An active liquid cooling heat dissipation module for electronic devices and electronic devices

Abstract

This invention discloses an active liquid cooling heat dissipation module for an electronic device and the electronic device itself. The heat dissipation module includes a first heat exchange structure, a second heat exchange structure, and a flexible connection structure. The second heat exchange structure includes a sealing membrane and a grooved flow channel formed on the inner side of the electronic device's housing. The sealing membrane completely covers the grooved flow channel. The flexible connection structure can pass through the connection point of two rotatably connected housings on the electronic device and bend and deform. One or more driving elements are provided on the first or second heat exchange structure. The driving elements are used to drive the cooling medium to circulate along the cooling flow path. This invention places the grooved flow channel of the second heat exchange structure in a housing other than the housing containing the component with the highest heat generation in the electronic device, thereby utilizing the lower heat generation module in the foldable electronic device for external heat dissipation, thus significantly improving heat dissipation efficiency.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for electronic devices, specifically relating to an active liquid cooling heat dissipation module and electronic devices. Background Technology

[0002] Laptop cooling is a core requirement for ensuring stable device performance and extending the device's lifespan. With the continuous improvement in the performance of processors, graphics cards, and other hardware, heat density has increased significantly, while the trend towards thinner and lighter designs (mainstream models are only 18-22mm thick) has severely limited heat dissipation space. Poor heat dissipation can directly lead to CPU / GPU overheating and throttling (performance drops of 30%-50%), extremely hot surfaces (keyboards exceeding 50℃, affecting operation), and even accelerated aging of motherboard capacitors due to prolonged high temperatures (reducing lifespan by 20%-30%). Especially in scenarios with sustained high loads such as game rendering and code compilation, an efficient cooling system is crucial to avoiding performance rollercoasters and ensuring stable task operation; its importance has evolved from "hardware assistance" to "core of user experience."

[0003] Currently, laptop cooling technology is rapidly innovating towards higher efficiency, intelligence, and greener operating standards, breaking through performance and user experience bottlenecks through the deep integration of materials, structure, and control technologies. Firstly, in the materials field, phase change materials (PCMs) absorb sudden heat (such as the instantaneous high temperatures during CPU turbo boost) through solid-liquid conversion, keeping temperature fluctuations within 5°C. Meanwhile, graphene heat dissipation films (with a thermal conductivity exceeding 5000W / mK) replace traditional copper foil, improving heat dissipation efficiency at the bottom of the chassis by 40%. Secondly, in terms of structural design, optimized airflow changes the fan's "external hot air blowing" to "internal cool air flowing," reducing the chassis surface temperature by 10°C while reducing the weight of the cooling module by 15%. Liquid cooling technology is evolving from external solutions to integrated solutions. Regarding intelligent temperature control, AI algorithms dynamically adjust fan speed and hardware power consumption, reducing noise by 15dB in silent mode while maintaining 85% performance output. Magnetic external water cooling modules can be expanded as needed, reducing CPU temperature by 12°C under high load. These technologies are driving the evolution of cooling systems from "independent modules" to "intelligent thermal management solutions integrated with the chassis," ultimately achieving the ultimate balance of "full performance, imperceptible noise, and a slim and lightweight form factor."

[0004] The main drawbacks of the existing technology are as follows:

[0005] 1. Current laptop cooling solutions typically use a combination of heat pipes, fans, and fins. Depending on the size of the heat pipe, the actual heat transfer coefficient of a copper heat pipe may be far lower than 100W / cm². 2(Theoretical value) Due to the limited space in laptops, the fixed size of the heat sink greatly limits the release of heat dissipation capacity. Especially in light laptops, "overheating and frequency reduction" may occur under high-performance loads. The thermal resistance of the thermal grease between the heat pipe and the chip will cause the chip's instantaneous power consumption response delay, resulting in a significant increase in chip temperature. This can cause users to experience lag or even crashes.

[0006] 2. Current laptop cooling solutions typically use a combination of heat pipes, fans, and fins. When this cooling solution encounters high-performance loads, the fan noise becomes very noticeable, especially in gaming laptops where the fan speed can reach 5000+ RPM, and the noise level can be as high as 60dB, which may be harmful to the human body.

[0007] 3. Some laptops use a combination of a vapor chamber and a fan for cooling. While this solution can increase heat conduction, it is relatively thick (3-5mm), which increases the overall weight of the laptop. It is only suitable for mid-to-high-end gaming laptops or workstations and is difficult to apply to portable laptops.

[0008] 4. A very small number of laptops use a liquid cooling solution. Generally speaking, liquid cooling solutions are divided into external liquid cooling and internal liquid cooling. The heat from the CPU / GPU is transferred to an external or internal radiator through liquid cooling pipes, and the liquid is circulated for heat dissipation. It requires a small water pump and heat sink fins. Although liquid cooling solutions have extremely high heat dissipation efficiency, when the radiator is internal, it is very heavy and thick. When the radiator is external, an additional large external liquid cooling device needs to be carried, which greatly reduces the portability of the laptop and makes it impossible to achieve a lightweight design.

[0009] 5. In some of the very thin business laptops currently available, passive cooling solutions are still used. These solutions rely solely on the chassis materials (such as aluminum alloy and magnesium alloy) and internal heat dissipation structures (heat pipes and fins) for natural heat dissipation, without an active fan. While this achieves quiet operation and lightweight design, the surface temperature of the chassis is relatively high under heavy loads, making it impossible to use a high-frequency CPU.

[0010] It is evident that it is difficult to achieve a balance between imperceptible noise, a slim and lightweight design, and full-power performance in electronic devices such as laptops.

