Electronic device with power supply terminals and thermal bridge

Abstract

The invention relates to an electronic device with a power supply terminal and a thermal bridge. An electronic device includes a housing, one or more power semiconductor dies within the housing, power supply terminals, and a thermal bridge. The power supply terminal is electrically connected to the one or more power semiconductor dies and is at least partially exposed from the housing. The power supply terminal extends lengthwise in a longitudinal direction and includes a constricted region at which a width of the power supply terminal decreases in a transverse direction transverse to the longitudinal direction. The thermal bridge is distinct from the housing. The thermal bridge bridges the contraction area and provides a heat conduction path parallel to the heat conduction path of the power supply terminal. The thermal bridge is non-magnetic and has a thermal conductivity higher than a thermal conductivity of the housing.

Description

Technical Field

[0001] The present disclosure relates to an electronic device having power supply terminals and a thermal bridge. Background Art

[0002] The demand for electronic components for power applications continues to increase rapidly in a wide range of industries, including automotive, consumer electronics, renewable energy, manufacturing and medical. The development of semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN) has made it possible to produce power electronic components with advantageous features such as a smaller footprint, higher voltage and current capabilities, and faster switching speeds. As components become smaller and / or carry higher currents, effective heat dissipation becomes particularly important to ensure acceptable reliability and lifespan. In addition, many applications of these electronic components benefit from or even require the use of sensors (e.g., Hall sensors) built into the components to monitor current during their operation. For some electronic component designs, there is a trade-off between heat dissipation and the ability to accurately measure current. Therefore, there is a need for a solution that can accurately measure current without sacrificing efficient heat dissipation. Summary of the Invention

[0003] According to an embodiment of an electronic device, the electronic device includes: a housing; one or more power semiconductor dies within the housing; a power supply terminal, which is electrically connected to the one or more power semiconductor dies and is at least partially exposed from the housing, the power supply terminal extending lengthwise in a longitudinal direction and including a contraction area, at which the width of the power supply terminal decreases in a transverse direction transverse to the longitudinal direction; and a thermal bridge, which is different from the housing, bridges the contraction area and provides a thermal path parallel to the thermal path of the power supply terminal, wherein the thermal bridge is non-magnetic and has a thermal conductivity higher than the thermal conductivity of the housing.

[0004] Those skilled in the art will recognize additional features and advantages upon reading the following detailed description, and upon viewing the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] The elements of the drawings are not necessarily to scale with respect to one another. Identical reference numerals denote corresponding similar components. Features of the various illustrated embodiments may be combined unless they exclude each other. Embodiments are illustrated in the drawings and described in detail in the following description.

[0006] Figure 1 A side cross-sectional view of an electronic device according to an embodiment is shown.

[0007] Figure 2 A top plan view of a power supply terminal and a thermal bridge according to an embodiment is shown.

[0008] Figure 3 Shown are top plan views of power supply terminals and thermal bridges according to various embodiments.

[0009] Figure 4 A side cross-sectional view of an electronic device according to an embodiment is shown.

[0010] Figure 5 A side cross-sectional view of an electronic device according to an embodiment is shown.

[0011] Figure 6 A side cross-sectional view of an electronic device according to an embodiment is shown.

[0012] Figure 7 A side cross-sectional view of an electronic device according to an embodiment is shown.

[0013] Figure 8 A side cross-sectional view of an electronic device according to an embodiment is shown. DETAILED DESCRIPTION

[0014] Described herein is an electronic device, such as a molded power semiconductor package or a power semiconductor module, having a power supply terminal and associated features that enable the power supply terminal to provide both heat dissipation and accurate current measurement during operation of the electronic device. The power supply terminal has a contraction region having a reduced width in a lateral direction relative to the remainder of the power supply terminal. During operation, when current passes through the power supply terminal, the higher current density in the contraction region results in a higher magnetic flux generated near the contraction region. The higher magnetic flux near the contraction region of the power supply terminal can enable a sensor placed near the contraction region to more accurately measure the current passing through the power supply terminal, compared to similar measurements made elsewhere along the power supply terminal where the magnetic flux is lower. However, the narrower contraction region limits the amount of thermal energy that can pass through the power supply terminal, thereby reducing the efficiency of heat dissipation from the electronic device through the power supply terminal.

[0015] According to embodiments described herein, an electronic device includes a thermal bridge that provides a heat conduction path parallel to the heat conduction path of a power supply terminal. The heat conduction path through the thermal bridge enables heat energy to bypass a constricted region of the power supply terminal. In some examples, providing a power supply terminal with a constricted region and a thermal bridge that provides a heat conduction path around the constricted region can enable the power supply terminal of the electronic device to dissipate heat away from the electronic device and provide a magnetic flux sufficient to enable accurate current measurement.

[0016] Next, an exemplary electronic device having a power supply terminal having a contraction region and a thermal bridge providing a heat conduction path around the contraction region will be described with reference to the accompanying drawings.

[0017] Figure 1A side cross-sectional view of an electronic device 100 is shown in accordance with an embodiment. The electronic device 100 includes one or more power semiconductor dies 120 mounted to a substrate 115 within a housing 110 .

