IC tray plane warping detection platform applied to IC detection equipment

Abstract

The invention provides an IC tray plane warping detection platform applied to IC detection equipment, which enables the detection to be efficient, is high in detection precision, and ensures that the quality control is stable and reliable. The machine table comprises a machine table large plate; the transmission mechanism comprises a front end detection conveying part, a rear end transfer conveying part and a lifting mechanism; a detection platform mechanism; and a blocking positioning mechanism. A front end detection conveying part of the transmission mechanism is arranged in a front cavity area of the machine table large plate, a pair of vertical stand columns B are arranged on the outer portions of the two sides, corresponding to the front end detection conveying part, of the machine table large plate, and the two ends, in the length direction, of a transverse connecting frame of the blocking and positioning mechanism are fixedly connected to the stand columns B respectively. An air cylinder adjusting plate is fixedly arranged on the transverse connecting frame, the air cylinder adjusting plate is arranged perpendicular to the transverse connecting frame, and the two ends of the air cylinder adjusting plate in the length direction are respectively provided with a material blocking assembly which is arranged downwards.

Description

Technical Field

[0001] The present invention relates to the technical field of the semiconductor industry, and in particular to an IC tray plane warping detection platform used in IC testing equipment. Background Art

[0002] In the semiconductor industry, IC tray warpage detection is an essential step in ensuring high production yields, high quality, and stable ICs during testing and packaging. Because IC trays undergo multiple processing steps, such as ovens and robotic gripping, they can suffer varying degrees of damage. Warpage can lead to inaccurate positioning during robotic gripping in subsequent processes, significantly increasing the chance of chip damage. Therefore, it's necessary to detect the degree of warpage in the IC tray's surface to eliminate unqualified trays and ensure stable operation in subsequent processes.

[0003] Currently, IC tray warpage inspection still uses a traditional manual method. This involves placing the IC tray on a standard horizontal surface and manually inserting a feeler gauge into the gap between the IC tray and the horizontal surface. If the gauge fits easily into the gap, the IC tray is deemed unqualified; otherwise, it passes. This traditional manual inspection method is cumbersome, inefficient, and prone to misjudgment. It also requires a large number of personnel, resulting in high costs, labor intensity, and unstable quality control. Summary of the Invention

[0004] In response to the above problems, the present invention provides an IC tray plane warpage detection platform for IC testing equipment, which makes the detection efficient and accurate, ensuring stable and reliable quality control.

[0005] An IC tray plane warpage detection platform for IC testing equipment, characterized in that it comprises:

[0006] Machine plate;

[0007] The transmission mechanism includes a front-end detection and conveying part and a rear-end transfer and conveying part.

[0008] Lifting mechanism;

[0009] Testing platform organization;

[0010] and a blocking positioning mechanism;

[0011] The front-end detection and conveying part of the transmission mechanism is arranged in the front cavity area of ​​the machine plate, and a pair of vertical columns B are arranged on the outside of the machine plate corresponding to both sides of the front-end detection and conveying part. The two ends of the transverse connecting frame of the blocking and positioning mechanism in the length direction are respectively fixed to the columns B, and a cylinder adjustment plate is fixed on the transverse connecting frame. The cylinder adjustment plate is arranged perpendicular to the transverse connecting frame, and the two ends of the length direction of the cylinder adjustment plate are respectively provided with downwardly arranged blocking components. The detection platform mechanism is connected to the lifting mechanism, and the lifting mechanism drives the detection platform mechanism to lift and lower the entire mechanism. In the rising state, the detection platform mechanism drives the IC tray to be detected to separate from the conveying part of the front-end detection and conveying part. The detection platform mechanism is arranged with a corresponding sensor group for detection, and the sensor group detects the warping state of the IC tray. Whether the detection is qualified or unqualified, the data is uploaded and the IC tray is sorted and placed after being transferred through the rear-end transfer and conveying part.

[0012] It is further characterized by:

[0013] The transmission mechanism includes round belts arranged on both sides of the front detection and conveying part, the round belts are connected to the rear transfer and conveying part, and the transmission mechanism also includes a power part and a transmission part;

[0014] The transmission mechanism is further provided with a pair of convex guide plates on both sides corresponding to the front end detection and conveying part, and the pair of guide plates guide the IC tray into the conveying range of the round belts on both sides of the front end detection and conveying part;

[0015] The pallet assembly of the detection platform mechanism is divided into platform pallet A, platform pallet B, and platform pallet C by two sets of round belts. The bottoms of platform pallet A, platform pallet B, and platform pallet C are connected by a platform bottom plate and surrounding panels. The surrounding panels are provided with avoidance grooves corresponding to the travel positions of the round belts. The height of the avoidance grooves allows the pallet assembly of the detection platform mechanism to be raised into position and the IC tray to be separated from the round belts.

