Micro-channel cooler and semiconductor device

Abstract

The invention discloses a micro-channel cooler and a semiconductor device, the micro-channel cooler comprises a first substrate, a second substrate and a flow channel layer, and the second substrate is arranged opposite to the first substrate along a first direction; the flow channel layer is arranged between the first substrate and the second substrate and provided with a fluid channel, the fluid channel comprises a plurality of first channel layers arranged in the first direction, each first channel layer comprises a plurality of first sub-channels, and the first sub-channels of the same first channel layer are arranged in rows at intervals in the second direction and arranged in columns at intervals in the third direction. Every two adjacent first sub-channels in the first direction are staggered and communicate with each other. Wherein every two of the first direction, the second direction and the third direction intersect. The heat dissipation performance of the micro-channel cooler can be improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor heat dissipation technology, and in particular to a microchannel cooler and a semiconductor device. Background Art

[0002] With the rapid development of high-power semiconductor lasers, high-performance computing chips, and industrial power equipment, the demand for thermal management has increased dramatically. In this context, microchannel coolers (MCCs), with their micron-scale flow channel design, significantly improve heat dissipation efficiency and become a key technology for resolving thermal bottlenecks.

[0003] However, due to structural limitations, the heat dissipation performance of microchannel coolers needs to be improved. Summary of the Invention

[0004] Embodiments of the present application provide a microchannel cooler and a semiconductor device for improving the heat dissipation performance of the microchannel cooler.

[0005] According to one aspect of the present application, a microchannel cooler is provided, comprising a first substrate, a second substrate and a flow channel layer, wherein the second substrate is arranged opposite to the first substrate along a first direction; the flow channel layer is arranged between the first substrate and the second substrate, the flow channel layer is provided with a fluid channel, the fluid channel comprises a plurality of first channel layers arranged along the first direction, the first channel layer comprises a plurality of first sub-channels, the plurality of first sub-channels of the same first channel layer are arranged in rows at intervals along the second direction and in columns at intervals along the third direction, and two adjacent first sub-channels along the first direction are staggered and connected; wherein the first direction, the second direction and the third direction intersect with each other.

[0006] In some embodiments, one of the first sub-channels in one of the first channel layers is connected to multiple first sub-channels in an adjacent first channel layer.

[0007] In some embodiments, the orthographic projection of one of the first sub-channels of one of the first channel layers on the first substrate overlaps with the orthographic projections of multiple first sub-channels of the adjacent first channel layer on the first substrate, and the areas of the multiple overlapping regions are equal.

[0008] In some embodiments, the dimensions of the plurality of first sub-channels along the first direction are equal; the dimensions of the plurality of first sub-channels along the second direction are equal, and the plurality of first sub-channels are evenly spaced along the second direction; the dimensions of the plurality of first sub-channels along the third direction are equal, and the plurality of first sub-channels are evenly spaced along the third direction.

[0009] In some embodiments, the second substrate is provided with a fluid inlet and a fluid outlet; the fluid channel further includes a second channel layer, the second channel layer includes a second sub-channel and a third sub-channel; one end of the second sub-channel along the first direction is connected to the fluid inlet, and the other end is connected to multiple first sub-channels; one end of the third sub-channel along the first direction is connected to the fluid outlet, and the other end is connected to multiple first sub-channels.

[0010] In some embodiments, the orthographic projection area of ​​the second subchannel on the first substrate is larger than the orthographic projection area of ​​the fluid inlet on the first substrate, and larger than the orthographic projection area of ​​the first subchannel on the first substrate; the orthographic projection area of ​​the third subchannel on the first substrate is larger than the orthographic projection area of ​​the fluid outlet on the first substrate, and larger than the orthographic projection area of ​​the first subchannel on the first substrate.

[0011] In some embodiments, the flow channel layer includes a plurality of first flow channel plates stacked in sequence along the first direction, and a plurality of first sub-channels are provided on the first flow channel plates; the layout of the first sub-channels on the plurality of first flow channel plates is the same; and two adjacent first flow channel plates along the first direction are staggered.

[0012] In some embodiments, two adjacent first flow channel plates are welded via a copper interface.