[0018] In some examples, housing 110 is a molded housing including a mold compound. In these examples, electronic device 100 may be a molded power semiconductor package, and although not in Figure 1 1 , but the power semiconductor die(s) 120 may be embedded in the housing 110. The molding compound is a plastic encapsulant typically formed from an organic resin such as an epoxy resin. The plastic encapsulant may include fillers such as non-melting inorganic materials. Catalysts may be used to accelerate the curing reaction of the organic resin. Other materials such as flame retardants, adhesion promoters, ion traps, stress relievers, colorants, etc. may be appropriately added to the plastic encapsulant. The molding compound may be formed by injection molding, compression molding, membrane assisted molding (FAM), reaction injection molding (RIM), resin transfer molding (RTM), blow molding, etc.

[0019] In some examples, housing 110 is a frame housing. In these examples, electronic device 100 may be a power semiconductor module. The frame housing may include one or more metals, plastics, composite materials, and / or other suitable materials that are constructed and arranged to surround (multiple) power semiconductor die 120. The frame housing may include a base, a lid, walls, and / or other components. The frame housing may include an opening that provides access to (multiple) power semiconductor die 120 (e.g., contact pads). Alternatively or in addition, the frame housing may include feed-through contacts, such as pins or terminals that provide electrical contact to (multiple) power semiconductor die 120.

[0020] The substrate 115 may be a printed circuit board (PCB), a lead frame, or other substrate, such as an insulated metal substrate (IMS), a DCB (direct copper bonding) substrate, an AMB (active metal brazing), or the like. The substrate 115 may include one or more layers 117 of insulating material (e.g., polyimide, ceramic) and one or more metal layers 119 (e.g., copper, aluminum). The one or more metal layers 119 may be patterned to provide areas for electrical contact with the power semiconductor die(s) 120. The substrate 115 may be mounted to a cooler 121, such as a natural or forced convection air cooling heat sink, a single-sided or double-sided cooling system with a liquid cooling plate, or the like.

[0021] exist Figure 1, bond wires 123 electrically connect the power semiconductor die 120 (e.g., source contacts of the semiconductor die 120) to each other and to one of the metal layers 119 of the substrate 115. In other examples, separate bond wires may be used to contact one or more of the power semiconductor die(s) 120 to each other, to one or more metal layers 119 of the substrate 115, and / or to another feature of the electronic device 100. In other examples, other electrical connection means, such as metal ribbons or strips, clip(s), etc., may be used to connect one or more of the power semiconductor die(s) 120 to each other, to one or more metal layers 119 of the substrate 115, and / or to another feature of the electronic device 100.

[0022] The power semiconductor die(s) 120 may include one or more devices, including transistors, diodes, resistors, capacitors, and / or other types of active or passive devices. Examples of transistors of the power semiconductor die(s) 120 may include MOSFETs, IGBTs, and / or BJTs, among others. The power semiconductor die(s) 120 and / or their constituent devices may be arranged to form all or part of a power electronics circuit, such as a DC / AC inverter, a DC / DC converter, an AC / DC converter, a DC / AC converter, an AC / AC converter, a multiphase inverter, an H-bridge, a motor driver, and the like. In some examples, the power electronics circuit including the power semiconductor die(s) 120 is a half-bridge or full-bridge circuit.

[0023] The electronic device 100 includes a power supply terminal 130, which is electrically connected to one or more of the power semiconductor die(s) 120, for example, via one of the metal layers 119 of the substrate 115. The power supply terminal 130 is at least partially exposed from the housing 110. In the example of the electronic device 100, the power supply terminal 130 extends lengthwise in the longitudinal (current flow) direction x and protrudes from the housing 110. In other examples, a surface of the power supply terminal 130 may be exposed from the housing 110. For example, the surface of the power supply terminal 130 may be flush with the surface of the housing 110, or may protrude or be recessed from the surface of the housing 110. Other configurations are contemplated in which the power supply terminal 130 is at least partially exposed from the housing 110. In examples where the power semiconductor die(s) 120 include one or more transistors (e.g., MOSFET(s), IGBT(s), or a half-bridge or full-bridge circuit), the power supply terminal 130 may be a source, emitter, drain, or collector terminal.

[0024] The power terminal 130 includes a constricted region 132 where the width of the power terminal 130 decreases in a transverse direction y that is transverse to the longitudinal direction x. As current flows through the power terminal 130 along the longitudinal direction x, the current density increases in the constricted region 132 due to the reduced width relative to the rest of the power terminal 130. This results in a higher magnetic flux near the constricted region 132. The higher magnetic flux near the constricted region 132 of the power terminal 130 can enable a sensor placed near the constricted region 132 to more accurately measure the current passing through the power terminal 130 when compared to similar measurements taken along other portions of the power terminal 130 (where the magnetic flux is lower).

[0025] Figure 1 An exemplary sensor 150 (e.g., a Hall sensor) is shown aligned with the constriction region 132 along a z-direction that is orthogonal to both the longitudinal direction x and the lateral direction y. In this example, the housing 110 includes a recess 112 that is aligned with the constriction region 132 along the z-direction and is configured to accommodate the sensor 150. The sensor 150 can be soldered to a printed circuit board (PCB) 160 (e.g., a gate driver PCB), for example. In other examples, such as the example of a molded housing 110, the sensor 150 can be embedded in the housing 110. The sensor 150 is included herein for illustrative purposes, but is optional and not a requirement for the electronic device 100.

