Cooling interface for pluggable modules

Abstract

The invention relates to a cooling interface for pluggable modules. A holder for receiving a pluggable module includes a plurality of plates including a lower plate, an upper plate, a left side plate between the lower plate and the upper plate, and a right side plate disposed between the lower plate and the upper plate and opposite the left side plate. A compartment is defined by the plurality of plates and sized to receive a pluggable module. The cage also includes one or more cooling interface modules. Each of the one or more cooling interface modules includes a gap pad and a protective cover, and is disposed such that the gap pad is adjacent to a particular plate of the plurality of plates and the protective cover is adjacent to the compartment.

Description

Background Art

[0001] Computer systems generate heat during operation. If this heat is not dissipated or cooling is not provided, it can damage various components within the system. Cooling systems come in many forms, but all help provide temperature control to allow the computer system and its components to continue operating without damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0002] Can be used alone or in combination with Figure 1 The present disclosure will be understood from the following detailed description. The accompanying drawings and their related descriptions are included to provide a further understanding of the present disclosure and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate one or more non-limiting aspects and implementations of the present teachings and, together with the description, explain certain principles and operations. In the drawings:

[0003] Figure 1 is a block diagram of an example bracket for pluggable modules consistent with the present disclosure.

[0004] Figure 2 is a block diagram of an example information handling system including a bay for pluggable modules consistent with the present disclosure.

[0005] Figure 3 is a perspective view of an example bracket for a pluggable module consistent with the present disclosure.

[0006] Figure 4 yes Figure 3 Exploded perspective view of the bracket in FIG.

[0007] Figure 5 yes Figure 3 Front view of the bracket in .

[0008] Figure 6 It was intercepted along line 6-6 Figure 3 Cross-sectional view of the bracket in .

[0009] Figure 7 It was intercepted along line 7-7 Figure 3 Cross-sectional view of the bracket in .

[0010] Figure 8A is a perspective view of an example system including a bracket for pluggable modules and a direct-coupled cold plate consistent with the present disclosure.

[0011] Figure 8B When the pluggable module is installed Figure 8A A perspective view of the system in .

[0012] Figure 9Ais a perspective view of an example system including a bracket for pluggable modules and a remotely located cold plate consistent with the present disclosure.

[0013] Figure 9B When the pluggable module is installed Figure 9A A perspective view of the system in .

[0014] Figure 10 is a front view of an example system including a bracket with a pluggable module installed, consistent with the present disclosure.

[0015] Figure 11 is a flow chart illustrating an example method of using a cooling interface for a pluggable module consistent with the present disclosure. DETAILED DESCRIPTION

[0016] Cooling systems are an important aspect of computers because, without an adequate cooling system, the heat generated by a computer or server system can cause damage to the components included therein. One type of cooling is through liquid cooling, whereby the heat is dissipated by absorbing it into a liquid coolant that is circulated through a liquid cooling system. Typically, the heat reaches the coolant through a liquid-cooled cold plate, which is thermally coupled to the components being cooled and to the liquid coolant. As used herein, a liquid-cooled cold plate (hereinafter referred to as a "cold plate") refers to a device that receives heat from an entity via conduction and dissipates the heat into a liquid coolant, which is either in direct contact with the cold plate (e.g., flowing through its internal chamber) or flows through pipes or tubes in contact with the cold plate.

[0017] Typically, in addition to more permanently installed components (such as a motherboard), a computer system also includes pluggable modules (such as optical transceivers). Pluggable modules are designed to be easily inserted into and removed from a bracket in the computing system, typically in a hot-swappable manner. The bracket may include a retaining frame defining an opening, referred to herein as a compartment, into which the pluggable module is received. Like other components of the system, pluggable modules generate heat and need to be cooled. However, while cooling pluggable modules is relatively simple in air-cooled systems, in computing systems that are cooled primarily or entirely by liquid cooling, cooling pluggable modules can be a challenge due to their removable / pluggable nature. In order to transfer heat from the pluggable module to the liquid coolant, a thermal interface needs to be established between the two. However, because pluggable modules are designed to be easily inserted and removed, methods commonly used to cool other components may not be applicable to pluggable modules. For example, a cold plate is often attached to a central processing unit (CPU) to provide liquid cooling thereto, but attaching such a cold plate to a pluggable module would affect the ability to easily insert or remove the pluggable module.

[0018] One approach to providing liquid cooling for pluggable modules is to place a cold plate (or a heat transfer device coupled to a cold plate) in a tray that receives the pluggable module, such that the cold plate or heat transfer device contacts the pluggable module when the module is inserted into the tray. However, ensuring that such a thermal interface has a sufficiently high heat transfer rate is a challenge. In particular, the surfaces that come into contact with each other are often not completely smooth and may not be perfectly aligned, which can reduce the heat transfer rate. Improvements to surface smoothness and alignment can be made, for example, by specifying tighter tolerances, but this can increase costs and may also make inserting and removing the module more difficult.

[0019] One approach to improving heat transfer despite surface roughness and misalignment is to add a thermal interface material (TIM) between the pluggable module and the cold plate or heat transfer device. As used herein, a TIM refers to a relatively thin, thermally conductive, and compliant material placed between two devices at their thermal interface to improve heat transfer. The TIM can fill gaps between mating surfaces (caused by, for example, surface roughness and misalignment), thereby improving heat transfer. However, one problem with this approach is that sliding contact can occur between the pluggable module and the TIM when the pluggable module is inserted into or removed from the bracket, resulting in damage to the TIM during insertion and / or removal. For example, if the TIM is a gap pad, the sliding contact may tear or wear away the gap pad. Alternatively, if the TIM is thermal grease or paste, the sliding contact may rub off the TIM. Therefore, a damaged or dislodged TIM may not be effective in improving heat transfer. Furthermore, even if the TIM remains effective for one or a few insertions / removals, it will eventually wear out and may need to be periodically replenished, which increases cost and complexity. Additionally, some thermal greases or pastes can be very messy and may spill during insertion or leave residue on the removed pluggable module after it is removed. Therefore, while using a TIM can improve thermal performance, it can also have some drawbacks.

[0020] Another approach is to use a dry thermal interface between the module and the cold plate heat transfer device, where a "dry thermal interface" refers to a direct contact interface without a TIM between the two contacting surfaces. For this interface, a relatively high contact pressure may be required between the contacting surfaces to compensate for roughness and / or misalignment. However, achieving high contact pressure may require the user to apply significant force when inserting and / or removing the pluggable module. Typically, the amount of force a user can comfortably apply during insertion / removal is limited. In some cases, the amount of contact pressure required to achieve the desired high heat transfer rate may exceed the limit of the insertion / removal force that a user can comfortably apply. Therefore, in some systems, the insertion / removal force can be limited to a level that is acceptable to the average user, but the result is that the pluggable module will have a limited amount of contact pressure with the cold plate or heat transfer device, and a correspondingly lower heat transfer rate. In other words, heat transfer rate may be sacrificed to maintain easy insertion and removal of the module. Therefore, with a dry thermal interface, achieving both good thermal performance and easy insertion / removal is difficult.

