A voltage regulating device for SIC semiconductor wet processing and semiconductor processing equipment

Abstract

The present invention relates to the field of semiconductor processing, and discloses a pressure regulating device for SIC semiconductor wet processing and semiconductor processing equipment, comprising an etching equipment body, wherein one end of the etching equipment body is fixedly connected to a barometer housing, the inner cavity of the barometer housing is fixedly connected to a dial, the middle of the dial is rotatably connected to a first rotating shaft, one end of the first rotating shaft is fixedly connected to a pointer, the bottom end of the barometer housing is fixedly connected to a connecting air pipe, one end of the connecting air pipe is fixedly connected to the etching equipment body, the other end of the connecting air pipe is fixedly connected to a Bourdon tube, one end of the Bourdon tube is rotatably connected to a first connecting rod, and one end of the first connecting rod is rotatably connected to a second connecting rod. Compared with the prior art, the present application allows bubbles generated by a chemical reaction in a semiconductor being etched within the etching equipment body to float up faster, thereby reducing the occurrence of bubbles adhering to the outer wall of the semiconductor, resulting in wet etching failure or poor results.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing, in particular to a voltage regulating device for SIC semiconductor wet processing and semiconductor processing equipment. Background Art

[0002] Silicon carbide is an inorganic substance with the chemical formula SIC. It is made by smelting quartz sand, petroleum coke (or coal coke), sawdust (salt is needed to produce green silicon carbide) and other raw materials through high-temperature smelting in a resistance furnace. Silicon carbide is a semiconductor and exists in nature in the form of the extremely rare mineral moissanite.

[0003] In the prior art, Chinese patent publication CN115692259A proposes a pressure regulating device for semiconductor reaction equipment and semiconductor reaction equipment. These devices solve the problem of preventing the generation of mechanical particles while achieving rapid and precise regulation of the pressure within the chamber. However, in actual application, there is still a problem. When wet processing a SIC semiconductor, the chemical reaction generated by the etchant when wet etching the SIC semiconductor will form bubbles. The bubbles adhere to the outer wall of the SIC semiconductor, causing corrosion to terminate, thus affecting the final effect of the SIC semiconductor wet etching. Therefore, the present invention discloses a pressure regulating device for SIC semiconductor wet processing and semiconductor processing equipment to meet the demand for better wet etching effect. Summary of the Invention

[0004] In response to the shortcomings of the existing technology, the present invention provides a voltage regulating device for SIC semiconductor wet processing and semiconductor processing equipment, which has the advantages of reducing bubbles generated during wet etching, and solves a series of problems such as bubbles affecting the final effect of SIC semiconductor wet etching.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a pressure regulating device for SIC semiconductor wet processing, comprising an etching equipment body, one end of the etching equipment body being fixedly connected to a barometer case, an inner cavity of the barometer case being fixedly connected to a dial, a middle portion of the dial being rotatably connected to a first rotating shaft, one end of the first rotating shaft being fixedly connected to a pointer, a bottom end of the barometer case being fixedly connected to a connecting air pipe, one end of the connecting air pipe being fixedly connected to the etching equipment body, and the other end of the connecting air pipe being fixedly connected to a Bourdon tube, one end of the Bourdon tube being rotatably connected to a first connecting rod, one end of the first connecting rod being rotatably connected to a second connecting rod, one end of the second connecting rod being fixedly connected to a second rotating shaft, a middle portion of the second rotating shaft being fixedly connected to a half gear, one end of the half gear being meshed with a circular gear, the circular gear being fixedly connected to the other end of the first rotating shaft, one end of the second rotating shaft being rotatably connected to a fixing bracket, the fixing bracket being fixedly connected to the barometer case, and one end of the second rotating shaft being provided with an exhaust assembly, the exhaust assembly extracting gas from the etching equipment body.

[0006] Preferably, the vacuum assembly includes an insulating ring fixedly connected to the second rotating shaft, one end of the insulating ring is fixedly connected to a control rod, the inner wall of the barometer case is fixedly connected to a limit block, a movable groove is provided in the middle of the limit block, one end of the movable groove is fixedly connected to a first touch block, one end of the first touch block is fixedly connected to a first wire, one end of the first wire passes through the outside of the barometer case and is fixedly connected to an vacuum pump, and the vacuum pump is fixedly connected to the etching equipment body.