[0026] According to an embodiment, the electronic device 100 includes a thermal bridge 140. The thermal bridge 140 is distinct from the housing 110 and electrically isolated from the power supply terminal 130. The thermal bridge 140 thermally bridges the contraction region 132 of the power supply terminal 130, providing a heat conduction path 172 that is parallel to the heat conduction path 171 of the power supply terminal 130. The heat conduction path 172 of the thermal bridge 140 enables thermal energy to bypass the contraction region 132 of the power supply terminal 130, thereby potentially improving heat dissipation from the electronic device 100. In addition, by directing the dissipated heat through the thermal bridge 140, the temperature of the power supply terminal 130 near the contraction region 132 can be reduced, thereby potentially reducing the impact of the temperature of the contraction region 132 on the sensor 150, enabling the sensor 150 to provide more accurate current measurements and / or avoiding excessive heating of the sensor 150.

[0027] The thermal bridge 140 is non-magnetic so that the thermal bridge 140 does not affect the magnetic flux around the contraction area 132 and therefore does not affect the measurement of the current through the power supply terminal 130. In addition, the thermal bridge 140 has a thermal conductivity that is higher than the thermal conductivity of the housing 110. For example, the thermal bridge 140 can have a thermal conductivity of at least 20 W / mK. The thermal bridge 140 can be electrically conductive or electrically insulating because the thermal bridge 140 does not form part of the main current path of the electronic device. In some examples, the thermal bridge 140 is metallic, for example, including copper, aluminum and / or one or more other metals or metal alloys. The thermal bridge 140 can be formed from metal foil. Other example materials for the thermal bridge 140 include ceramics such as silicon nitride, thermal grease, or a composite material including one or more fillers, among other examples.

[0028] exist Figure 1 1 , the thermal bridge 140 and the contraction area 132 of the power supply terminal 130 are embedded in the housing 110. A gap 114 separates the thermal bridge 140 from the power supply terminal 130 in the z-direction. A portion of the housing 110 is disposed in the gap 114, but in some examples, a thermal interface material (e.g., a heat transfer sheet, thermal filler, foil, glue) may be additionally or alternatively disposed in the gap 114. A recess 112 configured to accommodate the sensor 150 is on the side of the power supply terminal 130 opposite the thermal bridge 140. The lower surface 112 of the recess 112 is S The first main surface 130 of the power supply terminal 130 S1 The height h1 of the gap 116 is greater than the height of the power supply terminal 130 and the height of the first main surface 130. S1 The opposite second major surface 130 S2 The surface 140 of the thermal bridge 140 facing the power supply terminal 130 S The height h2 of the gap 114 therebetween.

[0029] Figure 2 FIG2 shows a top plan view of the power supply terminal 230 and the thermal bridge 240 according to an embodiment. The power supply terminal 230, the contraction area 232 of the power supply terminal 230 and the thermal bridge 240 are respectively Figure 1 An example of a power supply terminal 130, a shrinkage area 132 and a thermal bridge 140 of an electronic device 100.

[0030] The width W of the power supply terminal 230 ST The width W in the transverse direction y is reduced in the contraction region 232. CRThermal bridge 240 bridges contraction region 232 and includes an opening 242 aligned with contraction region 232 such that contraction region 232 is not covered by thermal bridge 240 in the z-direction. Specifically, thermal bridge 240 includes a first segment 244 and a second segment 246. First segment 244 bridges contraction region 232 along a first side of contraction region 232 in the longitudinal (current flow) x-direction, and second segment 246 is separated from first segment 244 in the transverse y-direction and bridges contraction region 232 along a second side of contraction region 232 opposite to the first side in the longitudinal x-direction. Opening 242 is located between first segment 244 and second segment 246 in the region of contraction region 232.

[0031] In some cases, providing openings 242 in thermal bridge 240 and aligning them with constriction region 232 can reduce the presence of stray magnetic fields from thermal bridge 240 near constriction region 232 (e.g., eddy currents generated by the magnetic field of thermal bridge 240 being close to power supply terminals 230). This arrangement can ensure that sensors (e.g., Figure 1 The magnetic field sensed by the sensor 150 is mainly from the power supply terminal 230, with little or no interference from the thermal bridge 240, thereby enabling the sensor to provide a more accurate measurement of the current in the power supply terminal 230. In addition, when the temperature of the thermal bridge 240 is changed from an associated electronic device (e.g., Figure 1 When the heat dissipation of the electronic device 100 is increased, providing the opening 242 can reduce the influence of the temperature of the thermal bridge 240 on the sensor.

[0032] Figure 3 Shown are top plan views of power supply terminals 330a-h and thermal bridges 340a-h according to various embodiments. Figure 3 The power supply terminals 330a-h, the shrinkage areas 332a-h and the thermal bridges 340a-h of a-3h are respectively Figure 1 The power supply terminal 130, the shrinkage area 132 and the thermal bridge 140 of the electronic device 100 and Figure 2 Various examples of power supply terminals 230 , shrinkage areas 232 , and thermal bridges 240 .

[0033] Figure 3 The examples illustrate various orientations of the corresponding contraction regions of the power supply terminals. The width of each power supply terminal 330a-h decreases in the transverse direction y within the corresponding contraction region 332a-h. In the examples of power supply terminals 330a, 330c, 330d, 330e, and 330h, the corresponding contraction regions 332a, 332c, 332d, 332e, and 332h are oriented along the longitudinal x-direction. In the examples of power supply terminals 330b, 330f, and 330g, the corresponding contraction regions 332b, 332f, and 332g each include a curved portion oriented in the transverse y-direction.

