Shell assembly and terminal equipment

Abstract

The invention provides a shell assembly and terminal equipment. The middle frame is provided with a heat dissipation structure, the heat dissipation structure comprises a first heat dissipation group and / or a second heat dissipation group, and heat of the circuit board assembly in the mainboard area can be quickly dissipated. The circuit board assembly can operate normally in a high-load scene, and the heat dissipation experience is good. In the first heat dissipation group, the heat of the circuit board assembly is conducted to the first phase change material layer through the first heat conduction piece, and the first phase change material layer absorbs and stores the heat of the first heat conduction piece. The first phase change material layer is adjacent to the screen area, so that heat of the circuit board assembly is conducted to the vicinity of the screen area. In the second heat dissipation group, the heat of the circuit board assembly is conducted to the second phase change material layer through the second heat conduction piece, and the second phase change material layer absorbs and stores the heat of the second heat conduction piece. The second phase change material layer is adjacent to the battery area, so that heat of the circuit board assembly is conducted to the vicinity of the battery area. Heat is stored by the first phase change material layer and the second phase change material layer, so that a user basically does not feel large temperature rise.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of heat dissipation structures of terminal devices, and in particular to a housing assembly and a terminal device. Background Art

[0002] In related terminal devices, the heat generated by heat-generating components, such as heat source chips, needs to be dissipated through heat dissipation structures. With the advancement of terminal device technology, chip power consumption and heat generation will gradually increase. The industry needs to address the issue of how to provide a housing assembly and terminal device with high heat dissipation capabilities to quickly dissipate heat from heat-generating components. Summary of the Invention

[0003] The embodiments of the present application provide a housing assembly and a terminal device, which have a high heat dissipation capability and enable the heat of the heating device to be dissipated quickly.

[0004] The embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, embodiments of the present application provide a housing assembly comprising a middle frame and a heat dissipation structure. The middle frame has a first side and a second side that are opposed to each other. The first side of the middle frame has a screen area. The second side of the middle frame has a motherboard area and a battery area. The motherboard area is used to mount a circuit board assembly. The circuit board assembly has a first heat conduction surface and a second heat conduction surface that are opposed to each other. The heat dissipation structure includes a first heat dissipation group and / or a second heat dissipation group.

[0006] Among them, the first heat dissipation group is arranged on the first side of the middle frame, and the first heat dissipation group includes a first heat conductive member and a first phase change material layer. A portion of the first heat conductive member is used to connect to the first heat conductive surface of the circuit board assembly, and the first phase change material layer is adjacent to the screen area and connected to the first heat conductive member.

[0007] The second heat dissipation group is arranged on the second side of the middle frame, and the second heat dissipation group includes a second heat conductive member and a second phase change material layer. A portion of the second heat conductive member is used to connect to the second heat conductive surface of the circuit board assembly, and the second phase change material layer is adjacent to the battery area and connected to the second heat conductive member.

[0008] The housing assembly provided in the present application has a central frame equipped with a heat dissipation structure. The heat dissipation structure includes at least one of a first heat dissipation group and a second heat dissipation group. This structure rapidly dissipates heat from the circuit board assembly in the motherboard area. This allows the circuit board assembly to operate normally under high loads, reduces the risk of triggering temperature control, and provides a superior heat dissipation experience. In the first heat dissipation group, heat is generated by the circuit board assembly during operation. Heat from the first heat-conducting surface is transferred via the first heat-conducting member to the first phase-change material layer, which absorbs and stores the heat from the first heat-conducting member, maintaining a substantially constant temperature. The first phase-change material layer releases heat when the temperature drops below the phase transition point. Placing the first phase-change material layer adjacent to the screen area fully utilizes the limited space of the housing assembly, allowing heat from the circuit board assembly to be transferred to the vicinity of the screen area, thereby improving heat dissipation capabilities. In the second heat dissipation group, heat is generated by the circuit board assembly during operation. Heat from the second heat-conducting surface is transferred via the second heat-conducting member to the second phase-change material layer, which absorbs and stores the heat from the second heat-conducting member, maintaining a substantially constant temperature. The second phase-change material layer releases heat when the temperature drops below the phase transition point. Placing the second phase-change material layer adjacent to the battery area fully utilizes the limited space within the housing assembly, transferring heat from the circuit board assembly to the battery area, which serves as the cooler zone of the midframe, improving heat dissipation. Heat stored in the first and second phase-change material layers minimizes noticeable temperature rise, providing a positive user experience.

[0009] In one optional implementation, the middle frame can be roughly rectangular or have another shape. The middle frame can include a support plate and a frame, with the support plate attached to the frame. The support plate is used to mount components such as circuit board assemblies. The frame serves as the exterior design of the terminal device. The support plate and frame can be integrally formed or assembled.

[0010] In one optional implementation, the first thermally conductive member includes at least one of a first graphite sheet and a first vapor chamber. Alternatively, only the first graphite sheet, only the first vapor chamber, or both the first graphite sheet and the first vapor chamber may be provided, enabling heat from the circuit board assembly to be transferred from the first thermally conductive member to the first phase change material layer.

[0011] In one optional implementation, the first thermally conductive element includes a first vapor chamber, which is connected to the first thermally conductive surface of the circuit board assembly, and the first phase change material layer is stacked on the first vapor chamber. Heat generated by the circuit board assembly is transferred from the first thermally conductive surface through the first vapor chamber, where it is dissipated by the first vapor chamber, and then to the first phase change material layer. The first phase change material layer absorbs and stores heat from the first thermally conductive element, maintaining a substantially constant temperature.

[0012] In an optional implementation, the first phase change material layer and the first vacuum chamber heat sink can be bonded together by adhesive or dispensing, which facilitates assembly.

[0013] In an optional implementation, the first vacuum chamber heat spreader is adjacent to the screen area, which facilitates the arrangement of a large-area first vacuum chamber heat spreader on the first side of the middle frame, thereby improving heat dissipation capability.

[0014] In one optional implementation, the projection of the first vapor chamber at least partially overlaps the projection of the motherboard area and the projection of the battery area in the thickness direction of the middle frame. The larger the area of ​​the first vapor chamber, the greater the heat dissipation capability, allowing heat to be diffused to different locations of the first vapor chamber. The more the projection of the first vapor chamber covers the projection of the motherboard area and the battery area, the higher the proportion of the projection area of ​​the first vapor chamber to the projection area of ​​the screen area, which facilitates the rapid transfer of heat generated by the circuit board assembly to the first phase change material layer.

[0015] In an optional implementation, the first phase change material layer is disposed on a side of the first vacuum chamber vapor chamber facing away from the circuit board assembly. The larger the area of ​​the first phase change material layer, the greater the heat storage capacity.

[0016] In one optional implementation, the projection of the first vapor chamber overlaps the projection of the first phase-change material layer along the thickness of the middle frame. A larger area of ​​the first vapor chamber provides greater heat dissipation. A larger area of ​​the first phase-change material layer provides greater heat storage capacity, thereby enhancing the first phase-change material layer's heat absorption and storage capabilities.

[0017] In one optional implementation, the first vapor chamber and the first phase change material layer are adjacent to the screen area, with the first phase change material layer located between the first vapor chamber and the screen area. In the thickness direction of the midframe, the first vapor chamber substantially covers the motherboard area and the battery area. The area of ​​the first phase change material layer is comparable or similar to that of the first vapor chamber. This allows the first vapor chamber to have a high heat dissipation capacity, while the first phase change material layer has a high heat storage capacity.