[0007] Preferably, both ends of the first rotating shaft are rotatably connected to the barometer case and the dial respectively, the pointer is located on one side of the dial, the circular gear is located on the other side of the dial, and the second connecting rod is a U-shaped bent pipe.

[0008] Preferably, the limiting block is an arc-shaped block, the center of the limiting block and the center of the second rotating shaft are the same point, and the control rod is slidably connected to the movable groove.

[0009] Preferably, one end of the etching equipment body is fixedly connected to a limiting frame, a glass sealing door is slidably connected inside the limiting frame, one end of the glass sealing door is fixedly connected to a sealing ring, and the sealing ring is adapted to the glass sealing door.

[0010] Preferably, a coil spring is fixedly connected to the middle of the first rotating shaft, one end of the coil spring is fixedly connected to the dial, and one side of the barometric case is made of transparent glass.

[0011] Preferably, the other end of the movable groove is fixedly connected to the second touch block, one end of the control rod is fitted with the first touch block and the second touch block, one end of the second touch block is fixedly connected to the second wire, the inner wall of the etching device body is fixedly connected to the insulating frame, one end of the insulating frame is fixedly connected to the electromagnetic block, the inner wall of the etching device body is rotatably connected to the push rod, one side of the push rod is fitted with the electromagnetic block, one end of the etching device body is fixedly connected to the air outlet pipe, the two ends of the air outlet pipe are respectively fixedly connected to the first fixing ring and the second fixing ring, one end of the second fixing ring is fixedly connected to the sealing block, the sealing block includes a spring and a sealing plate, the sealing plate is fixedly connected to the spring, the sealing plate is fitted with the first fixing ring, one end of the push rod passes through the first fixing ring and is fitted with the sealing plate, and the second wire is fixedly connected to the electromagnetic block.

[0012] Preferably, the push rod is an arc-shaped magnet, and the electromagnetic block and the push rod are magnets of the same polarity after being energized.

[0013] Preferably, the diameter of the sealing plate of the sealing block is larger than the diameter of the inner wall of the first fixing ring and smaller than the diameter of the inner wall of the air outlet pipe.

[0014] A semiconductor processing device for SIC semiconductor wet processing comprises the above-mentioned voltage regulating device for SIC semiconductor wet processing.

[0015] Compared with the prior art, the present invention provides a voltage regulating device for SIC semiconductor wet processing and semiconductor processing equipment, which has the following beneficial effects:

[0016] 1. The SIC semiconductor wet processing pressure regulating device and semiconductor processing equipment, when the air pressure in the etching equipment body changes, the air pressure in the connecting air pipe and the Bourdon tube also changes, causing the Bourdon tube to change shape, so that the Bourdon tube drives the second connecting rod to rotate via the first connecting rod, so that the second connecting rod drives the half gear to rotate via the second rotating shaft, and so that the half gear drives the first rotating shaft and the pointer to rotate via the circular gear, so that the staff can easily observe the air pressure in the etching equipment body according to the pointer. When the air pressure in the etching equipment body is greater than the set air pressure, the exhaust component is activated to extract the air pressure in the etching equipment body, so that the air pressure in the etching equipment body is lowered, so that bubbles generated during the chemical reaction of the semiconductor being etched in the etching equipment body can float up faster, thereby reducing the possibility of bubbles adhering to the outer wall of the semiconductor, resulting in wet etching failure or poor effect.

[0017] 2. The SIC semiconductor wet processing voltage regulating device and semiconductor processing equipment controls whether the etching equipment body is sealed by pushing the glass sealing door, which is convenient to use. After the pressure in the etching equipment body is reduced, the second wire and the sealing ring are more closely attached, making the sealing performance of the etching equipment body better and facilitating etching.

