Crystal ingot processing equipment

Abstract

The invention discloses crystal ingot processing equipment, and relates to the technical field of semiconductor manufacturing, the crystal ingot processing equipment comprises SIC equipment, the SIC equipment is provided with a material inlet, and the SIC equipment is internally provided with two conveyor belts for inputting and outputting materials; through the arrangement of the positioning center supporting mechanism, the center of the crystal ingot is forced to coincide with the vertical line of a laser light path emitted by the placing seat through mechanical positioning, laser energy can uniformly act on the crystal ingot through accurate center positioning, the problems of cutting path deviation, uneven notch and the like caused by position deviation are avoided, and the product quality is improved; the center of the crystal ingot is automatically aligned with a laser working point emitted by the placing seat, the step of manually adjusting the positions of a reflecting mirror and a focusing mirror in the traditional process is omitted, the laser processing efficiency and the automation degree of equipment are improved, the problem of non-uniform irradiation caused by deviation of laser energy is better solved, the positioning force is uniformly applied in the circumferential direction of the crystal ingot, and the production efficiency is improved. And crystal ingot deformation caused by traditional single-side clamping is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor manufacturing, and in particular to ingot processing equipment. Background Art

[0002] In the semiconductor, photovoltaic, and optical device manufacturing fields, ingots serve as a core foundational material. The precision of their processing plays a decisive role in subsequent chip manufacturing, solar cell conversion efficiency, and optical component performance. Silicon carbide (SIC), with its exceptional properties such as high hardness, high thermal conductivity, and wide bandgap, has become a key material for third-generation semiconductors, finding widespread application in 5G communications, new energy vehicles, and other fields.

[0003] Traditional ingot placement bases are mostly flat, fixed structures. When the ingot is placed on the base, it is impossible to automatically and conveniently detect and feedback the parallelism of the ingot's surface to be processed. During the ingot processing process, the parallelism of the ingot's surface to be processed plays a decisive role in processing accuracy. If there is a deviation in parallelism, the angle at which the laser beam acts on the ingot surface will deviate during laser substrate stripping, resulting in uneven laser energy distribution, which in turn makes the substrate stripping effect poor, and can lead to problems such as incomplete stripping and substrate surface damage, seriously affecting product quality and production efficiency. For example, when the parallelism deviation between the ingot's surface to be processed and the ideal plane exceeds a certain threshold, the surface roughness of the substrate after laser stripping will increase significantly, greatly affecting the subsequent device manufacturing process.

[0004] At the same time, existing ingot positioning methods have shortcomings. First, the clamping force is often fixed. During processing, the laser acting on the ingot generates heat, causing the ingot to change size due to thermal expansion and contraction. The fixed clamping force cannot adapt to these dimensional changes in the ingot, causing it to shift during processing, affecting processing accuracy and even damaging the ingot. Second, the existing clamping structure cannot detect thermal changes during processing and cannot adjust the flexible clamping force accordingly. In actual processing, different parts of the ingot generate different amounts of heat. Failure to adjust the clamping force accordingly can result in uneven stress on the ingot, generating internal stress that affects the ingot's crystal structure and reduces product quality.

[0005] Therefore, a crystal ingot processing device is proposed to solve the above problems. Summary of the Invention

[0006] In view of the deficiencies in the prior art, the present invention provides a crystal ingot processing device to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned object, the present invention provides the following technical solution: an ingot processing device, comprising: a SIC device, wherein the SIC device is provided with a material inlet, two conveyor belts are provided in the SIC device for inputting and outputting materials, a laser body is provided in the SIC device, a placement seat is provided below the laser body, an auxiliary processing leveling mechanism is provided on the placement seat, the auxiliary processing leveling mechanism is provided in two groups, and a positioning center support mechanism is provided in the middle of the auxiliary processing leveling mechanism; The auxiliary processing and leveling mechanism is used to place the ingot material to be processed and then provide feedback on whether the processing surface of the ingot is parallel to the placement seat; The positioning center support mechanism is used to align the center of the crystal ingot with the verticality of the laser body to assist the efficiency of the processing process and to flexibly adjust the positioning force according to the processing process.