[0034] Each thermal bridge 340a-h bridges a corresponding constriction 332a-h and includes a corresponding opening 342a-h aligned with the corresponding constriction 332a-h, such that the corresponding constriction 332a-h is uncovered by the corresponding thermal bridge 340a-h in the z-direction. Each thermal bridge 340a-h includes a corresponding first segment 344a-h bridging the corresponding constriction 332a-h along a first side of the corresponding constriction 332a-h in the longitudinal (current flow) x-direction and a corresponding second segment 346a-h separated from the corresponding first segment 344a-h in the transverse y-direction and bridging the corresponding constriction 332a-h along a second side of the corresponding constriction 332a-h, opposite the first side, in the longitudinal x-direction. The corresponding opening 342a-h is between the corresponding first segment 344a-h and the corresponding second segment 346a-h. In the examples of thermal bridges 340a, 340b, and 340c, the first segments 344a, 344b, and 344c and the second segments 346a, 346b, and 346c of the thermal bridges 340a, 340b, and 340c, respectively, are separate pieces.

[0035] Figure 3 a-3h illustrate only some example configurations of power supply terminals, shrinkage areas, and thermal bridges according to embodiments of the present disclosure. These examples are not limiting, and other structures, arrangements, orientations, features, etc. of power supply terminals, shrinkage areas, and thermal bridges can be envisioned and are within the scope of the present disclosure.

[0036] Figure 4 FIG shows a side cross-sectional view of an electronic device 400 according to an embodiment. Unless otherwise specified herein, the electronic device 400 may be similar to Figure 1 The similarities to the electronic device 100 may include the structure, composition, functionality, features, components, dimensions and / or other attributes of the electronic device 100 and its features.

[0037] The electronic device 400 includes a housing 410, a power supply terminal 430 having a contraction area 432, and a thermal bridge 440 bridging the contraction area 432 of the power supply terminal 430. The housing 410 may be similar to Figure 1 The power supply terminal 430 can be electrically connected to one or more power semiconductor dies (eg, Figure 1 (a plurality of) power semiconductor die 120). The power supply terminal 430 and the shrinkage area 432 may be similar to Figure 1 The power supply terminal 130 and the contraction area 132, Figure 2 The power supply terminal 230 and the contraction area 232, Figure 3 The thermal bridge 440 may be similar to one of the power supply terminals 330a-h and the shrinkage areas 332a-h, or may be different from these. Figure 1 Thermal bridge 140, Figure 2 Thermal bridge 240, Figure 3 One of the thermal bridges 340a-h, or may be different from these. Figure 4 Shows that it can be similar to Figure 1 4. An exemplary sensor 450 of the sensor 150 is shown. The sensor 450 is attached to an exemplary PCB 460 and is aligned with the constriction region 432 along the z-direction. The housing 410 includes a recess 412 configured to accommodate a sensor (e.g., sensor 450). The sensor 450, PCB 460, and recess 412 are included herein for illustrative purposes, but are optional and are not a requirement for the electronic device 400.

[0038] Electronic device 400 and Figure 1 The electronic device 100 differs in that a portion of the thermal bridge 440 is attached to the power supply terminal 430. Specifically, the power supply terminal 430 includes a first portion 4301 and a second portion 4302 on opposite sides of the contraction region 432. The thickness t2 of the second portion 4302 of the power supply terminal 430 is greater than the thickness t1 of the first portion 4301 of the power supply terminal 430, such that a gap 414 separates the first portion 4401 of the thermal bridge 440 from the first portion 4301 of the power supply terminal 430 and the contraction region 432. The second portion 4402 of the thermal bridge 440 is attached to the second portion 4302 of the power supply terminal 430. The second portion 4402 of the thermal bridge 440 can be attached to the second portion 4302 of the power supply terminal 430 using a thermally conductive material such as an adhesive or glue, or can be welded, diffusion welded, fused, brazed, or riveted to the second portion 4302.

[0039] exist Figure 4 , material 480 is disposed in gap 414. Material 480 may be part of housing 410 (e.g., a molding compound or part of a frame of housing 410), or may be a thermal interface material distinct from housing 410, such as a thermal transfer sheet, thermal filler, foil, glue, or other suitable material.

[0040] Figure 5 FIG shows a side cross-sectional view of an electronic device 500 according to an embodiment. Unless otherwise specified herein, the electronic device 500 may be similar to Figure 1 The similarities to the electronic device 100 may include the structure, composition, functionality, features, components, dimensions and / or other attributes of the electronic device 100 and its features.

[0041] The electronic device 500 includes a housing 510, a power supply terminal 530 having a contraction area 532, and a thermal bridge 540 bridging the contraction area 532 of the power supply terminal 530. The housing 510 may be similar to Figure 1 The power supply terminal 530 can be electrically connected to one or more power semiconductor dies (eg, Figure 1 (a plurality of) power semiconductor die 120). The power supply terminal 530 and the shrinkage area 532 may be similar to Figure 1 The power supply terminal 130 and the contraction area 132, Figure 2 The power supply terminal 230 and the contraction area 232, Figure 3 The thermal bridge 540 may be similar to one of the power supply terminals 330a-h and the shrinkage areas 332a-h, or may be different from these. Figure 1 Thermal bridge 140, Figure 2 Thermal bridge 240, Figure 3 One of the thermal bridges 340a-h, or may be different from these. Figure 5 Shows that it can be similar to Figure 1 5. The exemplary sensor 550 of the sensor 150 is shown. The sensor 550 is attached to the exemplary PCB 560 and is aligned with the constriction region 532 along the z-direction. The housing 510 includes a recess 512 configured to accommodate a sensor (e.g., the sensor 550). The sensor 550, the PCB 560, and the recess 512 are included herein for illustrative purposes, but are optional and are not a requirement for the electronic device 500.