[0018] 3. The SIC semiconductor wet processing pressure regulating device and semiconductor processing equipment limit the rotation position of the push rod through the etching equipment body, so that the electromagnetic block will push the push rod to rotate when energized. After the push rod penetrates the first fixed ring and pushes the sealing block to move, the air outside the etching equipment body will pass through the middle hole of the second fixed ring, the gap between the sealing block and the air outlet pipe, and the middle hole of the first fixed ring to enter the interior of the etching equipment body, thereby increasing the air pressure in the etching equipment body and facilitating the opening of the glass sealed door. When the air pressure in the etching equipment body is too low, the control rod will rotate to fit the second touch block, so that the second touch block controls the electromagnetic block to be energized through the second wire, so that the electromagnetic block pushes the sealing block to move through the push rod, so that the air outside the etching equipment body enters the inner cavity of the etching equipment body, increases the air pressure in the etching equipment body, and thus ensures the normal progress of the etching reaction, avoids the failure of semiconductor etching due to too low air pressure in the etching equipment body, and improves the probability of successful semiconductor etching. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0020] Figure 2 It is a schematic diagram of a partially cutaway three-dimensional structure of the etching device body of the present invention;

[0021] Figure 3 It is a partially cutaway three-dimensional structural schematic diagram of the limiting frame and the glass sealing door of the present invention;

[0022] Figure 4 It is a schematic diagram of the partially cutaway structure of the air outlet pipe, the first fixing ring and the second fixing ring of the present invention;

[0023] Figure 5 It is a partially cutaway three-dimensional structural diagram of the barometer case and dial of the present invention;

[0024] Figure 6 It is a schematic diagram of the partially cutaway three-dimensional structure of the limit block of the present invention.

[0025] In the figure: 1. Etching equipment body; 2. Barometer case; 3. Dial; 4. First rotating shaft; 5. Pointer; 6. Connecting air pipe; 7. Bourdon tube; 8. First connecting rod; 9. Second connecting rod; 10. Second rotating shaft; 11. Half gear; 12. Circular gear; 13. Coil spring; 14. Fixed frame; 15. Insulating ring; 16. Control rod; 17. Limit block; 18. Moving slot; 19. First touch block; 20. First wire; 21. Vacuum pump; 22. Second touch block; 23. Second wire; 24. Electromagnetic block; 25. Insulating frame; 26. Push rod; 27. Exhaust pipe; 28. First fixing ring; 29. ​​Second fixing ring; 30. Sealing block; 31. Limit frame; 32. Glass sealing door; 33. Sealing ring. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] As introduced in the background technology, the existing technology has deficiencies. In order to solve the above technical problems, the present application proposes a voltage regulating device for SIC semiconductor wet processing and a semiconductor processing equipment.