[0008] Preferably, the auxiliary processing leveling mechanism includes a positioning frame, which is fixedly connected to the placement seat. A first through groove is provided at one end of the positioning frame close to the placement seat, and a second through groove is provided at one end of the positioning frame away from the placement seat. A deflecting plate is rotatably connected in the first through groove, and the deflecting plate extends toward the middle of the placement seat. A limiting rod is provided above the deflecting plate, and the limiting rod is fixedly connected to the inner wall of the first through groove.

[0009] Preferably, the auxiliary processing leveling mechanism includes a U-shaped body, the end of the U-shaped body away from the weight-biased plate is rotatably connected to a connecting rod, the end of the connecting rod away from the U-shaped body is rotatably connected to a leveling body, a rotating rod is provided on the leveling body, both ends of the rotating rod of the leveling body are rotatably connected to a potentiometer, and the end of the potentiometer away from the leveling body is fixedly connected to the second through groove.

[0010] Preferably, the positioning center support mechanism includes a functional shell, which is fixedly connected to the middle part of the placement seat, a wire groove is opened on the upper surface of the functional shell, a driving screw is fixedly connected to the bottom of the inner cavity of the functional shell, a four-way block is threadedly connected to the driving screw, and the outer ring of the four-way block is rotatably connected to two straight rods, one of the straight rods is rotatably connected to a guide rod in the middle, and the end of the guide rod away from the straight rod is rotatably connected to the positioning seat, and the end of the positioning seat away from the guide rod is fixedly connected to the functional shell, and the ends of the two straight rods away from the four-way block are rotatably connected to curved rods.

[0011] Preferably, the positioning center support mechanism also includes a positioning body, the positioning body is fixedly connected to the end of the curved rod away from the straight rod, a temperature sensor is fixedly connected to the side wall of the positioning body, a side of the positioning body away from the curved rod is fixedly connected to a flexible arc body, a functional column is fixedly connected inside the positioning body, the functional column is fixedly connected to the flexible arc body, and an electrical conductor is fixedly connected inside the functional column.

[0012] Preferably, two positioning frames are provided and are symmetrically arranged about the central axis of the placement seat. A balance block is provided on the side of the first through slot close to the center of the placement seat to limit the parallelism of the deflection plate, and a counterweight block is provided on the end of the deflection plate away from the middle of the placement seat.

[0013] Preferably, the U-shaped body is fixedly connected to the upper side of the weight-biased plate provided with a counterweight block, the end of the leveling body away from the positioning frame is set to a straight state, and the potentiometer is electrically connected to the main controller.

[0014] Preferably, a cavity is provided in the functional shell, four wire grooves are provided at equal distances around the center of the functional shell, a connector is provided on the outer ring of the four-way block, and four connectors are provided on the four-way block at equal distances around the center of the four-way block.

[0015] Preferably, the temperature sensor is electrically connected to the main controller, the flexible arc body is an outward protruding arc surface, and there are multiple flexible arc bodies. The functional column is connected to the inner cavity of the flexible arc body, and magnetorheological fluid is installed in the functional column. The electrical conductor is electrically connected to the main controller.

[0016] Compared with the prior art, the present invention provides an ingot processing device with the following beneficial effects: 1. Through the setting of the auxiliary processing leveling mechanism, the crystal ingot is placed on the deflection plate, and gravity directly drives the leveling body to deflect until it contacts the upper surface of the crystal ingot. The rotation angle is fixed, and the leveling body synchronously drives the potentiometer to rotate, converting the mechanical displacement into an electrical signal. The rotation angle of the leveling body is used to feedback whether the upper surface of the crystal ingot is in a parallel state, and the state of the processed workpiece is adjusted. Accurate parallelism detection can make the cutting tool act evenly on the crystal ingot surface, ensure that the grinding tool or polishing tool applies uniform force on the entire crystal ingot surface, achieve consistent grinding and polishing effects, avoid processing defects caused by the tilt of the crystal ingot surface, improve processing accuracy, and reduce material waste. The rotation angle of the potentiometer is linearly corresponding to the tilt angle of the crystal ingot surface, and can output analog signals in real time, so that the control system can immediately obtain parallelism data.

