Active liquid cooling heat dissipation module of electronic equipment and electronic equipment

Abstract

The invention discloses an active liquid cooling heat dissipation module of electronic equipment and the electronic equipment. The heat dissipation module comprises a first heat exchange structure, a second heat exchange structure and a flexible connection structure. The second heat exchange structure comprises a sealing film and a groove flow channel formed in the inner side face of the electronic equipment shell. The sealing film completely covers the groove flow channel; the flexible connection structure can penetrate through the joint of two shells rotationally connected to the electronic equipment and is bent and deformed. One or more driving elements are arranged on the first heat exchange structure or the second heat exchange structure; and the driving element is used for driving the cooling working medium to circularly flow along the circulating heat dissipation flow path. The groove flow channel of the second heat exchange structure is formed in other shells except the shell where the element with the maximum heating value in the electronic equipment is located, and therefore the module with the low heating value in the folding type electronic equipment is used for dissipating heat outwards, and the heat dissipation efficiency is remarkably improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of heat dissipation of electronic equipment, and in particular relates to an active liquid cooling heat dissipation module for electronic equipment and the electronic equipment. Background Art

[0002] Laptop cooling is a core requirement for ensuring stable performance and longevity. As the performance of hardware like processors and graphics cards continues to improve, heat density is increasing significantly. However, the trend toward thin and lightweight designs (mainstream models are now reduced to 18-22mm thick) severely limits the space required for heat dissipation. Poor heat dissipation can directly lead to CPU / GPU overheating and throttling (a 30%-50% drop in performance), hot surfaces (keyboard temperatures exceeding 50°C affect operation), and even accelerated aging of motherboard capacitors due to prolonged high temperatures (shortening their lifespan by 20%-30%). Especially in sustained high-load scenarios like game rendering and code compiling, an efficient cooling system is crucial for avoiding performance fluctuations and ensuring stable operation. Its importance has evolved from a hardware aid to a core experience.

[0003] Currently, laptop cooling technology is rapidly evolving towards higher efficiency, smarter intelligence, and greener solutions. This deep integration of materials, structures, and control technologies is breaking through performance and user experience bottlenecks. First, in the materials field, phase change materials (PCMs) absorb sudden heat bursts (such as transient high temperatures during CPU turbo) through solid-liquid conversion, keeping temperature fluctuations within 5°C. Graphene heat dissipation film (with a thermal conductivity exceeding 5000W / mK) replaces traditional copper foil, improving heat dissipation efficiency under the chassis by 40%. Secondly, structural design optimizes the airflow, shifting the fan's "hot air blowing" strategy from "external" to "inner" to "cool air flow," reducing chassis surface temperatures by 10°C and the weight of the cooling module by 15%. Liquid cooling technology is evolving from external solutions to integrated solutions. For intelligent temperature control, AI algorithms dynamically adjust fan speed and hardware power consumption, reducing noise by 15dB in silent mode while maintaining 85% performance output. A magnetic external water cooling module can be expanded on demand, lowering CPU temperatures by 12°C under high loads. These technologies are driving the cooling system to evolve from an "independent module" to an "intelligent thermal management solution integrated with the body," ultimately achieving the ultimate balance of "full performance, imperceptible noise, and light and thin form."

[0004] The main defects of the prior art are as follows: 1. The cooling solution for existing notebook devices generally uses a combination of heat pipes + fans + fins. Depending on the size of the heat pipe, the actual heat transfer coefficient of the copper heat pipe may be much lower than 100W / cm 2(Theoretical value). Due to the limited space in laptops, the fixed size of the heat sink greatly limits the release of heat dissipation capacity. Especially in lightweight laptops, "overheating and frequency reduction" may occur under high-performance loads. The thermal resistance of the silicone grease between the heat pipe and the chip will cause a delay in the response of the chip's instantaneous power consumption, resulting in a significant increase in the chip temperature, causing users to experience lag or even freezes when using it.

[0005] 2. Existing notebook cooling solutions generally use a combination of heat pipes, fans, and fins. Once this cooling solution encounters high-performance loads, fan noise will be very obvious, especially for gaming laptops, which can rotate at speeds of 5,000+ rpm and generate noise as high as 60dB, which may be harmful to the human body.

[0006] 3. Some laptop cooling solutions use a combination of a vapor chamber (VC) and a fan. While this solution can improve thermal conductivity, its thickness (3-5mm) increases the overall weight of the laptop, making it suitable only for mid- to high-end gaming laptops or workstations and difficult to use in portable laptops.

[0007] 4. A very small number of laptops use water cooling. Generally speaking, water cooling solutions are divided into external water cooling and internal water cooling. The heat of the CPU / GPU is transferred to an external or internal water cooling radiator through liquid cooling pipes. The heat is dissipated by liquid circulation and requires a small water pump and cooling fins. Although the water cooling solution has extremely high heat dissipation efficiency, when the water cooling radiator is built in, it is very heavy and thick. When the water cooling radiator is external, it requires carrying a large external water cooling device, which greatly reduces the portability of the laptop and prevents the lightweight design.

[0008] 5. Among the currently very thin business notebook electronic devices, some still use passive cooling solutions, that is, they only dissipate heat naturally through the body material (such as aluminum alloy, magnesium alloy) and internal heat conduction structure (heat pipe + fins), without active fans. Although this can achieve quietness and lightweight, the surface temperature of the body is high under high load, and high-frequency CPUs cannot be used.

[0009] It can be seen that it is difficult to achieve a balance between quiet noise, thin and light appearance and full performance on electronic devices such as laptops.