[0016] The upper surface of the support plate assembly of the detection platform mechanism is surrounded by a fixed cross-piece assembly, a fixed side-piece assembly, a horizontal auxiliary positioning mechanism, and a vertical auxiliary positioning mechanism. The fixed cross-piece assembly and the horizontal auxiliary positioning mechanism are arranged opposite to each other. The horizontal auxiliary positioning mechanism pushes the IC tray toward the fixed cross-piece assembly to complete the horizontal position fixation. The fixed side-piece assembly and the vertical auxiliary positioning mechanism are arranged opposite to each other. The vertical auxiliary positioning mechanism pushes the IC tray toward the fixed side-piece assembly to complete the vertical position fixation. This allows the detection platform mechanism to reliably adjust the position of the IC tray in a slightly deviated state, ensuring stable, accurate and reliable detection of the plane warping area of ​​the IC tray.

[0017] The lateral auxiliary positioning mechanism is arranged at the front middle portion of the support plate assembly of the detection platform mechanism. The bottom of the lateral auxiliary positioning connecting plate of the lateral auxiliary positioning mechanism is fixedly connected to the platform bottom plate. The upper end of the lateral auxiliary positioning connecting plate is provided with a lateral fine-tuning component, which is used to drive the lateral position fine-tuning movement of the IC tray.

[0018] The vertical auxiliary positioning mechanism is arranged at one side of the support plate assembly of the detection platform mechanism. The bottom of the vertical auxiliary positioning connecting plate of the vertical auxiliary positioning mechanism is fixedly connected to the platform bottom plate. The upper end of the vertical auxiliary positioning connecting plate is provided with a vertical fine-tuning component, and the vertical fine-tuning component is used to drive the vertical position fine-tuning movement of the IC tray.

[0019] The center area of ​​the platform support plate B in the middle is hollowed out and is equipped with a photoelectric sensor A for detecting the presence of the IC tray. A photoelectric sensor B for detecting whether the IC tray has fallen is set at a corner of the platform support plate on the side. The surface area of ​​the platform bottom plate is arranged with several ranging sensors, and the corresponding platform support plates are provided with avoidance holes, which enable the ranging sensors to reliably and accurately detect the flatness of the IC tray.

[0020] The blocking and positioning mechanism includes a transverse connecting frame, a cylinder adjustment plate, and two sets of blocking components. The front end of the cylinder adjustment plate in the longitudinal direction is fixedly provided with a first blocking cylinder, and the lower output end of the first blocking cylinder is provided with a blocking plate A. The rear end of the cylinder adjustment plate in the longitudinal direction is fixedly provided with a second blocking cylinder, and the lower output end of the second blocking cylinder is provided with a blocking plate B, a sensor adjustment plate, a proximity sensor fixing plate, and a proximity sensor;

[0021] The lifting mechanism is fixedly connected to the two side columns A of the lower front end of the machine plate through connecting parts. The output end of the lifting module of the lifting mechanism is fixedly connected to the platform lifting connecting plate, and the platform lifting connecting plate is fixedly connected to the platform bottom plate.

[0022] After adopting the above technical solution, the IC tray is sent to the front-end detection and conveying part after chip omission detection, and the conveying position of the front-end detection and conveying part is stopped by the blocking and positioning mechanism. The IC tray is conveyed to the position, and then the lifting mechanism drives the detection platform mechanism to rise. In the rising state, the detection platform mechanism drives the IC tray to be detected to separate from the conveying part of the front-end detection and conveying part. The detection platform mechanism is arranged with a corresponding sensor group for detection. The sensor group detects the warping state of the IC tray. Whether the detection is qualified or unqualified, the data is uploaded and the IC tray is sorted and placed after being transferred through the back-end transfer and conveying part. This makes the detection efficient and accurate, ensuring stable and reliable quality control. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional schematic diagram of the transmission mechanism of the present invention;

[0024] Figure 2 It is a three-dimensional schematic diagram of the lifting mechanism of the present invention;

[0025] Figure 3 This is a three-dimensional schematic diagram of the detection platform mechanism of the present invention Figure 1 (Remove the horizontal auxiliary positioning mechanism and the vertical auxiliary positioning mechanism);