[0021] The present disclosure addresses these issues by providing a bracket for receiving pluggable modules having one or more cooling interface modules configured to provide a dry thermal interface with the pluggable modules, the dry thermal interface capable of achieving a high heat transfer rate and low insertion / removal force. Each cooling interface module includes a thermal gap pad having a thin protective cover attached thereto, wherein the protective cover is formed from a relatively strong (e.g., high strength, high hardness, and good ductility) thermally conductive material, such as a thin sheet of metal. In addition, each cooling interface module is movably coupled to a retaining frame of the bracket (the retaining frame defining the compartment into which the module is inserted) so that when the pluggable module is received into the compartment, the pluggable module directly contacts and moves the protective cover, which compresses the thermal gap pad between the protective cover and the retaining frame. The elastic restoring force in the compressed thermal gap pad pushes the protective cover onto the pluggable module, which aligns the protective cover with the pluggable module and reduces any initial misalignment between the surfaces. This ensures a relatively good thermal interface, allowing heat to be transferred from the pluggable module to the liquid cooling circuit at high speed via the path including the protective cover, thermal gap pad, and cage wall. Furthermore, the contact pressure between the protective cover and the pluggable module is relatively moderate, thereby avoiding the need for high insertion or removal forces. Furthermore, because it is the protective cover that contacts the pluggable module during insertion and removal, the protective cover prevents the thermal gap pad from being damaged or dislodged by the insertion and / or removal of the pluggable module.

[0022] In some examples, the disclosed bracket includes a connector cage having three cooling interface modules, each of which includes a metal-lined gap pad integrated with the top and side panels of the connector cage. The gap pad is sandwiched between the connector cage and the thin metal sheet that lines the gap pad.

[0023] When the pluggable module is inserted into the bracket, it slides and pushes against the thin metal plate. Because the gap gasket has some "springiness" and can be compressed, the pluggable module pushes against the thin metal plate, which also compresses the gap gasket. However, the spring force generated by the pluggable module insertion causes the gap gasket to return to its original, uncompressed state. Therefore, once the pluggable module is inserted, the gap gasket pushes the thin metal plate against the pluggable module, forcing the thin metal plate into a conforming fit. This interference contact establishes thermal coupling between the pluggable module and the cooling interface.

[0024] The bracket's connector holder is also thermally coupled to the cooling system's cold plate. In some examples, the connector holder is directly coupled to the cold plate, with the cold plate positioned directly on top of the connector holder. In other examples, the cold plate is remotely located; in these examples, heat generated by the pluggable module is conducted to the cold plate via a heat transfer device, such as a heat pipe. Regardless of the cold plate's location, the thermal coupling of the connector holder to the cold plate allows the connector holder, and therefore the pluggable module, to be integrated into the computing system's existing cooling system.

[0025] Figure 1 is a schematic diagram of an example bracket 10 for receiving a pluggable module consistent with the present disclosure. It should be understood that Figure 1 The specific shapes, sizes, or other structural details are not intended to be accurate or to scale, and implementations of the bracket 10 may have a different number and arrangement of components than those shown, and may also include other components not shown. Figure 1 In the figures, physical connections (eg, physical attachments and / or supports) are conceptually represented by dashed lines.

[0026] like Figure 1 As shown, the bracket 10 includes a retaining frame 11 and one or more cooling interface modules 22. The bracket 10 can be installed in an information handling system (e.g., a computing system, a networking device, etc.) and, when so installed, can provide an interface for receiving a pluggable module and electrically connecting the pluggable module to other components of the information handling system, such as a system board.

[0027] The retainer 11 is formed from a plurality of panels, namely, a lower panel 12, an upper panel 14, a left panel 18, and a right panel 16, with the left panel 18 and the right panel 16 positioned between the lower panel 12 and the upper panel 14. Panels 12, 14, 16, and 18 generally comprise planar structures forming the walls of the retainer 11 and are arranged parallel to a first direction, with the lower panel 12 and the upper panel 14 being parallel to each other, and the right panel 16 and the left panel 18 being parallel to each other and perpendicular to the lower panel 12 and the upper panel 14. In other words, the panels 12, 14, 16, and 18 are coupled together to form a box-like shape (i.e., a hollow rectangular prism). In some examples, the panels 12, 14, 16, and 18 are formed from one or more sheets of metal that have been machined (e.g., bent, stamped, etc.) to form the shape of the retainer 11. In some examples, some or all of the plates 12, 14, 16, and 18 are integrally connected to (i.e., part of the same integral body) other of the plates 12, 14, 16, and 18. In some examples, some or all of the plates 12, 14, 16, and 18 are formed as separate components that are connected together by mechanical fasteners, welding / brazing, or other fastening techniques.

[0028] Cage 11 also has a compartment 20 defined by panels 12, 14, 16, and 18 in the gaps between panels 12, 14, 16, and 18. Compartment 20 can be sized to receive a pluggable module, such as an optical transceiver or other pluggable module. Cage 11 has at least one opening into compartment 20 through which a pluggable module can be inserted. As previously mentioned, a pluggable module is a component of a computer system that is designed to be selectively engaged or used, as opposed to a more permanently installed component. A pluggable module is designed to be easily inserted into and removed from a compartment, such as compartment 20.

[0029] Although not shown, an electrical connector can also be placed in or adjacent to compartment 20 so that when a pluggable module is installed in compartment 20, the pluggable module's connector can mate with the electrical connector of bracket 10. The electrical connector can be connected to other components of the information handling system, such as a system board. In some examples, the electrical connector is part of bracket 10. In other examples, the electrical connector is part of the system in which bracket 10 can be installed.

[0030] Although Figure 1 Four panels are shown in FIG, but the example is not limited thereto and fewer panels may be used. For example, the cage may be formed from an upper panel and two side panels, while the lower panel may be omitted and some other structure separate from the cage (such as a surface to which the cage is attached) may define the boundaries of the compartments in place of the lower panel.

[0031] The holder 11 can be formed from a thermally conductive material, such as copper, a copper alloy, nickel, steel, stainless steel, aluminum, or an aluminum alloy. Good thermal conductivity allows the holder 11 to effectively transfer heat from the pluggable module received in the compartment 20 to a cooling subsystem (not shown) that can be thermally coupled to the holder 11. In addition to their good thermal conductivity, the above materials can also be beneficial when used in the holder 11 because they are electrically conductive, which can help suppress electromagnetic interference (EMI), and because they are structurally strong, they can allow the holder 11 to withstand repeated insertion and removal of the pluggable module and provide support for the pluggable module when installed therein. In some examples, the entire holder 11 can be made of a single material, such as copper. In other examples, a combination of materials can be used to make the holder 11. For example, in some embodiments, because copper has a high thermal conductivity, the upper plate 14 of the holder 11 can be made of copper so that the upper plate 14 is primarily responsible for conducting heat between the pluggable module and other components of the system. Meanwhile, the left plate 18 and the right plate 20 can be made of a material with low thermal conductivity, such as aluminum or stainless steel. Similar to the upper plate 14, the lower plate 12 can also be made of a material with low thermal conductivity, or can be made of copper. However, this example is not limited to this, and any combination of materials for the multiple plates can be used to achieve the desired level of thermal conductivity of the cage 11.

[0032] At least one cooling interface module 22 is coupled to the cage 11. Figure 1 Only one cooling interface module 22 is shown, but the example is not limited thereto, and more cooling interface modules 22 may be used. The cooling interface module 22 may include a gap pad 24 and a protective cover 26. As used herein, a gap pad is a special type of thermal interface material (TIM) that is heat-conducting and relatively compliant, meaning that the gap pad can compress and conform to the surface between which it is placed. The gap pad may have a compressibility between 10 and 50 percent, and preferably has a compressibility of approximately 20 percent.

