Universal type simulation device aging test system
By designing a universal analog device aging test system, the problem of reliability evaluation of electronic components in new energy vehicles in extreme environments has been solved, and early detection of defective chips has been achieved, and the quality and safety of the automobile have been improved.
Patent Information
- Application Number
- CN202510659851.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-21
- Publication Date
- 2025-08-29
AI Technical Summary
In the field of new energy vehicles, electronic components are prone to early failure or performance degradation in extreme environments, and existing testing methods are difficult to comprehensively evaluate their reliability, especially the random failure of chips has a significant impact on vehicle performance and safety.
A general-purpose aging test system for simulation devices is designed, consisting of a top computer and a lower computer, including a main control computer, an aging power supply, a high-temperature test chamber, a graphic driver board and an aging board. Aging test is performed by simulating the actual use environment, and data analysis and fault diagnosis are performed in combination with a life prediction module.
By discovering and eliminating defective chips in advance, we can improve the overall quality of new energy vehicles, extend the service life of the vehicle, reduce maintenance costs, and improve user satisfaction and brand competitiveness.
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Figure CN120559348A_ABST
Abstract
Description
Technical Field
[0001] The invention discloses an aging test system, belongs to the technical field of universal analog devices, and particularly relates to a universal analog device aging test system. Background Art
[0002] With the rapid development of electronic technology, the reliability requirements for complete equipment are becoming increasingly stringent. Screening electronic components before official use is essential. Various electronic components, including diodes, transistors, and integrated circuits, often fail during normal operation due to manufacturing defects and other factors, affecting the reliability of the entire equipment. Therefore, it is extremely important to conduct reliability tests on a batch of components before use.
[0003] The failure phenomenon of electronic components can be divided into early failure, random failure and wear-out failure. The failure rate varies depending on the working stage (power stress time). Figure 1 It shows the relationship between each working stage and failure rate.
[0004] This demand is particularly acute in the new energy vehicle sector. New energy vehicles rely on advanced electronic control systems and high-energy-density battery technology. The reliability of these systems and components is directly related to vehicle safety and performance. For example, the battery management system (BMS) in electric vehicles requires highly reliable electronic components to ensure stable operation and extend the life of the battery pack. Furthermore, key components such as motor controllers, onboard chargers, and DC / DC converters also undergo rigorous screening and reliability testing to ensure stable operation under various operating conditions.
[0005] New energy vehicle manufacturers typically use methods such as high-temperature aging testing, temperature cycling testing, and vibration and shock testing to assess the reliability of electronic components. These tests simulate the extreme environments and conditions a vehicle might encounter in real-world use, ensuring that components do not experience premature failure or performance degradation under these conditions. These tests enable manufacturers to identify qualified components, thereby improving the reliability and safety of the entire new energy vehicle system.
[0006] The chip's service life is the period during which the chip failure rate stabilizes. Failures that occur during this period are typically random and unpredictable. In new energy vehicles, random chip failures can impact vehicle performance, such as key functions like powertrain control, battery management system (BMS), and in-vehicle infotainment systems. Therefore, extremely high chip reliability requirements are required to ensure vehicle safety and performance.
[0007] After a certain period of operation, chips begin to degrade and their failure rates increase again, marking the beginning of their wear-out period. In new energy vehicles, this can be due to material aging and wear caused by prolonged operation of the chip under harsh conditions such as high temperature, high voltage, or high current. For example, chips in battery management systems may experience performance degradation due to prolonged monitoring of battery status.
[0008] In the new energy vehicle sector, chip applications follow the same general principles as electronic products, but with their own unique environments and requirements. Chips in new energy vehicles must operate stably under extreme conditions of temperature, humidity, vibration, and electromagnetic interference, placing even higher demands on chip quality and reliability. Therefore, comprehensive testing of the aging performance and lifespan of general-purpose analog components for new energy vehicles is necessary to ensure their safety and stability. Summary of the Invention
[0009] Purpose of the invention: To provide a universal analog device aging test system to solve the above-mentioned problems.
