Leveling device and semiconductor processing equipment

Abstract

The invention relates to a leveling device and semiconductor processing equipment, and relates to the technical field of semiconductor equipment, in the technical scheme of the invention, the leveling device comprises a first part, a second part, an adjusting piece and a guiding piece. A guide hole is formed in the first part in the first direction, the second part comprises a connecting part and a protruding part which are connected with each other, the protruding part penetrates through the guide hole and is arranged in the guide hole, and the protruding part is rotatably connected to the first part around a first axis, so that the first part and the second part are connected together; and the first part and the second part can relatively move around the first axis. Therefore, when the pressure head needs to be leveled, the pressure head is connected with one end of the connecting part, so that the pressure head can move along with the movement of the connecting part, the lug boss moves in the guide hole by adjusting the adjusting piece, the second part moves relative to the first part, the pressure head also moves around the first axis relative to the first part, and the pressure head is leveled.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a leveling device and semiconductor processing equipment. Background Art

[0002] The bonding process precisely secures flexible materials, such as chip-on-film (COF) with anisotropic conductive adhesive, used in touchscreens and LCD modules, to specific terminals on glass or circuit boards. This process involves applying a constant pressure with a high-temperature indenter and maintaining that pressure for a period of time. This ruptures the conductive particles within the COF, allowing for smooth signal flow between the COF and the terminals. However, before the indenter is pressed down, it must be carefully leveled to ensure uniform flatness across the entire bonding surface. This ensures consistent pressure across the entire bonding area during the bonding operation.

[0003] If the pressing surface of the indenter is uneven, pressure differences will occur in different areas of the same plane during pressing. This can cause uneven explosion of the conductive particles within the anisotropic conductive adhesive film, or even over-explosion or under-explosion of some particles. Ultimately, these pressure differences can lead to unstable and uneven signal transmission, resulting in substandard bonding quality. Therefore, leveling the indenter is crucial. Summary of the Invention

[0004] Based on this, it is necessary to provide a leveling device and semiconductor processing equipment to improve the leveling accuracy of the pressure head.

[0005] According to one aspect of the present application, an embodiment of the present application provides a leveling device, the leveling device comprising:

[0006] The first part is provided with a guide hole along a first direction, and the guide hole is extended around a first axis;

[0007] The second part includes a connecting portion and a protruding portion connected to each other, the connecting portion is used to be detachably connected to the pressure head, and the protruding portion is inserted into the guide hole; and

[0008] an adjusting member, one end of the adjusting member being connected to the raised portion, and the other end of the adjusting member being coupled to the first portion; the adjusting member being configured to drive the raised portion to move in a target direction within the guide hole, so as to cause the connecting portion to rotate about the first axis;

[0009] The target direction is an extension direction of the guide hole around the first axis, and the extension direction of the first axis is parallel to the first direction.

[0010] In one embodiment, the leveling device further comprises:

[0011] a first mounting member fixedly connected to the first portion; and

[0012] a second mounting member, fixedly connected to the raised portion;

[0013] The first mounting member and the second mounting member are spaced apart in the second direction; the adjusting member includes a differential head, which includes a body and a measuring rod connected to each other, the body being mounted on the second mounting member, the measuring rod having a first end and a second end oppositely disposed, the first end being movably connected to the body in a direction pointing from the first end to the second end, and the second end abutting against the first mounting member;

[0014] The first direction and the second direction are perpendicular to each other.

[0015] In one embodiment, the adjusting member further comprises a screw, the screw is hinged to the second mounting member, and the screw is threadedly connected to the first mounting member.

[0016] In one embodiment, the leveling device further includes a guide member, which is provided on a side of the first portion facing away from the connecting portion, the raised portion has a first arc surface, the guide member has a second arc surface, the first arc surface abuts against the second arc surface, and the first arc surface and the second arc surface are both part of a cylindrical surface with the first axis as the center axis.

[0017] In one embodiment, the leveling device further comprises a pressing member, which is provided on a side of the protrusion facing away from the guide member;

[0018] The pressing member is used for pressing the protrusion so that the first arc surface of the protrusion abuts against the second arc surface of the guide member.

[0019] In one embodiment, the raised portion has a third arc surface, the pressing member is a first pressing bearing, and the outer ring of the first pressing bearing is slidably connected to the raised portion.