[0011] For example, Chinese patent CN101344808B discloses a "Heat Dissipation Module," which specifically discloses the following: "The beneficial effect of this invention is that the heat dissipation module mainly utilizes a fan and a first heat dissipation unit to dissipate heat from the heat source in the computer body. The first heat dissipation fins of the first heat dissipation unit are located on the flow channel inside the fan and are assembled on the inner wall of the fan frame. Therefore, the airflow generated by the fan blades can remove the heat conducted from the heat source to the first heat dissipation fins when flowing through the flow channel. Compared with the prior art, because the first heat dissipation fins of the first heat dissipation unit are located on the inner wall of the fan frame, the heat dissipation of this invention..." The module has a small product size, and the heat dissipation module is suitable for installation in computer cases with limited space to effectively dissipate heat from the heat source inside the case (paragraph 0014 of the specification). Referring to the drawings in the specification of this patent, it can be seen that in this patent, the heat dissipation of the laptop electronic device is achieved through a fan, the first heat dissipation fin group of the first heat dissipation unit, and the first heat pipe. This is also a common heat dissipation method used in laptops. However, the fixed size of the heat sink in this heat dissipation method greatly limits the release of heat dissipation capacity, so its heat dissipation capacity is not strong. When the CPU is performing high-performance, overheating and frequency reduction may occur, and it may even fail to reach the CPU's turbo frequency.

[0012] For example, Chinese patent CN115904032A discloses an "Electronic Device and Cooling Module," which specifically discloses the following: "The cooling module involved in the second aspect of the present invention is used for heat absorption of multiple heat-generating elements mounted in the frame of an electronic device. The cooling module has: a first heat spreader plate, in which a working fluid is sealed in a closed space formed between two first metal plates; and a second heat spreader plate, in which a working fluid is sealed in a closed space formed between two second metal plates. The first heat spreader plate and the second heat spreader plate are arranged adjacent to each other with steps between them. The first heat spreader plate has a bridge portion, which extends toward the second heat spreader plate through at least one of the two first metal plates, crossing the steps, and is connected to the surface of the second heat spreader plate. The bridge portion does not have the closed space." (paragraph 0009 of the specification). It can be seen that in this patent, two heat spreader plates are used to dissipate heat from the electronic device. Referring to the accompanying drawings of the patent specification... Figures 1 to 5 As can be seen, the patent sets up two heat sinks on the CPU and GPU of the laptop and connects them together. Using the technical solution of this patent, the two heat sinks will not only increase the weight of the laptop, but also require steps to bridge the two heat sinks, which will increase the thickness of the laptop and make it difficult to meet the requirements of lightweight design.

[0013] For example, Chinese patent CN118963515A discloses "A Multi-Flow Path Liquid Cooling Module and a Laptop Computer," which specifically discloses the following: "This invention provides a multi-flow path liquid cooling module, in which a liquid cooling channel for a flowing liquid medium is provided within the liquid cooling plate. The liquid medium is driven by a pump to circulate between the inlet and outlet, thereby achieving heat transfer from the heat source. An air-cooling component is provided on the surface of the liquid cooling plate away from the heat source to quickly cool the heat carried by the liquid medium." (Paragraph 0012 of the specification). It is evident that in this patent, a liquid cooling module is used for heat transfer. The patent also discloses the following: "The liquid cooling plate is installed on the heat source surface through a multi-flow liquid cooling structure, and the heat is transferred to each air-cooling component by multiple branch channels. No additional connection or fixing parts are needed to position the water cooling plate, and the heat transfer part occupies a small volume" (paragraph 0013 of the specification). It can be seen that the patent transfers heat to the air-cooling component through the liquid cooling plate and then blows it out. First, adding a liquid cooling plate and fan assembly to a laptop will inevitably increase the thickness of the laptop. Second, the patent still uses a fan assembly to assist in blowing air, and the noise generated when it operates at high frequency is still very large.

[0014] For example, Chinese patent CN115696843A discloses a "Liquid Cooling Plate, Liquid Cooling System, and Electronic Device," which specifically discloses the following: "In a first aspect, this application provides a liquid cooling plate, the liquid cooling plate comprising: a shell, the shell comprising a top wall and a bottom wall, the top wall and the bottom wall being closed to form a receiving cavity, the receiving cavity comprising a first region and a second region; a support structure disposed in the first region and located between the top wall and the bottom wall; and a cooling medium, the cooling medium flowing within the receiving cavity to dissipate heat from heat-generating devices, the volume of the cooling medium being able to expand when heated and contract when cooled, the second region being able to absorb the volume change of the cooling medium through deformation." The liquid cooling system in this patent continuously circulates heat dissipation through a cooling medium between a cooling plate on the screen side and a cooling plate on the keyboard side. However, placing a cooling plate on both the flip-up side and the main body side significantly increases the thickness of both sides, greatly increasing the overall thickness of the laptop and making it difficult to meet the requirements for lightweight design. Summary of the Invention

[0015] The purpose of this invention is to solve the problem that existing laptop cooling systems cannot balance thickness, weight, noise, and performance release, and to provide an active liquid cooling module and electronic device.

[0016] In a first aspect, the present invention provides an active liquid cooling heat dissipation module for an electronic device, comprising a first heat exchange structure, a second heat exchange structure, and a flexible connection structure. The second heat exchange structure includes a sealing membrane and a grooved flow channel formed on the inner side of the electronic device housing. The sealing membrane completely covers the grooved flow channel, sealing the top opening of the grooved flow channel. The electronic device housing with the grooved flow channel is a housing other than the housing containing the component with the highest heat generation in the electronic device. The flow channel in the first heat exchange structure and the flow channel in the second heat exchange structure are connected through a flow channel in the flexible connection structure, forming a circulating heat dissipation path. The flexible connection structure can pass through the connection point of the two rotatably connected housings on the electronic device and bend and deform. The flexible connection structure bends and deforms with the relative rotation of the two housings on the electronic device, maintaining the internal flow channel in a conductive state. One or more driving elements are provided on the first or second heat exchange structure. The driving elements are used to drive the cooling medium to circulate along the circulating heat dissipation path. The cooling medium absorbs heat in the first heat exchange structure and then passes through the flexible connection structure into the second heat exchange structure for heat dissipation.

