Pin spot welding apparatus for electronic component processing

Abstract

The application relates to the technical field of spot welding equipment, and particularly discloses a pin spot welding device for electronic component processing, which comprises positioning piles, the side surfaces of the positioning piles are elastically slidably connected with fixing plates through connecting rods, four positioning plates are fixedly arranged at a fixed interval around the central shaft of the positioning pile, the four positioning plates are combined into a rectangle at the beginning, and the bottom surfaces of the four positioning plates are inlaid with chips. The pin spot welding device for electronic component processing can realize independent spot welding of the chip pins through the welding cavities, is different from traditional manual spot welding, can realize synchronous and rapid one-time welding forming of multiple pins, greatly improves the spot welding efficiency, greatly improves the spot welding quality, avoids spot welding quality problems caused by manual operation errors, and limits the tin liquid amount at each pin in the welding cavities, so that the welding spots are sufficiently beautiful and neat after welding, and the problem of connection of the welding spots caused by excessive tin liquid amount of a certain welding spot can be avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of spot welding equipment, in particular to a pin spot welding device for electronic component processing. BACKGROUND

[0002] In the field of electronic component processing, pin spot welding equipment is the key equipment for realizing the electrical connection of chips and circuit boards. The device provided by the present application realizes the automatic positioning, cleaning and tin liquid filling of chip pins through the cooperative design of positioning piles, plug-in frames and welding cavities. The core is that through the hydraulic drive of the driving rod and the auxiliary mechanism of the gas pressure linkage, the synchronous spot welding of multiple pins is realized, which is suitable for the mass production of high-density electronic components and has important significance for improving the consistency of welding points and production efficiency.

[0003] The traditional pin spot welding technology has significant shortcomings. In terms of efficiency, traditional manual spot welding relies on manual operation and cannot realize synchronous welding of multiple pins, resulting in low production efficiency and high labor intensity, which cannot meet the needs of mass production. Poor quality stability, manual control of tin liquid quantity easily leads to uneven welding points, and excessive tin liquid easily causes the welding points to be connected, affecting the circuit conduction performance, and the operation failure rate is high. Lack of cleaning mechanism, traditional equipment lacks automatic cleaning function for spot welding parts, and dust or oxide layer on the pin surface easily leads to problems such as virtual welding and welding. Low degree of automation, the whole process from positioning to tin injection needs manual intervention, lacks precise control of tin liquid quantity and automatic sealing mechanism of the welding cavity, and cannot adapt to different sizes of chips, making the replacement of clamps cumbersome, which restricts the precision and flexibility of electronic component processing. SUMMARY

[0004] (I) Technical problems solved

[0005] The present application provides a pin spot welding device for electronic component processing, which solves the problems mentioned in the background art.

[0006] (II) Technical solutions

[0007] To achieve the above objectives, the present invention provides the following technical solution: a pin spot welding device for electronic component processing, comprising positioning posts, wherein a fixing plate is elastically slidably inserted into the side surface of the positioning posts via a connecting rod, wherein four positioning plates are fixedly spaced around the central axis of the positioning posts, and the four positioning plates initially form a rectangle, with a chip embedded in the bottom surface of the four positioning plates; further comprising: a spot welding mechanism, wherein the spot welding mechanism is elastically slidably connected to the side surface of the positioning plates; and a reinforcement mechanism, wherein the reinforcement mechanism is fixedly installed inside the spot welding mechanism; wherein the spot welding mechanism includes an insertion frame, the insertion frame... The inner surface of the frame is elastically slidably inserted into the outer surface of the positioning plate. A filling cavity is opened inside the insertion frame. A cover plate is fixedly connected to the upper surface of the insertion frame. The filling cavity is fastened by the cover plate. A drive rod is fixedly connected to the upper surface of the cover plate. A hydraulic device is externally connected to the top of the drive rod. A feed port is opened through the middle upper surface of the cover plate. Air holes are opened through the upper surfaces of both ends of the cover plate. A welding cavity is opened on the bottom surface of the insertion frame. The welding cavity is connected to the filling cavity. The welding cavity is aligned with the pins of the chip. The inner wall of the welding cavity is coated with polytetrafluoroethylene.

[0008] According to one embodiment of the present invention, a soldering iron plate is fixedly embedded in the inner surface of the filling cavity, and a venting pipe is fixedly embedded through the outer surfaces of both sides of the plug frame, wherein one end of the venting pipe is set to a closed state and the other end is set to an open state, and the lower surface of the venting pipe is connected to the top of the welding cavity.