[0020] In one embodiment, the leveling device further comprises:

[0021] The third mounting member has an accommodating cavity; the connecting portion includes a connecting end disposed in the accommodating cavity, and the third mounting member is used to be fixedly connected to the pressure head;

[0022] The clamping piece is arranged in the accommodating cavity and is used for clamping the connecting end.

[0023] In one embodiment, the clamping member is a second compression bearing, and the connecting end has an inclined surface; from the direction of gravity, the inclined surface is inclined in a direction away from the central axis of the connecting end; and the inclined surface abuts against the second compression bearing.

[0024] In one embodiment, the first portion includes two first sub-portions spaced apart in a first direction, and a second sub-portion connecting the two first sub-portions; the two first sub-portions and the second sub-portion are arranged to form a receiving cavity with an opening, and part of the connecting portion is arranged in the receiving cavity; and / or

[0025] The first part and the connecting part are detachably connected.

[0026] According to another aspect of the present application, an embodiment of the present application provides a semiconductor processing equipment, including the leveling device and the pressure head in any of the above embodiments, and the pressure head is detachably connected to the leveling device.

[0027] In the above-mentioned leveling device and semiconductor processing equipment, the leveling device includes a first part, a second part, and an adjusting member. The first part has a guide hole along a first direction, and the guide hole extends around a first axis. The second part includes a connecting portion and a protruding portion connected to each other. The connecting portion is used to be detachably connected to the pressure head.

[0028] The protrusion is inserted into the guide hole, and the adjustment member is configured to drive the protrusion to move in a target direction within the guide hole, causing the connecting portion to rotate about the first axis. Thus, when the pressure head needs to be leveled, the pressure head is connected to one end of the connecting portion so that the pressure head can follow the movement of the connecting portion and move about the first axis. By adjusting the adjustment member, the protrusion is moved in the target direction within the guide hole, causing the second portion to move relative to the first portion, causing the pressure head to also move relative to the first portion about the first axis, thereby leveling the pressure head. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic structural diagram of a leveling device provided in some embodiments of the present application.

[0030] Figure 2 for Figure 1 A schematic structural diagram of the leveling device from another angle.

[0031] Figure 3 for Figure 1 Cross-sectional views of the locations where the micrometer head in the middle leveling device cooperates with the first mounting member and the second mounting member respectively.

[0032] Figure 4 for Figure 1 Schematic diagram of the three-dimensional structure of the micrometer head in the leveling device.

[0033] Figure 5 for Figure 1 Cross-sectional views of the locations where the screw in the middle leveling device cooperates with the first mounting member and the second mounting member respectively.

[0034] Figure 6 for Figure 1 Schematic diagram of the three-dimensional structure of the cooperation between the third mounting member and the connecting part in the middle leveling device.

[0035] Figure 7 for Figure 1 Schematic diagram of the structure of the middle leveling device from another angle.

[0036] Figure 8 for Figure 7 A partial enlarged view at point a.

[0037] The accompanying drawings in the specific implementation manner are as follows:

[0038] 100. Leveling Device, 1. Press Head, B1, First Part, B2, Second Part, C1, Guide Hole, L, Connecting Portion, D0, Connecting End, T, Raised Portion, J, Adjusting Part, A1, First Mounting Part, A2, Second Mounting Part, A3, Third Mounting Part, W, Differentiator Head, G1, Measuring Rod, BA, Body, D1, First End, D2, Second End, LD, Screw, Y, Guide, M1, First Arc Surface, M2, Second Arc Surface, M3, Third Arc Surface, E, Pressing Part, Z1, First Pressing Bearing, Q1, Accommodating Cavity, F, Clamping Part, Z2, Second Pressing Bearing, ZB1, First Sub-Part, Z2, Second Sub-Part, Q2, Accommodating Cavity, u, Opening;

[0039] F1, first direction, F2, second direction. DETAILED DESCRIPTION

[0040] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, the specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0041] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application.

[0042] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of technical features indicated. Therefore, a feature specified as "first" or "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0043] In this application, unless otherwise specified or limited, the terms "mounted," "connected," "connected," "fixed," etc., should be interpreted broadly. For example, these terms may refer to fixed connections, removable connections, or integration; mechanical connections or electrical connections; direct connections or indirect connections through an intermediary; and internal communication between two components or interaction between two components, unless otherwise specified. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0044] In this application, unless otherwise expressly specified or limited, if a first feature is described as being "above" or "below" a second feature, or similar descriptions, this may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is described as being "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is described as being "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0045] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only embodiment.

