Electronic device

Abstract

The embodiment of the invention provides electronic equipment, which comprises a first middle frame, a second middle frame, a rotating shaft, a first device module, a first heat dissipation assembly and a battery, and is characterized in that the rotating shaft is connected between the first middle frame and the second middle frame; the first device module and the first heat dissipation assembly are arranged in a space where the first middle frame is located, and the first heat dissipation assembly is used for performing active heat dissipation on a first heat source in the first device module; the second device module, the second heat dissipation assembly and the battery are arranged in the space where the second middle frame is located, the second heat dissipation module is used for conducting passive heat dissipation on a second heat source in the second device module, and the power of the first heat source is larger than that of the second heat source. The maximum size of the first heat source in the thickness direction of the electronic equipment is smaller than that of the second heat source in the thickness direction of the electronic equipment. According to the electronic equipment, the devices with different load levels and different heights of the electronic equipment are respectively arranged on the two opposite sides of the rotating shaft according to respective heat dissipation requirements, so that attractiveness and thinning are realized, and the use comfort is improved.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to an electronic device. Background Art

[0002] For portable electronic devices such as mobile phones, tablets, and computers, lightweight and thinness are the development trend. Foldable electronic devices have foldable screens, which can provide a large-screen display effect when flattened. Foldable electronic devices are also portable in the folded state and are deeply loved by users. Foldable electronic devices include a first body and a second body that can be folded relative to each other. The first body houses the motherboard, which needs to accommodate many core functional components and a heat dissipation structure, so the first body requires a relatively thick space. The second body mainly houses the battery and does not need to carry larger components. Because the second body is thinner, this design leads to a larger thickness difference between the first and second bodies. When the electronic device is flattened to present a large-screen usage form, the large thickness difference between the first and second bodies affects the comfort of the large-screen usage form and the user experience. Therefore, how to design an electronic device with a foldable screen that is beautiful, lightweight, and can fully utilize the space between the two bodies when the foldable screen is flattened, thereby reducing the thickness difference between the two bodies, is a problem that needs to be solved urgently. Summary of the Invention

[0003] An embodiment of the present application provides an electronic device, which effectively reduces the thickness difference between the two main bodies of the electronic device that can be relatively folded and unfolded by arranging components of different load levels and different heights on opposite sides of a rotating shaft according to their respective heat dissipation requirements.

[0004] In a first aspect, an embodiment of the present application provides an electronic device, which includes a first middle frame, a second middle frame, a rotating shaft, a first device module, a first heat dissipation assembly, a second device module, a second heat dissipation assembly, and a battery. The rotating shaft is connected between the first middle frame and the second middle frame. The first device module and the first heat dissipation assembly are arranged in the internal space of the electronic device where the first middle frame is located, and the first heat dissipation assembly is used to actively dissipate heat for the first heat source in the first device module. The second device module, the second heat dissipation assembly, and the battery are arranged in the internal space of the electronic device where the second middle frame is located, the second device module is located between the battery and the rotating shaft, and the second heat dissipation module is used to passively dissipate heat for the second heat source in the second device module. The power of the first heat source is greater than the power of the second heat source, and the maximum dimension of the first heat source along the thickness direction of the electronic device is smaller than the maximum dimension of the second heat source along the thickness direction of the electronic device.

[0005] Active cooling can be understood as accelerating the transfer of heat from a heat source (such as a chip) to the external environment through direct forced convection using fans or other devices (such as pumps). Passive cooling can be understood as relying on the thermal conductivity of materials to allow heat to dissipate from the device surface to the environment through natural convection or radiation.

[0006] In the embodiment of the present application, the first device module and the second device module are respectively arranged in the first middle frame and the second middle frame on opposite sides of the rotating shaft, and the first device module with higher heat output and smaller thickness is actively cooled, while the second device module with lower heat output and larger thickness is passively cooled. Compared with stacking the first device module and the second device module on the first middle frame and actively cooling them, in the embodiment of the present application, the second device module with larger thickness is arranged in the second middle frame, so that the overall thickness of the first middle frame can be reduced, and the thickness difference between the main body of the electronic device where the first middle frame is located and the main body of the electronic device where the second middle frame is located is reduced. In the present application, the first device module and the second device module are respectively arranged in the first middle frame and the second middle frame on opposite sides of the rotating shaft, so that the first heat source and the second heat source are dispersed in different main bodies of the electronic device, and the environment in which the first heat source and the second heat source are located has a suitable operating temperature, which is conducive to ensuring the working performance of the first heat source and the second heat source, and is conducive to improving the temperature uniformity and heat dissipation efficiency of the electronic device. Moreover, by setting the second device module between the battery and the rotating shaft, the second device module and the rotating shaft are arranged side by side without overlapping, which is conducive to controlling the thickness of the electronic device body where the second middle frame is located. In addition, the second device module and the rotating shaft are adjacent, and the rotating shaft can also serve as a medium for passive heat dissipation of the second device module, which is conducive to improving heat dissipation efficiency.

[0007] In one embodiment of the first aspect, the second heat dissipation assembly conducts heat from the second device module to the rotating shaft. By conducting heat from the second device module to the rotating shaft through the second heat dissipation assembly, the rotating shaft is connected to the second heat dissipation assembly, and the rotating shaft can participate in heat dissipation from the second device module. The rotating shaft can be considered part of the second heat dissipation assembly. This embodiment increases the area of ​​the second heat dissipation assembly, thereby improving heat dissipation efficiency.

[0008] In one possible implementation, the size range of the closest distance between the heating center of the second heat source and the edge of the rotating shaft is less than or equal to 5 cm. The heating center position of the second heat source can be obtained by measurement. This solution constrains a specific implementation scheme, and the size range of the closest distance between the edge of the rotating shaft and the center position of the second heat source is less than or equal to 5 cm. This is conducive to obtaining a better heat dissipation effect, and is also conducive to the compact structure of the devices arranged in the second middle frame and the reasonable layout of the space in the electronic device.

[0009] In one possible implementation, the edge of the rotating shaft is the edge of the door panel of the rotating shaft corresponding to the second middle frame, adjacent to the second heat source. The door panel of the rotating shaft is the door panel on the side of the rotating shaft adjacent to the screen. For example, in an electronic device, the rotating shaft has a two-door panel structure, namely a left door panel and a right door panel, one of which (for example, the right door panel) is located on one side of the second middle frame. In this case, the closest distance between the edge of the right door panel and the heat center of the second heat source is less than or equal to 5 cm. The rotating shaft may also have three door panels or another number of door panels.

[0010] In one embodiment of the first aspect, the second heat dissipation assembly includes a heat sink and a heat-conducting structure, the second device module includes a second circuit board and a second heat source, the second heat source is arranged on the second circuit board, the heat sink is located on the side of the second heat source away from the second circuit board, part of the heat-conducting structure is located between the heat sink and the back cover of the electronic device, and part of the heat-conducting structure and the rotating shaft are stacked to transfer the heat of the second heat source to the rotating shaft through the heat-conducting structure. The heat transfer path of the second heat source in this embodiment is as follows: the heat emitted by the second heat source passes through the heat sink, the heat-conducting structure, part of the second middle frame and the rotating shaft in sequence, and can be dissipated through the rotating shaft. By stacking part of the heat-conducting structure and the rotating shaft, it is possible to construct a heat-conducting path between the rotating shaft and the heat sink in a limited space, which is conducive to improving the heat dissipation efficiency of the electronic device while reasonably controlling the size of the electronic device in the thickness direction. Exemplarily, the heat-conducting structure can be a graphite sheet.

[0011] In one embodiment, the heat sink may be a metal plate or a radiator structure with heat dissipation fins. The heat sink may also be other types of heat dissipation structures such as a temperature equalizing plate, a combination of a metal plate and a heat pipe.

[0012] In one embodiment of the first aspect, the second circuit board and the second middle frame are connected via a thermally conductive medium. The side of the second middle frame facing away from the second circuit board serves as the screen of the electronic device, and the thermally conductive structure is located between the heat sink and the back cover of the electronic device. That is, along the thickness direction of the electronic device, the screen, the second middle frame, the thermally conductive medium, the second circuit board, the second heat source, the heat sink, the thermally conductive structure, and the back cover can be stacked in sequence, thereby establishing a first heat transfer path comprising the second heat source, the heat sink, the thermally conductive structure, and the rotating shaft, and a second heat transfer path comprising the second heat source, the second circuit board, the thermally conductive medium, the second middle frame, and the rotating shaft. In this embodiment, the rotating shaft can be considered part of the second heat dissipation component. This embodiment facilitates improving the heat dissipation efficiency of the electronic device while reasonably controlling the thickness dimension of the electronic device.

[0013] In one embodiment of the first aspect, the heat-conducting structure includes a first heat-conducting portion and a second heat-conducting portion, the first heat-conducting portion and the second heat-conducting portion are respectively located on opposite sides of the second heat source along the thickness direction of the electronic device, the first heat-conducting portion is located between the heat dissipation plate and the back cover of the electronic device, and the second heat-conducting portion is located between the second middle frame and the screen, the first heat-conducting portion extends to overlap with the rotating shaft along the thickness direction of the electronic device to form a first heat transfer path of the second heat source, the heat dissipation plate, the first heat-conducting portion and the rotating shaft; or the first heat-conducting portion extends to overlap with the battery along the thickness direction of the electronic device to form a second heat transfer path of the battery, the first heat-conducting portion and the back cover; or the second heat-conducting portion extends to overlap with the battery along the thickness direction of the electronic device to form a third heat transfer path of the battery, the second middle frame and the second heat-conducting portion; or the second heat-conducting portion extends to overlap with the rotating shaft along the thickness direction of the electronic device to form a fourth heat transfer path of the second heat source, the heat dissipation plate, the second heat-conducting portion and the rotating shaft. This solution can effectively utilize the inherent components of the electronic device, such as the hinge, back cover and second middle frame, to transfer the heat emitted by the second device module and the battery. That is, the hinge, back cover and second middle frame can participate in the heat dissipation of the second device module, and also provide heat dissipation for the battery, thereby improving the heat dissipation efficiency of the electronic device.

[0014] In one embodiment of the first aspect, the second circuit board and the second middle frame are connected by a heat-conducting medium, and the screen of the electronic device is arranged on the side of the heat sink facing away from the second circuit board. The second middle frame is arranged on the side of the second device module facing away from the screen, and the screen, heat-conducting structure, heat sink, second heat source, second circuit board, heat-conducting medium and second middle frame can be stacked in sequence. This allows the first middle frame and the second middle frame to replace the position and function of the back cover, that is, the first middle frame and the second middle frame of the electronic device are located at the position where the back cover is located and act as the back cover, and the first middle frame and the second middle frame are respectively spaced relative to part of the screen to form an accommodation space. This is conducive to ensuring the heat dissipation efficiency of the electronic device while achieving the lightness and thinness of the electronic device.