[0028] In a typical embodiment of the present application, Figures 1-6As shown, a pressure regulating device for SIC semiconductor wet processing includes an etching equipment body 1, one end of the etching equipment body 1 is fixedly connected to a pressure gauge case 2, the inner cavity of the pressure gauge case 2 is fixedly connected to a dial 3, the middle of the dial 3 is rotatably connected to a first rotating shaft 4, one end of the first rotating shaft 4 is fixedly connected to a pointer 5, the bottom end of the pressure gauge case 2 is fixedly connected to a connecting air pipe 6, one end of the connecting air pipe 6 is fixedly connected to the etching equipment body 1, the other end of the connecting air pipe 6 is fixedly connected to a Bourdon tube 7, one end of the Bourdon tube 7 is rotatably connected to a first connecting rod 8, one end of the first connecting rod 8 is rotatably connected to a second connecting rod 9, one end of the second connecting rod 9 is fixedly connected to a second rotating shaft 10, the middle of the second rotating shaft 10 is fixedly connected to a half gear 11, and the half gear 1 1 is meshed with a circular gear 12, and the circular gear 12 is fixedly connected to the other end of the first rotating shaft 4. One end of the second rotating shaft 10 is rotatably connected to a fixing bracket 14, and the fixing bracket 14 is fixedly connected to the barometer case 2. An exhaust component is provided at one end of the second rotating shaft 10, and the exhaust component extracts the gas in the etching equipment body 1. When in use, the barometer case 2 is fixedly connected to one end of the etching equipment body 1, and the inner cavity of the barometer case 2 is fixedly connected to the dial 3, so that the etching equipment body 1 fixes the position of the barometer case 2, and the barometer case 2 fixes the position of the dial 3. The first rotating shaft 4 is rotatably connected to the middle part of the dial 3, and one end of the first rotating shaft 4 is fixedly connected to the pointer 5, so that the dial 3 limits the rotation position of the first rotating shaft 4, so that the first rotating shaft 4 will drive the pointer 5 rotates together, and is fixedly connected to a connecting air pipe 6 through the bottom end of the barometer case 2. One end of the connecting air pipe 6 is fixedly connected to the etching device body 1, and the other end of the connecting air pipe 6 is fixedly connected to a Bourdon tube 7. One end of the Bourdon tube 7 is rotatably connected to a first connecting rod 8, and one end of the first connecting rod 8 is rotatably connected to a second connecting rod 9. One end of the second connecting rod 9 is fixedly connected to a second rotating shaft 10. A half gear 11 is fixedly connected to the middle of the second rotating shaft 10. One end of the half gear 11 is engaged with a circular gear 12, and the circular gear 12 is fixedly connected to the other end of the first rotating shaft 4. One end of the second rotating shaft 10 is rotatably connected to a fixing bracket 14, and the fixing bracket 14 is fixedly connected to the barometer case 2, so that the barometer case 2 limits the rotation position of the second rotating shaft 10 through the fixing bracket 14. The arrangement makes it possible that when the air pressure in the etching equipment body 1 changes, the air pressure in the connecting air pipe 6 and the Bourdon tube 7 will also change, thereby causing the Bourdon tube 7 to change in shape, so that the Bourdon tube 7 drives the second connecting rod 9 to rotate through the first connecting rod 8, so that the second connecting rod 9 drives the half gear 11 to rotate through the second rotating shaft 10, so that the half gear 11 drives the first rotating shaft 4 and the pointer 5 to rotate through the circular gear 12, so that the staff can easily observe the air pressure in the etching equipment body 1 according to the pointer 5, and an exhaust component is provided at one end of the second rotating shaft 10. The exhaust component extracts the gas in the etching equipment body 1, so that when the air pressure in the etching equipment body 1 is greater than the set air pressure, the exhaust component is started to extract the air pressure in the etching equipment body 1, so that the air pressure in the etching equipment body 1 is lower.As a result, bubbles generated during chemical reactions in the semiconductor being etched in the etching device body 1 can float up quickly, reducing the risk of bubbles adhering to the outer wall of the semiconductor, leading to wet etching failure or poor results.