[0046] Reference Figure 1 and Figure 2 , Figure 1 Schematic diagram of the structure of the leveling device 100 provided in some embodiments of the present application is shown. Figure 2 Shown Figure 1 The leveling device 100 provided in one embodiment of the present application includes a first portion B1, a second portion B2 and an adjusting member J.

[0047] The first part B1 and the second part B2 are the basis of the leveling device 100 and can be configured as any structure and shape that is convenient for connection and movement, such as a plate or block, and the present application does not limit this.

[0048] Specifically, the first portion B1 has a guide hole C1 defined along a first direction F1. The second portion B2 includes a connecting portion L and a protrusion T connected to each other. The protrusion T extends through the guide hole C1, and the guide hole C1 extends about a first axis, such that the protrusion T can rotate along the guide hole C1 about the first axis. The first direction F1 and the extension direction of the first axis are parallel to each other.

[0049] The adjusting member J is a component for adjusting the relative position of the first part B1 and the second part B2. Since the pressure head 1 is installed on the connecting portion L of the second part B2, it is also a component for adjusting the relative position of the pressure head 1 and the first part B1.

[0050] Specifically, one end of the adjusting member J is connected to the protrusion T, and the other end is coupled to the first portion B1. The adjusting member J is configured to drive the protrusion T to move within the guide hole C1 in a target direction, thereby causing the connecting portion L to rotate about the first axis. The target direction refers to the direction in which the guide hole C1 extends about the first axis.

[0051] Among them, the adjusting part J is matched with the first part B1. When force is applied to the adjusting part J, a relative force will be generated between the adjusting part J and the first part B1. At the same time, the first part B1 will also give the adjusting part J a reaction force, so that the adjusting part J can move relative to the first part B1, and the adjusting part J and the second part B2 are fixedly connected, so the second part B2 can move relative to the first part B1 along with the adjusting part J.

[0052] In this way, the leveling device 100 can level the pressing head 1 so that the flatness of the pressing surface of the pressing head 1 is uniform, so that the pressing head 1 in the entire pressing area is uniform and stable during the pressing operation.

[0053] The leveling device 100 proposed in this application is manually adjusted. Compared with electronic control adjustment, the electronic control equipment is larger, occupies a large space, and has a complex structure and requires consideration of wiring issues, resulting in higher costs.

[0054] Compared to applying force directly to the pressure head 1 to level the pressure head 1, the present application adopts a method of indirectly adjusting the movement of the pressure head 1, which can further improve the adjustment accuracy of the pressure head 1. This is because the adjustment accuracy of the pressure head 1 is very high and requires a very small displacement, so the force applied to the pressure head 1 should be smaller, and the force needs to be applied to a part of the pressure head 1. During the force application process, hand shaking and the like are prone to occur, which will directly affect the movement of the pressure head 1, causing the pressure head 1 to move to a non-target position, and ultimately making it difficult to level the pressure head 1. In addition, applying force directly to the pressure head 1 may cause excessive force on the local part of the pressure head 1, thereby causing deformation or damage to the pressure head 1. Therefore, the leveling device 100 of the present application can improve the leveling accuracy of the pressure head 1.

[0055] In some embodiments of this application, reference may be made to Figure 1 Combined with reference Figure 3 and Figure 4 , Figure 3 Shown Figure 1 Cross-sectional views of the positions where the micrometer head W in the leveling device 100 cooperates with the first mounting member A1 and the second mounting member A2, Figure 4 Shown Figure 1 A schematic diagram of the three-dimensional structure of the micrometer head W in the leveling device 100. The leveling device 100 also includes a first mounting member A1 and a second mounting member A2. The first mounting member A1 is fixedly connected to the first portion B1; the second mounting member A2 is fixedly connected to the raised portion T. The first mounting member A1 and the second mounting member A2 are spaced apart in the second direction F2, and the first direction F1 and the second direction F2 are perpendicular to each other.

