Chemical plating equipment and chemical plating method for TGV processing

Abstract

The present invention relates to the technical field of glass through-hole processing, and discloses an electroless plating device and an electroless plating method for TGV processing. The electroless plating device includes a plating tank, a driving component, a hook, a hanging basket, a heating component, a plating solution circulation component, an air jet component, a vibrating component, and a control component. The plating tank has a receiving chamber with an open top; the driving component is arranged above the plating tank; one end of the hook is connected to the driving component, and the other end extends toward the receiving chamber; the hanging basket is hung on the hook and at least partially extends into the receiving chamber, and is used to accommodate a glass substrate to be processed; the heating component is arranged around the receiving chamber; the plating solution circulation component has a liquid outlet and a liquid inlet, both of which are connected to the receiving chamber; the air jet component is inserted into the receiving chamber; the vibrating component is arranged on the plating tank; and the control component is electrically connected to the driving component, the heating component, the plating solution circulation component, the air jet component, and the vibrating component. During processing, the glass substrate is fully in contact with the plating solution, which can improve the uniformity of the plating layer and reduce plating leakage.

Description

Technical Field

[0001] The present invention relates to the technical field of through-glass hole processing, and in particular to chemical plating equipment and a chemical plating method for TGV processing. Background Art

[0002] Electroless plating is a novel metal surface treatment technology that involves the deposition of metals through a controlled redox reaction catalyzed by metals. In the semiconductor and microelectronics integrated manufacturing fields, the electroless plating process on glass substrates typically involves pretreatments such as degreasing, microetching, pre-impregnation, activation, and post-impregnation. The target metal is then deposited on the glass substrate through a redox reaction. Compared to electroplating, electroless plating offers advantages such as uniform coating, process flexibility, and the absence of a DC power supply. Consequently, electroless plating has gradually replaced electroplating and become a key development trend in semiconductor surface treatment.

[0003] However, glass substrates generally have dense through-holes with a very small radius. Chemical plating technology is limited by the fluidity of the plating solution. When processing the glass substrate, the surface of the glass substrate has the problem of uneven contact with the plating solution. In addition, the through-holes of the glass substrate may not be fully filled with the plating solution, resulting in plating leakage.

[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to provide an electroless plating device and an electroless plating method for TGV processing, aiming to solve the problems of uneven coating and missed plating in the existing electroless plating process on glass substrates.

[0006] The technical solutions of the present invention are as follows:

[0007] A chemical plating device for TGV processing, comprising:

[0008] The plating tank has a receiving cavity with an open top; the receiving cavity is used to receive the chemical plating solution;

[0009] A driving component is arranged above the plating tank;

[0010] A hook, one end of which is connected to the driving component and the other end of which extends toward the accommodating cavity; wherein the driving component is used to drive the hook to rotate and lift;

[0011] a hanging basket, hung on the hook and at least partially extending into the accommodating cavity, the hanging basket being used to accommodate the glass substrate to be processed;

[0012] a heating component, disposed around the accommodating cavity and used for heating the chemical plating solution in the accommodating cavity;

[0013] a plating solution circulation component having a liquid outlet and a liquid inlet, wherein both the liquid outlet and the liquid inlet are connected to the accommodating cavity; and the liquid inlet is arranged toward the hanging basket to spray the plating solution toward the hanging basket;

[0014] An air jet component is inserted into the accommodating cavity and is used to spray air toward the hanging basket;

[0015] A vibration component, provided on the plating tank, for exciting the hanging basket to vibrate;

[0016] The control component is electrically connected to the driving component, the heating component, the plating solution circulation component, the air-jet component and the vibration component.

[0017] The chemical plating equipment for TGV processing, wherein the plating tank comprises an outer cylinder and an inner cylinder arranged in a nested manner, and an interlayer space is formed between the outer cylinder and the inner cylinder;

[0018] The heating component includes a heat exchanger and a heating pipe. The heating pipe is connected to the outer cylinder and is arranged in a spiral, ring or serpentine shape in the interlayer space. The heat exchanger is connected to the heating pipe. Moreover, the heat exchanger is electrically connected to the control component.

[0019] The chemical plating equipment for TGV processing, wherein the driving component includes:

[0020] A machine platform, located above the plating pool;

[0021] A guide rail is vertically arranged on the machine platform;

[0022] a lifting slide, slidably disposed on the guide rail;

[0023] A lifting motor is provided on the guide rail and is in transmission connection with the lifting slide;

[0024] A rotating motor is provided on the lifting slide; the output shaft of the rotating motor is connected to the hook via a coupling;

[0025] Wherein, the output shaft of the rotating motor is vertically downward and points to the plating pool; the lifting motor and the rotating motor are both electrically connected to the control component.

[0026] The chemical plating equipment for TGV processing, wherein the plating solution circulation component includes a liquid outlet pipe for conducting the plating solution, a liquid inlet pipe for introducing the plating solution, and a flow meter, a filter, and a negative pressure pump sequentially arranged between the liquid outlet pipe and the liquid inlet pipe;

[0027] Wherein, the liquid outlet is arranged on the liquid outlet pipe, and the liquid inlet is arranged on the liquid inlet pipe; the flow meter and the negative pressure pump are both electrically connected to the control component.