[0013] In some embodiments, the microchannel cooler further includes a first inner solder pad provided on the side of the first substrate facing the second substrate, and a second inner solder pad provided on the side of the second substrate facing the first substrate; the first flow channel plate and the first substrate are welded via the first inner solder pad, and the first flow channel plate and the second substrate are welded via the second inner solder pad.

[0014] According to another aspect of the present application, a semiconductor device is provided, comprising a chip and the aforementioned micro-channel cooler, wherein the chip is fixed to the first substrate.

[0015] The microchannel cooler of the embodiment of the present application includes a first substrate and a second substrate arranged relative to each other along a first direction, and a flow channel layer arranged between the first substrate and the second substrate, the flow channel layer is provided with a plurality of first channel layers arranged along the first direction, the first channel layer includes a plurality of first sub-channels, the first sub-channels of the same first channel layer are arranged in rows at intervals along the second direction, and arranged in columns at intervals along the third direction, and the two first sub-channels adjacent to each other along the first direction are staggered and connected, wherein the first direction, the second direction, and the third direction intersect with each other. In this way, the plurality of first sub-channels are evenly distributed in the plane formed by the second direction and the third direction, thereby improving the heat dissipation efficiency and heat flux density carrying capacity. In addition, since the first sub-channels adjacent to each other along the first direction are staggered, the turbulence ratio of the coolant is improved, thereby improving the heat dissipation uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0017] Figure 1 A schematic structural diagram of a microchannel cooler in one embodiment of the present application is shown.

[0018] Figure 2 A schematic diagram of the flow channel design of a microchannel cooler in one embodiment of the present application is shown.

[0019] Description of reference numerals:

[0020] 1. Microchannel cooler;

[0021] 10. First substrate; 11. First inner pad; 12. First outer pad;

[0022] 20. Second substrate; 20a. Fluid inlet; 20b. Fluid outlet; 21. Second inner pad; 22. Second outer pad;

[0023] 30, flow channel layer; 31a, first channel layer; 31, first flow channel plate; 311, first sub-channel; 32, second flow channel plate; 32a, second channel layer; 321, second sub-channel; 322, third sub-channel;

[0024] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0025] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0026] When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Instead, they are merely examples of devices and methods consistent with certain aspects of the present application, as detailed in the appended claims.

[0027] With the rapid development of high-power semiconductor lasers, high-performance computing chips, and industrial power equipment, the demand for thermal management has increased dramatically. Traditional air cooling or macro-channel water cooling technology is limited by low heat dissipation efficiency, large size, and high energy consumption, making it difficult to meet the heat dissipation requirements of modern high-power density devices. For example, the power density of semiconductor lasers has exceeded 100W / cm 2 , while electric vehicle fast-charging technology and the high-frequency operation of industrial automation equipment further exacerbate thermal loads. Against this backdrop, the Micro Channel Cooler (MCC), with its micron-scale flow channel design significantly improving heat dissipation efficiency, has become a key technology for resolving thermal bottlenecks. Its microchannel structure achieves efficient heat dissipation, supporting the stable operation of lasers at power levels exceeding 100 watts.

[0028] The uniformity of coolant flow in a microchannel cooler directly determines the efficient diffusion of heat and the stability of the device, and the design of the flow channel layer is the core factor affecting the distribution of coolant flow. In related technologies, the flow channel layer of a microchannel cooler uses uniformly distributed parallel microchannels, and the coolant is prone to the phenomenon of "high flow velocity at the head end and flow attenuation at the end", which can easily lead to local overheating in high power density scenarios. In addition, due to processing technology limitations, the flow channel branch structure of the uniformly distributed parallel microchannels is difficult to ensure symmetry. Lack of symmetry will aggravate the flow distribution difference and reduce the uniformity of heat dissipation.

[0029] Combine Figure 1 and Figure 2 In order to solve the above problems, the present application provides a microchannel cooler 1, which includes a first substrate 10, a second substrate 20 and a flow channel layer 30.

[0030] The first substrate 10 and the second substrate 20 are disposed opposite to each other along the first direction X. The first substrate 10 is made of at least one of aluminum nitride ceramics, aluminum oxide ceramics, and diamond substrates, and the second substrate 20 is made of at least one of aluminum nitride ceramics, aluminum oxide ceramics, and diamond substrates.