[0010] Technical solution: A universal analog device aging test system, the aging test system consists of a host computer and a slave computer, the host computer and the slave computer are connected through a switch;
[0011] The host computer is composed of a main control computer;
[0012] The lower computer consists of an aging power supply, a high temperature test chamber, a graphics driver board, an auxiliary power supply and an aging board; the aging power supply, the graphics driver board, the auxiliary power supply and the aging board are installed in the high temperature test chamber;
[0013] The aging power supply is connected to the graphic driver board to provide an aging test voltage therefor, the auxiliary power supply is connected to the graphic driver board to provide an operating voltage therefor, and the aging board is connected to the graphic driver board and is used to fix the aging device.
[0014] In a further embodiment, the main control computer detects, displays, and records test parameters, automatically records parameters according to the set recording time, and records the operating status of the query system during operation, including the operating status of the test system and the status of the test device. Through query analysis, it distinguishes between faults caused by system reasons and faults caused by device reasons, as well as the time and status of the fault when the fault occurs.
[0015] In a further embodiment, the graphic driver board provides an aging interface, controls the working state of the aged device, completes data acquisition, processing and storage, and transmits data and various states detected during the aging process to the main control computer; the graphic driver board is provided with a plurality of boards, and each graphic driver board communicates independently with the main control computer. Each graphic driver board independently controls the test, simulates signal generation and driving, monitors, records, and communicates. Each graphic driver board performs the following tests:
[0016] Test the output voltage of the power supply corresponding to each aging board;
[0017] Test the working current ICC of each workstation;
[0018] Test the effective value of the AC voltage that needs to be monitored at each workstation.
[0019] In a further embodiment, the graphic driver board is composed of a main control board, an analog signal board, a current sampling switching board, and a voltage and current acquisition board;
[0020] The main control board is provided with a main control single chip unit, and the main control board is connected to the analog signal board, the current sampling switching board and the voltage and current acquisition board. The main control board is used for secondary power generation control, analog signal generation control and working status monitoring.
[0021] In a further embodiment, a temperature calibration module is provided in the high temperature test chamber, and the temperature calibration unit includes a temperature acquisition unit and an electric energy unit;
[0022] The electric energy unit is connected to the temperature unit data acquisition serial port in the host through a serial data line, and transmits data to the main control computer through real-time communication between the host and the switch.
[0023] In a further embodiment, the temperature acquisition unit is provided with a plurality of temperature acquisition channels, a resistance signal is formed by a temperature sensor, a voltage signal is acquired after passing through a resistance-to-voltage conversion circuit, a digital signal is obtained after passing through an analog-to-digital conversion circuit, and finally a temperature signal is obtained after data analysis and data processing by a single-chip microcomputer;
[0024] The electric energy unit measures the total accumulated electric energy consumed by the aging box within a specified time through current transformers and voltage transformers, that is:
[0025]
[0026] Among them, N represents the number of ventilation times, p1 represents the average power when the valve is closed, p2 represents the average power when the valve is open, y1 represents the ambient temperature, y2 represents the temperature inside the box, V represents the internal volume of the box, and d represents the ambient air density; thus, the average power of the aging box with the valve open and closed is calculated.
[0027] In a further embodiment, the aging test system includes an aging test method, and the aging test method includes:
[0028] Determine the test conditions for the aged device.
[0029] Determine the appropriate aging board based on the test device characteristics and packaging;
[0030] According to the characteristics of the devices, correctly insert the devices to be aged into the aging board;
[0031] Load all the test pieces into the aging board, send the device library correctly and start aging, recheck the secondary power supply to confirm the status of each working power supply and observe whether each waveform is normal through the oscilloscope recheck channel.
[0032] In a further embodiment, when the main control computer is running, it edits the corresponding voltage parameters and signal waveforms according to the aging parameters of each test piece, and sends them to the main control microcontroller and the graphic driver board of the aging zone respectively, so as to control the start and end of aging in each zone of the equipment and monitor the aging parameters in real time during the aging process; the main control microcontroller forwards the parameter signal of the control computer to each driver board and controls each first-level aging power output; after receiving various aging parameters, the graphic driver board performs various corresponding actions to generate the secondary power output and analog signal waveform required for device aging, drives it and sends it to the test device installed on the aging board, while monitoring the aging status of each test piece; the high-temperature test chamber provides a temperature environment for the test piece.