[0015] In one embodiment of the first aspect, part of the heat-conducting structure is located between the heat sink and the screen, and part of the heat-conducting structure is located between the rotating shaft and the screen. This enables a first heat transfer path of the second heat source, the heat sink, the heat-conducting structure, and the rotating shaft, and a second heat transfer path of the second heat source, the heat sink, the heat-conducting structure, and the screen. In this embodiment, the first and second middle frames are arranged at the position of the back cover of the electronic device, which can replace the back cover and eliminate the space occupied by the back cover along the thickness direction of the electronic device. At the same time, it can realize the transfer of heat emitted by the second device module through the inherent components of the electronic device, ultimately achieving a lightweight and thin electronic device while ensuring the passive heat dissipation efficiency of the second device module.

[0016] In one embodiment of the first aspect, a portion of the heat-conducting structure is located between the second middle frame and the second circuit board, and a portion of the heat-conducting structure is located between the battery and the second middle frame. This forms a first heat transfer path between the second heat source, the second circuit board, the heat-conducting medium, a portion of the heat-conducting structure, and the second middle frame, and a second heat transfer path between the battery, another portion of the heat-conducting structure, and the second middle frame. This expands the heat dissipation area of ​​the second device module and the battery, thereby improving the heat dissipation efficiency of the electronic device.

[0017] In one embodiment of the first aspect, the heat-conducting structure includes a third heat-conducting portion and a fourth heat-conducting portion. The third heat-conducting portion is located between the heat sink and the screen, and the fourth heat-conducting portion is located between the second circuit board and the second middle frame. The third heat-conducting portion extends to overlap with the rotating shaft along the thickness direction of the electronic device, thereby forming a first heat transfer path between the second heat source, the heat sink, the third heat-conducting portion, and the rotating shaft; or the fourth heat-conducting portion extends to overlap with the battery along the thickness direction of the electronic device, thereby forming a second heat transfer path between the battery, the fourth heat-conducting portion, and the fourth heat transfer path of the second middle frame. This embodiment provides two additional heat transfer paths by laying the fourth heat-conducting portion between the battery and the second middle frame. This embodiment improves the passive heat dissipation efficiency of the second heat source while ensuring the thinness and lightweight of the electronic device. Furthermore, these two heat transfer paths enable the rotating shaft and the second middle frame to participate in the heat dissipation of the second device module and the battery, expanding the heat dissipation area of ​​the second device module and the battery, which is beneficial for improving the heat dissipation efficiency of the electronic device.

[0018] In one embodiment of the first aspect, the electronic device further includes a charging port, the charging port being located on a second side of the second middle frame, the second circuit board being adjacent to the second side, and the charging port being electrically connected to the second circuit board. This solution integrates the charging port on the second circuit board, so that the second circuit board not only houses the second heat source but also houses the charging port and wiring connected to the charging port. Alternatively, the second circuit board may also be provided with electronic components electrically connected to the charging port. This integrated arrangement helps improve space utilization within the electronic device.

[0019] In one embodiment of the first aspect, the electronic device further comprises a bracket and a bracket shaft, the bracket and the bracket shaft are provided in the second middle frame and are located between the battery and the shaft, the bracket is connected to the bracket shaft, the bracket can be flipped relative to the second middle frame, and the second device module and the bracket are distributed on both sides of the bracket shaft. Along the length direction of the electronic device, the bracket and the battery are staggered and do not overlap, and the bracket shaft and the battery are also staggered and do not overlap. Along the thickness direction of the electronic device, the bracket and the bracket shaft do not occupy the space in the thickness direction of the battery, which is beneficial to reducing the thickness of the electronic device. In one embodiment, the shaft and the bracket shaft can form a "T-shaped" layout and surround the second heat source. The second heat dissipation component is used to conduct the heat from the second heat source to the bracket shaft and the shaft, and the "T-shaped" layout and the structure surrounding the second heat source are beneficial to improving the heat dissipation efficiency of the electronic device.

[0020] In one embodiment of the first aspect, the electronic device further includes a third device module, wherein the maximum dimension of the third device module along the thickness direction of the electronic device is smaller than the maximum dimension of the first device module along the thickness direction of the electronic device, and the third device module and the bracket are stacked in the thickness direction of the electronic device. Since the thickness of the third device module is relatively small, the thickness space occupied by the third device module and the bracket together with the bracket is beneficial to saving the internal space of the electronic device and achieving the lightness and thinness of the electronic device. In addition, by stacking the third device module and the bracket, and connecting the bracket to the bracket shaft, and the bracket shaft to the second middle frame, the heat generated by the functional components in the third device module can also be effectively dissipated through the bracket, the bracket shaft and the shaft.

[0021] In one embodiment of the first aspect, the third device module includes a third circuit board and an electronic device disposed on the third circuit board. The third circuit board is connected to the second middle frame. A support structure is provided between the electronic device and the bracket. The support structure and the second middle frame together surround the third device module. This prevents the third device module from being exposed during the bracket's flipping. This also enhances isolation between the third device module and the outside world when the electronic device is in a folded state.

[0022] In one embodiment of the first aspect, a shielding structure is further provided between the electronic device and the bracket, and the shielding structure is connected to the support structure. Along the thickness direction of the electronic device, the support structure, the shielding structure, and the bracket are stacked in sequence. The shielding structure can be a metal sheet, and the shielding structure is used to shield the support structure and can be used as a decorative piece. Along the thickness direction of the electronic device, the screen, the second middle frame, the third circuit board, the electronic device, the support structure, and the bracket are stacked in sequence, that is, a support structure is provided between the electronic device and the bracket. The support structure can be used to protect the third device module. The electronic device of the third device module is located between the support structure and the third circuit board. The third device module and the electronic device are shielded and protected by the support structure, so that when the bracket is flipped, the electronic device of the third device module will not be exposed.

[0023] In one embodiment of the first aspect, the electronic components on the third circuit board include at least one of a capacitor, a resistor, and an inductor. This reduces the load of the third component module and helps reduce heat generation of the electronic device.

[0024] In one embodiment of the first aspect, the first heat source includes at least one of a CPU module and a power supply module; or the second heat source includes at least one of a charging management module, a DDR module, a radio frequency chip, an audio PA, and a screen Tcon. The CPU module or the power supply module can be used to ensure the normal functioning of the electronic device. Exemplarily, the charging management module can be used to connect to an external power source and provide sufficient current to the CPU module or the power supply module. The DDR module, the radio frequency chip, the audio PA, or the screen Tcon all contribute to achieving high performance of the electronic device.

[0025] In one embodiment of the first aspect, the first heat dissipation assembly includes a heat spreader and a fan. The heat spreader is configured to conduct heat from a first heat source to the fan. The first device module includes a first circuit board and a first heat source. Along the thickness of the electronic device, the first heat source is located between the first circuit board and the heat spreader. A first spacing space is defined between the first circuit board and the first middle frame. A second spacing space is defined between the heat spreader and the back cover of the electronic device. The screen of the electronic device is located on a side of the first middle frame facing away from the first circuit board. When the first device module needs to dissipate heat, the fan draws cool air from the outside into the first middle frame, i.e., the first accommodating chamber, through an air inlet located on a side of the screen away from the rotating shaft. The cool air entering the first accommodating chamber carries away the heat generated by the first heat source as it flows through it. Under the influence of the flow field, the cool air is discharged from the electronic device through multiple air outlets located on the second and first sides of the first middle frame, ultimately achieving active heat dissipation of the first heat source.

[0026] In one embodiment of the first aspect, the first heat dissipation assembly includes a heat sink and a thermal pad. The first circuit board, the first heat source, the thermal pad, the heat sink, and the temperature vapor chamber are stacked in sequence along the thickness of the electronic device. The heat sink and the thermal pad are used to improve heat dissipation efficiency in an active heat dissipation path. In one embodiment, the heat sink can be made of copper. The thermal pad can be a thermally conductive gel or other type of thermally conductive medium.

[0027] In one embodiment of the first aspect, the maximum dimension of the first heat source along the thickness direction of the electronic device is less than or equal to 2.5 mm; or, the maximum dimension of the second heat source along the thickness direction of the electronic device is greater than or equal to 2 mm. In this embodiment, the first heat source with a smaller thickness occupies less internal space of the electronic device where the first middle frame is located. Furthermore, by arranging the second heat source with a larger thickness and the first heat source in two accommodation spaces on either side of the rotating shaft, this helps reduce the thickness difference of the electronic device on both sides of the rotating shaft, thereby achieving a lighter and thinner electronic device.

[0028] In one embodiment of the first aspect, the electronic device further includes an electrical connection structure that passes through or spans the rotating shaft and is electrically connected between the first device module and the second device module to electrically connect the first device module and the second device module. In one embodiment, the electrical connection structure is a flexible circuit board.

[0029] In one embodiment of the first aspect, the heat sink is at least one of a metal plate, a heat sink structure with fins, a temperature-vaporizing plate, or a combination of a metal plate and a heat pipe; or the thermally conductive structure is a graphite sheet. This facilitates improving the active heat dissipation efficiency of the first device module through the heat sink, and improving the passive heat dissipation efficiency of the second device module through the thermally conductive structure, ultimately achieving efficient heat dissipation of the electronic device. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a schematic structural diagram of an electronic device provided in an embodiment of the present application in an unfolded state;

[0031] Figure 2 is a schematic structural diagram of an electronic device provided in an embodiment of the present application when in a folded state;

[0032] Figure 3 1 is a schematic diagram of a top view of the electronic device provided in an embodiment of the present application in an unfolded state without a back cover;

[0033] Figure 4 yes Figure 2 A schematic cross-sectional view of the electronic device shown;

[0034] Figure 5 is a schematic cross-sectional structural diagram of an electronic device proposed in one embodiment of the present application;

[0035] Figure 6 is another cross-sectional structural diagram of the electronic device proposed in an embodiment of the present application;

[0036] Figure 7 is another cross-sectional structural diagram of the electronic device proposed in an embodiment of the present application;

[0037] Figure 8 is another cross-sectional structural diagram of the electronic device proposed in an embodiment of the present application;

[0038] Figure 9 is a schematic cross-sectional structural diagram of an electronic device in an expanded state according to an embodiment of the present application;

[0039] Figure 10 This is another cross-sectional structural diagram of the electronic device proposed in an embodiment of the present application when it is in an unfolded state;

[0040] Figure 11 This is another schematic top view of the electronic device provided in an embodiment of the present application in a flattened state without a back cover;

[0041] Figure 12 yes Figure 11 The cross-sectional structural diagram of the electronic device shown is in a folded state. DETAILED DESCRIPTION

[0042] Explanation of some terms:

[0043] CPU: Central Processing Unit, central processing unit.

[0044] PA:Power Amp l if ier, power amplifier.

[0045] Tcon:T iming controller, timing controller.

[0046] DDR: Double Data Rate Synchronous Dynamic Random Access Memory, double data rate synchronous dynamic random access memory.

[0047] VC: Vapor Chamber, vacuum chamber temperature plate.

[0048] Active cooling: Direct forced convection through fans or other devices (such as pumps) accelerates the transfer of heat from the heat source (such as the chip) to the external environment.

[0049] Passive heat dissipation: relies on the thermal conductivity of the material to allow heat to dissipate from the surface of the device to the environment through natural convection or radiation.

[0050] The following explains some of the terms involved in the embodiments of this application.