[0017] 2. By setting up a positioning center support mechanism, mechanical positioning is used to force the center of the crystal ingot to coincide with the vertical line of the laser light path emitted by the placement seat. Precise center positioning can make the laser energy act evenly on the crystal ingot, avoiding problems such as cutting path offset and uneven incision due to position deviation, thereby improving product quality. The center of the crystal ingot is automatically aligned with the laser working point emitted by the placement seat, eliminating the steps of manually adjusting the position of the reflector and focusing mirror in the traditional process, improving laser processing efficiency and the degree of equipment automation, and better reducing the problem of non-uniform irradiation caused by the offset of laser energy. The positioning force is evenly applied along the circumference of the crystal ingot, avoiding the deformation of the crystal ingot caused by traditional unilateral clamping.

[0018] 3. Through the coordinated setting of temperature sensors and electrical conductors, the processing heat generated in the ingot processing project is fed back. Under the action of the main controller, the magnetic field strength generated by the electrical conductor is adjusted to adjust the stiffness of the magnetorheological fluid. The magnetorheological fluid forms a "liquid support pad" through magnetic field constraints. The heat generated is used to feedback and control the support strength of the magnetorheological fluid. Flexible supports are used instead of rigid supports to avoid direct friction between the rigid support and the ingot surface, reducing processing damage caused by thermal stress. The support strength can be adjusted in real time according to the force conditions of different parts of the ingot during processing, compensating for thermal deformation of the ingot, improving the shape accuracy during position processing, buffering processing stress, reducing the risk of ingot breakage, improving processing yield, and effectively improving the adaptability and stability of clamping.

[0019] 4. Through the cooperation of the flexible arc and the magnetorheological fluid in the functional column, for special-shaped crystal ingots, such as polygonal and curved ones, due to the irregular surface, traditional rigid clamping is prone to local suspension or excessive extrusion. The flexible support generated by the cooperation of the magnetorheological fluid and the flexible arc has the "form-fitting filling" characteristic. When in liquid state, it quickly flows into the gap between the crystal ingot and the clamp, and solidifies into a semi-solid state after applying a magnetic field, closely fitting the curved surface of the crystal ingot. At the same time, the setting of the positioning center support mechanism provides peripheral rigid constraints. The cooperation of the two increases the contact area between the crystal ingot and the clamp, avoiding the risk of fragmentation caused by local stress concentration. The existence of the positioning body provides basic positioning. The magnetorheological fluid compensates for the shape error of the crystal ingot surface through local adjustment, adjusts the clamping stress according to the shape characteristics of each part of the special-shaped crystal ingot, prevents the crystal ingot from being damaged due to improper clamping during processing, and at the same time ensures the position accuracy during processing to meet the processing requirements of more precise processes for crystal ingots. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 This is a structural diagram of the auxiliary processing leveling mechanism and the positioning center support mechanism of the present invention; Figure 3 This is an internal structural diagram of the SIC device of the present invention; Figure 4 It is a partial structural diagram of the present invention; Figure 5 This is a cross-sectional structural diagram of the auxiliary processing and leveling mechanism of the present invention; Figure 6 This is a disassembled structural diagram of the auxiliary processing and leveling mechanism of the present invention; Figure 7 This is a cross-sectional structural diagram of the positioning center support mechanism of the present invention; Figure 8 This is a partial structural diagram of the positioning center support mechanism of the present invention; Figure 9This is a partially disassembled structural diagram of the positioning center support mechanism of the present invention.