[0056] The first mounting member A1 and the second mounting member A2 provide a stable and firm mounting base for the micrometer head W, wherein the first mounting member A1 is connected to the first part B1, and the second mounting member A2 is connected to the protrusion T, so that the adjustment member J can change the relative position between the first part B1 and the protrusion T.

[0057] The adjusting part J includes a differential head W, which includes a main body BA and a measuring rod G1 connected to each other. The main body BA is installed on the second mounting part A2. The measuring rod G1 has a first end D1 and a second end D2 that are relatively set. The first end D1 is movably connected to the main body BA along the direction from the first end D1 to the second end D2, and the second end D2 is in contact with the first mounting part A1.

[0058] The adjustment member J is specifically configured as a micrometer head W, which comprises at least a measuring rod G1, a main body BA, and an operating handwheel. Rotating the operating handwheel of the micrometer head W drives the measuring rod G1 to move linearly relative to the main body BA, thereby moving the second end D2 of the measuring rod G1 relative to the first mounting member A1. This allows for minor adjustments to the position of the indenter 1, thereby improving the leveling accuracy of the indenter 1. The operator can also precisely read the movement distance of the measuring rod G1 using the dial on the micrometer head W, thereby achieving precise control of the relative position.

[0059] Furthermore, the first mounting member A1 and the second mounting member A2 can both extend along the first direction F1 and be spaced apart in the second direction F2, with the first and second directions F2 being perpendicular to each other. In this case, the first and second mounting members A1 and A2 each have a certain length in the first direction F1, making it easier to install the adjustment member J. Furthermore, when the measuring rod G1 extends in the second direction F2, the force applied by the measuring rod G1 is directed in the second direction F2. Since the second mounting member A2 extends in the first direction F1, the force applied in this direction is perpendicular to the force-bearing surface of the second mounting member A2, allowing for more direct and effective transmission of force to the force-bearing surface. The first mounting member A1 also extends in the first direction F1. In this way, the spacing between the first and second mounting members A1 and A2 in the second direction F2 is the same, thereby enabling the measuring rod G1 of the micrometer head W to oscillate. The length and spacing between the first and second mounting members A1 and A2 can be adjusted as needed to accommodate first portions B1 and protrusions T of varying sizes and positions.

[0060] In some embodiments of the present application, continue to refer to Figure 1 , and combined with reference Figure 5 , Figure 5 Shown Figure 1 The cross-sectional view of the screw LD in the middle leveling device 100 respectively cooperates with the first mounting member A1 and the second mounting member A2. The adjusting member J also includes a screw LD, which is threadedly connected to the first mounting member A1 and hinged to the second mounting member A2.

[0061] The threaded connection of screw LD has high precision, and the position of the pressure head 1 can be finely adjusted by rotating the screw LD. Specifically, tightening the screw LD causes the second mounting member A2 to move toward the first mounting member A1, and loosening the screw LD causes the second mounting member A2 to move away from the first mounting member A1.

[0062] Among them, the screw LD is hinged to the second mounting part A2, so that the screw LD can move relative to the second part B2. In this way, when the screw LD is loosened, the screw rod of the screw LD is unscrewed from the first part B1, so that the distance between the first mounting part A1 and the second mounting part A2 becomes larger. Since the screw LD is hinged to the second mounting part A2, an installation space that can adapt to the movement of the screw LD is provided in the second mounting part A2, so that the screw LD can drive the second mounting part A2 to move in a direction away from the first mounting part A1, thereby reducing the relative movement of the first mounting part A1 and the second mounting part A2 and causing jamming or excessive constraint.

[0063] The screw LD can also be used as a fastener. When the pressure head 1 has completed leveling, the screw LD is no longer affected. The screw LD is fixedly connected to the first mounting member A1 and the second mounting member A2, so that the relative positions of the first mounting member A1 and the second mounting member A2 remain unchanged, so that the pressure head 1 no longer moves.

[0064] In other embodiments, a telescopic rod or a spring may be used as the adjusting member J, which is not limited here.

[0065] In some embodiments of the present application, continue to refer to Figure 1 and Figure 2 The leveling device 100 also includes a guide member Y, which is arranged on the side of the first part B1 away from the connecting part L. The raised portion T has a first arc surface M1, and the guide member Y has a second arc surface M2. The first arc surface M1 abuts against the second arc surface M2; wherein the first arc surface M1 and the second arc surface M2 are both part of a cylindrical surface with the first axis as the center axis.