[0017] The first heat exchange structure, the second heat exchange structure, and the flexible connection structure are all very thin. In particular, the second heat exchange structure adopts a slotted structure on the outer shell, which hardly occupies the internal space of the electronic device and has a very small volume. It does not significantly increase the thickness of the electronic device, and can efficiently dissipate heat from the electronic device while meeting the lightweight requirements of the electronic device.

[0018] Preferably, the inner side of the electronic device housing with the grooved flow channel has a groove structure. The side shape and depth of the groove structure correspond to the side shape and thickness of the sealing membrane, respectively. The grooved flow channel is formed on the bottom surface of the groove structure. The sealing membrane is embedded in the groove structure.

[0019] Preferably, the flexible connecting structure has a first medium inlet / outlet port at the end opposite to the first flow channel structure. The sealing membrane has a second medium inlet / outlet port that connects to the grooved flow channel. The first medium inlet / outlet port and the second medium inlet / outlet port are mated and bonded together.

[0020] Preferably, the second medium inlet / outlet is located on the side of the groove channel near the rotating connection position of the electronic device housing.

[0021] Preferably, the grooved flow channel includes a collecting channel and multiple heat-releasing microchannels. Each heat-releasing microchannel is divided into multiple heat-releasing channel groups. Within the same heat-releasing channel group, multiple heat-releasing microchannels are divided into multiple parallel heat-releasing units. Each heat-releasing microchannel in the same parallel heat-releasing unit is arranged in parallel. Each parallel heat-absorbing unit in the same heat-releasing channel group is arranged in series. The input and output ends of the heat-releasing channel group are connected to the second medium inlet / outlet interface on the sealed membrane through the collecting channel.

[0022] Preferably, both the flexible connecting structure and the first flow channel structure are sheet-like. The flexible connecting structure has two spaced-apart bends. The opposite ends of the two bends form two connecting segments with different heights.

[0023] Preferably, the flexible connection structure and the first flow channel structure are an integral structure, formed by bonding three membrane structures together; a through groove is formed on the middle membrane structure. The through groove on the middle membrane structure is closed by the membrane structures on both sides, forming the flow channels of the flexible connection structure and the first flow channel structure.

[0024] Preferably, the coverage area of ​​the second heat exchange structure is larger than that of the first heat exchange structure.

[0025] Preferably, the flow channel in the first heat exchange structure includes a pumping liquid region and a heat exchange region. The pumping liquid region has multiple pumping liquid levels. Each pumping liquid level includes two pumping liquid orifices spaced apart. A driving element is installed at each pumping liquid level. The driving element is a piezoelectric micropump.

[0026] Using a piezoelectric micropump as the driving element, it is quiet and small in size, which not only does not increase the overall size of the heat dissipation module, but also does not produce high noise during use.

[0027] Preferably, the heat exchange region is provided with multiple heat-absorbing microchannels. Each heat-absorbing microchannel is divided into multiple heat-absorbing channel groups. Each pump liquid level is divided into multiple pump liquid groups corresponding one-to-one with the heat-absorbing channel group. Multiple heat-absorbing microchannels in the same heat-absorbing channel group are divided into multiple parallel heat-absorbing units. The heat-absorbing microchannels in the same parallel heat-absorbing unit are arranged in parallel. The parallel heat-absorbing units in the same heat-absorbing channel group are arranged in series sequentially.

[0028] Secondly, the present invention provides an electronic device comprising a flip-up portion and a main body portion rotatably connected together; a heating element is disposed in the main body portion. The electronic device further includes the aforementioned active liquid cooling heat dissipation module. A first heat exchange structure covers the heating element of the electronic device. The first heat exchange structure is disposed within the housing of the main body portion; a second heat exchange structure is disposed within the housing of the flip-up portion.

[0029] When the electronic device is started, the active liquid cooling module of the electronic device will also start at the same time. During operation, the heat-generating components will generate heat. The cooling medium of the first heat exchange structure in the active liquid cooling module absorbs the heat of the chip. Then the cooling medium enters the second heat exchange structure through the flexible connection structure and dissipates heat in the housing module of the electronic device. After heat dissipation, the cooling medium returns to the first heat exchange structure of the electronic device, thus circulating the heat dissipation.

[0030] Preferably, the flipping part is connected to the main body via a pivot. The pivot has a radial through-slot structure. The flexible connecting structure passes through the radial through-slot structure on the pivot.

[0031] Preferably, the electronic device includes multiple flip-up sections. Each flip-up section is provided with a second heat exchange structure. The number of flexible connecting structures and the number of second heat exchange structures are the same and correspond one-to-one. The cooling medium in the first heat exchange structure flows to the corresponding second heat exchange structure through the multiple flexible connecting structures.

[0032] Preferably, the electronic device is a laptop computer. A liquid flow channel is provided on the inner surface (A-side) of the laptop's casing, and a liquid cooling film is positioned below the main body of the laptop. Cooling fluid is poured into the liquid cooling film. A flexible connecting structure passes through a hinge to connect the liquid cooling film and the liquid flow channel. The liquid cooling film covers the heat-generating components in the laptop's motherboard, absorbing heat from the components and then delivering the cooling fluid to the liquid flow channel on the inner surface of the laptop's flip-up section. The large-area liquid flow channel on the inner surface of the laptop's flip-up section dissipates heat, thus achieving efficient heat dissipation for the laptop.

[0033] The present invention has the following beneficial effects.