[0026] Figure 4 This is a three-dimensional schematic diagram of the detection platform mechanism of the present invention Figure 2 ;

[0027] Figure 5 is a three-dimensional schematic diagram of the lateral auxiliary positioning mechanism of the present invention;

[0028] Figure 6 is a three-dimensional schematic diagram of the vertical auxiliary positioning mechanism of the present invention;

[0029] Figure 7 is a three-dimensional schematic diagram of the blocking and positioning mechanism of the present invention;

[0030] Figure 8 It is a three-dimensional schematic diagram of the overall structure of the present invention;

[0031] The names corresponding to the serial numbers in the figure are as follows:

[0032] Photoelectric sensor A1, photoelectric sensor B2, ranging sensor 3;

[0033] Machine plate 100, front cavity area 101, column B 102, column A 103, transmission mechanism 200, front end detection and conveying part 201, rear end transfer and conveying part 202, round belt 203, guide plate 204, power part 205, transmission part 206, lifting mechanism 300, connecting part 301, lifting module 302, platform lifting connecting plate 303, drive motor 304, detection platform mechanism 400, platform pallet A 401, platform pallet B 402, platform pallet C 403, platform bottom plate 404, surrounding panels 405, avoidance groove 406, fixed cross block assembly 407, fixed side block assembly 408, lateral auxiliary positioning mechanism 409, lateral auxiliary positioning connecting plate 4091, first cylinder 4092, first cylinder connecting plate 4093, first cylinder push plate A 409 4. First horizontal positioning push plate 4095, first oil-free bushing 4096, first positioning push shaft 4097, first spring 4098, first retaining spring 4099, vertical auxiliary positioning mechanism 410, vertical auxiliary positioning connecting plate 4101, second cylinder 4102, cylinder push plate B4103, second vertical positioning push plate 4104, second oil-free bushing 4105, second positioning push shaft 4106, second spring 4107, second retaining spring 4108, component connecting plate 411, blocking positioning mechanism 500, horizontal connecting frame 501, cylinder adjustment plate 502, first material blocking cylinder 503, material blocking plate A504, second material blocking cylinder 505, material blocking plate B506, sensor adjustment plate 507, proximity sensor fixing plate 508, proximity sensor 509. DETAILED DESCRIPTION

[0034] An IC tray warpage detection platform for IC testing equipment, see Figures 1-8 , which includes: a machine plate 100, a transmission mechanism 200, a lifting mechanism 300, a detection platform mechanism 400, and a blocking and positioning mechanism 500;

[0035] The machine plate 100 has a front cavity area 101, and the transmission mechanism 200 includes a front detection and conveying part 201 and a rear transfer and conveying part 202.

[0036] The front-end detection and conveying part 201 is arranged in the front cavity area 101 of the machine plate 100. A pair of vertical columns B102 are arranged on the outside of the machine plate 100 corresponding to both sides of the front-end detection and conveying part 201. The two ends of the horizontal connecting frame 501 of the blocking positioning mechanism 500 in the length direction are respectively fixed to the columns B102. A cylinder adjustment plate 502 is fixed on the horizontal connecting frame 501. The cylinder adjustment plate 502 is arranged perpendicular to the horizontal connecting frame 501. The two ends of the length direction of the cylinder adjustment plate 502 are respectively provided with downwardly arranged blocking components. The detection platform mechanism 400 is connected to the lifting mechanism 300. The lifting mechanism 300 drives the detection platform mechanism 400 to lift and lower as a whole. In the rising state, the detection platform mechanism 400 drives the IC tray to be detected (not shown in the figure) to separate from the conveying part of the front-end detection and conveying part 201. The detection platform mechanism 400 is arranged with a corresponding sensor group for detection. The sensor group detects the IC The tray is inspected for warping status, and data is uploaded whether it is qualified or unqualified, and the tray is transported through the back-end transport and sorted and placed.

[0037] In a specific embodiment, the transmission mechanism 200 includes round belts 203 arranged on both sides of the front detection and conveying section. The round belts 203 are connected to the rear transfer and conveying section 202. The transmission mechanism 200 also includes a power section 205 and a transmission section 206. The power section 205 transmits power to the front detection and conveying section 201 and the rear transfer and conveying section 202 through the transmission section 206.

[0038] A pair of protruding guide plates 204 are provided on both sides of the transmission mechanism corresponding to the front detection and conveying portion. The pair of guide plates 204 guide the IC tray into the conveying range of the round belts 203 on both sides of the front detection and conveying portion 201.