[0033] In a further embodiment, the main control computer is provided with a life prediction module; the life prediction module is composed of a data filtering unit, a recurrent neural network module and a prediction module;
[0034] The life prediction module obtains the data required for life prediction and the data collected by the graphic driver board through the lower computer, and the data filtering unit performs data filtering, outlier removal and signal denoising data preprocessing to obtain data and further feature extraction to obtain a data set for measurement. The data set is divided into a training data set and a prediction data set. Sequence prediction and optimization are performed on the training set through the prediction model in the prediction module to obtain the predicted life.
[0035] Beneficial Effects: This invention uses burn-in testing to proactively identify and eliminate defective chips, thereby reducing failure rates. By simulating actual usage environments under specific test conditions, the burn-in equipment can help manufacturers identify and resolve potential reliability issues before products are released to the market. This not only improves the overall quality of new energy vehicles, but also extends their service life, reduces maintenance costs, and ultimately enhances user satisfaction and brand competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS
[0036] Figure 1 It is the relationship between each working stage and failure rate of electronic components.
[0037] Figure 2 It is a structural diagram of the present invention.
[0038] Figure 3 It is a schematic diagram of the present invention.
[0039] Figure 4 It is a schematic diagram of the present invention.
[0040] Figure 5 It is the schematic diagram of the aging test principle of the present invention. DETAILED DESCRIPTION
[0041] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.
[0042] A universal analog device aging test system, the aging test system is composed of a host computer and a slave computer, and the host computer and the slave computer are connected via a switch;
[0043] In one embodiment, Figure 2 and Figure 3 As shown, the host computer is composed of a main control computer;
[0044] The lower computer consists of an aging power supply, a high temperature test chamber, a graphics driver board, an auxiliary power supply and an aging board; the aging power supply, the graphics driver board, the auxiliary power supply and the aging board are installed in the high temperature test chamber;
[0045] The aging power supply is connected to the graphic driver board to provide an aging test voltage therefor, the auxiliary power supply is connected to the graphic driver board to provide an operating voltage therefor, and the aging board is connected to the graphic driver board and is used to fix the aging device.
[0046] In one embodiment, Figure 2 and Figure 3 As shown, the main control computer detects, displays, and records test parameters, automatically records parameters according to the set recording time, and records the operating status of the query system during operation, including the operating status of the test system and the status of the test device. Through query analysis, it distinguishes between faults caused by system reasons and faults caused by device reasons, as well as the time and status of the fault.
[0047] In one embodiment, Figure 2 and Figure 3 As shown, the graphic driver board provides an aging interface, controls the working state of the aged device, completes data acquisition, processing and storage, and transmits the data and various states detected during the aging process to the main control computer. The graphic driver board is provided with several pieces, and each graphic driver board communicates independently with the main control computer. Each graphic driver board independently controls the test, simulates signal generation and driving, monitors, records, and communicates. Each graphic driver board performs the following tests:
[0048] Test the output voltage of the power supply corresponding to each aging board;
[0049] Test the working current ICC of each workstation;
[0050] Test the effective value of the AC voltage that needs to be monitored at each workstation.
[0051] In one embodiment, Figure 5 As shown, the graphic driver board consists of a main control board, an analog signal board, a current sampling switch board, and a voltage and current acquisition board;
[0052] The main control board is provided with a main control single chip unit, and the main control board is connected to the analog signal board, the current sampling switching board and the voltage and current acquisition board. The main control board is used for secondary power generation control, analog signal generation control and working status monitoring.
[0053] In one embodiment, Figures 2 to 4 As shown, a temperature calibration module is provided in the high temperature test chamber, and the temperature calibration unit includes a temperature acquisition unit and an electric energy unit;
[0054] The electric energy unit is connected to the temperature unit data acquisition serial port in the host through a serial data line, and transmits data to the main control computer through real-time communication between the host and the switch.