[0042] Electronic device 500 and Figure 1 The electronic device 100 is different in that a portion of the thermal bridge 540 is attached to the power supply terminal 530. Specifically, the power supply terminal 530 includes a first portion 5301 and a second portion 5302 on opposite sides of a contraction region 532. The power supply terminal 530 has a curved portion between the first portion 5301 and the second portion 5302, so that a gap 514 separates the first portion 5401 of the thermal bridge 540 from the first portion 5301 and the contraction region 532 of the power supply terminal 530. The second portion 5402 of the thermal bridge 540 is attached to the second portion 5302 of the power supply terminal 530. The second portion 5402 of the thermal bridge 540 can be attached to the second portion 5302 of the power supply terminal 530 using a thermally conductive material such as an adhesive or glue, or can be welded, diffusion welded, fused, brazed, or riveted to the second portion 5302.

[0043] exist Figure 55 , material 580 is disposed in gap 514. Material 580 may be part of housing 510 (e.g., a molding compound or part of a frame of housing 510), or may be a thermal interface material distinct from housing 510, such as a thermal transfer sheet, thermal filler, foil, glue, or other suitable material.

[0044] Figure 6 FIG shows a side cross-sectional view of an electronic device 600 according to an embodiment. Unless otherwise specified herein, the electronic device 600 may be similar to Figure 1 The similarities to the electronic device 100 may include the structure, composition, functionality, features, components, dimensions and / or other attributes of the electronic device 100 and its features.

[0045] The electronic device 600 includes a housing 610, a power supply terminal 630 having a contraction area 632, and a first thermal bridge 640 on a first side of the power supply terminal 630. The first thermal bridge 640 bridges the contraction area 632 of the power supply terminal 630 and provides a first thermal conduction path 672 parallel to the thermal conduction path 671 of the power supply terminal 630. The housing 610 may be similar to Figure 1 The power supply terminal 630 can be electrically connected to one or more power semiconductor dies (eg, Figure 1 (a plurality of) power semiconductor die 120). The power supply terminal 630 and the shrinkage area 632 may be similar to Figure 1 The power supply terminal 130 and the contraction area 132, Figure 2 The power supply terminal 230 and the contraction area 232, Figure 3 The first thermal bridge 640 may be similar to one of the power supply terminals 330a-h and the contraction areas 332a-h, or may be different from these. Figure 1 Thermal bridge 140, Figure 2 Thermal bridge 240, Figure 3 One of the thermal bridges 340a-h, or may be different from these. Figure 6 Shows that it can be similar to Figure 1 6. The exemplary sensor 650 of the sensor 150 is shown. The sensor 650 is attached to an exemplary PCB 660 and is aligned with the constriction region 632 along the z-direction. The housing 610 includes a recess 612 configured to accommodate a sensor (e.g., sensor 650). The sensor 650, PCB 660, and recess 612 are included herein for illustrative purposes, but are optional and are not a requirement for the electronic device 600.

[0046] The electronic device 600 is different from the electronic device 100 in that the electronic device 600 includes a second thermal bridge 641, which is different from the housing 610 and is located on a second side of the power supply terminal 632 opposite to the first thermal bridge 640. The second thermal bridge 641 bridges the contraction area 632 and provides a second thermal path 673 parallel to the thermal path 671 of the power supply terminal 630. The first gap 614 separates the first thermal bridge 640 from the power supply terminal 630, and the second gap 616 separates the second thermal bridge 641 from the power supply terminal 630. Figure 6 6 , first gap 614 and second gap 616 each comprise a portion of housing 610. In other examples, one or both of first gap 614 and / or second gap 616 can comprise a different thermal interface material than housing 610 (e.g., a thermal transfer sheet, thermal filler, foil, glue, etc.).

[0047] The second thermal bridge 641 includes an opening 643 aligned along the z-direction with the contraction region 632. The opening 643 of the second thermal bridge 641 may be aligned with the opening of the first thermal bridge 640 along the z-direction.

[0048] The second thermal bridge 641 is non-magnetic and has a thermal conductivity that is higher than the thermal conductivity of the housing 610. The structure, composition, features, dimensions, and / or other properties of the second thermal bridge 641, such as the shape and size of the opening 643, can be similar to other thermal bridges described herein (e.g., Figure 1 Thermal bridge 140, Figure 2 Thermal bridge 240, Figure 3 One of the thermal bridges 340a-h, Figure 6 The structure, composition, characteristics and dimensions and / or other properties of the first thermal bridge 640) may be the same as, or may be different from, these.

[0049] Although the first thermal bridge 640 and the second thermal bridge 641 of this example are separated from the power supply terminal 630, it is conceivable that at least a portion of the first thermal bridge 640 and / or the second thermal bridge 641 is attached to the power supply terminal 630, respectively, similar to Figure 4 and Figure 5 Examples of thermal bridges 440 and 540 are shown in FIG.