[0018] In one optional implementation, the first thermally conductive member includes a first vapor chamber, which is connected to the first thermally conductive surface of the circuit board assembly, and the first phase change material layer is stacked on the first vapor chamber. The first thermally conductive member also includes a first graphite sheet, which is connected between the first thermally conductive surface of the circuit board assembly and the first vapor chamber. Combining the first graphite sheet with the first vapor chamber can improve heat dissipation capabilities.

[0019] In one optional implementation, the area of ​​the first graphite sheet is slightly larger than that of the first heat-conducting surface, allowing the operating heat of the circuit board assembly to be quickly transferred through the first graphite sheet to the first vapor chamber. Furthermore, the area of ​​the first vapor chamber is larger than that of the first graphite sheet, allowing the heat passing through the first graphite sheet to be diffused to different locations of the first vapor chamber, achieving efficient heat dissipation.

[0020] In one optional implementation, the second heat conducting member includes at least one of a second graphite sheet and a second vapor chamber. Alternatively, only the second graphite sheet, only the second vapor chamber, or both the second graphite sheet and the second vapor chamber may be provided, enabling heat from the circuit board assembly to be transferred from the second heat conducting member to the second phase change material layer.

[0021] In one optional implementation, the second heat conductor includes a second graphite sheet, one end of the second graphite sheet being connected to the second shielding member, and the other end being connected to the second phase-change material layer. Operating heat from the circuit board assembly is conducted to the second shielding member, where it is rapidly conducted from the second graphite sheet to the second phase-change material layer, where it is absorbed and stored.

[0022] In one optional implementation, a second phase-change material layer is located on the side of the second thermally conductive member facing the battery area. The second phase-change material layer is configured to absorb and store heat from the circuit board assembly and transferred to the second thermally conductive member. The second phase-change material layer releases heat when its temperature drops below its phase transition point. This reduces the amount of heat transferred to the back cover on the second side of the midframe when the second phase-change material layer dissipates heat.

[0023] In an optional implementation, the second phase change material layer has an avoidance groove on the side facing the battery area, and the avoidance groove is used to accommodate a flexible circuit board. The small circuit board and the main board can be electrically connected through the flexible circuit board. The flexible circuit board is set in the avoidance groove of the second phase change material layer. The thickness of the second phase change material layer is different at different positions. The thickness is smaller in the part with the avoidance groove, and the thickness is larger in the part without the avoidance groove. Under the middle frame of limited thickness, the flexible circuit board is arranged on the second side of the middle frame to increase the overall volume of the second phase change material layer, which can improve the heat absorption and heat storage capacity.

[0024] In an optional implementation, the second phase-change material layer has the same thickness at different locations, so that the heat conducted from the circuit board assembly to the second heat-conducting member is absorbed and stored by the second phase-change material layer of the same thickness.

[0025] In one optional implementation, the thickness of the second phase-change material layer is in the range of [0.03 mm, 0.3 mm]. The second phase-change material layer occupies a relatively small portion of the thickness of the middle frame, having little impact on the thickness of the middle frame. A larger second phase-change material layer can be used, for example, where the area of ​​the second phase-change material layer is equal to or close to the area of ​​the screen area, to enhance the heat storage capacity of the second phase-change material layer.

[0026] In a second aspect, an embodiment of the present application provides a terminal device, comprising a circuit board assembly and the above-mentioned shell assembly. The shell assembly comprises a middle frame and a heat dissipation structure. The middle frame has a first side and a second side opposite to each other. The first side of the middle frame has a screen area. The second side of the middle frame has a mainboard area and a battery area. The circuit board assembly is located in the mainboard area, and the circuit board assembly comprises a mainboard, a first heating device and a second heating device. The mainboard has a first surface and a second surface opposite to each other. The first heating device is arranged on the first surface, and the second heating device is arranged on the second surface. A first shielding member is provided on the first surface, and the first shielding member covers the first heating device, and the side of the first shielding member facing away from the mainboard forms a first heat-conducting surface. A second shielding member is provided on the second surface, and the second shielding member covers the second heating device, and the side of the second shielding member facing away from the mainboard forms a second heat-conducting surface.

[0027] In the terminal device provided in the embodiment of the present application, the circuit board assembly is arranged in the mainboard area of ​​the middle frame. A first heating device and a first shielding member are provided on the first surface of the mainboard, and the first shielding member realizes electromagnetic shielding of the first heating device. A second heating device and a second shielding member are provided on the second surface of the mainboard, and the second shielding member realizes electromagnetic shielding of the second heating device. The surface of the first shielding member serves as the first heat conducting surface, and the surface of the second shielding member serves as the second heat conducting surface. Combined with the heat dissipation structure in the shell assembly, the heat of the circuit board assembly is quickly dissipated. The circuit board assembly can operate normally under high load scenarios, reduce the triggering of temperature control, and have a good heat dissipation experience.

[0028] In an optional implementation, the first heat-generating device includes a system-on-chip.

[0029] In an optional implementation, the second heating device may include a capacitor, a resistor, or other devices.

[0030] In an optional implementation, the first heating device is arranged on the first surface of the mainboard, so as to arrange a large-area first heat conducting member on the side of the first shielding member away from the mainboard, and set a large-area first vacuum chamber heat sink and a first phase change material layer.

[0031] In one optional implementation, the midframe has a through-hole in the area corresponding to the motherboard; the first shielding member is at least partially located in the through-hole, or the first shielding member is disposed toward the through-hole. The first thermal conductor and the first phase-change material layer are arranged on the first side of the midframe to increase the area of ​​the first thermal conductor and the first phase-change material layer, thereby improving heat dissipation and heat storage capabilities.

[0032] In one optional implementation, when the heat dissipation structure includes a first heat dissipation group, a first thermally conductive gel is disposed between the top of the first shielding member and the first heat-generating device; and a second thermally conductive gel is disposed between the top of the first shielding member and the first heat-conducting member of the first heat dissipation group. The top of the first shielding member refers to a portion of the first shielding member away from the mainboard. This reduces thermal resistance and improves heat conduction efficiency.

[0033] In one optional implementation, the first shielding member includes a frame-shaped portion and a cover. The frame-shaped portion is mounted and connected to the first surface, and the cover is connected to the side of the frame-shaped portion facing away from the mainboard. The frame-shaped portion and the cover define a first accommodating cavity. The first heating device is located within the first accommodating cavity, and the side of the cover facing away from the mainboard forms a first heat-conducting surface. The frame-shaped portion and the cover provide electromagnetic shielding for the first heating device. This is suitable for providing a first heat dissipation group on the first heat-conducting surface of a circuit board assembly.

[0034] In one optional implementation, the first shielding member includes an integral first metal cover, with the side of the first metal cover facing away from the mainboard forming a first heat-conducting surface. The edge of the first metal cover is connected to the first surface of the mainboard, providing electromagnetic shielding for the first heat-generating component. This is suitable for use in situations where a second heat sink is provided on the second heat-conducting surface of the circuit board assembly, while a first heat sink is not provided on the first heat-conducting surface.

[0035] In an optional implementation, when the heat dissipation structure includes a second heat dissipation group, the second shielding member is filled with a third thermally conductive gel, which covers the second heat-generating device and is connected to the top of the second shielding member. The third thermally conductive gel can reduce thermal resistance and improve heat conduction efficiency.