[0055] In one embodiment, Figures 2 to 4 As shown, the temperature acquisition unit is provided with several temperature acquisition channels, which form a resistance signal through the temperature sensor, collect the voltage signal after passing through the resistance-voltage conversion circuit, and then obtain the digital signal after passing through the analog-to-digital conversion circuit, and finally obtain the temperature signal after data analysis and data processing by the single-chip microcomputer;
[0056] The electric energy unit measures the total accumulated electric energy consumed by the aging box within a specified time through current transformers and voltage transformers, that is:
[0057]
[0058] Among them, N represents the number of ventilation times, p1 represents the average power when the valve is closed, p2 represents the average power when the valve is open, y1 represents the ambient temperature, y2 represents the temperature inside the box, V represents the internal volume of the box, and d represents the ambient air density; thus, the average power of the aging box with the valve open and closed is calculated.
[0059] In one embodiment, Figures 2 to 5 As shown, the aging test system includes an aging test method, and the aging test method includes:
[0060] Determine the test conditions for the aged device.
[0061] Determine the appropriate aging board based on the test device characteristics and packaging;
[0062] According to the characteristics of the devices, correctly insert the devices to be aged into the aging board;
[0063] Load all the test pieces into the aging board, send the device library correctly and start aging, recheck the secondary power supply to confirm the status of each working power supply and observe whether each waveform is normal through the oscilloscope recheck channel.
[0064] In one embodiment, Figures 2 to 5 As shown, when the main control computer is running, it edits the corresponding voltage parameters and signal waveforms according to the aging parameters of each test piece, and sends them to the main control microcontroller and the graphic driver board of the aging area respectively, so as to control the start and end of aging in each area of the equipment and monitor the aging parameters in real time during the aging process; the main control microcontroller forwards the parameter signal of the control computer to each driver board and controls the output of each primary aging power supply; after receiving various aging parameters, the graphic driver board performs various corresponding actions to generate the secondary power output and analog signal waveform required for device aging, drives them and sends them to the test device installed on the aging board, while monitoring the aging status of each test piece; the high temperature test chamber provides a temperature environment for the test piece.
[0065] In one embodiment, Figure 4 As shown, the main control computer is provided with a life prediction module; the life prediction module is composed of a data filtering unit, a recurrent neural network module and a prediction module;
[0066] The life prediction module obtains the data required for life prediction and the data collected by the graphic driver board through the lower computer, and the data filtering unit performs data filtering, outlier removal and signal denoising data preprocessing to obtain data and further feature extraction to obtain a data set for measurement. The data set is divided into a training data set and a prediction data set. Sequence prediction and optimization are performed on the training set through the prediction model in the prediction module to obtain the predicted life.
[0067] Working principle: When the invention system adopts the upper and lower computer control mode, it is mainly composed of control computer, main control single chip unit, graphic drive detection board (hereinafter referred to as driver board), first-level aging power supply, high temperature test chamber and aging board. The equipment is divided into 1 zone and 6 zones, with main control single chip unit and communication interface. Figure 3 The block diagram shows the principle. The control computer (host computer) communicates with the main control microcontroller and driver board via a Gigabit network card. The computer's Ethernet port is set to 192.168.123.XXX. The host computer (computer) is responsible for managing device parameters, sending control commands, status and data query, data storage, and printing. The system has six slave units (microcontrollers), responsible for generating and controlling the secondary power supply, analog signal generation and control, and operating status monitoring for each zone.
[0068] The burn-in system is divided into six burn-in zones, visible from the front. Each burn-in slot corresponds to a graphics driver board; each zone independently generates burn-in signals and burn-in voltages, communicating with the microcomputer via a communication cable.
[0069] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.
Claims
1. A universal analog device aging test system, characterized in that: The aging test system is composed of a host computer and a slave computer, and the host computer and the slave computer are connected via a switch; The host computer is composed of a main control computer; The lower computer consists of an aging power supply, a high temperature test chamber, a graphics driver board, an auxiliary power supply and an aging board; the aging power supply, the graphics driver board, the auxiliary power supply and the aging board are installed in the high temperature test chamber; The aging power supply is connected to the graphic driver board to provide an aging test voltage therefor, the auxiliary power supply is connected to the graphic driver board to provide an operating voltage therefor, and the aging board is connected to the graphic driver board and is used to fix the aging device.