[0033] The cooling interface module 22 may also include a protective cover 26. As used herein, a protective cover refers to a piece of material designed to protect the gap pad when the cooling interface module 22 is in use. The protective cover can be made of a low-friction, thermally conductive material that is also conformable and tear-resistant. The protective cover 26 is attached to one side of the gap pad 24, for example, via an adhesive. In some examples, the protective cover 26 covers the entire side of the gap pad 24. In some examples, the protective cover 26 extends beyond the edges of the gap pad 24 in one or more directions. In some examples, the protective cover 26 includes attachment features that assist in attaching the cooling interface module 22 to the bracket 10.

[0034] Each cooling interface module 22 is coupled to a corresponding plate of bracket 10 such that, when coupled to bracket 10, gap pads 24 are sandwiched between protective cover 26 and the plate. Cooling interface modules 22 protrude into compartment 20, with protective cover 26 facing the central area of ​​compartment 20. Therefore, when a pluggable module is inserted into compartment 20, the pluggable module comes into contact with cooling interface module 22. More specifically, during insertion and removal of the pluggable module, the pluggable module slides along protective cover 26. Gap pads 24 are thereby protected from damage caused by the pluggable module.

[0035] In some examples, in response to the insertion of the pluggable module, each cooling interface module 22 can be coupled to the corresponding plate via a mechanical attachment feature that retains the cooling interface module on the holder 11 while also allowing movement of the cooling interface module 22. For example, the mechanical attachment feature can include a hook at one end of the cooling interface module 22 that engages with the end of the corresponding plate. In some examples, each cooling interface module 22 can be coupled to the corresponding plate via adhesion between the gap pad 24 and the corresponding plate, which can be used in addition to or in lieu of the mechanical attachment feature. In some examples, adhesion can be provided by the natural stickiness of the gap pad 24 itself. In other examples, adhesion can be provided by an adhesive added between the gap pad 24 and the plate.

[0036] During the insertion of the pluggable module, gap pad 24 is compressed by the force of insertion (e.g., through contact with the pluggable module). This compression occurs because the vacant space in compartment 20 (i.e., the unoccupied space in the central portion of compartment 20, defined by protective cover 26 of cooling interface module 22 and those of plates 12, 14, 16, or 18 lacking a cooling interface module (if any)) is slightly smaller in cross-section than the pluggable module. Consequently, the pluggable module must move protective cover 26 in a generally radially outward direction (i.e., toward the plate) to make room for itself. This radially outward movement of protective cover 26 compresses gap pad 23. Furthermore, protective cover 26 is deformed by the pressure between the pluggable module and the compressed or deformed gap pad 24. Consequently, protective cover 26 conforms to the surface shape of the pluggable module, resulting in an improved thermal interface between cooling interface module 22 and the pluggable module. Thus, when the pluggable module is installed in the compartment 20 , a heat conduction channel is formed from the pluggable module to the holder 11 via the cooling interface module.

[0037] As described above, the protective cover 26 can be made of a relatively low-friction, thermally conductive, compliant, and durable (tear-resistant) material. For example, the protective cover 26 can have a static friction coefficient of less than 1.5, a thermal conductivity greater than 5 w / mK, and a tensile strength greater than 10,000 psi. It should be noted that the compliance and thermal conductivity of the protective cover 26 depend not only on the intrinsic quality of the material used to make the protective cover 26, but also on the thickness of the protective cover 26. For example, a relatively thin protective cover 26 can have higher thermal conductivity and greater compliance than a relatively thick protective cover 26 of the same material. Many metals can be made into relatively thin sheets, foils, or films while maintaining good tear resistance, and also have good thermal conductivity and compliance (especially when made into thin sheets or films). Therefore, in some examples, the protective cover can be a thin metal sheet, foil, or film, such as a sheet, foil, or film made of copper, a copper alloy, nickel, steel, stainless steel, aluminum, an aluminum alloy, or a combination thereof. In such an example, the average thickness of the protective cover 26 may be as little as 0.0008 inches (0.020 mm), or, depending on the material, as high as 0.006 inches (0.152 mm).

[0038] In particular, in some examples, the protective cover 26 is copper and may have an average thickness of approximately 0.003 inches (0.076 mm). Copper has good thermal conductivity, which helps improve heat transfer through the protective cover 26. In addition, copper is highly ductile, which allows the protective cover 26 to easily conform to the surface of the pluggable module when the protective cover 26 is pressed against the pluggable module by the restoring force of the compressed gap pad 24. The conformation of the protective cover 26 to the pluggable module improves the thermal interface between the two, thereby further improving the heat transfer rate.

[0039] In other examples, protective cover 26 is stainless steel, which may have an average thickness of approximately 0.001 inches (0.025 mm). Stainless steel has excellent durability, which allows it to be made thinner than other materials while also preventing tearing during the insertion / removal of the pluggable module. This thinness allows for high thermal conductivity and conformability of protective cover 26. In particular, while stainless steel may have lower inherent thermal conductivity than copper, the ability to make protective cover 26 thinner can offset the lower inherent thermal conductivity of stainless steel and produce comparable (in some cases better) overall thermal conductivity through thermal interface module 22.

[0040] While metal is generally an ideal candidate for the material of protective cover 26, particularly copper and stainless steel, examples are not limited thereto. In other examples, protective cover 26 may be made of thermally conductive plastic or other thermally conductive non-metallic materials, such as thermally conductive tape. Regardless of the material used, protective cover 26 may be placed adjacent to gap pad 24 to protect gap pad 24 when engaging the pluggable module.

[0041] In some examples, the additional element is attached to protective cover 26 on the same side thereof as gap pad 24. For example, multiple gap pads, including gap pad 24, may be attached to the same side of protective cover 26. In some examples where multiple gap pads are attached to the same protective cover, some of the gap pads may have different material properties than the other gap pads.

[0042] For example, in some embodiments, one or more gap pads may have relatively high thermal conductivity but poor elasticity (i.e., generate relatively low restoring force (spring force) when compressed), while one or more other gap pads may have relatively low thermal conductivity but good elasticity (i.e., generate relatively high restoring force (spring force) when compressed). In such an embodiment, a resilient gap pad may be added to help push the protective cover 26 against the pluggable module to ensure its compliance and good thermal interface, while a high thermal conductivity gap pad may be provided to provide good heat conduction from the protective cover 26 to the cage 11.

[0043] Figure 2 is a block diagram of an example information handling system 200 ("system 200") consistent with the present disclosure including a tray 210 for pluggable modules. The tray 210 is a block diagram of an example information handling system 200 ("system 200") consistent with the present disclosure including a tray 210 for pluggable modules. Figure 1 An example implementation of the cradle 10 is described, and similar reference numbers having the same last two digits (e.g., 111 and 211) are used for components of the cradle 210 that correspond to (e.g., are example implementations of) components of the cradle 10 described above. Figure 2 In the diagram, physical coupling (eg, contact, attachment, support, etc.) is indicated by dashed lines, and electrical connection is indicated by dotted lines. For example, system 200 may be a computing system (eg, a server), a networking system (eg, a switch), or other information processing system.

[0044] The system 200 includes a chassis 28 and a system board 30 supported by and / or housed within the chassis 28. The system 200 also includes a bracket 210 and a module 32 that can be removably inserted.

[0045] System board 30 may be a printed circuit board assembly (or PCA) that may be housed in and / or supported by chassis 28. In some examples, system board 30 may include a printed circuit board (or PCB) and one or more electronic components mounted thereto, such as a processor, memory, or other components.