[0028] The chemical plating equipment for TGV processing, wherein the liquid inlet pipe includes a fixed pipe section and a rotating pipe section, one end of the fixed pipe section is connected to the negative pressure pump, and the other end extends to the bottom surface of the accommodating chamber, and the rotating pipe section is rotatably mounted on the fixed pipe section;

[0029] The rotating pipe section is provided with a plurality of liquid inlets.

[0030] The chemical plating equipment for TGV processing, wherein the fixed pipe section includes an inner ring and an outer ring, and the inner ring and the outer ring are concentrically arranged on the bottom surface of the accommodating cavity;

[0031] The rotating tube section includes a plurality of inner tubes and a plurality of outer tubes, wherein the plurality of inner tubes are arranged in a ring shape on the inner ring; and the plurality of outer tubes are arranged in a ring shape on the outer ring; and both the inner tubes and the outer tubes extend along the depth direction of the accommodating cavity;

[0032] Wherein, the hanging basket is located between the inner tube and the outer tube; at least one liquid inlet is provided on the side of the inner tube facing the outer tube; and at least one liquid inlet is provided on the side of the outer tube facing the inner tube.

[0033] The chemical plating equipment for TGV processing, wherein the hanging basket includes:

[0034] hanging board;

[0035] A hanging ring, provided on the hanging plate, for sleeve-engaging the hook;

[0036] A plurality of support rods are arranged on the hanging plate in a ring array; the support rods are inserted between the inner tube and the outer tube;

[0037] A plurality of clamps are arranged on the support rods; the clamps are used to clamp the glass substrate.

[0038] The chemical plating equipment for TGV processing, wherein the air jet component includes:

[0039] an air pump electrically connected to the control component;

[0040] an air jet bracket, one end of which is connected to the air pump and the other end of which is arranged on the bottom surface of the accommodating cavity;

[0041] Wherein, a plurality of air outlet holes are provided on the air jet support toward the hanging basket.

[0042] The chemical plating equipment for TGV processing, wherein the vibration component includes any one of an ultrasonic generator, a vibration generator, a magnetic oscillator, and a desktop oscillator.

[0043] The present application also discloses an electroless plating method, which is applied to any of the above-mentioned electroless plating equipment for TGV processing, wherein the electroless plating method comprises:

[0044] Determine processing conditions;

[0045] Pre-treating the plating solution in the plating pool based on the processing conditions; wherein the pre-treatment includes one or more of adjusting the plating solution temperature, adjusting the plating solution flow rate, and adjusting the gas injection rate;

[0046] Immersing the glass substrate to be processed in the pre-treated plating solution, rotating the glass substrate at a speed of 1-20 revolutions per minute; and simultaneously, stimulating the glass substrate at a frequency of once every 3-10 minutes under the excitation of a vibrating component;

[0047] After soaking for a predetermined time, the rotation is stopped and the glass substrate is taken out to complete the chemical plating process; wherein the predetermined time is 30-120 minutes.

[0048] Compared with the prior art, the embodiments of the present invention have the following advantages:

[0049] The chemical plating equipment disclosed in the present invention increases the fluidity of the plating solution and makes the temperature controllable by providing a heating component, a plating solution circulation component, and an air injection component. During the processing, the glass substrate is fixed to the hanging basket, and the driving component lowers the hook hanging the hanging basket until the plating solution in the plating tank immerses the glass substrate. In the plating solution, the glass substrate keeps rotating, and the surface of the glass substrate is in constant contact with the flowing plating solution, thereby depositing metal. In addition, the relative displacement of the glass substrate and the plating solution makes it easier for the plating solution to enter the through-holes on the glass substrate, which is conducive to filling the through-holes with plating solution and depositing a metal layer. In particular, by stimulating the vibration of the hanging basket through the vibration component, bubbles on the surface of the glass substrate and in the through-holes can be reduced, thereby reducing defects.

[0050] In summary, the present invention increases the contact time and contact area between the glass substrate and the plating solution, thereby improving the uniformity of the coating on the glass substrate and reducing the problem of missed plating. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0052] Figure 1 Schematic diagram of the structure of the chemical plating equipment used for TGV processing in the present invention;

[0053] Figure 2 This is an exploded view of the structure of the chemical plating equipment used for TGV processing in the present invention;

[0054] Figure 3 for Figure 2 A partial enlarged view of point A in the middle;

[0055] Figure 4 for Figure 2 A partial enlarged view of point B in the middle;

[0056] Figure 5 for Figure 2 A partial enlarged view of point C in the middle;

[0057] Figure 6 It is a structural schematic diagram of the hanging basket in the present invention;

[0058] Figure 7 It is a partial structural schematic diagram of the liquid inlet pipe in the present invention;

[0059] Figure 8 is a flow chart of the chemical plating method of the present invention;

[0060] Figure 9 This is a principle block diagram of the terminal in the present invention.