[0034] 1. This invention creates grooved flow channels on the inner side of the electronic device, integrating the largest external heat exchange area of ​​the heat dissipation module with the outer casing of the electronic device, without occupying the original internal space of the electronic device, thereby promoting the thinning and lightening of the electronic device. Furthermore, because this invention directly creates flow channels for the external heat exchange area on the casing of the electronic device, it helps improve the heat exchange efficiency between the flow channels and the external environment, increasing the heat dissipation speed of the liquid cooling module.

[0035] 2. This invention arranges a first heat exchange structure that absorbs heat inward and a second heat exchange structure that releases heat outward on different housings of a foldable electronic device, and connects the heat exchange structures using a flexible connection structure. This flexible connection structure ensures that the heat dissipation modules spanning different housings do not affect the normal opening and closing of the foldable electronic device. Furthermore, this invention places the grooved flow channels of the second heat exchange structure in housings other than those containing the components with the highest heat generation in the electronic device, thereby utilizing the lower heat generation modules in the foldable electronic device for external heat dissipation, thus significantly improving heat dissipation efficiency.

[0036] 3. This invention utilizes a liquid cooling medium for heat dissipation, which has a higher thermal conductivity compared to traditional air cooling. Furthermore, this invention uses a piezoelectric micropump as the driving element. The piezoelectric micropump produces very little noise during operation, eliminating additional noise and resulting in a very low overall operating noise level for the active liquid cooling module of the electronic device. This significantly reduces noise while maintaining high performance. In addition, after absorbing heat from the heat-generating element, the cooling medium in the first heat exchange structure flows to the larger second heat exchange structure, which better dissipates heat and fully utilizes the cooling medium's heat dissipation capacity. Its extremely high heat transfer efficiency ensures continuous high-performance operation of the electronic device.

[0037] 4. The present invention sets up several heat-absorbing microchannels in the first heat exchange structure. The cooling working fluid has a larger effective heat transfer area in the heat-absorbing microchannels, and the cooling working fluid is more likely to enter turbulence. The equivalent thermal conductivity is higher, reaching more than 20,000 W / m·K, which can withstand instantaneous power impact and keep the chip at a stable temperature. At the same time, the first heat exchange structure and the flexible connection structure adopt a sheet structure with a very thin thickness, which makes the overall volume of the active liquid cooling heat dissipation module of the electronic device very small, meeting the requirements of lightweight. Attached Figure Description

[0038] Figure 1 This is a schematic diagram of an electronic device equipped with an active liquid cooling heat dissipation module in Embodiment 1 of the present invention.

[0039] Figure 2 This is a schematic diagram of the flexible connection structure passing through the rotating shaft of the electronic device in Embodiment 1 of the present invention (i.e., Figure 1 (A magnified view of part A in the middle).

[0040] Figure 3 This is a schematic diagram of the installation of the active liquid cooling heat dissipation module for electronic devices in Embodiment 1 of the present invention.

[0041] Figure 4 This is a schematic diagram of the internal structure of an electronic device equipped with an active liquid cooling module in Embodiment 1 of the present invention.

[0042] Figure 5 This is a schematic diagram of the overall structure of the active liquid cooling heat dissipation module for electronic devices in Embodiment 1 of the present invention.

[0043] Figure 6 This is an exploded view of the first heat exchange structure and the flexible connection structure in Embodiment 1 of the present invention.

[0044] Figure 7 This is a three-dimensional schematic diagram of the second sub-heat dissipation layer and the second sub-flexible connection layer in Embodiment 1 of the present invention.

[0045] Figure 8 This is a top view schematic diagram of the second sub-heat dissipation layer and the second sub-flexible connection layer in Embodiment 1 of the present invention.

[0046] Figure 9 This is a schematic diagram of the grooved flow channel in Embodiment 1 of the present invention.

[0047] Figure 10 This is a schematic diagram of the internal structure of the active liquid cooling heat dissipation module of the electronic device in Embodiment 1 of the present invention.

[0048] Figure 11 This is a schematic diagram of the connection between the second heat exchange structure and the flexible connection structure in Embodiment 1 of the present invention (i.e.) Figure 10 (A magnified view of part B in the middle section).

[0049] Figure 12 This is a schematic diagram of the flow path of the cooling working fluid in Embodiment 1 of the present invention.

[0050] Figure 13 This is an exploded view of the electronic device in Embodiment 2 of the present invention.

[0051] Figure 14 This is a heat dissipation principle diagram of the electronic device in Embodiment 2 of the present invention.

[0052] In the diagram, 100 is the flip section; 110 is the screen; 120 is the housing of the flip section; 200 is the main body; 210 is the motherboard; 220 is the housing of the main body; 230 is the heating element; 240 is the keyboard; 300 is the active liquid cooling module; 310 is the flexible connection structure; 311 is the first sub-flexible connection layer; 312 is the second sub-flexible connection layer; 3121 is the fluid connection channel; 3122 is the fluid inlet hole; and 3123 is the fluid outlet hole. 313. Third sub-flexible connecting layer; 320. Second heat exchange structure; 321. Groove flow channel; 3211. Heat release microchannel; 322. Groove inlet; 323. Groove outlet; 324. Sealed membrane; 330. First heat exchange structure; 331. First sub-heat dissipation layer; 332. Second sub-heat dissipation layer; 3321. Heat absorption fluid channel; 3322. Pump liquid hole; 3323. Heat absorption microchannel; 333. Third sub-heat dissipation layer; 340. Piezoelectric micropump; 400. Rotating shaft. Detailed Implementation

[0053] The present invention will be further described below with reference to the accompanying drawings.

[0054] Example 1

[0055] An active liquid cooling module for electronic devices is installed inside the electronic device to dissipate heat from heat-generating components. In this embodiment, the electronic device is specifically a laptop computer. In some other embodiments, the electronic device can also be other foldable electronic devices, such as foldable mobile phones, tablets, computers, wearable devices, drones, robots, etc. The structure and installation method of the active liquid cooling module 300 for electronic devices in other embodiments can refer to this embodiment.