[0046] The bracket 210 includes a retaining frame 211 that can be coupled to the chassis 28 or form a part of the chassis 28. Figure 1Similar to the described bracket 10, the bracket 210 may include a cage 211 formed of a plurality of panels; namely, a lower panel 212, an upper panel 214, and a plurality of side panels 216, 218 coupling the lower panel 212 to the upper panel 214. In some examples, a given one of these panels may be coupled to, or may be part of, the chassis 28. For example, in Figure 2 , lower plate 212 is shown coupled to chassis 28. In some examples, a given plate (e.g., lower plate 212) can be a separate plate that is attached to chassis 28, for example, by welding, mechanical fasteners, adhesives, or any other suitable fastening mechanism. In other examples, a given plate (e.g., lower plate 212) can be integrally formed with chassis 28. In other words, given plate 212 is part of a wall, panel, or other structure of chassis 28, such that there is no separately attached plate.

[0047] The bracket 210 also includes one or more cooling interface modules 222 that are positioned within and attached to the cage 211. The cooling interface modules 222 may include gap pads 224 and protective covers 226. The cooling interface modules 222 may be positioned along and coupled to one of the plurality of panels. Figure 2 The cooling interface module 222 is shown positioned along and coupled to the upper plate 214; however, the example is not limited thereto, and the cooling interface module 222 may be positioned along the lower plate 212 or one of the plurality of side plates 216, 218. Figure 2 Only one cooling interface module 222 is shown in the drawings, but more than one cooling interface module 222 may be used. In such an example, each cooling interface module 222 may be positioned along a panel. For example, a first cooling interface module 222 may be positioned adjacent to a first panel in the plurality of panels 212, 214, 216, 218, and a second cooling interface module 222 may be positioned adjacent to a second panel in the plurality of panels 212, 214, 216, 218. In some examples, a third cooling interface module may also be included and positioned adjacent to a third panel in the plurality of panels 212, 214, 216, 218.

[0048] As about Figure 1 As depicted, the cooling interface module 222 includes a gap pad 224 and a protective cover 226. Figure 2 As shown in FIG, when installed in the system 200, the gap pad 224 can be placed adjacent to (e.g., in contact with) a plate, in this case, the upper plate 214. The gap pad 224 can have a degree of tack inherent in the material that helps maintain the gap pad 224 in position relative to the upper plate 214. In addition, the protective cover 226 can have an attachment mechanism, such as a hook, to couple the cooling interface module 222 to the holder 211. Figure 5 This attachment mechanism is discussed further herein.

[0049] The protective cover 226 can be coupled to the gap pad 224 so that the protective cover 226 and the gap pad 224 can move as a whole. For example, the protective cover 226 can be attached to the gap pad 224 by an adhesive. When installed in the holder 211, the protective cover 226 can be attached to the plate (e.g., Figure 1 In other words, the cooling interface module 222 can be installed in the holder 211 so that the gap pad 224 is sandwiched between one of the plates (such as the upper plate 214) and the protective cover 226.

[0050] This configuration can be used to establish a thermal interface between the removable pluggable module 32 and the holder 211 when the pluggable module 32 is inserted into the holder 211. More specifically, the cooling interface module 32 protrudes into the compartment 220 defined by the holder 211 so that the pluggable module 32 contacts the protective cover 226 when the pluggable module 32 is inserted into the compartment 220, as shown in FIG. Figure 2 In addition, when the pluggable module 32 is inserted, it faces the corresponding plate (eg Figure 2 214 in the upper plate 214) presses the protective cover 226, thereby compressing the gap pad 224 between the protective cover 226 and the retaining frame plate. The gap pad 224 resists the compression and generates a spring-like force that pushes the protective cover 226 against the pluggable module 32. This creates a contact pressure that improves the conductivity of the thermal interface between the pluggable module 32 and the protective cover 226. In particular, in some examples, the protective cover 226 has sufficient ductility that pressure will cause it to conform to the surface of the pluggable module 32, thereby forming a good thermal interface between the two, despite the lack of thermal interface material. In this case, the pluggable module 32 is in contact with the protective cover, the protective cover is in contact with the gap pad, and the gap pad is in contact with the plate of the retaining frame 211 (for example, Figure 2 Thus, a conductive path is formed from the removable module 32 to the holder 211. In other words, in this case, heat flows from the removable module 32 into the protective cover 226, from the protective cover into the gap pad 224, and then from the gap pad 224 into the holder 211.

[0051] The cold plate 34 can be thermally coupled to the holder 211. As previously described, the cold plate receives heat from the entity via conduction and dissipates the heat into the liquid coolant, cooling the entity to which the cold plate is connected. As used herein, two objects are "thermally coupled" if: (1) they are in contact with each other, or (2) they are both in contact with a thermally conductive heat transfer device (or a thermally conductive chain of thermally coupled heat transfer devices), or (3) the heat transfer coefficient between the two objects is 10 W·m-2·K-1 or less. It is worth noting that "contact" includes direct contact and indirect contact, where a thermally conductive intermediate material such as TIM is present in the indirect contact. The cold plate 34 can be part of a liquid cooling loop that flows liquid coolant through the system 200 to cool its components. In addition to the cold plate 34, the liquid cooling loop can also include additional cold plates (not shown) to cool other components (such as the processor of the system board 20) and other liquid cooling infrastructure (not shown) (such as coolant lines, valves, connectors, etc.).

[0052] In some examples, the cold plate 34 may be directly coupled to the cage 211 . Figure 3 An example of such direct coupling is shown. In other examples, the cold plate 34 can be remote from the holder 211. In such an example, a heat transfer device (such as a heat pipe) can be used to thermally couple the holder 211 to the cold plate 34. A heat transfer device is any heat transfer device configured to transfer heat from one object thermally coupled to it to another object thermally coupled to it across a distance. Examples of heat transfer devices include heat pipes, vapor chambers, copper bars (or other conductive materials), etc. Figure 4 An example of such a configuration is shown. Since the cold plate 34 is thermally coupled to the cage 211 (either directly or via a heat transfer device), the heat transferred from the removable pluggable module 32 to the cage 211 can be transferred to the cold plate 34 and from the cold plate 34 to the liquid coolant that removes the heat from the system 200. In other words, a heat path is established from the pluggable module 32 to the cold plate 34 via the cooling interface module 222 and the cage 211. This heat path is Figure 2 In an example where the carrier 210 has multiple cooling interface modules 222, multiple thermal paths similar to those described above can be established to transfer heat from the pluggable modules 32 to the cold plate 34, with each such thermal path passing through one of the modules 222 and the corresponding plate of the cage 211 with which the module 222 contacts.

[0053] Now turn Figure 3-7, an example tray 510 for receiving a pluggable module will be described. Tray 510 is an example implementation of trays 10 and 210 described above. Some components in tray 510 correspond to components in tray 10 or 210 (e.g., are example implementations of components in tray 10 or 210), and such corresponding components are given similar reference numbers with the same last two digits (e.g., 511, 211, and 11). Although Figure 3 The bracket 510 in FIG. 5 is an example implementation of the brackets 10 and 210 , but the brackets 10 and 210 are not limited to the bracket 510 .

[0054] like Figure 3-7 As shown, the bracket 510 includes a retaining frame 511 and three cooling interface modules 522. The retaining frame 511 can be formed by a lower plate 512, an upper plate 514, a left side plate 516 and a right side plate 518. Figure 4 , the lower plate 512 is shown offset from the upper plate 514 , the left side plate 516 , and the right side plate 518 ; however, in use, the lower plate 512 is coupled thereto to form the retaining frame 511 .