[0036] In an optional implementation, the second shielding member includes an adapter plate, a top plate, and a metal shielding layer. The adapter plate is connected to the second surface, the top plate is connected to the side of the adapter plate facing away from the mainboard, the adapter plate has an inner hole, the adapter plate and the top plate form a second accommodating cavity, the second heating device is located in the second accommodating cavity, the metal shielding layer is provided on the side of the adapter plate facing away from the mainboard, and the side of the metal shielding layer facing away from the mainboard forms a second heat conducting surface. The mainboard, the adapter plate, and the top plate form a circuit board sandwich structure. Components can be arranged on one side or both sides of the mainboard, and components can be arranged on one side or both sides of the top plate. More components can be arranged in a limited area, making full use of the limited space. The mainboard and the top plate can be connected through the plated through-holes of the adapter plate. Electromagnetic shielding of the second heating device is achieved through the metal shielding layer.

[0037] In an optional implementation, the metal shielding layer can be a sheet structure made of metal materials such as copper alloy, steel, etc. The metal shielding layer can be arranged on the top plate using surface mounting technology, which is easy to form.

[0038] In one optional implementation, the second shielding member includes an integral second metal cover, wherein a side of the second metal cover facing away from the mainboard forms a second heat-conducting surface. An edge of the second metal cover is connected to the second surface of the mainboard, and the second metal cover provides electromagnetic shielding for the second heating element.

[0039] In one optional implementation, the first heating element is located in the middle of the motherboard across its width. This middle position is allowed to deviate slightly along the width of the motherboard, allowing the center of the first heating element to move within a range of 3 mm from the middle position along the width of the motherboard. The operating heat of the first heating element can be evenly transferred from the middle position along the width of the motherboard to different locations on the motherboard in different directions, resulting in more uniform heat distribution across the motherboard.

[0040] In one optional implementation, the first heating element is located in the middle of the middle frame along its width. The middle of the middle frame is allowed to be offset along its width, and the center of the first heating element can be moved within a range of 3 mm from the center of the middle of the middle frame width. The operating heat of the first heating element can be evenly transferred along different directions on the first heat conductor to different locations on the first heat conductor, resulting in a more uniform heat distribution across different locations on the first heat conductor.

[0041] In one optional implementation, a first screen is provided in the screen area. The first screen is configured to output light to display information. If a first heat sink assembly is provided on the first side of the midframe, the first screen may cover the first heat sink assembly. The first screen may also have a touch function for detecting touch operations applied thereto or in the vicinity thereof.

[0042] In one optional implementation, a back cover is provided on the second side of the middle frame. As a visual component of the terminal device, the back cover protects the components on the second side of the middle frame. If a second heat sink is provided on the second side of the middle frame, the back cover can cover the second heat sink.

[0043] In one optional implementation, a second screen is provided on the second side of the middle frame. The second screen is configured to output light to display information. When a second heat sink assembly is provided on the second side of the middle frame, the second screen may fully or partially cover the second heat sink assembly. The second screen may also have a touch function to detect touch operations applied on or near it.

[0044] In an optional implementation, the battery area is provided with a battery, which is electrically connected to the circuit board assembly and is used to supply power to various electrical devices of the terminal device.

[0045] In one optional implementation, the second heat dissipation group includes a second heat conductor and a second phase-change material layer, with the second phase-change material layer positioned between the second heat conductor and the battery. The second phase-change material layer releases heat when its temperature drops below its phase transition point, thereby reducing heat transfer to the back cover during heat dissipation from the second phase-change material layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Figure 1 A schematic diagram of the structure of a terminal device provided in an embodiment of the present application;

[0047] Figure 2 A schematic diagram of the structure of a terminal device provided in another embodiment of the present application;

[0048] Figure 3 A schematic diagram of the structure of a terminal device provided in another embodiment of the present application;

[0049] Figure 4 A schematic diagram of the structure of a terminal device provided in another embodiment of the present application;

[0050] Figure 5 A three-dimensional assembly diagram of a terminal device provided in another embodiment of the present application;

[0051] Figure 6 for Figure 5 A three-dimensional exploded view of the terminal device;

[0052] Figure 7 for Figure 6 Another perspective exploded view of the terminal device;

[0053] Figure 8 for Figure 6 A perspective exploded view of a housing assembly in a terminal device;

[0054] Figure 9 for Figure 7 A perspective exploded view of a housing assembly in a terminal device;

[0055] Figure 10 (a) and (b) are temperature simulation diagrams of the terminal device of the related art and the terminal device of this embodiment, respectively.

[0056] Description of reference numerals:

[0057] 1000-terminal equipment; 100-housing assembly;

[0058] 110 - middle frame; 110a - first side; 110b - second side; 111 - screen area; 112 - motherboard area; 113 - battery area; 114 - support plate; 115 - frame; 116 - through hole;

[0059] 120 - heat dissipation structure; 120a - first heat dissipation group; 121 - first heat conducting member; 1211 - first graphite sheet; 1212 - first vacuum chamber heat sink;

[0060] 122 - first phase change material layer; 123 - first thermally conductive gel; 124 - second thermally conductive gel; 120b - second heat dissipation group; 125 - second thermally conductive member; 1251 - second graphite sheet; 1252 - second vacuum chamber heat sink; 126 - second phase change material layer; 1261 - avoidance groove; 127 - third thermally conductive gel;

[0061] 200 - circuit board assembly; 200a - first heat conducting surface; 200b - second heat conducting surface;

[0062] 210-main board; 210a-first surface; 210b-second surface;

[0063] 220-first heating element; 230-second heating element;

[0064] 240 - first shielding member; 241 - frame-shaped portion; 242 - cover; 243 - first accommodating cavity; 244 - first metal cover;

[0065] 250 - second shielding member; 251 - adapter plate; 252 - top plate; 253 - second accommodating cavity; 254 - metal shielding layer; 255 - second metal cover;

[0066] 300-first screen; 400-back cover; 500-battery. DETAILED DESCRIPTION

[0067] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application clearer, the application is further described in detail below in conjunction with the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain this application and are not used to limit this application. Although the description of this application will be introduced in conjunction with some embodiments, this does not mean that the features of this application are limited to this embodiment. On the contrary, the purpose of introducing the application in conjunction with the embodiment is to cover other options or modifications that may be extended based on the claims of this application. In order to provide an in-depth understanding of the application, the following description will contain many specific details. This application can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of this application, some specific details will be omitted in the description. It should be noted that the embodiments in this application and the features in the embodiments can be combined with each other unless there is a conflict.

[0068] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0069] It should be understood that in the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. The orientation or positional relationship indicated by the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. is based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0070] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0071] In the embodiments of this application, "and / or" is simply a description of the association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent three situations: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this document generally indicates that the related objects are in an "or" relationship.

[0072] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0073] A terminal device in the related art includes a middle frame, a screen, a back cover and a mainboard, the screen and the back cover are respectively arranged on opposite sides of the middle frame, the mainboard is arranged on the middle frame, and a heating device (such as a heat source chip) is provided on the mainboard. A vacuum cavity heat spreader can be set between the middle frame and the screen, and the vacuum cavity heat spreader is connected to the heating device, and the vacuum cavity heat spreader serves as a heat dissipation structure. The heat generated by the heating device can be dissipated through the vacuum cavity heat spreader. Under high load scenarios, the heat of the vacuum cavity heat spreader will be conducted to the screen, causing the local temperature of the screen to be too high.