[0066] This application also proposes a guide member Y. By positioning the guide member Y on the side of the first portion B1 facing away from the connection portion L, the raised portion T has a first curved surface M1, and the guide member Y has a second curved surface M2. The first curved surface M1 and the second curved surface M2 abut against each other. The cooperation between the guide member Y and the curved surface of the raised portion T can more accurately define the motion trajectory of the raised portion T, allowing the indenter 1 to move along a predetermined path and improve leveling accuracy. Furthermore, the cooperation between the first curved surface M1 and the second curved surface M2 can reduce error accumulation, making the movement of the indenter 1 more accurate.

[0067] In some embodiments of the present application, continue to refer to Figure 1 and Figure 2 The leveling device 100 also includes a pressing member E, which is arranged on the side of the protrusion T away from the guide member Y. The pressing member E is used to press the protrusion T so that the first arc surface M1 of the protrusion T abuts against the second arc surface M2 of the guide member Y.

[0068] Furthermore, the present application also provides a pressing member E, which is located on the side of the protrusion T facing away from the guide member Y. By applying pressure to the protrusion T, the first curved surface M1 of the protrusion T is tightly fitted with the second curved surface M2 of the guide member Y. This tight fit enables stable contact between the protrusion T and the guide member Y, reducing the risk of shaking or displacement caused by poor contact between the protrusion T and the guide member Y during the leveling process, thereby improving the stability and reliability of the leveling device 100.

[0069] In some embodiments of the present application, continue to refer to Figure 1 and Figure 2 The raised portion T has a third arc surface M3, the pressing member E is a first pressing bearing Z1, and the outer ring of the first pressing bearing Z1 is slidably connected to the raised portion T.

[0070] The first compression bearing Z1 consists of an inner ring, an outer ring, and rolling elements. When the first compression bearing Z1 functions as the compression element E, its outer ring contacts the third arcuate surface M3 of the raised portion T, and the rolling elements roll between the inner and outer rings, reducing the sliding friction between the outer ring and the third arcuate surface M3. This low friction makes the compression element E more flexible during adjustment, allowing operators to make fine adjustments with less force, facilitating more precise leveling operations and further improving the accuracy of the leveling device 100.

[0071] In some embodiments of this application, reference may be made to Figure 1 Combined with reference Figure 6 , Figure 6 Shown Figure 1 A schematic diagram of the three-dimensional structure of the third mounting member A3 and the connecting portion L in the leveling device 100. The leveling device 100 also includes a third mounting member A3 having an accommodating cavity Q1 and a clamping member F. The connecting portion L includes a connecting end D0 disposed within the accommodating cavity Q1, and the third mounting member A3 is used to securely connect to the pressure head 1. The clamping member F is disposed within the accommodating cavity Q1 and is used to clamp the connecting end D0.

[0072] The leveling device 100 further includes a third mounting member A3 having an accommodating cavity Q1 and a clamping member F. The connecting portion L includes a connecting end D0 disposed within the accommodating cavity Q1, and the third mounting member A3 is configured to be fixedly connected to the pressure head 1. The clamping member F is disposed within the accommodating cavity Q1 and is configured to clamp the connecting end D0.

[0073] The pressure head 1 and the third mounting member A3 are fixedly connected. The connection method is not limited here. Bolt connection or welding can be adopted to form a whole between the pressure head 1 and the third mounting member A3, reducing the risk of relative displacement or shaking of the pressure head 1 when subjected to force. The connection end D0 of the connecting part L is located in the accommodating cavity Q1 of the third mounting member A3 and is clamped by the clamping member F, further enhancing the stability of the connection. The clamping effect of the clamping member F can prevent the connection end D0 from loosening or rotating in the accommodating cavity Q1, thereby improving the reliability of the connection between the pressure head 1 and the leveling device 100. In addition, this structural design reduces the risk of loss of leveling accuracy due to displacement or shaking of the pressure head 1 after leveling through the stable support of the pressure head 1, thereby further improving the leveling accuracy of the pressure head 1.

[0074] In some embodiments of the present application, continue to refer to Figure 1 and Figure 6 The clamping member F is a second clamping bearing Z2, and the connecting end D0 has an inclined surface. From the direction of gravity, the inclined surface is inclined in a direction away from the central axis of the connecting end; and the inclined surface abuts against the second clamping bearing Z2.