[0039] The pallet assembly of the inspection platform mechanism 400 is divided into platform pallet A401, platform pallet B402, and platform pallet C403 by two sets of round belts 203. The bottoms of platform pallets A401, B402, and C403 are connected by a platform base plate 404 and surrounding panels 405. The surrounding panels 405 are provided with escape grooves 406 corresponding to the travel positions of the round belts. The height of the escape grooves 406 ensures that the pallet assembly of the inspection platform mechanism 400 is raised into position and the IC tray is separated from the round belts 203.

[0040] The upper surface of the pallet assembly of the inspection platform mechanism 400 is surrounded by a fixed crossbar assembly 407, a fixed sidebar assembly 408, a transverse auxiliary positioning mechanism 409, and a vertical auxiliary positioning mechanism 410. The fixed crossbar assembly 407 and the transverse auxiliary positioning mechanism 409 are arranged opposite each other. The transverse auxiliary positioning mechanism 409 pushes the IC tray toward the fixed crossbar assembly 407 to achieve transverse position fixation. The fixed sidebar assembly 408 and the vertical auxiliary positioning mechanism 410 are arranged opposite each other. The vertical auxiliary positioning mechanism 410 pushes the IC tray toward the fixed sidebar assembly 408 to achieve vertical position fixation. This allows the inspection platform mechanism 400 to reliably adjust the position of the IC tray in a slightly deviated state, ensuring stable, accurate and reliable detection of the planar warped area of ​​the IC tray.

[0041] The lateral auxiliary positioning mechanism 409 is disposed at the front center of the support plate assembly of the inspection platform mechanism 400. The bottom of the lateral auxiliary positioning connecting plate 4091 of the lateral auxiliary positioning mechanism 409 is fixedly connected to the platform base plate 404. The upper end of the lateral auxiliary positioning connecting plate 4091 is provided with a lateral fine-tuning assembly for driving the lateral position fine-tuning movement of the IC tray. In specific implementation, the lateral fine-tuning assembly includes a first cylinder 4092, a first cylinder connecting plate 4093, a first cylinder push plate A4094, a first lateral positioning push plate 4095, a first oil-free bushing 4096, a first positioning push shaft 4097, a first spring 4098, and a first retaining spring 4099.

[0042] The vertical auxiliary positioning mechanism 410 is arranged at one side of the support plate assembly of the detection platform mechanism 400. The bottom of the vertical auxiliary positioning connecting plate 4101 of the vertical auxiliary positioning mechanism 410 is fixedly connected to the platform base plate 404. The upper end of the vertical auxiliary positioning connecting plate 4101 is provided with a vertical fine-tuning component, which is used to drive the vertical position fine-tuning movement of the IC tray. The vertical fine-tuning component includes a second cylinder 4102, a cylinder push plate B4103, a second vertical positioning push plate 4104, a second oil-free bushing 4105, a second positioning push shaft 4106, a second spring 4107, and a second retaining spring 4108.

[0043] During specific implementation, the central area of ​​the platform pallet B402 located in the middle is hollowed out and is arranged with two photoelectric sensors A1 for detecting the presence of the IC tray. A photoelectric sensor B2 for detecting whether it has fallen completely and reliably in the height direction is set at a corner of the platform pallet located on the side. Ten ranging sensors 3 are arranged on the surface of the platform base plate 404, and avoidance holes are set on the corresponding platform pallets, which enable the ranging sensors 3 to be used to reliably and accurately detect the plane state of the IC tray.

[0044] During specific implementation, the blocking and positioning mechanism 500 includes a transverse connecting frame 501, a cylinder adjustment plate 502, and two groups of material blocking components. The front end of the cylinder adjustment plate 502 in the longitudinal direction is fixedly provided with a first material blocking cylinder 503, and the lower output end of the first material blocking cylinder 503 is provided with a material blocking plate A504. The rear end of the cylinder adjustment plate 502 in the longitudinal direction is fixedly provided with a second material blocking cylinder 505, and the lower output end of the second material blocking cylinder 505 is provided with a material blocking plate B506, a sensor adjustment plate 507, a proximity sensor fixing plate 508, and a proximity sensor 509.

[0045] During specific implementation, the lifting mechanism 300 is fixedly connected to the two side columns A103 of the lower front end of the machine platform 100 through the connecting piece 301, the output end of the lifting module 302 of the lifting mechanism 300 is fixedly connected to the platform lifting connecting plate 303, the platform lifting connecting plate 303 is fixedly connected to the platform bottom plate 404, and a driving motor 304 is arranged under the lifting module 302.