[0074] If the heat dissipation capacity of the heat dissipation structure is insufficient, the heat source chip will find it difficult to operate normally under high-load scenarios. If the temperature control is triggered, the power consumption and performance of the heat source chip will be reduced, resulting in a poor heat dissipation experience and a reduced service life of the terminal equipment.

[0075] See Figure 1 , an embodiment of the present application provides a terminal device 1000, including a circuit board assembly 200 and a shell assembly 100. The shell assembly 100 includes a middle frame 110 and a heat dissipation structure 120. The middle frame 110 has a first side 110a and a second side 110b opposite to each other. The first side 110a of the middle frame 110 has a screen area 111. The second side 110b of the middle frame 110 has a mainboard area 112 and a battery area 113. The circuit board assembly 200 is located in the mainboard area 112, and the circuit board assembly 200 includes a mainboard 210, a first heating device 220 and a second heating device 230. The mainboard 210 has a first surface 210a and a second surface 210b opposite to each other. The first heating device 220 is arranged on the first surface 210a, and the second heating device 230 is arranged on the second surface 210b. The first surface 210a is provided with a first shielding member 240, which covers the first heat generating device 220. The side of the first shielding member 240 facing away from the mainboard 210 forms a first heat conducting surface 200a. The second surface 210b is provided with a second shielding member 250, which covers the second heat generating device 230. The side of the second shielding member 250 facing away from the mainboard 210 forms a second heat conducting surface 200b.

[0076] In the terminal device 1000 provided in the embodiment of the present application, the circuit board assembly 200 is arranged in the mainboard area 112 of the middle frame 110. The first surface 210a of the mainboard 210 is provided with a first heating device 220 and a first shielding member 240, and the first shielding member 240 realizes electromagnetic shielding of the first heating device 220. The second surface 210b of the mainboard 210 is provided with a second heating device 230 and a second shielding member 250, and the second shielding member 250 realizes electromagnetic shielding of the second heating device 230. The surface of the first shielding member 240 serves as the first heat conducting surface 200a, and the surface of the second shielding member 250 serves as the second heat conducting surface 200b. Combined with the heat dissipation structure 120 in the shell assembly 100, the heat of the circuit board assembly 200 is quickly dissipated. The circuit board assembly 200 can operate normally under high load scenarios, reduce the triggering of temperature control, and have a good heat dissipation experience.

[0077] In order to facilitate description of the orientation and direction of the housing assembly 100 and the terminal device 1000 , the width direction, length direction, and thickness direction of the middle frame 110 are defined as direction X, direction Y, and direction Z, respectively.

[0078] See Figure 1 An embodiment of the present application provides a housing assembly 100, comprising: a middle frame 110 and a heat dissipation structure 120. The middle frame 110 has a first side 110a and a second side 110b opposite to each other. The first side 110a of the middle frame 110 has a screen area 111. The second side 110b of the middle frame 110 has a motherboard area 112 and a battery area 113. The motherboard area 112 is used to mount a circuit board assembly 200. The circuit board assembly 200 has a first heat-conducting surface 200a and a second heat-conducting surface 200b opposite to each other. The heat dissipation structure 120 includes a first heat dissipation group 120a and / or a second heat dissipation group 120b.

[0079] Among them, the first heat dissipation group 120a is arranged on the first side 110a of the middle frame 110, and the first heat dissipation group 120a includes a first heat conductive member 121 and a first phase change material layer 122. A portion of the first heat conductive member 121 is used to connect to the first heat conductive surface 200a of the circuit board assembly 200, and the first phase change material layer 122 is adjacent to the screen area 111 and connected to the first heat conductive member 121.

[0080] The second heat dissipation group 120b is arranged on the second side 110b of the middle frame 110. The second heat dissipation group 120b includes a second heat conductive member 125 and a second phase change material layer 126. A portion of the second heat conductive member 125 is used to connect to the second heat conductive surface 200b of the circuit board assembly 200. The second phase change material layer 126 is adjacent to the battery area 113 and connected to the second heat conductive member 125.

[0081] The first phase change material layer 122 and the second phase change material layer 126 are layered structures made of phase change material (PCM). Phase change material refers to a substance that changes state and provides latent heat when the temperature remains unchanged.

[0082] See Figure 1 When the first heat dissipation group 120 a and the second heat dissipation group 120 b are provided, the working heat of the circuit board assembly 200 is dissipated through the first heat dissipation group 120 a and the second heat dissipation group 120 b , thereby achieving a double-sided heat dissipation effect for the middle frame 110 .

[0083] See Figure 2 When the first heat dissipation group 120 a is provided, the working heat of the circuit board assembly 200 is dissipated through the first heat dissipation group 120 a , thereby achieving heat dissipation on the first side 110 a (ie, the side of the screen area 111 ) of the middle frame 110 .

[0084] See Figure 3 、 Figure 4 When the second heat dissipation group 120 b is provided, the working heat of the circuit board assembly 200 is dissipated through the second heat dissipation group 120 b , thereby achieving heat dissipation on the second side 110 b (ie, the side of the motherboard area 112 ) of the middle frame 110 .

[0085] The housing assembly 100 provided in the embodiment of the present application has a heat dissipation structure 120 disposed on the middle frame 110. The heat dissipation structure 120 includes at least one of a first heat dissipation group 120a and a second heat dissipation group 120b. This structure rapidly dissipates heat from the circuit board assembly 200 in the motherboard area 112. This allows the circuit board assembly 200 to operate normally under high loads, reduces the risk of triggering temperature control, and provides a superior heat dissipation experience. In the first heat dissipation group 120a, the circuit board assembly 200 generates heat during operation. This heat from the first heat-conducting surface 200a is transferred to the first phase-change material layer 122 via the first heat-conducting element 121. The first phase-change material layer 122 absorbs and stores the heat from the first heat-conducting element 121, maintaining its temperature substantially constant. The first phase-change material layer 122 releases heat when its temperature drops below the phase transition point. Placing the first phase-change material layer 122 adjacent to the screen area 111 fully utilizes the limited space within the housing assembly 100, transferring heat from the circuit board assembly 200 to the vicinity of the screen area 111 and improving heat dissipation. In the second heat dissipation group 120b, the circuit board assembly 200 generates heat during operation. The heat of the second heat-conducting surface 200b is transferred to the second phase-change material layer 126 through the second heat-conducting member 125. The second phase-change material layer 126 absorbs and stores the heat of the second heat-conducting member 125, and the temperature of the second phase-change material layer 126 remains basically unchanged. The second phase-change material layer 126 releases heat when the temperature drops below the phase change point. The second phase-change material layer 126 is adjacent to the battery area 113, making full use of the limited space of the housing assembly 100, so that the heat of the circuit board assembly 200 is transferred to the vicinity of the battery area 113, which is the cold area of ​​the middle frame 110, thereby improving the heat dissipation capacity. Since the first phase-change material layer 122 and the second phase-change material layer 126 store heat, the user will basically not feel a large temperature rise, and the user experience is good.

[0086] In some embodiments, see Figure 1 、 Figures 5 to 7 The middle frame 110 can be roughly rectangular or have another shape. The middle frame 110 can include a support plate 114 and a frame 115. The support plate 114 is connected to the frame 115. The support plate 114 is used to mount components such as circuit board assemblies. The frame 115 serves as the exterior design of the terminal device 1000. The support plate 114 and frame 115 can be integrally formed or assembled.