[0056] like Figures 1 to 12 As shown, in this embodiment, the laptop computer includes a main body 200, a flip-up portion 100, and a hinge 400. The flip-up portion 100 is connected to the main body 200 via the hinge 400. A screen 110 is mounted on the inner side of the flip-up portion 100. A motherboard is installed inside the main body 200, and a keyboard 240 is mounted on its inner side.

[0057] In some embodiments, the housings of the main body 200 and the flipping portion 100 are made of composite materials such as metal, plastic, alloy, and carbon fiber.

[0058] The active liquid cooling heat dissipation module 300 for the electronic device includes a first heat exchange structure 330, a second heat exchange structure 320, a cooling medium, and a flexible connection structure 310. The first heat exchange structure 330 is installed inside the main body 200 and covers the heat-generating elements on the motherboard. The second heat exchange structure 320 is located inside the flip-over portion 100. Both the first heat exchange structure 330 and the flexible connection structure 310 are multi-layered, sheet-like structures. The flow channels within the first heat exchange structure 330, the second heat exchange structure 320, and the flexible connection structure 310 are connected to form a circulating heat dissipation path. A cooling medium, driven by a driving element, circulates within the circulating heat dissipation path.

[0059] The flexible connection structure 310 and the first flow channel structure 330 are an integral structure. The end of the flexible connection structure 310 away from the first flow channel structure 330 is provided with a first medium inlet / outlet interface.

[0060] The second heat exchange structure 320 includes a sealing membrane 324 and a grooved flow channel 321 formed on the inner side of the shell 120 of the flipped portion. The ends of the grooved flow channel 321 form several liquid inlets and several liquid outlets of the second heat exchange structure 320. Each liquid inlet and outlet is arranged side-by-side, forming a second medium inlet / outlet interface on the second heat exchange structure 320. The sealing membrane 324 is adhered to the inner side of the shell 120 of the flipped portion, covering the grooved flow channel 321 and sealing the top opening of the grooved flow channel 321, so that the grooved flow channel 321 communicates with the outside only at the second medium inlet / outlet interface. In this embodiment, the second heat exchange structure 320 has two liquid inlets and two liquid outlets.

[0061] The first and second medium inlet / outlet ports are connected together to achieve the circulation of the cooling medium. During operation, the cooling medium absorbs heat in the first heat exchange structure 330, and then passes through the flexible connection structure 310 to enter the second heat exchange structure 320 for heat dissipation.

[0062] Figure 1 and Figure 2 This embodiment describes the connection relationships and installation location of an active liquid cooling heat dissipation module 300 in an electronic device. For example... Figure 1 and Figure 2 As shown, a through-slot structure is formed in the middle of the hinge 400 of the laptop. The flexible connecting structure 310 passes through the through-slot structure of the hinge 400, with one end connected to the second heat exchange structure 320 inside the flip portion 100 of the laptop, and the other end connected to the first heat exchange structure 330 inside the main body portion 200 of the laptop. The through-slot structure passes through the central axis of the hinge 400, so that the flexible connecting structure 310 passes exactly through the center of the hinge 400 of the laptop.

[0063] Figure 3 This description illustrates the installation location of an active liquid cooling module 300 in an electronic device according to this embodiment. As shown in Figure 3, the first heat exchange structure 330 covers the motherboard 210 of a laptop computer, completely covering the heat sources on the motherboard 210. The heat sources on the motherboard 210 include the CPU (Central Processing Unit) and the GPU (Graphics Processing Unit). In this embodiment, the grooved flow channel 321 of the second heat exchange structure 320 is specifically located on the inner sidewall of the casing corresponding to the A-side of the laptop computer. The first heat exchange structure 330 is rectangular, the flexible connection structure 310 is a long rectangular strip, and the second heat exchange structure 320 is rectangular, with an area much larger than that of the first heat exchange structure 330. In some embodiments, the grooved flow channel 321 of the second heat exchange structure 320 occupies more than 80% of the inner surface area of ​​the casing 120 of the laptop computer's flip-out portion.

[0064] Figure 4The internal structure of the flip section 100 and main body 200 of the laptop computer in this embodiment is described. A motherboard 210 is installed inside the shell 220 (i.e., the D-side of the laptop computer) of the main body. The area of ​​the motherboard 210 is smaller than that of the shell 220 of the main body 200 and it is mounted on the inner surface of the shell 220. Heating elements 230 are installed on the motherboard 210. Heating elements 230 refer to components that generate heat during operation. In this embodiment, the heating elements 230 include the CPU and GPU in the laptop computer. Driving elements are installed on the motherboard 210 near the heating elements 230. In this embodiment, the driving elements used are piezoelectric micropumps 340, and a total of six sets of piezoelectric micropumps 340 are installed on the motherboard 210.

[0065] Figure 5 This embodiment describes the overall shape and connection relationships of an active liquid cooling heat dissipation module 300 for an electronic device. For example... Figure 5 As shown, the first heat exchange structure 330 and the flexible connection structure 310 are integrally formed. The flexible connection structure 310 has two spaced-apart bends. A raised section is formed between the two bends. The raised section and the bends are used to elevate the flexible connection structure 310, so that the flexible connection structure 310 forms two parallel connection sections of different heights at opposite ends of the two bends, ensuring that the flexible connection structure 310 can smoothly pass through the through-slot structure of the laptop's hinge 400. In this embodiment, the first heat exchange structure 330, the second heat exchange structure 320, and the flexible connection structure 310 can be made of materials such as polymer PET, stainless steel, copper, copper alloys, and metal polymer composite materials.