[0055] More specifically, in this example, the upper plate 514, the left side plate 516, and the right side plate 518 are integrally connected together (ie, are part of the same unit). For example, the metal sheet can be bent into Figure 4 The structure shown includes plates 512, 514 and 516, and a single piece lower plate 512 is then attached to the structure (e.g., by welding, brazing, etc.) to complete the retainer 511. To assist in attaching the lower plate 512 to the other plates 512, 514 and 516, a flange 513 is provided that is integrally connected to the left and right plates 516 and 518. The flange 513 is bent perpendicular to the left and right plates 516 and 518 to be parallel to the lower plate 512, thereby providing a relatively large surface area that can be connected to the lower plate 512. In some examples, to prevent the flange 513 from extending into the compartment 520, the lower plate 512 can be provided with a recessed or thinned area 515 that receives the flange 513 so that the top surface of the flange 513 is aligned (e.g., coplanar) with the top surface of the central portion 517 of the lower plate 512, as shown. Figure 5 and Figure 6 shown.

[0056] In other examples, the plates 512, 514, 516, and 518 can all be connected integrally. In other examples, each plate 512, 514, 516, and 518 can be formed separately and then connected.

[0057] exist Figure 2-7In the example shown, the bracket includes three cooling interface modules 522-1, 522-2, and 522-3 (collectively referred to as cooling interface modules 522). Importantly, although three cooling interface modules 522 are shown, the example is not limited thereto and other numbers of cooling interface modules 522 may be used. Figure 3 As shown in FIG, each cooling interface module 522 is positioned adjacent to and coupled to a corresponding plate in plates 512, 514, 516, and 518. Figure 4 In the exploded perspective view of FIG, cooling interface modules 522 are shown on the exterior of their respective panels of cage 511; that is, cooling interface modules 522 are shown on the exterior of cage 510, rather than in their installed locations. When installed, cooling interface module 522-1 is positioned along left panel 516, cooling interface module 522-2 is positioned along upper panel 514, and cooling interface module 522-3 is positioned along right panel 518.

[0058] Each cooling interface module 522 includes gap pads, such as gap pads 524-1 to 524-3 (collectively referred to as gap pads 524). Figure 4 , but the cooling interface module 522-1 also has a similar gap pad 524-1, which is Figure 6 The gap pad 524 is placed adjacent to the protective cover, such as protective cover 526-1, 526-2, 526-3 (collectively referred to as protective cover 526). In addition, each cooling interface module 522 also includes a Figure 1 The protection cover 526 is designed to protect the gap pad 524 .

[0059] like Figure 3-5 and Figure 7As shown, hooks 50-1, 50-2, and 50-3 (collectively, hooks 50) are attached to one end of the protective cover 526 of each cooling interface module 522. Each hook 50 includes a ramp portion 50a extending at an angle away from the protective cover 526. Specifically, each ramp portion 50a protrudes generally forward from the protective cover 526 and away from the center of the compartment 520. Each hook 50 also includes a backcut portion 50b extending generally rearward from the end of the ramp portion 50a, extending rearward over at least a portion of the ramp portion 50a, and in some cases, over a portion of the protective cover 526. In some examples, the backcut portion 50b may extend parallel to the protective cover 526. In this manner, an opening is formed (between the backcut portion 50b and the ramp portion 50a) into which a plate of the cage 511 is received, allowing the cooling interface module 522 to be connected to the cage 510. More specifically, the hook 50 can allow the cooling interface module 522 to be connected to the edge of the cage 511 in a manner that still allows the cooling interface module 522 to move relative to the cage 511, such as by pivoting about the hook 50. In some examples, the hook 50 is integrally connected to the protective cover 526 - for example, the hook 50 and the protective cover 526 can be formed from the same piece of sheet metal or foil that is bent to form a Figure 3-7 In some examples, the hook 50 can be made of a thicker material than the protective cover 526. In other examples, the hook 50 and the protective cover 526 have similar thicknesses.

[0060] In some examples, the sloped portion 50a of the hook 50 that extends upward and away from the protective cover 526 provides an inclined or beveled surface that forms a portion of the edge or perimeter of the opening of the compartment 520. These inclined or beveled surfaces form a guide surface that is arranged to contact the pluggable module when the pluggable module is inserted and guide the pluggable module into the compartment 520. In addition, the inclined surface allows for a gradual transition from a first state in which the pluggable module is not in contact with the protective cover 526 and the gap pad 524 is not compressed to a second state in which the pluggable module slides along the protective cover 526 and the gap pad 524 is compressed.

[0061] Now turn Figure 8A and Figure 8B , an example system 800 including a bracket for pluggable modules and a direct-coupled cold plate will be described. Figure 8B With the pluggable module installed Figure 8A810-1, 810-2 (collectively referred to as brackets 810), are shown, but the example is not limited thereto, and more or fewer brackets may be present. System 800 is an example implementation of system 200 described above. Some components of system 800 correspond to components of system 200 (e.g., are example implementations of components of system 200), and these corresponding components are given similar reference numbers with the same last two digits (e.g., 832 and 32). Although Figure 8A and 8B The system 800 in FIG. 8 is an example implementation of the system 200 , but the system 200 is not limited to the system 800 .

[0062] In some examples, system 800 can be a computing system, such as a server. That is, system 800 can include a printed circuit board assembly (PCA) 828, which can be a main system board of the computing system or a secondary board configured to be connected to the main system board of the computing system. In some examples, PCA 828 is the main system board and includes a socket to receive a processor and memory.

[0063] like Figure 8A As shown in FIG, a cold plate 834 is disposed at the top and coupled to the bracket 810. Two pipes 36-1, 36-2 (collectively referred to as pipes 36) extend from the cold plate 334. The pipes 36 facilitate the flow of liquid coolant, allowing heat generated when the pluggable module is inserted into the bracket 310 to be dissipated. The pipes 36 and the cold plate 834 are part of the liquid cooling loop of the cooling system 800. The liquid cooling loop may also include a pump that circulates the liquid coolant and other liquid cooling infrastructure (not shown), which will be familiar to those of ordinary skill in the art. The pipes 36 are arranged in the liquid cooling loop so that one of the pipes 36 receives (directly or indirectly) liquid coolant from a coolant source (e.g., a heat exchanger) and supplies the liquid coolant to the cold plate 834, while another of the pipes 36 returns the liquid coolant to (directly or indirectly) the heat source. In some examples, the tubes 36 are fluidly coupled to an internal cavity within the cold plate 834, through which liquid coolant circulates, with one tube 36 supplying liquid coolant into the cavity and another tube 36 receiving liquid coolant from the cavity. In such examples, the liquid coolant directly contacts the inner surface of the cold plate 834. In other examples, the tubes 36 are part of the same tube (or network of tubes) that extends through the cold plate 834, such that the liquid coolant does not directly contact the cold plate 834, but instead contacts the tube walls, which in turn contact the cold plate 834.

[0064] Figure 8B The pluggable modules 832-1 and 832-2 (collectively referred to as the pluggable modules 832) are shown as being inserted into the bracket 810. Figure 8AIn this state, the pluggable module 832 contacts the cooling interface module of the tray 810, thereby establishing a thermal conduction path between the pluggable module 832 and the liquid coolant flowing through the cold plate 834, wherein the thermal conduction path passes from the pluggable module 832 to the cooling interface module, from the cooling interface module to the holder of the tray 810, from the holder of the tray 810 to the cold plate 834, and from the cold plate 834 to the liquid coolant (directly or via the wall of the tube 36). The system 800 may also include an electrical connector (not shown) disposed at the rear of each tray 810 and electrically connected to the PCA 828 so that Figure 8B Pluggable module 832 is shown in an inserted state in FIG. 8 to mate with the electrical connector and thereby electrically connect to PCA 828 .