[0046] In a specific embodiment, a component connecting plate 411 for connecting to other mechanisms is also installed at the bottom of the platform base plate, and the horizontal auxiliary positioning connecting plate 4091 and the vertical auxiliary positioning connecting plate 4101 are respectively fixed to the corresponding positions of the component connecting plate 411.

[0047] The working principle is as follows: when the IC tray is transferred to the feed port after chip omission detection, it is first assisted in positioning by a pair of guide plates, limiting the IC tray to the middle position of the conveying track of the front-end detection and conveying part 201, and is transported by the transmission mechanism. The first material blocking cylinder will always be in the initial position, that is, the first material blocking cylinder is in the open state; when the transmission mechanism transfers the IC tray to the position of the material blocking plate B, the proximity sensor will sense that the IC tray has reached the specified position, the transmission mechanism stops transporting, the first material blocking cylinder is closed, and the lifting module will drive the detection platform mechanism to rise, thereby making the IC tray higher than the round belt in the transmission mechanism to ensure that the IC tray does not contact the round belt. The upper edges of the rising detection platform mechanism ensure that the IC tray can accurately fall onto the detection plane formed by the platform's support plate assembly (Note: the flatness error of the side of this plane that contacts the bottom of the IC tray must be guaranteed to be ±0.02㎜). Then, two photoelectric sensors A determine whether there is an IC tray at this position, and photoelectric sensor B determines whether the IC tray has completely fallen down. When it is determined that there is an IC tray on this plane, the IC tray The tray also falls completely. The lateral auxiliary positioning mechanism is used to position the IC tray in the lateral direction, and the vertical auxiliary positioning mechanism is used to position the IC tray in the vertical direction. To avoid abnormal situations caused by auxiliary positioning (i.e., deformation of the IC tray due to excessive positioning force, resulting in false detection), a spring is installed at the positioning push shaft at the end of the positioning to avoid abnormal situations.

[0048] When debugging the IC tray warpage detection platform, a standard flatness template is first used to set the distance origin for each distance measurement sensor. Assuming the origin distance is 30mm, the actual measured distance is subtracted from the set origin distance, and the resulting value is compared with the specified standard value. If any value is greater than the specified standard value, the IC tray is judged to be unqualified.

[0049] When the above conditions are met, the distance sensors at 10 different positions begin to detect. When the distance sensor detection is completed, the horizontal auxiliary positioning mechanism and the vertical auxiliary positioning mechanism will be released, and the lifting module in the lifting mechanism will drive the IC tray to descend. The IC tray will land on the transmission mechanism and be transmitted to the next process. The unqualified IC trays and qualified IC trays determined by the distance sensor detection will be sorted and placed by the back-end workers, and the subsequent IC trays will be inspected back and forth in sequence.

[0050] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

[0051] In addition, it should be understood that although this specification is described in terms of implementation methods, not every implementation method contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art.

Claims

1. An IC tray warpage detection platform for IC testing equipment, characterized in that: It includes: Machine plate; The transmission mechanism includes a front-end detection and conveying part and a rear-end transfer and conveying part. Lifting mechanism; Testing platform organization; and a blocking positioning mechanism; The front-end detection and conveying part of the transmission mechanism is arranged in the front cavity area of ​​the machine plate, and a pair of vertical columns B are arranged on the outside of the machine plate corresponding to both sides of the front-end detection and conveying part. The two ends of the transverse connecting frame of the blocking and positioning mechanism in the length direction are respectively fixed to the columns B, and a cylinder adjustment plate is fixed on the transverse connecting frame. The cylinder adjustment plate is arranged perpendicular to the transverse connecting frame, and the two ends of the length direction of the cylinder adjustment plate are respectively provided with downwardly arranged blocking components. The detection platform mechanism is connected to the lifting mechanism, and the lifting mechanism drives the detection platform mechanism to lift and lower the entire mechanism. In the rising state, the detection platform mechanism drives the IC tray to be detected to separate from the conveying part of the front-end detection and conveying part. The detection platform mechanism is arranged with a corresponding sensor group for detection, and the sensor group detects the warping state of the IC tray. Whether the detection is qualified or unqualified, the data is uploaded and the IC tray is sorted and placed after being transferred through the rear-end transfer and conveying part.