[0010] For example, the Chinese patent number CN101344808B discloses a "heat dissipation module", which specifically discloses the following content: "The beneficial effect of the present invention is that the heat dissipation module of the present invention mainly uses a fan and a first heat dissipation unit to dissipate heat from the heat source in the computer body. Among them, the first heat dissipation fin group of the first heat dissipation unit is located on the flow channel inside the fan and is arranged on the inner wall of the fan frame. Therefore, the airflow generated by the fan blade group can remove the heat conducted to the first heat dissipation fin group from the heat source when flowing through the flow channel. Compared with the prior art, since the first heat dissipation fin group of the first heat dissipation unit is arranged on the inner wall of the fan frame, the heat dissipation module of the present invention is "The module has a small product volume, and the heat dissipation module is suitable for being installed in a computer body with limited space to effectively dissipate heat from the heat source inside the body" (paragraph 0014 of the specification). Referring to the drawings in the specification of the patent, it can be seen that in the patent, the notebook electronic device is cooled by a fan and the first heat dissipation fin group and the first heat pipe of the first heat dissipation unit. This is also the heat dissipation method currently commonly used in notebook computers. However, with this heat dissipation method, the fixed size of the heat sink greatly limits the release of heat dissipation capacity, so its heat dissipation capacity is not strong. When the CPU is performing high performance, overheating and frequency reduction will occur, and the CPU may even fail to reach the turbo frequency.

[0011] For another example, the Chinese patent with patent number CN115904032A discloses an "Electronic Device and Cooling Module", which specifically discloses the following content: "The cooling module involved in the second embodiment of the present invention is used for absorbing heat from multiple heating elements installed in the frame of the electronic device. The cooling module comprises: a first heat spreader, in which a working fluid is sealed in a closed space formed between two first metal plates; and a second heat spreader, in which a working fluid is sealed in a closed space formed between two second metal plates. The first heat spreader and the second heat spreader are arranged adjacent to each other with a step provided between them. The first heat spreader has a bridge portion, which is formed by at least one of the two first metal plates extending toward the second heat spreader in a manner of crossing the step and being connected to the surface of the second heat spreader. The bridge portion is not provided with the closed space." (Paragraph 0009 of the specification). It can be seen that in this patent, two heat spreaders are used to dissipate heat from the electronic device. Referring to the drawings in the specification of the patent, Figures 1 to 5 As you can see, the patent sets two heat spreaders on the CPU and GPU of the laptop respectively and then connects them together. Using the technical solution of this patent, the two heat spreaders will not only increase the weight of the laptop, but also require steps to bridge the two heat spreaders, which will increase the thickness of the laptop and make it difficult to meet the lightweight requirements.

[0012] For another example, the Chinese patent with patent number CN118963515A discloses "A multi-channel liquid cooling heat dissipation module and a laptop computer", which specifically discloses the following content: "The present invention provides a multi-channel liquid cooling heat dissipation module, in which a liquid cooling channel for flowing liquid medium is provided in the liquid cooling plate. The liquid medium is driven by the pump body to circulate at the liquid inlet and the liquid outlet, thereby realizing the transfer of heat at the heat source. An air cooling component is provided on the surface of the liquid cooling plate away from the heat source to quickly cool the heat carried by the liquid medium." (paragraph 0012 of the specification). It can be seen that in this patent, a liquid cooling module is used for heat transfer. , specifically disclosed the following content: "The liquid cooling plate is installed on the surface of the heat source through a multi-channel liquid cooling structure, and the heat is transferred to each air-cooled component by relying on multiple branch channels. There is no need to set additional connections or fixing parts to position the water cooling plate, and the heat transfer part occupies a small volume" (paragraph 0013 of the specification). It can be seen that the patent transfers heat to the air-cooled component through the liquid cooling plate and then blows it out. First, adding a liquid cooling plate and a fan assembly to a laptop computer will inevitably increase the thickness of the laptop computer. Secondly, the patent still uses a fan assembly to assist in blowing air, and the noise generated when working at high frequency is still very large.

[0013] For another example, Chinese patent number CN115696843A discloses a "Liquid Cooling Plate, Liquid Cooling System, and Electronic Device," which specifically discloses the following: "In a first aspect, the present application provides a liquid cooling plate, comprising: a housing, the housing comprising a top wall and a bottom wall, the top wall and the bottom wall together forming a receiving chamber, the receiving chamber comprising a first region and a second region; a support structure, the support structure disposed in the first region and located between the top wall and the bottom wall; and a cooling medium, the cooling medium flowing within the receiving chamber to dissipate heat for a heat-generating device, the volume of the cooling medium being capable of expanding when heated and contracting when cooled, the second region being capable of deforming to absorb changes in the volume of the cooling medium." The liquid cooling system described in this patent dissipates heat through the continuous circulation of a cooling medium between a cold plate on the screen side and a cold plate on the keyboard side. However, providing a cold plate on the flip side and the main body side, respectively, significantly increases the thickness of the flip side and the main body, significantly increasing the overall thickness of the laptop, making it difficult to meet lightweight requirements. Summary of the Invention

[0014] The purpose of the present invention is to solve the problem that the existing notebook computer heat dissipation system cannot balance thickness, weight, noise and performance release, and to provide an electronic equipment active liquid cooling heat dissipation module and electronic equipment.

[0015] In a first aspect, the present invention provides an active liquid cooling module for electronic devices, comprising a first heat exchange structure, a second heat exchange structure, and a flexible connection structure. The second heat exchange structure comprises a sealing membrane and a grooved flow channel formed on the inner side of the electronic device housing. The sealing membrane completely covers the grooved flow channel, sealing the top opening of the grooved flow channel. The electronic device housing having the grooved flow channel is a housing other than the housing housing the component generating the most heat. The flow channel within the first heat exchange structure is connected to the flow channel within the second heat exchange structure via a flow channel within the flexible connection structure, forming a circulating heat dissipation flow path. The flexible connection structure is capable of passing through the connection between two rotatably connected housings of the electronic device and bending and deforming. The flexible connection structure bends and deforms with the relative rotation of the two housings of the electronic device, maintaining the internal flow channel in a conductive state. One or more driving elements are provided on the first or second heat exchange structure. The driving elements are used to drive the coolant to circulate along the circulating heat dissipation flow path. The coolant absorbs heat in the first heat exchange structure and then passes through the flexible connection structure to enter the second heat exchange structure for heat dissipation.