[0065] Figure 9A and 9B An example system 900 is shown that includes a tray for pluggable modules and a remotely located cold plate. Figure 9B When the pluggable module is installed Figure 9A 910 - 1 , 910 - 2 (collectively referred to as brackets 910 ) are shown, but the example is not limited thereto, and more or fewer brackets may be present. System 900 is an example implementation of system 200 described above. Some components of system 900 correspond to components of system 200 (e.g., are example implementations thereof), and these corresponding components are given similar reference numbers with the same last two digits (e.g., 932 and 32 ). Although Figure 9A and 9B The system 900 in FIG. 1 is an example implementation of the system 200, but the system 200 is not limited to the system 900. As will be described in detail below, the system 900 may be similar to the system 800, except that the cold plate 934 is not in direct contact with the bracket 910 but is located at a distal end.

[0066] As with system 800, system 900 may be a computing system, such as a server, and include a PCA 928. PCA 928 may be a main system board of the computing system or a slave board configured to connect to the main system board of the computing system. In some examples, PCA 928 is the main system board and includes a socket to receive a processor and memory.

[0067] like Figure 9A and 9BAs shown in FIG, a plurality of heat pipes 40-1, 40-2, 40-3, 40-4 (collectively referred to as heat pipes 40) are coupled to a bracket 910 and a cold plate 934. The heat pipes 40 include a hollow interior in which a working liquid is placed and a wicking structure configured to transfer heat along the longitudinal direction of the heat pipes 40 through repeated cycles of evaporation, convection, condensation, and wicking. That is, heat is absorbed by the liquid phase portion of the working liquid at the hot end (the end connected to the bracket 910), causing the heated working liquid to evaporate into a vapor phase. The vapor phase working liquid then moves to the cold end (the end connected to the cold plate 934) by convection, whereupon the vapor phase working liquid condenses back into a liquid phase and releases heat into the cold plate 934 in the process. The now condensed liquid phase is then absorbed back into the hot end to begin the cycle again. In this way, heat is absorbed at the hot end of each heat pipe 40 and transported to its cold end, thereby transporting heat out of the bracket 910 and into the cold plate 934. In other examples, the heat pipe 40 can be replaced by other types of heat transfer devices, which can include any heat-conducting device that can transfer heat between the bracket 910 and the cold plate 934. For example, the heat transfer device can include a body of heat-conducting material, such as copper or other heat-conducting metal. Thus, the heat generated by the pluggable module 932 inserted into the bracket 910 reaches the cold plate 934 through the thermal connection between the bracket 910, the heat pipe 40 (or other heat transfer device used to replace the heat pipe 40), and the cold plate 934. The cold plate 934 includes a plurality of pipes 936-1, 936-2 (collectively referred to as pipes 936). The pipes 936 circulate liquid coolant through the cold plate 934, cooling the heat pipe 40, thereby transferring the cooling to the bracket 910. The cold plate 934 and the pipes 936 can be configured similarly to the cold plate 834 and pipes 836 described above.

[0068] Figure 10 1 is a front view of an example system 1000 including a bracket 1010 with a pluggable module installed consistent with the present disclosure. System 1000 is an example implementation of system 200 described above. Some components of system 100 correspond to components of system 200 (e.g., are example implementations of components of system 200), and these corresponding components are given similar reference numbers with the same last two digits (e.g., 1010 and 210). Although Figure 10 The system 1000 in FIG. 1 is an example implementation of the system 200 , but the system 200 is not limited to the system 1000 .

[0069] like Figure 10As shown in FIG, system 1000 includes a bracket 1010, a pluggable module 1032, a cold plate 1034, and a base 1028. Bracket 1010 is an example implementation of bracket 10 described above and includes a cage 1011 and one or more cooling interface modules 1022 coupled to the cage. Each cooling interface module 1022 includes a protective cover 1026 and a gap pad 1024. In some examples, bracket 1010 can have the same configuration as bracket 510 described above, such as Figure 10 In other examples, bracket 1010 can have a different configuration, such as having more or fewer cooling interface modules 1022 and / or a differently shaped retainer 1011 .

[0070] In some examples, base 1028 is a PCA, such as a main system board or a slave board of a computing system (e.g., similar to PCA 828 or 928). In other examples, base 1028 is a mechanical support, such as a chassis wall of a computing system. Cage 1011 is coupled to base 1028.

[0071] In the example shown, the cold plate 1034 is in direct contact with the holder 1011, in particular the top plate 1014 thereof, similar to Figure 8A and 8B , but in other examples the system 1000 may have a cold plate 1034 located at the far end, similar to Figure 9A and 9B In the arrangement shown in , the heat pipe (or other heat transfer device) would be in contact with the cage 1011 rather than the cold plate 1034 .

[0072] like Figure 10 As shown in FIG, the pluggable module 1032 is received in the opening of the cage 1011 defined by the lower plate 1012, the upper plate 1014, the left plate 1016, and the right plate 1018 of the cage 1011. Furthermore, the pluggable module 732 contacts the protective covers 1026-1, 1026-2, and 1026-3 (collectively referred to as protective covers 1026). Furthermore, the protective covers 1026 are coupled to the gap pads 1024-1, 1024-2, and 1024-3 (collectively referred to as gap pads 1024), respectively.

[0073] Inserting the pluggable module 1032 into the bracket 1010 results in a thermal connection being established between the bracket 1010 and the pluggable module 1032. When the pluggable module 1032 is inserted into the bracket 1010, each gap pad 1024 is compressed a certain amount. When the pluggable module 1032 is inserted into the bracket 1010, the pluggable module 1032 contacts the protective cover 1026 and pushes the protective cover 1026 away from the centerline of the retaining frame 1011, i.e., generally in a radially outward direction. Specifically, Figure 10Push the protective cover 1026-1 in the +x direction as shown. Figure 10 The protective cover 1026-2 is pushed in the +y direction and the protective cover 1026-3 is pushed in the -y direction. Figure 10 , the movement of the protective cover 1026-1 relative to its resting position prior to insertion of the pluggable module 1032 is represented by a distance d (i.e., upon insertion, the pluggable module 1032 pushes the protective cover 1026-1 in the +x direction by a distance d). The movement of the protective cover 1026 away from the centerline of the cage 1011 compresses the gap pad 1024 sandwiched between the protective cover 1026 and the cage 1011. In other words, inserting the pluggable module 1032 into the bracket 1010 pushes against the protective cover 1026, causing the gap pad 1024 to be compressed during the insertion process.

