rotation speed and angle of the heat dissipation blades 406 based on the feedback from the temperature sensor.

[0084] Speed ​​adjustment formula:

[0085]

[0086] in:

[0087] R is the speed of the heat dissipation motor 402;

[0088] R min and R max are the minimum and maximum speeds of the heat dissipation motor 402;

[0089] T current is the current temperature;

[0090] T min and T max are the minimum and maximum temperature thresholds that are set.

[0091] Heat dissipation blade 406 angle adjustment formula:

[0092]

[0093] in:

[0094] θ is the twist angle of the heat dissipation blade 406;

[0095] θ min and θ max are the minimum and maximum angles of the heat dissipation blades 406 .

[0096] The fan speed and the angle of the heat dissipation blade 406 are adjusted according to the current temperature relative to a preset temperature threshold by a linear interpolation method. When the temperature rises, the speed and angle increase, thereby improving the cooling efficiency.

[0097] Zoning control algorithm: The zoning cooling system automatically adjusts the multi-way control valve 302 of the cooling pipe 303 of the relevant area according to the temperature monitoring data of each area, accurately controls the amount and rate of coolant entering each area, and ensures regional precision cooling.

[0098] Cooling air guide control algorithm: controls the opening and closing of the cooling air guide mechanism 305 according to the requirements of the regional temperature and coolant flow rate to optimize the cooling effect and reduce energy consumption.

[0099] Coolant flow control algorithm: This algorithm is used to control the multi-way control valve 302 to optimize the distribution of coolant and ensure the efficiency of regional cooling.

[0100] Flow adjustment formula:

[0101] F=F base ×(1+k×(T target -T current ))

[0102] in:

[0103] F is the coolant flow rate into a specific area;

[0104] F base It is the basic flow setting;

[0105] T target is the target temperature setting;

[0106] T current is the current temperature,

[0107] k is the flow adjustment factor, which is used to increase or decrease the response.

[0108] This formula adjusts the flow rate based on the difference between the target temperature and the current temperature to achieve a balance between fast response and efficiency. If the current temperature is higher than the target temperature, the flow rate will increase to enhance the cooling effect.

[0109] The combination of these systems and algorithms not only improves cooling efficiency, but also increases the system's adaptability, enabling it to automatically adjust cooling strategies based on changes in internal conditions to achieve a better energy efficiency ratio. Specific embodiment six:

[0111] like Figure 9 As shown, when the partitioned cooling mechanism 3 is actually used, the end of the feed pipe 301 is connected to the outside and the coolant storage tank, and power is provided by an external water pump. The discharged coolant is cooled by the condenser or heat sink and then flows back to the coolant storage tank for recycling.

[0112] In actual use, the cooling air guide mechanism 305 on the surface of the cooling pipe 303 isolates the water flow, and a film is provided to prevent water from overflowing, and it guides air but not liquid, so as to facilitate air flow exchange.

[0113] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further restrictions, an element defined by the statement "comprising a reference structure" does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0114] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation device for a chassis, comprising a heat dissipation cooling mechanism (4) mounted on the side of a chassis body (1), characterized in that: The thermal cooling mechanism (4) comprises: A heat dissipation motor (402) and a heat dissipation blade (406); the output shaft of the heat dissipation motor (402) is connected to a guide truncated platform (403); a guide screw groove (404) is provided on the circumference of the surface of the guide truncated platform (403); a traction spring (405) is provided inside the guide screw groove (404) at one end close to the heat dissipation motor (402); a guide slide (407) is connected to the end of the traction spring (405); and the top surface of the guide slide (407) abuts against the bottom surface of the heat dissipation blade (406).

2. The heat dissipation device according to claim 1, wherein: The back of the heat dissipation blades (406) are provided with blade guide grooves (410) distributed in a staggered manner.

3. The heat dissipation device according to claim 1, wherein: An air guide platform (408) is provided at the end of the guide circular platform (403), and air guide strips (409) are distributed circumferentially on the surface of the air guide platform (408).

4. The heat dissipation device according to claim 1, wherein: A fan base (401) is provided outside the heat dissipation motor (402), and the heat dissipation motor (402) is bolted to the inner wall of the fan base (401), and the fan base (401) is connected to the inner surface of the chassis body (1).

5. The heat dissipation device according to claim 1, wherein: The guide truncated cone (403) is a trapezoidal truncated cone structure, and the cross section of one end close to the heat dissipation motor (402) is smaller than the cross section of the other end.

6. The heat dissipation device according to claim 1, wherein: The heat dissipation device further comprises a temperature monitoring component (12) arranged inside the chassis body (1), and the temperature monitoring component (12) is electrically connected to the heat dissipation cooling mechanism (4).

7. The heat dissipation device according to claim 1, wherein: The heat dissipation device further comprises a chassis flow guiding main groove (8) provided on the surface of the chassis main body (1), and chassis flow guiding arc grooves (9) are symmetrically distributed on both sides of the chassis flow guiding main groove (8).

8. A heat dissipation control method implemented by the heat dissipation device according to any one of claims 1 to 7, characterized in that: The steps include: According to the data of the temperature monitoring component (12), the rotation speed of the heat dissipation motor (402) and the torsion angle of the heat dissipation blade (406) are dynamically adjusted.

9. The heat dissipation control method according to claim 8, wherein: The speed of the heat dissipation motor (402) is adjusted by the following formula: in: R is the speed of the heat dissipation motor (402); R min and R max are the minimum and maximum speeds of the heat dissipation motor (402); T current is the current temperature; T min and T max are the set minimum and maximum temperature thresholds.

10. The heat dissipation control method according to claim 8, wherein: The torsion angle of the heat dissipation blade (406) is adjusted by the following formula: in: θ is the twist angle of the heat dissipation blade (406); θ min and θ max are the minimum and maximum angles of the heat dissipation blades (406).

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