[0075] The provision of the second hold-down bearing Z2 also reduces friction between the connection end D0 and the clamping member F. Furthermore, the contact between the inclined surface of the connection end D0 and the second hold-down bearing Z2 provides a certain degree of rotational flexibility. During the leveling process of the leveling device 100, low friction and flexibility make it easier to adjust the position of the pressure head 1. For example, when fine-tuning the position of the pressure head 1 is necessary, only a small amount of force is required to move the pressure head 1, further improving the accuracy of the leveling operation.

[0076] Furthermore, the inclined surface is positioned in the direction of gravity, tilting away from the central axis of the connecting end D0. When the second hold-down bearing Z2 applies a force to the inclined surface, this force is decomposed into a first component perpendicular to the inclined surface and a second component along the inclined surface. The second component can be considered as a force that induces relative motion between the second hold-down bearing Z2 and the inclined surface. However, due to the interaction between the tab hold-down bearing Z2 and the connecting end D0, this force component along the inclined surface actually transforms into a clamping force, helping to secure the connecting end D0 in place. This helps to enhance the clamping effect on the connecting end D0.

[0077] In other embodiments, a stop block may be in contact with the connecting end D0 so that the pressing head 1 does not separate from the connecting piece.

[0078] In some embodiments of the present application, continue to refer to Figure 1 The first part B1 includes two first sub-parts ZB1 spaced apart in the first direction F1, and a second sub-part ZB2 connecting the two first sub-parts ZB1; the two first sub-parts ZB1 and the second sub-part ZB2 are arranged to form a accommodating cavity Q2 with an opening u, and a partial connecting part L is arranged in the accommodating cavity Q2; and / or the first part B1 and the connecting part L are detachably connected.

[0079] In the case where "the first part B1 includes two first sub-parts ZB1 spaced apart in a first direction F1, and a second sub-part ZB2 connecting the two first sub-parts ZB1; the two first sub-parts ZB1 and the second sub-parts ZB2 enclose an accommodating cavity Q2 having an opening u, and a portion of the connecting part L is disposed within the accommodating cavity Q2," relative displacement of the two first sub-parts ZB1 within a certain range is permitted, enabling fine-tuning of the position of the connecting part L during installation. By adjusting the relative position of the two first sub-parts ZB1, the connecting part L can be more precisely installed in the appropriate position, ensuring proper fit between the connecting part L and the other components of the leveling device 100.

[0080] Furthermore, this structural design allows the first portion B1 to form a receiving cavity Q2 having an opening u, providing a compact installation space for the connecting portion L. Part of the connecting portion L is disposed within the receiving cavity Q2, effectively utilizing space and making the layout of the entire leveling device 100 more rational and compact, thereby reducing the overall volume of the leveling device 100 and facilitating installation and integration of the leveling device 100.

[0081] In the case of a detachable connection between the first portion B1 and the connecting portion L, specifically, a through-hole is provided in the first portion B1, and a threaded hole is provided in the connecting portion L. The fastener passes through the through-hole and the threaded hole in sequence, thereby securing the connecting portion L to the first portion B1. A gap is left between the through-hole and the fastener. This allows the fastener to flexibly adjust its position within the through-hole when mating with the threaded hole, allowing it to be screwed into the threaded hole more smoothly and achieve precise fixation.

[0082] After the leveling is completed, the first portion B1 and the connection portion L are threadedly connected together, so that the pressure head 1 does not move or shake, thereby improving the leveling accuracy of the leveling device 100. The detachable connection method is not limited, and a threaded connection can be used.

[0083] The above-mentioned "the first part B1 includes two first sub-parts ZB1 spaced apart in the first direction F1, and a second sub-part ZB2 connecting the two first sub-parts ZB1; the two first sub-parts ZB1 and the second sub-part ZB2 are arranged to form a accommodating cavity Q2 with an opening u, and part of the connecting part L is arranged in the accommodating cavity Q2" and "the first part B1 and the connecting part L are detachably connected" can be arbitrarily combined according to actual conditions.