[0009] According to one embodiment of the present invention, a plug-in groove is provided on the bottom surface of the plug-in frame near the fixed plate, and an installation groove is provided at the top of the plug-in groove. A sliding rod is symmetrically fixedly connected to the inner surface of the top of the installation groove, and an extrusion strip is slidably sleeved on the sliding rod. An inner plate is elastically slidably inserted into the plug-in groove, and the top of the inner plate is fixedly connected to the bottom surface of the extrusion strip. An extrusion bladder is fixedly connected to the upper surface of the extrusion strip.

[0010] According to one embodiment of the present invention, an inner groove is provided through the bottom of the inner plate, the inner groove is directly opposite to the pins of the chip, the bottom of the inner plate initially protrudes from the bottom of the plug frame, and a cleaning groove is provided through the bottom surface of the plug frame on the side away from the fixing plate, the cleaning groove is directly opposite to the pins of the chip.

[0011] According to one embodiment of the present invention, a sliding groove is provided on the side of the plug frame away from the fixed plate, an outer plate is slidably inserted into the sliding groove, an expansion bladder is fixedly connected to the upper surface of the outer plate, the internal cavity of the expansion bladder communicates with the internal cavity of the compression bladder, a sealing protrusion is provided at the bottom of the outer plate, the sealing protrusion is slidably inserted into the inner surface of the cleaning groove, wherein the bottom of the sealing protrusion is initially at the top of the cleaning groove.

[0012] According to one embodiment of the present invention, the reinforcing mechanism includes an auxiliary groove formed in the wall of the inner plate. An auxiliary bladder is fixedly connected to the top inner surface of the auxiliary groove. The interior of the auxiliary bladder is composed of multiple independent cavities. A driving block is fixedly connected to the bottom of the auxiliary bladder. The bottom of the driving block is elastically slidably inserted into the inner groove at the bottom of the inner plate. The bottom surface of the driving block is initially set to be the same plane as the bottom surface of the inner plate. At the same time, the elastic force of the driving block is greater than the elastic force of the inner plate.

[0013] According to one embodiment of the present invention, a gas collecting hood is fixedly embedded in the inner surface of the insertion slot. The gas collecting hood is slidably connected to the top outer surface of the inner plate. The number of gas collecting hoods is the same as the number of driving blocks. The gas collecting hood is disposed above the driving blocks, and the internal cavity of the gas collecting hood is in communication with the independent cavities in the auxiliary bladder.

[0014] According to one embodiment of the present invention, a connecting pipe is fixedly connected through the bottom surface of the filling cavity, and the number of connecting pipes is the same as the number of driving blocks. The filling cavity is connected to the welding cavity through the connecting pipe. A sealing plate is slidably fitted on the bottom inner surface of the connecting pipe. A connecting rod is fixedly connected to the upper surface of the sealing plate. An installation rod is fixedly connected to the top of the connecting rod. The two ends of the installation rod are fixedly connected to the inner surfaces of both sides of the filling cavity.

[0015] According to one embodiment of the present invention, a connecting ring is fixedly sleeved on the outer surface of the connecting tube. The connecting ring is slidably disposed in the inner wall of the insertion frame below the filling cavity. A connecting bladder is fixedly connected to the lower surface of the connecting ring. The connecting bladder is annular, and its internal cavity communicates with the gas collection hood directly opposite it. When it is necessary to solder a chip onto a circuit board, the circuit board can be fixed first. Then, the chip to be soldered can be weakly and elastically snapped onto the bottom surface of the fixing plate. After snapping, the driving rod is pressed down by an external hydraulic device. As the driving rod moves down, it will pass through the insertion frame. The moving positioning post and the fixing plate move down synchronously, so that the bottom surface of the chip on the fixing plate is finally attached to the upper surface of the circuit board, and the pins on the chip are aligned with the solder joints on the circuit board. At this time, molten solder is filled into the filling cavity through the feed port on the cover plate. After the molten solder enters the filling cavity, it gradually flows into the soldering cavity. When the soldering cavity is filled with molten solder, the drive rod moves up a certain distance. At this time, the plug-in frames on both sides of the fixing plate move up a certain distance, opening the soldering cavity. After the molten solder at the chip pins cools and solidifies, the drive rod continues to move up, which can drive the fixing plate to gradually detach from the chip, and finally complete the soldering of the chip pins.