[0051] The terms "first", "second", "third", "fourth", etc. in the description and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0052] The present application provides an electronic device, which can be any foldable terminal device such as a foldable screen mobile phone or a foldable PC. The electronic device has two main bodies that can be folded and unfolded relative to each other, so that the electronic device can be used in a folded state and a flattened state. The electronic device has a foldable screen, that is, the screen is in a flexible and foldable state. In the folded state, the screen is relatively folded, and the electronic device has a smaller volume and is convenient to carry. In the flattened state, the screen is in a flat large-screen state with a better display effect. In the flattened state, the difference in thickness between the two main bodies of the electronic device is small, which is conducive to the advantages of being light, beautiful and easy to use. If the difference in thickness between the two main bodies is large, in the flattened state, one side of the screen will be heavier and the other side will be lighter, which will affect the comfort of use and the user experience will be poor.

[0053] The layout of components within an electronic device affects its thickness. To minimize the difference in thickness between the two relatively folded bodies of the electronic device, the present embodiment utilizes the space of the entire device by placing components of different load levels and heights within the internal spaces of the two bodies on opposite sides of the hinge, according to their respective heat dissipation requirements (or space requirements). This ensures that the thickness difference between the two bodies is within an appropriate range, resulting in an aesthetically pleasing, thin electronic device and enhancing user comfort and experience.

[0054] In one embodiment, the embodiment of the present application sets the mainboard and the devices thereon in one of the middle frames, and sets the devices with larger height and smaller load level (such devices are large in height, but the power is not very large, and do not require active heat dissipation, and passive heat dissipation can also meet their working needs) in another middle frame. In this way, the overall thickness of the main body of the electronic device where the mainboard is located is reduced, and the thickness difference between the two main bodies is reduced. On the premise of meeting the heat dissipation needs, the overall thickness size of the electronic device can be reasonably controlled to improve the user experience.

[0055] Specifically, in one embodiment, the functional components in the electronic device include a first type of component (a component with a high load and a medium height), a second type of component (a component with a medium load and a high height), and a third type of component (a component with a low load and a low height). The high load, medium load, and low load mentioned here refer to the relative comparison of the power and heat generation parameters of the device in the working state. The medium height, high height, and low height mentioned here refer to the space occupied by the device in the thickness direction of the electronic device. In one embodiment, the embodiment of the present application sets the first type of component in the space of the main body where the first middle frame is located, and adopts active heat dissipation, and sets the second type of component in the space of the main body where the second middle frame is located, and adopts passive heat dissipation. The third type of component is set in the space of the main body where the second middle frame is located and is arranged below the built-in bracket. The built-in bracket and the battery do not overlap, and passive heat dissipation is also adopted. Exemplarily, the first type of component includes but is not limited to a CPU module, a power supply module, etc. The second type of component includes at least one of a charging management module, a DDR module, a radio frequency chip, an audio PA, and a screen Tcon. The third type of component can be at least one of a resistor, a capacitor, an inductor, etc.

[0056] This application distributes the second type of devices (high-height devices) and the first type of devices (medium-height devices) in the spaces of different middle frames on both sides of the shaft, actively dissipating heat for the first type of devices and passively dissipating heat for the second type of devices. For active heat dissipation, the heat dissipation structure requires a larger space, while the heat dissipation structure for passive heat dissipation does not require a larger space. Therefore, this application arranges the first type of devices with medium height that require active heat dissipation in the space where one middle frame is located, and passively dissipates heat for the second type of devices with high height in the space where another middle frame is located, so that the thickness difference of the main body of the electronic device corresponding to the two middle frames is within a suitable smaller range. On the contrary, if the first type of devices and the second type of devices are both arranged in the space where the same middle frame is located, then the thickness of the main body corresponding to this middle frame is bound to be larger, and the thickness of the other middle frame will be smaller, which will result in a larger difference in thickness between the two middle frames.

[0057] The electronic device in the embodiment of the present application may also be a tablet computer, a laptop computer, a handheld device with wireless communication function, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device, an electronic device in a 5G network, or an electronic device in a future evolved public land mobile communication network (PLMN), etc.

[0058] Figure 1 This is a structural diagram of the electronic device 100 provided in an embodiment of the present application in an unfolded state. Figure 2 This is a structural diagram of the electronic device 100 provided in an embodiment of the present application in a folded state. Figure 1 and Figure 2 , the electronic device 100 includes a first middle frame 1, a second middle frame 2, a hinge 3 and a back cover 10. The first middle frame 1 and the second middle frame 2 can both be used to carry functional components of the electronic device 100, such as a central processing unit, a circuit board, a charging module, a battery, etc. The first middle frame 1 and the second middle frame 2 are respectively located on both sides of the hinge 3 and are connected to the hinge 3. The first middle frame 1 and the second middle frame 2 can be opened and closed by the hinge 3. A part of the back cover 10 is provided on the first middle frame 1 and is surrounded by the first middle frame 1 to form a first accommodating cavity. Another part of the back cover 10 is provided on the second middle frame 2 and is surrounded by the second middle frame 2 to form a second accommodating cavity. Both the first accommodating cavity and the second accommodating cavity can be used to accommodate functional components of the electronic device 100.

[0059] Combine Figure 1 and Figure 2 As shown, in the embodiment of the present application, the direction of the axis of the rotating shaft 3 of the electronic device 100 is the first direction X, and the length direction of the electronic device 100 is the second direction Y, or the length direction of the first middle frame 1 and the second middle frame 2 is the second direction Y, and the second direction Y is perpendicular to the first direction X. The thickness direction of the electronic device 100, the thickness direction of the first middle frame 1 and the thickness direction of the second middle frame 2 are all the third direction Z, and the third direction Z is perpendicular to the plane formed by the first direction X and the second direction Y. Among them, the length, width, and thickness in the embodiment of the present application are only for convenience of description and do not mean any limitation on the size. For example, the length can be greater than, equal to, or less than the width.

[0060] See also Figure 1 The first middle frame 1 and the second middle frame 2 can be relatively unfolded to a flat state. When the electronic device 100 is in the flat state, the screen 101 of the electronic device 100 is flat, which can maximize the display interface. In the flat state, the electronic device 100 can be held for operation, or the electronic device can be supported by a stand on any place such as a desktop without being held, making it easier for the user to operate the electronic device 100.

[0061] See also Figure 2 The first middle frame 1 and the second middle frame 2 can be relatively closed to a folded state, and the electronic device 100 is in the folded state. The electronic device 100 has portable performance and is easy to carry.

[0062] like Figure 1 and Figure 2 As shown in a possible embodiment, the electronic device 100 is a foldable device, including two main bodies that can be folded and unfolded relative to each other, that is, the number of the first middle frame 1, the hinge 3 and the second middle frame 2 can all be one, and the hinge 3 can be located between the first middle frame 1 and the second middle frame 2. When the electronic device 100 is in the folded state, the first middle frame 1 and the second middle frame 2 are folded relative to each other to form a two-layer state (refer to Figure 2 shown). Figure 2 In the illustrated embodiment, the electronic device 100 is an inward-folding device. In the folded state, the screen 101 is located between the first middle frame 1 and the second middle frame 2. In other embodiments, the electronic device 100 may also be a tri-folding device, comprising three middle frames, wherein any adjacent middle frames may be connected via a hinge. In specific embodiments, the tri-folding electronic device can be folded into an S-shape or a G-shape when in the folded state.

[0063] like Figure 1 and Figure 2 As shown, in a possible embodiment, the frame of the electronic device corresponding to the first middle frame 1 includes a first side 11A and a second side 11B. The first side 11A is parallel to the rotating shaft 3. There are two second sides 11B, which are arranged opposite to each other and connected between the rotating shaft 3 and the first side 11A. In one embodiment, an air inlet 12 and an air outlet 13 are provided on the frame of the electronic device 100. The air inlet 12 is located on the second side 11B, and the air inlet 12 is located on the second side 11B at a position closer to the first side 11A. In one embodiment, the number of air inlets 12 of the electronic device 100 is two, and one air inlet 12 is provided on each second side 11B. The air outlet 13 is located on the first side 11A. In one embodiment, there are two air outlets 13, and the two air outlets 13 are arranged on the first side 11A at a relative interval. The air inlet 12 and the air outlet 13 have different opening directions, but are located adjacent to each other and can both be positioned near a fan within the electronic device 100. This helps ensure airflow exchange between the inside and outside of the electronic device 100, effectively dissipating heat from various heat-generating components, and ensuring the long-term and efficient operation of the electronic device 100. In one embodiment, the two air outlets 13 of the electronic device 100 face the same direction; for example, both air outlets 13 face the second direction Y.

[0064] Combine Figure 1 and Figure 2 As shown, in one possible embodiment, the electronic device 100 is provided with a first charging interface 14 and a second charging interface 21. Optionally, the first charging interface 14 is provided on the first side 11A, and the second charging interface 21 is provided on the frame of the electronic device corresponding to the second middle frame 2. Specifically, the frame of the electronic device corresponding to the second middle frame 2 includes a third side 22A and a fourth side 22B. The third side 22A is parallel to the rotation axis 3. There are two fourth sides 22B, which are arranged opposite each other and connected between the rotation axis 3 and the third side 22A. The fourth side 22B extends along the second direction Y (i.e., the length of the electronic device 100). The second charging interface 21 is provided on the fourth side 22B near the rotation axis 3, i.e., the distance between the second charging interface 21 and the rotation axis 3 is less than the distance between the second charging interface 21 and the third side 22A. The first charging interface 14 and the second charging interface 21 can each be used to receive external power to charge the functional components within the electronic device. In one embodiment, the first charging interface 14 and the second charging interface 21 can be used interchangeably and have the same function. Depending on the usage of the electronic device, the first charging interface 14 or the second charging interface 21 can be selected to facilitate plugging in a charger. In one embodiment, the positions of the first charging interface 14 and the second charging interface 21 can be determined by the distribution of electronic components within the first and second middle frames 1 and 2. Proper positioning of the first charging interface 14 and the second charging interface 21 can improve the device integration of the electronic device 100 and thereby conserve internal space within the electronic device 100. In other embodiments, the electronic device 100 may be provided with only one charging interface.

[0065] Figure 3 1 is a schematic diagram of a top view of the electronic device 100 provided in an embodiment of the present application in an unfolded state without a back cover 10. Figure 4 yes Figure 2 The cross-sectional structural diagram of the electronic device 100 shown in FIG. Figure 3 and Figure 4As shown, the electronic device 100 provided in the embodiment of the present application includes a first device module 4, a first heat dissipation component 5, a second device module 6, a second heat dissipation component 7, an electrical connection structure 8 and a battery 9. The first device module 4 and the second device module 6 both include a circuit board and functional devices, packaging structures, shielding structures, etc. arranged on the circuit board. In one embodiment, the first device module 4 is a first type device (a device with a high load and a medium height), and the second device module 6 is a second type device (a device with a medium load and a high height). The first device module 4 and the second device module 6 are distributed in two main bodies on both sides of the rotating shaft of the electronic device. The first heat dissipation component 5 provides active heat dissipation for the first device module 4, and the second heat dissipation component 7 provides passive heat dissipation for the second device module 6. The first heat dissipation component 5 and the second heat dissipation component 7 can both include specific structural parts in the electronic device, such as a rotating shaft, a middle frame, a back cover, a shielding cover of the device, etc. These structures have materials with high thermal conductivity, and they can all serve as part of the heat dissipation component. The electrical connection structure 8 is used to electrically connect the first device module 4 and the second device module 6. Specifically, Figure 3 The electrical connection structure 8 is represented by a rectangular frame. Figure 4 The electrical connection structure 8 is represented by a thicker line. The electrical connection structure 8 can pass through or cross the rotating shaft 3 and electrically connect the first device module 4 and the second device module 6. In one embodiment, the electrical connection structure 8 is an FPC.