[0031] The flow channel layer 30 is disposed between the first substrate 10 and the second substrate 20. The flow channel layer 30 is provided with fluid channels, which include a plurality of first channel layers 31a arranged along a first direction X. The first channel layer 31a includes a plurality of first sub-channels 311. The plurality of first sub-channels 311 in the same first channel layer 31a are arranged in rows along the second direction Y and in columns along the third direction Z. Adjacent first sub-channels 311 along the first direction X are staggered and connected. The first direction X, the second direction Y, and the third direction Z intersect with each other, for example, being perpendicular to each other, forming an acute angle between each other, or one of the directions being perpendicular to the other two directions, with the angles between the two directions being acute or obtuse.

[0032] Based on this, the multiple first sub-channels 311 are evenly distributed within the plane defined by the second direction Y and the third direction Z, improving heat dissipation efficiency and heat flux density carrying capacity. Furthermore, the staggered arrangement of adjacent first sub-channels 311 along the first direction X forms a multi-stage turbulent flow channel, increasing the coolant turbulence ratio and improving heat dissipation uniformity.

[0033] Optionally, the orthographic projection shape of the first sub-channel 311 on the first substrate 10 is a circle, an ellipse, a triangle, a quadrilateral, a pentagon, a hexagon, or a combination thereof. This increases the range of shape design options. Furthermore, when the orthographic projection shape of the first sub-channel 311 on the first substrate 10 is a polygon, it can specifically be a regular polygon. In this way, multiple first sub-channels 311 can be arranged more closely and evenly, thereby increasing the flow area and flow uniformity of the fluid, thereby improving the heat dissipation efficiency and heat dissipation uniformity.

[0034] In an exemplary embodiment, the orthographic projection shape of the first sub-channel 311 on the first substrate 10 is a regular hexagon, and a plurality of regular hexagonal first sub-channels 311 are arranged in a honeycomb shape, for example, to improve the arrangement density and arrangement uniformity, thereby improving the heat dissipation efficiency and heat dissipation uniformity.

[0035] Optionally, one first subchannel 311 of one first channel layer 31a is connected to multiple first subchannels 311 of an adjacent first channel layer 31a. For example, one first subchannel 311 of one first channel layer 31a is connected to two, three, or more first subchannels 311 of an adjacent first channel layer 31a. In this way, the fluid in the flow channel layer 30 is diverted multiple times during its flow, adjusting the flow direction and flow pressure, reducing the flow rate difference between the fluid inlet 20a and the fluid outlet 20b, and improving the uniformity of the fluid flow.

[0036] Optionally, the orthographic projection of one first subchannel 311 of one first channel layer 31a on the first substrate 10 overlaps with the orthographic projections of multiple first subchannels 311 of an adjacent first channel layer 31a on the first substrate 10, and the areas of the multiple overlapping regions are equal. Exemplarily, the orthographic projection of one first subchannel 311 of one first channel layer 31a on the first substrate 10 overlaps with the orthographic projections of three first subchannels 311 of an adjacent first channel layer 31a on the first substrate 10, and the areas of the multiple overlapping regions are equal. In other words, after the fluid flows from one first subchannel 311 of one first channel layer 31a to an adjacent first channel layer 31a, it is evenly distributed to the three first subchannels 311, making the fluid pressure in each channel more uniform.

[0037] In some embodiments, the multiple first sub-channels 311 have equal dimensions along the first direction X; the multiple first sub-channels 311 have equal dimensions along the second direction Y, and the multiple first sub-channels 311 are evenly spaced along the second direction Y; and the multiple first sub-channels 311 have equal dimensions along the third direction Z, and the multiple first sub-channels 311 are evenly spaced along the third direction Z. This further improves the uniformity of fluid flow.