[0061] Among them, 10, plating pool; 11, accommodating chamber; 12, outer tube; 13, inner tube; 14, interlayer space; 20, driving component; 21, machine; 22, guide rail; 23, lifting slide; 24, lifting motor; 25, rotating motor; 30, hook; 40, hanging basket; 41, hanging plate; 42, lifting ring; 43, support rod; 44, clamp; 50, heating component; 51, heat exchanger; 52, heating tube; 60, plating Liquid circulation component; 61, liquid outlet; 62, liquid inlet; 63, liquid outlet pipe; 64, liquid inlet pipe; 641, fixed pipe section; 6411, inner ring; 6412, outer ring; 642, rotating pipe section; 6421, inner pipe; 6422, outer pipe; 65, flow meter; 66, filter; 67, negative pressure pump; 70, jet component; 71, air pump; 72, jet bracket; 721, air outlet; 80, vibration component. DETAILED DESCRIPTION

[0062] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will provide a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0063] Due to manufacturing techniques and / or tolerances, variations in the shapes shown in the drawings may occur. Therefore, the examples described herein are not limited to the specific shapes shown in the drawings but include changes in shapes that occur during manufacturing.

[0064] As used herein, the term "and / or" includes any one of the associated listed items and any combination of any two or more items.

[0065] For ease of description, spatial relational terms such as "above," "upper," "below," and "lower" may be used herein to describe the relationship of one element to another element as shown in the accompanying drawings. Such spatial relational terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the accompanying drawings. For example, if the device in the accompanying drawings is turned over, an element described as being "above" or "upper" relative to another element would subsequently be located "below" or "lower" relative to the other element. Thus, the term "above" encompasses both the orientations of "above" and "below," depending on the spatial orientation of the device. The device may also be positioned in other ways, and the spatial relational terms used herein will be interpreted accordingly.

[0066] The terms used herein are intended only to describe various examples and are not intended to limit the present disclosure. Unless the context clearly indicates otherwise, the singular is intended to include the plural. The terms "comprise," "include," and "have" list the presence of stated features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof.

[0067] Through Glass Via (TGV) technology is a vertical electrical interconnection technique that penetrates a glass substrate. Similar to Through Silicon Via (TSV) process technology, both achieve vertical electrical interconnection by drilling holes in an interposer and then electroplating and filling them. This reduces signal transmission distance, increases bandwidth, and enables package miniaturization. However, unlike TSV, TGV uses high-quality borosilicate glass or quartz glass as the interposer substrate, achieving better packaging performance than silicon interposers. It is considered a key technology for next-generation 3D integration.

[0068] like Figure 1 and Figure 2 As shown, as an embodiment of the present application, a chemical plating device for TGV processing is disclosed, which includes a plating tank 10, a driving component 20, a hook 30, a hanging basket 40, a heating component 50, a plating solution circulation component 60, an air-jet component 70, a vibrating component 80, and a control component. The control component is electrically connected to the driving component 20, the heating component 50, the plating solution circulation component 60, the air-jet component 70, and the vibrating component 80 to achieve the effect of automatically controlling the processing parameters. The control component disclosed in this embodiment includes but is not limited to mobile phones, computers, integrated circuit boards, and other devices, which store a control program for the chemical plating device to control the opening and closing of the driving component 20, the heating component 50, the plating solution circulation component 60, the air-jet component 70, and the vibrating component 80.

[0069] Specifically, if Figure 2 As shown, the plating pool 10 has a accommodating cavity 11 with a top opening; the accommodating cavity 11 is used to accommodate chemical plating solution; the driving component 20 is arranged above the plating pool 10; one end of the hook 30 is connected to the driving component 20, and the other end extends toward the accommodating cavity 11; the driving component 20 is used to drive the hook 30 to rotate and lift; the hanging basket 40 is hung on the hook 30 and at least partially extends into the accommodating cavity 11, and the hanging basket 40 is used to accommodate the glass substrate to be processed.

[0070] In this embodiment, the driving component 20 drives the hook 30 and the hanging basket 40 to perform lifting, rotation and other actions, so that the glass substrate keeps moving, and can more fully contact the plating solution in the plating tank 10, thereby increasing the probability of metal deposition.

[0071] like Figure 1 、 Figure 2 and Figure 4As shown, the heating component 50 is arranged around the accommodating cavity 11, and is used to heat the chemical plating solution in the accommodating cavity 11; the plating solution circulation component 60 has a liquid outlet 61 and a liquid inlet 62, and the liquid outlet 61 and the liquid inlet 62 are both connected to the accommodating cavity 11; and the liquid inlet 62 is arranged toward the hanging basket 40 to spray the plating solution toward the hanging basket 40; the jet component 70 is inserted into the accommodating cavity 11, and is used to spray toward the hanging basket 40; the vibration component 80 is provided on the plating pool 10, and is used to excite the hanging basket 40 to vibrate.

[0072] The chemical plating equipment disclosed in this embodiment accurately controls the temperature of the plating solution by providing a heating component 50, increases the fluidity of the plating solution by providing a plating solution circulation component 60 and an air injection component 70, and shakes the hanging basket 40 by providing a vibration component 80 to clear bubbles on the surface of the glass substrate.