[0087] In some embodiments, see Figure 1 The middle frame 110 has a through hole 116 at a position corresponding to the mainboard area 112 ; the first shielding member 240 is at least partially located in the through hole 116 , or the first shielding member 240 is disposed toward the through hole 116 .

[0088] Arranging the first thermally conductive member 121 and the first phase-change material layer 122 on the first side 110a of the middle frame 110 increases the area of ​​the first thermally conductive member 121 and the first phase-change material layer 122, thereby improving heat dissipation and heat storage capabilities. The circuit board assembly 200 generates heat during operation. This heat is transferred from the first thermally conductive surface 200a of the first shielding member 240 through the first thermally conductive member 121 to the first phase-change material layer 122. The first phase-change material layer 122 absorbs and stores the heat from the first thermally conductive member 121.

[0089] In some embodiments, see Figure 1 The first heat generating device 220 includes a system-on-chip (SoC). For example, the SoC may be a mobile phone main chip that integrates a central processing unit (CPU), a graphics processing unit (GPU), a communication module, and other modules. The SoC generates a large amount of heat during operation.

[0090] In some embodiments, see Figure 1 The second heating device 230 may include capacitors, resistors and other devices.

[0091] In some embodiments, see Figure 1 The first heating device 220 is arranged on the first surface 210a of the mainboard 210, which facilitates the arrangement of a large-area first heat conductor 121 on the side of the first shielding member 240 away from the mainboard 210. For example, a large-area first vacuum chamber heat spreader 1212 and a first phase change material layer 122 are provided. The heat from the first heating device 220 is conducted to different positions of the first vacuum chamber heat spreader 1212 through the first shielding member 240 through the first vacuum chamber heat spreader 1212, and the heat is absorbed and stored by the first phase change material layer 122. The heat dissipation capacity is high, and the user basically does not feel a large temperature rise.

[0092] In some embodiments, see Figure 1 When the heat dissipation structure 120 includes the first heat dissipation group 120a, a first thermally conductive gel 123 is disposed between the top of the first shielding member 240 and the first heat-generating device 220; and a second thermally conductive gel 124 is disposed between the top of the first shielding member 240 and the first heat-conducting member 121 of the first heat dissipation group 120a. The top of the first shielding member 240 refers to a portion of the first shielding member 240 away from the motherboard 210.

[0093] The first thermally conductive gel 123 is filled between the first shielding member 240 and the first heating element 220, and the second thermally conductive gel 124 is filled between the first shielding member 240 and the first thermally conductive member 121, both of which can reduce thermal resistance and improve thermal conductivity efficiency, so that the working heat of the first heating element 220 is efficiently conducted to the first shielding member 240 through the first thermally conductive gel 123, and then efficiently conducted to the first thermally conductive member 121 of the first heat dissipation group 120a through the second thermally conductive gel 124, so that the first heat dissipation group 120a can achieve rapid heat dissipation.

[0094] There are multiple optional implementations for setting the first shielding member 240 . Two implementations of the first shielding member 240 are exemplarily given below.

[0095] The first implementation of the first shielding member 240 is as follows: Figure 1 、 Figure 2 The first shielding member 240 includes a frame 241 and a cover 242. The frame 241 is mounted and connected to the first surface 210a, and the cover 242 is connected to the side of the frame 241 facing away from the mainboard 210. The frame 241 and the cover 242 form a first accommodating cavity 243. The first heating device 220 is located in the first accommodating cavity 243, and the side of the cover 242 facing away from the mainboard 210 forms the first heat conduction surface 200a. The frame 241 and the cover 242 provide electromagnetic shielding for the first heating device 220. This method is suitable for the case where the first heat dissipation group 120a is arranged on the first heat conduction surface 200a of the circuit board assembly 200. A first thermally conductive gel 123 is placed on the top surface of the first heating element 220 , and the cover 242 is connected to the frame 241 . Then, a second thermally conductive gel 124 is placed on the cover 242 . Finally, the first heat dissipation group 120 a is installed to connect the first thermally conductive element 121 and the second thermally conductive gel 124 .

[0096] The second implementation of the first shielding member 240 is as follows: Figure 3 、 Figure 4 The first shielding member 240 includes an integrated first metal cover 244. The side of the first metal cover 244 facing away from the mainboard 210 forms the first heat conducting surface 200a. The edge of the first metal cover 244 is connected to the first surface 210a of the mainboard 210, and the first metal cover 244 provides electromagnetic shielding for the first heat generating device 220. This approach is suitable for situations where the second heat dissipation group 120b is installed on the second heat conducting surface 200b of the circuit board assembly 200, while the first heat dissipation group 120a is not installed on the first heat conducting surface 200a.

[0097] In some embodiments, see Figure 1 、 Figure 2The first heat conducting member 121 includes at least one of a first graphite sheet 1211 and a first vapor chamber 1212. Only the first graphite sheet 1211, only the first vapor chamber 1212, or both the first graphite sheet 1211 and the first vapor chamber 1212 may be provided. These arrangements enable heat from the circuit board assembly 200 to be transferred from the first heat conducting member 121 to the first phase change material layer 122.

[0098] The graphite sheet and the heat spreader of the vacuum chamber are made of flexible thermally conductive materials, have high heat dissipation capacity, have certain flexibility to facilitate bending and arrangement in the middle frame 110, occupy a small space, and are light in weight.

[0099] Graphite sheets rely on the anisotropy of the graphite crystal structure to conduct heat evenly in the horizontal direction and can adapt well to any surface.

[0100] Vapor chamber (VC) vapor chambers utilize the principle of phase change heat transfer. Liquid fluid within the vacuum chamber vaporizes upon heating, diffuses through the vapor to the condensation zone, releases heat, and then flows back, creating a fluid cycle. Vapor chambers dissipate heat quickly and evenly.

[0101] In some embodiments, see Figure 1 and Figure 2 The first heat-conducting member 121 includes a first vapor chamber 1212, which is connected to the first heat-conducting surface 200a of the circuit board assembly 200. The first phase-change material layer 122 is superimposed on the first vapor chamber 1212. Heat generated by the circuit board assembly 200 is transferred from the first heat-conducting surface 200a through the first vapor chamber 1212, where it is uniformly distributed and dissipated, and then transferred to the first phase-change material layer 122. The first phase-change material layer 122 absorbs and stores the heat from the first heat-conducting member 121, maintaining a substantially constant temperature.

[0102] The first phase change material layer 122 and the first vacuum chamber heat sink 1212 can be bonded together by adhesive or dispensing, which facilitates assembly.

[0103] Illustratively, the first vacuum chamber vapor chamber 1212 is adjacent to the screen area 111 , which facilitates the arrangement of a large-area first vacuum chamber vapor chamber 1212 on the first side 110 a of the middle frame 110 , thereby improving heat dissipation capability.

[0104] In some embodiments, see Figure 1 and Figure 2In the thickness direction Z of the middle frame 110, the projection of the first vapor chamber 1212 at least partially covers the projection of the motherboard area 112 and the projection of the battery area 113. The larger the area of ​​the first vapor chamber 1212, the stronger the heat dissipation capability, allowing heat to be diffused to different locations of the first vapor chamber 1212. The more the projection of the first vapor chamber 1212 covers the projection of the motherboard area 112 and the battery area 113, and the higher the proportion of the projection area of ​​the first vapor chamber 1212 to the projection area of ​​the screen area 111, the more conducive it is for the heat generated by the circuit board assembly 200 to be quickly transferred to the first phase change material layer 122.