[0038] In some embodiments, the second substrate 20 is provided with a fluid inlet 20a and a fluid outlet 20b. The fluid channel further comprises a second channel layer 32a, which includes a second sub-channel 321 and a third sub-channel 322. The second sub-channel 321 is connected to the fluid inlet 20a at one end along the first direction X and to a plurality of first sub-channels 311 at the other end. The third sub-channel 322 is connected to the fluid outlet 20b at one end along the first direction X and to a plurality of first sub-channels 311 at the other end. In this manner, fluid entering through the fluid inlet 20a first passes through the second sub-channel 321, then enters the first sub-channel 311, and then enters the third sub-channel 322, before finally exiting the fluid outlet 20b. Based on this, the shapes and sizes of the second and third sub-channels 321 and 322 can be adaptively adjusted to avoid interference with the fluid inflow and outflow process.

[0039] Optionally, the first substrate 10 is used to be fixed to the chip. Based on this, the fluid inlet 20a and the fluid outlet 20b are both arranged on the second substrate 20, which can avoid the fluid inlet 20a and the fluid outlet 20b from interfering with the chip in position, and there is no need to reserve more space on the first substrate 10 to set the fluid inlet 20a and the fluid outlet 20b, thereby reducing the size of the microchannel cooler 1.

[0040] Optionally, the orthographic projection area of ​​the second subchannel 321 on the first substrate 10 is larger than the orthographic projection area of ​​the fluid inlet 20a on the first substrate 10, and larger than the orthographic projection area of ​​the first subchannel 311 on the first substrate 10; the orthographic projection area of ​​the third subchannel 322 on the first substrate 10 is larger than the orthographic projection area of ​​the fluid outlet 20b on the first substrate 10, and larger than the orthographic projection area of ​​the first subchannel 311 on the first substrate 10. In this way, the second subchannel 321 and the third subchannel 322 can be prevented from interfering with the fluid inflow and outflow process.

[0041] Optionally, the orthographic projection of a second subchannel 321 on the first substrate 10 overlaps with the orthographic projections of the plurality of first subchannels 311 on the first substrate 10; and the orthographic projection of a third subchannel 322 on the first substrate 10 overlaps with the orthographic projections of the plurality of second subchannels 321 on the first substrate 10. In this way, fluid entering through the fluid inlet 20a first passes through the second subchannel 321 and then is split into the plurality of first subchannels 311, achieving a fluid pressure adjustment effect. The fluid pressure is further adjusted during the flow through the plurality of first channel layers 31a before flowing through the third subchannel 322 and finally out of the fluid outlet 20b, thereby more effectively improving the uniformity of fluid flow.

[0042] In some embodiments, the flow channel layer 30 includes a plurality of first flow channel plates 31 stacked in sequence along the first direction X, and the material of the first flow channel plates 31 includes, for example, at least one of copper and aluminum. A plurality of first sub-channels 311 are provided on the first flow channel plate 31, and the layout of the first sub-channels 311 on the plurality of first flow channel plates 31 is the same, and two adjacent first flow channel plates 31 along the first direction X are staggered. In this way, while ensuring the uniformity of fluid flow, the structure of the microchannel cooler 1 is simplified and the manufacturing process is simplified. When the microchannel cooler 1 is applied to chip packaging, the flow channel shape design ensures that the fluid flow distribution matches the chip power, and the structural design improves the turbulence ratio of the coolant, ensures the longitudinal flow of the coolant and heat exchange, and improves the heat dissipation efficiency.

[0043] Optionally, two adjacent first flow channel plates 31 are welded via a copper interface. It should be noted that the conventional microchannel cooler 1 uses indium solder packaging, which has a low melting point (157°C). Long-term operation under high-temperature conditions can easily lead to electrothermal migration, causing device failure and significantly shortening its lifespan. This embodiment uses copper interface welding technology to replace the conventional indium solder packaging, solving the problem of solder joint failure and short lifespan of the microchannel cooler 1 product at high temperatures.

[0044] Optionally, the flow channel layer 30 further includes a second flow channel plate 32 disposed between the first flow channel plate 31 and the second substrate 20 , and the second flow channel plate 32 is provided with a second sub-channel 321 and a third sub-channel 322 .