[0073] In the course of processing, the glass substrate is fixed on the hanging basket 40, and the driving unit 20 is lowered by the hook 30 that hangs the hanging basket 40, until the plating solution in the plating pool 10 submerges the glass substrate. In the plating solution, the glass substrate keeps rotating, and can also suitably be lifted and lowered. The surface of the glass substrate is constantly in contact with the flowing plating solution, thereby spontaneously depositing metal, forming a coating. Moreover, the relative displacement of the glass substrate and the plating solution makes the plating solution more easily enter the through hole on the glass substrate, is conducive to filling the plating solution in the through hole, depositing a metal layer. Especially, in the present embodiment, the vibrations of the hanging basket 40 are also excited by the vibrating unit 80, so that the bubble in the surface and the through hole of the glass substrate can be reduced, so that the surface contact of the plating solution and the glass substrate is more sufficient, to reduce the defect of the coating on the glass substrate surface.

[0074] In summary, this embodiment increases the contact time and contact area between the glass substrate and the plating solution, thereby improving the uniformity of the coating on the glass substrate and reducing the problem of missed plating.

[0075] For example Figure 1 and Figure 2 As shown, as another embodiment of the present application, the plating pool 10 is disclosed to include an outer cylinder 12 and an inner cylinder 13 that are nested, and an interlayer space 14 is formed between the outer cylinder 12 and the inner cylinder 13; the heating component 50 includes a heat exchanger 51 and a heating pipe 52, and the heating pipe 52 is connected to the outer cylinder 12, and is arranged in a spiral, ring or serpentine shape in the interlayer space 14; the heat exchanger 51 is connected to the heating pipe 52; and the heat exchanger 51 is electrically connected to the control component.

[0076] The plating tank 10 disclosed in this embodiment is double-layered, with both the inner tube 13 and the outer tube 12 being made of alloy materials, thereby forming an interlayer space 14 to accommodate the heating tube 52. The heat exchanger 51 disclosed in this embodiment is a spiral tube heat exchanger 51 or a twisted tube heat exchanger 51. The heat exchanger 51 heats the fluid in the heating tube 52, transferring the heat to the interlayer space 14, which then diffuses to the wall of the inner tube 13, thereby heating the plating solution in the inner tube 13.

[0077] By configuring the heating tube 52 to be spiral, annular, or serpentine, the length of the heating tube 52 can be increased, thereby improving the heat exchange effect of the heating tube 52 and thereby increasing the heating speed of the plating solution and the efficiency of the chemical plating process.

[0078] like Figure 2 and Figure 3 As shown in FIG. 1 , as another embodiment of the present application, the driving component 20 includes a platform 21, a guide rail 22, a lifting slide 23, a lifting motor 24, and a rotating motor 25. The platform 21 is located above the plating tank 10 and plays a supporting role. Multiple feet can be provided on the edge of the platform 21 to stabilize it on the ground or a tabletop, thereby maintaining the relative stability of the platform 21 and the plating tank 10.

[0079] Specifically, the guide rail 22 is vertically arranged on the machine 21; the lifting slide 23 is slidably arranged on the guide rail 22; the lifting motor 24 is arranged on the guide rail 22 and is transmission-connected to the lifting slide 23; the rotating motor 25 is arranged on the lifting slide 23; the output shaft of the rotating motor 25 is connected to the hook 30 through a coupling; the output shaft of the rotating motor 25 is vertically downward, pointing to the plating pool 10; the lifting motor 24 and the rotating motor 25 are both electrically connected to the control component.

[0080] The lifting motor 24 and the rotating motor 25 disclosed in the present embodiment can all adopt a stepping motor, a servo motor or a DC motor. In addition, the lifting motor 24 is connected to the lifting slide 23 by a screw rod, or a gear, or a drag chain to drive the lifting slide 23 to rise or fall. The rotating motor 25 is arranged on the lifting slide 23, so the height of the rotating motor 25 can be adjusted by the lifting motor 24. Because the hook 30 is connected to the rotating motor 25 and the hanging basket 40 is hung on the hook 30, the effect of adjusting the height of the hanging basket 40 by the lifting motor 24 is achieved. In addition, in the present embodiment, the rotating motor 25 is connected to the hook 30 by a coupling, so the hook 30 can be driven to rotate, achieving the effect of driving the hanging basket 40 to rotate.

[0081] Specifically, in this embodiment, the guide rail 22 is vertically arranged, so the lifting slide 23 can only move in the vertical direction. At the same time, the output shaft of the rotary motor 25 extends vertically downward, so the hook 30 can also be in a vertical position. Therefore, when the hanging basket 40 is suspended, the rotary motor 25, the hook 30, and the hanging basket 40 are kept in the same vertical line. When the hook 30 and the hanging basket 40 rotate, the shaking is reduced, the probability of the hanging basket 40 colliding with the plating tank 10 is reduced, and the safety of the equipment is improved.