[0050] Figure 7 A side cross-sectional view of an electronic device 700 is shown in accordance with an embodiment. Figure 7 Shown Figure 6 An alternative arrangement of the electronic device 600. Figure 7 The features shown are similar to Figure 6 Features with corresponding numbers shown. Figure 7 Electronic equipment 700 and Figure 6The electronic device 600 is different in that the recess 612 extends at least partially through the opening 643 so that the second thermal bridge 641 surrounds the recess 612. In addition, thermal interface materials 780 and 781 can be respectively disposed in the first gap 614 and / or the second gap 616. Each of the thermal interface materials 780 and 781 can be a thermal transfer sheet, a thermal filler, a foil, a glue, or other suitable material. In other examples, one or both of the first gap 614 and / or the second gap 616 can be partially or completely filled with a portion of the housing (e.g., Figure 6 In some examples, the first thermal bridge 640, the second thermal bridge 641, the contraction region 632 of the power supply terminal 630, and the thermal interface materials 780 and 781 are partially or completely within the housing of the electronic device 700 (e.g., Figure 6 outside the housing 610).

[0051] Figure 8 FIG shows a side cross-sectional view of an electronic device 800 according to an embodiment. Unless otherwise specified herein, the electronic device 800 may be similar to Figure 1 The similarities to the electronic device 100 may include the structure, composition, functionality, features, components, dimensions and / or other attributes of the electronic device 100 and its features.

[0052] The electronic device 800 includes one or more power semiconductor dies 820 attached to a substrate 815 within a housing 810, power supply terminals 830 having a constriction 832, and a thermal bridge 840. The power supply terminals 830 are electrically connected to one or more of the power semiconductor dies 820. A first thermal bridge 840 bridges the constriction 832 of the power supply terminals 830.

[0053] The housing 810 may be similar to Figure 1 The housing 110. The substrate 815 may be similar to Figure 1 The substrate 815 may include one or more layers 817 of insulating material (e.g., polyimide, ceramic) and one or more metal layers 819 (e.g., copper, aluminum). Layers 817 and 819 may be similar to Figure 1 The substrate 815 can be mounted to a cooler 821. The cooler 821 can be similar to Figure 1 The bonding wires 823 electrically connect the power semiconductor dies 820 (eg, the source contacts of the semiconductor dies 820) to each other and to one of the metal layers 819 of the substrate 815. Figure 1In the example of the electronic device 100, other examples may include separate bonding wires that contact one or more of the (multiple) power semiconductor die 820 to each other, to one or more metal layers 819 of the substrate 815, and / or to another feature of the electronic device 800, and / or may include other electrical connection devices, such as metal strips or ribbons, (multiple) clips, etc., to connect one or more of the (multiple) power semiconductor die 820 to each other, to one or more metal layers 819 of the substrate 815, and / or to another feature of the electronic device 800.

[0054] The power semiconductor die(s) 820 may be similar to Figure 1 The power supply terminals 830 and the shrinkage area 832 may be similar to Figure 1 The power supply terminal 130 and the contraction area 132, Figure 2 The power supply terminal 230 and the contraction area 232, Figure 3 The thermal bridge 840 may be similar to one of the power supply terminals 330a-h and the shrinkage areas 332a-h, or may be different from these. Figure 1 Thermal bridge 140, Figure 2 Thermal bridge 240, Figure 3 Although the thermal bridge 840 of this example is separated from the power supply terminal 830, it is conceivable that at least a portion of the thermal bridge 840 is attached to the power supply terminal 830, similar to Figure 4 and Figure 5 In addition, it is possible to envision an example where a thermal interface material (e.g., a heat transfer sheet, a thermal filler, a foil, a glue) is provided in the gap between the thermal bridge 840 and the power supply terminal 830, for example, as shown in FIG. Figure 4 、 Figure 5 and Figure 7 shown.

[0055] Figure 8 Shows that it can be similar to Figure 1 8. An exemplary sensor 850 of the sensor 150 is shown. The sensor 850 is aligned with the contraction region 832 along the z-direction. The sensor 850 can be electrically coupled to a printed circuit board (PCB) 860 (e.g., a gate driver PCB). The sensor 850 is included herein for illustrative purposes, but the sensor 850 is optional and is not a requirement for the electronic device 800.

[0056] Electronic device 800 differs from electronic device 100 in that housing 810 surrounds one or more power semiconductor dies 820, and a separate electrically insulating body 811 surrounds thermal bridge 840, constriction region 832 of power supply terminal 830, and sensor 850 (if present). In some examples, separate electrically insulating body 811 is a molded housing including a mold compound.

[0057] Although the present disclosure is not limited in this regard, the following numbered examples illustrate one or more aspects of the present disclosure.

[0058] Example 1: An electronic device comprises: a housing; one or more power semiconductor dies within the housing; a power supply terminal electrically connected to the one or more power semiconductor dies and at least partially exposed from the housing, the power supply terminal extending lengthwise in a longitudinal direction and comprising a contraction region, wherein the width of the power supply terminal decreases in a transverse direction transverse to the longitudinal direction; and a thermal bridge, different from the housing, bridging the contraction region and providing a thermal conduction path parallel to the thermal conduction path of the power supply terminal, wherein the thermal bridge is non-magnetic and has a thermal conductivity higher than the thermal conductivity of the housing.