[0016] (III) Beneficial Effects

[0017] This invention provides a pin spot welding device for electronic component processing. It has the following beneficial effects:

[0018] (I) The pin spot welding equipment for processing electronic components can independently spot weld chip pins through the set welding cavity. Unlike traditional manual spot welding, it can not only realize the synchronous and rapid one-time welding of multiple pins, greatly improving the spot welding efficiency, but also greatly improve the spot welding quality and avoid spot welding quality problems caused by human operation errors. At the same time, the welding cavity can limit the amount of solder at each pin, which can not only make the solder joints look neat and tidy after welding, but also avoid the problem of solder joints connecting due to excessive amount of solder at a certain solder joint.

[0019] (II) In the pin spot welding equipment for processing electronic components, when the bottom surface of the chip contacts the upper surface of the circuit board, it means that the inner groove at the bottom of the inner board and the inner end of the pin are interlocked, thereby sealing the inner end of the welding cavity. At this time, high-pressure gas is introduced into the vent pipe. As the drive rod continues to move downward, that is, the insertion frame continues to move downward, the inner board begins to move inward relative to the insertion groove, that is, it begins to squeeze the extrusion strip, and the extrusion bladder is squeezed by the extrusion strip. When the extrusion bladder is squeezed, the air pressure inside it is delivered to the expansion bladder, causing the expansion bladder to expand downward, that is, it begins to push the outer board down along the slide groove. At this time, the high-pressure gas is delivered into the welding cavity through the vent pipe. The dust cleaned by the high-pressure gas is output outward through the cleaning groove on the outside of the insertion frame until the sealing protrusion on the outer board moves down to the bottom and seals the cleaning groove. At this time, the input of high-pressure gas is stopped. Finally, the spot welding part is cleaned by high-pressure gas before welding, so as to avoid the problem of dust on the pin spot welding part causing the subsequent spot welding quality to be substandard.

[0020] (III) In the pin spot welding equipment for this electronic component processing, when the sealing bump moves to the bottom, the inner plate cannot continue to move upward. At this time, as the insertion frame continues to move downward, the driving block in the inner groove of the inner plate will receive strong squeezing force. Under the action of squeezing force, the driving block begins to move upward along the inner groove, that is, it begins to squeeze the auxiliary bag through the top of the driving block. When the auxiliary bag is squeezed, it will transport its internal air pressure to the gas collection hood and finally to the connecting bag, causing the air pressure in the connecting bag to rise, and begin to push the connecting ring upward. The upward movement of the connecting ring will synchronously drive the connecting tube upward, so that the bottom of the connecting tube is misaligned with the sealing plate, thereby opening the bottom of the connecting tube. At this time, the molten solder in the filling cavity flows into the welding cavity through the connecting tube, and the welding cavity is completely sealed. Thus, after the dust at the pin is cleaned, the welding cavity is automatically sealed and the molten solder is injected automatically at the same time, which greatly improves the automation level of this equipment, reduces the difficulty of using this equipment, and at the same time can The adjustable mounting plate allows the device to accommodate chips of different sizes, significantly increasing its soldering range and applicability. Furthermore, the auxiliary chamber is divided into multiple cavities, each connected to a separate gas collection hood. This ensures that soldering cavities with pins are only opened for soldering molten solder, while those without pins remain closed due to the lack of pressure from the pins on the drive block. This allows the device to accommodate different pins on the same size chip, further enhancing its applicability. The connector frames use a flexible insertion method on both sides of the mounting plate, allowing for quick matching and insertion of different connector frames when accommodating larger chips. This significantly improves the speed and difficulty of connector frame replacement. After the solder molten solder is injected into the soldering cavity, the connector frame is moved upwards a certain distance before the connecting tube resets and closes again, preventing excessive solder molten solder leakage and waste. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the bottom surface of the present invention;

[0023] Figure 3 This is a schematic diagram of the dispersion structure of the fixing plate of the present invention;

[0024] Figure 4 This is a schematic diagram of the chip mounting structure of the present invention;

[0025] Figure 5 This is a schematic diagram of the internal structure of the plug-in frame of the present invention;

[0026] Figure 6 This is a schematic diagram of the outer plate and its connection structure of the present invention;

[0027] Figure 7 This is a schematic diagram of the inner plate and its connection structure of the present invention;

[0028] Figure 8 This is a schematic diagram of the connecting pipe and its connection structure of the present invention;

[0029] Figure 9 This is a schematic diagram of the driving block and its connection structure of the present invention.