[0082] like Figure 2 and Figure 4 As shown, as another embodiment of the present application, the plating liquid circulation component 60 is disclosed to include a liquid outlet pipe 63 for discharging the plating liquid, a liquid inlet pipe 64 for introducing the plating liquid, and a flow meter 65, a filter 66 and a negative pressure pump 67 sequentially arranged between the liquid outlet pipe 63 and the liquid inlet pipe 64; the liquid outlet 61 is arranged on the liquid outlet pipe 63, and the liquid inlet 62 is arranged on the liquid inlet pipe 64; the flow meter 65 and the negative pressure pump 67 are both electrically connected to the control component.

[0083] The flowmeter 65 disclosed in this embodiment includes, but is not limited to, any one of a turbine flowmeter 65, an electromagnetic flowmeter 65, a differential pressure flowmeter 65, a positive displacement flowmeter 65, and a vortex flowmeter 65. The flow rate of the plating solution is monitored by the flowmeter 65, and the flow rate of the plating solution is controlled by the negative pressure pump 67. The negative pressure pump 67 disclosed in this embodiment includes, but is not limited to, a water ring vacuum pump or a rotary vane vacuum pump. The negative pressure pump 67 and the flowmeter 65 are both electrically connected to a control component to achieve the effect of automatically controlling the flow rate of the plating solution through the control component, thereby ensuring that the plating solution is in a suitable flow state, increasing the contact time with the glass substrate, and improving the processing quality of the coating.

[0084] In addition, by accurately detecting the flow rate of the plating solution through the flow meter 65, it is possible to avoid excessive power of the negative pressure pump 67 and prevent the plating solution from splashing out of the plating tank 10 due to excessive jet speed.

[0085] Specifically, during the continued use of the chemical plating equipment of this embodiment, solid impurities are inevitably generated in the plating solution. By providing a filter 66 to purify the plating solution, the plating solution in the plating tank 10 remains clean, reducing the chance of impurities scratching the glass substrate, maintaining the integrity of the glass substrate surface, and improving the processing quality of the coating. Furthermore, the pressure that filter 66 can withstand is limited. By monitoring the flow rate of the plating solution with flow meter 65 and controlling the output power of negative pressure pump 67 to ensure that the flow rate of the plating solution is within the tolerance range of filter 66, the safety and effectiveness of the equipment can be further improved, thereby extending the service life of the equipment.

[0086] In summary, the plating solution circulation assembly disclosed in this embodiment purifies the plating solution and improves the fluidity of the plating solution, which can increase the contact area and contact time between the plating solution and the surface of the glass substrate during processing, which is conducive to uniform deposition of the plating layer and reduces plating leakage.

[0087] like Figure 7 As shown, as another embodiment of the present application, the liquid inlet pipe 64 is disclosed to include a fixed pipe section 641 and a rotating pipe section 642, one end of the fixed pipe section 641 is connected to the negative pressure pump 67, and the other end extends to the bottom surface of the accommodating chamber 11, and the rotating pipe section 642 is rotatably mounted on the fixed pipe section 641; a plurality of the liquid inlets 62 are provided on the rotating pipe section 642.

[0088] The liquid inlet pipe 64 disclosed in this embodiment is used to inject plating solution. A fixed pipe section 641 is secured to the bottom surface of the accommodating chamber 11 by welding, gluing, or screwing, thereby maintaining stability. A rotating pipe section 642 is rotatably mounted on the fixed pipe section 641, allowing the plating solution to flow through the fixed pipe section 641 into the rotating pipe section 642 and ultimately be ejected from the liquid inlet 62. In particular, rotating the rotating pipe section 642 adjusts the direction of liquid discharge from the liquid inlet 62, thereby adjusting the angle between the liquid inlet 62 and the surface of the glass substrate. This facilitates direct injection of the plating solution toward the through-holes in the glass substrate, further increasing the probability of the plating solution filling the through-holes and achieving a better deposition effect of the plating layer in the through-holes.

[0089] For example Figure 7 As shown, as another embodiment of the present application, it is disclosed that the fixed pipe section 641 includes an inner ring 6411 and an outer ring 6412, and the inner ring 6411 and the outer ring 6412 are concentrically arranged on the bottom surface of the accommodating cavity 11; the rotating pipe section 642 includes a plurality of inner tubes 6421 and a plurality of outer tubes 6422, and the plurality of inner tubes 6421 are arranged in a ring shape on the inner ring 6411; the plurality of outer tubes 6422 are arranged in a ring shape on the outer ring 6412; and the inner tubes 6421 and the outer tubes 6422 both extend along the depth direction of the accommodating cavity 11; the hanging basket 40 is located between the inner tube 6421 and the outer tube 6422; at least one liquid inlet 62 is provided on the side of the inner tube 6421 facing the outer tube 6422; at least one liquid inlet 62 is provided on the side of the outer tube 6422 facing the inner tube 6421.

[0090] In this embodiment, a double-layer structure is formed by providing an inner ring 6411 and an outer ring 6412, and a two-layer annular structure is formed by a plurality of inner tubes 6421 and a plurality of outer tubes 6422, so that the hanging basket 40 is "sandwiched" in the middle. The plating solution can be sprayed simultaneously from both sides of the hanging basket 40, thereby increasing the direct jet effect on the surface of the glass substrate, thereby increasing the contact time between the plating solution and the surface of the glass substrate, which is conducive to rapid deposition and improved processing efficiency.