[0021] In the picture: 11. SIC equipment; 12. Laser body; 13. Placement seat; 2. Auxiliary processing leveling mechanism; 21. Positioning frame; 22. First through slot; 23. Second through slot; 24. Weight-biasing plate; 25. Limit rod; 26. U-shaped body; 27. Connecting rod; 28. Leveling body; 29. ​​Potentiometer; 3. Positioning center support mechanism; 31. Functional shell; 32. Wire groove; 33. Drive screw; 34. Four-way block; 35. Straight rod; 36. Guide rod; 37. Positioning seat; 38. Bending rod; 39. Positioning body; 310. Temperature sensor; 311. Flexible arc body; 312. Functional column; 313. Electrical conductor. DETAILED DESCRIPTION

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0023] The present invention will be described in further detail below with reference to the accompanying drawings and examples.

[0024] Example Please refer to Figures 1 to 6 As shown: To solve the problems mentioned in the technical solution, an embodiment of the present application provides an ingot processing device, comprising: a SIC device 11, wherein the SIC device 11 is provided with a material inlet, two conveyor belts are provided in the SIC device 11 for inputting and outputting materials, a laser body 12 is provided in the SIC device 11, a placement seat 13 is provided below the laser body 12, an auxiliary processing leveling mechanism 2 is provided on the placement seat 13, the auxiliary processing leveling mechanism 2 is provided with two groups, and a positioning center support mechanism 3 is provided in the middle of the auxiliary processing leveling mechanism 2; The auxiliary processing leveling mechanism 2 is used to place the ingot material to be processed and then feedback whether the ingot processing surface is in a parallel state with the placement seat 13. The auxiliary processing leveling mechanism 2 includes a positioning frame 21, which is fixedly connected to the placement seat 13. There are two positioning frames 21 and they are symmetrically arranged with respect to the central axis of the placement seat 13. The positioning frame 21 is provided with a first through slot 22 at one end close to the placement seat 13. A balance block is provided on the side of the first through slot 22 close to the center of the placement seat 13 to limit the parallelism of the deflection plate 24. A second through slot 23 is provided at one end of the positioning frame 21 away from the placement seat 13, and a deflecting plate 24 is rotatably connected in the first through slot 22. The deflecting plate 24 is used to place the ingot material to be processed, and the deflecting plate 24 extends toward the middle of the placement seat 13. A limiting rod 25 is provided above the deflecting plate 24. The limiting rod 25 is used to limit the deflecting plate 24 when it tilts upward. The limiting rod 25 is fixedly connected to the inner wall of the first through slot 22, and a counterweight is provided at one end of the deflecting plate 24 away from the middle of the placement seat 13. The auxiliary processing leveling mechanism 2 includes a U-shaped body 26, which is fixedly connected to the upper side of the eccentric weight plate 24 provided with a counterweight block. The end of the U-shaped body 26 away from the eccentric weight plate 24 is rotatably connected to a connecting rod 27, and the end of the connecting rod 27 away from the U-shaped body 26 is rotatably connected to a leveling body 28. The leveling body 28 is used to contact the upper surface of the crystal ingot when the crystal ingot is placed on the eccentric weight plate 24 to feedback whether it is in a parallel state. The end of the leveling body 28 away from the positioning frame 21 is set to a straight state. A rotating rod is provided on the leveling body 28. Both ends of the rotating rod of the leveling body 28 are rotatably connected to a potentiometer 29. The end of the potentiometer 29 away from the leveling body 28 is fixedly connected to the second through slot 23, and the potentiometer 29 is electrically connected to the main controller. Among them: the potentiometer 29 is composed of a resistor body, a sliding arm, a shell, pins, etc., and its operation is based on the principle of resistance voltage division. The two ends of the resistor body are connected to the power supply. The resistance value of the connected circuit is changed by moving the sliding arm on the resistor body. The resistance value of the potentiometer 29 is changed by the deflection angle of the leveling body 28. The parallel state of the ingot processing surface is detected under the data feedback of the two groups of potentiometers 29.