[0105] In some embodiments, see Figure 1 and Figure 2 The first phase-change material layer 122 is located on the side of the first vacuum chamber heat sink 1212 facing away from the circuit board assembly 200. The larger the area of ​​the first phase-change material layer 122, the greater its heat storage capacity. By increasing the area of ​​the first phase-change material layer 122, it can easily absorb and store a large amount of heat from the first thermal conductor 121, maintaining the temperature of the first phase-change material layer 122 essentially unchanged. This allows users to experience no significant temperature rise, resulting in a better user experience.

[0106] In some embodiments, see Figure 1 and Figure 2 In the thickness direction Z of the middle frame 110, the projection of the first vacuum chamber heat sink 1212 overlaps the projection of the first phase change material layer 122. A larger area of ​​the first vacuum chamber heat sink 1212 provides greater heat dissipation. A larger area of ​​the first phase change material layer 122 provides greater heat storage capacity, thereby improving the heat absorption and storage capabilities of the first phase change material layer 122.

[0107] Exemplarily, the first vapor chamber 1212 and the first phase change material layer 122 are adjacent to the screen area 111, with the first phase change material layer 122 located between the first vapor chamber 1212 and the screen area 111. In the thickness direction Z of the middle frame 110, the first vapor chamber 1212 substantially covers the motherboard area 112 and the battery area 113. The area of ​​the first phase change material layer 122 is comparable or close to that of the first vapor chamber 1212. This allows the first vapor chamber 1212 to have a higher heat dissipation capability, while the first phase change material layer 122 has a higher heat storage capability.

[0108] In some embodiments, see Figure 1 and Figure 2The first heat-conducting member 121 includes a first vapor chamber 1212 connected to the first heat-conducting surface 200a of the circuit board assembly 200. The first phase-change material layer 122 is stacked on the first vapor chamber 1212. The first heat-conducting member 121 also includes a first graphite sheet 1211 connected between the first heat-conducting surface 200a of the circuit board assembly 200 and the first vapor chamber 1212.

[0109] Combining first graphite sheet 1211 with first vapor chamber 1212 enhances heat dissipation. Operating heat from circuit board assembly 200 is transferred from first heat-conducting surface 200a, rapidly conducted through first graphite sheet 1211 to first vapor chamber 1212. Heat is then dissipated by vapor chamber 1212, dissipating to different locations within the first vapor chamber 1212. The heat is then efficiently conducted to first phase-change material layer 122, where it is absorbed and stored.

[0110] For example, the area of ​​the first graphite sheet 1211 is slightly larger than the area of ​​the first heat conducting surface 200a, allowing the operating heat of the circuit board assembly 200 to be quickly transferred through the first graphite sheet 1211 to the first vacuum chamber vapor chamber 1212. The area of ​​the first vacuum chamber vapor chamber 1212 is larger than that of the first graphite sheet 1211, allowing the heat passing through the first graphite sheet 1211 to diffuse to different locations of the first vacuum chamber vapor chamber 1212, achieving efficient heat dissipation.

[0111] In some embodiments, see Figure 1 、 Figure 3 、 Figure 4 When the heat dissipation structure 120 includes the second heat dissipation group 120b, the second shielding member 250 is filled with the third thermally conductive gel 127. The third thermally conductive gel 127 covers the second heat generating device 230 and is connected to the top of the second shielding member 250. The top of the second shielding member 250 refers to a position on the second shielding member 250 away from the mainboard 210.

[0112] The third thermally conductive gel 127 can reduce thermal resistance and improve thermal conductivity efficiency, so that the working heat of the first heating device 220 is transferred to the top of the second shielding component 250 through the mainboard 210 and the third thermally conductive gel 127, and the working heat of the second heating device 230 is transferred to the top of the second shielding component 250 through the third thermally conductive gel 127, and rapid heat dissipation is achieved by the second heat dissipation group 120b.

[0113] There are multiple optional implementations for setting the second shielding member 250 . Two implementations of the second shielding member 250 are exemplarily given below.

[0114] The first implementation of the second shielding member 250 is shown in FIG. Figures 1 to 3The second shielding member 250 includes an adapter plate 251, a top plate 252 and a metal shielding layer 254. The adapter plate 251 is connected to the second surface 210b, the top plate 252 is connected to the side of the adapter plate 251 facing away from the main board 210, the adapter plate 251 has an inner hole, the adapter plate 251 and the top plate 252 form a second accommodating cavity 253, the second heating device 230 is located in the second accommodating cavity 253, the metal shielding layer 254 is provided on the side of the adapter plate 251 facing away from the main board 210, and the side of the metal shielding layer 254 facing away from the main board 210 forms a second heat conducting surface 200b.

[0115] The main board 210, the adapter board 251 and the top plate 252 form a circuit board sandwich structure. Components can be arranged on one side or both sides of the main board 210, and components can be arranged on one side or both sides of the top plate 252, so that more components can be arranged in a limited area, making full use of the limited space, so that more space can be reserved in the middle frame 110 to arrange larger devices (such as batteries 500). The main board 210 and the top plate 252 can be connected through the plated through-holes of the adapter board 251. A metal shielding layer 254 is provided on the top of the top plate 252, and the electromagnetic shielding of the second heating device 230 is achieved through the metal shielding layer 254, reducing the electromagnetic interference of the second heating device 230 to devices other than the second shielding member 250 (such as the camera module). The metal shielding layer 254 can also allow the heat of the top plate 252 to be conducted to the second heat conducting member 125 of the second heat dissipation group 120b through the metal shielding layer 254.

[0116] The metal shielding layer 254 may be a sheet structure made of metal materials such as copper alloy, steel, etc. The metal shielding layer 254 may be mounted on the top plate 252 using surface mounted technology (SMT), which is easy to form.

[0117] The second implementation of the second shielding member 250 is as follows: Figure 4 The second shielding member 250 includes an integrated second metal cover 255. The side of the second metal cover 255 facing away from the mainboard 210 forms a second heat conducting surface 200b. The edge of the second metal cover 255 is connected to the second surface 210b of the mainboard 210. The second metal cover 255 provides electromagnetic shielding for the second heating element 230, reducing electromagnetic interference from the second heating element 230 to devices outside the second metal cover 255 (such as the camera module).

[0118] In some embodiments, see Figure 1 、 Figure 3 、 Figure 4The second heat conducting member 125 includes at least one of a second graphite sheet 1251 and a second vapor chamber 1252. Only the second graphite sheet 1251, only the second vapor chamber 1252, or both the second graphite sheet 1251 and the second vapor chamber 1252 may be provided. These arrangements enable heat from the circuit board assembly 200 to be transferred from the second heat conducting member 125 to the second phase change material layer 126.

[0119] Exemplarily, the second heat conducting member 125 includes a second graphite sheet 1251, one end of which is connected to the second shielding member 250, and the other end of which is connected to the second phase-change material layer 126. The operating heat of the circuit board assembly 200 is conducted to the second shielding member 250, and then rapidly conducted to the second phase-change material layer 126 by the second graphite sheet 1251, where it is absorbed and stored.

[0120] In some embodiments, see Figure 1 、 Figure 3 、 Figure 4 The second phase-change material layer 126 is located on the side of the second thermally conductive element 125 facing the battery area 113. The second phase-change material layer 126 is used to absorb and store heat from the circuit board assembly 200 and transferred to the second thermally conductive element 125. The second phase-change material layer 126 releases heat when its temperature drops below the phase transition point. This reduces the amount of heat transferred from the second phase-change material layer 126 to the back cover 400 on the second side 110b of the middle frame 110, improving the user experience.