[0059] Example 2: The electronic device of Example 1, wherein the thermal bridge includes an opening aligned with the contraction area such that the contraction area is not covered by the thermal bridge in a direction orthogonal to both the longitudinal direction and the lateral direction.

[0060] Example 3: An electronic device according to Example 1 or 2, wherein the thermal bridge includes a first section and a second section, the first section bridging the contraction area along a first side of the contraction area in the longitudinal direction, and the second section is separated from the first section in the transverse direction and bridging the contraction area along a second side of the contraction area opposite to the first side in the longitudinal direction.

[0061] Example 4: The electronic device of any of Examples 1 to 3, wherein the first and second sections of the thermal bridge are separate sections.

[0062] Example 5: The electronic device of any one of Examples 1 to 4, wherein the thermal bridge is embedded in the housing.

[0063] Example 6: The electronic device of any one of Examples 1 to 5, wherein the thermal bridge is metallic.

[0064] Example 7: The electronic device of any one of Examples 1 to 6, wherein the thermal bridge is electrically isolated from the power supply terminal.

[0065] Example 8: The electronic device of any of Examples 1 to 7, wherein the gap separates at least a portion of the thermal bridge from the power supply terminal in a direction orthogonal to both the longitudinal direction and the lateral direction.

[0066] Example 9: The electronic device of any one of Examples 1 to 8, wherein a portion of the housing is disposed in the gap.

[0067] Example 10: The electronic device of any of Examples 1 to 9, wherein a thermal interface material different from the housing is disposed in the gap.

[0068] Example 11: An electronic device according to any one of Examples 1 to 6 or 8 to 10, wherein the power supply terminal includes a first portion and a second portion on opposite sides of the contraction area, wherein the gap separates the first portion of the thermal bridge from the first portion of the power supply terminal, and wherein the second portion of the thermal bridge is attached to the second portion of the power supply terminal.

[0069] Example 12: The electronic device according to Example 11, wherein a thickness of the second portion of the power supply terminal is greater than a thickness of the first portion of the power supply terminal.

[0070] Example 13 An electronic device according to any one of Examples 1 to 6 or 8 to 12, wherein at least a portion of the thermal bridge is attached to the power supply terminal.

[0071] Example 14: An electronic device according to any one of Examples 1 to 13, wherein the housing includes a recess configured to accommodate a sensor, and wherein the recess is aligned with the contraction area on a side of the power supply terminal opposite to the thermal bridge and along a direction orthogonal to both the longitudinal direction and the transverse direction.

[0072] Example 15: An electronic device according to Example 14, wherein the height of the first gap between the lower surface of the recess and the first main surface of the power supply terminal is greater than the height of the second gap between the second main surface of the power supply terminal opposite to the first main surface and the surface of the thermal bridge facing the power supply terminal.

[0073] Example 16: An electronic device according to any one of Examples 1 to 15, wherein the thermal bridge is a first thermal bridge on a first side of the power supply terminal, wherein the heat conduction path provided by the first thermal bridge is a first heat conduction path, and wherein the electronic device further comprises a second thermal bridge on a second side of the power supply terminal opposite to the first thermal bridge, wherein the second thermal bridge is different from the housing, the second thermal bridge bridges the contraction area and provides a second heat conduction path parallel to the heat conduction path of the power supply terminal, and wherein the second thermal bridge is non-magnetic and has a thermal conductivity higher than the thermal conductivity of the housing.

[0074] Example 17: An electronic device according to any one of Examples 1 to 16, wherein a first gap separates at least a portion of the first thermal bridge from the power supply terminal, and wherein a second gap separates at least a portion of the second thermal bridge from the power supply terminal.

[0075] Example 18: The electronic device of any of Examples 1 to 17, wherein a thermal interface material different from the housing is disposed in at least one of the first gap or the second gap.

[0076] Example 19: An electronic device according to any one of Examples 1 to 18, wherein the second thermal bridge includes an opening that is aligned with the contraction area along a direction orthogonal to both the longitudinal direction and the lateral direction, and wherein the housing includes a recess that is configured to accommodate a sensor, the recess extending at least partially through the opening so that the second thermal bridge surrounds the recess.

[0077] Example 20: The electronic device of any one of Examples 1 to 19, further comprising a sensor aligned with the contraction region along a direction orthogonal to both the longitudinal direction and the lateral direction.

[0078] Example 21: An electronic device according to any one of Examples 1 to 20, wherein the thermal bridge, the contraction area of ​​the power supply terminal and the sensor are embedded in the housing.

[0079] Example 22: An electronic device according to any one of Examples 1 to 4 or 6 to 20, wherein the housing surrounds the one or more power semiconductor dies, and wherein the electronic device further comprises a separate electrically insulating body surrounding the thermal bridge, the shrinkage area of ​​the power supply terminal, and the sensor.

[0080] Terms such as "first", "second", etc. are used to describe various elements, regions, parts, etc., and are not intended to be limiting. Throughout the specification, the same terms refer to the same elements.

[0081] As used herein, the terms "having," "comprising," "containing," "including," and the like are open-ended terms indicating the presence of stated elements or features, but do not exclude additional elements or features. The articles "a," "an," and "the" are intended to include the plural as well as the singular, unless the context clearly indicates otherwise.