[0029] As a preferred implementation in this embodiment, refer to the attached Figure 2-Figure 6, the exhaust assembly includes an insulating ring 15 fixedly connected to the second rotating shaft 10, one end of the insulating ring 15 is fixedly connected to the control rod 16, the inner wall of the barometer case 2 is fixedly connected to the limit block 17, the middle part of the limit block 17 is provided with a moving groove 18, one end of the moving groove 18 is fixedly connected to the first touch block 19, one end of the first touch block 19 is fixedly connected to the first wire 20, the first wire 20 passes through the end of the outside of the barometer case 2 and is fixedly connected to the exhaust pump 21, the exhaust pump 21 is fixedly connected to the etching equipment body 1, the two ends of the first rotating shaft 4 are respectively rotatably connected to the barometer case 2 and the dial 3, the pointer 5 is located on one side of the dial 3, the circular gear 12 is located on the other side of the dial 3, the second connecting rod 9 is a U-shaped bend, the limit block 17 is an arc block, the limit block 1 The center of the circle of 7 is the same as the center of the circle of the second rotating shaft 10. The control rod 16 is slidably connected to the movable groove 18. One end of the control rod 16 is fitted with the first touch block 19 and the second touch block 22. The middle part of the first rotating shaft 4 is fixedly connected with a coil spring 13. One end of the coil spring 13 is fixedly connected to the dial 3. One side of the barometer case 2 is made of transparent glass. One end of the etching device body 1 is fixedly connected to a limit frame 31. A glass sealing door 32 is slidably connected to the limit frame 31. One end of the glass sealing door 32 is fixedly connected to a sealing ring 33. The sealing ring 33 is adapted to the glass sealing door 32. The exhaust component includes an insulating ring 15 fixedly connected to the second rotating shaft 10. One end of the insulating ring 15 is fixedly connected to the control rod 16. The inner wall of the barometer case 2 is fixedly connected A limit block 17 is provided with a movable groove 18 in the middle of the limit block 17, one end of the movable groove 18 is fixedly connected to a first touch block 19, one end of the first touch block 19 is fixedly connected to a first wire 20, and one end of the first wire 20 that passes through the outside of the barometer case 2 is fixedly connected to an air pump 21, and the air pump 21 is fixedly connected to the etching device body 1, so that the Bourdon tube 7 is deformed under the drive of the air pressure change, so that when the second rotating shaft 10 rotates, the second rotating shaft 10 drives the control rod 16 to rotate through the insulating ring 15, and when the control rod 16 is in contact with the first touch block 19, the air pump 21 is controlled to start through the first wire 20 to extract the gas in the etching device body 1, so that the air pressure in the etching device body 1 is reduced, and the air pressure in the etching device body 1 is reduced to the required level. After the interval, the control rod 16 is driven by the second rotating shaft 10 to rotate to a position where it is not in contact with the first touch block 19. At this time, the air pump 21 is turned off and stops extracting the gas in the etching equipment body 1, thereby realizing automatic control of the air pressure in the etching equipment body 1. The two ends of the first rotating shaft 4 are rotatably connected to the air pressure gauge case 2 and the dial 3 respectively, so that the air pressure gauge case 2 and the dial 3 limit the rotation of the first rotating shaft 4. The pointer 5 is located on one side of the dial 3 and the circular gear 12 is located on the other side of the dial 3, so that the user can easily view the displayed air pressure through the dial 3. The second connecting rod 9 is a U-shaped bend pipe, so that the second connecting rod 9 can drive the half gear 11 to rotate. The limit block 17 is an arc block, and the center of the limit block 17 is the same as the center of the second rotating shaft 10.The control rod 16 is slidably connected to the movable groove 18, so that the second rotating shaft 10 can drive the control rod 16 to rotate in the movable groove 18. One end of the control rod 16 is fitted with the first touch block 19 and the second touch block 22, so that the control rod 16 can form a switch with the first touch block 19 and the second touch block 22 respectively, so as to facilitate the control of the air pressure in the etching device body 1. A coil spring 13 is fixedly connected to the middle of the first rotating shaft 4, and one end of the coil spring 13 is fixedly connected to the dial 3, so that the coil spring 13 can help the first rotating shaft 4 to rotate to its original position. One side of the air pressure meter case 2 is made of transparent glass. The rotation of the pointer 5 is easy to observe. One end of the etching device body 1 is fixedly connected to a limit frame 31. A glass sealing door 32 is slidably connected to the limit frame 31. One end of the glass sealing door 32 is fixedly connected to a sealing ring 33. The sealing ring 33 is adapted to the glass sealing door 32, so that the user can control whether the etching device body 1 is sealed by pushing the glass sealing door 32, which is convenient for use. After the pressure in the etching device body 1 is reduced, the second wire 23 and the sealing ring 33 are more tightly attached, making the sealing of the etching device body 1 better and facilitating the etching process.