[0121] In some embodiments, see Figure 7 、 Figure 8 The second phase change material layer 126 has a relief groove 1261 on a side facing the battery area 113 . The relief groove 1261 is used to accommodate a flexible circuit board (not shown).

[0122] The mainboard area 112 of the middle frame 110 can be provided with a mainboard 210, and a small circuit board (not shown) can be provided at a position of the middle frame 110 away from the mainboard area 112. The small circuit board and the mainboard 210 can be electrically connected via a flexible circuit board. The flexible circuit board is provided in the avoidance groove 1261 of the second phase change material layer 126. The thickness of the second phase change material layer 126 is not equal at different positions. The thickness is smaller in the portion where the avoidance groove 1261 is provided, and the thickness is larger in the portion where the avoidance groove 1261 is not provided. Under the limited thickness of the middle frame 110, the flexible circuit board is arranged on the second side 110b of the middle frame 110 to increase the overall volume of the second phase change material layer 126, which can improve the heat absorption and heat storage capacity.

[0123] In other embodiments, see Figure 1The second phase change material layer 126 has the same thickness at different locations. The heat conducted from the circuit board assembly 200 to the second heat conducting member 125 is absorbed and stored by the second phase change material layer 126 of the same thickness.

[0124] In some embodiments, see Figure 1 、 Figure 8 The thickness of the second phase-change material layer 126 is in the range of [0.03 mm, 0.3 mm]. The second phase-change material layer 126 occupies a relatively small portion of the thickness of the middle frame 110 and has little impact on the thickness of the middle frame 110. A larger second phase-change material layer 126 can be used, for example, one whose area is equal to or close to that of the screen area 111, to enhance the heat storage capacity of the second phase-change material layer 126.

[0125] The thickness of the second phase change material layer 126 may be 0.03 millimeters (mm), 0.10 mm, 0.15 mm, 0.20 mm, 0.25 mm, 0.30 mm, etc.

[0126] In some embodiments, see Figure 8 In the width direction X of the mainboard 210, the first heating element 220 is located in the middle of the mainboard 210. The middle position of the mainboard 210 is allowed to be offset to a certain extent along the width direction X of the mainboard 210. For example, the center of the first heating element 220 can be moved within a range of 3 mm from the middle position in the width direction X of the mainboard 210.

[0127] The operating heat of the first heating element 220 can be evenly transferred from the middle portion of the motherboard 210 in the width direction X to different locations on the motherboard 210 in different directions, resulting in a more uniform heat distribution at different locations on the motherboard 210 and reducing the risk of localized overheating on the first side 110a of the middle frame 110 under high load conditions. Combined with the first heat sink group 120a and / or the second heat sink group 120b in the heat dissipation structure 120, the heat from the first heating element 220 can be dispersed in different directions, achieving efficient heat dissipation.

[0128] In some embodiments, see Figure 5 In the width direction X of the middle frame 110, the first heating device 220 is located in the middle of the middle frame 110. The middle position of the middle frame 110 is allowed to be offset to a certain extent along the width direction X of the middle frame 110. For example, the center of the first heating device 220 can be moved left and right within a range of 3 mm from the middle position of the middle frame 110 in the width direction X.

[0129] The working heat of the first heating element 220 can be uniformly conducted to different positions of the first heat conducting member 121 along different directions on the first heat conducting member 121, so that the heat distribution at different positions of the first heat conducting member 121 is more uniform, thereby reducing the situation where the local temperature of the first side 110a of the middle frame 110 is too high in high load scenarios.

[0130] In some embodiments, see Figure 1 、 Figures 5 to 7 The screen area 111 is provided with a first screen 300. The first screen 300 is used to output light to display information. If the first heat dissipation group 120a is provided on the first side 110a of the middle frame 110, the first screen 300 can cover the first heat dissipation group 120a. The first screen 300 can also have a touch function to detect touch operations applied on or near it.

[0131] In some embodiments, see Figure 1 、 Figures 5 to 7 A back cover 400 is provided on the second side 110b of the middle frame 110. As a component of the terminal device 1000, the back cover 400 protects the components on the second side 110b of the middle frame 110. If a second heat sink group 120b is provided on the second side 110b of the middle frame 110, the back cover 400 can cover the second heat sink group 120b.

[0132] In other embodiments, a second screen is provided on the second side 110b of the middle frame 110. The second screen is configured to output light to display information. When a second heat sink group 120b is provided on the second side 110b of the middle frame 110, the second screen may completely or partially cover the second heat sink group 120b. The second screen may also have a touch function to detect touch operations applied thereto or in the vicinity thereof.

[0133] In some embodiments, refer to FIG. Figure 1 、 Figures 7 to 9 The battery area 113 is provided with a battery 500, which is electrically connected to the circuit board assembly 200. The battery 500 is used to supply power to various electrical components of the terminal device 1000.

[0134] When second heat dissipation group 120b is provided, it includes a second heat conducting member 125 and a second phase change material layer 126. Second phase change material layer 126 is located between second heat conducting member 125 and battery 500. Second phase change material layer 126 releases heat when the temperature drops below the phase transition point. This reduces the amount of heat transferred to the back cover 400 when the second phase change material layer 126 dissipates heat, improving the user experience.

[0135] The following simulation test compares the heat dissipation performance of a terminal device in the related art and that of the terminal device in this embodiment. The terminal device in the related art is referred to as the comparative example, and the terminal device in this embodiment is referred to as the present embodiment. The length and width dimensions of the middle frame and circuit board assembly in both the comparative example and the present embodiment are identical. The circuit board assembly in both cases includes a mainboard and a first heat-generating device. The first heat-generating device is a SoC with a power output of 4 watts (W).

[0136] In the comparative example, Figure 10As shown in (a), the first heating element 220' is not located in the middle of the motherboard in the width direction X, but rather farther away from the middle of the motherboard. The shielding element of the first heating element 220' is connected to the vacuum chamber heat sink. There is no graphite sheet between the shielding element of the first heating element 220' and the vacuum chamber heat sink, and the vacuum chamber heat sink does not have a phase change material layer.

[0137] In this embodiment, see Figure 8 、 Figure 9 The first heating element 220 is located in the middle of the main board 210 in the width direction X. A first graphite sheet 1211 is provided between the first shielding member 240 of the first heating element 220 and the first vacuum chamber heat sink 1212 , and the first phase change material layer 122 is stacked on the first vacuum chamber heat sink 1212 .

[0138] from Figure 10 As shown in (a) and (b), the comparative example exhibits localized overheating on the screen side. Compared to the comparative example, the temperature rise parameter of this embodiment is improved by approximately 0.7 milliamperes per degree Celsius (mA / °C), demonstrating a higher steady-state heat dissipation capability. The temperature rise parameter represents the current value (e.g., 1 mA, 2 mA, etc.) corresponding to each 1°C increase in the terminal device's temperature and can be used to characterize the terminal device's steady-state heat dissipation capability.

[0139] The junction temperature of the SoC in the comparative example is 74.68°C, while the junction temperature of the SoC in this embodiment is 74.15°C, which is about 0.5°C lower. The heat dissipation effect of the SoC in this embodiment is better. The junction temperature refers to the actual operating temperature of the semiconductor in the electronic device.