[0074] The compression of gap pads 1024 generates internal elastic restoring forces that urge gap pads 1024 back to their uncompressed state, similar to the spring force generated by a compressed spring. These restoring forces push against protective cover 1026 in the opposite direction of compression. For example, the restoring force of gap pad 1024-1 pushes protective cover 1026-1 in the -x direction, the restoring force of gap pad 1024-2 pushes protective cover 1026-2 in the -y direction, and the restoring force of gap pad 1024-3 pushes protective cover 1026-3 in the +x direction. Thus, the restoring force of a given gap pad 1024 can push the corresponding protective cover 1026 back against pluggable module 1032, generating contact pressure between the protective cover 1026 and the pluggable module 1032 and maintaining contact therebetween. In other words, the restoring force of gap pads 1024 pushes protective cover 1026 into full contact with pluggable module 1032, thereby establishing a thermal interface. Furthermore, in some examples, the protective cover 1032 can have sufficient adaptability / compliance, i.e., a restoring force that allows the protective cover 1026 to deform and conform to the outer surface of the pluggable module 1032. This allows for reducing the number and size of air gaps at the interface between the pluggable module 1032 and the protective cover 1026, or in other words, increasing the total area of ​​contact, thereby improving the heat transfer rate across the thermal interface. In some examples, the restoring force from the gap pad 1024 is strong enough to achieve a good thermal interface, but not so strong as to require excessive insertion force. For example, in some embodiments, the thermal interface between the pluggable module and the retaining bracket can transfer heat at a rate of at least 0.10 W / cm2C and the insertion force required to insert the pluggable module 1032 into the bracket 1010 can be no more than 25 lbf. In some examples, when the gap pad 1024 is compressed, the pressure generated by the restoring force of the compressed gap pad 1024 can be between 5 lbf and 25 lbf. Thus, gap pads 1024 serve the dual function of transferring heat from protective cover 1026 to holder 1011 and applying contact pressure between protective cover 1026 and pluggable module 1032 to help protective cover 1026 establish a thermal connection between bracket 1010 and pluggable module 1032 .

[0075] In some examples using gap gasket 1024 and protective cover 1026, gap gaskets with different properties can be used. For example, different gap gaskets may have different degrees of thermal conductivity, as well as different degrees of elasticity and compressibility. Compressibility refers to the degree to which a gap gasket compresses when subjected to a given amount of pressure, and compressibility is inversely proportional to the gap gasket's resistance to compression. That is, a highly compressible gap gasket is less resistant to compression and therefore can be compressed more for a given applied pressure, while a less compressible gap gasket is more resistant to compression and therefore can be compressed less for a given applied pressure. Therefore, when compressed by a given amount of force, a more compressible gap gasket will produce a lower restoring force than a less compressible gap gasket when compressed by the same amount of force. In other words, all other things being equal, a highly compressible gap gasket will tend to produce a lower restoring force, while a less compressible gap gasket will produce a greater restoring force. It may be the case that a gap gasket with a high thermal conductivity is more compressible than a gap gasket with a lower thermal conductivity. Such high thermal conductivity and high compressibility gap pads may generate weak contact pressure between the protective cover 1026 and the pluggable module 1032, which may result in a poor thermal interface between the protective cover 1026 and the module 1032. Therefore, despite the high thermal conductivity of the gap pads, the overall thermal conductivity of the cooling interface module 1022 may be poor. On the other hand, gap pads with lower thermal conductivity may have higher compressibility and, therefore, may generate higher contact pressure between the protective cover 1026 and the module 1032. Therefore, such gap pads with low thermal conductivity and low compressibility may improve the thermal interface between the protective cover 1026 and the module 1032, but the gap pads' own low thermal conductivity may create a thermal bottleneck that reduces the overall thermal conductivity of the module 1022. Therefore, in some examples, to ensure that the cooling interface module 1022 achieves the desired overall thermal conductivity level, different gap pads with varying degrees of thermal conductivity and compressibility may be mixed with the module 1022. For example, a given module 1022 may be provided with multiple gap pads 1024 attached to the same protective cover 1026, including one or more gap pads 1024 having high thermal conductivity and high compressibility to ensure a highly conductive thermal path between the protective cover 1026 and the holder 1011, and one or more gap pads 1024 having lower thermal conductivity and lower compressibility to ensure that sufficient contact pressure is applied between the protective cover 1026 and the module 1032. These different gap pads 1024 may be arranged in various patterns on the protective cover 1026, such as a pattern in which high thermal conductivity gap pads 1024 are arranged in a central region and lower thermal conductivity gap pads 1024 surround the high thermal conductivity gap pads, or a pattern in which high thermal conductivity gap pads 1024 and lower thermal conductivity gap pads 1024 are arranged in alternating positions in an array (such as a checkerboard pattern).

[0076] In other examples, a first gap pad with high thermal conductivity can be installed adjacent to one board. Other gap pads with lower thermal conductivity but higher compressibility can be installed adjacent to other boards. Because each gap pad is compressed when the pluggable module 1032 is inserted into the bracket 1010, the gap pads with higher compressibility will generate a lower restoring force than the gap pads with lower compressibility.

[0077] Furthermore, in some examples, additional compressible material can be coupled to the gap pad 1024 and / or the protective cover 1026. In such examples, the additional compressible material can be used to increase the amount of restoring force that pushes the protective cover onto the pluggable module 1032. This can help establish a good thermal interface between the pluggable module 732 and the bracket 1010.

[0078] Figure 11 8 is an example method 80 for using a cooling interface for a pluggable module consistent with the present disclosure. At 82, method 80 may include inserting a removable pluggable module into a bracket of a computing system. As previously described, the bracket may be designed to receive the removable pluggable module within a compartment defined by a plurality of walls. The bracket may be coupled to the computing system or may be integrally formed as part of a component of the computing system, such as as part of a chassis.

[0079] At 84, method 80 may include placing the removable pluggable module in contact with a protective cover of a cooling interface module attached to the carrier. As previously described, the carrier may include at least one cooling interface module coupled to a plate of the carrier. The cooling interface module may include a protective cover (such as a thin metal sheet) and a gap gasket and may be coupled to the carrier such that the gap gasket is sandwiched between the carrier and the protective cover. Thus, when the removable pluggable module is inserted into the carrier, the removable pluggable module may be placed in contact with the protective cover.

[0080] At 86, method 80 may include compressing a gap gasket of the cooling interface module. As previously described, the gap gasket may be inherently compressible such that when the removable pluggable module is inserted into the carrier, the gap gasket is compressed to allow for the insertion. In other words, when the removable pluggable module contacts the protective cover during insertion into the carrier, the gap gasket may also be compressed to allow the removable pluggable module to be fully inserted into and received by the carrier.

[0081] At 88, method 80 may include thermally coupling the removable pluggable module to the carrier by causing the gap pads to push the protective cover onto the removable pluggable module. Figure 10As previously mentioned, since the gap pad is compressed when the removable pluggable module is inserted into the holder, the restoring force will move the gap pad back to its uncompressed state once the removable pluggable module is fully inserted. Since the gap pad is attached to the protective cover, the restoring force of the gap pad also has the effect of pushing the protective cover onto the removable pluggable module. As previously mentioned, especially with respect to Figure 1 , the protective cover is made of a thermally conductive material, and since the gap pad is also thermally conductive, the contact between the peripheral portion of the bracket, the gap pad, the protective cover and the removable pluggable module results in a thermal connection between the removable pluggable module and the bracket.

[0082] The bracket can be thermally coupled to a cold plate of the computing system. Figure 2 、 8A As discussed above with respect to FIGs. 8A-9B and 9A-9B, the cold plate can be directly coupled to the bracket or can be remotely located such that the bracket is thermally coupled to the cold plate via, for example, a heat pipe. However, in either configuration, the thermal coupling of the removable pluggable module to the bracket results in the removable pluggable module being thermally coupled to the cold plate. In this manner, the removable pluggable module can be cooled.

[0083] It should be understood that both the general description and the detailed description provide examples that are illustrative in nature and are intended to provide an understanding of the present disclosure without limiting the scope of the present disclosure. Based on the considerations of the present disclosure, it will be apparent to those skilled in the art that other examples according to the present disclosure will be apparent. For example, without departing from the scope of the present disclosure, various mechanical, compositional, structural, electronic and operational changes may be made to the disclosed examples, including, for example, the addition, removal, change, replacement or rearrangement of the elements of the disclosed examples, which will be apparent to those skilled in the art. In addition, it will be apparent to those skilled in the art that, whenever practicable, certain features or aspects of the present teachings may be utilized independently (even if they are disclosed together in some examples) or may be used together (even if disclosed in separate examples). In some cases, well-known circuits, structures and techniques are not shown or described in detail to avoid confusing the examples. Therefore, without being limited to the examples disclosed herein, the following claims are intended to be given their maximum breadth, including equivalents.