[0030] In the diagram: 1. Positioning stake; 2. Fixing plate; 3. Chip; 4. Spot welding mechanism; 41. Insertion frame; 42. Filling cavity; 43. Cover plate; 44. Drive rod; 45. Feed port; 46. Air hole; 47. Welding cavity; 48. Soldering iron plate; 49. Vent pipe; 410. Insertion groove; 411. Mounting groove; 412. Sliding rod; 413. Extrusion strip; 414. Inner plate; 415. Extrusion bladder; 416. Inner groove; 417. Cleaning groove; 418. Sliding groove; 419. Outer plate; 420. Expansion bladder; 421. Sealing protrusion; 5. Reinforcing mechanism; 51. Auxiliary groove; 52. Auxiliary bladder; 53. Drive block; 54. Gas collection hood; 55. Connecting pipe; 56. Sealing disc; 57. Connecting rod; 58. Mounting rod; 59. Connecting ring; 510. Connecting bladder. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] First embodiment: as follows Figures 1 to 9 As shown, the present invention provides a technical solution: a pin spot welding device for processing electronic components, including a positioning post 1, a fixing plate 2 elastically slidably inserted into the side surface of the positioning post 1 via a connecting rod, wherein four positioning plates are fixedly spaced around the central axis of the positioning post 1, the four positioning plates initially assemble into a rectangle, and a chip 3 is embedded in the bottom surface of the four positioning plates, and further includes:

[0033] Spot welding mechanism 4 is elastically slidably connected to the side surface of the positioning plate;

[0034] Reinforcing mechanism 5 is fixedly installed inside the spot welding mechanism 4;

[0035] The spot welding mechanism 4 includes a plug-in frame 41, the inner surface of which is elastically slidably plugged into the outer surface of the positioning plate. A filling cavity 42 is provided inside the plug-in frame 41. A cover plate 43 is fixedly connected to the upper surface of the plug-in frame 41. The filling cavity 42 is fastened by the cover plate 43. A drive rod 44 is fixedly connected to the upper surface of the cover plate 43. A hydraulic device is externally connected to the top of the drive rod 44. A feed port 45 is provided through the middle upper surface of the cover plate 43. Air holes 46 are provided through the upper surfaces of both ends of the cover plate 43. A welding cavity 47 is provided on the bottom surface of the plug-in frame 41. The welding cavity 47 is connected to the filling cavity 42. The welding cavity 47 is aligned with the pins of the chip 3. The inner wall of the welding cavity 47 is coated with a polytetrafluoroethylene coating.

[0036] A soldering iron plate 48 is fixedly embedded on the inner surface of the filling cavity 42, and a vent pipe 49 is fixedly embedded through the outer surfaces of both sides of the insertion frame 41. One end of the vent pipe 49 is set to a closed state, and the other end is set to an open state. The lower surface of the vent pipe 49 is connected to the top of the welding cavity 47.

[0037] The bottom surface of the plug-in frame 41 near the fixed plate 2 is provided with a plug-in groove 410. The top of the plug-in groove 410 is connected to an installation groove 411. The top inner surface of the installation groove 411 is symmetrically fixedly connected with a slide rod 412. An extrusion strip 413 is slidably sleeved on the slide rod 412. An inner plate 414 is elastically slidably inserted into the plug-in groove 410. The top of the inner plate 414 is fixedly connected to the bottom surface of the extrusion strip 413. An extrusion bladder 415 is fixedly connected to the upper surface of the extrusion strip 413.

[0038] The bottom of the inner plate 414 has an inner groove 416 that runs through it. The inner groove 416 is directly opposite to the pins of the chip 3. Initially, the bottom of the inner plate 414 protrudes from the bottom of the plug frame 41. A cleaning groove 417 is provided on the bottom surface of the plug frame 41 away from the fixing plate 2. The cleaning groove 417 is directly opposite to the pins of the chip 3.

[0039] A groove 418 is provided on the side of the insertion frame 41 away from the fixed plate 2. An outer plate 419 is slidably inserted into the groove 418. An expansion bladder 420 is fixedly connected to the upper surface of the outer plate 419. The internal cavity of the expansion bladder 420 is connected to the internal cavity of the compression bladder 415. A sealing protrusion 421 is provided at the bottom of the outer plate 419. The sealing protrusion 421 is slidably inserted into the inner surface of the cleaning groove 417. Initially, the bottom of the sealing protrusion 421 is at the top of the cleaning groove 417.