[0091] The inner ring 6411 and the outer ring 6412 disclosed in this embodiment can be connected through a connecting pipe. When the plating solution flows in, the pressure of the liquid inlet 62 on the inner ring 6411 and the liquid inlet 62 on the outer ring 6412 are the same, so the impact force on the hanging basket 40 is the same, which can reduce the risk of the hanging basket 40 being pushed sideways and improve the stability during the processing.

[0092] Specifically, in this embodiment, the inner tube 6421 and the outer tube 6422 both extend along the depth direction of the accommodating cavity 11. Preferably, multiple liquid inlets 62 can be set along the length direction of the inner tube 6421, and multiple liquid inlets 62 can also be set along the length direction of the outer tube 6422, so that the flow of the plating solution in the accommodating cavity 11 is more uniform, and the plating solution flows as a whole, which can further increase the contact probability between the plating solution and the surface of the glass substrate and improve the deposition efficiency.

[0093] like Figure 6 As shown, as another embodiment of the present application, the hanging basket 40 is disclosed to include a hanging plate 41, a hanging ring 42, a plurality of support rods 43 and a plurality of clamps 44. The hanging ring 42 is provided on the hanging plate 41 for sleeved on the hook 30; a plurality of the support rods 43 are provided in a ring array on the hanging plate 41; the support rods 43 are inserted between the inner tube 6421 and the outer tube 6422; a plurality of the clamps 44 are provided on the support rods 43; and the clamps 44 are used to clamp the glass substrate.

[0094] The hanging basket 40 disclosed in this embodiment is a separate structure, which can be detachably assembled with the hook 30 through the hanging ring 42, so it is flexible to use. The glass substrate to be processed can be fixed on the clamp 44 first, and then the hanging basket 40 can be hung on the hook 30, making the disassembly and assembly operations more convenient.

[0095] Specifically, a plurality of support rods 43 are provided, and a plurality of clamps 44 are provided on the support rods 43 , so that the hanging basket 40 can clamp glass substrates in batches, which is beneficial to batch processing of glass substrates and improves processing efficiency.

[0096] like Figure 2 and Figure 5As shown, as another embodiment of the present application, the jet component 70 is disclosed to include an air pump 71 and a jet bracket 72, and the air pump 71 is electrically connected to the control component; one end of the jet bracket 72 is connected to the air pump 71, and the other end is arranged on the bottom surface of the accommodating cavity 11; a plurality of air outlet holes 721 are arranged on the jet bracket 72 toward the hanging basket 40.

[0097] The air pump 71 disclosed in this embodiment is an electric air pump, such as a micro diaphragm pump, a piston air pump, or a rotary vane pump. Air is blown into the air jet bracket 72 by the air pump 71, and the air outlet 721 of the air jet bracket 72 blows air toward the hanging basket 40, thereby further increasing the flow rate of the plating solution around the hanging basket 40 and further improving the contact probability between the plating solution and the surface of the glass substrate. The air jet bracket 72 is arranged on the bottom surface of the accommodating chamber 11, and the air outlet 721 sprays air upward, which can not only push the plating solution at the bottom of the accommodating chamber 11 and improve the uniformity of the plating solution flow; but also avoid blowing air to the bottom surface of the accommodating chamber 11, reducing the probability of impurities or sediments at the bottom of the accommodating chamber 11 being blown away.

[0098] Specifically, as another embodiment of the present application, the vibrating component 80 is disclosed as comprising any one of an ultrasonic generator, a vibration generator, a magnetic oscillator, and a desktop oscillator. Because a chemical reaction occurs during the spontaneous precipitation process, bubbles may be present on the surface of the glass substrate. Furthermore, the jetting component 70 injects air into the plating solution, which may also cause bubbles to adhere to the surface of the glass substrate. Therefore, the vibrating component 80 is provided to excite the hanging basket 40 through ultrasound, magnetic force, or mechanical propulsion, causing the hanging basket 40 to vibrate at a high frequency and a small amplitude, thereby dispersing the bubbles and ensuring more complete contact between the plating solution and the surface of the glass substrate.

[0099] like Figure 8 As shown, as another embodiment of the present application, a chemical plating method is also disclosed, which is applied to any of the chemical plating equipment for TGV processing as described above, wherein the chemical plating method includes:

[0100] Step S10, determining processing conditions;

[0101] Step S20, pre-treating the plating solution in the plating pool 10 based on the processing conditions; wherein the pre-treating comprises one or more of adjusting the plating solution temperature, adjusting the plating solution flow rate, and adjusting the gas injection rate;

[0102] Step S30: Immerse the glass substrate to be processed in the pre-treated plating solution and rotate the glass substrate at a speed of 1-20 revolutions per minute; at the same time, under the excitation of the vibration component 80, excite the glass substrate at a frequency of once every 3-10 minutes;

[0103] Step S40: After soaking for a predetermined time, stop the rotation and take out the glass substrate to complete the chemical plating process; wherein the predetermined time is 30-120 minutes.