[0016] The thickness of the first heat exchange structure, the second heat exchange structure and the flexible connection structure are all very thin. In particular, the second heat exchange structure adopts a slotted structure on the outer shell, which hardly occupies the internal space of the electronic device and occupies a very small volume. It will not significantly increase the thickness of the electronic device. While meeting the lightweight requirements of the electronic device, it can efficiently dissipate heat from the electronic device.

[0017] Preferably, the inner side surface of the electronic device housing in which the groove flow channel is provided is provided with a groove structure. The side shape and depth of the groove structure correspond to the side shape and thickness of the sealing membrane. The groove flow channel is provided on the bottom surface of the groove structure. The sealing membrane is embedded in the groove structure.

[0018] Preferably, the flexible connection structure has a first medium inlet and outlet interface at one end away from the first flow channel structure. The sealing membrane has a second medium inlet and outlet interface connected to the groove flow channel. The first medium inlet and outlet interface is docked with the second medium inlet and outlet interface and fixed by bonding.

[0019] Preferably, the second medium inlet and outlet interface is located on a side of the groove flow channel close to the rotation connection position of the electronic device housing.

[0020] Preferably, the groove flow channel includes a collecting channel and a plurality of heat-releasing microchannels. Each heat-releasing microchannel is divided into a plurality of heat-releasing channel groups. The plurality of heat-releasing microchannels in the same heat-releasing channel group are divided into a plurality of parallel heat-releasing units. The heat-releasing microchannels in the same parallel heat-releasing unit are arranged in parallel. The parallel heat-absorbing units in the same heat-releasing channel group are arranged in series. The input and output ends of the heat-releasing channel group are connected to the second medium inlet and outlet interface on the sealing membrane through the collecting channel.

[0021] Preferably, the flexible connection structure and the first flow channel structure are both sheet-shaped. The flexible connection structure is provided with two spaced-apart bending portions. Opposite ends of the two bending portions form two connection sections of different heights.

[0022] Preferably, the flexible connection structure and the first flow channel structure are integrally formed by laminating and bonding three membrane structures; a through-groove is defined in the middle membrane structure. The through-groove in the middle membrane structure is closed by membrane structures on both sides, thereby forming a flow channel of the flexible connection structure and the first flow channel structure.

[0023] Preferably, the coverage area of ​​the second heat exchange structure is larger than the coverage area of ​​the first heat exchange structure.

[0024] Preferably, the flow channel in the first heat exchange structure includes a pumping area and a heat exchange area. The pumping area is provided with a plurality of pumping levels. Each pumping level includes two pumping holes spaced apart. A driving element is mounted on each pumping level. The driving element is a piezoelectric micropump.

[0025] Using a piezoelectric micropump as a driving element is silent and small in size. It not only does not increase the overall volume of the heat dissipation module, but is also silent in use and does not generate high noise.

[0026] Preferably, the heat exchange region is provided with a plurality of heat-absorbing microchannels. Each heat-absorbing microchannel is divided into a plurality of heat-absorbing channel groups. Each pump liquid level is divided into a plurality of pump liquid groups corresponding one to each heat-absorbing channel group. The plurality of heat-absorbing microchannels in the same heat-absorbing channel group are divided into a plurality of parallel heat-absorbing units. The heat-absorbing microchannels in the same parallel heat-absorbing unit are arranged in parallel. The parallel heat-absorbing units in the same heat-absorbing channel group are sequentially arranged in series.

[0027] In a second aspect, the present invention provides an electronic device comprising a pivotally connected flip portion and a main body; the main body is provided with a heating element. The electronic device also includes the aforementioned electronic device active liquid cooling module. The first heat exchange structure covers the heating element of the electronic device. The first heat exchange structure is disposed within a housing of the main body; the second heat exchange structure is disposed within a housing of the flip portion.

[0028] When the electronic device is started, the active liquid cooling and heat dissipation module of the electronic device will also be started at the same time. During operation, the heating element will generate heat. The cooling medium of the first heat exchange structure in the active liquid cooling and heat dissipation module of the electronic device absorbs the heat of the chip, and then the cooling medium enters the second heat exchange structure through the flexible connection structure and dissipates heat in the housing module of the electronic device. After heat dissipation, the cooling medium returns to the first heat exchange structure of the electronic device, thereby circulating heat dissipation.

[0029] Preferably, the flip portion is connected to the main body via a rotating shaft, the rotating shaft is provided with a radial through-slot structure, and the flexible connection structure passes through the radial through-slot structure on the rotating shaft.

[0030] Preferably, the electronic device includes multiple flip sections. Each flip section is provided with a second heat exchange structure. The flexible connection structures are identical in number to the second heat exchange structures and correspond one-to-one. The cooling medium in the first heat exchange structure flows to the corresponding second heat exchange structure through the multiple flexible connection structures.

[0031] Preferably, the electronic device is a laptop computer, a liquid flow channel is provided on the inner surface (surface A) of the laptop computer shell, and a liquid cooling film is provided under the main body of the laptop computer, a cooling medium is poured into the liquid cooling film, a flexible connection structure passes through the rotating shaft to connect the liquid cooling film and the liquid flow channel, the liquid cooling film covers the heating element in the laptop computer motherboard, absorbs the heat in the heating element and then transports the cooling medium to the liquid flow channel on the inner surface of the flip part of the laptop computer, the liquid flow channel on the inner surface of the flip part of the laptop computer dissipates heat over a large area, thereby efficiently dissipating heat for the laptop computer. The present invention has the following beneficial effects.