[0066] See Figure 3 and Figure 4The first device module 4 and the first heat dissipation component 5 are both provided in the first middle frame 1. Specifically, the first device module 4 and the first heat dissipation component 5 are both located in the first accommodating cavity 15 formed by the back cover 10 and the first middle frame 1. The first device module 4 includes a first heat source 41. Schematically, the first heat source 41 may include, but is not limited to, a CPU module or a power supply module. Optionally, the maximum dimension of the first heat source 41 along the thickness direction of the electronic device 100 is less than or equal to 2.5 mm. The dimension of the first heat source 41 along the thickness direction of the electronic device 100 includes the functional components (such as a chip or part of the circuit), the packaging structure, the screen cover and other structures of the first heat source 41. The first heat dissipation component 5 may include, but is not limited to, a fan or a liquid cooling component. The first heat dissipation component 5 can be used to actively dissipate heat for the first device module 4. In one embodiment, the first heat dissipation component 5 includes a temperature vapor chamber 51 and a fan 52. A portion of the temperature vapor chamber 51 along the thickness direction of the electronic device 100 is stacked with the first heat source 41. The fan 52 can be provided at a position adjacent to the air outlet 13. In one possible embodiment, the number of fans 52 in the electronic device 100 is two, that is, an air inlet 12 and an air outlet 13 are provided near any fan 52. In one embodiment, the temperature plate 51 includes a first part 511 and a second part 512 that are connected to each other. The first part 511 is connected to the first heat source 41, and the second part 512 is connected to the fan 52. The second part 512 is arranged in a one-to-one correspondence with the number of fans 52. For example, in one embodiment, the number of fans 52 is two, and the number of second parts 512 is also two. The two second parts 512 are distributed on opposite sides of the first part 511 along the first direction X (that is, the width direction of the electronic device 100). As Figure 3 As shown, the temperature uniform plate 51 is roughly T-shaped.

[0067] See Figure 3 In one embodiment, an active heat dissipation solution is formed by combining a temperature equalizing plate 51 and a fan 52. The temperature equalizing plate 51 includes a hot end and a cold end. For example, the part where the first part 511 contacts the first heat source 41 is the hot end, and the position adjacent to the second part 512 and the fan 52 is the cold end. When the first heat source 41 is working, since the first heat source 41 has a higher power and generates a larger amount of heat, for example, the temperature of the second heat source 61 in the working state can exceed 50 degrees. The heat energy of the second heat source 61 is transferred to the hot end of the temperature equalizing plate 51, so that the medium in the temperature equalizing plate 51 is heated and vaporized. The vaporized medium diffuses to the cold end in the temperature equalizing plate 51, and is cooled and turned into liquid at the cold end (for example, at the position of the fan 52). The liquid medium is driven to the hot end through the structure in the temperature equalizing plate 51 (for example, a capillary structure), forming a circulating heat dissipation.

[0068] See Figure 3 and Figure 4, the second device module 6, the second heat dissipation assembly 7 and the battery 9 are all arranged in the second accommodating cavity 23 formed by the back cover 10 and the second middle frame 2. Optionally, the second device module 6 and the second heat dissipation assembly 7 are stacked along the third direction Z (the thickness direction of the electronic device 100). The second device module 6 is arranged side by side with the battery 9 along the second direction Y (the length direction of the electronic device 100). The second device module 6 and the battery 9 do not overlap, and there is no area overlap between the two in the thickness direction of the electronic device. In one embodiment, the second device module 6 and the battery 9 can be in contact. In one embodiment, a gap can also be retained between the second device module 6 and the battery 9. The gap between the second device module 6 and the battery 9 can be filled with an elastic structure, such as foam, which can absorb the dimensional changes caused by the thermal expansion of the second device module 6 and the battery 9. The second heat dissipation assembly 7 can be fixed on the circuit board or fixed to the second middle frame 2 by fasteners (such as screws). For example, by fixing the second heat dissipation assembly 7 and the second middle frame 2 , the position of the second device module 6 can also be fixed (clamped and fixed between the second heat dissipation assembly and the second middle frame in a stacking manner).

[0069] In one embodiment, the second device module 6 is provided in a position adjacent to the rotating shaft 3 in the second middle frame 2, and the second device module 6 is located between the battery 9 and the rotating shaft 3 along the second direction Y (the length direction of the electronic device 100). The second device module 6 includes a second heat source 61. Schematically, the second heat source 61 includes at least one of a charging management module, a DDR module, a radio frequency chip, an audio PA, and a screen Tcon. In one embodiment, the second heat source 61 is a charging management module, etc. Optionally, the maximum dimension of the second heat source 61 along the thickness direction of the electronic device 100 is greater than or equal to 2 mm, and the dimension of the second heat source 61 along the thickness direction of the electronic device 100 includes the functional device (chip), packaging structure, screen cover and other structures of the second heat source 61. The second heat dissipation component 7 can be used to passively dissipate heat for the second heat source 61 of the second device module 6. Schematically, the second heat dissipation component 7 is made of a material with high thermal conductivity, such as metal, graphite, etc. The second heat dissipation component 7 can be used to conduct the heat of the second heat source 61 to components such as the circuit board, middle frame, heat-conducting structure, heat dissipation plate or rotating shaft 3 of the electronic device 100. The heat is transferred to areas with lower heat on these components to achieve passive heat dissipation of the second heat source 61.

[0070] See Figure 4In one embodiment, the maximum dimension of the first device module 4 along the third direction Z is smaller than the maximum dimension of the second device module 6 along the third direction. The first device module 4 includes a first circuit board 42 and a first heat source 41 disposed on the first circuit board 42. The sum of the thickness of the first circuit board 42 and the maximum dimension H1 of the first heat source 41 along the third direction Z (i.e., the thickness direction of the electronic device 100) is equal to the maximum dimension of the first device module 4 along the third direction Z. The second device module 6 includes a second circuit board 62 and a second heat source 61 disposed on the second circuit board 62. The sum of the thickness of the second circuit board 62 and the maximum dimension H2 of the second heat source 61 along the third direction Z (i.e., the thickness direction of the electronic device 100) is equal to the maximum dimension of the second device module 6 along the third direction Z.

[0071] See also Figure 4 In one embodiment, the maximum dimension H1 of the first heat source 41 along the third direction Z (i.e., the thickness direction of the electronic device 100) is smaller than the maximum dimension H2 of the second heat source 61 along the third direction Z (i.e., the thickness direction of the electronic device 100). For example, the first heat source 41 may include multiple functional devices, and the second heat source 61 may also include multiple functional devices, and the thickness of the functional device with the largest dimension along the third direction Z in the first heat source 41 is smaller than the thickness of the functional device with the largest dimension along the third direction Z in the second heat source 61. This embodiment only needs to constrain the functional device with the largest dimension in the first direction Z. It can be understood that smaller functional devices may also exist in the second heat source 61, and the dimensions of some functional devices in the first heat source 41 in the third direction Z may be larger than the dimensions of some functional devices in the second heat source 61 in the third direction Z.

[0072] See Figure 4, the power of the first heat source 41 is greater than the power of the second heat source 61, that is, the heat generated per unit time by the first heat source 41 in the working state is greater than the heat generated per unit time by the second heat source 61 in the working state. The first heat source 41 needs to be actively dissipated by the first heat dissipation component 5. Since the heat generated by the first heat source 41 in the working state is large, if the heat of the first heat source 41 is directly conducted to the screen or back cover of the electronic device, it will cause local overheating of the electronic device, affecting the user experience (for example, it will be hot to the touch), and will also affect the normal operation of the screen. Therefore, the first heat source 41 needs to actively dissipate heat. In a specific embodiment, along the thickness direction of the electronic device 100, there is a first spacing G1 between the end of the first device module 4 away from the back cover 10 and the first middle frame 1. The first spacing G1 forms a thermal isolation between the first heat source 41 and the first middle frame 1 to prevent heat from being conducted to the first middle frame 1, causing the position of the first middle frame 1 corresponding to the first heat source 41 to overheat, thereby affecting the life and display of the screen 101. Along the thickness direction of the electronic device 100, the end of the first device module 4 away from the first middle frame 1 has a second spacing G2 from the back cover 10. This second spacing G2 forms a thermal barrier between the first heat source 41 and the back cover 10, preventing heat from being transferred to the back cover 10 and causing overheating at the position of the back cover 10 corresponding to the first heat source 41, thereby affecting the user experience (for example, becoming too hot). Therefore, in addition to the space occupied by the first device module 4 in the first accommodating cavity 15 along the thickness direction of the electronic device 100, the first spacing G1 and the second spacing G2 also require additional space in the first accommodating cavity 15 along the thickness direction of the electronic device 100.

[0073] See Figure 4 , the heat dissipation requirement of the second heat source 61 is lower than that of the first heat source 41, and the heat dissipation requirement of the second heat source 61 can be met by adopting passive heat dissipation for the second heat source 61. Passive heat dissipation requires that the second device module 6 and the second heat dissipation component 7 be fitted with the shell of the electronic device along the thickness direction of the electronic device 100 or have a small gap, and the smaller the gap, the better. That is, the smaller the gap, the easier it is for the heat emitted by the second device module 6 and the second heat dissipation component 7 to be transferred to the shell of the electronic device and other components with heat dissipation capabilities, and finally the heat is dissipated and the temperature of the electronic device is uniformed through the shell and these components. Along the thickness direction of the electronic device 100, the end of the second device module 6 away from the back cover 10 is connected to the second middle frame 2 by a heat-conducting medium 73. Most of the space of the second accommodating cavity 23 along the thickness direction of the electronic device 100 is reserved for the second device module 6 and the second heat dissipation component 7, which can provide heat dissipation efficiency on the one hand and is conducive to the thin design of the electronic device on the other hand.

[0074] In one embodiment, the rotating shaft 3 is connected to the second heat dissipation assembly 7, for example, Figure 4In the cross section shown, the second middle frame 2 is connected to the rotating shaft 3, and the second heat dissipation assembly 7 is indirectly connected through the second middle frame 2 and the rotating shaft 3. The second heat dissipation assembly 7 can conduct the heat of the second device module 6 to the rotating shaft 3. In one embodiment, the second middle frame 2 and the rotating shaft 3 both have thermal conductivity. For example, the materials of the second middle frame 2 and the rotating shaft 3 both include metal materials. For example, the second middle frame 2 can be made of aluminum alloy, and the rotating shaft 3 can include metal materials such as copper. In this solution, the rotating shaft 3 can participate in the heat dissipation of the second device module 6, and the rotating shaft 3 can be regarded as a part of the second heat dissipation assembly 7. This embodiment is conducive to improving the heat dissipation efficiency of the electronic device 100.