[0030] As a preferred implementation in this embodiment, refer to the attached Figure 3-Figure 6The other end of the movable groove 18 is fixedly connected to the second touch block 22, one end of the second touch block 22 is fixedly connected to the second wire 23, the inner wall of the etching device body 1 is fixedly connected to the insulating frame 25, one end of the insulating frame 25 is fixedly connected to the electromagnetic block 24, the inner wall of the etching device body 1 is rotatably connected to the push rod 26, one side of the push rod 26 is in contact with the electromagnetic block 24, one end of the etching device body 1 is fixedly connected to the air outlet pipe 27, the two ends of the air outlet pipe 27 are respectively fixedly connected to the first fixing ring 28 and the second fixing ring 29, one end of the second fixing ring 29 is fixedly connected to the sealing block 30, the sealing block 30 includes a spring and a sealing plate, the sealing plate is fixedly connected to the spring, the sealing plate is in contact with the first fixing ring 28, and one end of the push rod 26 passes through the first fixing ring 28 is fitted with the sealing plate, the second wire 23 is fixedly connected to the electromagnetic block 24, the push rod 26 is an arc-shaped magnet, and the electromagnetic block 24 is the same-pole magnet as the push rod 26 after being energized, the diameter value of the sealing plate of the sealing block 30 is greater than the diameter value of the inner wall of the first fixing ring 28 and is smaller than the diameter value of the inner wall of the outlet pipe 27, and is fixedly connected with the insulating frame 25 through the inner wall of the etching device body 1, and one end of the insulating frame 25 is fixedly connected with the electromagnetic block 24, so that the etching device body 1 fixes the position of the electromagnetic block 24 through the insulating frame 25, and is rotatably connected with the push rod 26 through the inner wall of the etching device body 1, one side of the push rod 26 is fitted with the electromagnetic block 24, and the push rod 26 is an arc-shaped magnet. After the electromagnetic block 24 is energized, it is the same-pole magnet as the push rod 26, so that the etching device body 1 will limit the push rod 2 6 is rotated to a position such that the electromagnetic block 24 pushes the push rod 26 to rotate after being energized, and an air outlet pipe 27 is fixedly connected through one end of the etching device body 1, and the two ends of the air outlet pipe 27 are respectively fixedly connected to a first fixing ring 28 and a second fixing ring 29, and one end of the second fixing ring 29 is fixedly connected to a sealing block 30, and the sealing block 30 includes a spring and a sealing plate, and the sealing plate is fixedly connected to the spring, and the sealing plate is fitted with the first fixing ring 28. One end of the push rod 26 passes through the first fixing ring 28 and fits with the sealing plate, so that after the push rod 26 passes through the first fixing ring 28 and pushes the sealing block 30 to move, the air outside the etching device body 1 will pass through the middle hole of the second fixing ring 29, the gap between the sealing block 30 and the air outlet pipe 27, and the middle hole of the first fixing ring 28. The hole enters the interior of the etching equipment body 1, so that the air pressure in the etching equipment body 1 increases, which facilitates the opening of the glass sealing door 32. The second touch block 22 is fixedly connected to the other end of the movable slot 18, and one end of the second touch block 22 is fixedly connected to the second wire 23. The second wire 23 is fixedly connected to the electromagnetic block 24, so that when the air pressure in the etching equipment body 1 is too low, the control rod 16 will rotate to fit the second touch block 22, so that the second touch block 22 controls the electromagnetic block 24 to be energized through the second wire 23, so that the electromagnetic block 24 pushes the sealing block 30 to move through the push rod 26, so that the air outside the etching equipment body 1 enters the inner cavity of the etching equipment body 1, thereby increasing the air pressure in the etching equipment body 1, thereby ensuring the normal progress of the packaging etching reaction.To avoid semiconductor etching failures caused by low air pressure in the etching equipment body 1 and improve the probability of successful semiconductor etching, the diameter of the sealing plate of the sealing block 30 is larger than the diameter of the inner wall of the first fixing ring 28 and smaller than the diameter of the inner wall of the outlet pipe 27, so that the sealing plate of the sealing block 30 can move within the outlet pipe 27.

[0031] A semiconductor processing device for SIC semiconductor wet processing comprises the above-mentioned voltage regulating device for SIC semiconductor wet processing.