[0032] 1. This invention creates a grooved flow channel on the inner side of the electronic device, allowing the external heat exchange area, which occupies the largest area of ​​the heat dissipation module, to be integrated with the electronic device's housing, eliminating the original internal space of the electronic device and promoting the lightweight and thinner electronic device. Furthermore, because the flow channel for the external heat exchange area is directly created in the electronic device's housing, the invention helps improve the heat exchange efficiency between the flow channel and the external environment, thereby increasing the heat dissipation speed of the liquid cooling heat dissipation module.

[0033] 2. The present invention arranges a first heat exchange structure for internal heat absorption and a second heat exchange structure for external heat dissipation on separate housings of a foldable electronic device. A flexible connection structure connects the heat exchange structures, ensuring that the heat dissipation modules spanning different housings do not affect the normal opening and closing of the foldable electronic device. Furthermore, the present invention incorporates the grooved flow channels of the second heat exchange structure in housings other than the housing housing the highest-heating components of the electronic device. This allows heat to be dissipated externally from the lower-heating modules within the foldable electronic device, significantly improving heat dissipation efficiency.

[0034] 3. The present invention utilizes liquid cooling medium for heat dissipation, and its thermal conductivity is higher than that of traditional air cooling. In addition, the present invention uses a piezoelectric micropump as a driving element. The piezoelectric micropump produces very little sound when working and does not generate additional noise, so that the overall working sound of the active liquid cooling heat dissipation module of the electronic device is also very small, which greatly reduces the noise while meeting high performance. In addition, after the cooling medium in the first heat exchange structure of the present invention absorbs the heat of the heating element, the cooling medium will flow to the second heat exchange structure with a larger area, which can better dissipate heat and give full play to the heat dissipation ability of the cooling medium. Its heat transfer efficiency is extremely high, which can ensure the continuous high-performance operation of the electronic device.

[0035] 4. The present invention provides a plurality of heat-absorbing microchannels within the first heat exchange structure. This allows the coolant to transfer heat over a larger effective heat area within the microchannels, allowing it to more easily enter turbulent flow and resulting in a higher equivalent thermal conductivity of over 20,000 W / m·K. This allows the coolant to withstand transient power surges and maintain a stable chip temperature. Furthermore, the first heat exchange structure and flexible connection structure utilize a thin sheet structure, minimizing the overall size of the active liquid cooling module for electronic devices, meeting lightweight requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 Schematic diagram of an electronic device equipped with an active liquid cooling module in Example 1 of the present invention.

[0037] Figure 2 This is a schematic diagram of the flexible connection structure passing through the electronic device shaft in Example 1 of the present invention (ie Figure 1 (partially enlarged view of part A in the figure).

[0038] Figure 3 This is a schematic diagram of the installation of the active liquid cooling and heat dissipation module of the electronic device in Example 1 of the present invention.

[0039] Figure 4 This is a schematic diagram of the interior of an electronic device equipped with an active liquid cooling module in Example 1 of the present invention.

[0040] Figure 5 This is a schematic diagram of the overall structure of the active liquid cooling and heat dissipation module of the electronic device in Example 1 of the present invention.

[0041] Figure 6 It is an exploded view of the first heat exchange structure and the flexible connection structure in Example 1 of the present invention.

[0042] Figure 7 It is a three-dimensional schematic diagram of the second sub-heat dissipation layer and the second sub-flexible connection layer in Example 1 of the present invention.

[0043] Figure 8 3 is a schematic top view of the second sub-heat dissipation layer and the second sub-flexible connection layer in Example 1 of the present invention.

[0044] Figure 9 It is a schematic structural diagram of the groove flow channel in Example 1 of the present invention.

[0045] Figure 10 This is a schematic diagram of the internal structure of the active liquid cooling and heat dissipation module of the electronic device in Example 1 of the present invention.

[0046] Figure 11 This is a schematic diagram of the connection between the second heat exchange structure and the flexible connection structure in Example 1 of the present invention (ie Figure 10 (partially enlarged view of part B in the figure).

[0047] Figure 12 Schematic diagram of the flow path of the cooling medium in Example 1 of the present invention.

[0048] Figure 13 It is an exploded view of the electronic device in Example 2 of the present invention.

[0049] Figure 14 This is a diagram showing the heat dissipation principle of the electronic device in Example 2 of the present invention.

[0050] In the figure, 100, flip part; 110, screen; 120, flip part housing; 200, main body; 210, motherboard; 220, main body housing; 230, heating element; 240, keyboard; 300, active liquid cooling module; 310, flexible connection structure; 311, first sub-flexible connection layer; 312, second sub-flexible connection layer; 3121, fluid connection channel; 3122, fluid communication inflow hole; 3123, fluid communication outflow hole; 313. Third sub-flexible connection layer; 320. Second heat exchange structure; 321. Grooved flow channel; 3211. Heat-releasing microchannel; 322. Grooved input port; 323. Grooved output port; 324. Sealing membrane; 330. First heat exchange structure; 331. First sub-heat dissipation layer; 332. Second sub-heat dissipation layer; 3321. Heat-absorbing fluid channel; 3322. Pump liquid hole; 3323. Heat-absorbing microchannel; 333. Third sub-heat dissipation layer; 340. Piezoelectric micropump; 400. Rotating shaft. DETAILED DESCRIPTION

[0051] The present invention will be further described below with reference to the accompanying drawings.