[0025] Further examples: Please refer to Figures 7 to 9 As shown: The positioning center support mechanism 3 is used to align the center of the crystal ingot with the verticality of the laser body 12 to assist the efficiency of the processing process and to flexibly adjust the positioning force according to the processing process. The positioning center support mechanism 3 includes a functional shell 31, which is fixedly connected to the middle of the placement seat 13. A cavity is opened in the functional shell 31, and a wire groove 32 is opened on the upper surface of the functional shell 31. Four wire grooves 32 are opened at equal distances around the center of the functional shell 31. A driving screw 33 is fixedly connected to the bottom of the inner cavity of the functional shell 31. The driving screw 33 The upper thread is connected to a four-way block 34, and a connecting piece is provided on the outer ring of the four-way block 34. Four connecting pieces are equidistantly provided on the four-way block 34 around the center of the four-way block 34. The outer ring of the four-way block 34 is rotatably connected to two straight rods 35, and the middle part of one of the straight rods 35 is rotatably connected to a guide rod 36. The end of the guide rod 36 away from the straight rod 35 is rotatably connected to a positioning seat 37. The end of the positioning seat 37 away from the guide rod 36 is fixedly connected to the functional shell 31. The ends of the two straight rods 35 away from the four-way block 34 are both rotatably connected to a bent rod 38.

[0026] The positioning center support mechanism 3 also includes a positioning body 39, which is fixedly connected to the end of the bending rod 38 away from the straight rod 35. A temperature sensor 310 is fixedly connected to the side wall of the positioning body 39. The laser body 12 generates a certain amount of heat during the processing of the ingot material placed on the deflection plate 24. Under the heat transfer, the positioning body 39 that fits and clamps the ingot and the temperature sensor 310 installed on its side wall detects the heat and transmits it to the main controller. After the main controller receives it, it is converted into an electrical signal to control the current strength of the conductor 313 to change the electromagnetic intensity and control the solidification state of the magnetorheological fluid in the functional column 312. The temperature sensor 310 is mainly used for processing the ingot during processing. The calorific value in the project is detected and fed back, and then the electromagnetic strength of the conductor 313 is adjusted by the main controller, thereby changing the flexible supporting force of the flexible arc 311. The temperature sensor 310 is electrically connected to the main controller. The side of the positioning body 39 away from the bending rod 38 is fixedly connected to the flexible arc 311. The flexible arc 311 is an outward protruding arc surface. There are multiple flexible arcs 311. A functional column 312 is fixedly connected to the positioning body 39. The functional column 312 is fixedly connected to the flexible arc 311. The functional column 312 is communicated with the inner cavity of the flexible arc 311. Magnetorheological fluid is installed in the functional column 312. The functional column 312 is fixedly connected to the conductor 313. The conductor 313 is electrically connected to the main controller.

[0027] Among them: the magnetic field strength of the conductor 313 is the core parameter for controlling the state of the magnetorheological fluid in the functional column 312: when the magnetic field strength is zero, the magnetorheological fluid presents a low-viscosity fluid state and can flow freely; as the magnetic field strength increases, the magnetic particles in the liquid will quickly arrange into a chain structure along the direction of the magnetic field, so that its shear yield strength increases linearly, and the state changes from fluid to solid-like; when the magnetic field strength weakens or is removed, the particle chain structure quickly disintegrates, and the liquid returns to its initial flow state; the yield strength is approximately linearly related to the magnetic field strength, and its stiffness and damping force can be precisely controlled by adjusting the strength of the magnetic field.

[0028] Everything in the above example works as follows: In the initial state, one end of the weight plate 24 with the counterweight is deflected downward, the end of the potentiometer 29 away from the positioning frame 21 is deflected upward, and the four-way block 34 is at the top of the driving screw 33.