[0075] In one possible implementation, the size range of the closest distance between the heating center position of the second heat source 61 and the edge of the rotating shaft 3 is: less than or equal to 5 cm. The heating center position of the second heat source 61 can be obtained by measurement means. Schematically, the heating center position is in a plane formed by the width direction (X direction) of the electronic device 100 and the thickness direction (Z direction) of the electronic device 100, and the edge of the rotating shaft 3 is at a vertical distance from the plane along the length direction of the electronic device 100, and the vertical distance is roughly the closest distance between the heating center position of the second heat source 61 and the edge of the rotating shaft 3. This embodiment constrains a specific implementation scheme, and the size range of the closest distance between the edge of the rotating shaft 3 and the heating center position of the second heat source 61 is constrained by a distance of less than or equal to 5 cm, which is conducive to obtaining a better heat dissipation effect. This solution is conducive to providing a shorter heat conduction path, that is, the heat transfer path of the second heat source 61, the second heat dissipation component 7, the second middle frame 2 and the rotating shaft 3, so as to improve the heat transfer efficiency. The constraint of the closest distance between the heating center and the edge of the rotating shaft 3 being less than or equal to 5 cm is also conducive to a compact structure of the components arranged in the second middle frame 2 and a reasonable layout of the space in the electronic device 100.

[0076] In one possible embodiment, the edge of the rotating shaft 3 is the edge of the door panel of the rotating shaft 3 corresponding to the second middle frame 2, adjacent to the second heat source 61. The door panel of the rotating shaft 3 is the door panel on the side of the rotating shaft 3 adjacent to the screen 101 of the electronic device 100. For example, in an electronic device 100, the rotating shaft 3 has a two-door panel structure, namely a left door panel and a right door panel. For example, one of the door panels (such as the right door panel) is arranged opposite to the second middle frame 2, then the size range of the closest distance between the edge of the right door panel and the heating center position of the second heat source 61 is less than or equal to 5 cm. Optionally, the rotating shaft 3 can also have three door panels or other numbers of door panels.

[0077] Figure 5 This is a schematic cross-sectional view of an electronic device according to an embodiment of the present application. Figure 5In one embodiment, the first heat source 41 and the second heat source 61 are both provided in the first middle frame 1. For example, the first heat source 41 and the second heat source 61 are both provided on the first circuit board 42. The first heat dissipation component 5 actively dissipates heat for the first heat source 41 and the second heat source 61. Since the heat of the second heat source 61 and the heat of the first heat source 41 are both concentrated in the first accommodating cavity 15, the first spacing G1 and the second spacing G2 still need to maintain appropriate sizes. Since the maximum dimension H2 of the second heat source 61 along the third direction Z is greater than the maximum dimension H1 of the first heat source 41 along the third direction Z, Figure 5 The thickness of the main body of the electronic device corresponding to the first middle frame 1 provided in the embodiment shown needs to be greater than Figure 4 The thickness of the main body of the electronic device corresponding to the first middle frame 1 provided in the embodiment shown is as follows. Figure 4 The provided implementation method, Figure 5 In the illustrated embodiment, the difference in thickness of the main body of the electronic device on both sides of the rotating shaft 3 is greater.

[0078] Therefore, compared with Figure 5 The embodiment shown, Figure 4 In the illustrated embodiment, by setting the second device module 6 with a larger thickness in the second middle frame 2, the overall thickness of the main body of the electronic device where the first middle frame 1 is located can be reduced. In the main body of the electronic device where the first middle frame 1 is located, along the thickness direction, the size of the first device module 4 is close to the thickness of the first heat dissipation component 5. The size of the second device module 6 in the thickness direction is larger than the size of the first device module 4, and the size of the second device module 6 in the thickness direction is also larger than the thickness of the first heat dissipation component 5. Therefore, if the second device module 6 is set in the second middle frame, the size of the main body of the electronic device where the first middle frame is located in the thickness direction may be reduced compared to the solution of setting the second device module 6 in the first middle frame. Therefore, the embodiment of the present application can achieve a smaller thickness difference between the main body of the electronic device 100 where the first middle frame 1 is located and the main body of the electronic device 100 where the second middle frame 2 is located. Moreover, by setting the second device module 6 at a position between the battery 9 and the rotating shaft 3, the second device module 6 and the rotating shaft 3 are set side by side, that is, they do not overlap in the Z direction, which is conducive to controlling the thickness of the electronic device 100 body where the second middle frame 2 is located, and the second device module 6 and the rotating shaft 3 are adjacent, and the rotating shaft 3 can also serve as a medium for passive heat dissipation of the second device module 6, that is, the present application can perform auxiliary heat dissipation through the rotating shaft 3, which is conducive to improving the heat dissipation efficiency.

[0079] For example, in an embodiment of the present application, a first device module 4 having a higher load and a lower thickness adopts active heat dissipation and is arranged in the space of the electronic device where the first middle frame 1 is located on one side of the rotating shaft 3. The first device module 4 is actively cooled by a first heat dissipation assembly 5 including a core heat dissipation module such as a temperature equalizer 51 and a fan 52. A second device module 6 having a lower load and a higher thickness adopts passive heat dissipation and is arranged in the space of the electronic device where the second middle frame 2 is located on the other side of the rotating shaft 3. The second device module 6 is passively cooled by a second heat dissipation assembly 7. By arranging the first device module and the second device module in two different main bodies respectively, the embodiment of the present application avoids concentrating larger-sized and thicker devices in one main body, thereby reducing the thickness difference between the two main bodies, having the advantages of being beautiful and thin, and improving the performance of the first device module and the second device module.

[0080] Figure 4 In the embodiment shown, passive heat dissipation of the second device module 6 is performed by the second heat dissipation component 7. Figure 4 The embodiment shown, Figure 6 The illustrated embodiment provides a specific design of the second heat dissipation assembly 7 . Figure 6 The embodiment shown is similar to Figure 4 The difference between the illustrated embodiments lies in the specific structure of the second heat dissipation component 7 .

[0081] Figure 6 This is another cross-sectional structural diagram of the electronic device proposed in the embodiment of the present application, see Figure 6In one possible embodiment, the second heat dissipation assembly 7 includes a heat dissipation plate 71 and a heat-conducting structure 72. The heat dissipation plate 71 is stacked on the side of the second heat source 61 away from the second circuit board 62, and the heat-conducting structure 72 is located on the side of the heat dissipation plate 71 away from the second heat source 61, that is, along the third direction Z, the second circuit board 62, the second heat source 61, the heat dissipation plate 71, and the heat-conducting structure 72 are stacked in sequence. The heat dissipation plate 71 can also be a heat dissipation bracket. In one embodiment, the heat dissipation plate 71 has a temperature-uniformity performance. In one embodiment, the heat dissipation plate 71 can be a metal plate, or a radiator structure with heat dissipation fins. The heat dissipation plate 71 can also be other types of heat dissipation structures such as a temperature-uniform plate, a combination of a metal plate and a heat pipe. Optionally, the heat dissipation plate 71 is plate-shaped. Along the third direction Z (the thickness direction of the electronic device 100), the heat dissipation plate 71 is located between the back cover 10 and the second device module 6. Along the second direction Y (the length direction of the electronic device 100), the heat dissipation plate 71 is located between the battery 9 and part of the second middle frame 2. In one embodiment, the heat sink 71 can be attached to or thermally connected (e.g., via a thermally conductive medium) to the side of the second heat source 61 facing away from the screen 101. The heat sink 71 can transfer heat from the second heat source 61 to other components of the electronic device 100, such as the second middle frame 2, the hinge 3, or the back cover 10.

[0082] In one embodiment, the heat sink 71 can be fixed on the circuit board and fixed to the second middle frame 2 by fasteners, such as screws. Exemplarily, by fixing the heat sink 71 and the second middle frame 2, the position of the second circuit board 62 where the second heat source 61 is located can also be fixed. The heat sink 71 and the second heat source 61 are connected by a heat-conducting medium to achieve a large thermal resistance between the second heat source 61 and the heat sink 71 (for example, air. If no heat-conducting medium is provided, air will exist in the position where the second heat source 61 and the heat sink 71 cannot be completely fitted together. The air has a large thermal resistance and affects heat dissipation).

[0083] See Figure 6In one possible embodiment, the heat-conducting structure 72 is in the form of a sheet. Optionally, the heat-conducting structure 72 is a graphite sheet having a thickness at the nanometer level. Along the third direction Z (the thickness direction of the electronic device 100), the heat-conducting structure 72 can be provided on the side of the heat sink 71 away from the second heat source 61. In one embodiment, part of the heat-conducting structure 72 is connected to the heat sink 71, and the other part of the heat-conducting structure 72 is connected to the second middle frame 2. The heat-conducting structure 72 can enhance the heat conduction between the heat sink 71 and the second middle frame 2. Along the third direction Z (the thickness direction of the electronic device 100), part of the second middle frame 2 and the rotating shaft 3 are stacked. Since the heat-conducting structure 72 is connected to the second middle frame 2, the heat from the second heat source 61 can be transferred to the second middle frame 2 and the rotating shaft 3 through the heat-conducting structure 72, which is beneficial to improving the heat dissipation efficiency of the electronic device 100. In one embodiment, the heat-conducting structure 72 is attached to the inner surface of the back cover 10. In order to avoid concentrated overheating at the position of the back cover 10 facing the heat source, the present solution uses a heat-conducting structure 72 to disperse the heat. Therefore, the heat-conducting structure 72 can achieve temperature uniformity of the electronic device.

[0084] The heat-conducting structure 72 provided in this solution can, on the basis of the heat dissipation plate 71, guide the heat from the second heat source 61 to other components of the electronic device 100, such as the second middle frame 2, the hinge 3, or the back cover 10, thereby achieving efficient heat dissipation without occupying additional Z-direction space of the electronic device 100 on the side of the second middle frame 2, thereby facilitating the realization of a lightweight, high-performance electronic device 100. In other embodiments, the heat-conducting structure 72 can also be a heat-conducting sheet, a temperature vapor chamber, a heat pipe, or other structures with thermal conductivity made of other materials. The appropriate heat-conducting structure can be selected based on the space requirements within the electronic device to achieve thickness-wise stacking.