[0045] Optionally, the microchannel cooler 1 further includes a first inner solder pad 11 provided on the side of the first substrate 10 facing the second substrate 20, and a second inner solder pad 21 provided on the side of the second substrate 20 facing the first substrate 10. The first flow channel plate 31 is welded to the first substrate 10 via the first inner solder pad 11, and the first flow channel plate 31 is welded to the second substrate 20 via the second inner solder pad 21. In this way, the flow channel layer 30 can be fixed to the first substrate 10 and the second substrate 20.

[0046] Optionally, the microchannel cooler 1 further includes a first outer solder pad 12 provided on a side of the first substrate 10 facing away from the second substrate 20, and a second outer solder pad 22 provided on a side of the second substrate 20 facing away from the first substrate 10. The first outer solder pad 12 can be used for soldering to a chip, and the first outer solder pad 12 can also be used to form a circuit, which is coupled to an external power supply, for example, to control the flow state of the fluid.

[0047] The following are some examples of steps in the above-mentioned microchannel cooler molding process.

[0048] Step S1: providing a first substrate and a second substrate.

[0049] Step S2: providing a flow channel layer.

[0050] Step S3: fixing the flow channel layer to the first substrate and the second substrate.

[0051] See Figure 1 and Figure 2 Specifically, in step S1 , providing the first substrate 10 includes, for example, providing an aluminum nitride ceramic, an aluminum oxide ceramic, or a diamond substrate.

[0052] Providing the second substrate 20 includes, for example, providing an aluminum nitride ceramic, alumina ceramic, or diamond substrate. Laser drilling holes into the second substrate 20 forms flow channel inlets and outlets, with hole diameters ranging from 3 mm to 5 mm. The laser-processed second substrate 20 is cleaned with an alkaline solution / HF to remove slag generated by the laser processing. The alkaline solution may be NaOH or KOH.

[0053] A seed layer of metal is sputtered on the surfaces of the first substrate 10 and the second substrate 20 by magnetron sputtering. The thickness of the seed layer of metal is 0.5um-3um. The seed layer of metal can be titanium, copper or other metal layers.

[0054] The required pad patterns are transferred to the surfaces of the first substrate 10 and the second substrate 20 based on the seed layer metal by using photoresist in combination with exposure and development technology.

[0055] The surface of the pad pattern is filled with copper using an electroplating process.

[0056] The electroplated first substrate 10 and second substrate 20 are leveled to improve the surface flatness of the pads for facilitating subsequent welding and other processes.

[0057] The film is stripped and etched to reveal the pad circuits on the surfaces of the first substrate 10 and the second substrate 20 .

[0058] In step S2, providing the flow channel layer 30 includes, for example, etching the desired flow channel pattern on a 0.2 mm to 1 mm thick copper foil using laser or chemical etching, thereby forming a first flow channel plate 31 having a first subchannel 311 and a second flow channel plate 32 having a second subchannel 321 and a third subchannel 322. The number of layers of flow channel copper foil in a single microchannel cooler 1 product ranges from 2 to 100.

[0059] The copper interface welding technology is used to weld the plurality of first flow channel plates 31 and the second flow channel plates 32 .

[0060] In step S3 , the flow channel layer 30 is fixed to the first substrate 10 and the second substrate 20 , for example, by using copper interface welding technology to pressure-weld the flow channel layer 30 and the first substrate 10 .

[0061] The welded products are surface treated by physical grinding and chemical polishing.

[0062] The surface finishing layer is chemically plated, and the finishing layer can be a silver layer, a nickel-gold layer, or a nickel-palladium-gold layer, with a thickness of 0.5um-5um.

[0063] The microchannel cooler (MCC) thus prepared is based on a micron-scale flow channel structure and a multi-stage turbulence enhancement design, which significantly improves the heat dissipation efficiency and heat flux density carrying capacity, increases the upper temperature limit of the MCC product, and solves the problem of product interface welding failure under high temperature. The miniaturization heat dissipation effect of the cooler is improved by thinning the flow channel plate. The unique flow channel shape design ensures that the flow distribution matches the chip power, and through the structural design, the turbulence ratio of the coolant is increased, and the chip temperature uniformity is improved by more than 50%. The microchannel cooler is suitable for high-power semiconductor devices (such as IGBT, SiC / GaN modules), new energy vehicle electric drive systems, industrial servo equipment, 5G communication base stations, fiber lasers and aerospace electronic equipment. It achieves efficient thermal management through compact and lightweight design, effectively suppressing performance degradation and safety hazards caused by high temperature. This technology combines high efficiency, low energy consumption and high adaptability, providing innovative thermal management solutions for new energy, high-end equipment and intelligent manufacturing fields.