[0084] Based on the same inventive concept, the present application provides a semiconductor processing device, including the leveling device 100 and the pressure head 1 in any of the above embodiments, wherein the pressure head 1 and the leveling device 100 are detachably connected, and can continue to refer to Figure 1 , and combined with reference Figure 7 and Figure 8 , Figure 7 Shown Figure 1 A structural diagram of the middle leveling device 100 from another angle, Figure 8 for Figure 7 In the partial enlarged view at a, the leveling device 100 can be used for leveling different types of press heads 1 .

[0085] In the technical solution of the embodiment of the present application, since the semiconductor processing equipment includes the leveling device 100 in any of the above embodiments, it also has the advantages of any of the above embodiments. Among them, the semiconductor processing equipment includes a die bonder, a flip chip machine, etc.

[0086] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0087] The above embodiments merely illustrate several implementation methods of the present application. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present application, all of which fall within the scope of protection of the present application. Therefore, the scope of protection of the present patent application shall be determined by the appended claims.

Claims

1. A leveling device, characterized in that: The leveling device comprises: The first part is provided with a guide hole along a first direction, and the guide hole is extended around a first axis; The second part includes a connecting portion and a protruding portion connected to each other, wherein the connecting portion is used to be detachably connected to the pressure head, and the protruding portion is inserted into the guide hole; and an adjusting member, one end of the adjusting member being connected to the protruding portion, and the other end of the adjusting member being coupled to the first portion; the adjusting member being configured to drive the protruding portion to move in the guide hole along a target direction so as to cause the connecting portion to rotate about the first axis; The target direction is an extension direction of the guide hole around the first axis, and the extension direction of the first axis is parallel to the first direction.

2. The leveling device according to claim 1, characterized in that: The leveling device further comprises: a first mounting member fixedly connected to the first portion; and a second mounting member, fixedly connected to the raised portion; wherein the first mounting member and the second mounting member are spaced apart in the second direction; the adjusting member comprises a differential head, the differential head comprising a body and a measuring rod connected to each other, the body being mounted on the second mounting member, the measuring rod having a first end and a second end oppositely disposed, the first end being movably connected to the body in a direction from the first end to the second end, and the second end being in contact with the first mounting member; The first direction and the second direction are perpendicular to each other.

3. The leveling device according to claim 2, characterized in that: The adjusting member further comprises a screw, the screw is hinged to the second mounting member, and the screw is threadedly connected to the first mounting member.

4. The leveling device according to claim 1, characterized in that: The leveling device also includes a guide member, which is arranged on the side of the first part away from the connecting part. The raised part has a first arc surface, and the guide member has a second arc surface. The first arc surface abuts against the second arc surface, and the first arc surface and the second arc surface are both part of a cylindrical surface with the first axis as the center axis.

5. The leveling device according to claim 4, characterized in that: The leveling device further includes a pressing member, which is provided on a side of the protrusion facing away from the guide member; The pressing member is used to press the protrusion so that the first arc surface of the protrusion abuts against the second arc surface of the guide member.

6. The leveling device according to claim 5, characterized in that: The raised portion has a third arc surface, the pressing member is a first pressing bearing, and the outer ring of the first pressing bearing is slidably connected to the raised portion.

7. The leveling device according to any one of claims 1 to 6, characterized in that: The leveling device further comprises: a third mounting member having an accommodating cavity; the connecting portion includes a connecting end disposed in the accommodating cavity, and the third mounting member is used to be fixedly connected to the pressure head; A clamping member is provided in the accommodating cavity, and the clamping member is used for clamping the connecting end.

8. The leveling device according to claim 7, characterized in that: The clamping member is a second compression bearing, and the connecting end has an inclined surface; from the direction of gravity, the inclined surface is inclined in a direction away from the central axis of the connecting end; and the inclined surface abuts against the second compression bearing.

9. The leveling device according to any one of claims 1 to 6, characterized in that: The first portion includes two first sub-portions spaced apart in the first direction, and a second sub-portion connecting the two first sub-portions; the two first sub-portions and the second sub-portion are arranged to form a receiving cavity with an opening, and part of the connecting portion is arranged in the receiving cavity; and / or The first portion and the connecting portion are detachably connected.

10. A semiconductor processing equipment, characterized in that: It comprises the leveling device and the pressure head according to any one of claims 1 to 9, wherein the pressure head is detachably connected to the leveling device.

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