[0032] The working principle of the present invention is as follows: when in use, when the air pressure in the etching device body 1 changes, the air pressure in the connecting air pipe 6 and the Bourdon tube 7 will also change, causing the Bourdon tube 7 to change in shape, so that the Bourdon tube 7 drives the second connecting rod 9 to rotate through the first connecting rod 8, so that the second connecting rod 9 drives the half gear 11 to rotate through the second rotating shaft 10, so that the half gear 11 drives the first rotating shaft 4 and the pointer 5 to rotate through the circular gear 12, so that the staff can easily observe the air pressure in the etching device body 1 according to the pointer 5, and when the Bourdon tube 7 is deformed under the drive of the air pressure change, so that when the second rotating shaft 10 rotates, the second rotating shaft 10 drives the control rod 16 to rotate through the insulating ring 15, and when the control rod 16 is in contact with the first touch block 19, the air pump 21 is controlled by the first wire 20 to start, and the gas in the etching device body 1 is extracted, so that the gas in the etching device body 1 is The pressure drop is reduced. After the air pressure in the etching equipment body 1 is reduced to the required range, the control rod 16 is driven by the second rotating shaft 10 to rotate to a position where it is not in contact with the first touch block 19. At this time, the air pump 21 is turned off and stops extracting the gas in the etching equipment body 1, thereby realizing automatic control of the air pressure in the etching equipment body 1. The half gear 11 can be driven to rotate by the second connecting rod 9, and the control rod 16 can be driven to rotate in the movable groove 18 by the second rotating shaft 10. The control rod 16 can form a switch with the first touch block 19 and the second touch block 22 respectively, which is convenient for controlling the air pressure in the etching equipment body 1, so that the air pressure in the etching equipment body 1 is low, so that the bubbles generated by the chemical reaction of the semiconductor being etched in the etching equipment body 1 can float up faster, reducing the bubbles adhering to the outer wall of the semiconductor, resulting in failure of wet etching or poor effect.

[0033] The user controls whether the etching equipment body 1 is sealed by pushing the glass sealing door 32, which is convenient to use. After the pressure in the etching equipment body 1 is reduced, the second wire 23 and the sealing ring 33 fit more closely, making the sealing inside the etching equipment body 1 better and facilitating etching.

[0034] The etching device body 1 will limit the rotation position of the push rod 26, so that the electromagnetic block 24 will push the push rod 26 to rotate after being energized. After the push rod 26 passes through the first fixed ring 28 and pushes the sealing block 30 to move, the air outside the etching device body 1 will pass through the middle hole of the second fixed ring 29, the gap between the sealing block 30 and the outlet pipe 27, and the middle hole of the first fixed ring 28 to enter the interior of the etching device body 1, so that the air pressure in the etching device body 1 increases, which facilitates the opening of the glass sealing door 32. When the air pressure is too low, the control rod 16 will rotate to fit the second touch block 22, so that the second touch block 22 controls the electromagnetic block 24 to be energized through the second wire 23, so that the electromagnetic block 24 pushes the sealing block 30 to move through the push rod 26, so that the air outside the etching equipment body 1 enters the inner cavity of the etching equipment body 1, and increases the air pressure in the etching equipment body 1, thereby ensuring the normal progress of the packaging etching reaction, avoiding the failure of semiconductor etching caused by too low air pressure in the etching equipment body 1, and increasing the probability of successful semiconductor etching.

[0035] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A voltage regulating device for SIC semiconductor wet processing, characterized by: The etching device comprises an etching device body (1), one end of the etching device body (1) is fixedly connected to a barometer case (2), the inner cavity of the barometer case (2) is fixedly connected to a dial (3), the middle of the dial (3) is rotatably connected to a first rotating shaft (4), one end of the first rotating shaft (4) is fixedly connected to a pointer (5), the bottom end of the barometer case (2) is fixedly connected to a connecting air pipe (6), one end of the connecting air pipe (6) is fixedly connected to the etching device body (1), the other end of the connecting air pipe (6) is fixedly connected to a Bourdon tube (7), one end of the Bourdon tube (7) is rotatably connected to a first connecting rod (8), and the first connecting rod (8) is fixedly connected to the etching device body (1). One end of the connecting rod (8) is rotatably connected to a second connecting rod (9), one end of the second connecting rod (9) is fixedly connected to a second rotating shaft (10), a middle portion of the second rotating shaft (10) is fixedly connected to a half gear (11), one end of the half gear (11) is meshed with a circular gear (12), the circular gear (12) is fixedly connected to the other end of the first rotating shaft (4), one end of the second rotating shaft (10) is rotatably connected to a fixing frame (14), the fixing frame (14) is fixedly connected to the barometer case (2), and one end of the second rotating shaft (10) is provided with an exhaust component, the exhaust component extracts gas from the etching equipment body (1); The vacuum assembly includes an insulating ring (15) fixedly connected to the second rotating shaft (10), one end of the insulating ring (15) is fixedly connected to a control rod (16), the inner wall of the barometer case (2) is fixedly connected to a limit block (17), a movable groove (18) is provided in the middle of the limit block (17), one end of the movable groove (18) is fixedly connected to a first touch block (19), one end of the first touch block (19) is fixedly connected to a first wire (20), and one end of the first wire (20) that passes through the outside of the barometer case (2) is fixedly connected to an air pump (21), and the air pump (21) is fixedly connected to the etching equipment body (1).