[0052] Example 1

[0053] An active liquid cooling and heat dissipation module for an electronic device is installed in the electronic device to dissipate heat from heat-generating components in the electronic device. In this embodiment, the electronic device is specifically a laptop computer. In other embodiments, the electronic device may also be other electronic devices with foldable functions, such as foldable mobile phones, tablet computers, computers, wearable devices, drones, robots, and other electronic devices. The structure and installation method of the active liquid cooling and heat dissipation module 300 for electronic devices in other embodiments may refer to this embodiment.

[0054] like Figures 1 to 12 As shown, in this embodiment, the laptop computer includes a main body 200, a flip portion 100, and a hinge 400. The flip portion 100 is connected to the main body 200 via the hinge 400. A screen 110 is mounted on the inner side of the flip portion 100. The main body 200 has a motherboard mounted inside and a keyboard 240 mounted on the inner side.

[0055] In some embodiments, the shells of the main body portion 200 and the flip portion 100 are made of composite materials such as metal, plastic, alloy, carbon fiber, etc.

[0056] The active liquid cooling heat dissipation module 300 of the electronic device includes a first heat exchange structure 330, a second heat exchange structure 320, a cooling medium and a flexible connection structure 310. The first heat exchange structure 330 is installed inside the main body 200 and covers the heating element of the mainboard. The second heat exchange structure 320 is located inside the flip part 100. The first heat exchange structure 330 and the flexible connection structure 310 are both multi-layered sheet structures. The flow channels in the first heat exchange structure 330, the second heat exchange structure 320 and the flexible connection structure 310 are connected to form a circulating heat dissipation flow path. The circulating heat dissipation flow path is provided with a cooling medium that is driven by a driving element to circulate.

[0057] The flexible connection structure 310 and the first flow channel structure 330 are an integrated structure. The end of the flexible connection structure 310 away from the first flow channel structure 330 is provided with a first medium inlet and outlet interface.

[0058] The second heat exchange structure 320 includes a closed film 324 and a groove flow channel 321 provided on the inner side of the shell 120 of the flip part. The ends of the groove flow channel 321 form a plurality of liquid inlets and a plurality of liquid outlets of the second heat exchange structure 320. The liquid inlets and liquid outlets are arranged side by side to form a second medium inlet and outlet interface located on the second heat exchange structure 320. The closed film 324 is pasted on the inner side of the shell 120 of the flip part and covers the groove flow channel 321, closing the top opening of the groove flow channel 321, so that the groove flow channel 321 is connected to the outside only at the second medium inlet and outlet interface. In this embodiment, the number of liquid inlets and liquid outlets of the second heat exchange structure 320 is two each.

[0059] The first medium inlet and outlet interface and the second medium inlet and outlet interface are connected together to realize the circulation of the cooling medium. During operation, the cooling medium absorbs heat in the first heat exchange structure 330, then passes through the flexible connection structure 310 and enters the second heat exchange structure 320 for heat dissipation.

[0060] Figure 1 and Figure 2 The present embodiment describes the connection relationship of an active liquid cooling heat dissipation module 300 for electronic equipment and its installation position in the electronic equipment. Figure 1 and Figure 2 As shown, a through-slot structure is defined in the middle of the laptop's hinge 400. The flexible connection structure 310 passes through the through-slot structure of the hinge 400. One end connects to the second heat exchange structure 320 inside the laptop's flip portion 100, and the other end connects to the first heat exchange structure 330 inside the laptop's main body 200. The through-slot structure passes through the central axis of the hinge 400, allowing the flexible connection structure 310 to pass precisely through the center of the laptop's hinge 400.

[0061] Figure 3 This embodiment describes the installation location of an active liquid cooling module 300 for an electronic device within the electronic device. As shown in Figure 3, the first heat exchange structure 330 covers the motherboard 210 of the laptop computer, completely covering the heat sources on the motherboard 210. The heat sources on the motherboard 210 include the CPU (central processing unit) and the GPU (graphics processing unit). In this embodiment, the groove flow channel 321 of the second heat exchange structure 320 is specifically located on the inner side wall of the shell corresponding to the A side of the laptop computer. The first heat exchange structure 330 is rectangular, the flexible connection structure 310 is a long rectangular strip, and the second heat exchange structure 320 is rectangular, and the area of ​​the second heat exchange structure 320 is much larger than that of the first heat exchange structure 330. In some embodiments, the groove flow channel 321 of the second heat exchange structure 320 occupies more than 80% of the inner side surface area of ​​the shell 120 of the flip portion of the laptop computer.

[0062] Figure 4The internal structure of the flip portion 100 and main body 200 of the laptop computer in this embodiment is described. A motherboard 210 is mounted within the housing 220 of the main body (i.e., the D-side of the laptop computer). The motherboard 210 is smaller in area than the housing 220 of the main body 200 and is mounted on the inner surface of the housing 220. Heat-generating elements 230 are mounted on the motherboard 210. Heat-generating elements 230 refer to elements that generate heat during operation. In this embodiment, the heat-generating elements 230 include the CPU and GPU in the laptop computer. Driver elements are mounted on the motherboard 210 near the heat-generating elements 230. The driver elements used in this embodiment are piezoelectric micropumps 340. A total of six piezoelectric micropumps 340 are mounted on the motherboard 210.

[0063] Figure 5 The overall shape and connection relationship of an active liquid cooling module 300 for electronic equipment in this embodiment are described. Figure 5 As shown, the first heat exchange structure 330 and the flexible connection structure 310 are made into one piece. The flexible connection structure 310 is provided with two bends set at intervals. The two bends are set at intervals. A raised section is formed between the two bends. The raised section and the bend are used to raise the flexible connection structure 310 so that the flexible connection structure 310 forms two connection sections with different heights and parallel to each other at opposite ends of the two bends, ensuring that the flexible connection structure 310 can smoothly pass through the through-groove structure of the hinge 400 of the laptop computer. In this embodiment, the first heat exchange structure 330, the second heat exchange structure 320, and the flexible connection structure 310 can be made of materials such as polymer PET, stainless steel, copper, copper alloy, and metal polymer composite materials.