[0066] Figure 6 This embodiment describes the overall shape and connection relationship of the first heat exchange structure 330 and the flexible connection structure 310 of an active liquid cooling heat dissipation module 300 for an electronic device. For example... Figure 6 As shown, the first heat exchange structure 330 and the flexible connection structure 310 are a single integral membrane, described separately due to their different functions. The integral first heat exchange structure 330 and flexible connection structure 310 are a three-layer structure. The first flow channel structure 330 includes a first sub-heat dissipation layer 331, a second sub-heat dissipation layer 332, and a third sub-heat dissipation layer 333 stacked sequentially. The flexible connection structure 310 includes a first sub-flexible connection layer 311, a second sub-flexible connection layer 312, and a third sub-flexible connection layer 313 stacked sequentially. The first sub-heat dissipation layer 331 and the first sub-flexible connection layer 311 are integral membranes of the same layer. The second sub-heat dissipation layer 332 and the second sub-flexible connection layer 312 are integral membranes of the same layer. The third sub-heat dissipation layer 333 is integral membranes of the same layer. The third sub-heat dissipation layer 333 is attached to the heat-generating element on the motherboard; the driving element is fixed to the third sub-heat dissipation layer 333 of the first heat exchange structure 330.

[0067] Figure 7 and Figure 8 The overall shape of the second sub-heat dissipation layer 332 and the second sub-flexible connection layer 312 of an active liquid cooling heat dissipation module 300 for an electronic device according to this embodiment is described. For example... Figure 7 and Figure 8 As shown, a flow channel groove is formed on the integrated film layer composed of the second sub-heat dissipation layer 332 and the second sub-flexible connection layer 312. The first sub-heat dissipation layer 331 and the third sub-heat dissipation layer 333 are sandwiched on both sides of the second sub-heat dissipation layer 332, forming a heat absorption fluid channel 3321. The first sub-flexible connection layer 311 and the third sub-flexible connection layer 313 are sandwiched on both sides of the second sub-flexible connection layer 312, forming a fluid connection channel 3121.

[0068] like Figure 7 and Figure 8 As shown, the heat-absorbing fluid channel 3321 includes a pumping liquid region and a heat exchange region. The pumping liquid region of the heat-absorbing fluid channel 3321 has six pumping liquid levels. Each pumping liquid level includes two pumping liquid holes 3322 spaced apart. The six pumping liquid levels are connected in parallel. Six piezoelectric micropumps 340 correspond to the positions of the six pumping liquid levels. The inlet and outlet of each of the six piezoelectric micropumps 340 are aligned with and connected to the two pumping liquid holes 3322 of their respective pumping liquid levels.

[0069] The second sub-flexible connecting layer 312 has two fluid communication outlet holes 3123 and a fluid communication inlet hole 3122 arranged side-by-side at its end away from the second sub-heat dissipation layer 332. The two fluid communication outlet holes 3123 and the fluid communication inlet hole 3122 constitute the aforementioned first medium inlet / outlet interface. The fluid connection channel 3121 of the second sub-flexible connecting layer 312 is divided into two low-temperature channels and two high-temperature channels. The two low-temperature channels are respectively connected to the two fluid communication outlet holes 3123. The two high-temperature channels are respectively connected to the fluid communication inlet holes 3122. The six pump levels are divided into two groups of three. Each low-temperature channel is connected to one group of three pump levels. In some other embodiments, the number of low-temperature channels and high-temperature channels can be other than 2, such as 1, 3, 4, 5, or 6; in some other embodiments, the number of low-temperature channels and high-temperature channels can be the same or different.

[0070] The heat exchange area of ​​the heat-absorbing fluid channel 3321 corresponds to the position of the heating element 230. Multiple heat-absorbing microchannels 3323 are provided in the heat exchange area. The heat-absorbing microchannels 3323 connect the pump level and the high-temperature flow channel. Each heat-absorbing microchannel 3323 is divided into two heat-absorbing channel groups. The two heat-absorbing channel groups correspond to two pump levels respectively. Within the same heat-absorbing channel group, multiple heat-absorbing microchannels 3323 are further divided into multiple parallel heat-absorbing units (in this embodiment, one heat-absorbing channel group consists of two parallel heat-absorbing units; the other heat-absorbing channel group includes three parallel heat-absorbing units). The heat-absorbing microchannels 3323 within the same parallel heat-absorbing unit are arranged in parallel. The parallel heat-absorbing units within the same heat-absorbing channel group are arranged in series sequentially. The heat-absorbing microchannels 3323 can fully disperse the cooling medium and improve the heat exchange efficiency, so that the first heat exchange structure 330 has an extremely high thermal conductivity, making the heat dissipation capacity of the active liquid cooling heat dissipation module 300 of electronic equipment stronger.

[0071] Figure 9 The overall shape of the groove channel 321 of the active liquid cooling heat dissipation module 300 of an electronic device in this embodiment is described, such as... Figure 9 As shown, the inner surface of the shell 120 of the flipped portion has a groove structure. The groove structure is rectangular, and its length, width, and depth are consistent with the length, width, and thickness of the sealing membrane 324, respectively. The groove channel 321 is formed on the bottom surface of the groove structure. The sealing membrane 324 is embedded in the groove structure and completely covers the groove channel 321. The groove channel 321 is engraved on the inner surface of the shell of the flipped portion 100 but does not penetrate it.