[0104] The electroless plating method disclosed in this embodiment is applied to an electroless plating device. Different processing conditions can be determined based on parameters such as the size of the glass substrate being processed, the diameter of the through-holes, and the density of the through-holes. For example, on a glass substrate with a small through-hole diameter and a high through-hole density, the plating solution needs to flow more rapidly to fully contact the glass substrate, increasing the probability of the plating solution entering the through-holes and improving the quality of the coating. Therefore, the processing conditions include, but are not limited to, controllable parameters such as the plating solution temperature, the plating solution flow rate, the rotation speed of the hanging basket 40, and the gas injection rate, which are determined based on the glass substrate being processed.

[0105] In this embodiment, by simultaneously controlling multiple processing parameters such as the rotation speed of the hanging basket 40, the plating solution temperature, the plating solution flow rate, the gas injection speed, and the excitation frequency of the hanging basket 40, the contact time and contact area between the plating solution and the glass substrate can be increased, thereby improving the quality of the final product, improving the uniformity of the coating, and reducing plating leakage.

[0106] In some embodiments, a terminal is provided, whose internal structure diagram can be as follows: Figure 9 As shown. The terminal includes a processor, a memory, an input / output interface, a communication interface, a display unit and an input device. The processor, the memory and the input / output interface are connected via a system bus, and the communication interface, the display unit and the input device are connected to the system bus via the input / output interface. The processor of the terminal is used to provide computing and control capabilities. The memory of the terminal includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The input / output interface of the terminal is used to exchange information between the processor and an external device. The communication interface of the terminal is used to communicate with an external terminal in a wired or wireless manner, and the wireless manner can be implemented through WIFI, a mobile cellular network, NFC (near field communication) or other technologies. When the computer program is executed by the processor, the above-mentioned chemical plating method is implemented. The display unit of the terminal is used to form a visually visible image, and can be a display screen, a projection device or a virtual reality imaging device. The display screen can be a liquid crystal display screen or an electronic ink display screen. The input device of the terminal can be a touch layer covering the display screen, or a button, trackball or touchpad set on the terminal housing, or an external keyboard, touchpad or mouse, etc.

[0107] Those skilled in the art will understand that Figure 9The structure shown in the figure is only a block diagram of a part of the structure related to the solution of the present invention, and does not constitute a limitation on the terminal to which the solution of the present invention is applied. The specific terminal may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0108] In some embodiments, a terminal is provided, including a memory and a processor, wherein a computer program is stored in the memory, and the processor implements the steps of the chemical plating method described above when executing the computer program.

[0109] Those skilled in the art will understand that all or part of the processes in the above-mentioned embodiment methods can be implemented by instructing related hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods.

[0110] Any reference to memory, database, or other media used in the various embodiments provided herein may include at least one of non-volatile and volatile memory. Non-volatile memory may include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical storage, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, and the like. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM may be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0111] The database involved in each embodiment provided by the present invention may include at least one of a relational database and a non-relational database. Non-relational databases may include, but are not limited to, distributed databases based on blockchain. The processor involved in each embodiment provided by the present invention may be, but is not limited to, a general-purpose processor, a central processing unit, a graphics processing unit, a digital signal processor, a programmable logic unit, a data processing logic unit based on quantum computing, etc.

[0112] In summary, the present application discloses a chemical plating equipment for TGV processing, which includes a plating tank, a driving component, a hook, a hanging basket, a heating component, a plating solution circulation component, an air injection component, a vibration component and a control component. The plating tank has a accommodating chamber with a top opening; the accommodating chamber is used to accommodate the chemical plating solution; the driving component is arranged above the plating tank; one end of the hook is connected to the driving component, and the other end extends toward the accommodating chamber; the driving component is used to drive the hook to rotate and lift; the hanging basket is hung on the hook and at least partially extends into the accommodating chamber, and the hanging basket is used to accommodate the liquid to be treated. The glass substrate is processed; the heating component is arranged around the accommodating cavity, and is used to heat the chemical plating solution in the accommodating cavity; the plating solution circulation component has a liquid outlet and a liquid inlet, and the liquid outlet and the liquid inlet are both connected to the accommodating cavity; and the liquid inlet is arranged toward the hanging basket to spray the plating solution toward the hanging basket; the jet component is inserted into the accommodating cavity, and is used to spray the solution toward the hanging basket; the vibration component is arranged on the plating tank, and is used to excite the hanging basket to vibrate; the control component is electrically connected to the driving component, the heating component, the plating solution circulation component, the jet component, and the vibration component. The chemical plating equipment disclosed in this embodiment improves the uniformity of the coating on the glass substrate and reduces the problem of plating leakage by increasing the contact time and contact area between the glass substrate and the plating solution.

[0113] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0114] It should be noted that the present invention uses the chemical plating equipment and chemical plating method for TGV processing as an example to introduce the specific structure and working principle of the present invention, but the application of the present invention is not limited to the chemical plating equipment and chemical plating method for TGV processing, and can also be applied to the production and use of other similar workpieces.

[0115] It should be understood that the present invention is not limited to the exact construction described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.