[0064] Figure 6 The overall shape and connection relationship of the first heat exchange structure 330 and the flexible connection structure 310 of the active liquid cooling heat dissipation module 300 of an electronic device in this embodiment are described. Figure 6 As shown, the first heat exchange structure 330 and the flexible connection structure 310 form a single integral membrane, described separately due to their different functions. The integrated first heat exchange structure 330 and flexible connection structure 310 are a three-layer structure. The first flow channel structure 330 includes a first sub-heat dissipation layer 331, a second sub-heat dissipation layer 332, and a third sub-heat dissipation layer 333, stacked in sequence. The flexible connection structure 310 includes a first sub-flexible connection layer 311, a second sub-flexible connection layer 312, and a third sub-flexible connection layer 313, stacked in sequence. The first sub-heat dissipation layer 331 and the first sub-flexible connection layer 311 form a single integral membrane layer. The second sub-heat dissipation layer 332 and the second sub-flexible connection layer 312 form a single integral membrane layer. The third sub-heat dissipation layer 333 and the third sub-flexible connection layer 313 form a single integral membrane layer. The third sub-heat dissipation layer 333 is bonded to the heating element on the motherboard; the driving element is fixed to the third sub-heat dissipation layer 333 of the first heat exchange structure 330.

[0065] Figure 7 and Figure 8 The overall shape of the second sub-heat dissipation layer 332 and the second sub-flexible connection layer 312 of the active liquid cooling heat dissipation module 300 of an electronic device in this embodiment is described. Figure 7 and Figure 8 As shown, the integrated film layer consisting of the second sub-heat dissipation layer 332 and the second sub-flexible connection layer 312 is provided with flow channel grooves. The first sub-heat dissipation layer 331 and the third sub-heat dissipation layer 333 are sandwiched on either side of the second sub-heat dissipation layer 332, forming a heat-absorbing fluid channel 3321. The first sub-flexible connection layer 311 and the third sub-flexible connection layer 313 are sandwiched on either side of the second sub-flexible connection layer 312, forming a fluid connection channel 3121.

[0066] like Figure 7 and Figure 8 As shown, the heat absorption fluid channel 3321 includes a pumping area and a heat exchange area. Six pumping levels are provided in the pumping area of ​​the heat absorption fluid channel 3321. Each pumping level includes two pumping holes 3322 spaced apart from each other. The six pumping levels are connected in parallel. The six piezoelectric micropumps 340 correspond to the positions of the six pumping levels, respectively. The liquid inlets and outlets of the six piezoelectric micropumps 340 are aligned and connected to the two pumping holes 3322 of the corresponding pumping level.

[0067] The second sub-flexible connection layer 312 has two fluid-connected outflow holes 3123 and a fluid-connected inflow hole 3122 arranged side by side at the end away from the second sub-heat dissipation layer 332. The two fluid-connected outflow holes 3123 and the fluid-connected inflow hole 3122 constitute the aforementioned first medium inlet and outlet interface. The fluid connection channel 3121 of the second sub-flexible connection layer 312 is divided into two low-temperature flow channels and two high-temperature flow channels. The two low-temperature flow channels are respectively connected to the two fluid-connected outflow holes 3123. The two high-temperature flow channels are respectively connected to the fluid-connected inflow holes 3122. The six pump levels are divided into two groups of three. Each low-temperature flow channel corresponds to a group of three pump levels. In some other embodiments, the number of low-temperature and high-temperature flow channels can be other than 2, such as 1, 3, 4, 5, or 6. In some other embodiments, the number of low-temperature and high-temperature flow channels can be the same or different.

[0068] The heat exchange region of the heat-absorbing fluid channel 3321 corresponds to the position of the heating element 230. Multiple heat-absorbing microchannels 3323 are provided in the heat exchange region. The heat-absorbing microchannels 3323 are connected between the pump liquid level and the high-temperature flow channel. Each heat-absorbing microchannel 3323 is divided into two heat-absorbing channel groups. The two heat-absorbing channel groups correspond to the two sets of pump liquid levels, respectively. The multiple heat-absorbing microchannels 3323 in the same heat-absorbing channel group are further divided into multiple parallel heat-absorbing units (in this embodiment, one heat-absorbing channel group consists of two parallel heat-absorbing units; the other heat-absorbing channel group consists of three parallel heat-absorbing units). The heat-absorbing microchannels 3323 in the same parallel heat-absorbing unit are arranged in parallel. The parallel heat-absorbing units in the same heat-absorbing channel group are arranged in series. The heat-absorbing microchannels 3323 can fully disperse the cooling medium and improve the heat exchange efficiency, so that the first heat exchange structure 330 has an extremely high thermal conductivity coefficient, and the electronic equipment active liquid cooling heat dissipation module 300 has a stronger heat dissipation capacity.

[0069] Figure 9 The overall shape of the groove channel 321 of the active liquid cooling heat dissipation module 300 of an electronic device in this embodiment is described. Figure 9 As shown, the inner side of the flip portion housing 120 is provided with a groove structure. The groove structure is rectangular, and its length, width, and depth are consistent with the length, width, and thickness of the sealing membrane 324. The groove flow channel 321 is provided on the bottom surface of the groove structure. The sealing membrane 324 is embedded in the groove structure and completely covers the groove flow channel 321. The groove flow channel 321 is engraved on the inner surface of the flip portion housing 100 but does not penetrate through it.