2. A universal analog device aging test system according to claim 1, characterized in that: The main control computer detects, displays, and records test parameters, automatically records parameters according to the set recording time, and records the operating status of the query system during operation, including the operating status of the test system and the status of the test device. Through query analysis, it distinguishes between faults caused by system reasons and faults caused by device reasons, as well as the time and status of the fault.
3. A universal analog device aging test system according to claim 1, characterized in that: The graphic driver board provides an aging interface, controls the working state of the aged device, completes data acquisition, processing and storage, and transmits the data and various states detected during the aging process to the main control computer. The graphic driver board is provided with several pieces, and each graphic driver board communicates independently with the main control computer. Each graphic driver board independently controls the test, simulates signal generation and driving, monitors, records, and communicates. Each graphic driver board performs the following tests: Test the output voltage of the power supply corresponding to each aging board; Test the working current ICC of each workstation; Test the effective value of the AC voltage that needs to be monitored at each workstation.
4. A universal analog device aging test system according to claim 1, characterized in that: The graphic driver board is composed of a main control board, an analog signal board, a current sampling switch board and a voltage and current acquisition board; The main control board is provided with a main control single chip unit, and the main control board is connected to the analog signal board, the current sampling switching board and the voltage and current acquisition board. The main control board is used for secondary power generation control, analog signal generation control and working status monitoring.
5. A universal analog device aging test system according to claim 1, characterized in that: The high temperature test chamber is provided with a temperature calibration module, and the temperature calibration unit includes a temperature acquisition unit and an electric energy unit; The electric energy unit is connected to the temperature unit data acquisition serial port in the host through a serial data line, and transmits data to the main control computer through real-time communication between the host and the switch.
6. A universal analog device aging test system according to claim 1, characterized in that: The temperature acquisition unit is provided with several temperature acquisition channels, which form a resistance signal through the temperature sensor, collect the voltage signal after passing through the resistance-voltage conversion circuit, and then obtain the digital signal after passing through the analog-to-digital conversion circuit, and finally obtain the temperature signal after data analysis and data processing by the single-chip microcomputer; The electric energy unit measures the total accumulated electric energy consumed by the aging box within a specified time through current transformers and voltage transformers, that is: Among them, N represents the number of ventilation times, p1 represents the average power when the valve is closed, p2 represents the average power when the valve is open, y1 represents the ambient temperature, y2 represents the temperature inside the box, V represents the internal volume of the box, and d represents the ambient air density; thus, the average power of the aging box with the valve open and closed is calculated.
7. A universal analog device aging test system according to claim 1, characterized in that: The aging test system includes an aging test method, and the aging test method includes: Determine the test conditions for the aged device. Determine the appropriate aging board based on the test device characteristics and packaging; According to the characteristics of the devices, correctly insert the devices to be aged into the aging board; Load all the test pieces into the aging board, send the device library correctly and start aging, recheck the secondary power supply to confirm the status of each working power supply and observe whether each waveform is normal through the oscilloscope recheck channel.
8. A universal analog device aging test system according to claim 7, characterized in that: When the main control computer is running, it edits the corresponding voltage parameters and signal waveforms according to the aging parameters of each test piece, and sends them to the main control microcontroller and the graphic driver board of the aging area respectively, so as to control the start and end of aging in each area of the equipment and monitor the aging parameters in real time during the aging process; the main control microcontroller forwards the parameter signal of the control computer to each driver board and controls the output of each first-level aging power supply; after receiving various aging parameters, the graphic driver board executes various corresponding actions to generate the secondary power output and analog signal waveform required for device aging, drives them and sends them to the test pieces installed on the aging board, while monitoring the aging status of each test piece; the high-temperature test chamber provides a temperature environment for the test pieces.
9. The universal analog device aging test system according to claim 1, characterized in that: The main control computer is provided with a life prediction module; the life prediction module is composed of a data filtering unit, a recurrent neural network module and a prediction module; The life prediction module obtains the data required for life prediction and the data collected by the graphic driver board through the lower computer, and the data filtering unit performs data filtering, outlier removal and signal denoising data preprocessing to obtain data and further feature extraction to obtain a data set for measurement. The data set is divided into a training data set and a prediction data set. Sequence prediction and optimization are performed on the training set through the prediction model in the prediction module to obtain the predicted life.
Citation Information
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