[0029] The following is a working process of the auxiliary processing leveling mechanism 2 for placing the ingot material to be processed and then providing feedback on whether the ingot processing surface is in a parallel state with the placement seat 13: During use, the ingot to be processed is transported by a conveying device and placed on two deflecting plates 24. Under the action of gravity, the end of the deflecting plate 24 away from the counterweight block is pushed downward until it collides with the parallel block in the positioning frame 21. At this time, the deflecting plate 24 and the placement seat 13 are in a parallel state, and the end of the deflecting plate 24 provided with the counterweight block is synchronously parallel. The U-shaped body 26 moves upward when the deflecting plate 24 deflects, pushing one end of the connecting rod 27 to move upward and deflecting in the U-shaped body 26. The end of the connecting rod 27 away from the U-shaped body 26 pushes the leveling body under this thrust. One end of the leveling body 28 deflects upward. At this time, the end of the leveling body 28 away from the connecting rod 27 approaches the direction of the ingot placed on the deflecting plate 24 until it is in contact with the upper surface of the ingot. Due to the deflection of the leveling body 28 in the second through slot 23, the potentiometers 29 set on both sides thereof are deflected, thereby changing the resistance value in the potentiometer 29. Under the setting of the two sets of potentiometers 29, the potentiometers 29 on both sides of the ingot feed back the resistance change value to the main controller, thereby understanding whether the processing surface of the ingot is parallel to the surface of the placement seat 13, thereby assisting in the stability of the processing process; Through the setting of the auxiliary processing leveling mechanism 2, the crystal ingot is placed on the deflection plate 24, and gravity directly drives the leveling body 28 to deflect until it contacts the upper surface of the crystal ingot. The rotation angle is fixed, and the leveling body 28 synchronously drives the potentiometer 29 to rotate, converting the mechanical displacement into an electrical signal. The rotation angle of the leveling body 28 is used to feedback whether the upper surface of the crystal ingot is in a parallel state, and the state of the processed workpiece is adjusted. Accurate parallelism detection can make the cutting tool act evenly on the surface of the crystal ingot, ensure that the grinding tool or polishing tool applies force evenly on the entire crystal ingot surface, achieve consistent grinding and polishing effects, avoid processing defects caused by the tilt of the crystal ingot surface, improve processing accuracy, and reduce material waste. The rotation angle of the potentiometer 29 is linearly corresponding to the tilt angle of the crystal ingot surface, and can output analog signals in real time, so that the control system can immediately obtain parallelism data.

[0030] Please refer to the above working process Figures 1 to 6 .

[0031] The following is a working process of the positioning center support mechanism 3 for aligning the center of the crystal ingot with the verticality of the laser body 12 to assist the efficiency of the processing process and flexibly adjusting the positioning force according to the processing process: The guide rod 36 connected to the straight rod 35 is synchronously deflected with the connection point of the positioning seat 37 in the direction of the driving screw rod 33, thereby assisting the straight rod 35 and the curved rod 38 to move upward with the connection point of the straight rod 35 and the four-way block 34 as a fulcrum. Since the state of the straight rod 35 is to deflect with the connection point of the guide rod 36 as a fulcrum under the length limit, the deflection force of the straight rod 35 is converted into a driving force of the curved rod 38, which pushes one end of the curved rod 38 to move toward the middle under this force, and then under the restriction of the linear groove 32, the straight movement of the auxiliary curved rod 38 is synchronously driven to move the positioning body 39 toward the direction of the crystal ingot until it fits. The surface is limited to ensure that during the processing, the laser body 12 and the center of the ingot are on the same vertical line; further, during the processing, due to the heat generated by the laser processing, the ingot will change in size due to thermal expansion and contraction. During this change, the temperature sensor 310 set on the positioning body 39 performs thermal sensing. When the temperature is too high, the heat signal is transmitted to the main controller, which reduces the electromagnetic intensity of the conductor 313, prompting the magnetorheological fluid in the functional column 312 to be in a flexible state, and simultaneously improving the flexibility of the flexible arc 311, reducing the clamping force on the ingot, making it in a flexible support state, avoiding damage to the ingot caused by excessive clamping force of the rigid support on the ingot during thermal expansion, and through the setting of multiple temperature sensors 310, the electromagnetic intensity of the conductor 313 is adjusted in a targeted manner, the support state of the magnetorheological fluid is controlled, and the contact force of the flexible arc 311 on the ingot is better adapted, thereby improving the stability of the crystal structure of the ingot during processing.