[0084] Unless otherwise expressly indicated, references herein to examples, implementations, or other similar references should be understood to refer to prophetic or hypothetical examples, rather than to devices / systems that have actually been produced. Likewise, unless otherwise expressly indicated, references to qualities or characteristics of examples should be understood to represent estimates or expectations made by the inventors based on their understanding of the relevant principles involved, application of theory and / or modeling, and / or past experience, rather than to the actual qualities or characteristics of actually produced devices / systems or empirical results of actually performed testing.

[0085] In addition, the spatial, positional and relational terms used herein are intended to help the reader understand the examples of the present invention and are not intended to limit the present invention to a specific reference frame, direction or positional relationship. For example, as shown in the figures, spatial, positional and relational terms such as "up", "down", "lateral", "below", "below", "below", "above", "above", "proximal", "distal" and the like can be used to describe a direction or to describe the spatial relationship of one element or feature to another element or feature. These spatial terms are used relative to the reference frame in the figures and are not limited to a specific reference frame in the real world. In addition, if a reference frame different from the reference frame shown in the figures is considered, the spatial terms used herein may need to be interpreted differently in the different reference frames. In addition, the postures of the items shown in the figures are selected for ease of illustration and description, but in actual implementation, the postures of the items may be different.

[0086] In addition, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context indicates otherwise. Furthermore, the terms "include," "comprise," "include," and the like indicate the presence of features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups. Components described as coupled may be coupled directly, electronically or mechanically, or indirectly, via one or more intermediate components, unless specifically stated otherwise.

[0087] And / or: Sometimes the phrase "and / or" is used herein with a list of items. This phrase means that any combination of the items in the list—from a single item to all items and any permutation in between—is included. For example, "A, B, and / or C" means "one of {A}, {B}, {C}, {A, B}, {A, C}, {C, B}, and {A, C, B}."

[0088] Unless the context of this specification indicates otherwise, mathematical and geometric terms are not necessarily used in accordance with their strict definitions, as one of ordinary skill in the art will understand that, for example, even if a term has a strict definition, substantially similar elements that function in a substantially similar manner can easily fall within the scope of the descriptive term. In addition, unless otherwise indicated herein or implied by the context, when approximate terms such as "substantially," "approximately," "about," "approximately," "roughly," and the like are used, this should be understood to mean that mathematical precision is not required, but rather that a range of variation is included but not strictly limited to the stated value, property, or relationship. In particular, in addition to any ranges explicitly indicated herein (if any), the range of variation implied by the use of such approximate terms includes at least any insignificant variations and those variations that are typical in the relevant art for the type of item in question due to manufacturing or other tolerances. In any case, unless otherwise indicated, the range of variation may at least include values ​​within ±1% of the stated value, property, or relationship.

Claims

1. A bracket for receiving a pluggable module, the bracket comprising: A retainer, the retainer comprising a plurality of plates, the plurality of plates comprising: Lower plate; upper plate; a left side plate, the left side plate being placed between the lower plate and the upper plate; a right side plate, the right side plate being placed between the lower plate and the upper plate and opposite to the left side plate; a compartment defined by the plurality of panels, wherein the compartment is sized to receive a pluggable module; One or more cooling interface modules, wherein: Each of the one or more cooling interface modules comprises: Gap pads; and protective cover; and Each of the one or more cooling interface modules is positioned such that the gap pad is adjacent to a given plate of the plurality of plates and between the protective cover and the given plate. 2 . The bracket according to claim 1 , wherein the protective cover is movable relative to the given plate.

3. The bracket of claim 1 , wherein each of the one or more cooling interface modules further comprises a hook attached to an end of the protective cover and configured to pivotally connect the cooling interface module to an edge of the holder.

4. The bracket according to claim 1, wherein: a first cooling interface module of the one or more cooling interface modules positioned adjacent a first plate of the plurality of plates; and A second cooling interface module of the one or more cooling interface modules is positioned adjacent to a second plate of the plurality of plates. 5 . The bracket of claim 4 , wherein a third cooling interface module of the one or more cooling interface modules is positioned adjacent a third plate of the plurality of plates. The bracket of claim 1 , wherein the protective cover comprises a metal sheet.

7. The bracket according to claim 6, wherein: The metal sheet has an average thickness of 0.003 inches or less; and The metal sheet includes one of copper, copper alloy, nickel, steel, stainless steel, aluminum, aluminum alloy, or any combination thereof.

8. The bracket of claim 1, wherein the protective cover comprises a low-friction, compliant, tear-resistant, and thermally conductive material.

9. A computing system, comprising: Chassis; a system board, the system board being supported by the chassis; Removable and pluggable modules; a bracket coupled to or formed by the chassis and configured to receive the removable pluggable module, wherein the bracket comprises: A retainer, the retainer comprising a plurality of plates, the plurality of plates comprising: Lower plate; an upper plate located opposite the lower plate; and a side plate coupled to the lower plate and the upper plate; at least one cooling interface module disposed along one of the plurality of plates, wherein the at least one cooling interface module further comprises: Gap pads; and a protective cover coupled to the gap pad such that the gap pad is sandwiched between a plate of the retainer and the protective cover; and A cold plate is thermally coupled to the bracket.

10. The system of claim 9, wherein the gap pad of the at least one cooling interface module compresses upon insertion of the removable pluggable module, thereby establishing a thermal connection between the bracket and the removable pluggable module.

11. The system of claim 10, wherein when the removable pluggable module is inserted into the bay, the removable pluggable module compresses the gap pad by pushing the protective cover away from the removable pluggable module.

12. The system of claim 11, wherein contact between the gap pad and the bracket, between the gap pad and the protective cover, and between the protective cover and the pluggable module establishes a thermal interface between the pluggable module and the bracket.

13. The system of claim 10, wherein: Insertion of the removable pluggable module results in compression of the gap pad; and The protective cover is pushed onto the detachable pluggable module by a restoring force caused by compression of the gap pad.

14. The system of claim 9, wherein the gap pad has a compressibility between 10% and 50%.

15. The system of claim 14, wherein the gap pad has a compressibility of 20%.

16. The system of claim 9, wherein the cold plate is directly coupled to the bracket.

17. The system of claim 9, wherein: The cold plate is a distal cold plate; and The bracket is thermally coupled to the remotely located cold plate via one or more heat transfer devices.

18. The system of claim 9, wherein the protective cover is a stainless steel cover.

19. A method comprising: inserting a removable pluggable module into a bay of a computing system, the bay including a cage defining a compartment into which the removable pluggable module is insertable, and a cooling interface module attached to the bay; During the inserting process, the removable pluggable module is brought into contact with the protective cover of the cooling interface module; compressing a gap pad of the cooling interface module between the protective cover and a plate of the retainer via the contact, wherein the gap pad is attached to the protective cover; as well as In response to being compressed, the removable pluggable module is thermally coupled to the bracket by causing the gap pad to push the protective cover onto the removable pluggable module.

20. The method of claim 18, wherein: The bracket is thermally coupled to a cold plate of the computing system; and Thermally coupling the removable pluggable module to the carrier includes thermally coupling the removable pluggable module to the cold plate.

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