[0085] See Figure 6In one possible embodiment, the second circuit board 62 and the second middle frame 2 are connected via a thermally conductive medium 73. The side of the second middle frame 2 facing away from the second circuit board 62 is the screen 101 of the electronic device 100. Along the third direction Z (the thickness direction of the electronic device 100), the screen 101, the second middle frame 2, the thermally conductive medium 73, the second circuit board 62, the second heat source 61, the heat sink 71, the thermally conductive structure 72, and the back cover 10 are stacked in sequence. This layout in this embodiment forms a first heat transfer path between the second heat source 61, the heat sink 71, the thermally conductive structure 72, the second middle frame 2, and the hinge 3, as well as a second heat transfer path between the second heat source 61, the second circuit board 62, the thermally conductive medium 73, and the second middle frame 2. This allows the hinge 3 and the second middle frame 2 to participate in the operation of the second heat dissipation assembly 7, thereby improving heat dissipation efficiency. It should be noted that the middle frame receives heat from the heat source. Due to its large surface structure, the heat can be dispersed through the middle frame, preventing heat from being concentrated in a single location and causing localized overheating of the screen 101. The middle frame disperses heat to achieve a uniform temperature, thus keeping the heat of screen 101 within an appropriate range to meet the usage requirements of screen 101. In a specific embodiment, a small gap is provided between the middle frame and screen 101 to achieve thermal isolation between the middle frame and screen 101. Thermal isolation can also be achieved by attaching thermal insulation foam between screen 101 and the middle frame.

[0086] based on Figure 6 In the embodiment shown in FIG. 1 , the embodiment of the present application can further design the second heat dissipation component 7 in detail to optimize the passive heat dissipation efficiency of the second device module 6. For example, the embodiment of the present application can further refine the second heat dissipation component 7 in detail to optimize the passive heat dissipation efficiency of the second device module 6. Figure 6 The structure of the second heat dissipation component 7 is optimized to improve the heat dissipation efficiency by optimizing the heat transfer path between the second heat dissipation component 7 and other components of the electronic device.

[0087] Figure 7 This is another cross-sectional structural diagram of the electronic device proposed in the embodiment of the present application, see Figure 7 , Figure 7 The embodiment shown is similar to Figure 6The difference between the illustrated embodiments is that in one possible embodiment, the heat-conducting structure 72 includes a first heat-conducting portion 721 and a second heat-conducting portion 722. The first heat-conducting portion 721 is arranged between the heat dissipation plate 71 and the back cover 10. The first heat-conducting portion 721 can be arranged on the inner side of the back cover 10 or on the heat dissipation plate 71. The second heat-conducting portion 722 is arranged between the second middle frame 2 and the screen 101, that is, the second heat-conducting portion 722 is arranged on the side of the second middle frame 2 away from the heat-conducting medium 73. The second heat-conducting portion 722 is stacked between the second middle frame 2 and the screen 101. The second heat-conducting portion 722 arranged on the side of the second middle frame 2 away from the heat-conducting medium 73 extends along the second direction Y (the longitudinal direction of the electronic device 100) to overlap with a portion of the rotating shaft 3. In this embodiment, by setting a second heat conducting part 722 between the hinge 3 and the screen 101, and setting a first heat conducting part 721 between the hinge 3 and the back cover 10, the hinge 3 can participate in the heat dissipation of the second device module 6 through the connection between the second middle frame 2 and the hinge 3. This solution can form a first heat transfer path of the second heat source 61, the heat sink 71, the first heat conducting part 721, the second middle frame 2 and the hinge 3, and a second heat transfer path of the second heat source 61, the second circuit board 62, the heat conducting medium 73, the second middle frame 2, the second heat conducting part 722 and the hinge 3. It can be seen from the above heat transfer path that compared with Figure 6 In the electronic device 100 shown in this embodiment, the second heat conducting portion 722 is added to enhance the heat transfer efficiency.

[0088] In one embodiment, the heat-conducting structure 72 can be a graphite sheet with a relatively small thickness, which is beneficial for improving the heat dissipation efficiency within the limited space of an electronic device. By providing the heat-conducting structure 72 on both sides of the second heat source 61 in the thickness direction, this solution can more effectively conduct the heat from the second heat source 61 to the shaft 3, thereby improving the utilization rate of the shaft in heat dissipation. By laying a portion of the heat-conducting structure 72 between the second middle frame 2 and the screen 101, this embodiment optimizes the transfer path between the heat emitted by the second heat source 61 and the external environment, which is beneficial for improving the heat dissipation efficiency of the electronic device 100.

[0089] based on Figure 7 In the embodiment shown, the embodiment of the present application may further include more detailed designs for the heat-conducting structure 72 of the second heat dissipation component 7 to optimize the passive heat dissipation efficiency of the second device module 6 .

[0090] Figure 8 is another cross-sectional structural diagram of the electronic device proposed in the embodiment of the present application, Figure 8 The embodiment shown is similar to Figure 7The difference between the embodiment shown is that part of the heat-conducting structure 72 is on the inner surface of the back cover and extends to the second middle frame and the battery layer respectively, and part of the heat-conducting structure 72 is between the second middle frame 2 and the screen 101 and extends to the hinge and the battery layer respectively. Figure 8 In one possible embodiment, the heat-conducting structure 72 includes a first heat-conducting portion 721 and a second heat-conducting portion 722. The first heat-conducting portion 721 extends along the second direction Y (the length direction of the electronic device) and is stacked with the battery 9. Along the third direction Z (the thickness direction of the electronic device), the screen 101, the second middle frame 2, the battery 9, and the first heat-conducting portion 721 are stacked. This solution can form a first heat transfer path between the second heat source 61, the heat sink 71, the first heat-conducting portion 721, and the rotating shaft 3, and a second heat transfer path between the battery 9, the first heat-conducting portion 721, and the back cover 10. In this embodiment, the second heat-conducting portion 722 is located between the portion of the second middle frame 2 adjacent to the battery 9 and the screen 101, that is, along the thickness direction of the electronic device 100 (the Z direction in the figure), the screen 101, the second heat-conducting portion 722, the second middle frame 2, the battery 9, and part of the heat-conducting structure 72 are stacked, that is, both sides of the battery 9 along the thickness direction of the electronic device 100 have a part of the heat-conducting structure 72. This solution can form a third heat transfer path between the battery 9, the second middle frame 2, and the second heat conducting portion 722. The three heat transfer paths formed by this solution can effectively utilize inherent components of the electronic device 100, such as the hinge 3, the back cover 10, and the second middle frame 2, to transfer heat dissipated by the second device module 6 and the battery 9. This allows the hinge 3, the back cover 10, and the second middle frame 2 to participate in the heat dissipation of the second device module 6, and also provide heat dissipation for the battery 9, thereby improving the heat dissipation efficiency of the electronic device 100.

[0091] See Figure 8 , part of the second heat-conducting part 722 extends to between the part of the second middle frame 2 corresponding to the battery 9 and the screen 101. Another part of the second heat-conducting part 722 and part of the second middle frame 2, the second device module 6 and the second heat dissipation component 7 are stacked in sequence along the thickness direction of the electronic device 100 (Z direction in the figure). And the second heat-conducting part 722, the rotating shaft 3, part of the second middle frame 2 and the first heat-conducting part 721 are stacked in sequence along the thickness direction of the electronic device 100 (Z direction in the figure). Along the thickness direction of the electronic device 100, both sides of the second heat source 61 have partial heat-conducting structures 72, that is, the first heat-conducting part 721 and the second heat-conducting part 722 are respectively provided. And both sides of the battery 9 have partial heat-conducting structures 72, that is, the first heat-conducting part 721 and the second heat-conducting part 722 are respectively provided. This solution improves the heat dissipation efficiency of the electronic device 100 while ensuring the lightness and thinness of the electronic device 100 by setting a large-area first heat-conducting portion 721 on the inner surface of the back cover 10 and a large-area second heat-conducting portion 722 between the second middle frame 2 and the screen 101.

[0092] based on Figure 8 In the embodiment shown, the first heat-conducting portion 721 can only cover the area where the heat sink 71 and the battery 9 are located, that is, the setting of the first heat-conducting portion 721 can avoid the position of the rotating shaft 3 to save space in the area where the rotating shaft is located. The second heat-conducting portion 722 can also only cover other areas on the second middle frame 2 except the rotating shaft 3, that is, the second heat-conducting portion 722 can also avoid the position of the rotating shaft 3 to save space in the area where the rotating shaft is located. On both sides of the battery 9 along the third direction Z, the first heat-conducting portion 721 and the second heat-conducting portion 722 can both cover part of the area of ​​the battery 9, or the entire area. Therefore, the present application does not restrict the specific setting of the heat-conducting structure 72, and the heat-conducting structure 72 can be reasonably arranged according to the needs of the specific application scenario.

[0093] Figure 6 、 Figure 7 and Figure 8 The embodiment shown in the figure introduces the structure of the second heat dissipation component 7 to optimize the passive heat dissipation efficiency of the second device module 6. On this basis, the embodiment of the present application can also improve Figure 6 、 Figure 7 and Figure 8 The position of the middle frame in the middle part can ensure the passive heat dissipation efficiency of the second device module 6 while achieving the lightness and thinness of the electronic device 100.

[0094] Figure 9 This is a schematic cross-sectional view of the electronic device in a flattened state according to an embodiment of the present application. Figure 9 , Figure 9 The embodiment shown is similar to Figure 6 、 Figure 7 and Figure 8 The difference between the illustrated embodiments lies in the different configuration of the middle frame. In one possible embodiment, the first and second middle frames 1 and 2 can replace the position and function of the back cover. Specifically, the first and second middle frames 1 and 2 of the electronic device 100 are positioned in the back cover's place and serve as the back cover. The first and second middle frames 1 and 2 are spaced relative to and spaced from portions of the screen 101 to form a storage space within which the functional components of the electronic device are located. Along the third direction Z (the thickness direction of the electronic device 100), the first middle frame 1 is positioned on the side of the first device module 4 facing away from the screen 101. The screen 101, first device module 4, first heat dissipation assembly 5, and first middle frame 1 can be stacked in sequence. The screen 101 is positioned on the side of the heat sink 71 facing away from the second circuit board 62, and the second middle frame 2 is positioned on the side of the second device module 6 facing away from the screen 101. The screen 101, heat conductive structure 72, heat sink 71, second heat source 61, second circuit board 62, heat conductive medium 73, and second middle frame 2 can be stacked in sequence.

[0095] See Figure 9 In one embodiment, the second circuit board 62 and the second middle frame 2 can be connected by a heat-conducting medium 73 to realize a first heat transfer path among the second heat source 61, the second circuit board 62, the heat-conducting medium 73 and the second middle frame 2. The heat sink 71 is located between the second circuit board 62 and the screen 101. Part of the heat-conducting structure 72 can be fitted with the heat sink 71, that is, part of the heat-conducting structure 72 is located between the heat sink 71 and the screen 101. Part of the heat-conducting structure 72 can extend along the second direction Y (the length direction of the electronic device 100) to fit with the rotating shaft 3, that is, part of the heat-conducting structure 72 is located between the rotating shaft 3 and the screen 101. This can realize the second heat transfer path among the second heat source 61, the heat sink 71, the heat-conducting structure 72 and the rotating shaft 3, and the third heat transfer path among the second heat source 61, the heat sink 71, the heat-conducting structure 72 and the screen 101. In this embodiment, the first middle frame 1 and the second middle frame 2 are arranged at the position of the back cover of the electronic device, which can replace the back cover and eliminate the space occupied by the back cover along the thickness direction of the electronic device 100. At the same time, it can realize the transfer of heat emitted by the second device module 6 through the inherent components of the electronic device 100, and ultimately achieve the lightweight and thinness of the electronic device 100 while ensuring the passive heat dissipation efficiency of the second device module 6.