[0040] Second embodiment: as follows Figures 1 to 9As shown, the reinforcing mechanism 5 includes an auxiliary groove 51, which is formed in the wall of the inner plate 414. An auxiliary bladder 52 is fixedly connected to the top inner surface of the auxiliary groove 51. The interior of the auxiliary bladder 52 is composed of multiple independent cavities. A driving block 53 is fixedly connected to the bottom of the auxiliary bladder 52. The bottom of the driving block 53 is elastically slidably inserted into the inner groove 416 at the bottom of the inner plate 414. Initially, the bottom surface of the driving block 53 and the bottom surface of the inner plate 414 are set to be on the same plane. At the same time, the elastic force of the driving block 53 is greater than the elastic force of the inner plate 414.

[0041] An air collecting hood 54 is fixedly embedded in the inner surface of the insertion slot 410. The air collecting hood 54 is slidably connected to the top outer surface of the inner plate 414. The number of air collecting hoods 54 is the same as the number of driving blocks 53. The air collecting hood 54 is located above the driving block 53, and the internal cavity of the air collecting hood 54 is connected to the independent cavities in the auxiliary bladder 52.

[0042] A connecting pipe 55 is fixedly connected through the bottom surface of the filling cavity 42. The number of connecting pipes 55 is the same as the number of driving blocks 53. The filling cavity 42 is connected to the welding cavity 47 through the connecting pipe 55. A sealing plate 56 is slidably fitted on the bottom inner surface of the connecting pipe 55. A connecting rod 57 is fixedly connected to the upper surface of the sealing plate 56. An installation rod 58 is fixedly connected to the top of the connecting rod 57. The two ends of the installation rod 58 are fixedly connected to the inner surfaces of both sides of the filling cavity 42.

[0043] A connecting ring 59 is fixedly sleeved on the outer surface of the connecting pipe 55. The connecting ring 59 is slidably disposed in the inner wall of the insertion frame 41 below the filling cavity 42. A connecting bladder 510 is fixedly connected to the lower surface of the connecting ring 59. The connecting bladder 510 is configured as an annular shape, and the internal cavity of the connecting bladder 510 is connected to the gas collection hood 54 directly opposite it.