[0064] Based on the same inventive concept, the present application also provides a semiconductor device, which includes a chip and the microchannel cooler of the above embodiment, wherein the chip is fixed to the first substrate, for example, the chip and the first substrate are fixed by welding with a pad.

[0065] In the description of this application, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In addition, in the description of this application, unless otherwise specified, "multiple" refers to at least two, for example, two, three, four, etc. "and / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the previous and subsequent associated objects are in an "or" relationship.

[0066] The above disclosure is only a preferred embodiment of the present application and cannot be used to limit the scope of rights of the present application. Therefore, equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A microchannel cooler, characterized in that: include: a first substrate; a second substrate, arranged opposite to the first substrate along a first direction; a flow channel layer disposed between the first substrate and the second substrate, the flow channel layer being provided with a fluid channel, the fluid channel comprising a plurality of first channel layers arranged along the first direction, the first channel layer comprising a plurality of first sub-channels, the plurality of first sub-channels in the same first channel layer being arranged in rows at intervals along the second direction and in columns at intervals along the third direction, and two adjacent first sub-channels along the first direction being staggered and connected; The first direction, the second direction, and the third direction intersect with each other.

2. The microchannel cooler according to claim 1, characterized in that One of the first sub-channels in one of the first channel layers is connected to a plurality of the first sub-channels in an adjacent first channel layer.

3. The microchannel cooler according to claim 2, characterized in that: The orthographic projection of one of the first sub-channels of one of the first channel layers on the first substrate overlaps with the orthographic projections of multiple first sub-channels of an adjacent first channel layer on the first substrate, and the areas of the multiple overlapping regions are equal.

4. The microchannel cooler according to claim 1, characterized in that The sizes of the plurality of first sub-channels along the first direction are equal; The first sub-channels have the same size along the second direction, and are evenly spaced apart along the second direction; The first sub-channels have the same size along the third direction, and are evenly spaced apart along the third direction.

5. The microchannel cooler according to claim 1, characterized in that: The second substrate is provided with a fluid inlet and a fluid outlet; The fluid channel further includes a second channel layer, the second channel layer including a second sub-channel and a third sub-channel; One end of the second sub-channel along the first direction is connected to the fluid inlet, and the other end is connected to the plurality of first sub-channels; One end of the third sub-channel along the first direction is communicated with the fluid outlet, and the other end is communicated with the plurality of first sub-channels.

6. The microchannel cooler according to claim 5, characterized in that: The orthographic projection area of ​​the second subchannel on the first substrate is larger than the orthographic projection area of ​​the fluid inlet on the first substrate, and larger than the orthographic projection area of ​​the first subchannel on the first substrate; An orthographic projection area of ​​the third subchannel on the first substrate is larger than an orthographic projection area of ​​the fluid outlet on the first substrate, and larger than an orthographic projection area of ​​the first subchannel on the first substrate.

7. The microchannel cooler according to claim 1, characterized in that The flow channel layer includes a plurality of first flow channel plates sequentially stacked along the first direction, and a plurality of first sub-channels are provided on the first flow channel plates; The layout of the first sub-channels on the plurality of first flow channel plates is the same; Two adjacent first flow channel plates along the first direction are staggered.

8. The microchannel cooler according to claim 7, characterized in that: Two adjacent first flow channel plates are welded via a copper interface.

9. The microchannel cooler according to claim 7, characterized in that: The microchannel cooler further includes a first inner solder pad provided on a side of the first substrate facing the second substrate, and a second inner solder pad provided on a side of the second substrate facing the first substrate; The first flow channel plate and the first substrate are welded via the first inner welding pad, and the first flow channel plate and the second substrate are welded via the second inner welding pad.

10. A semiconductor device, characterized in that: include: chip; The microchannel cooler according to any one of claims 1 to 9; Wherein, the chip is fixed to the first substrate.

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