[0096] Figure 9 The embodiment shown can ensure the passive heat dissipation efficiency of the second device module 6 while achieving the lightness and thinness of the electronic device 100 by designing the positions of the first middle frame 1 and the second middle frame 2. Figure 10 The illustrated embodiment can also optimize the heat transfer path between the second heat dissipation component 7 and other components of the electronic device 100 by refining the specific configuration of the heat-conducting structure 72 to improve the heat dissipation efficiency.

[0097] Figure 10 This is another cross-sectional structural diagram of the electronic device in the embodiment of the present application when it is in a flattened state. Figure 10 , this program and Figure 9The difference between the illustrated embodiments lies in the specific details of the heat-conducting structure 72. In one possible embodiment, the heat-conducting structure 72 of the electronic device 100 in this embodiment includes a third heat-conducting portion 723 and a fourth heat-conducting portion 724. Along the third direction Z (the thickness direction of the electronic device 100), the fourth heat-conducting portion 724 is located between the second middle frame 2 and the second circuit board 62, and the second circuit board 62, the heat-conducting medium 73, the fourth heat-conducting portion 724 and the second middle frame 2 can be stacked in sequence. This can form a third heat transfer path of the second heat source 61, the second circuit board 62, the heat-conducting medium 73, the fourth heat-conducting portion 724 and the second middle frame 2. In one embodiment, the fourth heat-conducting portion 724 can extend along the length direction of the electronic device 100 to the battery compartment area where the battery 9 is located, that is, the fourth heat-conducting portion 724 and the battery 9 are stacked along the thickness direction of the electronic device 100, that is, there is a fourth heat-conducting portion 724 between the battery 9 and the second middle frame 2. This can form a fourth heat transfer path of the battery 9, the fourth heat-conducting portion 724 and the second middle frame 2. In this embodiment, the fourth heat conducting portion 724 is laid between the battery 9 and the second middle frame 2. Figure 9 The electronic device 100 shown in this embodiment provides two additional heat transfer paths. While ensuring the lightweight and thinness of the electronic device 100, this embodiment can also improve the passive heat dissipation efficiency of the second heat source 61. Furthermore, these four heat transfer paths allow the hinge 3 and the second middle frame 2 to participate in the heat dissipation of the second device module 6 and the battery 9, expanding the heat dissipation area of ​​the second device module 6 and the battery 9, thereby improving the heat dissipation efficiency of the electronic device 100.

[0098] Figure 3 In the embodiment shown, the area between the rotating shaft 3 and the battery 9 is used to arrange the second device module 6 and the second heat dissipation assembly 7. The second circuit board 62 can be long and extend along the first direction X (parallel to the rotating shaft). The second heat source 61 can be arranged at any position on the second circuit board 62. The embodiment of the present application can also provide a built-in bracket in the electronic device, so that when the electronic device is in a flat state, the built-in bracket can support the electronic device, making it easier to use and improving the comfort and user experience. For specific design, please refer to Figure 11 The embodiment shown.

[0099] Figure 11 This is another schematic diagram of the top view of the electronic device provided in the embodiment of the present application when it is in a flat state and without a back cover. Figure 3 The difference between the embodiment shown is that the bracket 103 is added and the charging circuit corresponding to the second charging interface 21 is integrated on the second circuit board 62. Figure 11In one possible embodiment, the second charging interface 21 is provided on the fourth side 22B of the second middle frame 2. The second circuit board 62 of the second device module 6 is adjacent to the fourth side 22B. The second heat source 61 is provided on the second circuit board 62 along the thickness direction of the electronic device 100. The second circuit board 62 also includes a charging circuit and a connector, both of which are used to electrically connect the second charging interface 21, that is, the second charging interface 21 is electrically connected to the second circuit board 62. In this embodiment, by electrically connecting the second heat source 61 of the second device module 6, the second circuit board 62 and the second charging interface 21 of the electronic device 100, and integrating the second heat source 61, the second circuit board 62 and the second charging interface 21, the space of the second accommodating cavity 23 of the electronic device 100 can be saved. The electronic device 100 also includes a bracket 103 and a bracket shaft 104. The bracket 103 is connected to the bracket shaft 104 so that the bracket 103 can be flipped around the bracket shaft 104. The bracket 103 and the rotating shaft 104 are located between the battery 9 and the rotating shaft 3 , and the second device module 6 and the bracket 103 are distributed on both sides of the bracket rotating shaft 104 .

[0100] Figure 12 yes Figure 11 The cross-sectional view of the electronic device in the folded state is shown. Figure 11 and Figure 12 As shown, along the second direction Y (the length direction of the electronic device 100), the bracket 103 and the battery 9, as well as the bracket shaft 104 and the battery 9 are all staggered, that is, along the third direction Z (the thickness direction of the electronic device 100), the bracket 103 and the bracket shaft 104 do not occupy the Z-direction space of the battery 9, which is beneficial to reducing the Z-direction space size of the electronic device 100 on the side of the second middle frame 2. A window is provided on the back cover 10 to accommodate the bracket 103. When the bracket 103 is not used, the bracket 103 is completely closed. At this time, along the first direction X (the width direction of the electronic device 100), the bracket 103 can be in the same plane as the part of the back cover 10 close to the second middle frame 2. Figure 11 Taking the electronic device 100 in the unfolded state as an example, when the bracket 103 is needed, the bracket 103 is flipped around the bracket rotation axis 104 to be unfolded. At this time, the bracket 103 can form a certain angle with the plane formed by the first direction X and the second direction Y. Schematically, the projection of the end of the bracket 103 away from the bracket rotation axis 104 in the unfolded state along the thickness direction of the electronic device 100 can be as follows: Figure 11 The dotted position pointed by the dotted arrow.

[0101] Combine Figure 11 and Figure 12 As shown, in a possible embodiment, the rotating shaft 3 and the bracket rotating shaft 104 can form a Figure 11The "T-shaped" layout shown surrounds the second heat source 61 of the electronic device 100. Specifically, the second device module 6 and the bracket 103 can be distributed on both sides of the bracket shaft 104, that is, the bracket shaft 104 can divide the second accommodating cavity 23 into two sub-accommodating cavities, and the second device module 6 and the second heat dissipation component 7 are located in one of the sub-accommodating cavities, and along the third direction Z (the thickness direction of the electronic device 100), the bracket 103 can be stacked with the other sub-accommodating cavity. This makes it possible to stagger the bracket 103 and the second device module 6 and the second heat dissipation component 7 along the width direction of the electronic device 100, that is, along the first direction, the bracket 103 and the second device module 6 and the second heat dissipation component 7 are all staggered, that is, along the length direction of the electronic device 100, the bracket 103 and the bracket shaft 104 do not occupy the additional Y-direction space of the electronic device 100 on the side of the second middle frame 2, which is conducive to achieving high integration and miniaturization of the electronic device 100. In one embodiment, the second heat dissipation component 7 is used to conduct the heat from the second heat source 61 to the bracket shaft 104. Because the second heat sink assembly 7 is disposed within the second middle frame 2, which is connected to the hinge 3 and the bracket hinge 104, heat emitted from the second heat source 61 of the second device module 6 can be transferred sequentially along the second heat sink assembly 7 and the second middle frame 2 to the hinge 3 and the bracket hinge 104. The bracket hinge 104 can contribute to the heat dissipation of the second device module 6, expanding the heat dissipation area of ​​the second device module 6 and thereby improving the heat dissipation efficiency of the electronic device 100. In one embodiment, the second middle frame 2, the hinge 3, and the bracket hinge 104 all comprise metal or other materials with good thermal conductivity. In this embodiment, the second heat sink assembly 7 conducts heat from the second device module 6 to the bracket hinge 104, enabling effective passive heat dissipation of the thicker second device module 6 through the inherent components of the electronic device 100, without requiring additional components for active heat dissipation, such as fans and liquid cooling elements. This helps reduce the thickness of the electronic device 100.

[0102] Combine Figure 11 and Figure 12As shown, in one possible embodiment, the electronic device 100 further includes a third device module 105. In one embodiment, the third device module 105 is a third type device (a device with low load and low height). The third device module 105 is located between the battery 9 and the rotating shaft 3, that is, along the second direction Y (the length direction of the electronic device 100), the battery 9, the third device module 105 and the rotating shaft 3 are arranged in sequence. Along the first direction X (the width direction of the electronic device 100), the third device module 105 and the second device module 6 are arranged in sequence. Along the third direction Z (the thickness direction of the electronic device 100), the third device module 105 and the bracket 103 are stacked. The maximum dimension of the third device module 105 along the thickness direction of the electronic device 100 is smaller than the maximum dimension of the first device module 4 along the thickness direction of the electronic device 100. Optionally, the third device module 105 may include low-load devices such as resistors, capacitors and inductors. In this embodiment, the third device module 105 is disposed in a space that overlaps with the bracket 103 along the thickness direction of the electronic device 100. Since the third device module 105 is relatively thin, it occupies the same thickness space as the bracket 103, which helps save internal space of the electronic device 100 and thus achieves a thinner and lighter electronic device 100. In addition, by stacking the third device module 105 and the bracket 103, with the bracket 103 connected to the bracket shaft 104, and the bracket shaft 104 connected to the second middle frame 2, the heat generated by the functional components in the third device module 105 can be effectively dissipated through the bracket 103, the bracket shaft 104, and the shaft 3. This allows the bracket 103, the bracket shaft 104, and the shaft 3 to participate in the heat dissipation of the third device module 105, expanding the heat dissipation area of ​​the third device module 105, and thus improving the heat dissipation efficiency of the electronic device 100. For example, compared with the first device module 4 and the second device module 6, the third device module 105 has the lowest load and the smallest thickness. By arranging the third device module 105 below the bracket 103 along the thickness direction of the electronic device 100, and the bracket 103 does not overlap with the battery 9, the space of the battery 9 will not be affected, and there is no need to add additional heat dissipation elements to dissipate heat for the third device module 105, which is conducive to the lightweight and thinness of the electronic device 100.

[0103] Combine Figure 11 and Figure 12As shown, in one possible embodiment, the third device module 105 includes an electronic device 1051 and a third circuit board 1052. The electronic device 1051 is provided on the third circuit board 1052, and the third circuit board 1052 can be connected to the second middle frame 2. Optionally, the electronic device 100 further includes a support structure 106 and a shielding structure 107. Along the third direction Z (the thickness direction of the electronic device 100), the support structure 106, the shielding structure 107, and the portion of the back cover 10 near the second middle frame 2 can be arranged in sequence. The support structure 106, the shielding structure 107, and the bracket 103 can also be arranged in sequence. The shielding structure 107 can be a metal sheet. The shielding structure 107 is used to shield the support structure 106 and can serve as a decorative piece. Along the thickness direction of the electronic device 100 (Z direction in the figure), the screen 101, the second middle frame 2, the third circuit board 1052, the electronic device 1051, the support structure 106, and the bracket 103 are stacked in sequence, that is, the support structure 106 is provided between the electronic device 1051 and the bracket 103. The support structure 106 can be used to protect the third device module 105. The electronic device 1051 of the third device module 105 is located between the support structure 106 and the third circuit board 1052. The support structure 106 shields and protects the third device module 105 and the electronic device 1051, so that when the bracket 103 is flipped, the electronic device 1051 of the third device module 105 will not be exposed.