[0070] The groove flow channel 321 includes a collecting channel and multiple heat-releasing microchannels 3211. Each heat-releasing microchannel 3211 is divided into two heat-releasing channel groups. The multiple heat-releasing microchannels 3211 within a heat-releasing channel group are further divided into multiple parallel heat-releasing units (in this embodiment, a heat-releasing channel group consists of two parallel heat-releasing units). The heat-releasing microchannels 3211 within a parallel heat-releasing unit are arranged in parallel. The parallel heat-absorbing units within the same heat-releasing channel group are arranged in series. The heat-releasing microchannels 3211 can fully disperse the cooling medium, improving heat exchange efficiency, and endowing the second heat exchange structure 320 with an extremely high thermal conductivity, thereby enhancing the heat dissipation capability of the active liquid cooling module 300 for electronic devices. The groove flow channel 321 is provided with two groove output ports 323 and two groove input ports 322 arranged in parallel. The groove output ports 323 are aligned with and connected to the fluid communication inlet holes 3122 on the second sub-flexible connection layer 312. The groove input port 322 is aligned and connected to the fluid communication outlet hole 3123 on the second sub-flexible connection layer 312. The input and output ends of the heat release channel group are connected to the groove output port 323 and the groove input port 322 respectively through the collecting channel.

[0071] Figure 10 and Figure 11 The present embodiment describes the heat dissipation flow path of an active liquid cooling heat dissipation module 300 of an electronic device in the electronic device. As shown in Figure 10, in this embodiment, a groove flow channel 321 is provided on the inner surface of the shell 120 of the flip part of the electronic device, and a sealing film 324 completely covers the groove flow channel 321 to form the groove flow channel 321. The groove flow channel 321 is directly engraved on the inner surface of the shell 220 of the electronic device, and only the sealing film 324 needs to be covered on the inner surface of the shell 220 of the electronic device. Figure 11 As shown, in this embodiment, the second sub-flexible connection layer 312 includes a fluid communication outflow hole 3123 and a fluid communication inflow hole 3122, and the fluid communication outflow hole 3123 on the second sub-flexible connection layer 312 corresponds to the pumping hole 3322 on the second sub-heat dissipation layer 332.

[0072] Figure 12 The present embodiment describes the flow path of the cooling medium in an active liquid cooling heat dissipation module 300 of an electronic device. Figure 12 As shown, in this embodiment, the cooling medium used can be a coolant such as pure water, plasma water, deionized water and fluorinated liquid. The cooling medium flow path, that is, the cooling process, is as follows: first, the cooling medium in the heat absorbing microchannel 3323 of the heat absorbing fluid channel 3321 absorbs the heat of the heating element 230 on the main board 210, and then the cooling medium flows to the fluid connection channel 3121 in the flexible connection structure 310 under the drive of the piezoelectric micropump 340, and then passes through the fluid communication outflow hole 3123 of the second sub-flexible connection layer 312 and enters the second The groove input port 322 of the groove flow channel 321 in the heat exchange structure 320 flows to the groove output port 323 through the heat absorption micro-channels 3323 of the groove flow channel 321 (heat is dissipated in this process), and then passes through the fluid communication inflow hole 3122 on the second sub-flexible connection layer 312 to enter the fluid connection channel 3121, and enters the heat absorption micro-channel 3323 of the heat absorption fluid channel 3321 through the fluid connection channel 3121 of the second sub-flexible connection layer 312, completing a circulation of the cooling medium, and repeating this cycle.

[0073] Example 2

[0074] like Figure 13 and Figure 14 As shown, an electronic device includes an active liquid cooling module for electronic devices according to Example 1. The electronic device further includes a flip portion 100 and a main body 200. The flip portion housing 120 is connected to the main body housing 220 via a rotating shaft, allowing the flip portion 100 and the main body 200 to rotate vertically about a horizontal axis. A main body housing 220 houses a motherboard 210. A chip is mounted on the motherboard 210.

[0075] The electronic device is a flip-type electronic device, specifically a laptop computer in this embodiment. The flip portion 100 corresponds to the laptop's housing A, housing B, and screen module; the main body 200 corresponds to the laptop's housing C, housing D, motherboard module, and keyboard module. In other embodiments, the electronic device may also be a foldable mobile phone, a foldable tablet computer, a flip-type computer, a flip-type wearable device, a flip-type robot, or other flip-type electronic devices.

[0076] Figure 13 The components and specific structure of an electronic device of this embodiment are described. The electronic device active liquid cooling and heat dissipation module 300 is installed in the housing of the flip part 100 and the main part 200.

[0077] The first heat exchange structure 330 in the electronic device active liquid cooling heat dissipation module 300 is fixed on the main board 210 in the main body 200, and the second heat exchange structure 320 is located in the flip part and includes a groove flow channel 321 opened on the inner surface of the shell 120 of the flip part.

[0078] The flexible connection structure passes through the rotating shaft to connect the first heat exchange structure 330 and the second heat exchange structure 320. The overall thickness of the first heat exchange structure 330, the second heat exchange structure 320 and the flexible connection structure 310 is very thin.

[0079] like Figure 13 As shown, the mainboard 210 is equipped with a driving element that drives the coolant to circulate within the first heat exchange structure 330, the second heat exchange structure 320, and the flexible connection structure 310. The first heat exchange structure 330 covers the surface of the mainboard 210, completely covering the chip on the mainboard 210. The first heat exchange structure 330 has a heat-absorbing fluid channel inside, which contains a plurality of heat-absorbing microchannels 3323. Each heat-absorbing microchannel 3323 completely covers the chip. The driving element is a piezoelectric micropump, which is fixedly connected to the first heat exchange structure 330. Using a piezoelectric micropump as a driving element is quiet and compact.