[0044] During operation, when chip 3 needs to be soldered onto the circuit board, the circuit board is first fixed. Then, chip 3, which is required for soldering, is weakly and elastically snapped onto the bottom surface of the fixing plate 2. After snapping, the drive rod 44 is pressed down by an external hydraulic device. As the drive rod 44 moves down, it drives the positioning stake 1 and the fixing plate 2 to move down synchronously through the insertion frame 41. This ultimately makes the bottom surface of chip 3 on the fixing plate 2 fit against the upper surface of the circuit board, and the pins on chip 3 are aligned with the solder points on the circuit board. At this time, molten solder is filled into the filling cavity 42 through the feed port 45 on the cover plate 43. After entering the filling cavity 42, the molten solder gradually flows into the soldering cavity 47. When the soldering cavity 47 is filled with molten solder, the drive rod 44 moves up a certain distance. At this time, the insertion points on both sides of the fixing plate 2... The mounting frame 41 moves upward a certain distance, opening the soldering cavity 47. After the solder at the chip 3 pins cools and solidifies, the drive rod 44 continues to move upward, causing the fixing plate 2 to gradually disengage from the chip 3, ultimately completing the soldering of the chip 3 pins. The soldering cavity 47 enables independent spot welding of the chip 3 pins, unlike traditional manual spot welding. This not only allows for simultaneous and rapid one-time soldering of multiple pins, significantly improving welding efficiency, but also greatly improves welding quality, avoiding quality issues caused by human error. Furthermore, the soldering cavity 47 limits the amount of solder at each pin, ensuring a neat and aesthetically pleasing solder joint after welding, while also preventing solder joints from connecting due to excessive solder at one point. After the bottom surface of plate 3 contacts the upper surface of the circuit board, it means that the inner groove 416 at the bottom of the inner plate 414 and the inner end of the pin are engaged with each other, thereby sealing the inner end of the welding cavity 47. At this time, high-pressure gas is introduced into the vent pipe 49. As the drive rod 44 continues to move downward, that is, the insertion frame 41 continues to move downward, the inner plate 414 begins to move inward relative to the insertion groove 410, that is, it begins to compress the extrusion strip 413, and the extrusion bladder 415 is compressed by the extrusion strip 413. When the extrusion bladder 415 is compressed, it will transfer the air pressure inside to the expansion bladder 420, causing the expansion bladder 420 to begin to expand downward, that is, to begin to push the outer plate 419 downward along the slide groove 418. At this time, high-pressure gas is delivered to the welding cavity 47 through the vent pipe 49. Inside the 7th panel, the dust cleaned by high-pressure gas is discharged outward through the cleaning groove 417 on the outside of the connector frame 41 until the sealing protrusion 421 on the outer plate 419 moves down to the bottom and seals the cleaning groove 417. At this point, the input of high-pressure gas stops, thus achieving the goal of cleaning the spot welding area with high-pressure gas before welding, avoiding the problem of dust on the spot welding area of ​​the pins causing the subsequent spot welding quality to be substandard. When the sealing protrusion 421 moves to the bottom, the inner plate 414 can no longer move upward. At this time, as the connector frame 41 continues to move downward, the driving block 53 in the inner groove 416 on the inner plate 414 will receive strong squeezing force. Under the action of squeezing force, the driving block 53 begins to move upward along the inner groove 416, that is, it begins to squeeze the auxiliary bag 52 through the top of the driving block 53.When the auxiliary bladder 52 is compressed, its internal air pressure is delivered to the gas collecting hood 54 and finally to the connecting bladder 510, causing the air pressure inside the connecting bladder 510 to increase. This pushes the connecting ring 59 upward, which in turn moves the connecting tube 55 upward, causing the bottom of the connecting tube 55 to misalign with the sealing plate 56. This opens the bottom of the connecting tube 55, allowing the molten solder in the filling cavity 42 to flow into the soldering cavity 47 through the connecting tube 55. At this point, the soldering cavity 47 is completely sealed, thus automatically sealing the soldering cavity 47 and simultaneously injecting molten solder after cleaning the dust at the pins. This significantly improves the automation level of the device and reduces its ease of use. Furthermore, the adjustable fixing plate 2 allows the device to accommodate chips 3 of different sizes. The installation significantly expands the soldering range and improves the applicability of this equipment. Furthermore, because the auxiliary bladder 52 is divided into multiple cavities, each connected to a separate gas collection hood 54, only soldering cavities 47 with leads are opened for solder injection. Soldering cavities 47 without leads are not opened because the driving block 53 is not subjected to relative pressure from the leads. This allows the equipment to match different leads on chips 3 of the same size, further enhancing its applicability. The connector frame 41 uses a flexible insertion method to connect to both sides of the fixing plate 2. Even when matching larger chips 3, different models of connector frames 41 can be quickly matched and connected by sliding, significantly increasing the replacement speed and reducing the difficulty of replacing the connector frame 41.

[0045] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0046] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A pin spot welding device for processing electronic components, comprising positioning posts (1), characterized in that: The side surface of the positioning stake (1) is elastically slidably connected to a fixing plate (2) via a connecting rod. Four positioning plates are fixedly spaced around the central axis of the positioning stake (1). Initially, the four positioning plates are combined into a rectangle. A chip (3) is embedded in the bottom surface of the four positioning plates. The system also includes: Spot welding mechanism (4), wherein the spot welding mechanism (4) is elastically slidably connected to the side surface of the positioning plate; The reinforcing mechanism (5) is fixedly installed inside the spot welding mechanism (4); The spot welding mechanism (4) includes a plug frame (41), the inner surface of which is elastically slidably plugged into the outer surface of the positioning plate. A filling cavity (42) is opened inside the plug frame (41). A cover plate (43) is fixedly connected to the upper surface of the plug frame (41). The filling cavity (42) is fastened by the cover plate (43). A drive rod (44) is fixedly connected to the upper surface of the cover plate (43). A hydraulic device is externally connected to the top of the drive rod (44). A feed port (45) is opened through the middle upper surface of the cover plate (43). Air holes (46) are opened through the upper surfaces of both ends of the cover plate (43). A welding cavity (47) is opened on the bottom surface of the plug frame (41). The welding cavity (47) is connected to the filling cavity (42). The welding cavity (47) is aligned with the pins of the chip (3). The inner wall of the welding cavity (47) is coated with a polytetrafluoroethylene coating. The bottom surface of the plug-in frame (41) near the fixed plate (2) is provided with a plug-in groove (410). The top of the plug-in groove (410) is connected to an installation groove (411). A slide rod (412) is symmetrically fixedly connected to the inner surface of the top of the installation groove (411). An extrusion strip (413) is slidably sleeved on the slide rod (412). An inner plate (414) is elastically slidably inserted into the plug-in groove (410). The top of the inner plate (414) is fixedly connected to the bottom surface of the extrusion strip (413). An extrusion bladder (415) is fixedly connected to the upper surface of the extrusion strip (413). The reinforcing mechanism (5) includes an auxiliary groove (51) which is opened in the wall of the inner plate (414). An auxiliary bladder (52) is fixedly connected to the top inner surface of the auxiliary groove (51). The interior of the auxiliary bladder (52) is composed of multiple independent cavities. A driving block (53) is fixedly connected to the bottom of the auxiliary bladder (52). The bottom of the driving block (53) is elastically slidably inserted into the inner groove (416) at the bottom of the inner plate (414). Initially, the bottom surface of the driving block (53) is set to be on the same plane as the bottom surface of the inner plate (414). At the same time, the elastic force of the driving block (53) is greater than that of the inner plate (414).