[0104] Along the thickness direction of the electronic device 100, the support structure 106, the shielding structure 107, and the bracket 103 can be stacked in sequence, that is, the support structure 106 and the shielding structure 107 are provided between the electronic device 1051 and the bracket 103. The shielding structure 107 can be used to improve the appearance of the exposed portion of the support structure 106 during the inversion of the bracket 103, and can also enhance the isolation of the third device module 105 from the outside world.

[0105] See also Figure 12In one possible embodiment, the support structure 106 is in the shape of a flat plate. In one possible embodiment, the support structure 106 may be in a stepped structure. The stepped support structure 106 may be provided with structural members of different sizes. For example, the third device module 105 has different heights, or the rotating shaft adjacent to the third device module 105 or the related structures of the second middle frame have different sizes. The shielding structure 107 and the bracket 103 may also be in a stepped shape to match the stepped multi-device structure. The stepped support structure 106, the shielding structure 107 and the bracket 103 can not only fully fill the height difference caused by electronic devices 1051 of different sizes, but also do not occupy additional space of the second middle frame 2 along the thickness direction of the electronic device 100. The stepped bracket 103 can also have a stronger supporting strength, which is beneficial to the stability of the electronic device 100 when it is placed in any placeable area through the bracket 103, and ultimately achieves efficient operation of the electronic device 100.

[0106] In one embodiment, the bracket 103 is made of metal. The support structure 106 is provided with a magnetic structure, and the magnetic attraction between the magnetic structure and the bracket 103 can fix the position of the bracket 103 when the bracket 103 is in the closed state to prevent the bracket 103 from freely turning over.

[0107] Combine Figure 11 as well as Figure 12 As shown, in a possible embodiment, the first heat dissipation component 5 can include a temperature homogenizing plate 51, a fan 52, a heat sink 53 and a thermal pad 54. Along the thickness direction of the electronic device 100 (Z direction in the figure), the screen 101, the first middle frame 1, the first circuit board 42, the first heat source 41, the thermal pad 54, the heat sink 53, the temperature homogenizing plate 51 and the back cover 10 can be stacked in sequence. That is, along the thickness direction of the electronic device 100, the first heat source 41 is located between the first circuit board 42 and the temperature homogenizing plate 51, and the first middle frame 1 is connected to the screen 101 of the electronic device 100. The number of fans 52 is at least two, and at least two fans 52 can be respectively arranged on opposite sides of the temperature homogenizing plate 51 along the width direction of the electronic device 100 (X direction in the figure). Optionally, the heat spreader 51 can be provided with two supports on opposite sides of the width of the electronic device 100. At least two fans 52 can be connected to the two supports. The fans 52 and the heat spreader 51 together achieve active heat dissipation. The heat sink 53 and thermal pad 54 are used to improve heat dissipation efficiency along the active heat dissipation path. In one embodiment, the heat sink 53 can be made of copper. The thermal pad 54 can be made of thermal gel or other types of thermal conductive media.

[0108] Figure 12In the embodiment shown, the detailed structure of the first heat dissipation component 5, for example, the arrangement of the heat sink 53 and the thermal pad 54 in the first heat dissipation component 5, can also be used in Figures 4 to 10 In any of the possible implementation schemes shown.

[0109] Figure 11 and Figure 12 The solution of setting the bracket 103 in the electronic device can also be used in Figures 4 to 10 In any of the possible implementation schemes shown.

[0110] In summary, the embodiments of the present application provide an electronic device that effectively reduces the thickness of the electronic device while ensuring high performance of the electronic device by arranging components of different load levels and heights on opposite sides of a rotating shaft according to their respective heat dissipation requirements.

[0111] The above description is merely a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of the present application. Therefore, the scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. An electronic device, characterized in that: include: A first middle frame, a second middle frame, and a rotating shaft, wherein the rotating shaft is connected between the first middle frame and the second middle frame; A first device module and a first heat dissipation component are provided in an internal space of the electronic device where the first middle frame is located, and the first heat dissipation component is used to actively dissipate heat from a first heat source in the first device module; The second device module, the second heat dissipation assembly, and the battery are arranged in the internal space of the electronic device where the second middle frame is located. The second device module is located between the battery and the rotating shaft. The second heat dissipation module is used to passively dissipate heat for the second heat source in the second device module. The power of the first heat source is greater than the power of the second heat source. The maximum dimension of the first heat source along the thickness direction of the electronic device is smaller than the maximum dimension of the second heat source along the thickness direction of the electronic device.

2. The electronic device according to claim 1, wherein The second heat dissipation assembly conducts heat from the second device module to the rotating shaft.

3. The electronic device according to claim 2, wherein: The closest distance between the heating center of the second heat source and the edge of the rotating shaft is in the range of less than or equal to 5 cm.

4. The electronic device according to claim 3, wherein: The edge of the rotating shaft is an edge of a door panel of the rotating shaft corresponding to the second middle frame and adjacent to the second heat source.

5. The electronic device according to any one of claims 2 to 4, characterized in that: The second heat dissipation component includes a heat dissipation plate and a heat-conducting structure. The second device module includes a second circuit board and the second heat source. The second heat source is arranged on the second circuit board. The heat dissipation plate is located on the side of the second heat source away from the second circuit board. Part of the heat-conducting structure is located between the heat dissipation plate and the back cover of the electronic device. Part of the heat-conducting structure and the rotating shaft are stacked to transfer the heat of the second heat source to the rotating shaft through the heat-conducting structure.

6. The electronic device according to claim 5, characterized in that The second circuit board and the second middle frame are connected via a heat-conducting medium. The screen of the electronic device is arranged on a side of the second middle frame away from the second circuit board. The heat-conducting structure is located between the heat sink and the back cover of the electronic device.

7. The electronic device according to claim 6, wherein: The heat-conducting structure includes a first heat-conducting portion and a second heat-conducting portion, wherein the first heat-conducting portion and the second heat-conducting portion are respectively located on opposite sides of the second heat source along the thickness direction of the electronic device, the first heat-conducting portion is located between the heat dissipation plate and the back cover of the electronic device, and the second heat-conducting portion is located between the second middle frame and the screen. The first heat conducting portion extends to overlap with the rotating shaft along the thickness direction of the electronic device; or The first heat conducting portion extends to overlap with the battery along the thickness direction of the electronic device; or The second heat conducting portion extends to overlap with the rotating shaft along the thickness direction of the electronic device; or The second heat conducting portion extends to overlap with the battery along a thickness direction of the electronic device.

8. The electronic device according to claim 5, wherein: The second circuit board and the second middle frame are connected via a heat-conducting medium, and the screen of the electronic device is arranged on a side of the heat dissipation plate away from the second circuit board.

9. The electronic device according to claim 8, wherein: Part of the heat-conducting structure is located between the heat dissipation plate and the screen, and part of the heat-conducting structure is located between the rotating shaft and the screen.

10. The electronic device according to claim 9, characterized in that Part of the heat-conducting structure is located between the second middle frame and the second circuit board, and part of the heat-conducting structure is located between the battery and the second middle frame.

11. The electronic device according to claim 10, characterized in that The heat-conducting structure includes a third heat-conducting part and a fourth heat-conducting part. The third heat-conducting part is located between the heat dissipation plate and the screen, and the fourth heat-conducting part is located between the second circuit board and the second middle frame. The third heat conducting portion extends to overlap with the rotating shaft along the thickness direction of the electronic device; or The fourth heat conducting portion extends to overlap with the battery along a thickness direction of the electronic device.

12. The electronic device according to any one of claims 5 to 11, characterized in that: The electronic device further includes a charging interface, which is located on the second side of the second middle frame. The second circuit board is adjacent to the second side, and the charging interface is electrically connected to the second circuit board.

13. The electronic device according to any one of claims 1 to 12, characterized in that: The electronic device also includes a bracket and a bracket shaft, which are arranged in the second middle frame and located between the battery and the shaft. The bracket is connected to the bracket shaft and can be flipped, and the second device module and the bracket are distributed on both sides of the bracket shaft.

14. The electronic device according to claim 13, wherein: The electronic device further includes a third device module, the maximum dimension of the third device module along the thickness direction of the electronic device is smaller than the maximum dimension of the first device module along the thickness direction of the electronic device. Along the thickness direction of the electronic device, the third device module and the bracket are stacked.

15. The electronic device according to claim 14, characterized in that The third device module includes a third circuit board and an electronic device arranged on the third circuit board. The third circuit board is connected to the second middle frame. A supporting structure is provided between the electronic device and the bracket. The supporting structure and the second middle frame jointly surround the third device module.

16. The electronic device according to claim 15, characterized in that A shielding structure is further provided between the electronic device and the bracket. The shielding structure is connected to the supporting structure. Along the thickness direction of the electronic device, the supporting structure, the shielding structure and the bracket are stacked in sequence.

17. The electronic device according to claim 15, characterized in that The electronic components on the third circuit board include at least one of a capacitor, a resistor, and an inductor.

18. The electronic device according to any one of claims 1 to 17, characterized in that: The first heat source includes at least one of a CPU module and a power supply module; or The second heat source includes at least one of a charging management module, a DDR module, a radio frequency chip, an audio PA, and a screen Tcon.

19. The electronic device according to claim 1-18, characterized in that: The first heat dissipation component includes a temperature vapor chamber and a fan, the temperature vapor chamber is used to conduct heat from the first heat source to the fan position, the first device module includes a first circuit board and the first heat source, along the thickness direction of the electronic device, the first heat source is located between the first circuit board and the temperature vapor chamber, there is a first spacing space between the first circuit board and the first middle frame, there is a second spacing space between the temperature vapor chamber and the back cover of the electronic device, and the screen of the electronic device is arranged on the side of the first middle frame away from the first circuit board.

20. The electronic device according to claim 19, wherein The first heat dissipation component includes a heat sink and a thermal pad. Along the thickness direction of the electronic device, the first circuit board, the first heat source, the thermal pad, the heat sink and the temperature vapor chamber are stacked in sequence.

21. The electronic device according to any one of claims 1 to 20, characterized in that: The maximum dimension of the first heat source along the thickness direction of the electronic device is less than or equal to 2.5 mm; or the maximum dimension of the second heat source along the thickness direction of the electronic device is greater than or equal to 2 mm.

22. The electronic device according to any one of claims 1 to 21, characterized in that: The electronic device further includes an electrical connection structure, which passes through or spans the rotating shaft and is electrically connected between the first device module and the second device module.

23. The electronic device according to any one of claims 5 to 12, characterized in that: The heat dissipation plate is at least one of a metal plate, a radiator structure with heat dissipation fins, a temperature homogenizing plate, and a combination of a metal plate and a heat pipe; or the heat conductive structure is a graphite sheet.

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