2. The IC tray warpage detection platform for IC testing equipment according to claim 1, characterized in that: The transmission mechanism includes round belts arranged on both sides of the front end detection and conveying part, and the round belts are connected to the rear end transfer and conveying part. The transmission mechanism also includes a power part and a transmission part.

3. The IC tray warpage detection platform for IC testing equipment according to claim 2, characterized in that: The transmission mechanism is further provided with a pair of convex guide plates on both sides corresponding to the front end detection and conveying part, and the pair of guide plates guide the IC tray into the conveying range of the round belts on both sides of the front end detection and conveying part.

4. The IC tray warpage detection platform for IC testing equipment according to claim 2, characterized in that: The pallet assembly of the detection platform mechanism is divided into platform pallet A, platform pallet B, and platform pallet C by two groups of circular belts. The bottoms of the platform pallet A, platform pallet B, and platform pallet C are connected by the platform base plate and the surrounding panels. The surrounding panels are provided with avoidance grooves corresponding to the travel positions of the circular belts. The height of the avoidance grooves allows the pallet assembly of the detection platform mechanism to rise into place and complete the separation of the IC tray and the circular belts.

5. The IC tray warpage detection platform for IC testing equipment according to claim 4, characterized in that: The upper surface of the pallet assembly of the detection platform mechanism is surrounded by a fixed cross-piece assembly, a fixed side-piece assembly, a horizontal auxiliary positioning mechanism, and a vertical auxiliary positioning mechanism. The fixed cross-piece assembly and the horizontal auxiliary positioning mechanism are arranged opposite to each other, and the horizontal auxiliary positioning mechanism pushes the IC tray toward the fixed cross-piece assembly to complete the horizontal position fixation. The fixed side-piece assembly and the vertical auxiliary positioning mechanism are arranged opposite to each other, and the vertical auxiliary positioning mechanism pushes the IC tray toward the fixed side-piece assembly to complete the vertical position fixation.

6. The IC tray warpage detection platform for IC testing equipment according to claim 5, characterized in that: The lateral auxiliary positioning mechanism is arranged at the middle position of the front end of the support plate assembly of the detection platform mechanism, the bottom of the lateral auxiliary positioning connecting plate of the lateral auxiliary positioning mechanism is fixedly connected to the platform bottom plate, and the upper end of the lateral auxiliary positioning connecting plate is provided with a lateral fine-tuning component, and the lateral fine-tuning component is used to drive the lateral position fine-tuning movement of the IC tray.

7. The IC tray warpage detection platform for IC testing equipment according to claim 5, characterized in that: The vertical auxiliary positioning mechanism is arranged at one side of the support plate assembly of the detection platform mechanism, the bottom of the vertical auxiliary positioning connecting plate of the vertical auxiliary positioning mechanism is fixedly connected to the platform bottom plate, and the upper end of the vertical auxiliary positioning connecting plate is provided with a vertical fine-tuning assembly, and the vertical fine-tuning assembly is used to drive the vertical position fine-tuning movement of the IC tray.

8. The IC tray warpage detection platform for IC testing equipment according to claim 5, characterized in that: The central area of ​​the platform pallet B located in the middle is hollowed out and is equipped with a photoelectric sensor A for detecting the presence of an IC tray. A photoelectric sensor B for detecting whether it has fallen is set at a corner of the platform pallet located on the side. Several ranging sensors are arranged on the surface of the platform bottom plate, and avoidance holes are set on the corresponding platform pallets.

9. The IC tray warpage detection platform for IC testing equipment according to claim 1, characterized in that: The blocking and positioning mechanism includes a transverse connecting frame, a cylinder adjustment plate, and two groups of material blocking components. The front end of the cylinder adjustment plate in the longitudinal direction is fixedly provided with a first material blocking cylinder, and the lower output end of the first material blocking cylinder is provided with a material blocking plate A. The rear end of the cylinder adjustment plate in the longitudinal direction is fixedly provided with a second material blocking cylinder, and the lower output end of the second material blocking cylinder is provided with a material blocking plate B, a sensor adjustment plate, a proximity sensor fixing plate, and a proximity sensor.

10. The IC tray plane warpage detection platform for IC testing equipment according to claim 1, characterized in that: The lifting mechanism is fixedly connected to the two side columns A of the lower front end of the machine plate through connecting parts. The output end of the lifting module of the lifting mechanism is fixedly connected to the platform lifting connecting plate, and the platform lifting connecting plate is fixedly connected to the platform bottom plate.

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