[0140] The temperature rise curves for the comparative example and the present embodiment, i.e., the temperature-temperature control duration curve, are obtained for both in a 4K resolution, 60 FPS recording scenario. At the same temperature of 46°C, the temperature control duration for the comparative example is approximately 1260 seconds, while that for the present embodiment is approximately 1350 seconds, extending the temperature control duration by approximately 90 seconds. The frame rate (FPS) indicates the number of images refreshed per second.

[0141] After confirming whether the housing assembly 100 and terminal device 1000 are embodiments of the present application, the device can be disassembled for analysis to confirm that the heat dissipation structure 120 includes a first heat dissipation group 120a and / or a second heat dissipation group 120b. The first heat dissipation group 120a is located on the first side 110a of the middle frame 110. The first heat dissipation group 120a includes a first heat conductive member 121 and a first phase change material layer 122. A portion of the first heat conductive member 121 is used to connect to the first heat conductive surface 200a of the circuit board assembly 200. The first phase change material layer 122 is adjacent to the screen area 111 and connected to the first heat conductive member 121. The second heat dissipation group 120b is located on the second side 110b of the middle frame 110. The second heat dissipation group 120b includes a second heat conductive member 125 and a second phase change material layer 126. A portion of the second heat conductive member 125 is used to connect to the second heat conductive surface 200b of the circuit board assembly 200. The second phase change material layer 126 is adjacent to the battery area 113 and connected to the second heat conductive member 125.

[0142] Finally, it should be noted that the above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A housing assembly, characterized in that: include: Middle frame and heat dissipation structure; The middle frame has a first side and a second side opposite to each other; The first side of the middle frame has a screen area; The second side of the middle frame has a mainboard area and a battery area, the mainboard area is used to install a circuit board assembly, and the circuit board assembly has a first heat conducting surface and a second heat conducting surface facing each other; The heat dissipation structure includes a first heat dissipation group and / or a second heat dissipation group; The first heat dissipation group is provided on the first side of the middle frame, and includes a first heat conductive member and a first phase change material layer. A portion of the first heat conductive member is used to connect to the first heat conductive surface of the circuit board assembly, and the first phase change material layer is adjacent to the screen area and connected to the first heat conductive member. The second heat dissipation group is arranged on the second side of the middle frame, and the second heat dissipation group includes a second heat conductive member and a second phase change material layer. A portion of the second heat conductive member is used to connect to the second heat conductive surface of the circuit board assembly, and the second phase change material layer is adjacent to the battery area and connected to the second heat conductive member.

2. The housing assembly according to claim 1, wherein: The first heat conducting member includes at least one of a first graphite sheet and a first vacuum chamber heat sink; And / or, the second heat conducting member includes at least one of a second graphite sheet and a second vacuum chamber heat sink.

3. The housing assembly according to claim 1, wherein: The first heat conducting member includes a first vacuum chamber vapor chamber, the first vacuum chamber vapor chamber is connected to the first heat conducting surface of the circuit board assembly, and the first phase change material layer is stacked on the first vacuum chamber vapor chamber.

4. The housing assembly according to claim 3, wherein: In the thickness direction of the middle frame, the projection of the first vacuum chamber vapor chamber at least partially covers the projection of the main board area and the projection of the battery area.

5. The housing assembly according to claim 3 or 4, characterized in that: The first phase change material layer is disposed on a side of the first vacuum chamber vapor chamber facing away from the circuit board assembly.

6. The housing assembly according to claim 5, wherein: In the thickness direction of the middle frame, the projection of the first vacuum chamber heat sink covers the projection of the first phase change material layer.

7. The housing assembly according to any one of claims 3 to 6, characterized in that: The first heat conducting member further includes a first graphite sheet, which is connected between the first heat conducting surface of the circuit board assembly and the first vacuum chamber heat sink.

8. The housing assembly according to any one of claims 1 to 7, characterized in that: The second phase change material layer is located on a side of the second heat conducting member facing the battery area.

9. The housing assembly according to any one of claims 1 to 8, characterized in that: A side of the second phase change material layer facing the battery area has an avoidance groove, and the avoidance groove is used to accommodate a flexible circuit board; Alternatively, the thickness of the second phase-change material layer at different locations is equal.

10. The housing assembly according to any one of claims 1 to 9, characterized in that: The thickness range of the second phase change material layer is [0.03 mm, 0.3 mm].

11. A terminal device, characterized in that: comprising a circuit board assembly and a housing assembly according to any one of claims 1 to 10; The circuit board assembly is located in the mainboard area, and includes a mainboard, a first heating device, and a second heating device. The mainboard has a first surface and a second surface facing each other. The first heating device is provided on the first surface, and the second heating device is provided on the second surface. A first shielding member is provided on the first surface, the first shielding member covers the first heat-generating device, and a side of the first shielding member facing away from the mainboard forms the first heat-conducting surface; A second shielding member is provided on the second surface. The second shielding member covers the second heat-generating device. The side of the second shielding member facing away from the mainboard forms the second heat-conducting surface.

12. The terminal device according to claim 11, characterized in that The middle frame has a through hole at a position corresponding to the mainboard area; the first shielding component is at least partially located in the through hole, or the first shielding component is arranged toward the through hole.

13. The terminal device according to claim 11 or 12, characterized in that: In the case where the heat dissipation structure includes the first heat dissipation group, a first heat-conducting gel is provided between the top of the first shielding member and the first heat-generating device; a second heat-conducting gel is provided between the top of the first shielding member and the first heat-conducting member of the first heat dissipation group; And / or, in the case where the heat dissipation structure includes the second heat dissipation group, the second shielding component is filled with a third thermally conductive gel, the third thermally conductive gel covers the second heating element, and is connected to the top of the second shielding component.

14. The terminal device according to any one of claims 11 to 13, characterized in that: The first shielding member includes a frame-shaped portion and a cover body, the frame-shaped portion is installed and connected to the first surface, the cover body is connected to the side of the frame-shaped portion facing away from the mainboard, the frame-shaped portion and the cover body form a first accommodating cavity, the first heating device is located in the first accommodating cavity, and the side of the cover body facing away from the mainboard forms the first heat conduction surface.

15. The terminal device according to any one of claims 11 to 13, characterized in that: The first shielding component includes an integrated first metal cover, and a side of the first metal cover facing away from the mainboard forms the first heat conducting surface.

16. The terminal device according to any one of claims 11 to 15, characterized in that: The second shielding component includes an adapter plate, a top plate and a metal shielding layer. The adapter plate is connected to the second surface, the top plate is connected to the side of the adapter plate facing away from the main board, the adapter plate has an inner hole, the adapter plate and the top plate form a second accommodating cavity, the second heating device is located in the second accommodating cavity, the metal shielding layer is provided on the side of the adapter plate facing away from the main board, and the side of the metal shielding layer facing away from the main board forms a second heat conducting surface.

17. The terminal device according to any one of claims 11 to 15, characterized in that: The second shielding component includes an integrated second metal cover, and a side of the second metal cover facing away from the mainboard forms the second heat conducting surface.

18. The terminal device according to any one of claims 11 to 17, characterized in that: In the width direction of the main board, the first heating element is located in the middle of the main board; And / or, in the width direction of the middle frame, the first heating device is located in the middle of the middle frame.

19. The terminal device according to any one of claims 11 to 18, characterized in that: The screen area is provided with a first screen; And / or, the second side of the middle frame is provided with a back cover and / or a second screen.

20. The terminal device according to any one of claims 11 to 19, characterized in that: The battery area is provided with a battery, and the battery is electrically connected to the circuit board assembly.

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