[0082] Unless expressly stated otherwise, the expression "and / or" should be interpreted as including all possible combinations, both conjunctive and disjunctive. For example, the expression "A and / or B" should be interpreted as meaning only A, only B, or both A and B. Unless expressly stated otherwise, the expression "at least one" should be interpreted in the same manner as "and / or." For example, the expression "at least one of A and B" should be interpreted as meaning only A, only B, or both A and B.

[0083] It will be understood that the features of the various embodiments described herein may be combined with each other, unless specifically stated otherwise.

[0084] Although specific embodiments have been shown and described herein, it will be understood by those skilled in the art that various alternative and / or equivalent embodiments may be substituted for the specific embodiments shown and described without departing from the scope of the present invention. This application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, the present invention is intended to be limited only by the claims and their equivalents.

Claims

1. An electronic device comprising: shell; one or more power semiconductor dies within the housing; a power supply terminal electrically connected to the one or more power semiconductor dies and at least partially exposed from the housing, the power supply terminal extending lengthwise in a longitudinal direction and comprising a constriction region at which a width of the power supply terminal is reduced in a lateral direction transverse to the longitudinal direction; as well as a thermal bridge, distinct from the housing, bridging the contraction region and providing a heat conduction path parallel to the heat conduction path of the power supply terminals, The thermal bridge is non-magnetic and has a thermal conductivity higher than the thermal conductivity of the housing.

2. The electronic device according to claim 1, wherein The thermal bridge comprises an opening aligned with the shrinkage area such that the shrinkage area is not covered by the thermal bridge in a direction orthogonal to both the longitudinal direction and the transverse direction.

3. The electronic device according to claim 1, wherein The thermal bridge includes a first section and a second section, wherein the first section bridges the contraction area along a first side of the contraction area in the longitudinal direction, and the second section is separated from the first section in the transverse direction and bridges the contraction area along a second side of the contraction area opposite to the first side in the longitudinal direction.

4. The electronic device according to claim 3, wherein The first section and the second section of the thermal bridge are separate sections.

5. The electronic device according to claim 1, wherein The thermal bridge is embedded in the housing. The electronic device according to claim 1 , wherein: The thermal bridge is metallic.

7. The electronic device according to claim 1, wherein The thermal bridge is electrically isolated from the power supply terminals.

8. The electronic device according to claim 1, wherein A gap separates at least a portion of the thermal bridge from the power supply terminal in a direction orthogonal to both the longitudinal direction and the transverse direction.

9. The electronic device according to claim 8, wherein: A portion of the housing is disposed in the gap.

10. The electronic device according to claim 8, wherein A thermal interface material different from the housing is disposed in the gap.

11. The electronic device according to claim 8, in, The power supply terminal includes a first portion and a second portion on opposite sides of the constricted area, wherein the gap separates the first portion of the thermal bridge from the first portion of the power supply terminal, and Wherein, the second part of the thermal bridge is attached to the second part of the power supply terminal.

12. The electronic device according to claim 11, wherein The thickness of the second portion of the power supply terminal is greater than the thickness of the first portion of the power supply terminal.

13. The electronic device according to claim 1, wherein At least a portion of the thermal bridge is attached to the power supply terminal.

14. The electronic device according to claim 1, in, The housing includes a recess configured to accommodate the sensor, and The recess is on a side of the power supply terminal opposite to the thermal bridge and is aligned with the contraction area along a direction orthogonal to both the longitudinal direction and the transverse direction.

15. The electronic device according to claim 14, wherein A first gap between a lower surface of the recess and a first main surface of the power supply terminal has a height greater than a second gap between a second main surface of the power supply terminal opposite to the first main surface and a surface of the thermal bridge facing the power supply terminal.

16. The electronic device according to claim 1, in, The thermal bridge is a first thermal bridge on a first side of the power supply terminal, Wherein, the heat conduction path provided by the first thermal bridge is a first heat conduction path; The electronic device further includes a second thermal bridge on a second side of the power supply terminal opposite to the first thermal bridge. wherein the second thermal bridge is different from the housing, the second thermal bridge bridges the contraction area and provides a second thermal conduction path parallel to the thermal conduction path of the power supply terminal, and The second thermal bridge is non-magnetic and has a thermal conductivity higher than the thermal conductivity of the housing.

17. The electronic device according to claim 16, in, A first gap separates at least a portion of the first thermal bridge from the power supply terminal, and The second gap separates at least a portion of the second thermal bridge from the power supply terminal.

18. The electronic device according to claim 17, wherein: A thermal interface material different from the housing is disposed in at least one of the first gap or the second gap.

19. The electronic device according to claim 16, in, The second thermal bridge includes an opening aligned with the constriction region along a direction orthogonal to both the longitudinal direction and the transverse direction.

20. The electronic device of claim 1, further comprising a sensor aligned with the constricted region along a direction orthogonal to both the longitudinal direction and the lateral direction.

21. The electronic device according to claim 20, wherein The thermal bridge, the contracted area of ​​the power supply terminal, and the sensor are embedded in the housing.

22. The electronic device according to claim 20, in, The housing surrounds the one or more power semiconductor dies, and The electronic device further comprises a separate electrically insulating body surrounding the thermal bridge, the shrinkage area of ​​the power supply terminal and the sensor.

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