[0072] The grooved flow channel 321 includes a collection channel and multiple heat-releasing microchannels 3211. Each heat-releasing microchannel 3211 is divided into two heat-releasing channel groups. Within the same heat-releasing channel group, multiple heat-releasing microchannels 3211 are further divided into multiple parallel heat-releasing units (in this embodiment, one heat-releasing channel group consists of two parallel heat-releasing units). Each heat-releasing microchannel 3211 within the same parallel heat-releasing unit is arranged in parallel. Each parallel heat-absorbing unit within the same heat-releasing channel group is arranged in series. The heat-releasing microchannels 3211 can fully disperse the cooling working fluid, improving heat exchange efficiency and giving the second heat exchange structure 320 an extremely high thermal conductivity, thus enhancing the heat dissipation capacity of the active liquid cooling module 300 for electronic devices. The grooved flow channel 321 is provided with two grooved outlet ports 323 and two grooved inlet ports 322 arranged in parallel. The grooved outlet ports 323 are aligned with and connected to the fluid inflow holes 3122 on the second sub-flexible connection layer 312. The groove inlet 322 and the fluid communication outlet 3123 on the second flexible connecting layer 312 are aligned and connected. The inlet and outlet of the heat release channel group are connected to the groove outlet 323 and the groove inlet 322 respectively through the collection channel.

[0073] Figure 10 and Figure 11 This embodiment describes the heat dissipation path of an active liquid cooling heat dissipation module 300 in an electronic device. As shown in Figure 10, in this embodiment, the inner surface of the housing 120 of the flip-up portion of the electronic device has a grooved flow channel 321, and a sealing film 324 completely covers the grooved flow channel 321 to form the grooved flow channel 321. The grooved flow channel 321 is directly engraved on the inner surface of the housing 220 of the electronic device, and only the sealing film 324 needs to cover the inner surface of the housing 220 of the electronic device. Figure 11 As shown, in this embodiment, the second sub-flexible connection layer 312 includes a fluid communication outlet hole 3123 and a fluid communication inlet hole 3122, and the fluid communication outlet hole 3123 on the second sub-flexible connection layer 312 corresponds to the pumping hole 3322 on the second sub-heat dissipation layer 332.

[0074] Figure 12 The flow path of the cooling medium in an active liquid cooling module 300 for an electronic device according to this embodiment is described. For example... Figure 12 As shown, in this embodiment, the cooling medium used can be pure water, plasma water, deionized water, or fluorinated liquid, etc. The cooling medium flow path, i.e., the cooling process, is as follows: First, the cooling medium in the heat-absorbing microchannels 3323 of the heat-absorbing fluid channel 3321 absorbs heat from the heating element 230 on the motherboard 210. Then, driven by the piezoelectric micropump 340, the cooling medium flows to the fluid connection channel 3121 in the flexible connection structure 310, and then passes through the fluid communication outlet hole 3123 of the second sub-flexible connection layer 312, entering the second... In the heat exchange structure 320, the groove inlet 322 of the grooved flow channel 321 flows to the groove outlet 323 through each heat-absorbing microchannel 3323 of the grooved flow channel 321 (heat is dissipated in the process), and then passes through the fluid communication inlet hole 3122 on the second sub-flexible connection layer 312 to enter the fluid connection channel 3121. It then enters the heat-absorbing microchannel 3323 of the heat-absorbing fluid channel 3321 through the fluid connection channel 3121 of the second sub-flexible connection layer 312, completing one cycle of the cooling medium, and repeating this cycle.

[0075] Example 2

[0076] like Figure 13 and Figure 14 As shown, an electronic device includes an active liquid cooling module as described in Embodiment 1. The electronic device further includes a flip-up portion 100 and a main body portion 200. The housing 120 of the flip-up portion is connected to the housing 220 of the main body portion via a pivot, allowing the flip-up portion 100 and the main body portion 200 to rotate vertically about a horizontal axis. A motherboard 210 is installed inside the housing 220 of the main body portion. Chips are mounted on the motherboard 210.

[0077] The electronic device is an electronic device with a flip structure, specifically a laptop computer in this embodiment. The flip portion 100 corresponds to the A-shell, B-shell, and screen module of the laptop computer; the main body portion 200 corresponds to the C-shell, D-shell, motherboard module, and keyboard module of the laptop computer. In some other embodiments, the electronic device may also be a foldable mobile phone, a foldable tablet computer, a computer with a flip structure, a wearable device with a flip structure, a robot with a flip structure, or other electronic devices with a flip structure.

[0078] Figure 13 The components and specific structure of an electronic device according to this embodiment are described. The active liquid cooling heat dissipation module 300 of the electronic device is installed inside the housing of the flip part 100 and the main body part 200.

[0079] The first heat exchange structure 330 in the active liquid cooling heat dissipation module 300 of the electronic device is fixed on the motherboard 210 in the main body 200, and the second heat exchange structure 320 is located in the flip-up part and includes a groove channel 321 formed on the inner surface of the housing 120 of the flip-up part.

[0080] The flexible connection structure passes through the rotating shaft to connect the first heat exchange structure 330 and the second heat exchange structure 320. The overall thickness of the first heat exchange structure 330, the second heat exchange structure 320, and the flexible connection structure 310 is very thin.

[0081] like Figure 13 As shown, a driving element is installed on the motherboard 210. The driving element drives the cooling medium to flow within the first heat exchange structure 330, the second heat exchange structure 320, and the flexible connection structure 310. The first heat exchange structure 330 covers the surface of the motherboard 210, completely covering the chips on the motherboard 210. The first heat exchange structure 330 has heat-absorbing fluid channels inside, and there are several heat-absorbing microchannels 3323 in the heat-absorbing fluid channels. Each heat-absorbing microchannel 3323 completely covers the chips. The driving element is a piezoelectric micropump, which is fixedly connected to the first heat exchange structure 330. Using a piezoelectric micropump as the driving element results in quiet operation and small size.