2. The voltage regulating device for SIC semiconductor wet processing according to claim 1, characterized in that: The two ends of the first rotating shaft (4) are rotatably connected to the barometer case (2) and the dial (3), respectively; the pointer (5) is located on one side of the dial (3); the circular gear (12) is located on the other side of the dial (3); and the second connecting rod (9) is a U-shaped curved pipe.

3. The voltage regulating device for SIC semiconductor wet processing according to claim 1, characterized in that: The limit block (17) is an arc-shaped block, the center of the limit block (17) and the center of the second rotating shaft (10) are the same point, and the control rod (16) is slidably connected in the movable groove (18).

4. The voltage regulating device for SIC semiconductor wet processing according to claim 1, characterized in that: One end of the etching equipment body (1) is fixedly connected to a limiting frame (31), a glass sealing door (32) is slidably connected inside the limiting frame (31), and one end of the glass sealing door (32) is fixedly connected to a sealing ring (33), and the sealing ring (33) is adapted to the glass sealing door (32).

5. The voltage regulating device for SIC semiconductor wet processing according to claim 1, characterized in that: A coil spring (13) is fixedly connected to the middle of the first rotating shaft (4), one end of the coil spring (13) is fixedly connected to the dial (3), and one side of the barometer case (2) is made of transparent glass.

6. The voltage regulating device for SIC semiconductor wet processing according to claim 1, characterized in that: The other end of the movable groove (18) is fixedly connected to a second touch block (22), one end of the control rod (16) is in contact with the first touch block (19) and the second touch block (22), one end of the second touch block (22) is fixedly connected to a second wire (23), the inner wall of the etching device body (1) is fixedly connected to an insulating frame (25), one end of the insulating frame (25) is fixedly connected to an electromagnetic block (24), the inner wall of the etching device body (1) is rotatably connected to a push rod (26), one side of the push rod (26) is in contact with the electromagnetic block (24), and the etching device body (1) is fixedly connected to an insulating frame (25). One end of the corrosion equipment body (1) is fixedly connected to an air outlet pipe (27), and the two ends of the air outlet pipe (27) are respectively fixedly connected to a first fixing ring (28) and a second fixing ring (29), and one end of the second fixing ring (29) is fixedly connected to a sealing block (30), and the sealing block (30) includes a spring and a sealing plate, and the sealing plate is fixedly connected to the spring, and the sealing plate is fitted with the first fixing ring (28), one end of the push rod (26) passes through the first fixing ring (28) and is fitted with the sealing plate, and the second wire (23) is fixedly connected to the electromagnetic block (24).

7. The voltage regulating device for SIC semiconductor wet processing according to claim 6, characterized in that: The push rod (26) is an arc-shaped magnet, and the electromagnetic block (24) and the push rod (26) are magnets of the same polarity when energized.

8. The voltage regulating device for SIC semiconductor wet processing according to claim 6, characterized in that: The diameter of the sealing plate of the sealing block (30) is greater than the diameter of the inner wall of the first fixing ring (28) and smaller than the diameter of the inner wall of the air outlet pipe (27).

9. A semiconductor processing equipment for SIC semiconductor wet processing, characterized by: The invention comprises the voltage regulating device for SIC semiconductor wet processing according to any one of claims 1 to 8.

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