[0080] Figure 14 The heat dissipation process of the electronic device in this embodiment is described. Figure 14As shown, the working process of the electronic device in this embodiment is as follows: when the electronic device is started, the active liquid cooling and heat dissipation module of the electronic device will also be started at the same time. During operation, the chip on the mainboard 210 will generate heat, and the cooling medium of the first heat exchange structure 330 in the active liquid cooling and heat dissipation module of the electronic device absorbs the heat of the chip. The heat absorbing micro-channels 3323 in the heat absorbing fluid channel in the first heat exchange structure 330 are in direct contact with the chip. After absorbing the heat, the cooling medium enters the second heat exchange structure 320 through the flexible connection structure 310, and enters the second fluid channel in the second heat exchange structure 320, and dissipates heat on the surface of the shell 120 of the flip part of the electronic device. The cooling medium after heat dissipation returns to the first heat exchange structure 330 of the electronic device, thereby circulating heat dissipation.

[0081] In some embodiments, the inner side surface of the shell where the second heat exchange structure 320 is arranged is a curved surface, and the groove flow channel 321 of the second heat exchange structure 320 is opened on the curved surface. The closing film 324 is curved and tightly fits and covers the groove flow channel 321 opened on the curved surface.

[0082] Example 3

[0083] An electronic device, the difference between this embodiment and embodiment 1 is that the electronic device is a drone with a flip structure. The main body 200 is the fuselage of the drone. The flip portion 100 is the cantilever of the drone. There are multiple second heat exchange structures 320 in the active liquid cooling heat dissipation module 300 of the electronic device. A second heat exchange structure 320 is provided in each cantilever of the drone. The flexible connection structures 310 are the same in number as the second heat exchange structures 320 and correspond one-to-one. The cooling medium in the first heat exchange structure 330 flows to the corresponding second heat exchange structure 320 through multiple flexible connection structures 310.

Claims

1. An active liquid cooling heat dissipation module for electronic equipment, comprising a first heat exchange structure (330) and a second heat exchange structure (320); characterized in that: The device further comprises a flexible connection structure (310); the second heat exchange structure (320) comprises a closed film (324) and a groove flow channel (321) provided on the inner side of the electronic device housing; the closed film (324) completely covers the groove flow channel (321); the flow channel in the first heat exchange structure (330) and the flow channel in the second heat exchange structure (320) are connected via the flow channel in the flexible connection structure (310) to form a circulating heat dissipation flow path; the flexible connection structure (310) is capable of passing through the connection of two rotationally connected housings on the electronic device and bending and deforming; The cooling medium in the circulating heat dissipation flow path is driven by a driving element to circulate.

2. The active liquid cooling heat dissipation module for electronic equipment according to claim 1, characterized in that: A groove structure is provided on the inner side surface of an electronic device housing in which a groove flow channel (321) is provided; the side shape and depth of the groove structure correspond to the side shape and thickness of the closing film (324); the groove flow channel (321) is provided on the bottom surface of the groove structure; and the closing film (324) is embedded in the groove structure.

3. The active liquid cooling heat dissipation module for electronic equipment according to claim 1, characterized in that: The flexible connection structure (310) is provided with a first medium inlet and outlet interface at one end facing away from the first flow channel structure (330); the closing membrane (324) is provided with a second medium inlet and outlet interface communicating with the groove flow channel (321); and the first medium inlet and outlet interface is butted against the second medium inlet and outlet interface.

4. The active liquid cooling heat dissipation module for electronic equipment according to claim 3, characterized in that: The groove flow channel (321) includes a collecting groove and a plurality of heat-releasing micro-channels (3211); each heat-releasing micro-channel (3211) is divided into a plurality of heat-releasing channel groups; the plurality of heat-releasing micro-channels (3211) in the same heat-releasing channel group are divided into a plurality of parallel heat-releasing units; the heat-releasing micro-channels (3211) in the same parallel heat-releasing unit are arranged in parallel; the parallel heat-absorbing units in the same heat-releasing channel group are arranged in series in sequence; the input end and the output end of the heat-releasing channel group are connected to the second medium inlet and outlet interface on the closed membrane (324) through the collecting groove.

5. The active liquid cooling and heat dissipation module for electronic equipment according to claim 1, characterized in that: The flexible connection structure (310) and the first flow channel structure (330) are both sheet-shaped; the flexible connection structure (310) is provided with bending portions arranged at intervals; the bending portions form connection sections of different heights.

6. The active liquid cooling heat dissipation module for electronic equipment according to claim 1, characterized in that: The flexible connection structure (310) and the first flow channel structure (330) are an integrated structure, formed by stacking three membrane structures; a through groove is provided on the membrane structure located in the middle; the through groove on the membrane structure located in the middle is closed by the membrane structures located on both sides, thereby forming a flow channel of the flexible connection structure (310) and the first flow channel structure (330).

7. The active liquid cooling heat dissipation module for electronic equipment according to claim 1, characterized in that: The coverage area of ​​the second heat exchange structure (320) is greater than the coverage area of ​​the first heat exchange structure (330).

8. The active liquid cooling and heat dissipation module for electronic equipment according to claim 1, characterized in that: The flow channel in the first heat exchange structure (330) includes a pumping area and a heat exchange area; a plurality of pumping levels are provided in the pumping area; each pumping level includes two pumping holes (3322) spaced apart; a driving element is mounted on each pumping level; the driving element is a piezoelectric micropump (340).

9. An electronic device comprising a flip portion (100) and a main portion (200) connected together in a rotational manner; a heating element is provided in the main portion (200); and characterized in that: The electronic device further comprises the electronic device active liquid cooling and heat dissipation module according to claim 1; the first heat exchange structure (330) covers the heating element of the electronic device; the first heat exchange structure (330) is arranged in the shell of the main part (200); and the second heat exchange structure (320) is arranged in the shell of the flip part (100).

10. The electronic device according to claim 9, characterized in that: The flip part (100) is connected to the main body part (200) via a rotating shaft; a radial through-slot structure is provided on the rotating shaft (400); and the flexible connection structure (310) passes through the radial through-slot structure on the rotating shaft (400).

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