2. The pin spot welding equipment for electronic component processing according to claim 1, characterized in that: The inner surface of the filling cavity (42) is fixedly inlaid with a soldering iron plate (48), and the outer surfaces of both sides of the plug frame (41) are fixedly inlaid with vent pipes (49). One end of the vent pipe (49) is set to a closed state, and the other end is set to an open state. The lower surface of the vent pipe (49) is connected to the top of the welding cavity (47).

3. The pin spot welding equipment for electronic component processing according to claim 2, characterized in that: The bottom of the inner plate (414) is provided with an inner groove (416) through it. The inner groove (416) is directly opposite to the pins of the chip (3). The bottom of the inner plate (414) initially protrudes from the bottom of the plug frame (41). The bottom surface of the plug frame (41) away from the fixed plate (2) is provided with a cleaning groove (417) through it. The cleaning groove (417) is directly opposite to the pins of the chip (3).

4. The pin spot welding equipment for electronic component processing according to claim 3, characterized in that: The insertion frame (41) has a groove (418) on the side away from the fixed plate (2). An outer plate (419) is slidably inserted into the groove (418). An expansion bladder (420) is fixedly connected to the upper surface of the outer plate (419). The internal cavity of the expansion bladder (420) is connected to the internal cavity of the compression bladder (415). A sealing protrusion (421) is provided at the bottom of the outer plate (419). The sealing protrusion (421) is slidably inserted into the inner surface of the cleaning groove (417). Initially, the bottom of the sealing protrusion (421) is at the top of the cleaning groove (417).

5. The pin spot welding equipment for electronic component processing according to claim 4, characterized in that: The inner surface of the insertion slot (410) is fixedly inlaid with a gas collection hood (54). The gas collection hood (54) is slidably connected to the top outer surface of the inner plate (414). The number of gas collection hoods (54) is the same as the number of driving blocks (53). The gas collection hoods (54) are located above the driving blocks (53), and the internal cavity of the gas collection hood (54) is connected to the independent cavities in the auxiliary bag (52).

6. The pin spot welding equipment for electronic component processing according to claim 5, characterized in that: The bottom surface of the filling cavity (42) is fixedly connected to a connecting pipe (55). The number of connecting pipes (55) is the same as the number of driving blocks (53). The filling cavity (42) is connected to the welding cavity (47) through the connecting pipes (55). A sealing plate (56) is slidably fitted on the bottom inner surface of the connecting pipe (55). A connecting rod (57) is fixedly connected to the upper surface of the sealing plate (56). An installation rod (58) is fixedly connected to the top of the connecting rod (57). The two ends of the installation rod (58) are fixedly connected to the inner surfaces of both sides of the filling cavity (42).

7. The pin spot welding equipment for electronic component processing according to claim 6, characterized in that: A connecting ring (59) is fixedly sleeved on the outer surface of the connecting pipe (55). The connecting ring (59) is slidably disposed in the inner wall of the insertion frame (41) below the filling cavity (42). A connecting bag (510) is fixedly connected to the lower surface of the connecting ring (59). The connecting bag (510) is configured as an annular shape. The internal cavity of the connecting bag (510) is connected to the gas collection hood (54) directly opposite it.

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