[0032] By setting up the positioning center support mechanism 3, mechanical positioning is used to force the center of the crystal ingot to coincide with the vertical line of the laser light path emitted by the placement seat 13. Precise center positioning can make the laser energy act evenly on the crystal ingot, avoiding problems such as cutting path offset and uneven incision caused by position deviation, thereby improving product quality. The center of the crystal ingot is automatically aligned with the laser working point emitted by the placement seat 13, eliminating the steps of manually adjusting the position of the reflector and focusing mirror in the traditional process, improving the laser processing efficiency and the degree of equipment automation, and better reducing the problem of non-uniform irradiation caused by the offset of laser energy. The positioning force is evenly applied along the circumference of the crystal ingot, avoiding the deformation of the crystal ingot caused by traditional unilateral clamping.

[0033] Through the coordinated arrangement of the temperature sensor 310 and the conductor 313, the processing heat generated in the ingot processing project is fed back. Under the action of the main controller, the magnetic field strength generated by the conductor 313 is adjusted to adjust the stiffness of the magnetorheological fluid. The magnetorheological fluid forms a "liquid support pad" through magnetic field constraint. The heat generated is used to feedback and control the support strength of the magnetorheological fluid. Flexible support is used instead of rigid support to avoid direct friction between the rigid support and the surface of the ingot, reducing processing damage caused by thermal stress. The support strength can be adjusted in real time according to the stress conditions of different parts of the ingot during processing, compensating for thermal deformation of the ingot, and ensuring shape accuracy during position processing. This can buffer processing stress, reduce the risk of ingot breakage, improve processing yield, and effectively improve the adaptability and stability of clamping.

[0034] Through the cooperation of the flexible arc 311 and the magnetorheological fluid in the functional column 312, for special-shaped crystal ingots, such as polygonal and curved ones, due to their irregular surfaces, traditional rigid clamping is prone to local suspension or excessive extrusion. The flexible support generated by the cooperation of the magnetorheological fluid and the flexible arc 311 can quickly flow into the gap between the crystal ingot and the clamp when in liquid state through the "form-fitting filling" feature, and solidify into a semi-solid state after applying a magnetic field, closely fitting the curved surface of the crystal ingot; at the same time, the setting of the positioning center support mechanism 3 provides peripheral rigid constraints, and the cooperation of the two increases the contact area between the crystal ingot and the clamp, avoiding the risk of fragmentation caused by local stress concentration. The existence of the positioning body 39 provides basic positioning, and the magnetorheological fluid compensates for the shape error of the crystal ingot surface through local adjustment, adjusts the clamping stress according to the shape characteristics of each part of the special-shaped crystal ingot, prevents the crystal ingot from being damaged due to improper clamping during processing, and at the same time ensures the position accuracy during processing, meeting the processing requirements of more precise processes for crystal ingots.

[0035] Please refer to the above working process Figures 7 to 9 .

[0036] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or device comprising the element.

[0037] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A crystal ingot processing device comprising: The SIC device (11) is characterized in that: the SIC device (11) is provided with an auxiliary processing leveling mechanism (2) and a positioning center support mechanism (3); A laser body (12) is provided in the SIC device (11), and a placement seat (13) is provided below the laser body (12); The auxiliary processing leveling mechanism (2) comprises: a positioning frame (21), wherein the positioning frame (21) is fixedly connected to the center position of the upper surface of the placement seat (13); A first through slot (22) is formed at one end of the positioning frame (21) close to the placement seat (13), and a second through slot (23) is formed at one end of the positioning frame (21) away from the placement seat (13); A weight-biasing plate (24) is rotatably connected in the first through slot (22), and the weight-biasing plate (24) extends toward the middle of the placement seat (13); A limiting rod (25) is provided above the weight-biasing plate (24), and the limiting rod (25) is fixedly connected to the inner wall of the first through slot (22).