[0082] Figure 14 The heat dissipation process of the electronic device in this embodiment is described. For example... Figure 14As shown, the working process of the electronic device in this embodiment is as follows: When the electronic device is started, the active liquid cooling heat dissipation module of the electronic device will also be started at the same time. During operation, the chip on the motherboard 210 will generate heat. The cooling medium of the first heat exchange structure 330 in the active liquid cooling heat dissipation module of the electronic device absorbs the heat of the chip. The heat absorption microchannel 3323 in the heat absorption fluid channel of the first heat exchange structure 330 is in direct contact with the chip. After absorbing heat, the cooling medium enters the second heat exchange structure 320 through the flexible connection structure 310 and enters the second fluid channel in the second heat exchange structure 320 to dissipate heat on the surface of the shell 120 of the flip part of the electronic device. After dissipation, the cooling medium returns to the first heat exchange structure 330 of the electronic device to circulate heat dissipation.

[0083] In some embodiments, the inner surface of the housing on which the second heat exchange structure 320 is arranged is curved. Then, the grooved flow channel 321 of the second heat exchange structure 320 is formed on the curved surface, and the sealing film 324 is called curved, which closely fits and covers the grooved flow channel 321 formed on the curved surface.

[0084] Example 3

[0085] An electronic device, the difference between this embodiment and Embodiment 1, is that the electronic device is a drone with a flipping structure. The main body 200 is the fuselage of the drone. The flipping part 100 is the cantilever of the drone. The active liquid cooling module 300 of the electronic device has multiple second heat exchange structures 320. Each cantilever of the drone has one second heat exchange structure 320. The number of flexible connection structures 310 is the same as the number of second heat exchange structures 320 and they correspond one-to-one. The cooling medium in the first heat exchange structure 330 flows to the corresponding second heat exchange structure 320 through multiple flexible connection structures 310.

Claims

1. An active liquid cooling heat dissipation module for electronic devices, comprising a first heat exchange structure (330) and a second heat exchange structure (320); characterized in that: It also includes a flexible connection structure (310); the second heat exchange structure (320) includes a sealing membrane (324) and a grooved flow channel (321) formed on the inner side of the electronic device housing; the sealing membrane (324) completely covers the grooved flow channel (321); the flow channel in the first heat exchange structure (330) and the flow channel in the second heat exchange structure (320) are connected through the flow channel in the flexible connection structure (310) to form a circulating heat dissipation flow path; the flexible connection structure (310) can pass through the connection point of the two housings rotatably connected on the electronic device and bend and deform; The cooling medium in the circulating heat dissipation flow path is driven to circulate by a driving element; the first heat exchange structure (330) and the flexible connection structure (310) are in the form of sheets; the first heat exchange structure (330) is attached to the heat-generating element of the electronic device; The flexible connection structure (310) and the first heat exchange structure (330) are an integral structure formed by layering membrane structures; a through groove is opened on the middle membrane structure; the through groove on the middle membrane structure is closed by the membrane structures on both sides to form the flow channel of the flexible connection structure (310) and the first heat exchange structure (330); The flexible connection structure (310) has a first medium inlet / outlet port at one end away from the first heat exchange structure (330); the first medium inlet / outlet port includes a fluid communication outlet hole (3123) and a fluid communication inlet hole (3122); the flexible connection structure (310) has corresponding through holes for the fluid communication outlet hole (3123) and the fluid communication inlet hole (3122) on the membrane structure on the side of the closed membrane (324); the closed membrane (324) has a second medium inlet / outlet port that communicates with the groove channel (321); the first medium inlet / outlet port is connected to the second medium inlet / outlet port; The flow channel in the first heat exchange structure (330) includes a pump liquid area and a heat exchange area; the pump liquid area is provided with multiple pump liquid levels; each pump liquid level includes two pump liquid holes (3322) spaced apart; each pump liquid level is equipped with a driving element; the driving element is a piezoelectric micropump (340); the inlet and outlet of the piezoelectric micropump (340) are aligned with and connected to the two pump liquid holes (3322) of the corresponding pump liquid level.

2. The active liquid cooling heat dissipation module for electronic devices according to claim 1, characterized in that: The inner side of the electronic device housing with the groove flow channel (321) has a groove structure; the side shape and depth of the groove structure correspond to the side shape and thickness of the sealing film (324); the groove flow channel (321) is opened on the bottom surface of the groove structure; the sealing film (324) is embedded in the groove structure.

3. The active liquid cooling heat dissipation module for electronic devices according to claim 1, characterized in that: The grooved flow channel (321) includes a collection channel and multiple heat release microchannels (3211); each heat release microchannel (3211) is divided into multiple heat release channel groups; multiple heat release microchannels (3211) in the same heat release channel group are divided into multiple parallel heat release units; each heat release microchannel (3211) in the same parallel heat release unit is arranged in parallel; each parallel heat absorption unit in the same heat release channel group is arranged in series; the input end and output end of the heat release channel group are connected to the second medium inlet / outlet interface on the closed membrane (324) through the collection channel.

4. The active liquid cooling heat dissipation module for electronic devices according to claim 1, characterized in that: The flexible connection structure (310) is provided with spaced-apart bends; the bends form connection segments of different heights.

5. The active liquid cooling heat dissipation module for electronic devices according to claim 1, characterized in that: The coverage area of ​​the second heat exchange structure (320) is greater than that of the first heat exchange structure (330).

6. An electronic device comprising a flip-over portion (100) and a main body portion (200) rotatably connected together; wherein a heating element is provided in the main body portion (200); characterized in that: The electronic device further includes the active liquid cooling heat dissipation module of the electronic device as described in claim 1; the first heat exchange structure (330) covers the heat-generating element of the electronic device; the first heat exchange structure (330) is disposed in the housing of the main body part (200); and the second heat exchange structure (320) is disposed in the housing of the flip part (100).

7. An electronic device according to claim 6, characterized in that: The flip-over part (100) is connected to the main body part (200) via a rotating shaft (400); a radial through groove structure is provided on the rotating shaft (400); the flexible connection structure (310) passes through the radial through groove structure on the rotating shaft (400).

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