[0116] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chemical plating equipment for TGV processing, characterized in that: include: The plating tank has a receiving cavity with an open top; the receiving cavity is used to receive the chemical plating solution; A driving component is arranged above the plating tank; A hook, one end of which is connected to the driving component and the other end of which extends toward the accommodating cavity; wherein the driving component is used to drive the hook to rotate and lift; a hanging basket, hung on the hook and at least partially extending into the accommodating cavity, the hanging basket being used to accommodate the glass substrate to be processed; a heating component, disposed around the accommodating cavity and used for heating the chemical plating solution in the accommodating cavity; a plating solution circulation component having a liquid outlet and a liquid inlet, wherein both the liquid outlet and the liquid inlet are connected to the accommodating cavity; and the liquid inlet is arranged toward the hanging basket to spray the plating solution toward the hanging basket; An air jet component is inserted into the accommodating cavity and is used to spray air toward the hanging basket; A vibration component, provided on the plating tank, for exciting the hanging basket to vibrate; a control component electrically connected to the driving component, the heating component, the plating solution circulation component, the air-jet component, and the vibration component; The plating pool comprises an outer cylinder and an inner cylinder which are nested, and an interlayer space is formed between the outer cylinder and the inner cylinder; The heating component includes a heat exchanger and a heating pipe, the heating pipe is connected to the outer cylinder and is arranged in the interlayer space in a spiral, ring or serpentine shape; the heat exchanger is in communication with the heating pipe; and the heat exchanger is electrically connected to the control component; The plating solution circulation component includes a liquid outlet pipe for conducting the plating solution, a liquid inlet pipe for introducing the plating solution, and a flow meter, a filter and a negative pressure pump sequentially arranged between the liquid outlet pipe and the liquid inlet pipe; Wherein, the liquid outlet is provided on the liquid outlet pipe, and the liquid inlet is provided on the liquid inlet pipe; the flow meter and the negative pressure pump are both electrically connected to the control component; The liquid inlet pipe includes a fixed pipe section and a rotating pipe section, one end of the fixed pipe section is connected to the negative pressure pump, and the other end extends to the bottom surface of the accommodating chamber, and the rotating pipe section is rotatably sleeved on the fixed pipe section; The rotating pipe section is provided with a plurality of liquid inlets; The fixed pipe section includes an inner ring and an outer ring, and the inner ring and the outer ring are concentrically arranged on the bottom surface of the accommodating cavity; The rotating tube section includes a plurality of inner tubes and a plurality of outer tubes, wherein the plurality of inner tubes are arranged in a ring shape on the inner ring; and the plurality of outer tubes are arranged in a ring shape on the outer ring; and both the inner tubes and the outer tubes extend along the depth direction of the accommodating cavity; The hanging basket is located between the inner tube and the outer tube; at least one liquid inlet is provided on a side of the inner tube facing the outer tube; and at least one liquid inlet is provided on a side of the outer tube facing the inner tube.

2. The chemical plating equipment for TGV processing according to claim 1, characterized in that: The driving component includes: A machine platform, located above the plating pool; A guide rail is vertically arranged on the machine platform; a lifting slide, slidably disposed on the guide rail; A lifting motor is provided on the guide rail and is in transmission connection with the lifting slide; A rotating motor is provided on the lifting slide; the output shaft of the rotating motor is connected to the hook via a coupling; Wherein, the output shaft of the rotating motor is vertically downward and points to the plating pool; the lifting motor and the rotating motor are both electrically connected to the control component.

3. The chemical plating equipment for TGV processing according to claim 1, characterized in that: The hanging basket comprises: hanging board; A hanging ring, provided on the hanging plate, for sleeve-engaging the hook; A plurality of support rods are arranged on the hanging plate in a ring array; the support rods are inserted between the inner tube and the outer tube; A plurality of clamps are arranged on the support rods; the clamps are used to clamp the glass substrate.

4. The chemical plating equipment for TGV processing according to claim 1, characterized in that: The jetting components include: an air pump electrically connected to the control component; an air jet bracket, one end of which is connected to the air pump and the other end of which is arranged on the bottom surface of the accommodating cavity; Wherein, a plurality of air outlet holes are provided on the air jet support toward the hanging basket.

5. The chemical plating equipment for TGV processing according to claim 1, characterized in that: The vibration component includes any one of an ultrasonic generator, a vibration generator, a magnetic oscillator, and a desktop oscillator.

6. A chemical plating method, applied to the chemical plating equipment for TGV processing according to any one of claims 1 to 5, characterized in that: The chemical plating method comprises: Determine processing conditions; Pre-treating the plating solution in the plating pool based on the processing conditions; wherein the pre-treatment includes one or more of adjusting the plating solution temperature, adjusting the plating solution flow rate, and adjusting the gas injection rate; Immersing the glass substrate to be processed in the pre-treated plating solution, rotating the glass substrate at a speed of 1-20 revolutions per minute; and simultaneously, stimulating the glass substrate at a frequency of once every 3-10 minutes under the excitation of a vibrating component; After soaking for a predetermined time, the rotation is stopped and the glass substrate is taken out to complete the chemical plating process; wherein the predetermined time is 30-120 minutes.

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