2. The ingot processing equipment according to claim 1, characterized in that: The SIC device (11) is provided with a material inlet, and two conveyor belts are provided inside the SIC device (11) for inputting and outputting materials.

3. The ingot processing equipment according to claim 2, characterized in that: A U-shaped body (26) is fixedly connected to one end of the eccentric weight plate (24) provided with a counterweight block, and an end of the U-shaped body (26) away from the eccentric weight plate (24) is rotatably connected to a connecting rod (27), and an end of the connecting rod (27) away from the U-shaped body (26) is rotatably connected to a leveling body (28), and a rotating rod is provided on the leveling body (28), and both ends of the rotating rod of the leveling body (28) are rotatably connected to a potentiometer (29), and an end of the potentiometer (29) away from the leveling body (28) is fixedly connected to the second through groove (23).

4. The ingot processing equipment according to claim 1, wherein: The positioning center support mechanism (3) includes a functional shell (31), the functional shell (31) is fixedly connected to the middle of the placement seat (13), the upper surface of the functional shell (31) is provided with a wire groove (32), the bottom of the inner cavity of the functional shell (31) is fixedly connected to a driving screw rod (33), the driving screw rod (33) is threadedly connected to a four-way block (34), the outer ring of the four-way block (34) is rotatably connected to two straight rods (35), one of the straight rods (35) is rotatably connected to a guide rod (36) in the middle, the guide rod (36) is rotatably connected to a positioning seat (37) at one end away from the straight rod (35), the positioning seat (37) is fixedly connected to the functional shell (31) at one end away from the guide rod (36), and the ends of the two straight rods (35) away from the four-way block (34) are both rotatably connected to a bending rod (38).

5. The ingot processing equipment according to claim 4, characterized in that: The positioning center support mechanism (3) further comprises a positioning body (39), wherein the positioning body (39) is fixedly connected to one end of the curved rod (38) away from the straight rod (35), a temperature sensor (310) is fixedly connected to the side wall of the positioning body (39), a flexible arc body (311) is fixedly connected to one side of the positioning body (39) away from the curved rod (38), a functional column (312) is fixedly connected inside the positioning body (39), the functional column (312) is fixedly connected to the flexible arc body (311), and an electric conductor (313) is fixedly connected inside the functional column (312).

6. The ingot processing equipment according to claim 2, characterized in that: Two positioning frames (21) are provided and are symmetrically arranged with respect to the central axis of the placement seat (13); a balancing block is provided on one side of the first through slot (22) close to the center of the placement seat (13) to limit the parallelism of the deflecting plate (24); and a counterweight block is provided on one end of the deflecting plate (24) away from the middle of the placement seat (13).

7. The ingot processing equipment according to claim 3, characterized in that: One end of the leveling body (28) away from the positioning frame (21) is set in a straight state, and the potentiometer (29) is electrically connected to the main controller.

8. The ingot processing equipment according to claim 4, characterized in that: A cavity is provided in the functional shell (31), four wire slots (32) are provided at equal intervals around the center of the functional shell (31), a connecting piece is provided on the outer ring of the four-way block (34), and four connecting pieces are provided on the four-way block (34) at equal intervals around the center of the four-way block (34).

9. The ingot processing equipment according to claim 5, characterized in that: The temperature sensor (310) is electrically connected to the main controller. The flexible arc body (311) is an outwardly protruding arc surface. A plurality of flexible arc bodies (311) are provided. The functional column (312) is connected to the inner cavity of the flexible arc body (311). Magnetorheological fluid is installed in the functional column (312). The electrical conductor (313) is electrically connected to the main controller.

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